ZT5 Module Datasheet
Version: 20210617
Online Version
Contents
Contents
1 Overview
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1 Dimensions and package . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Module interfaces
3 Electrical parameters
. . . . . . . . . . . . . . . . . . . . . 10
3.1 Absolute electrical parameters
. . . . . . . . . . . . . . . . . . . . . . . 10
3.2 Normal working conditions
3.3 TX and RX power consumption . . . . . . . . . . . . . . . . . . . . . 11
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.4 Working current
4 RF parameters
4.1 Basic RF features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2 TX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3 RX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 Antenna information
5.1 Antenna type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 Antenna interference reduction . . . . . . . . . . . . . . . . . . . . . 14
6 Packaging information and production instructions
. . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1 Mechanical dimensions
6.2 Side view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.3 The schematic diagram of footprint . . . . . . . . . . . . . . . . . . . 17
. . . . . . . . . . . . . . . . . . . . . . . . . 18
6.4 Production instructions
6.5 Recommended oven temperature curve . . . . . . . . . . . . . . . . . 20
6.6 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2
3
10
12
14
15
24
24
7 MOQ and packaging information
8 Appendix: Statement
i
Contents
ZT5 is a Zigbee module that Tuya has developed. It consists of a highly integrated
RF processing chip (Z2) and a few peripherals. ZT5 is embedded with a low-power
32-bit CPU, 1024-KB flash memory, 64-KB RAM, and rich peripherals.
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1 OVERVIEW
Based on ZT5, you can develop embedded Zigbee products as required.
1 Overview
1.1 Features
• Embedded with a low-power 32-bit CPU and ARM Cortex-M33 processor
• The clock rate: 48 MHz
• Wide working voltage: 1.8 to 3.6 V
• Peripherals: 6 GPIOs, 1 UART, and 1 ADC
• Zigbee connectivity
– Support 802.15.4 MAC/PHY
– Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250
Kbps
– Up to +10dBm output power
– Built-in onboard PCB antenna
– Onboard PCB antenna with a gain of 2.8 dBi
– Working temperature: -40℃ to 85℃
– Support hardware encryption and AES 128
1.2 Applications
• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Intelligent bus
1.3 Change history
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2 MODULE INTERFACES
Date
Updated content
Version after
update
06/04/2021
This is the first
release.
V1.0.0
2 Module interfaces
2.1 Dimensions and package
ZT5 has two rows of pins with a spacing of 2±0.1 mm, 14 pins in total.
The ZT5 dimensions are 14.8±0.35mm (W) x 20.4±0.35mm (L) x 2.0±0.15mm (H)
The dimensions of ZT5 are as follows:
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2 MODULE INTERFACES
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2 MODULE INTERFACES
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2.2 Pin definition
2 MODULE INTERFACES
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Pin number
Symbol
I/O type
Function
2 MODULE INTERFACES
1
2
3
4
5
6
7
B4
I/O
D2
I/O
C2
I/O
C3
I/O
VCC
P
C4
I/O
GND
P
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Support hardware
PWM and
correspond to B4
(Pin 14) on the
internal IC
Support hardware
PWM and
correspond to D2
(Pin 31) on the
internal IC
Uart_TXD,can
also be used as
GPIO,and
correspond to C2
(Pin 22) on the
internal IC
Uart_RXD,can
also be used as
GPIO,and
correspond to C3
(Pin 23) on the
internal IC
Power supply pin
of the module
(The typical
power supply
voltage: 3.3V
ADC pin, which
corresponds to C4
(Pin 24) on the
internal IC
Power supply
reference ground
2 MODULE INTERFACES
Pin number
Symbol
I/O type
Function
SWS
I/O
00
B5
I/O
B7
I/O
0
8
9
10
11
12
RST
VCC
B1
GND
I
P
I/O
P
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Burning pin,
which
corresponds to
SWS (Pin 5) on
the internal IC
Support hardware
PWM and
correspond to B5
(Pin 15) on the
internal IC
GPIO, which
corresponds to B7
(Pin 17) on the
internal IC
The enabling pin
and the EN pin
are connected
together and a
pull-up resistor is
connected to
them.
Power supply pin
of the module
(The typical
power supply
voltage: 3.3V)
which
corresponds to B1
(Pin 6) of the IC
Power supply
reference ground
Note: P indicates a power supply pin and I/O indicates an input/output pin.
