November 2008 McAdams 2.4 GHz Smart Transceiver Module Application Note Hardware Description Rev. 1.2 Automotive, Industrial &
Multimarket Edition 2008-11-13 Published by Infineon Technologies AG 81726 Munich, Germany 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Mc Adams 2.4 GHz Smart Transceiver Module Application Note Hardware Description 3 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module Infineon RFT v2.0 MAB-X816483 -004 FCC ID: WFO-ADAMRFMO IC: 6850 B-ADAMRFMO Notice This device complies with Part 15 of the FCC Rules and with RSS-210 of Industry Canada Operation is subject to the following conditions:
1. 2. this device may not cause harmful interference, and this device must accept any interference received, including interference that may cause undesired operation. FCC d Notice Changes or modifications made to this equipment not expressly approved by Infineon Technlologies may void the FCC authorization to operate this equipment. Notice Applications including the Mc Adams RF module must have an exterior label showing the information below:
Contains FCC ID:WFO-ADAMRFMO Application Note Hardware Description 4 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module Figure 1 Declaration of Conformity DeclarationOfConformity vsd Application Note Hardware Description 5 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module McAdams 2.4 GHz Smart Transceiver Module Revision History: 2008-11-13, Rev. 1.2 Previous Version: 1.0 Page Subjects (major changes since last revision) Table 1, Table 3, Table 5, Table 6, Figure 3 updated. Previous Version: 1.1 Figure 2 added Table 1, Figure 1, Figure 2, Figure 4, Figure 5 and layout guidelines updated Trademarks of Infineon Technologies AG ABM, A-GOLD, AOP, BlueMoon, ConverGate, Converpath, COSIC, C166, DUALFALC, DuSLIC, E-GOLD, ELASTec, Epic, FALC, FlexiSLIC, GEMINAX, GIGAFLOW, GOLDMOS, INCA, IOM, IPVD, Isac, IWE, IWORX, LEDFET, M-GOLD, MuSLIC, OCTALFALC, OCTAT, OmniTune, OmniVia, OPTIVERSE, PASi, PROSOC, QUADFALC, SCEPTRE, SCOUT, SEROCCO, S-GOLD, SICOFI, SIEGET, SLIC, SMARTI, SMARTiPM, SMARTiPM+, SMARTiUE, SMARTi3G, SMARTi3G+, SMINT, SOCRATES, TrueNTRY, VINAX, VINETIC, VIONTIC, VOIPRO, WDCT, WildPass, X-GOLD, XMM, X-PMU. Other Trademarks Microsoft, Visio, Windows of Microsoft Corporation. Linux of Linus Torvalds. FrameMaker of Adobe Systems Incorporated. APOXI, COMNEON of Comneon GmbH & Co. OHG. PrimeCell, RealView, ARM, ARM Developer Suite (ADS), Multi-ICE, ARM1176JZ-S, CoreSight, Embedded Trace Macrocell (ETM), Thumb, ETM9, AMBA, ARM7, ARM9, ARM7TDMI-S, ARM926EJ-S of ARM Limited. OakDSPCore, TeakLite DSP Core, OCEM of ParthusCeva Inc. IndoorGPS, GL-20000, GL-
LN-22 of Global Locate. mipi of MIPI Alliance. CAT-iq of DECT Forum. MIPS, MIPS II, 24KEc of MIPS Technologies, Inc. Texas Instruments, PowerPAD, C62x, C55x, VLYNQ, Telogy Software, TMS320C62x, Code Composer Studio, SSI of Texas Instruments Incorporated. Luxworks of LSI Corporation. Bluetooth of Bluetooth SIG, Inc. IrDA of the Infrared Data Association. Java, SunOS, Solaris of Sun Microsystems, Inc. Philips, I2C-Bus of Koninklijke Philips Electronics N.V. Epson of Seiko Epson Corporation. Seiko of Kabushiki Kaisha Hattori Seiko Corporation. Panasonic of Matsushita Electric Industrial Co., Ltd. Murata of Murata Manufacturing Company. Taiyo Yuden of Taiyo Yuden Co., Ltd. TDK of TDK Electronics Company, Ltd. Motorola of Motorola, Inc. National Semiconductor, MICROWIRE of National Semiconductor Corporation. IEEE of The Institute of Electrical and Electronics Engineers, Inc. Samsung, OneNAND, UtRAM of Samsung Corporation. Toshiba of Toshiba Corporation. Dallas Semiconductor, 1-
