ZTC Module Datasheet Version: 20220620 Online Version Contents Contents 1 Overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 2 2.1 Dimensions and package . 4 2.2 Pin definition . 5 2 Module interfaces 3 Electrical parameters
. 8 3.1 Absolute electrical parameters 3.2 Normal working conditions
. 8 3.3 TX and RX power consumption . 9
. 9 3.4 Operating current 4 RF parameters
. 11 4.1 Basic RF features 4.2 TX performance . 11 4.3 RX performance . 12 5 Requirements on power-on sequence 6 Antenna information 6.1 Antenna type . 15 6.2 Antenna interference reduction . 15 7 Packaging information and production instructions 7.1 Mechanical dimensions
. 16 7.2 Side view . 17 7.3 The schematic diagram of footprint . 17
. 18 7.4 The diagram of PCB footprint 7.5 Production instructions
. 18 7.6 Recommended oven temperature curve . 20 7.7 Storage conditions . 22 2 4 8 11 13 15 16 I 8 MOQ and packaging information 9 Appendix: Statement Contents 23 24 II Contents ZTC is a Zigbee module that Tuya has developed. It consists of a highly integrated RF processor chip (Z2) and a few peripherals. ZTC is embedded with a low-power 32-bit CPU, 1024-KB flash memory, 64-KB RAM, and rich peripherals. 1 / 26 1 Overview Based on ZTC, customers can develop Zigbee products as required. 1 Overview 1.1 Features Embedded with low-power 32-bit CPU and ARM Cortex-M33 processor The clock rate: 48 MHz Wide operating voltage: 1.8 (2.8V or higher is recommended) to 3.6 V Peripherals: 5 GPIOs, 1 UART Zigbee connectivity Support 802.15.4 MAC/PHY Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250 Kbps Up to +10dBm output power and dynamic output power > 35 dB Built in with a monopole antenna Monopole antenna with a gain of 2.5 dBi Operating temperature: -40C to 105C Support hardware encryption and AES 128 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Intelligent bus 1.3 Change history 2 / 26 1 Overview Date Updated content Version after update 6/16/2022 This is the first release. V1.0.0 3 / 26 2 Module interfaces 2 Module interfaces 2.1 Dimensions and package ZTC has two rows of pins with a spacing of 1.50.1 mm. The ZTC dimensions are 150.35 mm (L)80.35 mm (W) 30.15 mm (H). The dimensions of ZTC are as follows:
4 / 26 2 Module interfaces Pin number Symbol I/O type Function 2.2 Pin definition 2 3 4 RXD TXD C2 Uart_RXD, which corresponds to B7
(Pin 17) on the internal IC Uart_TXD, which corresponds to B1
(Pin 6) of the IC Support hardware PWM and correspond to C2
(Pin 22) on the internal IC I/O I/O I/O 5 / 26 2 Module interfaces Support hardware PWM and correspond to C3
(Pin 23) on the internal IC Support hardware PWM and correspond to D2
(Pin 31) on the internal IC Support hardware PWM and correspond to B4
(Pin 14) on the internal IC Support hardware PWM and correspond to B5
(Pin 15) on the internal IC Power supply reference ground Power supply pin of the module (The typical power supply voltage:
3.3V Burning pin, which corresponds to SWS (Pin 5) on the internal IC Pin number Symbol I/O type Function C3 I/O D2 I/O 5 6 7 8 9 10 11 B4 B5 GND 3V3 SWS I/O I/O I/O P P 6 / 26 Pin number Symbol I/O type Function 12 RST I 2 Module interfaces Hardware reset pin; by default, high level, low active Note: P indicates a power supply pin and I/O indicates an input/output pin. 7 / 26 3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Unit 1.8 (2.8V or higher is rec-
ommended) Operating temperature Power supply voltage TAMB-25C TAMB-25C
-40
105 3.6 2 0.5 Ta VBAT ESD voltage
(human body model) ESD voltage
(machine model) 3.2 Normal working conditions C V KV KV Parameter Description Minimum value Typical value Maximum value
-40 105 Ta VCC VIL VIH Operating tempera-
ture Operating voltage I/O low level input
I/O high level input 3.3 3.6 1.8 (2.8V or higher is recom-
mended) VDD*0.3 VDD*0.7
Unit C V V V
8 / 26 3 Electrical parameters Parameter Description Minimum value Typical value VOL VOH I/O low level output
I/O high level output VDD*0.8
Maximum value VDD*0.2
Unit V V 3.3 TX and RX power consumption Mode Rate Transmit power/re-
ceive Average value 250 Kbps +0 dBm 4.8 250 Kbps +10 dBm 9.15 250 Kbps Constantly 7.35 7.39 receive Peak value
(Typical value) 23 39 Unit mA mA mA Working status Transmit Transmit Receive
3.4 Operating current Working mode Average value Maximum value (Typical value) Unit mA 9.15 9.49 Quick connection network state Connected 9 9.2 mA Working status, Ta =
25C The module is in the fast network connection state The module is connected to the network 9 / 26 3 Electrical parameters Working mode Average value Deep sleep mode 2.8
Working status, Ta =
