FCC ID: 2ANDL-ZSU-IPEX Zigbee Module

ZSU-IPEX Module Datasheet Version: 20211115 Online Version Contents Contents 1 Product overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 3

. 4 2.1 Dimensions and footprint 2.2 Pin definition . 6 2 Module interfaces 3 Electrical parameters

. 10 3.1 Absolute electrical parameters 3.2 Normal working conditions

. 10 3.3 TX and RX power consumption . 11

. 11 3.4 Working current 4 RF parameters

. 13 4.1 Basic RF features 4.2 TX performance . 13 4.3 RX performance . 13 5 Antenna information 5.1 Antenna type . 15 5.2 Antenna interference reduction . 15 6 Packaging information and production instructions 6.1 Mechanical dimensions

. 16 6.2 Side view . 17 6.3 The schematic diagram of footprint . 18 6.4 Recommended footprint . 19

. 19 6.5 Production instructions 6.6 Recommended oven temperature curve . 21 6.7 Storage conditions . 24 7 MOQ and packaging information 2 4 10 13 15 16 25 I 8 Appendix: Statement Contents 26 II Contents ZSU-IPEX is a Zigbee module that Tuya has developed. It consists of a highly integrated RF processing chip (EFR32MG21A020F1024IM32-B), a few peripher-

als, a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and rich library functions. 1 / 28 1 Product overview ZSU-IPEX is embedded with a low-power 32-bit ARM Cortex-M33 core, 1024-KB flash program memory, 96-KB RAM and abundant peripheral resources. It integrates all function libraries of the Zigbee MAC and TCP/IP. You can develop embedded Zigbee products as required. 1 Product overview 1.1 Features Embedded ARM Cortex-M 33 processor having a low-power 32-bit CPU and hav-

ing DSP instructions and uping-point units, which can also function as an appli-

cation processor Clock rate: 80 MHz Wide working voltage: 2.0 to 3.8 V Peripherals: 9 GPIOs, 1 UART, 2 ADCs, and 5 PWMs Zigbee connectivity Support 802.15.4 MAC/PHY Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250 Kbps Up to +20dBm output power 60 uA/MHz power consumption during running; 5-uA sleep current Ipex antenna with a gain of 3.1 dBi Working temperature: -40 to 105 Support hardware encryption and AES 128/256 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 / 28 1 Product overview 1.3 Change history Update date Updated content Version after update 06/30/2021 This is the first release. V1.0.0 3 / 28 2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint ZSU-IPEX has 3 lines of pins. The spacing of pins at the two sides is 1.40.1 mm, and the spacing of pins at the bottom is 1.80.1 mm. The dimensions of ZSU-IPEX are 20.30.35 mm (L)15.80.35 mm (W) 3.00.15 mm (H). The dimensions of ZSU-IPEX are as follows:

4 / 28 2 Module interfaces 5 / 28 2.2 Pin definition 2 Module interfaces 1 2 3 4 Pin number Symbol Function PC04 PC05 PA02 PA01 I/O Type I/O I/O I/O 6 / 28 Common I/O pin, which corresponds to PC04 (Pin 5) on the internal IC Common I/O pin, which corresponds to PC05 (Pin 6) on the internal IC Burning pin, SWDIO, which corresponds to PA02 (Pin 19) on the internal IC Burning pin, SWCLK, which corresponds to PA01 (Pin 18) on the internal IC Pin number Symbol Function 2 Module interfaces ADC pin, which corresponds to PC01 (Pin 2) on the internal IC Common I/O pin, which corresponds to PD03 (Pin 29) on the internal IC Common I/O pin, which corresponds to PD04 (Pin 28) on the internal IC Support hardware PWM and correspond to PB01 (Pin 15) on the internal IC Support hardware PWM and correspond to PB00 (Pin 16) on the internal IC Support hardware PWM and correspond to PA00 (Pin 17) on the internal IC Support hardware PWM and correspond to PA03 (Pin 20) on the internal IC 5 6 7 8 9 10 11 PC01 PD03 PD04 PB01 Type I I/O I/O I/O PB00 I/O PA00 I/O PA03 I/O 7 / 28 Pin number Symbol Function 12 13 14 15 17 18 19 PA04 GND VCC TXD0 NRST PD01 Type I/O P P I/O I/O I/O 8 / 28 16 RXD0 I/O PD02 I 2 Module interfaces Support hardware PWM and correspond to PA04 (Pin 21) on the internal IC Power supply reference ground Power supply pin

