COMPANY CONFIDENTIAL LTE-Advanced PCI Express M.2 Module
(LTE, UMTS) Engineering Requirements Specification Project code: T77W676.00 Solution: MDM9240+WTR3925+WTR4905 SKU: WW-3-S3 Copyright 2017. Foxconn Communications Inc. All rights reserved.
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COMPANY CONFIDENTIAL Reviewers Department Name Signature Review Dates
* Plan
** Results Project Manager Project Leader Choro.Chung Ai-ning Song Hardware Engineer Yannie.Zhang Modification History Rev Date Originator D1.0 2016/12/13 Yannie.Zhang Comment Initial release for customer discussion and carrier engagement, will update it after hardware design frozen. D1.1 2016/12/27 Yannie.Zhang Change the module picture and remark 1.8V MIPI. D1.2 2017/2/24 Yannie.Zhang Update RF performance follow EVT design D1.3 2017/05/10 Yannie.Zhang Upadte CA Combination. D1.4 2017/08/02 Yannie.Zhang Update LTE B5 powers spec.
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COMPANY CONFIDENTIAL CONTENTS 1. 1.1 1.2 1.3 1.4 1.5 2. GENERAL DESCRIPTION ...................................................................... 5 SYSTEM MAIN FEATURE ...................................................................... 6 CARRIER AGGREGATION COMBINATION ...................................... 8 SYSTEM BLOCK DIAGRAM ............................ !
PIN DEFINITION ....................................................................................... 9 PLATFORM CONNECTION DESIGN ................................................. 11 HARDWARE FEATURES ..................................................................... 19 2.1 MOBILE DATA MODEM ............................................................................... 19 2.2 RF TRANSCEIVER ........................................................................................ 20 2.3 POWER MANAGEMENT IC ........................................................................ 21 2.4 ANTENNA DESIGN ....................................................................................... 22 3. MECHANICAL SPECIFICATIONS ...................................................... 25 3.1 OVERVIEW ..................................................................................................... 25 3.2 MECHANICAL CONSTRAINTS .................................................................. 25 3.3 M.2 CARD ASSEMBLY ................................................................................ 26 4. ELECTRICAL SPECIFICATIONS ........................................................ 29 4.1 RECOMMENDED OPERATING CONDITIONS ....................................... 29 4.2 POWER CONSUMPTION ............................................................................. 30 5. RF PERFORMANCE SPECIFICATIONS ........................................... 31 5.1 RF MAXIMUM TX POWER &RF MIN. RX SENSITIVITY SPECIFICATIONS ................................................................................................ 31
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HOST INTEGRATION INSTRUCTIONS ............................................. 33 COMPANY CONFIDENTIAL 6.
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COMPANY CONFIDENTIAL 1. General Description T77W676.00 is designed to enable wireless data connectivity for notebook computer or any other device compatible with the PCI Express M.2 Specification 3042 type Key.B slot. T77W676.00 is the data card solution that delivers wireless wide-area network (WWAN) connectivity for the LTE, UMTS (HSDPA/HSUPA/HSPA+/DC-HSPA+) and GPS/Glonass/Beidou protocols in one hardware configuration. SKU WW-3-S3 / T77W676 NA: AT&T, Verizon, Sprint WW: Vodafone, Orange, Telefonica-O2 EU: Deutsche Telekom, Swisscom APAC: Telstra, Optus, Docomo, KDDI China: CMCC/CUCC/CTCC