25C Deep sleep mode, reserve 32-KB SRAM Maximum value (Typical value) Unit uA 10 / 26 4 RF parameters Parameter Description Working frequency Zigbee standard Data transmission rate 2.405 to 2.480 GHz IEEE 802.15.4 250 Kbps Antenna type monopole antenna with a gain of 2.5 dBi 4 RF parameters 4.1 Basic RF features 4.2 TX performance TX performance
Maximum output power
(250Kbps) Minimum output power
(250Kbps) Output power adjustment stepping Output spectrum adjacent channel suppression Frequency error Parameter Typical value Minimum value Maximum value Unit dBm dBm dBm dBc 10
-25 0.5
-31
1
11 / 26
-10
10 ppm 4 RF parameters 4.3 RX performance RX sensitivity Parameter PER<8%, RX sensitivity
(250 Kbps) Minimum value Typical value Maximum value
-102
-101
-99 Unit dBm 12 / 26 5 Requirements on power-on sequence 5 Requirements on power-on sequence The Z2 chip has requirements on the power-on sequence. During the power-on process, the system starts when the RST pin reaches 1.62V. At this time, the VCC needs to reach more than 1.8V within 10ms. Because the RST pin has the RC link, the VCC of the bare module is much more than 1.8V when the RST reaches 1.62V. In some cases that the large capacitance in the power driver connected to the Z2 chip module charges or discharges, if the module voltage is not fully discharged 13 / 26 5 Requirements on power-on sequence below 0.6V, the module will probably crash when it is restarted. It is required that the power supply pin VCC_3.3V of the module needs to be connected with a dummy load of 1K to release power quickly. You can refer to the following figure which shows parts of power-driven links. 14 / 26 6 Antenna information 6 Antenna information 6.1 Antenna type ZTC only uses the monopole antenna. 6.2 Antenna interference reduction To ensure the optimal Zigbee performance when the Zigbee module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. 15 / 26 7 Packaging information and production instructions 7 Packaging information and production instructions 7.1 Mechanical dimensions The PCB dimensions are 150.35 mm (L)80.35 mm (W) 0.80.1 mm (H). 16 / 26 7 Packaging information and production instructions 7.2 Side view 7.3 The schematic diagram of footprint 17 / 26 7 Packaging information and production instructions 7.4 The diagram of PCB footprint ZTC can choose SMT placement. 7.4.1 PCB footprint diagram-SMT 7.5 Production instructions 1. The Tuya SMT module should be mounted by the SMT device. After being un-
packed, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded
(the total exposure time cannot exceed 168 hours). SMT devices:
Mounter SPI 18 / 26 7 Packaging information and production instructions Reflow soldering machine Thermal profiler Automated optical inspection (AOI) equipment Baking devices:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment where the tem-
perature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag.
![HIC -SMT module .png ]( https :// airtake -public -data -1254153901. cos.ap 1 2 -shanghai . myqcloud .com/goat /20210410/48793 a0e11ea40d4839db36535e47bf 3 5. png) 3. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking. There is no HIC in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months has passed since the sealing of the bag. 4. Baking settings:
Temperature: 60C and 5% RH for reel package and 125C and 5%
RH for tray package (please use a heat-resistant tray rather than a plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond 19 / 26 7 Packaging information and production instructions the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 7.6 Recommended oven temperature curve Set oven temperatures according to the following temperature curve of reflow sol-
dering. The peak temperature is 245C. A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s perature: 150 to 200C F: Duration above the liquidus: 50 to 70s 20 / 26 E: Duration of constant temperature: 60 to 120s; the range of constant tem-
7 Packaging information and production instructions G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications. 21 / 26 7 Packaging information and production instructions 7.7 Storage conditions 22 / 26 8 MOQ and packaging information 8 MOQ and packaging information Product model MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton ZTC 3600 Tape reel 900 4 23 / 26 9 Appendix: Statement 9 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device to an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user. 24 / 26 9 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-ZTC. The end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-ZTC
. This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with 25 / 26 9 Appendix: Statement the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 26 / 26