(3.3V) UART_TXD0, burning authorization pin, correspond to PA05 (Pin 22) on the internal IC UART_RXD0, burning authorization pin, correspond to PA06 (Pin 23) on the internal IC ADC pin, which corresponds to PD02 (Pin 30) on the internal IC Reset pin, low active, correspond to RESETn (Pin 9) on the internal IC Common I/O pin, which corresponds to PD01 (Pin 31) on the internal IC Pin number Symbol Function PC02 Type I/O 20 21 PC03 I/O 2 Module interfaces Common I/O pin, which corresponds to PC02 (Pin 3) on the internal IC Common I/O pin, which corresponds to PC03 (Pin 4) on the internal IC Note: P indicates a power supply pin and I/O indicates an input/output pin. Pin 3, 4, 13, 14, and 18 are burning pins, which are not exposed by default. During routing, customers should bypass them. 9 / 28 Parameter Description Minimum value Maximum value Unit 3 Electrical parameters 150 3.8 2 0.5 V KV KV 3 Electrical parameters 3.1 Absolute electrical parameters Storage temperature Power supply voltage TAMB-25 TAMB-25

-50 2.0

Ts VBAT ESD voltage

(human body model) ESD voltage

(machine model) 3.2 Normal working conditions Parameter Description Minimum value Typical value Maximum value Ta VCC VIL VIH VOL Working tempera-

ture Working voltage I/O low level input I/O high level input I/O low level output

-40 105 2.0 3.3 3.8 VDD*0.7

VDD*0.3 VDD*0.2 Unit V V V V

10 / 28 3 Electrical parameters Parameter Description Minimum value Typical value Maximum value VOH VDD*0.8

I/O high level output 3.3 TX and RX power consumption Transmit power/re-

ceive Average value Peak value

(Typical value) Mode Rate 250Kbps +20dBm 200 211 250 Kbps +10 dBm 62 250 Kbps +0 dBm 27 250Kbps Constantly receive 11 65 29 15 Working status Transmit Transmit Transmit Receive

3.4 Working current Unit V Unit mA mA mA mA Working mode Average value EZ mode Connected and busy Working status, Ta =

25C The module is in fast network connection state. The module is connected to the network and in running state. 12 13 Maximum value (Typical value) 38 70 Unit mA mA 11 / 28 3 Electrical parameters Working mode Average value Maximum value (Typical value) Unit mA 12 14 Connected and idle Deep sleep mode Working status, Ta =

25C The module is connected to the network and in idle state. Deep sleep mode, 64-KB flash memory reserved 5

uA 12 / 28 4 RF parameters Parameter Description Working frequency Zigbee standard Data transmission rate 2.405 to 2.480 GHz IEEE 802.15.4 250 Kbps Antenna type IPEX antenna with a gain of 3.1 dBi Parameter Typical value Minimum value Maximum value 15 0.5

-31 20 1

Unit dBm dBm dBc

-15

15 ppm 4 RF parameters 4.1 Basic RF features 4.2 TX performance TX performance Output power

(250Kbps)

-30

Output power adjustment stepping Output spectrum adjacent channel suppression Frequency error 4.3 RX performance RX sensitivity 13 / 28 4 RF parameters Minimum value Typical value Maximum value

-102

-101

-99 Unit dBm Parameter PER<8%, RX sensitivity

(250 Kbps) 14 / 28 5 Antenna information 5 Antenna information 5.1 Antenna type The ZSU-IPEX uses a new generation of IPEX antenna bases. Its structure is shown below:

5.2 Antenna interference reduction It is recommended that the antenna be at least 15 mm away from other metal parts. 15 / 28 6 Packaging information and production instructions 6 Packaging information and production instructions 6.1 Mechanical dimensions The PCB dimensions are 20.30.35 mm (W)15.80.35 mm (L) 1.00.1 mm (H). 16 / 28 6 Packaging information and production instructions 6.2 Side view 17 / 28 6 Packaging information and production instructions 6.3 The schematic diagram of footprint 18 / 28 6 Packaging information and production instructions 6.4 Recommended footprint 6.5 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not 19 / 28 6 Packaging information and production instructions greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

(SMT process) SMT devices:

Mounter SPI Reflow soldering machine Thermal profiler Automated optical inspection (AOI) equipment

(Wave soldering process) Wave soldering devices Wave soldering equipment Wave soldering fixture Constant-temperature soldering iron Tin bar, tin wire and flux Thermal profiler Baking devices:

Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:

The moisture-proof bag must be placed in an environment in which the temperature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag.