* Carrier engagement based on real business agreement MDM9240+WTR3925+WTR4905+PMD9645 FDD / TDD Carrier Support QCT Solution FDD Support Band B2/4/5/7/12/13/17/25/26/30/38/41/66 Carrier Aggregation 2CCs&3CCs DL CA, 2X2MIMO, Up to inter-band 3CCs DL Cat (DL/UL Mbps) Up to Cat11 @20MHz+20MHz+20MHz 3CCs DL CA WCDMA HSPA+ Rel8 (DL/UL: up to 42/11 Mbps) Support Band Band4 GNSS Interface Form factor GPS/GLONASS/Beidou USB2.0, USB3.0 3042 PCIe M.2 Key.B 5 4G 3G 1.1 System Main Feature Feature Physical Electrical Dimension Shielding design Weight USIM Operating Bands COMPANY CONFIDENTIAL Description PCI express M.2 module, size 3042,Key.B,75Pin golden finger Single VCC supply (3.135V~4.4V follow M.2 standard) Dimensions (L W H): 42 mm 30 mm 2.3 mm, maximum height=2.38mm (add PCB tolerance=0.08mm) Shield case on board design, no additional shielding requirement Approximately ~6g Off-board USIM connector supported WCDMA/HSDPA/HSUPA/HSPA+ operating bands:
Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL) LTE FDD operating bands:
Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL) Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL) Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL) Band 7: 2500 to 2570 MHz (UL), 2620 to 2690 MHz (DL) Band 12: 699 to 716 MHz (UL), 729 to 746 MHz (DL) Band 13: 777 to 787 MHz (UL), 746 to 756 MHz (DL) Band 17: 704 to 716 MHz (UL), 734 to 746 MHz (DL) Band 25: 1850 to 1915 MHz (UL), 1930 to 1995 MHz (DL) Band 26: 814 to 849 MHz (UL), 859 to 894 MHz (DL) Band 30: 2305 to 2315 MHz (UL) 2350 to 2360 MHz (DL) Band 38: 2570 to 2620 MHz (UL/DL) Band 41: 2496 to 2690 MHz (UL/DL) Band 66: 1710 to 1800 MHz (UL), 2110 to 2200 MHz (DL) Diversity/2nd Rx GNSS All UMTS operating bands All LTE operating bands GPS: L1 (1575.42MHz) GLONASS: L1 (1602MHz) Beidou (1561.098MHz) USIM Voltage Support 1.8V and 2.85V, and auto detects follow SIM card type Antenna connectors MAIN and AUX(supports Diversity and GPS simultaneously) Throughput WCDMA CS: DL 64 kbps /UL 64 kbps WCDMA PS: DL 384 kbps /UL 384 kbps HSPA+: DL 21.6 Mbps /UL 5.76 Mbps DC-HSPA+: DL 42 Mbps/UL 5.76 Mbps LTE Cat4: DL:150 Mbps/UL 50 Mbps LTE Cat6: DL:300 Mbps/UL 50 Mbps LTE Cat9: DL:450 Mbps/UL 50 Mbps LTE Cat11: DL:585 Mbps/UL 50 Mbps 6 COMPANY CONFIDENTIAL LTE air interface LTE Rel11
FDD: up to 585 Mbps downlink, 50 Mbps uplink
Up to 20MHz+20MHz+20MHz Inter-band or Intra-band 3DL CA
Support 256QAM in DL, 16QAM in UL (64QAM software upgradable)
Support TDD+FDD CA (3GPP Rel12 feature)
1.4 to 20 MHz RF bandwidth
Support downlink 4X2 MIMO
IPv6, QoS WCDMA/HSPA air interface
R99:
All modes and data rates for WCDMA FDD
R5 HSDPA PS data speeds up to 7.2 Mbps on the downlink
R6 HSUPA E-DCH data rates of up to 5.76 Mbps for 2 ms TTI (UE category 6) uplink
R7 HSPA+
Downlink 64 QAM SISO: up to 21 Mbps Downlink 16 QAM 2X2 MIMO: up to 28 Mbps Uplink 16 QAM: up to 5.76 Mbps
R8 DC-HSPA+
Downlink dual carrier with 64 QAM (SISO); up to 42 Mbps IPv6
GNSS
Customizable tracking session Automatic tracking session on startup Concurrent standalone GPS, GLONASS and BeiDou gpsOneXTRA with GPS + GLONASS + BeiDou support 7 COMPANY CONFIDENTIAL 1.2 Carrier aggregation combination 1.2.1. Refer to Qualcomm documents 80-NR113-650, Rev.E, Published: 03-16-2016. Remark: T77W676 hardware design can support follow CA combination, but the Final CA combinations plan depends on carrier engagement and Qualcomm software design. 1.2.2. Qualcomm MDM9240 support 3CA+256QAM(up to Cat11) and partial Rel12
(FDD+TDD CA) which is mandatory for AU/JP/China carriers. Region Carriers 2CCs DL CA Combinations 3CCs DL CA Combinations NA AT&T, VZW, Sprint, TMO, Canada B2 + B2, B2 + B4, B2 + B5, B2 + B12, B2 + B13, B2 +
B17, B2 + B29, B2 + B30, B4
+ B4, B4 + B5, B4 + B7, B4
+ B12, B4 + B13, B4 + B17, B4 + B29, B4 + B30, B5 +
B30, B12 + B12, B12 + B30, B25 + B25, B25 + B26, B25
+ B41, B26 + B41, B29 +
B30, B41 + B41, B2+B66, B5+B66, B12+B66, B13+B66, B66+B66, B29+B66 Korea SKT,KT, LGU+
B1 + B5, B3 + B5, B3 + B8, B5 + B7 JP EU KDDI, B1 + B3, B1 + B8, B1 + B18, DCM, B1 + B19, B1 + B26, B3 +
