FCC ID: MCLT77H747 NFC Module

COMPANY CONFIDENTIAL Revision Note NFC

(Near Field Communication) NXP NPC300 Module Project Name Document Rev. FOXCONN Part No. Module Rev. FRU Part No. Customer Part No. FOXCONN Label Rev NFC (NXP NPC300) Module 5.0 T77H747.10 005 01AX745 SW10K97523 00S0 Prepared by Reviewed by Bandy.Jiang Wei.Liao Approved by Chang-Fu Lin 1 COMPANY CONFIDENTIAL Revision History Revision Date Originator Comment 1.0 2016/01/28 Smile. Ming Initial release 1> Add pin 1 marking for mechanical drawing. 2> Add SM bus support in addition to I2C bus. (in page 4,5) 3> Add description of pin9 (TX_PWR_REQ) signal with active high 1.8V level output. (in page 15) 4> Change the PN of antenna connector from BM05B-ACHSS-A-GAN-ETF(LF)(SN) to BM05B-

ACHKS-A-GAN-ETF(HF) 5> Update material in shielding drawing. 6> Following the latest schematic, update the material description into BOM 7> Add Tray ID label, Carton label, Pallet label into label information 8> Update packing information 1> Update Module picture in page 18 2> Update packing information in page 23~24 3> Update vendor PN of host interface connector in page 15 1> Remove R5 from BOM. 2> Change Foxconn project name from T77H747.00 to T77H747.10 3> Change FRU part No. from 00JT548 to 01AX745. 4> Based on above change list, update module picture, BOM, label contents and packing information. 1> Change Host JST part number from ACHR-05V-

A-S to ACHR-05V-A-K(HF) in page 14 2.0 2016/04/20 Bandy.Jiang 3.0 2016/04/26 Bandy.Jiang 4.0 2016/06/24 Bandy.Jiang 5.0 2016/06/28 Bandy. Jiang T77H747.10 is made in China, Manufactured by HongFuJin Precision Industry Co., LTD Manufacture Site: ChongQing http://www.foxconn.com 2 COMPANY CONFIDENTIAL Content 1. INTRODUCTION ............................................................................................................................................................. 4 1.1 SCOPE ....................................................................................................................................................................... 4 1.2 FUNCTION .................................................................................................................................................................. 4 1.3 HARDWARE BLOCK DIAGRAM ....................................................................................................................................... 5 2. ELECTRICAL CHARACTERISTICS ............................................................................................................................. 6 2.1 OPERATING CONDITIONS .............................................................................................................................................. 6 2.1 HOST INTERFACE CHARACTERISTICS .......................................................................................................................... 7 2.2 POWER-UP SEQUENCE ................................................................................................................................................ 8 2.3 POWER-DOWN SEQUENCE ........................................................................................................................................... 9 2.4 FUNCTION TIMING CHARACTERISTICS ......................................................................................................................... 9 3. NFC CONTACTLESS STANDARD CONFORMANCE ............................................................................................ 10 3.1 FREQUENCY INTEROPERABILITY ............................................................................................................................... 10 3.2 SUPPORTED SMART CARD TYPES .............................................................................................................................. 10 3.3 CONTACTLESS INTERFACE UNIT ................................................................................................................................ 11 4. MECHANICAL ARCHITECTURE ................................................................................................................................ 12 4.1 MODULE MECHANICAL DRAWING .............................................................................................................................. 12 4.2 ANTENNA INTERFACE OF NFC MODULE .................................................................................................................... 13 4.3. HOST INTERFACE OF NFC MODULE ......................................................................................................................... 15 4.4. SHIELDING COVER OF NFC MODULE ....................................................................................................................... 18 4.5. PICTURE OF NFC MODULE ....................................................................................................................................... 18 5. PCB PATTERN OF NFC MODULE ............................................................................................................................ 19 5.1 PCB COMPONENT PLACEMENT ................................................................................................................................. 19 5.2 PCB STACK UP AND MATERIALS .............................................................................................................................. 19 6. BOM (BILL OF MATERIALS) OF NFC MODULE ..................................................................................................... 20 7. MARKING INFORMATION .......................................................................................................................................... 21 8. PACKING INFORMATION ........................................................................................................................................... 23 3 COMPANY CONFIDENTIAL 1. Introduction The T77H747.10 is an NFC module designed for integration in computer or portable equipment and consumer devices compliant with NFC standards (NFC Forum, NCI, ISO/IEC 14443 and ISO/IEC 15693) etc. This module is based on NXP NPC300 solution, which is a highly integrated transmission module for contactless communication at 13.56MHz. 1.1 Scope The NFC module RF protocols supported:

 NFCIP-1, NFCIP-2 protocol

 NFC Forum device 1.3





 FeliCa PCD mode/PICC mode

 MIFARE PCD encryption mechanism(MIFARE 1K/4K)

 MIFARE PICC mode

 NFC Forum tag (type 1/type 2/type 3/type 4/type V) ISO/IEC 14443A, ISO/IEC 14443B ISO/IEC 15693/ICODE VCD mode 1.2 Function

 NFC Features

- Reader & Writer mode

- Peer-to-Peer Communication mode

- Card emulation mode I2C-bus and SM-bus compatible for host Interface



 Windows 8 Logo Device Requirement compliant

- NFC Forum Wave1 Certification

- LLCP

- SNEP

 Windows 10 Logo system Requirement compliant

- Peer to Peer Communication over 2cm distance less than 10cm

 Modular certification

- FCC

- CE

- UL/CB

- meet other regulatory requirements (as defined by 108 countries)

(Remark: Regulatory Certification is not started at this phase)

 Support Intel Windows 7/8.x/10 platform

 RoHS and Green Compliant 4 COMPANY CONFIDENTIAL 1.3 Hardware block diagram The T77H747.10 NFC module is based on NXP NPC300 solution with includes ARM microcontroller core, EEPROM, demodulator and decoder, power management unit, host interface. This module is powered from the host (5V) and interfaces to the host with I2C -bus compatible signals, on-board 27.12 MHz XTAL. Also includes on board low profile FPC/FFC 12pin connector for host interface and 5pin WTB antenna connector for antenna interface. Form factor: 20.0mm x13.0mm x 2.1mm (typical) NFC module Host Interface: I2C and SM bus compatible interface with 12-pin FPC connector PCB: 4-layers HDI design The functional block diagram is shown as below:

5 COMPANY CONFIDENTIAL 2. Electrical Characteristics 2.1 operating conditions Absolute Maximum Rating Symbol VBAT PVDD ESD Limit Level Condition Respect to GND Respect to GND HBM CDM

--

--

--

Min.

--

--

--

--

0

-20 0 Typ. 5.0 3.3

--

--

Max 6.0 4.35

+/-1.0

+/-500

--

+25

+25 Operating Temperature Storage Temperature Storage Humidity Recommended Operating Condition Symbol VBAT PVDD PMUVCC VDD VDD(SIM) Remark: VDD for TX_PWR_REQ referred voltage, VDD(SIM) for SWIO_UICC referred voltage. Power Consumption Condition Condition Respect to GND Respect to GND Respect to GND Respect to GND Respect to GND Min. 4.5 3.0 1.62 1.65 1.62 Typ. 5.0 3.3 1.8 1.8 1.8 Typ. Min.

+70

+85

+85 Max 5.5 3.6 1.98 1.95 1.98 Max Power consumption Reader mode

(PCD active) Reader mode

(PCD standby) Peer to peer mode

(active) Peer to peer mode

(standby) Continue TX mode Hard Power Down mode

--

--

--

--

--

--

130 50 130 50 130 10

--

--

--

--

--

--

Unit V V KV V

%

Unit V V V V V Unit mA uA mA uA mA uA 6 COMPANY CONFIDENTIAL 2.1 Host interface characteristics I2C-bus Interface The I2C-bus Interface implements a slave I2C-bus interface with integrated shift register, shift timing generation and slave address recognition. I2C-bus Standard mode (100 KHz SCL), Fast mode (400 KHz SCL) and High-speed mode (3.4 MHz SCL) are supported. I2C-bus timings Here below are timings and frequency specifications. High-speed mode I2C-bus timing specification Symbol fCLK(HIF4) Conditions I2C-bus SCL; Cb<100pF Max 3.4 Unit MHz repeated time(repeated) START time for a Parameter Clock frequency on pin HIF4 Set-up START condition Hold condition LOW period of the SCL clock HIGH period of the SCL clock Date set-up time Data hold time Rise time on pin HIF3 Fall time on pin HIF3 Hysteresis voltage tSU;STA tHD;STA tLOW tHIGH tSU;DAT tHD;DAT tr(HIF3) tf(HIF3) Vhys Fast mode I2C-bus timing specification Symbol fCLK(HIF4) tSU;STA repeated time time(repeated) START for a Parameter Clock frequency on pin HIF4 Set-up START condition Hold condition LOW period of the SCL clock HIGH period of the SCL clock Date set-up time Data hold time Hysteresis voltage tHD;STA tLOW tHIGH tSU;DAT tHD;DAT Vhys Cb<100pF Cb<100pF Cb<100pF Cb<100pF Cb<100pF Cb<100pF I2C-bus SDA; Cb<100pF I2C-bus SDA; Cb<100pF Schmitt Cb<100pF trigger inputs;

Conditions I2C-bus SCL; Cb<400pF Cb<400pF Cb<400pF Cb<400pF Cb<400pF Cb<400pF Cb<400pF Schmitt Cb<400pF trigger inputs;

Min 0 160 160 160 60 10 0 10 10

-

-

-

-

-

-

80 80 0.1*VPVDD

-

Min 0 600 600 1.3 600 100 0 0.1* VPVDD Max 400

-

-

-

-

-

900

-

ns ns ns ns ns ns ns ns V Unit KHz ns ns ns ns ns ns V 7 COMPANY CONFIDENTIAL 2.2 Power-up sequence There are 2 different supplies for module which allows set up independently, therefore different power-up sequences have to be considered. 1> VBAT is set up before PVDD This is at least the case when VBAT pin is directly connected to the battery and when module VBAT is always supplied as soon the system is supplied. As VEN pin is referred to VBAT pin, VEN voltage shall go high after VBAT has been set. 2> PVDD and VBAT are set up in the same time It is at least the case when VBAT pin is connected to a PMU/regulator which also supplies PVDD. 8 2.3 Power-down sequence COMPANY CONFIDENTIAL 2.4 Function timing characteristics Reset timing Symbol tW(VEN) tboot Power-up timings Symbol Parameter VEN pulse width Boot time tt(VBAT-VEN) tt(VPVDD-VEN) tt(VBAT-VPVDD) Parameter Transition time from pin VBAT to pin VEN Transition time from pin PVDD to pin VEN Transition time from pin VBAT to pin PVDD Power-down timings Symbol tVBAT(L) Download mode timings Symbol Tt(DWL_REQ-VEN) Parameter Time VBAT LOW Parameter Transition DWL_REQ to pin VEN time from Conditions To reset Min 10

-

Typ Max

-

-

-

2.5 Unit us ms Conditions VBAT,VEN Voltage=HIGH PVDD,VEN Voltage=HIGH VBAT,PVDD Voltage=HIGH Min Typ Max Unit 0 0 0 0.5 0.5 0.5

-

-

-

ms ms ms Conditions Min 20 Typ Max

-

-

Unit ms pin Conditions DWL_REQ,VEN voltage=HIGH Min 0 Typ Max 0.5

-

Unit ms 9 3. NFC contactless standard conformance COMPANY CONFIDENTIAL 3.1 Frequency interoperability When in communication, NFC module is generating some RF frequencies. It is also sensitive to some RF signals as it is looking from data in the field. In order to avoid interference with others RF communication, it is required to tune the antenna matching for antenna board.