 3. The module needs to be baked in the following cases:

The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. 20 / 28 6 Packaging information and production instructions More than 12 months has passed since sealing of the bag. 4. Baking settings:

Temperature: 60C and 5% RH for reel package and 125C and 5%

RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use the reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 6.6 Recommended oven temperature curve Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements. Manner 1: SMT process (Recommended oven temperature curve of reflow soldering) Set oven temperatures according to the following curve. 21 / 28 6 Packaging information and production instructions A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s perature: 150 to 200C F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s E: Duration of constant temperature: 60 to 120s; the range of constant tem-

Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications. Manner 2: Wave soldering process (Oven temperature curve of wave sol-

dering) Set oven temperatures according to the following temperature curve of wave sol-

dering. The peak temperature is 260C5C. 22 / 28 6 Packaging information and production instructions Suggestions on oven temperature curve of wave soldering Preheat temperature Suggestions on manual soldering temperature Soldering temperature 80 to 130 C 36020C Preheat time 75 to 100s Soldering time 3s/point Peak contact time 3 to 5s Temperature of tin cylinder 2605C Ramp-up slope 2C/s Ramp-down slope 6C/s NA NA NA NA NA NA NA NA 23 / 28 6 Packaging information and production instructions 6.7 Storage conditions 24 / 28 7 MOQ and packaging information 7 MOQ and packaging information Product model MOQ (pcs) Packing method Modules per reel Reels per carton ZSU-IPEX 4400 Tape reel 1100 4 25 / 28 8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-

lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the in-

tended destination. The firmware setting is not accessible by the end-user. 26 / 28 8 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-

fication. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-ZSU-IPEX. The end product must be labelled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-

ZSU-IPEX. This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-

mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-

quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 27 / 28 8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 28 / 28

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Model: ZSU-IPEX PIN:2.01.01.00001 7a A S/N:DFGHA7WQK00001 FCC ID:2ANDL-ZSU-IPEX

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (11/15/2021) TUV SUD BABT UNLIMITED TCB Octagon House, Segensworth North, Fareham, Hampshire, PO15 5RL, United Kingdom Confidentiality Request FCC ID: 2ANDL-ZSU-IPEX Pursuant to Sections 0.457(d)(1)(ii) and 0.459 of the Commissions Rules, (Hangzhou Tuya Information Technology Co.,Ltd) hereby requests permanent confidential treatment of information accompanying this application as outlined below:

Schematics Block Diagrams Theory of Operation The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457(d)(1)(ii), disclosure of this Application and all accompanying materials will not be made before the date of the Grant for this Application. Yours sincerely, Company Officer:

Telephone Number:

Email:

86-571-86581786 mikeshou@tuya.com

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (11/15/2021) TUV SUD BABT UNLIMITED TCB Octagon House, Segensworth North, Fareham, Hampshire, PO15 5RL, United Kingdom Dear Sir or Madam, We, (Hangzhou Tuya Information Technology Co.,Ltd), hereby authorize Jiaxi XU from TV SD Certification and Testing (China) Co., Ltd. Shanghai Branch 3-13, No.151 Heng Tong Road Shanghai 201108 P.R. China to act as our agent in all matters relating to applications for equipment authorization, including the signing of all documents relating to these matters. This authorization expires on (Dec.31,2021). Sincerely, Company Officer:

Telephone Number:

Email:

86-571-86581786 mikeshou@tuya.com

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (11/15/2021) Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Modular Approval Request FCC ID: 2ANDL-ZSU The following attestation addresses the requirements to support modular approval:

Modular approval requirement Yes (provide brief statement) No *

(a) The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly The module has a metal shied. Refer to the external photo of EUT.

(b) The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal Data to the modulation circuit is buffered as described in the operational description provided with the application.

(c) The module must contain power supply regulation on the module The module contains its own power supply regulation. Please refer to schematic filed with this application.

(d) The module must contain a permanently attached antenna, or The module connects to its antenna (FPC antenna) using Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b)

(e) The module must demonstrate compliance in a stand-alone configuration

(f) The module must be labelled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements)

(g) The module must comply with all specific rules applicable to the transmitter. The grantee must provide comprehensive instructions to explain compliance requirements an IPEX connector which is considered a standard connector. Factory will use the permanent, industrial epoxy, Loctite or solder to make the connection permanent before shipping. Refer to the photo of EUT. The module was tested stand-

alone as shown in test setup photographs filed with this application. The FCC ID is printed on the label of the module. Refer to the label of EUT. The module comply with all specific rules.Refer to the datasheet. Modular approval requirement Yes (provide brief statement) No *

(h) The module must comply with RF exposure requirements Please refer exhibition RF Exposure for the compliance of MPE RF exposure rule.

* Please provide a detailed explanation if the answer is No. Yours sincerely, Name:

Title:

General Manager