SBM B19, B19 + B21, B41 + B41 Various B1 + B20, B3 + B3, B3 + B7, B3 + B20, B3 + B38, B7 +
B7, B7 + B8, B7 + B20, B38
+ B38 B1 + B3, B1 + B26, B3 +
B26, B3 + B40, B39 + B39, B39 + B41, B40 + B40, B41
+ B41 B1 + B3, B1 + B7, B1 + B28, B3 + B8, B3 + B28, B5 + B7, B5 + B40, B7 + B8, B7 +
B28 8 China CMCC, CTCC, CUCC AU/SE A/LA Telstra
/Optus B2 + B2 + B12, B2 + B2 + B13,B2 +
B4 + B5, B2 + B4 + B12, B2 + B4 +
B13, B2 + B4 + B29, B2 + B5 + B30, B2 + B12 + B12, B2 + B12 + B30, B2
+ B29 + B30, B4 + B4 + B5, B4 + B4
+ B12, B4 +B4 +B13, B4 + B5 + B30, B4 + B12 + B12, B4 + B12 + B30, B4
+ B29 + B30, B25 + B26 + B41, B25
+ B41 + B41, B26 + B41 + B41, B41
+ B41 + B41 B13+B66+B2, B12+B66+B66, B13+B66+B66, B5+B66+B2, B5+B66+B66, B66+B66+B2, B66+B66+B66 B1 + B3 + B5, B1 + B3 + B8, B1 +
B5 + B7, B1 + B7 + B28, B3 + B7 +
B8 B1 + B3 + B19, B1 + B3 + B28, B1 +
B41 + B41, B41 + B41 + B41 B1 + B3 + B20, B1 + B7 + B20, B3 +
B3 + B7, B3 + B3 + B20, B3 + B7 +
B20, B3 + B7 + B7, B3 + B20 + B38, B3 + B38 + B38 B1 + B3 + B3, B1 + B3 + B26, B1 +
B3 + B41, B3 + B40 + B40, B39 +
B39 + B41, B39 + B41 + B41, B40 +
B40 + B40, B41 + B41 + B41 B3 + B3 + B8, B3 + B7 + B7, B3 +
B7 + B28, B7 + B7 + B28, B3 + B40
+ B40, B28 + B40 + B40, B40 + B40
+ B40 COMPANY CONFIDENTIAL 1.3 Pin definition 1.3.1 Golden finger Pin sequence Figure 1-2 shows the sequence of pins on the 75-pin signal interface of M.2 3042 Key.B. 9 1.4.2 Pin definition Table 1-1 M.2 Pin definition. 74 72 70 68 3.3V 3.3V 3.3V SUSCLK(32kHz) (I)(0/3.3V) 66 64 62 60 58 56 54 SIM DETECT (I) COEX_TXD (O)(0/1.8V) COEX_RXD(I)(0/1.8V) COEX3(I/O)(0/1.8V) MIPI_DATA (0/1.8V) MIPI_CLK (0/1.8V) PEWAKE# (IO)(0/3.3V) 52 CLKREQ# (IO)(0/3.3V) 50 PERST# (I)(0/3.3V) 48 46 44 42 40 38 36 34 32 30 28 26 24 GPIO_4 TX_BLANKING (0/1.8V*) GPIO_3 SYSCLK (0/1.8V*) GPIO_2 GNSS_IRQ (0/1.8V*) GPIO_1 GNSS_SDA(0/1.8V*) GPIO_0 GNSS_SCL (0/1.8V*) Not connect UIM PWR (O) UIM DATA (IO) UIM CLK (O) UIM RESET (O) GPIO_8 AUDIO_3 (IO) (0/1.8V) GPIO_10 W_DISABLE2# (I) (0/3.3.V) GPIO_7 AUDIO_2 (IO) (0/1.8V) COMPANY CONFIDENTIAL 75 73 71 69 67 65 63 61 59 57 55 53 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 Reserved, but SW disable in default Reserved, but SW disable in default Reserved, but SW disable in default Reserved, but SW disable in default Reserved, but SW disable in default Reserved, but SW disable in default 3.3V I/O Not connect in T77W676 Dual layout 3GPIOs and UART I/F for LTE / Wi-Fi coexistence For external tunable antenna (MiPi) Reserved, but SW disable in default Reserved, but SW disable in default Reserved, but SW disable in default Not connect in Foxconn design Reserved Reserved Reserved 3.3V I/O CONFIG_2 (GND) GND GND CONFIG_1 (GND) RESET# (I)(0/1.8V) ANTCTL3 (O)(0/1.8V) ANTCTL2 (O)(0/1.8V) ANTCTL1 (O)(0/1.8V) ANTCTL0 (O)(0/1.8V) GND REFCLKP REFCLKN GND PERp0 PERn0 GND PETp0 PETn0 GND USB3.0 Rx+
USB3.0 Rx GND USB3.0 Tx+
USB3.0 Tx GND DPR (I)(0/3.3V) GPIO_11 WoWWA N# (O)(0/1.8V) CONFIG_0 (GND) Module Key GND USB_D USB_D+
GND GND CONFIG_3 (N/C) GPIO_6 AUDIO_1 (IO)(0/1.8V) GPIO_5 AUDIO_0 (IO)(0/1.8V) GPIO_9 LED#1 (O)(Open drain) W_DISABLE1# (I)(0/3.3V) 3.3V I/O FULL_CARD_POWER_OFF# (I)(0/3.3V) 3.3V I/O 3.3V 3.3V 22 20 12~18 Module Key 10 8 6 4 2 Notes: Foxconn will provide one excel file to explain the PCIe M.2 Pin connection after project award. 21 13~19 11 9 7 5 3 1 10 COMPANY CONFIDENTIAL 1.4 Platform connection design 1.5.1 Configuration Pins The M.2 module provides 4 configuration pins. T77W676 is configured as WWAN-USB3.0 0, refer to PCIe M.2_Rev 1.1. Module configuration decodes Item Config Config_0 Config_1 Config_2 Config_3 Pin No. State 21 GND 75 GND 69 GND 1 NC Module type Port configuration WWAN-USB3.0 0 1.5.2 Power and ground
(1) Power Rail Parameters Parameter Operating voltage The operating voltage was defined in PCIe M.2_Rev 1.1 standard as 3.135V~4.4V.