(Remark: The antenna matching tuning is responsible for antenna vendor) It must limit the RF frequency dispersion to 13.56MHz +/-50ppm. 3.2 Supported smart card types Card Types NFC Forum Type1 Tag NFC Forum Type2 Tag NFC Forum Type3 Tag NFC Forum Type4 Tag NFC Forum TypeV Tag ISO/IEC 14443 Type A compliance cards Mifare Classics 1K,4K Mifare DESFire Mifare Ultralight Mifare Plus

(Mifare) SmartMX ISO/IEC 14443 Type B compliance cards FeliCa general card FeliCa Edy card FeliCa Suica card FeliCa PKI Option card HID iCLASS Seos Read CSN

(Card Serial Number) Yes Yes Yes Yes Yes Read/Write application data area Yes Yes Yes Yes Yes Supported baud rates 106 kbps 106 kbps 212, 424 kbps 106 kbps 106 kbps Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 212, 424 kbps Yes (with application) 212, 424 kbps Yes (with application) 212, 424 kbps Yes (with application) 212, 424 kbps Yes (with application) 106 kbps 10 COMPANY CONFIDENTIAL 3.3 Contactless interface unit The NFC module supports various communication modes at different transfer speeds and modulation schemes. The following chapters give more detailed overview of selected communication modes. 1> Reader/Writer communication modes Generally 5 reader/writer communication modes are supported:

 PCD reader/writer for ISO/IEC 14443A/MIFARE The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.

 PCD reader/writer for ISO/IEC 14443B The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.

 PCD reader/writer for Jewel/Topaz tags The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.

 PCD reader/writer for FeliCa cards The transfer speed includes 212 kbit/s, 424 kbit/s.

 VCD reader/writer for ISO/IEC 15693/ICODE The transfer speed includes 1.65 kbit/s, 26.48 kbit/s. 2> Peer to Peer communication modes

(ISO/IEC 18092, Ecma 340 NFCIP-1 communication modes) An NFCIP-1 communication takes place between 2 devices:

 NFC initiator: generates RF field at 13.56 MHz and starts the NFCIP-1communication.

 NFC Target: responds to NFC initiator command either in a load modulation scheme in Passive communication mode or using a self-generated and self-modulated RF field for Active communication mode. The NFCIP-1 communication differentiates between Active and Passive communication modes.



Active communication mode means both the NFC initiator and the NFC target are using their own RF field to transmit data Passive communication mode means that the NFC target answers to an NFC initiator command in a load modulation scheme. The NFC initiator is active is terms of generating the RF field.



The NFC module supports the Active Target, Active Initiator, Passive Target and Passive Initiator communication modes at the transfer speeds 106 kbit/s, 212 kbit/s and 424 kbit/s. 3> Card communication modes The NFC module can be addressed as an ISO/IEC 14443A or ISO/IEC 14443B cards. This means that NFC module can generate an answer in a load modulation scheme. The transfer speed includes 106 kbit/s, 212 kbit/s and 424 kbit/s. 11 COMPANY CONFIDENTIAL 4. Mechanical Architecture 4.1 Module Mechanical Drawing Dimension (WxL): 20mm x 13mm, Module Max Thickness: 2.2mm Pin 1 12 COMPANY CONFIDENTIAL 4.2 Antenna interface of NFC module 1> Antenna connector Manufacturer: JST Manufacturer PN: BM05B-ACHKS-A-GAN-ETF(HF) Connector Type ACH connector SMT type with 1.2mm pitch Manufacture PN JST : BM05B-ACHKS-A-GAN-

ETF(HF) Size 7.8mm x 4.3mm x 1.5mm Connector 2D drawing:

Remark: Dimension Tolerance: +/-0.3mm Note I/O Refer Symbol RXP TX1 GND TX2 RXN GND GND Pin definition:

Pin 1 2 3 4 5 S1 S2 Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output Positive receiver input Antenna output1 Ground Antenna output2 Negative receiver input Ground Ground VDD VDD N/A VDD VDD N/A N/A I O G O I G G 13 2> Recommend Antenna cable design. COMPANY CONFIDENTIAL 14 COMPANY CONFIDENTIAL 4.3. Host interface of NFC module 1> Host interface connector Manufacturer: KYOCERA Manufacturer PN: 046811612000846 +

Connector Manufacture PN Size FPC/FFC connector SMT type with 0.5mm pitch KYOCERA: 046811612000846+

11.73mm x 4.79mm x 1.28mm Pin 1 Remark: The connector is bottom conduct with golden plating of FPC cable Pin Symbol 1 2 3 4 5 6 Pin Type Input Power Input Power I/O I G O VBAT PVDD I2C_SDA I2C _SCL GND IRQ Refer N/A N/A PVDD PVDD N/A PVDD 7 8 9 NFC_Presence G VEN I N/A VBAT TX_PWR_REQ O VDD PMUVCC SWIO_UICC DWL_REQ GND GND 10 11 12 S1 S2 Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output Input Power I/O I G G N/A VDD(SIM) PVDD N/A N/A Description Power supply from system (4.5V - 5.5V) Power supply to I/O (3.0V 3.6V) I2C data I2C clock Ground Interrupt from NFC module to the host (Host_Wake) Connect to ground for NFC module presence bit (Low active) Reset pin. Set the device in Hard Power Down

(External TX power supply request)

(Active high 1.8V level output) Indicates NFC busy state during NFC communication to touchpad. Power supply to UICC(1.78V~3.3V) SWP data connection to SIM Firmware download control pin Ground Ground 15 COMPANY CONFIDENTIAL 2> Pin characteristics VEN input pin characteristics Symbol Parameter VIH VIL IIH IIL Ci Pin characteristics for IRQ, and TX_PWR_REQ Symbol Parameter VOH HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current Input capacitance Conditions VEN voltage=VBAT VEN voltage=0V HIGH-level output voltage Conditions IOH<3mA IRQ and CLK_REQ pin TX_PWR_REQ pin IOL<3mA CL=12pF max High speed Low speed CL=12pF max High speed Low speed IRQ and CLK_REQ pins [1]

TX_PWR_REQ pin [1]

VOL CL tf tr LOW-level output voltage Load capacitance Fall time Rise time Rpd Pull-down resistance

[1] Activated in HPO and Monitor states. Input pin characteristics for DWL_REQ Conditions Symbol Parameter VPVDD=1.8V VIH V PVDD=1.8V VIL VIH VPVDD=3V VPVDD=3V VIL IIH IIL LOW-level input voltage HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input curent HIGH-level input voltage Min 1.1 0

-

1

-

Min

-

VPVDD -0.4 VDD-0.4 0

-

1 2 1 2 0.35 55 Min 0.65*VPVDD

-

2

-

-

1 Typ

-

-

-

-

5 Typ

-

-

-

-

-

-

-

-

-

-

-

Typ

-

-

-

-

-

-

Max VBAT 0.4 1

-

-

Max

-

VPVDD VDD 0.4 20 3.5 10 3.5 10 0.85 120 Unit V V A A pF Unit

-

V V V pF ns ns ns ns M k Max Unit

-

V 0.35*VPVDD V

-

V V 0.8 A 1

-

A tr Rise time Extra pull-down Input capacitance Pull down resistance Ci Rpd Pin characteristics for HIF3(used as I2C-bus SDA) and HIF4(used as I2C-bus SCL) Max Symbol Parameter VOL 0.4 CL tf Load capacitance Fall time LOW-level output voltage Typ

-

Min 0

-

0.85

-

0.35 10 250

-

30 5

-

-

-

Conditions IOL<3mA [1]

CL=100 pF; [1]

Rpull-up=2k; Standard and Fast mode CL=100 pF; [1]

Rpull-up=1k; High-speed mode CL=100 pF; [1]

Rpull-up=2k; Standard and Fast mode CL=100 pF; [1]

Rpull-up=1k; High-speed mode VI= VPVDD; high impedance VI=0V; high impedance 80 30 10

-

-

-

-

-

-

-

5 110 250 100 VPVDD 0.3*VPVDD 1

-

-

HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current Input capacitance VIH VIL IIH IIL Ci

[1] Only for pin HIF3(I2C-bus SDA), HIF4(I2C-bus SCL) is only used as input. 0.7 *VPVDD 0

-

-1

-

pF M Unit V pF ns ns ns ns V V A A pF 16 COMPANY CONFIDENTIAL Min 1.4 Typ

-

Max

-

Unit V 0.85 VDD(SIM)

-

0.85 VDD(SIM)

-

-

-

V V SWIO_UICC pin characteristics Symbol Parameter VOH HIGH-level output voltage VOH HIGH-level output voltage VOH HIGH-level output voltage Conditions IIH=1mA; [1]

IDD(SIM)=50mA;

VDD(SIM_PMU)=2.75V;

VDD(SIM_PMU) in class B ISIM_SWIO=1mA; [1]

IDD(SIM)=30mA;

VDD(SIM_PMU)=1.67V;

VDD(SIM_PMU) in class C IIH =1mA; [1]

IDD(SIM)=5mA;

VDD(SIM_PMU)=0V;

VDD(SIM)-VDDD 0A<IIL<20a [1]

LOW-level output voltage HIGH-level input current VOL IIH

[1] To allow for overshoot, the voltage on SWIO shall remain between -0.3V and VOHmax+0.3V during dynamic operation. 3> Recommend FPC cable 0.15VDD(SIM)

-

-

300 V A

-

-

. 17 COMPANY CONFIDENTIAL 4.4. Shielding Cover of NFC module Dimension (L x W x H): 11.69mm x 7.88mm x 1.35mm, Thickness: 0.15mm Materials: KU360S 4.5. Picture of NFC module Pin 1

(Top view) (Bottom view) 18 7. Marking Information Label information COMPANY CONFIDENTIAL 21 COMPANY CONFIDENTIAL 22 8. Packing information COMPANY CONFIDENTIAL 23 COMPANY CONFIDENTIAL 24 9. Reliability Test plan COMPANY CONFIDENTIAL No Item Test Condition Qty Criteria Result 1 test & Cross Pull Section (2pcs) Cross Section: 1pcs Pull Test: 1pcs 1. 2. 3. Visual inspection: All locations Cross BGA/Connector/PTH Hole (SMT/PIH) Pull strength: 0.4mm/0.5mm pitch QFP section:

Hole/Via 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass;

3. Cross section

- No separation

- Allowable Crack Length: Max. 25% of pad diameter 4. Pull test

- 800g for 0.4mm pitch QFP, 1kg for 0.5mm pitch QFP TBD TBD 4. Power on;

5. Temp.= -40 6. Test Period = 240hrs.

;

1.Power Off , 2.Temperature=100 3.Test period=96 Hours 4.Power on 3times 1.Power Off 2.Temperature=0 3.Test period=96 Hours 4.Power on 3times 1. Power On( apply core voltage to PCBA ) 2. Temp.= 85 3. Test period= 400 Hours

& Humi.= 85%R.H for 7.5mins for 7.5mins to -40 for 7.5mins to 85 ATC:

1.Power off 2.Ta=85 3.Ta=85 4.Ta=-40 5.Ta=-40 6.Repeat 630cycles Cross Section(both Bright & Dark):

BGA/CONNECTOR/PTH Hole/ Via Hole (SMT/PIH) for 7.5mins 1. Frequency = 5 ~ 500 ~ 5 HZ;