Wire of Dallas Semiconductor Corp. NOVeA of Virage Logic Corp. ISO of the International Organization for Standardization. IEC of the International Engineering Consortium. EMV of EMVCo, LLC. Zetex of Zetex Semiconductors. Rohm of Rohm Co., Ltd. Microtec of Microtec Research, Inc. Verilog of Cadence Design Systems, Inc. ANSI of the American National Standards Institute, Inc. WindRiver and VxWorks of Wind River Systems, Inc. Nucleus of Mentor Graphics Corporation. Application Note Hardware Description 6 Rev. 1.2, 2008-11-13 Table of Contents Mc Adams 2.4 GHz Smart Transceiver Module Table of Contents 4 Table of Contents . 7 List of Tables . 9 2.4 GHz Smart Transceiver Module . 10 Overview . 10 Reference Schematic and Layout Guidelines . 12 Electrical Specifications . 14 Absolute Maximum Ratings . 14 Operating Conditions . 14 Radio Specifications . 15 SPI Timing . 16 Terminology . 18 References . 19 1 1.1 1.2 2 2.1 2.2 2.3 2.4 Application Note Hardware Description 7 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Declaration of Conformity . 5 Top View of the 2.4GHz Smart Transceiver Module . 10 Decoupling Circuit. 12 Footprint on Host Board for Mc Adams Module . 13 Module Drawing . 13 SPI Timing Diagram . 17 Application Note Hardware Description 8 Rev. 1.2, 2008-11-13 List of Tables Mc Adams 2.4 GHz Smart Transceiver Module List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Module Pin Description . 10 Absolute Maximum Ratings . 14 Normal Operating Conditions . 14 DC Supply Power Up Current . 15 RF Receiver RFIO Port1 . 15 RF Transmitter RFIO Port1 . 16 SPI Timing Characteristics . 16 Application Note Hardware Description 9 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module 2.4 GHz Smart Transceiver Module 2.4 GHz Smart Transceiver Module 1 This Application Note provides guidelines, hints, requirements and electrical specifications to enable customer to design in the 2.4 GHz Smart Transceiver module Mc Adams in wireless XBOX applications. Overview 1.1 The 2.4 GHz Smart Transceiver module is intended to be used as a main building block in wireless XBOX peripheral systems. It can be easily connected to the host board. Communication between a backend processor and the module is done via a serial peripheral interface (SPI). The module top view is given in Figure 2 . 2.4GHz Smart Transceiver Module 2.vsd Top View of the 2.4GHz Smart Transceiver Module Figure 2 The Mc Adams RF module comprises a 2.4 GHz Smart Transceiver IC that is supported by a 12 MHz crystal oscillator and a security device, needed for authorization as an XBOX conform peripheral. The RF output is connected via a matching circuit (discrete balun) to a printed inverted F-antenna. Note: Applications including the Mc Adams RF module must have an exterior label showing the information below:
Contains FCC ID:WFO-ADAMRFMO Furthermore it features module pins at the edges of the PCB which are described in Table 1. Table 1 Pin X1 X2 Module Pin Description Name VSSA VSSIO Type GND GND Application Note Hardware Description Function analog GND digital GND 10 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module 2.4 GHz Smart Transceiver Module Function digital GND (module extra GND pin) IO Supply for security device 12 MHz clock or SysClk output for backend Note: Voltage range of the microcontroller clock input needs to be checked against output voltage on CLKOUT. If it doesnt fit a level shifter needs to be added on the host board. digital GND (module extra GND pins) analog GND (module extra GND pins) Wakeup, external 1.5k pull up resistor to VDDIO needed on host board, active low IO Supply General Purpose IO General Purpose IO SPI slave data available General Purpose IO or FRAME_SYNC#