(2) 3.135 V is the minimum voltage supplied to LTE M.2 card by the host platform, and VCC must never be under 3.135 V in any case. As our experiment, if we set the VCC=3.0V, the M.2 card will power off possibly when M.2 card working at +23dBm continue mode.
(3) The LTE M.2 module provides 5 power pins and 11 Ground pins. To ensure that the LTE module works normally, all the pins must be connected. Units Vdc Min 3.135 Type 3.3 Max 4.4 11 COMPANY CONFIDENTIAL 1.5.3 Full_Card_Power_Off The M.2 LTE module can be controlled to power on/off by the Full_Card_Power_Of pin. Item 1 2 M.2 card state Powers off, Its internally pulled down by 100K ohm resistor Powers on, it is 3.3V tolerant but can be driven by either 1.8V or 3.3V GPIO. State Low High The recommended connections as below 1.5.4 USB3.0 interface T77W676 module is compliant with USB3.0 in all modes. When two devices are connected via a USB3.0 interface, one of the devices must act as a host, and the other device must act as a peripheral. The host is responsible for initiating and controlling traffic on the bus. Figure 1-3 USB3.0 interface. 12 COMPANY CONFIDENTIAL 1.5.5 W_DISABLE#
This control setting is implementation-specific and represents the collective intention of the host software to manage radio operation. T77W676 provides a hardware pin (W_DISABLE#) to disable or enable the radio. Besides, the radio can also be enabled or disabled through software AT commands. Item W_DISABLE#1 Low WWAN Disabled (no RF operation allowed) Function (WWAN state) State High W_DISABLE#2 Low High WWAN Enabled (RF operation allowed), internally pull up GPS Disabled (no RF operation allowed) GPS Enabled (RF operation allowed), internally pull up Note: W_Disable# is connected to configurable GPIO pin from PMIC, which can support either 3.3V VIO or 1.8V VIO. The default configuration is 3.3V VIO with interrupt function
(low active), 1.8V will not disable RF function. 1.5.6 LED Indication The LED signal is provided to enable wireless communication add-in cards to provide status indications to users via system provided indicators
(1) State of the LED# pin Definition Item The LED is emitting light. 1 2 The LED is emitting no light. Radio is incapable of transmitting.
(2) Typical LED Connection in Platform/System Interpretation Radio is capable of transmitting. State Low High
. 13 COMPANY CONFIDENTIAL 1.5.7 WoWWAN The WAKE_ON_WWAN# signal is for power saving. LTE module always listening at very low power in idle mode LTE module will wake up mother board via WoWWAN signal. The platform will power on when triggered by the LTE module. The WAKE_ON_WWAN# signal is used to wake up the host. It is open drain and should be pulled up at the host side. When the WWAN needs to wake up the host, it will output a one second low pulse, shown in Figure 1-4. Typical Connection in Platform/System 14 COMPANY CONFIDENTIAL 1.5.8 DPR (Dynamic Power Reduction) The optional DPR signal is used by wireless devices to assist in meeting regulatory SAR
(Specific Absorption Rate) requirements for RF exposure. The signal is provided by a host system proximity sensor to the wireless device to provide an input trigger causing a reduction in the radio transmit output power. The required value of the power reduction will vary between different host systems and is left to the host platform OEM and card vendor to determine, along with the specific implementation details. The assertion and de-assertion of DPR is asynchronous to any system clock. All transients resulting from the proximity sensor need to be de-bounced by system circuitry.
(1) State of the DPR Item 1 2 Interpretation Radio is capable of transmitting. Radio is incapable of transmitting. Definition Enable the SAR power back off. Disable the SAR power back off, internally pull up State Low High Note: DPR is connected to configurable GPIO pin from PMIC, which can support either 3.3V VIO or 1.8V VIO. The default configuration is 3.3V VIO with interrupt function (low active), 1.8V will not enable DPR function.
(2) Typical Connection in Platform/System Remark:
a. The proximity sensor was controlled by the platform side. b. After DPR pin becomes low level, you can set the MAX TX power by AT commands.. 15 COMPANY CONFIDENTIAL 1.5.9 USIM The UIM contains parameters necessary for the WWAN devices operation in a wireless wide area network radio environment. The UIM signals are described in the following paragraphs for M.2 add-in cards that support the off-card UIM interface.