2. Acceleration = 2 G;

3. Sweep time: 3mins/cycle;

4. Each of x, y, z axis/ 30 min;

5. Power on and continuously ping AP/SG./Golden(AP for WLAN, SG for WWAN, Golden for BT) 6. Product need to be connected with the mating connector which used in laptop. 1. Half-Sine wave ,50G , 11msec 2. Test 3. Three shock per axes,

+/- x, y, z axes total 18 shocks. 4. Product need to be connected with the mating connector which used in laptop. 5. Detect by an electrical discontinuity monitor. 1. Frequency = 5 ~ 500 ~ 5 HZ;

2. Acceleration = 2 Grms;

3. Each of x, y, z axis/ 30 mins. 1. Sine wave ,230G , 3msec ;

2. Test

+/- x, y, z axes 1. Power off 60/95%RH for 2000hrs;

2. Room Temperature 2000hrs. 2 Low Test Temperature 3 Hot Start Test 4 Cold Start Test 5 Temperature-Humidity Bias (THB) 6 Accelerated Thermal Cycles (ATC) 7 Sine Vibration(Unpackaged

) 8 Shock Test(Unpackaged) 9 10 Sine Vibration(Packaged) Shock Test(Packaged) 11 Tin Wisker 2 Pls refer to ATC 2 1. 2. Visual Inspection Compliance with IPC-A-

610D Class 3 & 39T0261;

Function test Pass. TBD 1. Visual Inspection Compliance with IPC-A-610D 2 Class 3 & 39T0261;

2. Function test Pass. 2 Pls refer to ATC TBD TBD 2 2 2 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass;

3. Cross section ( AFTER 630 cycles )

- No separation

- Allowable Crack Length: Max. 25% of pad diameter TBD 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass;

3. No disconnect between device & AP/SG /Golden TBD during the test . 1. Visual Inspection Compliance with IPC-A-610D 2. Class 3 & 39T0261;

No electrical discontinuity is greater than 1 microsecond. TBD 1 Carton 1 Carton 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass. 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass. 10 Whisker Length <50um TBD TBD TBD 25 COMPANY CONFIDENTIAL 10. Notice Operating Temperature Conditions The product shall be capable of continuous reliable operation when operating in ambient temperature of 0C to 70C. Non-Operating Temperature Conditions Neither subassembly shall be damaged nor shall the operational performance be degraded when restored to the operating temperature when exposed to storage temperature in the range of -20C to +85C. Operating Humidity Conditions The product shall be capable of continuous reliable operation when subjected to relative humidity in the range of 0% and 85% non-condensing. Handling Environment Please make sure to avoid mechanical shock and vibration for this module. Please do not drop the module. Please do not clean the module. 26 FederalCommunicationCommissionInterferenceStatement ThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothefollowingtwo conditions:(1)Thisdevicemaynotcauseharmfulinterference,and(2)thisdevicemustacceptany interferencereceived,includinginterferencethatmaycauseundesiredoperation. ThisequipmenthasbeentestedandfoundtocomplywiththelimitsforaClassBdigitaldevice, pursuanttoPart15oftheFCCRules. Theselimitsaredesignedtoprovidereasonableprotection againstharmfulinterferenceinaresidentialinstallation.Thisequipmentgenerates,usesandcan radiateradiofrequencyenergyand,ifnotinstalledandusedinaccordancewiththeinstructions,may causeharmfulinterferencetoradiocommunications. However,thereisnoguaranteethat interferencewillnotoccurinaparticularinstallation. Ifthisequipmentdoescauseharmful interferencetoradioortelevisionreception,whichcanbedeterminedbyturningtheequipmentoff andon,theuserisencouragedtotrytocorrecttheinterferencebyoneofthefollowingmeasures:

Reorientorrelocatethereceivingantenna. Increasetheseparationbetweentheequipmentandreceiver. Connecttheequipmentintoanoutletonacircuitdifferentfromthat towhichthereceiverisconnected. Consultthedealeroranexperiencedradio/TVtechnicianforhelp. FCCCaution:Anychangesormodificationsnotexpresslyapprovedbythepartyresponsiblefor compliancecouldvoidtheuser'sauthoritytooperatethisequipment. Thistransmittermustnotbecolocatedoroperatinginconjunctionwithanyotherantennaor transmitter. RadiationExposureStatement:

ThisequipmentcomplieswithFCCradiationexposurelimitssetforthforanuncontrolledenvironment. Thisequipmentshouldbeinstalledandoperatedwithminimumdistance20cmbetweentheradiator

&yourbody. ThisdeviceisintendedonlyforOEMintegratorsunderthefollowingconditions:

Theantennamustbeinstalledsuchthat20cmismaintainedbetweentheantennaandusers,and Thetransmittermodulemaynotbecolocatedwithanyothertransmitterorantenna. Aslongas2conditionsabovearemet,furthertransmittertestwillnotberequired.However,theOEM integratorisstillresponsiblefortestingtheirendproductforanyadditionalcompliancerequirements requiredwiththismoduleinstalled IMPORTANTNOTE:Intheeventthattheseconditionscannotbemet(forexamplecertainlaptop configurationsorcolocationwithanothertransmitter),thentheFCCauthorizationisnolonger consideredvalidandtheFCCIDcannotbeusedonthefinalproduct.Inthesecircumstances,theOEM integratorwillberesponsibleforreevaluatingtheendproduct(includingthetransmitter)and obtainingaseparateFCCauthorization. EndProductLabeling Thistransmittermoduleisauthorizedonlyforuseindevicewheretheantennamaybeinstalledsuch that20cmmaybemaintainedbetweentheantennaandusers.Thefinalendproductmustbelabeled inavisibleareawiththefollowing:ContainsFCCID:MCLT77H747.Thegrantee'sFCCIDcanbeused onlywhenallFCCcompliancerequirementsaremet. ManualInformationTotheEndUser TheOEMintegratorhastobeawarenottoprovideinformationtotheenduserregardinghowto installorremovethisRFmoduleintheusersmanualoftheendproductwhichintegratesthis module. Theendusermanualshallincludeallrequiredregulatoryinformation/warningasshowinthismanual. IndustryCanadastatement:

ThisdevicecomplieswithISEDslicenceexemptRSSs.Operationissubjecttothefollowingtwo conditions:(1)Thisdevicemaynotcauseharmfulinterference,and(2)thisdevicemustacceptany interferencereceived,includinginterferencethatmaycauseundesiredoperation. LeprsentappareilestconformeauxCNRdISEDapplicablesauxappareilsradioexemptsdelicence. Lexploitationestautoriseauxdeuxconditionssuivantes:(1)ledispositifnedoitpasproduirede brouillageprjudiciable,et(2)cedispositifdoitacceptertoutbrouillagereu,ycomprisunbrouillage susceptibledeprovoquerunfonctionnementindsirable. RadiationExposureStatement:

ThisequipmentcomplieswithISEDradiationexposurelimitssetforthforanuncontrolled environment.Thisequipmentshouldbeinstalledandoperatedwithminimumdistance20cm betweentheradiator&yourbody. Dclarationd'expositionauxradiations:

Cetquipementestconformeauxlimitesd'expositionauxrayonnementsISEDtabliespourun environnementnoncontrl.Cetquipementdoittreinstalletutilisavecunminimumde20cm dedistanceentrelasourcederayonnementetvotrecorps. ThisdeviceisintendedonlyforOEMintegratorsunderthefollowingconditions:(Formoduledevice use) 1)Theantennamustbeinstalledsuchthat20cmismaintainedbetweentheantennaandusers,and 2)Thetransmittermodulemaynotbecolocatedwithanyothertransmitterorantenna. Aslongas2conditionsabovearemet,furthertransmittertestwillnotberequired.However,theOEM integratorisstillresponsiblefortestingtheirendproductforanyadditionalcompliancerequirements requiredwiththismoduleinstalled. CetappareilestconuuniquementpourlesintgrateursOEMdanslesconditionssuivantes:(Pour utilisationdedispositifmodule) 1)L'antennedoittreinstalledetellesortequ'unedistancede20cmestrespecteentrel'antenne etlesutilisateurs,et2)Lemodulemetteurpeutnepastrecomplantavecunautremetteurou antenne. Tantqueles2conditionscidessussontremplies,desessaissupplmentairessurl'metteurneseront pasncessaires.Toutefois,l'intgrateurOEMesttoujoursresponsabledesessaissursonproduitfinal pourtoutesexigencesdeconformitsupplmentairesrequispourcemoduleinstall. IMPORTANTNOTE:

Intheeventthattheseconditionscannotbemet(forexamplecertainlaptopconfigurationsor colocationwithanothertransmitter),thentheCanadaauthorizationisnolongerconsideredvalidand theICIDcannotbeusedonthefinalproduct.Inthesecircumstances,theOEMintegratorwillbe responsibleforreevaluatingtheendproduct(includingthetransmitter)andobtainingaseparate Canadaauthorization. NOTEIMPORTANTE:

Danslecasocesconditionsnepeuventtresatisfaites(parexemplepourcertainesconfigurations d'ordinateurportableoudecertainescolocalisationavecunautremetteur),l'autorisationdu Canadan'estplusconsidrcommevalideetl'IDICnepeutpastreutilissurleproduitfinal.Dans cescirconstances,l'intgrateurOEMserachargdervaluerleproduitfinal(ycomprisl'metteur)et l'obtentiond'uneautorisationdistincteauCanada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC: 2878DT77H747. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 2878DT77H747". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. This radio transmitter (IC: 2878DT77H747, Model: T77H747) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet metteur radio (IC: 2878DT77H747, Modle: T77H747) a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs cidessous avec le gain maximal admissible indiqu. types d'antennes non inclus dans cette liste, ayant un gain suprieur au gain maximum indiqu pour ce type, sont strictement interdits pour une utilisation avec cet appareil. 1. 2. XXXyyyLPDzzzzx MPE 1mW/cm2 0.97 mW/cm2

COMPANY CONFIDENTIAL Revision Note NFC

(Near Field Communication) NXP NPC300 Module Project Name Document Rev. FOXCONN Part No. Module Rev. FRU Part No. Customer Part No. FOXCONN Label Rev NFC (NXP NPC300) Module 5.0 T77H747.10 005 01AX745 SW10K97523 00S0 Prepared by Reviewed by Bandy.Jiang Wei.Liao Approved by Chang-Fu Lin 1 COMPANY CONFIDENTIAL Revision History Revision Date Originator Comment 1.0 2016/01/28 Smile. Ming Initial release 2016/04/20 Bandy.Jiang 2.0 2016/04/26 Bandy.Jiang 3.0 2016/06/24 Bandy.Jiang 4.0 5.0 2016/06/28 Bandy. Jiang 1> Add pin 1 marking for mechanical drawing. 2> Add SM bus support in addition to I2C bus. (in page 4,5) 3> Add description of pin9 (TX_PWR_REQ) signal with active high 1.8V level output. (in page 15) 4> Change the PN of antenna connector from BM05B-ACHSS-A-GAN-ETF(LF)(SN) to BM05B-

ACHKS-A-GAN-ETF(HF) 5> Update material in shielding drawing. 6> Following the latest schematic, update the material description into BOM 7> Add Tray ID label, Carton label, Pallet label into label information 8> Update packing information 1> Update Module picture in page 18 2> Update packing information in page 23~24 3> Update vendor PN of host interface connector in page 15 1> Remove R5 from BOM. 2> Change Foxconn project name from T77H747.00 to T77H747.10 3> Change FRU part No. from 00JT548 to 01AX745. 4> Based on above change list, update module picture, BOM, label contents and packing information. 1> Change Host JST part number from ACHR-05V-