2 MODULE INTERFACES
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Parameter
Description
Minimum
value
Maximum
value
Unit
3 ELECTRICAL PARAMETERS
85
3.6
2
0.5
℃
V
KV
KV
3 Electrical parameters
3.1 Absolute electrical parameters
Working
temperature
Power supply
voltage
TAMB-25℃
TAMB-25℃
-40
1.9
-
-
Ta
VBAT
ESD voltage
(human body
model)
ESD voltage
(machine
model)
3.2 Normal working conditions
Parameter
Description
Minimum
Value
Typical
Value
Maximum
Value
Ta
VCC
VIL
VIH
Working
tempera-
ture
Working
voltage
I/O low
level input
-
I/O high
level input
-40
85
1.9
3.3
3.6
VDD*0.3
VDD*0.7
-
Unit
℃
V
V
V
-
-
-
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3 ELECTRICAL PARAMETERS
Parameter
Description
Minimum
Value
Typical
Value
Maximum
Value
Unit
-
VDD*0.2
V
VOL
VOH
I/O low
level
output
I/O high
level
output
-
-
3.3 TX and RX power consumption
VDD*0.8
-
V
Working
status
Transmit
Transmit
Receive
-
-
-
Mode
Rate
Transmit
power/re-
ceive
Average
value
250 Kbps +0 dBm
4.4
250 Kbps +10 dBm 9.1
250 Kbps
Constantly
receive
6.6
Peak
value
(Typical
value)
29
44
10.2
Unit
mA
mA
mA
3.4 Working current
Working
mode
Quick
network
connection
state
The module is
in the fast
network
connection
state
Working
status, Ta =
25°C
Average
value
Maximum
value (Typical
value)
9.15
9.49
Unit
mA
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4 RF PARAMETERS
Working
mode
Working
status, Ta =
25°C
Average
value
Maximum
value (Typical
value)
Connected
8.95
9.15
Unit
mA
Deep sleep
mode
2.8
-
uA
The module is
connected to
the network
Deep sleep
mode,
reserve 32-KB
SRAM
4 RF parameters
4.1 Basic RF features
Parameter
Description
Working frequency
2.405 to 2.480 GHz
Zigbee standard
IEEE 802.15.4
Data transmission rate
250 Kbps
Antenna type
PCB antenna with a gain of 2.8 dBi
4.2 TX performance
TX performance
-
Maximum
output power
(250Kbps)
Parameter
Typical value
Minimum
value
Maximum
value
10
-
Unit
dBm
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Parameter
Typical value
Minimum
value
Maximum
value
4 RF PARAMETERS
-25
0.5
-31
-
-
1
-
-
-
Minimum
output power
(250Kbps)
Output power
adjustment
stepping
Output
spectrum
adjacent
channel
suppression
Frequency
error
4.3 RX performance
RX sensitivity
Parameter
Typical value
Minimum
value
Maximum
value
-99
-99
-99
PER<8%, RX
sensitivity
(250 Kbps)
-10
-
10
ppm
Unit
dBm
dBm
dBc
Unit
dBm
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5 ANTENNA INFORMATION
5 Antenna information
5.1 Antenna type
ZT5 only uses the onboard PCB antenna.
5.2 Antenna interference reduction
To ensure the optimal Zigbee performance when the Zigbee module uses an onboard
PCB antenna, it is recommended that the antenna be at least 15 mm away from
other metal parts.
To prevent an adverse impact on the antenna radiation performance, avoid copper
or traces along the antenna area on the PCB.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6 Packaging information and production instructions
6.1 Mechanical dimensions
The PCB dimensions are 24±0.35mm (L) x 16±0.35mm (W) x 0.8±0.1mm (H)
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.2 Side view
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.3 The schematic diagram of footprint
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.3.1 PCB footprint diagram-SMT
6.4 Production instructions
1. For the modules that can be packaged with the SMT or in an in-line way, you can
select either of them according to the PCB design solutions of customers. If a
PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB
is designed to be in-line-packaged, package the module in an in-line way. After
being unpacked, the module must be soldered within 24 hours. Otherwise, it
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
needs to be put into the drying cupboard where the relative humidity is not
greater than 10%; or it needs to be packaged again under vacuum and the
exposure time needs to be recorded (the total exposure time cannot exceed
168 hours).