(1) USIM card socket It is recommended to take electrostatic discharge (ESD) protection measures near the USIM card socket. The USIM socket should be placed near the NGFF interface (<100 mm), because a long circuit may impact signal quality.
(2) UIM-PWR UIM_PWR power supply can supply 1.8 V and 2.85 V power to UIM card and auto detects follow SIM card type
(3) SIM Detect This signal is used to detect the insertion and removal of a SIM device in the SIM socket. With a Normal Short SIM Card connector, PUSH-PUSH type, the detect switch is normally shorted to ground when no SIM card is inserted. When the SIM is inserted, the SIM_DETECT will transition from logic 0 to logic 1 state. The rising edge will indicate insertion of the SIM card. When the SIM is pulled out, the SIM_DETECT will transition from logic1 to logic 0. This falling edge will indicates the pulling out of the SIM card. The M.2 module monitoring this signal will treat the rising/falling edge or the actual logic state as an interrupt, that when triggered, the module will act accordingly. The UIM_PWR from the PRODUCT shall be turned ON 2 seconds after UIM_DETECT pin is asserted to HIGH. This is to ensure the power is not turned ON earlier before SIM card to be seated well. 16 COMPANY CONFIDENTIAL 0 1 0 1 880 ~ 960 791 ~ 894 746 ~787 704 ~746 Band8 (WCDMA) + GSM900 + High Bands Band5 (WCDMA, LTE) + GSM850 + High Bands Band13 (LTE) + High Bands Band17 (LTE) + High Bands 1.5.10 Antenna Control
(1).T77W676 provides GPIO control signals for external antenna tuner application. ANTCTRL (0-3) are provided to allow for the implementation of antenna tuning solutions. The number antenna control lines required will depend on the application and antenna/band requirements. We will provide a tool to fill antenna control table in ODM factory to enable antenna tuner support on specific platforms. Foxconn general design for WWAN module with two control signals for reference only. ANTCTL0 ANTCTL1 Frequency (MHz) Band support 0 0 1 1
(2). T77W676 also provides MIPI interface (VIO=1.8V) for external antenna tuner application.The function is under development for customization. M.2 pin.56 (MIPI_CLK), 58
(MIPI_DATA) are provided to allow for the implementation of antenna tuner solutions with variable capacitors. We will provide a tool to fill MIPI registers in ODM factory to enable antenna tuner support on specific platforms. 1.5.11 Coexistence COEX1, COEX2 and COEX3 are provided to allow for the implementation of wireless coexistence solutions between the radio(s) on the M.2 Card and other off-card radio(s). These other radios can be located on another M.2 Card located in the same host platform or as alternate radio implementations (for example, using a PCI Express M.2 CEM or a proprietary form-factor add-in solution). We also dual layout UART Tx/Rx with COEX1 and COEX2 for future extension, please contact with us if need to use these Pins. Item COEX1 COEX2 COEX3 Signal name LTE_ACTIVE (COEX_TXD) LTE_FRAME_SYNC (COEX_RXD) LTE_WLAN_PRIORITY Description TBD TBD TBD 17 COMPANY CONFIDENTIAL 1.5.12 RESET#
Asynchronous RESET# pin, active low. Whenever this pin is active, the modem will immediately be placed in a Power On reset condition. Care should be taken not to activate this pin unless there is a critical failure and all other methods of regaining control and/or communication with the WWAN sub-system have failed. The Reset# signal is relatively sensitive, it is recommended to install one capacitor
(10~100pF) near to the M.2 card pin. 18 COMPANY CONFIDENTIAL 2. Hardware features T77W676.00 consists of the following key engine components, in addition to the required front-end RF and other discrete components. Modem engine Soft Baseband: MDM-9240 RF: WTR3925 and WTR4905 Power: PMD9645 Connectivity engine USB: USB3.0 USIM: located off board Antenna: connectors for the off board antennas 2.1 Mobile Data Modem The MDM9x40 chipset supports high-speed data capabilities over a wide range of air interface standards; the supported RF operating bands are defined by the chipsets RFICs. They are complete system solutions that operate on networks worldwide. The major functions of MDM9240 used on T77W676.00 are listed below:
Processor:
- Manufactured in 20nm CMOS process