A-S to ACHR-05V-A-K(HF) in page 14 T77H747.10 is made in China, Manufactured by HongFuJin Precision Industry Co., LTD Manufacture Site: ChongQing http://www.foxconn.com 2 COMPANY CONFIDENTIAL Content 1. INTRODUCTION ........................................................................................................................................................... 4 1.1 SCOPE ....................................................................................................................................................................... 4 1.2 FUNCTION.................................................................................................................................................................. 4 1.3 HARDWARE BLOCK DIAGRAM ....................................................................................................................................... 5 2. ELECTRICAL CHARACTERISTICS ........................................................................................................................... 6 2.1 OPERATING CONDITIONS .............................................................................................................................................. 6 2.1 HOST INTERFACE CHARACTERISTICS .......................................................................................................................... 7 2.2 POWER-UP SEQUENCE ................................................................................................................................................ 8 2.3 POWER-DOWN SEQUENCE ........................................................................................................................................... 9 2.4 FUNCTION TIMING CHARACTERISTICS ......................................................................................................................... 9 3. NFC CONTACTLESS STANDARD CONFORMANCE .......................................................................................... 10 3.1 FREQUENCY INTEROPERABILITY ................................................................................................................................ 10 3.2 SUPPORTED SMART CARD TYPES .............................................................................................................................. 10 3.3 CONTACTLESS INTERFACE UNIT ................................................................................................................................ 11 4. MECHANICAL ARCHITECTURE .............................................................................................................................. 12 4.1 MODULE MECHANICAL DRAWING .............................................................................................................................. 12 4.2 ANTENNA INTERFACE OF NFC MODULE .................................................................................................................... 13 4.3. HOST INTERFACE OF NFC MODULE ......................................................................................................................... 15 4.4. SHIELDING COVER OF NFC MODULE ....................................................................................................................... 18 4.5. PICTURE OF NFC MODULE ....................................................................................................................................... 18 5. PCB PATTERN OF NFC MODULE .......................................................................................................................... 19 5.1 PCB COMPONENT PLACEMENT ................................................................................................................................. 19 5.2 PCB STACK UP AND MATERIALS .............................................................................................................................. 19 6. BOM (BILL OF MATERIALS) OF NFC MODULE ................................................................................................... 20 7. MARKING INFORMATION ........................................................................................................................................ 21 8. PACKING INFORMATION ......................................................................................................................................... 23 3 COMPANY CONFIDENTIAL 1. Introduction The T77H747.10 is an NFC module designed for integration in computer or portable equipment and consumer devices compliant with NFC standards (NFC Forum, NCI, ISO/IEC 14443 and ISO/IEC 15693) etc. This module is based on NXP NPC300 solution, which is a highly integrated transmission module for contactless communication at 13.56MHz. 1.1 Scope The NFC module RF protocols supported:

NFCIP-1, NFCIP-2 protocol NFC Forum device 1.3 ISO/IEC 14443A, ISO/IEC 14443B ISO/IEC 15693/ICODE VCD mode FeliCa PCD mode/PICC mode MIFARE PCD encryption mechanism(MIFARE 1K/4K) MIFARE PICC mode NFC Forum tag (type 1/type 2/type 3/type 4/type V) 1.2 Function NFC Features

- Reader & Writer mode

- Peer-to-Peer Communication mode

- Card emulation mode I2C-bus and SM-bus compatible for host Interface Windows 8 Logo Device Requirement compliant

- NFC Forum Wave1 Certification

- LLCP

- SNEP Windows 10 Logo system Requirement compliant

- Peer to Peer Communication over 2cm distance less than 10cm Modular certification

- FCC

- CE

- UL/CB

- meet other regulatory requirements (as defined by 108 countries)

(Remark: Regulatory Certification is not started at this phase) Support Intel Windows 7/8.x/10 platform RoHS and Green Compliant 4 COMPANY CONFIDENTIAL 1.3 Hardware block diagram The T77H747.10 NFC module is based on NXP NPC300 solution with includes ARM microcontroller core, EEPROM, demodulator and decoder, power management unit, host interface. This module is powered from the host (5V) and interfaces to the host with I2C -bus compatible signals, on-board 27.12 MHz XTAL. Also includes on board low profile FPC/FFC 12pin connector for host interface and 5pin WTB antenna connector for antenna interface. Form factor: 20.0mm x13.0mm x 2.1mm (typical) NFC module Host Interface: I C and SM bus compatible interface with 12-pin FPC connector 2 PCB: 4-layers HDI design The functional block diagram is shown as below:

5 COMPANY CONFIDENTIAL 2. Electrical Characteristics 2.1 operating conditions Absolute Maximum Rating Symbol VBAT PVDD ESD Limit Level Operating Temperature Storage Temperature Storage Humidity Condition Respect to GND Respect to GND HBM CDM

--

--

--

Min.

--

--

--

--

0

-20 0 Typ. 5.0 3.3

--

--

+25

+25

--

Max 6.0 4.35

+/-1.0

+/-500

+70

+85

+85 Recommended Operating Condition Symbol VBAT PVDD PMUVCC VDD VDD(SIM) Remark: VDD for TX_PWR_REQ referred voltage, VDD(SIM) for SWIO_UICC referred voltage. Condition Respect to GND Respect to GND Respect to GND Respect to GND Respect to GND Min. 4.5 3.0 1.62 1.65 1.62 Typ. 5.0 3.3 1.8 1.8 1.8 Max 5.5 3.6 1.98 1.95 1.98 Power Consumption Condition Power consumption Reader mode

(PCD active) Reader mode

(PCD standby) Peer to peer mode

(active) Peer to peer mode

(standby) Continue TX mode Hard Power Down mode Min.

--

--

--

--

--

--

Typ. 130 50 130 50 130 10 Max

--

--

--

--

--

--

Unit V V KV V

%

Unit V V V V V Unit mA uA mA uA mA uA 6 2.1 Host interface characteristics I2C-bus Interface The I2C-bus Interface implements a slave I2C-bus interface with integrated shift register, shift timing generation and slave address recognition. COMPANY CONFIDENTIAL I2C-bus Standard mode (100 KHz SCL), Fast mode (400 KHz SCL) and High-speed mode (3.4 MHz SCL) are supported. I2C-bus timings Here below are timings and frequency specifications. High-speed mode I2C-bus timing specification Symbol fCLK(HIF4) Conditions I2C-bus SCL; C <100pF b repeated time(repeated) START time for a Parameter Clock frequency on pin HIF4 Set-up START condition Hold condition LOW period of the SCL clock HIGH period of the SCL clock Date set-up time Data hold time Rise time on pin HIF3 Fall time on pin HIF3 Hysteresis voltage tSU;STA tHD;STA tLOW tHIGH tSU;DAT tHD;DAT tr(HIF3) tf(HIF3) Vhys Fast mode I2C-bus timing specification Symbol fCLK(HIF4) tSU;STA repeated time time(repeated) START for a Parameter Clock frequency on pin HIF4 Set-up START condition Hold condition LOW period of the SCL clock HIGH period of the SCL clock Date set-up time Data hold time Hysteresis voltage tHD;STA tLOW tHIGH tSU;DAT tHD;DAT Vhys Cb<100pF Cb<100pF Cb<100pF Cb<100pF Cb<100pF Cb<100pF I2C-bus SDA; C <100pF I2C-bus SDA; C <100pF Schmitt Cb<100pF trigger b b inputs;

Conditions I2C-bus SCL; C <400pF Cb<400pF b Cb<400pF Cb<400pF Cb<400pF Cb<400pF Cb<400pF Schmitt Cb<400pF trigger inputs;

Min 0 160 160 160 60 10 0 10 10

-

-

-

-

-

-

80 80 0.1*VPVDD

-

Min 0 600 600 1.3 600 100 0 0.1* VPVDD Max 400

-

-

-

-

-

900

-

Max 3.4 Unit MHz ns ns ns ns ns ns ns ns V Unit KHz ns ns ns ns ns ns V 7 2.2 Power-up sequence COMPANY CONFIDENTIAL There are 2 different supplies for module which allows set up independently, therefore different power-up sequences have to be considered. 1> VBAT is set up before PVDD This is at least the case when VBAT pin is directly connected to the battery and when module VBAT is always supplied as soon the system is supplied. As VEN pin is referred to VBAT pin, VEN voltage shall go high after VBAT has been set. 2> PVDD and VBAT are set up in the same time It is at least the case when VBAT pin is connected to a PMU/regulator which also supplies PVDD. 8 2.3 Power-down sequence COMPANY CONFIDENTIAL 2.4 Function timing characteristics Reset timing Symbol tW(VEN) tboot Parameter VEN pulse width Boot time Power-up timings Symbol tt(VBAT-VEN) tt(VPVDD-VEN) tt(VBAT-VPVDD) Parameter Transition time from pin VBAT to pin VEN Transition time from pin PVDD to pin VEN Transition time from pin VBAT to pin PVDD Power-down timings Symbol tVBAT(L) Parameter Time VBAT LOW Conditions To reset Min 10

-

Typ Max

-

-

-

2.5 Unit us ms Conditions VBAT,VEN Voltage=HIGH PVDD,VEN Voltage=HIGH VBAT,PVDD Voltage=HIGH Min Typ Max Unit 0 0 0 0.5 0.5 0.5

-

-

-

ms ms ms Conditions Min 20 Typ Max

-

-

Unit ms Download mode timings Symbol Tt(DWL_REQ-VEN) Parameter Transition DWL_REQ to pin VEN time from pin Conditions DWL_REQ,VEN voltage=HIGH Min 0 Typ Max 0.5

-

Unit ms 9 3. NFC contactless standard conformance 3.1 Frequency interoperability COMPANY CONFIDENTIAL When in communication, NFC module is generating some RF frequencies. It is also sensitive to some RF signals as it is looking from data in the field. In order to avoid interference with others RF communication, it is required to tune the antenna matching for antenna board.