• (SMT process) SMT devices:
– Mounter
– SPI
– Reflow soldering machine
– Thermal profiler
– Automated optical inspection (AOI) equipment
• (Wave soldering process) Wave soldering devices
– Wave soldering equipment
– Wave soldering fixture
– Constant-temperature soldering iron
– Tin bar, tin wire, and flux
– Thermal profiler
• Baking devices:
– Cabinet oven
– Anti-electrostatic and heat-resistant trays
– Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:
• The moisture-proof bag must be placed in an environment where the tem-
perature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.
• There is a humidity indicator card (HIC) in the packaging bag.
3. The module needs to be baked in the following cases:
• The packaging bag is damaged before unpacking.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
• There is no humidity indicator card (HIC) in the packaging bag.
• After unpacking, circles of 10% and above on the HIC become pink.
• The total exposure time has lasted for over 168 hours since unpacking.
• More than 12 months have passed since the sealing of the bag.
4. Baking settings:
• Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5%
RH for tray package (please use the heat-resistant tray rather than plastic
container)
• Time: 48 hours for reel package and 12 hours for tray package
• Alarm temperature: 65°C for reel package and 135°C for tray package
• Production-ready temperature after natural cooling: < 36°C
• Re-baking situation: If a module remains unused for over 168 hours after
being baked, it needs to be baked again.
• If a batch of modules is not baked within 168 hours, do not use the reflow
soldering or wave soldering to solder them. Because these modules are
Level-3 moisture-sensitive devices, they are very likely to get damp when
exposed beyond the allowable time. In this case, if they are soldered at
high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective
measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI
to monitor the quality of solder paste printing and mounting.
6.5 Recommended oven temperature curve
Select a proper soldering manner according to the process. For the SMT process,
please refer to the recommended oven temperature curve of reflow soldering. For
the wave soldering process, please refer to the recommended oven temperature
curve of wave soldering. There are some differences between the set temperatures
and the actual temperatures. All the temperatures shown in this module datasheet
are obtained through actual measurements.
Manner 1: SMT process (Recommended oven temperature curve of reflow
soldering)
Set oven temperatures according to the following curve.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
• A: Temperature axis
• B: Time axis
• C: Liquidus temperature: 217 to 220°C
• D: Ramp-up slope: 1 to 3°C/s
perature: 150 to 200°C
• F: Duration above the liquidus: 50 to 70s
• G: Peak temperature: 235 to 245°C
• H: Ramp-down slope: 1 to 4°C/s
• E: Duration of constant temperature: 60 to 120s; the range of constant tem-
Note: The above curve is just an example of the solder paste SAC305.
For more details about other solder pastes, please refer to Recommended
oven temperature curve in the solder paste specifications.
Manner 2: Wave soldering process (Oven temperature curve of wave sol-
dering)
Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260°C±5°C.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
{width=100%}
Suggestions on
oven temperature
curve of wave
soldering
Preheat
temperature
Suggestions on
manual soldering
temperature
Soldering
temperature
80 to 130 °C
360±20°C
Preheat time
75 to 100s
Soldering time
< 3s/point
Peak contact time 3 to 5s
Temperature of
tin cylinder
260±5°C
Ramp-up slope
≤2°C/s
Ramp-down slope ≤6°C/s
NA
NA
NA
NA
NA
NA
NA
NA
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.6 Storage conditions
23 / 26
7 MOQ and packaging information
8 APPENDIX: STATEMENT
Product
number
MOQ (pcs)
Shipping
packaging
method
The number
of modules
per reel
The number
of reels per
carton
ZT5
3600
Tape reel
900
4
8 Appendix: Statement
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class
B digital device, according to part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if
not installed and used following the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which
can be determined by turning the device off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled
24 / 26
8 APPENDIX: STATEMENT
rolled environment. This device should be installed and operated with a minimum
distance of 20cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operating simultaneously
with other radios in the host system except following FCC multi-transmitter product
procedures. Additional testing and device authorization may be required to operate
simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are
country dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC
rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing
with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as
shown in this manual, including “This product must be installed and operated with
a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-ZT5. The end product must be labeled in a
visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZT5”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna
and users, and 2) The transmitter module may not be co-located with any other
transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product
for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module
product is in compliance with essential requirements and other relevant provisions
25 / 26
of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be
found at https://www.tuya.com.
8 APPENDIX: STATEMENT
This product must not be disposed of as normal household waste, in accordance with
the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU).
Instead, it should be disposed of by returning it to the point of sale, or to a municipal
recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
26 / 26