SPI chip select SPI master output slave input signal SPI master input slave output signal Wakeup, external 1.5k pull up resistor to VDDIO needed on host board, active low SPI clock Reset, external 1.5k pull up resistor to VDDIO needed on host board VDDC regulator output analog GND (module extra GND pins) Table 1 Pin X3 X4 X5 X6, X7 X8..X10 X11 X12, X13 X14 X15 X16 X17 X18 X19 X20 X21 Module Pin Description (contd) Name VSSIO VDDIOSEC CLKOUT Type GND GND O VSSIO VSSA WAKEUP_1#
GND GND I VDDIO GPIO(3) GPIO(4) D_AVAIL#
GPIO(2) CS#
MOSI MISO WAKEUP_0#
Supply IO IO O IO I I O I X22 X23 CLK RESET#
I I X24 X25..X32 VDDCREG VSSA S GND Symbols:
I: Input O: Output S: Supply Application Note Hardware Description 11 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module 2.4 GHz Smart Transceiver Module Reference Schematic and Layout Guidelines 1.2 Layout guidelines Some generic layout guidelines and parameters for the application host board are desribed below:
Material recommendation: epoxy glass, nema grade FR4, halogen free ROHS and WEE compliant, rating 110-
Place the McAdams module in a way that the antenna is not in the middle of the application PCB but at the 150 C edge Place ground plane under the Mc Adams module for shielding. Take particular note that there is no ground plane, trace or something similar below the antenna area to avoid RF signal disturbances. If possible leave a hole below the antenna area In order to minimize crosstalk at the Mc Adams module a decoupling circuit for its power supply (VDDIO) should be placed on the host PCB. A simple decoupling circuit with a ferrite choke and three capacitors is shown in Figure 3. L1 220n V_in
C1 1 C2 100n V_out C3 10n Decoupling Circuit Figure 3 The Mc Adams Module has to be soldered onto the host board. The appropriate footprint for the host board is shown in Figure 4. Decoupling2.vsd Application Note Hardware Description 12 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module 2.4 GHz Smart Transceiver Module Note: dimensions in mm [mil]
2.4GHz Smart Transceiver Module Footprint.vsd Footprint on Host Board for Mc Adams Module Figure 4 The module drawing is illustrated in Figure 5. 31.94 9 5
. 8 2 7
. 3 2 18 2.5 5
. 0 1
. 0
0
. 6 Note: dimensions in mm 2.4GHz Smart Transceiver Module Drawing.vsd Figure 5 Module Drawing Application Note Hardware Description 13 Rev. 1.2, 2008-11-13 2 Electrical Specifications 2.1 Absolute Maximum Ratings Absolute Maximum Ratings Table 2 Description Storage Temperature I/O Supply Voltage Input Voltage Range Output Voltage Range Lead Temp. (solder 4 sec) RF core Power Supply Voltage Absolute difference between power supplies Voltage on any pin Storage Temperature Lead Temp. (solder 4 sec) ESD - human body model ESD - machine model Mc Adams 2.4 GHz Smart Transceiver Module Electrical Specifications Typ Min
-55
-0.9
-0.9
-0.9
-0.3 Max
+150 4.0 4.0 4.0
+260 1.9 0.3 Vdd+0.3V
+150
+260 2 200 Units C V C C C V V V C C KV V Attention: Stresses above those listed here are likely to cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Maximum ratings are not operating conditions. 2.2 Operating Conditions Normal Operating Conditions Table 3 Description Normal Operating ambient temperature range Refer to CMOS digital input (35 ppm overall) Input Supply Voltage VDDIO I/0 Voltgage Typ. 12 Min. 5 2.0 2.0 Max.