(Remark: The antenna matching tuning is responsible for antenna vendor) It must limit the RF frequency dispersion to 13.56MHz +/-50ppm. 3.2 Supported smart card types Card Types NFC Forum Type1 Tag NFC Forum Type2 Tag NFC Forum Type3 Tag NFC Forum Type4 Tag NFC Forum TypeV Tag ISO/IEC 14443 Type A compliance cards Mifare Classics 1K,4K Mifare DESFire Mifare Ultralight Mifare Plus

(Mifare) SmartMX ISO/IEC 14443 Type B compliance cards FeliCa general card FeliCa Edy card FeliCa Suica card FeliCa PKI Option card HID iCLASS Seos Read CSN

(Card Serial Number) Yes Yes Yes Yes Yes Read/Write application data area Yes Yes Yes Yes Yes Supported baud rates 106 kbps 106 kbps 212, 424 kbps 106 kbps 106 kbps Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 212, 424 kbps Yes (with application) 212, 424 kbps Yes (with application) 212, 424 kbps Yes (with application) 212, 424 kbps Yes (with application) 106 kbps 10 COMPANY CONFIDENTIAL 3.3 Contactless interface unit The NFC module supports various communication modes at different transfer speeds and modulation schemes. The following chapters give more detailed overview of selected communication modes. 1> Reader/Writer communication modes Generally 5 reader/writer communication modes are supported:

PCD reader/writer for ISO/IEC 14443A/MIFARE The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s. PCD reader/writer for ISO/IEC 14443B The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s. PCD reader/writer for Jewel/Topaz tags The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s. PCD reader/writer for FeliCa cards The transfer speed includes 212 kbit/s, 424 kbit/s. VCD reader/writer for ISO/IEC 15693/ICODE The transfer speed includes 1.65 kbit/s, 26.48 kbit/s. 2> Peer to Peer communication modes

(ISO/IEC 18092, Ecma 340 NFCIP-1 communication modes) An NFCIP-1 communication takes place between 2 devices:

NFC initiator: generates RF field at 13.56 MHz and starts the NFCIP-1communication. NFC Target: responds to NFC initiator command either in a load modulation scheme in Passive communication mode or using a self-generated and self-modulated RF field for Active communication mode. The NFCIP-1 communication differentiates between Active and Passive communication modes. Active communication mode means both the NFC initiator and the NFC target are using their own RF field to transmit data Passive communication mode means that the NFC target answers to an NFC initiator command in a load modulation scheme. The NFC initiator is active is terms of generating the RF field. The NFC module supports the Active Target, Active Initiator, Passive Target and Passive Initiator communication modes at the transfer speeds 106 kbit/s, 212 kbit/s and 424 kbit/s. 3> Card communication modes The NFC module can be addressed as an ISO/IEC 14443A or ISO/IEC 14443B cards. This means that NFC module can generate an answer in a load modulation scheme. The transfer speed includes 106 kbit/s, 212 kbit/s and 424 kbit/s. 11 COMPANY CONFIDENTIAL 4. Mechanical Architecture 4.1 Module Mechanical Drawing Dimension (WxL): 20mm x 13mm, Module Max Thickness: 2.2mm Pin 1 12 4.2 Antenna interface of NFC module 1> Antenna connector COMPANY CONFIDENTIAL Manufacturer: JST Manufacturer PN: BM05B-ACHKS-A-GAN-ETF(HF) Connector Type Manufacture PN Size ACH connector SMT type with 1.2mm pitch JST : BM05B-ACHKS-A-GAN-

ETF(HF) 7.8mm x 4.3mm x 1.5mm Connector 2D drawing:

Remark: Dimension Tolerance: +/-0.3mm I/O Refer Symbol Pin definition:

Pin 1 2 3 4 5 S1 S2 Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output Positive receiver input Antenna output1 Ground Antenna output2 Negative receiver input Ground Ground RXP TX1 GND TX2 RXN GND GND VDD VDD N/A VDD VDD N/A N/A I O G O I G G Note 13 2> Recommend Antenna cable design. COMPANY CONFIDENTIAL 14 COMPANY CONFIDENTIAL 4.3. Host interface of NFC module 1> Host interface connector Manufacturer: KYOCERA Manufacturer PN: 046811612000846 +

Connector Manufacture PN Size FPC/FFC connector SMT type with 0.5mm pitch KYOCERA: 046811612000846+

11.73mm x 4.79mm x 1.28mm Pin 1 Remark: The connector is bottom conduct with golden plating of FPC cable Pin Symbol 1 2 3 4 5 6 VBAT PVDD I2C_SDA I2C _SCL GND IRQ Pin Type Input Power Input Power I/O I G O 7 8 9 NFC_Presence G VEN I TX_PWR_REQ O Refer N/A N/A PVDD PVDD N/A PVDD N/A VBAT VDD 10 11 12 S1 S2 PMUVCC SWIO_UICC DWL_REQ GND GND Input Power I/O I G G N/A VDD(SIM) PVDD N/A N/A Description Power supply from system (4.5V - 5.5V) Power supply to I/O (3.0V 3.6V) I2C data I2C clock Ground Interrupt from NFC module to the host (Host_Wake) Connect to ground for NFC module presence bit (Low active) Reset pin. Set the device in Hard Power Down

(External TX power supply request)

(Active high 1.8V level output) Indicates NFC busy state during NFC communication to touchpad. Power supply to UICC(1.78V~3.3V) SWP data connection to SIM Firmware download control pin Ground Ground Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output 15 2> Pin characteristics COMPANY CONFIDENTIAL VEN input pin characteristics Symbol Parameter VIH VIL IIH IIL Ci HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current Input capacitance Conditions VEN voltage=VBAT VEN voltage=0V Pin characteristics for IRQ, and TX_PWR_REQ Symbol Parameter VOH HIGH-level output voltage Conditions IOH<3mA IRQ and CLK_REQ pin TX_PWR_REQ pin IOL<3mA CL=12pF max High speed Low speed CL=12pF max High speed Low speed IRQ and CLK_REQ pins TX_PWR_REQ pin [1]

[1]

VOL CL tf tr Rpd LOW-level output voltage Load capacitance Fall time Rise time Pull-down resistance

[1] Activated in HPO and Monitor states. HIGH-level input voltage Input pin characteristics for DWL_REQ Conditions Symbol Parameter VPVDD=1.8V VIH V PVDD=1.8V VIL VIH VPVDD=3V VPVDD=3V VIL IIH IIL LOW-level input voltage HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input curent Ci Rpd Input capacitance Pull down resistance Extra pull-down Min 1.1 0

-

1

-

Min

-

VPVDD -0.4 VDD-0.4 0

-

1 2 1 2 0.35 55 Typ

-

-

-

-

5 Typ

-

-

-

-

-

-

-

-

-

-

-

Min 0.65*VPVDD Typ

-

-

2

-

-

1

-

0.35

-

-

-

-

-

5

-

Max VBAT 0.4 1

-

-

Max

-

VPVDD VDD 0.4 20 3.5 10 3.5 10 0.85 120 Unit V V A A pF Unit

-

V V V pF ns ns ns ns M k Max

-

0.35*VPVDD

-

0.8 1

-

Unit V V V V A A

-

0.85 pF M Pin characteristics for HIF3(used as I2C-bus SDA) and HIF4(used as I2C-bus SCL) Max Symbol Parameter VOL 0.4 CL tf Conditions IOL<3mA Load capacitance Fall time LOW-level output voltage Typ

-

Min 0 10 250

-

30

-

-

[1]

[1]

tr Rise time

[1]

CL=100 pF;

Rpull-up=2k; Standard and Fast mode CL=100 pF;

Rpull-up=1k; High-speed mode CL=100 pF;

Rpull-up=2k; Standard and Fast mode CL=100 pF;

Rpull-up=1k; High-speed mode

[1]

[1]

80 30 10 VIH VIL IIH IIL Ci

[1] Only for pin HIF3(I2C-bus SDA), HIF4(I2C-bus SCL) is only used as input. HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current Input capacitance VI= VPVDD; high impedance VI=0V; high impedance 0.7 *VPVDD 0

-

-1

-

-

-

-

-

-

-

-

5 110 250 100 VPVDD 0.3*VPVDD 1

-

-

Unit V pF ns ns ns ns V V A A pF 16 COMPANY CONFIDENTIAL Min 1.4 Typ

-

Max

-

Unit V 0.85 VDD(SIM)

-

0.85 VDD(SIM)

-

-

-

V V SWIO_UICC pin characteristics Symbol Parameter VOH HIGH-level output voltage VOH HIGH-level output voltage VOH HIGH-level output voltage Conditions

[1]

IIH=1mA;

IDD(SIM)=50mA;

VDD(SIM_PMU)=2.75V;

VDD(SIM_PMU) in class B ISIM_SWIO=1mA; [1]

IDD(SIM)=30mA;

VDD(SIM_PMU)=1.67V;

VDD(SIM_PMU) in class C IIH =1mA;

IDD(SIM)=5mA;

VDD(SIM_PMU)=0V;

VDD(SIM)-VDDD 0A<IIL<20a [1]

[1]

VOL IIH

[1] To allow for overshoot, the voltage on SWIO shall remain between -0.3V and V LOW-level output voltage HIGH-level input current

-

-

-

300 0.15VDD(SIM)

-

V A

+0.3V during dynamic OHmax operation. 3> Recommend FPC cable

. 17 COMPANY CONFIDENTIAL 4.4. Shielding Cover of NFC module Dimension (L x W x H): 11.69mm x 7.88mm x 1.35mm, Thickness: 0.15mm Materials: KU360S 4.5. Picture of NFC module Pin 1

(Top view)

(Bottom view) 18 7. Marking Information Label information COMPANY CONFIDENTIAL 21 COMPANY CONFIDENTIAL 22 8. Packing information COMPANY CONFIDENTIAL 23 COMPANY CONFIDENTIAL 24 9. Reliability Test plan COMPANY CONFIDENTIAL 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass;

3. Cross section

- No separation

- Allowable Crack Length: Max. 25% of pad diameter 4. Pull test

- 800g for 0.4mm pitch QFP, 1kg for 0.5mm pitch QFP Pls refer to ATC Visual Inspection Compliance with IPC-A-

610D Class 3 & 39T0261;

Function test Pass. 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass. Pls refer to ATC 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass;

3. Cross section ( AFTER 630 cycles )

- No separation

- Allowable Crack Length: Max. 25% of pad diameter 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass;

3. No disconnect between device & AP/SG /Golden during the test . No 1 2 3 4 5 6 7 8 9 10 Item Pull test & Cross Section (2pcs) Cross Section: 1pcs Pull Test: 1pcs Low Test Temperature Hot Start Test Cold Start Test Temperature-Humidity Bias (THB) Accelerated Thermal Cycles (ATC) Sine Vibration(Unpackaged

) Shock Test(Unpackaged) Sine Vibration(Packaged) Shock Test(Packaged) 11 Tin Wisker Test Condition 1. 2. 3. 4. Power on;

5. Temp.= -40 ;

6. Test Period = 240hrs. 1.Power Off 2.Temperature=0 3.Test period=96 Hours 4.Power on 3times 1.Power Off , 2.Temperature=100 3.Test period=96 Hours 4.Power on 3times 1. Power On( apply core voltage to PCBA ) 2. Temp.= 85 & Humi.= 85%R.H 3. Test period= 400 Hours 2 2 2 2 2. 1. Qty Criteria section:

Hole/Via Visual inspection: All locations Cross BGA/Connector/PTH Hole (SMT/PIH) Pull strength: 0.4mm/0.5mm pitch QFP 1 Carton 1 Carton 2 2 2 ATC:

1. Power off 2. Ta=85 for 7.5mins 3.Ta=85 to -40 for 7.5mins 4.Ta=-40 for 7.5mins 5.Ta=-40 to 85 for 7.5mins 6.Repeat 630cycles Cross Section(both Bright & Dark):

BGA/CONNECTOR/PTH Hole/ Via Hole (SMT/PIH) uency = 5 ~ 500 ~ 5 HZ;

1. Freq 2. Acceleration = 2 G;

3. Sweep time: 3mins/cycle;

4. Each of x, y, z axis/ 30 min;

5. Power on and continuously ping AP/SG./Golden(AP for WLAN, SG for WWAN, Golden for BT) 6. Product need to be connected with the mating connector which used in laptop. 4. Product need to be connected with the mating connector which used in laptop. 5. Detect by an electrical discontinuity 1. Half-Sine wave ,50G , 11msec 2. Test +/- x, y, z axes 3. Three shock per axes, total 18 1. Frequency = 5 ~ 500 ~ 5 HZ;

2. Acceleration = 2 Grms;

3. Each of x, y, z axis/ 30 mins. 1. Sine wave ,230G , 3msec ;

2. Test +/- x, y, z axes monitor. shocks. 1. Power off 60/95%RH for 2000hrs;

2. Room Temperature 2000hrs. 1. Visual Inspection Compliance with IPC-A-610D 2. No electrical discontinuity is greater than 1 Class 3 & 39T0261;

microsecond. 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass. 1. Visual Inspection Compliance with IPC-A-610D Class 3 & 39T0261;

2. Function test Pass. 10 Whisker Length <50um Result TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 25 10. Notice Operating Temperature Conditions COMPANY CONFIDENTIAL The product shall be capable of continuous reliable operation when operating in ambient temperature of 0C to 70C. Non-Operating Temperature Conditions Neither subassembly shall be damaged nor shall the operational performance be degraded when restored to the operating temperature when exposed to storage temperature in the range of -20C to +85C. Operating Humidity Conditions The product shall be capable of continuous reliable operation when subjected to relative humidity in the range of 0% and 85% non-condensing. Handling Environment Please make sure to avoid mechanical shock and vibration for this module. Please do not drop the module. Please do not clean the module. 26 Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be colocated or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator

& your body. This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20 cm is maintained between the antenna and users, and The transmitter module may not be colocated with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their endproduct for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID:MCLT77H747. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Industry Canada statement:

This device complies with ISEDs licenceexempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d ISED applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage prjudiciable, et (2) ce dispositif doit accepter tout brouillage reu, y compris un brouillage susceptible de provoquer un fonctionnement indsirable. Radiation Exposure Statement:

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be colocated with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their endproduct for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions cidessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines colocalisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC: 2878D-T77H747. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 2878D-T77H747". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. This radio transmitter (IC: 2878D-T77H747, Model: T77H747) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet metteur radio (IC: 2878D-T77H747, Modle: T77H747) a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs ci-dessous avec le gain maximal admissible indiqu. types d'antennes non inclus dans cette liste, ayant un gain suprieur au gain maximum indiqu pour ce type, sont strictement interdits pour une utilisation avec cet appareil. DETACHABLE ANTENNA USAGE This radio transmitter (IC: 2878DT-77H747 / Model: T77H747) has been approved by ISED to operate with This radio transmitter (IC: 2878DT77H747 / Model: T77H747) has been approved by ISED to operate with the the antenna type listed below with maximum permissible gain indicated. Antenna types not included in this antenna type listed below with maximum permissible gain indicated. Antenna types not included in this list, list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this this device. device. Le prsent metteur radio (IC: 2878D-T77H747 / Model: T77H747) a t approuv par ISED pour fonctionner Le prsent metteur radio (IC: 2878DT77H747 / Model: T77H747) a t approuv par ISED pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal. Les types d'antenne non avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur. inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur.

1. 2. XXXyyyLPDzzzzx MPE 1mW/cm2 0.97 mW/cm2

COMPANY CONFIDENTIAL NFC

(Near Field Communication) NXP NPC300 Module Project Name Document Rev. FOXCONN Part No. Module Rev. FRU Part No. Customer Part No. FOXCONN Label Rev NFC (NXP NPC300) Module 5.0 T77H747.10 005 01AX745 SW10K97523 00S0 Prepared by Bandy.Jiang Reviewed by Wei.Liao Approved by Chang-Fu Lin 1 COMPANY CONFIDENTIAL Revision History Revision 1.0 Date Originator 2016/01/28 Smile. Ming Initial release Comment 1> Add pin 1 marking for mechanical drawing. 2> Add SM bus support in addition to I2C bus. (in page 4,5) 3> Add description of pin9 (TX_PWR_REQ) signal with active high 1.8V level output. (in page 15) 4> Change the PN of antenna connector from BM05B-ACHSS-A-GAN-ETF(LF)(SN) to BM05B-

ACHKS-A-GAN-ETF(HF) 5> Update material in shielding drawing. 6> Following the latest schematic, update the material description into BOM 7> Add Tray ID label, Carton label, Pallet label into label information 8> Update packing information 1> Update Module picture in page 18 2> Update packing information in page 23~24 3> Update vendor PN of host interface connector in page 15 1> Remove R5 from BOM. 2> Change Foxconn project name from T77H747.00 to T77H747.10 3> Change FRU part No. from 00JT548 to 01AX745. 4> Based on above change list, update module picture, BOM, label contents and packing information. 1> Change Host JST part number from ACHR-05V-

A-S to ACHR-05V-A-K(HF) in page 14 2.0 2016/04/20 Bandy.Jiang 3.0 2016/04/26 Bandy.Jiang 4.0 2016/06/24 Bandy.Jiang 5.0 2016/06/28 Bandy. Jiang T77H747.10 is made in China, Manufactured by HongFuJin Precision Industry Co., LTD Manufacture Site: ChongQing http://www.foxconn.com 2 COMPANY CONFIDENTIAL Content 1. INTRODUCTION.................................................................................................................................................................... 4 1.1 SCOPE................................................................................................................................................................................ 4 1.2 FUNCTION .......................................................................................................................................................................... 4 1.3 HA RDWARE BLOCK DIAGRAM .............................................................................................................................................. 5 2. ELECTRICAL CHARACTERISTICS ................................................................................................................................. 6 2.1 OPERA TING CONDITIONS ..................................................................................................................................................... 6 2.1 HOS T INTE RFA CE CHARA CTERIS TICS................................................................................................................................. 7 2.2 POWER-UP SEQUENCE ........................................................................................................................................................ 8 2.3 POWER-DOWN SEQUE NCE .................................................................................................................................................. 9 2.4 FUNCTION TIMING CHARA CTE RIS TICS ................................................................................................................................ 9 3. NFC CONTACTLESS STANDARD CONFORMANCE ...............................................................................................10 3.1 FREQUENCY INTEROPERABILITY ......................................................................................................................................10 3.2 SUPPORTED SMART CARD TYPES.....................................................................................................................................10 3.3 CONTA CTLESS INTE RFACE UNIT .......................................................................................................................................11 4. MECHANICAL ARCHITECTURE .....................................................................................................................................12 4.1 MODULE ME CHANICA L DRAWING.....................................................................................................................................12 4.2 ANTENNA INTE RFACE OF NFC MODULE ..........................................................................................................................13 4.3. HOS T INTE RFA CE OF NFC MODULE................................................................................................................................15 4.4. SHIE LDING COVE R OF NFC MODULE..............................................................................................................................18 4.5. PICTURE OF NFC MODULE ..............................................................................................................................................18 5. PCB PATTERN OF NFC MODULE .................................................................................................................................19 5.1 PCB COMPONENT P LACEME NT ........................................................................................................................................19 5.2 PCB STA CK UP AND MA TERIALS .....................................................................................................................................19 6. BOM (BILL OF MATERIALS) OF NFC MODULE.........................................................................................................20 7. MARKING INFORMATION ................................................................................................................................................21 8. PACKING INFORMATION .................................................................................................................................................23 3 COMPANY CONFIDENTIAL 1. Introduction The T77H747.10 is an NFC module designed for integration in computer or portable equipment and consumer devices compliant with NFC standards (NFC Forum, NCI, ISO/IEC 14443 and ISO/IEC 15693) etc. This module is based on NXP NPC300 solution, which is a highly integrated transmission module for contactless communication at 13.56MHz. 1.1 Scope The NFC module RF protocols supported:

NFCIP-1, NFCIP-2 protocol NFC Forum device 1.3 ISO/IEC 14443A, ISO/IEC 14443B ISO/IEC 15693/ICODE VCD mode FeliCa PCD mode/PICC mode MIFARE PCD encryption mechanism(MIFARE 1K/4K) MIFARE PICC mode NFC Forum tag (type 1/type 2/type 3/type 4/type V) 1.2 Function NFC Features

- Reader & Writer mode

- Peer-to-Peer Communication mode

- Card emulation mode I2C-bus and SM-bus compatible for host Interface Windows 8 Logo Device Requirement compliant

- NFC Forum Wave1 Certification

- LLCP

- SNEP Windows 10 Logo system Requirement compliant

- Peer to Peer Communication over 2cm distance less than 10cm Modular certification

- FCC

- CE

- UL/CB

- meet other regulatory requirements (as defined by 108 countries)

(Remark: Regulatory Certification is not started at this phase) Support Intel Windows 7/8.x/10 platform RoHS and Green Compliant 4 COMPANY CONFIDENTIAL 1.3 Hardware block diagram The T77H747.10 NFC module is based on NXP NPC300 solution with includes ARM microcontroller core, EEPROM, demodulator and decoder, power management unit, host interface. This module is powered from the host (5V) and interfaces to the host with I2C -bus compatible signals, on-board 27.12 MHz XTAL. Also includes on board low profile FPC/FFC 12pin connector for host interface and 5pin WTB antenna connector for antenna interface. Form factor: 20.0mm x13.0mm x 2.1mm (typical) NFC module Host Interface: I C and SM bus compatible interface with 12-pin FPC connector 2 PCB: 4-layers HDI design The functional block diagram is shown as below:

5 COMPANY CONFIDENTIAL 2. Electrical Characteristics 2.1 operating conditions Absolute Maximum Rating Symbol VBAT PVDD ESD Limit Level Operating Temperature Storage Temperature Storage Humidity Condition Respect to GND Respect to GND HBM CDM

Min.

0

-20 0 Typ. 5.0 3.3

+25

+25

Max 6.0 4.35

+/-1.0

+/-500

+70

+85

+85 Recommended Operating Condition Symbol VBAT PVDD PMUVCC VDD VDD(SIM) Remark: VDD for TX_PWR_REQ referred voltage, VDD(SIM) for SWIO_UICC referred voltage. Condition Respect to GND Respect to GND Respect to GND Respect to GND Respect to GND Typ. 5.0 3.3 1.8 1.8 1.8 Min. 4.5 3.0 1.62 1.65 1.62 Max 5.5 3.6 1.98 1.95 1.98 Power Consumption Condition Power consumption Reader mode

(PCD active) Reader mode

(PCD standby) Peer to peer mode

(active) Peer to peer mode

(standby) Continue TX mode Hard Power Down mode Min.

Typ. 130 50 130 50 130 10 Max

Unit V V KV V

Unit V V V V V Unit mA uA mA uA mA uA 6 COMPANY CONFIDENTIAL 2.1 Host interface characteristics I2C-bus Interface The I2C-bus Interface implements a slave I2C-bus interface with integrated shift register, shift timing generation and slave address recognition. I2C-bus Standard mode (100 KHz SCL), Fast mode (400 KHz SCL) and High-speed mode (3.4 MHz SCL) are supported. I2C-bus timings Here below are timings and frequency specifications. High-speed mode I2C-bus timing specification Symbol fCLK(HIF4) Conditions I2C-bus SCL; C <100pF b Max 3.4 Unit MHz repeated time(repeated) START time for a Parameter Clock frequency on pin HIF4 Set-up START condition Hold condition LOW period of the SCL clock HIGH period of the SCL clock Date set-up time Data hold time Rise time on pin HIF3 Fall time on pin HIF3 Hysteresis voltage tSU;STA tHD;STA tLOW tHIGH tSU;DAT tHD;DAT tr(HIF3) tf(HIF3) Vhys Fast mode I2C-bus timing specification Symbol fCLK(HIF4) tSU;STA repeated time(repeated) START time for a Parameter Clock frequency on pin HIF4 Set-up START condition Hold condition LOW period of the SCL clock HIGH period of the SCL clock Date set-up time Data hold time Hysteresis voltage tHD;STA tLOW tHIGH tSU;DAT tHD;DAT Vhys Cb<100pF Cb<100pF Cb<100pF Cb<100pF Cb<100pF Cb<100pF I2C-bus SDA; C <100pF I2C-bus SDA; C <100pF Schmitt Cb<100pF trigger b b inputs;

Conditions I2C-bus SCL; C <400pF Cb<400pF b Cb<400pF Cb<400pF Cb<400pF Cb<400pF Cb<400pF Schmitt Cb<400pF trigger inputs;

Min 0 160 160 160 60 10 0 10 10

80 80 0.1*VPVDD

Min 0 600 600 1.3 600 100 0 0.1* VPVDD Max 400

900

ns ns ns ns ns ns ns ns V Unit KHz ns ns ns ns ns ns V 7 2.2 Power-up sequence COMPANY CONFIDENTIAL There are 2 different supplies for module which allows set up independently, therefore different power-up sequences have to be considered. 1> VBAT is set up before PVDD This is at least the case when VBAT pin is directly connected to the battery and when module VBAT is always supplied as soon the system is supplied. As VEN pin is referred to VBAT pin, VEN voltage shall go high after VBAT has been set. 2> PVDD and VBAT are set up in the same time It is at least the case when VBAT pin is connected to a PMU/regulator which also supplies PVDD. 8 2.3 Power-down sequence COMPANY CONFIDENTIAL 2.4 Function timing characteristics Reset timing Symbol tW(VEN) tboot Power-up timings Symbol tt(VBA T -V E N) tt(VPV D D-V E N) tt(VBA T -V P V D D) Parameter VEN pulse width Boot time Conditions To reset Min 10

Typ Max

2.5 Unit us ms Parameter Transition time from pin VBAT to pin VEN Transition time from pin PVDD to pin VEN Transition time from pin VBAT to pin PVDD Conditions VBAT,VEN Voltage=HIGH PVDD,VEN Voltage=HIGH VBAT,PVDD Voltage=HIGH Min Typ Max Unit 0 0 0 0.5 0.5 0.5

ms ms ms Power-down timings Symbol tVBAT(L) Parameter Time VBAT LOW Conditions Min 20 Typ Max

Unit ms Download mode timings Symbol Tt(DWL_REQ-VEN) Parameter Transition DWL_REQ to pin VEN time from pin Conditions DWL_REQ,VEN voltage=HIGH Min 0 Typ Max 0.5

Unit ms 9 3. NFC contactless standard conformance 3.1 Frequency interoperability COMPANY CONFIDENTIAL When in communication, NFC module is generating some RF frequencies. It is also sensitive to some RF signals as it is looking from data in the field. In order to avoid interference with others RF communication, it is required to tune the antenna matching for antenna board.

(Remark: The antenna matching tuning is responsible for antenna vendor) It must limit the RF frequency dispersion to 13.56MHz +/-50ppm. 3.2 Supported smart card types Card Types NFC Forum Type1 Tag NFC Forum Type2 Tag NFC Forum Type3 Tag NFC Forum Type4 Tag NFC Forum TypeV Tag ISO/IEC 14443 compliance cards Mifare Classics 1K,4K Type A Mifare DESFire Mifare Ultralight Mifare Plus

(Mifare) SmartMX ISO/IEC 14443 compliance cards FeliCa general card FeliCa Edy card FeliCa Suica card Type B FeliCa PKI Option card HID iCLASS Seos Read CSN

(Card Serial Number) Yes Yes Yes Yes Yes Read/Write application data area Yes Yes Yes Yes Yes Supported baud rates 106 kbps 106 kbps 212, 424 kbps 106 kbps 106 kbps Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 106 kbps Yes (with application) 212, 424 kbps Yes (with application) 212, 424 kbps Yes (with application) 212, 424 kbps Yes (with application) 212, 424 kbps Yes (with application) 106 kbps 10 COMPANY CONFIDENTIAL 3.3 Contactless interface unit The NFC module supports various communication modes at different transfer speeds and modulation schemes. The following chapters give more detailed overview of selected communication modes. 1> Reader/Writer communication modes Generally 5 reader/writer communication modes are supported:

PCD reader/writer for ISO/IEC 14443A/MIFARE The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s. PCD reader/writer for ISO/IEC 14443B The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s. PCD reader/writer for Jewel/Topaz tags The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s. PCD reader/writer for FeliCa cards The transfer speed includes 212 kbit/s, 424 kbit/s. VCD reader/writer for ISO/IEC 15693/ICODE The transfer speed includes 1.65 kbit/s, 26.48 kbit/s. 2> Peer to Peer communication modes

(ISO/IEC 18092, Ecma 340 NFCIP-1 communication modes) An NFCIP-1 communication takes place between 2 devices:

NFC initiator: generates RF field at 13.56 MHz and starts the NFCIP-1communication. NFC Target: responds to NFC initiator command either in a load modulation scheme in Passive communication mode or using a self-generated and self-modulated RF field for Active communication mode. The NFCIP-1 communication differentiates between Active and Passive communication modes. Active communication mode means both the NFC initiator and the NFC target are using their own RF field to transmit data Passive communication mode means that the NFC target answers to an NFC initiator command in a load modulation scheme. The NFC initiator is active is terms of generating the RF field. The NFC module supports the Active Target, Active Initiator, Passive Target and Passive Initiator communication modes at the transfer speeds 106 kbit/s, 212 kbit/s and 424 kbit/s. 3> Card communication modes The NFC module can be addressed as an ISO/IEC 14443A or ISO/IEC 14443B cards. This means that NFC module can generate an answer in a load modulation scheme. The transfer speed includes 106 kbit/s, 212 kbit/s and 424 kbit/s. 11 COMPANY CONFIDENTIAL 4. Mechanical Architecture 4.1 Module Mechanical Drawing Dimension (WxL): 20mm x 13mm, Module Max Thickness: 2.2mm Pin 1 12 4.2 Antenna interface of NFC module 1> Antenna connector COMPANY CONFIDENTIAL Manufacturer: JST Manufacturer PN: BM05B-ACHKS-A-GAN-ETF(HF) Connector Type ACH connector SMT type with 1.2mm pitch Manufacture PN JST : BM05B-ACHKS-A-GAN-

ETF(HF) Size 7.8mm x 4.3mm x 1.5mm Connector 2D drawing:

Remark: Dimension Tolerance: +/-0.3mm Refer Pin definition:

Pin 1 2 3 4 5 S1 S2 Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output Positive receiver input Antenna output1 Ground Antenna output2 Negative receiver input Ground Ground Symbol RXP TX1 GND TX2 RXN GND GND VDD VDD N/A VDD VDD N/A N/A I/O I O G O I G G Note 13 2> Recommend Antenna cable design. COMPANY CONFIDENTIAL 14 COMPANY CONFIDENTIAL 4.3. Host interface of NFC module 1> Host interface connector Manufacturer: KYOCERA Manufacturer PN: 046811612000846 +

Connector FPC/FFC connector SMT type with 0.5mm pitch Manufacture PN Size KYOCERA: 046811612000846+

11.73mm x 4.79mm x 1.28mm Remark: The connector is bottom conduct with golden plating of FPC cable Pin Symbol 1 2 3 4 5 6 VBAT PVDD I2C_SDA I2C _SCL GND IRQ Pin Type Input Power Input Power I/O I G O NFC_Presence G VEN I Refer N/A N/A PVDD PVDD N/A PVDD N/A VBAT TX_PWR_REQ O VDD PMUVCC SWIO_UICC DWL_REQ GND GND Input Power I/O I G G N/A VDD(SIM) PVDD N/A N/A 7 8 9 10 11 12 S1 S2 Description Power supply from system (4.5V - 5.5V) Power supply to I/O (3.0V 3.6V) I2C data I2C clock Ground Interrupt from NFC module to the host (Host_Wake) Connect to ground for NFC module presence bit (Low active) Reset pin. Set the device in Hard Power Down

(External TX power supply request)

(Active high 1.8V level output) Indicates NFC busy state during NFC communication to touchpad. Power supply to UICC(1.78V~3.3V) SWP data connection to SIM Firmware download control pin Ground Ground Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output 15 2> Pin characteristics COMPANY CONFIDENTIAL VEN input pin characteristics Symbol Parameter VIH VIL IIH IIL Ci HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current Input capacitance Conditions VEN voltage=VBAT VEN voltage=0V Pin characteristics for IRQ, and TX_PWR_REQ Symbol Parameter VOH HIGH-level output voltage Conditions IOH<3mA IRQ and CLK_REQ pin TX_PW R_REQ pin IOL<3mA CL=12pF max High speed Low speed CL=12pF max High speed Low speed IRQ and CLK_REQ pins TX_PW R_REQ pin [1]

VOL CL tf tr Rpd LOW-level output voltage Load capacitance Fall time Rise time Pull-down resistance

[1] Activated in HPO and Monitor states. HIGH-level input voltage Input pin characteristics for DWL_REQ Conditions Symbol Parameter VPVDD=1.8V VIH V PVDD=1.8V VIL VIH VPVDD=3V VPVDD=3V VIL IIH IIL LOW-level input voltage HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input curent Ci Rpd Input capacitance Pull down resistance Extra pull-down Min 1.1 0

1

Min

VPVDD -0.4 VDD-0.4 0

1 2 1 2 0.35 55 Typ

5 Typ

Max VBAT 0.4 1

Max

VPVDD VDD 0.4 20 3.5 10 3.5 10 0.85 120 Unit V V A A pF Unit

V V V pF ns ns ns ns M k Min 0.65*VPVDD Typ

2

1

0.35

5

Max

0.35*VPVDD

0.8 1

Unit V V V V A A

0.85 pF M

[1]

Pin characteristics for HIF3(used as I2C-bus SDA) and HIF4(used as I2C-bus SCL) Max Symbol Parameter VOL 0.4 CL 10 tf 250 LOW-level output voltage Load capacitance Fall time Conditions IOL<3mA Typ

Min 0

30

[1]

[1]

tr Rise time

[1]

CL=100 pF;

Rpull-up=2k; Standard and Fast mode CL=100 pF;

Rpull-up=1k; High-speed mode

[1]

CL=100 pF;

Rpull-up=2k; Standard and Fast mode CL=100 pF;

Rpull-up=1k; High-speed mode

[1]

80 30 10 VIH VIL IIH IIL Ci

[1] Only for pin HIF3(I2C-bus SDA), HIF4(I2C-bus SCL) is only used as input. HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current Input capacitance VI= VPVDD; high impedance VI=0V; high impedance 0.7 *VPVDD 0

-1

5 110 250 100 VPVDD 0.3*VPVDD 1

Unit V pF ns ns ns ns V V A A pF 16 COMPANY CONFIDENTIAL

[1]

VOH SWIO_UICC pin characteristics Parameter Symbol VOH HIGH-level output voltage Min 1.4 HIGH-level output voltage Conditions IIH=1mA;

IDD(SIM)=50mA;

VDD(SIM_PMU)=2.75V;

VDD(SIM_PMU) in class B ISIM_SWIO=1mA; [1]

IDD(SIM)=30mA;

VDD(SIM_PMU)=1.67V;

VDD(SIM_PMU) in class C IIH =1mA;

IDD(SIM)=5mA;

VDD(SIM_PMU)=0V;

VDD(SIM)-VDDD 0A<IIL<20a [1]

VOL IIH

[1] To allow for overshoot, the voltage on SWIO shall remain between -0.3V and V LOW-level output voltage HIGH-level input current HIGH-level output voltage 0.85 VDD(SIM) 0.85 VDD(SIM) VOH

[1]

Typ

Max

Unit V

300

V V 0.15VDD(SIM)

V A

+0.3V during dynamic operation. OHmax 3> Recommend FPC cable

. 17 COMPANY CONFIDENTIAL 4.4. Shielding Cover of NFC module Dimension (L x W x H): 11.69mm x 7.88mm x 1.35mm, Thickness: 0.15mm Materials: KU360S 4.5. Picture of NFC module Pin 1

(Top view)

(Bottom view) 18 7. Marking Information Label information COMPANY CONFIDENTIAL 21 COMPANY CONFIDENTIAL 22 8. Packing information COMPANY CONFIDENTIAL 23 COMPANY CONFIDENTIAL 24 9. Reliability Test plan COMPANY CONFIDENTIAL No Item Test Conditio n Pull test & Cross Section (2pcs ) Cross Section: 1pcs Pull Test: 1pcs 1. 2. 3. Visual inspect ion: All locations Cross BGA/ C on nect o r/ PTH Hole (SMT/ PI H) Pull strengt h: 0.4mm/ 0. 5m m pitch QFP Qty Criteria section:

Hole/ Via 2. 1. 2 2 Pls refer to ATC 1. Visual Inspectio n Complian c e with IPC-A-6 10 D Class 3 & 39T026 1;

2. Functio n test Pass;

3. Cross section

- No separat ion

- Allowa ble Crack Lengt h: Max. 25% of pad diamet er 4. Pull test

- 800g for 0.4mm pitch QFP, 1kg for 0.5mm pitch QFP Visual Inspect ion Complianc e with IPC-A-

610D Class 3 & 39T0261;

Functio n test Pass. 1. Visual Inspect ion Complian c e with IPC-A-6 10 D Class 3 & 39T026 1;

2. Functio n test Pass. Pls refer to ATC 1. Visual Inspect ion Complian ce with IPC-A-6 10 D Class 3 & 39T026 1;

2. Functio n test Pass;

3. Cross section ( AFTER 630 cycles )

- No separat ion

- Allowa ble Crack Lengt h: Max. 25% of pad diamet er 4. Power on;

5. Temp. = -40 ;

6. Test Period = 240hrs. 1.Power Off , 2.Temperat ure= 1 00 3.Test period= 96 Hours 4.Power on 3times 1.Power Off 2.Temperat ure= 0 3.Test period= 96 Hours 4.Power on 3times 1. Power On( apply core voltage to PCBA ) 2. Temp. = 85 & Humi. = 85%R. H 3. Test period= 400 Hours ATC:

1. Power off 2. Ta=85 for 7.5mins 3.Ta=85 to -40 for 7.5mins 4.Ta=-40 for 7.5mins 5.Ta=-40 to 85 for 7.5mins 6.Repeat 630cycles Cross Section (bot h Bright & Dark):

BGA/ C O NNE CTO R/ P TH Hole/ Via Hole (SMT/ PI H) uen cy = 5 ~ 500 ~ 5 HZ;

1. Freq 2. Accelerat ion = 2 G;

3. Sweep time: 3mins/ cy cle;

4. Each of x, y, z axis/ 30 min;

5. Power on and continu ous ly ping AP/SG./ G old en(A P for WLAN, SG for WWAN, Golden for BT) 6. Product need to be connect ed wit h the mating connect or which used in laptop. 1. Half-Sin e wave ,50G , 11msec 2. Test +/- x, y, z axes 3. Three shock per axes, total 18 shock s. 4. Product need to be connect ed wit h the mating connect or which used in laptop. 2 2 2 2 2 1. Visual Inspect ion Complian ce with IPC-A-6 10 D Class 3 & 39T026 1;

2. Functio n test Pass;

3. No discon nect between device & AP/SG /Golde n TBD during the test . Low Test Tempe rat u re Hot Start Test Cold Start Test Tempe rat ure -Hum idit y Bias (THB) Accelerat ed Thermal Cycles (ATC) Sine Vibrat ion(Un pac ka ged

) Shock Test(Un pa ck a ged ) 1. Visual Inspect ion Complian ce with IPC-A-6 10 D Class 3 & 39T026 1;

2. No electric al discont inuit y is great er than 1 microsecon d. 5. Detect by an electric al discont in u i t y monit or. Sine Vibrat ion(P ack ag ed) 1. Frequen c y = 5 ~ 500 ~ 5 HZ;

2. Accelerat ion = 2 Grms;

3. Each of x, y, z axis/ 30 mins. Shock Test(Pac kag ed) 1. Sine wave ,230G , 3msec ;

2. Test +/- x, y, z axes 1 Carton 1 Carton 1. Visual Inspect ion Complian ce with IPC-A-6 10 D Class 3 & 39T026 1;

2. Functio n test Pass. 1. Visual Inspect ion Complian ce with IPC-A-6 10D Class 3 & 39T026 1;

2. Functio n test Pass. Tin Wisker 1. Power off 60/95% RH for 2000hrs;

2. Room Tempe rat u re 2000hrs. 10 Whisker Lengt h <50um 1 2 3 4 5 6 7 8 9 10 11 Result TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 25 COMPANY CONFIDENTIAL 26 10. Notice Operating Temperature Conditions COMPANY CONFIDENTIAL The product shall be capable of continuous reliable operation when operating in ambient temperature of 0C to 70C. Non-Operating Temperature Conditions Neither subassembly shall be damaged nor shall the operational performance be degraded the when restored to the operating temperature when exposed to storage temperature in range of -20C to +85C. Operating Humidity Conditions The product shall be capable of continuous reliable operation when subjected to relative humidity in the range of 0% and 85% non-condensing. Handling Environment Please make sure to avoid mechanical shock and vibration for this module. Please do not drop the module. Please do not clean the module. 27 Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be colocated or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator

& your body. Radiation Exposure Statement:

The product complies with the FCC portable RF exposure limit set forth for an uncontrolled environment and is safe for intended operation as described in this manual. Further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such a function is available. This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20 cm is maintained between the antenna and users, and The transmitter module may not be colocated with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their endproduct for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID:MCLT77H747. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Industry Canada statement:

This device complies with ISEDs licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d ISED applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage prjudiciable, et (2) ce dispositif doit accepter tout brouillage reu, y compris un brouillage susceptible de provoquer un fonctionnement indsirable. Radiation Exposure Statement:

The product comply with the Canada portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available. Dclaration d'exposition aux radiations:

Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le Canada tablies pour un environnement non contrl. Le produit est sr pour un fonctionnement tel que dcrit dans ce manuel. La rduction aux expositions RF peut tre augmente si l'appareil peut tre conserv aussi loin que possible du corps de l'utilisateur ou que le dispositif est rgl sur la puissance de sortie la plus faible si une telle fonction est disponible. Radiation Exposure Statement:

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with greater than 20cm between the radiator & your body. Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis plus de 20 cm entre le radiateur et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) The antenna must be installed and operated with greater than 20cm between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) L'antenne doit tre install et exploit avec plus de 20 cm entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed and operated with greater than 20cm between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC: 2878D-T77H747. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un appareil o lantenne peut tre installe et utilise plus de 20 cm entre lantenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 2878D-T77H747". End Product Labeling The product can be kept as far as possible from the user body or set the device to lower output power if such function is available. The final end product must be labeled in a visible area with the following: Contains IC:

2878D-T77H747. Plaque signaltique du produit final L'appareil peut tre conserv aussi loin que possible du corps de l'utilisateur ou que le dispositif est rgl sur la puissance de sortie la plus faible si une telle fonction est disponible. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 2878D-T77H747". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. DETACHABLE ANTENNA USAGE This radio transmitter (IC: 2878D-T77H747 / Model: T77H747) has been approved by ISED to operate with the antenna type listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le prsent metteur radio (IC: 2878D-T77H747 / Model: T77H747) a t approuv par ISED pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur. 1. 2. XXXyyyLPDzzzzx MPE 1mW/cm2 0.97 mW/cm2

HON HAI PRECISION IND. CO., LTD. 5F-1,5 Hsin-An Road Hsinchu, Science-Based Industrial Park Taiwan, R.O.C. Date: 2023-08-11 FCC ID: MCLT77H747 To the attention of Federal Communications Commission Authorization and Evaluation Division Attestation Statements Attestation Statements Part 2.911(d)(5)(i) Filing HON HAI PRECISION IND. CO., LTD. certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Attestation Statements Part 2.911(d)(5)(ii) Filing HON HAI PRECISION IND. CO., LTD. certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment. Sincerely yours, Signature:

Rio Chen Compliance Manager HON HAI PRECISION IND. CO., LTD. TEL: +88635784975 FAX: +88635775100 Email: rio.chen@foxconn.com

HON HAI PRECISION IND. CO., LTD. 5F-1,5 Hsin-An Road Hsinchu, Science-Based Industrial Park Taiwan, R.O.C. Agent letter FCC attestation statement (FCC CFR 47 2.911(d) U.S. Agent for Service of Process Attestation To the attention of Federal Communications Commission Authorization and Evaluation Division U.S. Agent Name:

FRN:

Street Address:

Telephone number:

Email Address:

This letter is to confirm that we (The Designated U.S. Agent) have accepted the responsibility to act as the designated U.S. Agent for the service of process as required by section 47 CFR 2.911(d)(7) on behalf of the Applicant noted below. Ivy Hsu 0033415266 8 Ravendale, Irvine CA. 92602

(949)923-1870 glodacertusa@gmail.com U.S. Agent Signature:

Date: 2023-08-15 Signed by (printed name):

Applicant HON HAI PRECISION IND. CO., LTD. MCL 0010777365 Mrs. Rio Chen 5F-1,5 Hsin-An Road Hsinchu Science-Based Industrial Park, Hsinchu, Taiwan, R.O.C.

+886-3-5784975 rio.chen@foxconn.com Company name:

FCC Grant Code:

FRN:

Contact Name:

Street Address:

City/Province/Zip:

Telephone No:

Email:

This letter is to confirm that the Applicant has designated the U.S. Agent noted above for the purpose of accepting service of process on their behalf as required by 2.911(d)(7). The Applicant further acknowledges acceptance to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any Commission -

related proceeding involving the equipment. Applicant Signature:

Date: 2023-08-15 Signed by (printed name):

HON HAI PRECISION IND. CO., LTD. 5F-1,5 Hsin-An Road Hsinchu, Science-Based Industrial Park Taiwan, R.O.C. A G E N C Y A U T H O R I Z A T I O N L E T T E R Date: 2023/08/01 FCC ID: MCLT77H747 To whom it may concern:

We, the undersigned, hereby authorize Amanda Wu of Bureau Veritas Consumer Products Services (H.K.) Ltd., Taoyuan Branch (BV CPS Taoyuan) of Taiwan to act on our behalf in all manners relating to FCC application for equipment authorization, including signing of all documents relating to these matters. Any and all acts carried out by Amanda Wu of BV CPS Taoyuan on our behalf shall have the same effect as acts of our own. If you have any questions regarding the authorization, please dont hesitate to contact us. Sincerely yours, Signature:

Rio Chen Compliance Manager HON HAI PRECISION IND. CO., LTD. TEL: +88635784975 FAX: +88635775100 Email: rio.chen@foxconn.com

HON HAI PRECISION IND. CO., LTD. 5F-1,5 Hsin-An Road Hsinchu, Science-Based Industrial Park Taiwan, R.O.C. Description of Permissive Change Date: 2023/08/10 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Attn: OET Dept. Ref: Class II permissive change Applicant: HON HAI PRECISION IND. CO., LTD. Dear Examiner, This is to request a Class II permissive change for FCC ID: MCLT77H747, the original grant date:10/26/2017. This Equipment is prepared for FCC Reassessment, the change list is as below:

1. From mobile device to portable device. If you have any questions regarding this application, please feel free to contact me. Sincerely yours, Signature:

Rio Chen Compliance Manager HON HAI PRECISION IND. CO., LTD. TEL: +88635784975 FAX: +88635775100 Email: rio.chen@foxconn.com