- System uP (Cortex-A7 up to 1.19 GHz with 256 kB L2 cache) Memory:
- External memory EBI1: 2Gb LPDDR2, 32-bit LPDDR2 SDRAM at up to 518 MHz
- External memory EBI2: 2Gb NAND flash Air interface:
- WCDMA (R99, HSDPA, HSUPA, HSPA+, DC-HSPA+)
- LTE (R11 Cat6/9/11, FDD/TDD)
- GPS/Glonass/Beidou Advance RX operation:
- Mobile receive diversity (WCDMA, LTE) Connectivity:
- USB 3.0 with built-in USB PHY 19 COMPANY CONFIDENTIAL
- UART interface
- UIM support (dual voltage) 2.2 RF transceiver In order to support 3DL CA, there are two RF transceivers in T77W676, include WTR3925 and WTR4905. WTR3925 is designed for high bands and middle bands, and WTR4905 is for low bands and GNSS. Both of them are the RF transceiver ICs within compatible Qualcomm MDM9240 chipsets. 2.2.1.1 Key features of WTR3925
Qualcomm Technologies, Inc. (QTI) fourth-generation
4G/3G/2G transceiver
First 28 nm CMOS, wafer-level package
First single-chip LTE-carrier aggregation (CA)
First RF transceiver to support 40 MHz CA
Support for intraband and interband CA
Significant increase in number of RF ports
Dedicated feedback receiver
Integrated GPS core GPS/Glonass/BeiDou 2.2.1.2 Key benefits of WTR3925
Enables a single PCB design for global platforms
Significant power consumption and size reduction over previous generations
> 25% current consumption savings
> 50% direct package area savings
LTE-A, HSPA+, UMTS, CDMA, TD-S, and GSM
Spectrum support: 7002700 MHz
Supporting all newly specified and planned spectrums
Support for 28 Rx ports and 10 Tx ports
Reduces external components lowers cost
Single-ended inputs, easier PCB routing 2.2.2.1 Key features of WTR4905
QTI fifth-generation LTE transceiver
LTE, HSPA+, UMTS, CDMA, TD-S, and GSM
First RF transceiver to support SAWless 2G
Second 28 nm CMOS, wafer-level package 20 COMPANY CONFIDENTIAL
Supports B28 APAC 700 MHz
Significant increase in the number of Rx ports
Dedicated feedback receiver
Integrated GPS core
GPS/GLONASS/BeiDou with no eLNA 2.2.2.2 Key benefits of WTR4905
Smaller size (10 mm2) with more functionality
Spectrum support: 7002700 MHz
Supports all newly specified spectrums (including B28)
Support for eight Rx ports and five Tx ports
Enables a single PCB design for emerging markets
Reduces number of external switches
No Rx SAW required for 2G bands
Significant current consumption savings over previous generations
> 30% for 3G talk and > 50% for 4G Cat-3
Significant size reduction over previous generations 2.3 Power management IC T77W676.00 system uses the Qualcomm PMD9645. The PMD9645 device integrates all the wireless products power management, general housekeeping, and user interface support functions into a single mixed-signal IC. Its versatile design is suitable for any multimode, multiband product.Since the PMD9645 includes so many diverse functions, its operation is more easily understood by considering major functional blocks individually. Therefore, the PMD9645 document set is organized by the following device functionality:
Input power management
Output power management
General housekeeping
User interfaces
IC interfaces
Configurable pinseither multipurpose pins (MPPs) or general-purpose inputs/outputs (GPIOs)that can be configured to function within some of the other categories 21 COMPANY CONFIDENTIAL 2.4 Antenna Design 2.4.1 Antenna specification T77W676.00 also provides connectivity for off board antennas. The antennas and their connection interface for this device satisfy the requirements specified in the PCI Express M.2 Specification Revision Version 1.0 standard. The antenna elements are typically integrated into the notebook/ultrabook /tablet and connected to T77W676.00 module via flexible RF coaxial cables. T77W676.00 provides two RF connectors (MHF type), one for the primary transmitter/receiver port and the other for the diversity receiver and GNSS. To ensure stable RF performance, customer must assemble adequate antenna according to the antenna specification. Table 2-1 Main antenna specifications Max. 0.5
/
3:1 Parameter Min. Typ. Cable loss Impedance Maximum loss to antenna Antenna load impedance Maximum allowed VSWR of antenna Units dB Ohm
/
50
/
VSWR Notes
/
/
/
/
Table 2-2 Aux antenna specifications Parameter Gain Maximum gain and uniform converge in high angle elevation and zenith. Gain in the azimuth is not desired.
>-5dBi Typical value <3:1
>10dB in all related bands Any Average 3D gain VSWR Isolation(diversity to Main) Polarization 2.4.2 Antenna location and mechanical design. To ensure customer has a clear knowledge of the two antennas, check below product picture. Figure 2-1 Antenna connector location and type 22 Figure 2-2 RF connectors COMPANY CONFIDENTIAL 23 Figure 2-3 RF receptacles COMPANY CONFIDENTIAL 24 COMPANY CONFIDENTIAL 3. Mechanical Specifications 3.1 Overview T77W676.00 is compatible with the PCI Express M.2 Specification 3042 Key.B type 75-pin card edge-type connector. Refer to Electromechanical Specification Revision 0.7a, Version 1.0 with Input Power and Voltage Tolerance ECN for more details. 3.2 Mechanical constraints Figure 3-1 shows the mechanical constraints of T77W676.00 (3042-S3-B) 25 COMPANY CONFIDENTIAL 3.3 M.2 card assembly Figure 3-2 shows Stack-up Mid-Line (In-line) Single Sided Module for 1.5 Maximum Component Height, refer to section 2.4.8.3.1 of PCIe M.2_Rev 1.1 standard. Remark:
a. 2.4mm maximum above mother board b. Cut area of main board under M.2 module c. Need to add thermal pad between M.2 module and mechanical component (like material shielding) for thermal dissipation. 26 COMPANY CONFIDENTIAL 3.4 Connector assembly a. Mate the connector vertically as much as possible. Adjusting the mating axis of plug and receptacle. Do not slant mate. b. Unmating: In case of unmating by pulling tool. Use the pulling tool as the following drawing, and pull plug to vertical direction as directly as possible c. Pulling tool(Unit:mm) 27 COMPANY CONFIDENTIAL C
-20
-40
+70
+25 Min
-30
-10 Max
+85
+55 Type
+25
+25 Units C C 4. Electrical Specifications 4.1 Recommended operating conditions Table 4-1 Recommended operating conditions Parameter Storage temperature Recommend operating temperature
(3GPP compliant) Restricted operating temperature(*1)
(operational, non-3GPP compliant) Extendable (with limited performance) Temperature measure on T77W676 module(*2) Operating voltage
(1).Restricted operation allows normal mode data transmission for limited time until automatic thermal shutdown takes effect. Within the restricted temperature range (outside the operating temperature range) the specified electrical characteristics may be in or decreased.
(2).Due to temperature measurement uncertainly, a tolerance on the stated shutdown thresholds may occur. The possible deviation is in the range of +/- 2 at the over-temperature and under-temperature limit. Operating T77W676.00 device under conditions beyond its absolute maximum ratings
(Table 4-1) may damage the device. Absolute maximum ratings are limiting values to be considered individually when all other parameters are within their specified operating ranges. Functional operation and specification compliance under any absolute maximum condition, or after exposure to any of these conditions, is not guaranteed or implied. Exposure may affect device reliability 3.135 Vdc
+85 3.3 4.4 28 COMPANY CONFIDENTIAL 4.2 Power consumption Table 4-2 Radio system power consumption Estimated power range goal
(Max.)
<1500mA
<1200mA
<2200mA
<300mA Test condition WCDMA in suspend mode WCDMA (Tx=24dBm) LTE in suspend mode LTE (16QAM) Tx=23 dBm LTE CA mode, Tx=23dBm GPS/GNSS tracking Connected standby Radio Off Estimated power range goal
(Typical)
<5mA
<800mA
<5mA
<900mA
<1100mA
<150mA
<3mA
<3mA 29 COMPANY CONFIDENTIAL 5. RF performance specifications Radio performance for T77W676.00 is given in the following sections, including RF receiver, RF transmitter. 5.1 RF maximum Tx power &RF min. Rx sensitivity specifications Table 5-1 Conducted Maximum transmit power & Min. receiver sensitivity (LTE BW: 10MHz) Notes: The below test result is for reference only, we will update the Rx sensitivity after EVT build before Feb. of 2017. Band 1 2 3 4 5 7 8 12 13 17 18 19 20 21 25 26 28 29 30 38 39 40 41 66 WCDMA 1 2 4 5(6/19) 8 3GPP Standard
(dBm) 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 23 +/-2 3GPP Standard
(dBm) 24+1.7/-3.7 24+1.7/-3.7 24+1.7/-3.7 24+1.7/-3.7 24+1.7/-3.7 MFG Spec.
(dBm) 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +2/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 23 +/-1 MFG Spec.
(dBm) 23.5+/-1 23.5+/-1 23.5+/-1 23.5+/-1 23.5+/-1 DRx
(dBm)
-97
-97
-97
-97
-100
-97
-99.5
-99
-98.5
-99
-99
-99
-98.5
-98
-97
-99
-99
-98
-96.5
-97
-98
-97
-96
-97 DRx
(dBm)
-109
-109
-109
-110
-110 PRx
(dBm)
-97.5
-98
-98.5
-97
-99
-98.5
-99.5
-99
-99
-99
-99
-99
-99
-98
-98
-99
-98.5
-98
-97
-97.5
-98
-97
-97.5
-97 PRx
(dBm)
-109
-109
-109
-110
-110 30 MIMO Combined
(dBm)
-100
-100
-100
-100
-102
-100
-102.5
-102
-101.5
-102
-102
-102
-101.5
-101
-100
-102
-101
-101
-100
-100
-100
-100
-99
-100 MIMO
(dBm)
-112
-112
-112
-113
-113 Combined 3GPP,MIMO Combined (dBm)
-95
-95
-94
-97
-95
-95
-94
-94
-94
-94
-97
-97
-94
-97
-93.5
-94.5
-95.5
-94
-97
-97
-97
-97
-96
-96.5 3GPP,MIMO Combined (dBm)
-106.7dBm
-104.7dBm
-106.7dBm
-104.7dBm
-103.7dBm GNSS tracking sensitivity Design target
(dBm)
-159 COMPANY CONFIDENTIAL Spec
(dBm)
-152 Remark:
a. It has 3dB margin at least refer to 3GPP standard. b. The typical value of LTE was measured as combine Rx sensitivity which was follow test setup of 3GPP standard (TS36.521 charter 7.2 and charter 7.3.5), the test setup is follow TS36.508 Annex A Figure A.3. c. Above table is for general application, please inform us if you have any specific requirement. RX UE under Test Splitter/
combiner RX/TX RX/TX Ior SS or 31 COMPANY CONFIDENTIAL 6. Host integration instructions Install module through golden finger. FederalCommunicationCommissionInterferenceStatement ThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothefollowingtwoconditions:(1) Thisdevicemaynotcauseharmfulinterference,and(2)thisdevicemustacceptanyinterferencereceived, includinginterferencethatmaycauseundesiredoperation. ThisequipmenthasbeentestedandfoundtocomplywiththelimitsforaClassBdigitaldevice,pursuantto Part15oftheFCCRules. These limitsaredesignedtoprovidereasonableprotectionagainstharmful interferenceinaresidentialinstallation.Thisequipmentgenerates,usesandcanradiateradiofrequency energyand,ifnotinstalledandusedinaccordancewiththeinstructions,maycauseharmfulinterferenceto radiocommunications. However, thereisnoguaranteethatinterferencewillnotoccurinaparticular installation. Ifthisequipmentdoescauseharmfulinterferencetoradioortelevisionreception,whichcan bedeterminedbyturningtheequipmentoffandon,theuserisencouragedtotrytocorrecttheinterference byoneofthefollowingmeasures:
towhichthereceiverisconnected. FCCCaution:Anychangesormodificationsnotexpresslyapprovedbythepartyresponsibleforcompliance couldvoidtheuser'sauthoritytooperatethisequipment. Thistransmittermustnotbecolocatedoroperatinginconjunctionwithanyotherantennaortransmitter. Reorientorrelocatethereceivingantenna. Increasetheseparationbetweentheequipmentandreceiver. Connecttheequipmentintoanoutletonacircuitdifferentfromthat Consultthedealeroranexperiencedradio/TVtechnicianforhelp. 32 COMPANY CONFIDENTIAL Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions:
ThisdeviceisintendedonlyforOEMintegratorsunderthefollowingconditions:
Theantennamustbeinstalledsuchthat20cmismaintainedbetweentheantennaandusers,and Thetransmittermodulemaynotbecolocatedwithanyothertransmitterorantenna. Aslongas2conditionsabovearemet,furthertransmittertestwillnotberequired.However,theOEM integratorisstillresponsiblefortestingtheirendproductforanyadditionalcompliancerequirements requiredwiththismoduleinstalled IMPORTANTNOTE:Intheeventthattheseconditionscannotbemet(forexamplecertainlaptop configurationsorcolocationwithanothertransmitter),thentheFCCauthorizationisnolongerconsidered validandtheFCCIDcannotbeusedonthefinalproduct.Inthesecircumstances,theOEMintegratorwillbe responsibleforreevaluatingtheendproduct(includingthetransmitter)andobtainingaseparateFCC authorization. EndProductLabeling Thistransmittermoduleisauthorizedonlyforuseindevicewheretheantennamaybeinstalledsuchthat20 cmmaybemaintainedbetweentheantennaandusers.Thefinalendproductmustbelabeledinavisible areawiththefollowing:ContainsFCCID:MCLT77W676.Thegrantee'sFCCIDcanbeusedonlywhenallFCC compliancerequirementsaremet. ManualInformationTotheEndUser TheOEMintegratorhastobeawarenottoprovideinformationtotheenduserregardinghowtoinstallor removethisRFmoduleintheusersmanualoftheendproductwhichintegratesthismodule. Theendusermanualshallincludeallrequiredregulatoryinformation/warningasshowinthismanual. 33 Industry Canada statement:
This device complies with ISEDs licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d ISED applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage prjudiciable, et (2) ce dispositif doit accepter tout brouillage reu, y compris un brouillage susceptible de provoquer un fonctionnement indsirable. Radiation Exposure Statement:
The product comply with the Canada portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available. Dclaration d'exposition aux radiations:
Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le Canada tablies pour un environnement non contrl. Le produit est sr pour un fonctionnement tel que dcrit dans ce manuel. La rduction aux expositions RF peut tre augmente si l'appareil peut tre conserv aussi loin que possible du corps de l'utilisateur ou que le dispositif est rgl sur la puissance de sortie la plus faible si une telle fonction est disponible. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The transmitter module may not be co-located with any other transmitter or antenna. As long as 1 condition above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 1 condition ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:
Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling The product can be kept as far as possible from the user body or set the device to lower output power if such function is available. The final end product must be labeled in a visible area with the following: Contains IC: 2878D-T77W676. Plaque signaltique du produit final L'appareil peut tre conserv aussi loin que possible du corps de l'utilisateur ou que le dispositif est rgl sur la puissance de sortie la plus faible si une telle fonction est disponible. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 2878D-T77W676". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. 2. XXXyyyLPDzzzz-x