+60 3.6 3.6 Units C MHz V V Application Note Hardware Description 14 Rev. 1.2, 2008-11-13 2.3 Radio Specifications Mc Adams 2.4 GHz Smart Transceiver Module Electrical Specifications DC Supply Power Up Current Table 4 Description Static current in power down Receive mode current with PLL synthesizer switch on Transmit mode current RF setup mode current Max. RF current Condition After reset and tbd
-90 dBm sensitivity High output power Tbd programmed Including RF output current of the PA stage;
Min. Typ. Max. 10 15 15 17 72 Units A mA mA mA mA RF Receiver RFIO Port1 Table 5 Description Receiver input frequency range RFIO1/RFIO1X LNA Input resistance (balanced ) LNA Input capacitance LO leakage Low RSSI limit High RSSI limit RSSI resolution Receiver sensitivity Receiver sensitivity degrade by full temperature range Receiver sensitivity, degraded by frequency offset Receiver input power range Intermodulation performance level
(IP3) Interferer performance in high sensitivity mode; RF wanted f=2442 MHz, Pin = -70dBm, Ta=25C, f=(2442+k+2)MHz Out of band blocking Condition f = 2440 MHz f = 2440 MHz Min. 2401 Typ. Max. Units 2483 MHz Ohm pF dBm dBm dBm dB dBm dBm dBm dBm dBm dBc dBc dBc dBc dBm
-60
-88 100 1 3
-90 2 1.5 3 10
-18 10
-23
-50
-55
-30
-20
-20
-48
-92
-92
-27 4-bit BER <=1E-3; Ta=25C BER <=1E-3; 0C<=Ta<=+65C frequency offset|<= 50Hz; Ta=
25C Ta = 25C Ta=25C; BER <= 1E-3;
RF wanted f= 2442 MHz, Pin = -70 dBm, FSK @2438 MHz, CW
@2440 MHz k = 0 (Co-channel) k = +/-1 k = +/-2 k =+/-3 1-2000 MHz 2000 - 2400 MHz 2484 - 6000 MHz Application Note Hardware Description 15 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module Electrical Specifications RF Transmitter RFIO Port1 Table 6 Description Transmitter output frequency range Output power ( high gain ) Output power ( low gain ) Coarse output power steps Fine output power steps Adjacent channel noise power
(P/N) Spurious Emission conducted device operation 2.4 SPI Timing Condition Min. 2401 Typ. Max. Units 2483 MHz Tx power control bits:
00000 --> 10000 Tx power control bits:
00000 + 1 P/N = +/-1 P/N = +/-2 P/N = +/-3 30 MHz to 1 GHz 1.0 GHZ to 12,75 GHz 1.8 GHz to 1.9 GHz 5.15 GHz to 5.30 GHz
-41 4
-38 25
-37 1 2 4
-36
-65
-68
-60
-40
-60
-75 dBm dBm dBm dBm dBc dBc dBc dBm dBm dBm dBm Table 7 Parameter SPI Timing Characteristics Limit Values Unit Test Condition Min. Typ. Max. 7.518 MHz 200 100 100 1) fSPI t1 ns t2 ns t3 ns tout_delay ns tsetup ns 1) SPI frequency can be calculated by fSPI = fsys / (3 + 8ns * fsys) 20 5 fsys = 24 MHz Application Note Hardware Description 16 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module Electrical Specifications t3 D_AVAIL#
CS#
CLK MOSI MISO t1 X X t2 fSPI tsetup tout_delay Figure 6 SPI Timing Diagram ADAMS SPI-Timing.vsd Application Note Hardware Description 17 Rev. 1.2, 2008-11-13 Mc Adams 2.4 GHz Smart Transceiver Module Terminology Terminology SPI Serial Peripheral Interface Application Note Hardware Description 18 Rev. 1.2, 2008-11-13 References
[1] Adams Smart Transceiver Data Sheet Rev. 1.1 Mc Adams 2.4 GHz Smart Transceiver Module References Application Note Hardware Description 19 Rev. 1.2, 2008-11-13 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG