FCC ID: QISME309-562 eMTC Module

by: Huawei Technologies Co.,Ltd latest update: 2018-02-09 model: ME309-562

Two grants have been issued under this FCC ID on 02/09/2018 (this is one of three hundred and eighty-nine releases in 2018 for this grantee). Public details available include manuals, internal & external photos, and frequency information. some products also feature user submitted or linked instructions, troubleshooting guides, password defaults, drivers, & warrantee terms.

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all	frequencies			exhibits	applications
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all exhibits 12
1 ~ 2018-02-09 12
2 ~ 2018-02-09 8

app s				submitted / available
1 2	User Manual 2	Users Manual	pdf	83.28 KiB	August 02 2018 / January 08 2018
1 2	Users Manual 1	Users Manual	pdf	957.06 KiB	August 02 2018 / January 08 2018
1 2		Cover Letter(s)	pdf		August 02 2018 / September 02 2018
1 2		External Photos	pdf		August 02 2018 / January 08 2018
1 2		Internal Photos	pdf		August 02 2018 / January 08 2018
1 2		RF Exposure Info	pdf		August 02 2018 / September 02 2018
1 2		Cover Letter(s)	pdf		August 02 2018 / September 02 2018
1 2		ID Label/Location Info	pdf		August 02 2018 / September 02 2018
1 2		Test Report	pdf		September 02 2018
1 2		Test Setup Photos	pdf		August 02 2018 / January 08 2018
1 2		Test Report	pdf		September 02 2018
1 2		Test Report	pdf		September 02 2018

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Safety Information Warnings and Precautions This section contains important information pertaining to the operating instructions of your device. It also contains information about how to use your device safely. Read this information carefully before using the device. Electronic Device Do not use your device if using the device is prohibited. Do not use the device when using the device causes danger or interference with electronic devices. Medical Device Follow rules and regulations set forth by hospitals and health care facilities. Do not use your device when using the device is prohibited. Some wireless devices may affect the performance of hearing aids or pacemakers. For any such problems, consult your service provider. If you are using an electronic medical device, consult the doctor or the device manufacturer to confirm whether radio waves affect the operation of this device. Potentially Explosive Atmosphere Do not use your device in any area with a potentially explosive atmosphere, and comply with all signs and instructions. Areas that may have potentially explosive atmospheres include the areas where you would normally be advised to turn off your vehicle engine. Triggering of sparks in such areas could cause an explosion or a fire, resulting in bodily injuries or even deaths. Do not use your device at refueling points such as service stations. Comply with restrictions on the use of radio equipment in fuel depots, storage, and distribution areas, and chemical plants. In addition, adhere to restrictions in areas where blasting operations are in progress. Before using the device, watch out for areas that have potentially explosive atmospheres that are often, but not always, clearly marked. Such locations include areas below the deck on boats, chemical transfer or storage facilities, and areas where the air 1 contains chemicals or particles such as grain, dust, or metal powders. Ask the manufacturers of vehicles using liquefied petroleum gas (such as propane or butane) whether this device can be safely used in their vicinity. Traffic Security Observe local laws and regulations while using the device. To prevent accidents, do not use your wireless device while driving. RF signals may affect electronic systems of motor vehicles. For more information, consult the vehicle manufacturer. In a motor vehicle, do not place the device over the air bag or in the air bag deployment area. Otherwise, the device may hurt you owing to the strong force when the air bag inflates. Do not use your device while flying in an aircraft and before boarding an aircraft. Using wireless devices in an aircraft may cause danger to the operation of the aircraft and disrupt the wireless telephone network. It may also be considered illegal. Operating Environment Do not use the device in dusty, damp, and dirty places or places with magnetic fields. Otherwise, it may result in malfunction of the circuit. On a stormy day with thunder, do not use your device when it is being charged, to prevent While using the device, observe the local laws and regulations, and respect others'

The device should be installed and operated with a minimum distance of 20 cm between any danger caused by lightning. privacy and legal rights. the radiator and your body. In order to avoid the possibility of exceeding the Industrial Canada radio frequency exposure limits, human proximity to the device antenna shall not be less than 20 cm during normal operation;

Afin d'viter la possibilit de dpasser les limites d'exposition aux frquences radio industrielle du Canada, la proximit humaine pour l'appareil antenne ne doit pas tre infrieure 20 cm au cours fonctionnement normal.;

2 Safety of Children Comply with all precautions with regard to children's safety. Letting the child play with your device or its accessories, which may include parts that can be detached from the device, may be dangerous, as it may present a choking hazard. Ensure that small children are kept away from the device and accessories. Accessories Use the accessories delivered only by the manufacturer. Using accessories of other manufacturers or vendors with this device model may invalidate any approval or warranty applicable to the device, result in the non-operation of the device, and cause danger. Cleaning and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and disconnect the wireless device from your PC. Use your wireless device and accessories with care and in a clean environment. Keep the wireless device away from a fire or a lit cigarette. Protect your wireless device and accessories from water and vapor, and keep them dry. Do not drop, throw, or bend your wireless device. Clean your wireless device with a piece of damp and soft antistatic cloth. Do not use any chemical detergent, powder, or other chemical agents (such as alcohol and benzene) to clean the device. Keep the ambient temperature between -30 to +75 for using the device. FCC and IC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. Note 1: This module has been certified to comply with RF exposure requirements under mobile or fixed condition, this module is to be installed only in mobile or fixed applications. The system antenna(s) used for this module must not exceed 2.5dBi. The transmitter module may not be co-located with any other transmitter or antenna. The FCC ID label on the final system must be labeled with Contains FCC ID:

3 QISME309-562.And the IC label on the final system must be labeled with Contains IC : 6369A-ME309562 As long as the above conditions are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. In case the conditions specified above cannot be met, the FCC/IC authorization would no longer be considered valid and the FCC/IC ID could not be used on the final product. Under these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter (s)) and obtaining a separate FCC authorization. Additional tests for compliance with RF Exposure compliance (i.e. portable applications) and transmitter / host specific tests could be required. Note 2: Any modifications made to the module will void the Grant of Certification, this module is limited to OEM installation only and must not be sold to end-users, end-user has no manual instructions to remove or install the device, only software or operating procedure shall be placed in the end-user operating manual of final products. Note 3: The device must not transmit simultaneously with with any other antenna or transmitter. Note 4: The transmitter module must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the host product. FCC Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. 4 15.19 NOTICE:

This device complies with Part 15 of the FCC Rules Operation is subject to the following two conditions:

1) This device may not cause harmful interference, and 2) This device must accept any interference received, including interference that may cause undesired operation. 15.21 NOTICE:

Changes or modifications made to this device not expressly approved by Huawei Technologies Co., Ltd. may void the FCC authorization to operate this device. 15.105 NOTE:

This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by connecting or disconnecting the device to a PC, the user is encouraged to try to correct the interference by adopting one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the distance between the device and the receiver. Connect the device to an outlet on a circuit different from that to which the receiver is Consult the dealer or an experienced radio or TV technician for help. This device is intended for OEM integrators only. Host system must be labeled with "Contains FCC ID: QISME309-562", FCC ID displayed connected. on label. 5 Industry Canada Compliance This device complies with Industry Canada. The Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de la class B est conforme la norme NMB-003 du Canada. In the United States and Canada,. The standard incorporates a substantial margin of safety to give additional protection for the public and to account for any variations in measurements. 6

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HUAWEI ME309-562 eMTC LGA Module Hardware Guide Issue Date 03 2017-07-18 Copyright Huawei Technologies Co., Ltd. 2015. All rights reserved. No part of this manual may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. and its affiliates ("Huawei"). The product described in this manual may include copyrighted software of Huawei and possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by applicable laws or such actions are approved by respective copyright holders. Trademarks and Permissions

, and are trademarks or registered trademarks of Huawei Technologies Co., Ltd. LTE is a trade mark of ETSI. Other trademarks, product, service and company names mentioned may be the property of their respective owners. Notice Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and therefore may not be activated or may be limited by local network operators or network service providers. Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability. DISCLAIMER ALL CONTENTS OF THIS MANUAL ARE PROVIDED AS IS. EXCEPT AS REQUIRED BY APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO EVENT SHALL HUAWEI BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOSS OF PROFITS, BUSINESS, REVENUE, DATA, GOODWILL SAVINGS OR ANTICIPATED SAVINGS REGARDLESS OF WHETHER SUCH LOSSES ARE FORSEEABLE OR NOT. THE MAXIMUM LIABILITY (THIS LIMITATION SHALL NOT APPLY TO LIABILITY FOR PERSONAL INJURY TO THE EXTENT APPLICABLE LAW PROHIBITS SUCH A LIMITATION) OF HUAWEI ARISING FROM THE USE OF THE PRODUCT DESCRIBED IN THIS MANUAL SHALL BE LIMITED TO THE AMOUNT PAID BY CUSTOMERS FOR THE PURCHASE OF THIS PRODUCT. Import and Export Regulations Customers shall comply with all applicable export or import laws and regulations and be responsible to obtain all necessary governmental permits and licenses in order to export, re-export or import the product mentioned in this manual including the software and technical data therein. Privacy Policy To better understand how we protect your personal information, please see the privacy policy at http://consumer.huawei.com/privacy-policy. HUAWEI ME309-562 eMTC LGA Module Hardware Guide About This Document Revision History Document Version 01 02 Date Chapter Descriptions 2017-03-23 2017-05-26

Draft release 1.Cancel SPI/I2C function;

2.Cancel wake_up out function, use RING to replace it;

3.Update the pin map interface picture because the change above. Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 3 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Contents 1 Introduction.................................................................................................................................... 5 2 Overall Description ...................................................................................................................... 6 2.1 About This Chapter ........................................................................................................................... 6 2.2 Function Overview............................................................................................................................ 6 2.3 Circuit Block Diagram ....................................................................................................................... 7 2.4 Application Block Diagram ............................................................................................................... 8 3 Description of the Application Interfaces .............................................................................. 10 3.1 About This Chapter ......................................................................................................................... 10 3.2 LGA Interface ................................................................................................................................. 10 4 Mechanical Specifications ......................................................................................................... 20 4.1 About This Chapter ......................................................................................................................... 20 4.2 Storage Requirement ..................................................................................................................... 20 4.3 Moisture Sensitivity ........................................................................................................................ 20 4.4 Dimensions ..................................................................................................................................... 20 4.5 Customer PCB Design ................................................................................................................... 22 4.5.1 PCB Surface Finish ............................................................................................................... 22 4.5.2 PCB Pad Design .................................................................................................................... 22 4.5.3 Solder Mask ........................................................................................................................... 24 4.5.4 Requirements on PCB Layout ............................................................................................... 24 4.5.5 Stencil Design ........................................................................................................................ 24 Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 4 HUAWEI ME309-562 eMTC LGA Module Hardware Guide 1 Introduction This document describes the hardware application interfaces and air interfaces provided by HUAWEI ME309-562 eMTC LGA module (hereinafter referred to as the ME309-562 module). This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the ME309-562 module. Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 5 HUAWEI ME309-562 eMTC LGA Module Hardware Guide 2 Overall Description 2.1 About This Chapter This chapter gives a general description of the ME309-562 module and provides:

Function Overview Circuit Block Diagram Application Block Diagram 2.2 Function Overview Table 2-1 ME309-562 module features Feature Physical Dimensions Operating Bands Operating Temperature Storage Temperature Power Voltage Description Dimensions (W L H): 18 mm 24 mm 2.5 mm Weight TBD HD-FDD LTE: Band 2, Band 4, Band 12, Band13 Normal operating temperature: 30C to +75C (Characteristics guaranteed) Extended operating temperature[1]: 40C to +85C (Normal working) 40C to +95C 3.3 V to 4.2 V (3.8 V is recommended.) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 6 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Feature Application Interface

(120-pin LGA interface) Description GPIO x 5 UART interface (one 8-wire UART0, two 4-wire UART1&UART2, and UART2 is only for debugging) Standard SIM interface ADC interface x 2 SPI interface (software not support) I2C interface (software not support) LED interface x 2 JTAG interface Power supply interface Power on/off interface Hardware reset interface Wake in/out interface RF antenna pad x 1 Antenna Interface Data Services LTE FDD: DL 300kbps; UL 375kbps @1.4MHz BW catM1

[1]: When the ME309-562 module works at 40C to 30C or +75C to +85C, NOT all its RF performances comply with the 3GPP specifications. 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the ME309-562 module. The major functional units of the ME309-562 module contain the following parts:

Baseband controller Nor flash RF Circuit Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 7 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 2-1 Circuit block diagram of the ME309-562 module 2.4 Application Block Diagram Figure 2-2 Application block diagram of the ME309-562 module UART Interface:

SIM Interface:

GPIO:

External Power Supply:

ADC:

I2C:

The module supports 3 UART interfaces. Two are 4-wire UARTs, and the other one is 8-wire UART. Uart02 is only for debugging. The SIM interface provides the interface for a SIM card. General Purpose I/O pins. DC 3.8 V is recommended. Analog-to-Digital Converter InterIntegrated Circuit Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 8 HUAWEI ME309-562 eMTC LGA Module Hardware Guide SPI:

RF Pad:

Serial Peripheral Interface RF antenna interface. Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 9 HUAWEI ME309-562 eMTC LGA Module Hardware Guide 3 Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the ME309-562 module LGA Interface. 3.2 LGA Interface The ME309-562 module uses a 120-pin LGA as its external interface. For details about the module and dimensions, see 4.4 Dimensions. Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 10 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 3-1 Pin map of LGA interface (Top view) Update 26/05/2017 Figure 3-2 Appearance of ME309-562 module (without label) Top View Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 11 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Table 3-1 Definitions of pins on the LGA interface Pin No. A8 Pin Name UART0_TX Pad Type O A7 UART0_RX B7 UART0_CTS B8 UART0_RTS C7 UART0_DTR C6 UART0_DSR B6 UART0_DCD A6 UART0_RING A4 UART1_TX A5 UART1_RX B4 UART1_CTS B5 UART1_RTS F3 UART2_TX F1 UART2_RX I I O I O O O O I I O O I Description Parameter Min.

(V) Typ.

(V) Max.

(V) Comments UART0 transmit output UART0 receive data input UART0 clear to send UART0 ready for receive Data terminal ready UART0 data set ready UART0 data carrier detect UART0 ring indicator UART1 transmit output UART1 receive data input UART1 clear to send UART1 ready for receive UART2 transmit output UART2 receive data input VOH VOL VIH VIL VIH VIL VOH VOL VIH VIL VOH VOL VOH VOL VOH VOL VOH VOL VIH VIL VIH VIL VOH VOL VOH VOL VIH VIL 1.44 0 1.26 0 1.26 0 1.44 0 1.26 0 1.44 0 1.8

1.8

1.8 0.36 1.8 0.54 1.8 0.54 1.8 0.36 1.8 0.54 1.8 0.36 1.44 1.8 1.8 0 1.44 0 1.44 0 1.26 0 1.26 0 1.44 0 1.44 0 1.26 0

1.8

0.36 1.8 0.36 1.8 0.36 1.8 0.54 1.8 0.54 1.8 0.36 1.8 0.36 1.8 0.54

Use as wake_up out

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 12 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Description Pad Type Parameter Min.

(V) Typ.

(V) Max.

(V) Comments Pin No. F2 Pin Name UART2_CTS E2 UART2_RTS D1 SPI_CS_N D2 SPI_CLK C2 SPI_MOSI C1 SPI_MISO G1 I2C_SCL H1 I2C_SDA I/O I O O O O I O UART2 clear to send UART2 ready for receive Active low chip select to SPI device Clock to SPI device, running at 104MHz Serial data line for transmitted data, master out Serial data line for received data, master in I2C bus serial clock line (need pull up to VCC_EXT) I2C bus serial data line (need pull up to VCC_EXT) VIH VIL VOH VOL VOH VOL VOH VOL VOH VOL VIH VIL VOH VOL VOH VOL VIH VIL

D9 SIM_VCC PO Power supply for SIM D10 SIM_IO I/O SIM data B9 SIM_CLK C9 SIM_RST C10 SIM_DETECT O O I SIM clock SIM reset SIM hot swap VIH 1.26 1.26 0 1.44 0 1.44 0 1.44 0 1.44 0 1.26 0 1.8

1.8

NOT support NOT support NOT support NOT support 1.8 0.54 1.8 0.36 1.8 0.36 1.8 0.36 1.8 0.36 1.8 0.54 1.44 1.8 1.8 NOT support 0

1.44 0 1.26 0

0.36 1.8 0.36 1.8 0.54

NOT support

1.8 If not use, please pull it 1.8

1.8

1.8/

3.0 1.8/

3.0 1.8 Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 13 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Pin No. Description Pad Type Parameter Min.

(V) E3 SIM_SWITCH O L8 WAKEUP_IN I L3 WAKEUP_OUT O K3 SLEEP_STATUS O J8 LED_MODE O E8 GPIO1 I/O detection H: SIM is resent L: SIM is absent Switch from one card to the other, should cooperate with SIM switch IC chip. The host sets the module into sleep mode or wakes up the module from sleep mode. H: Sleep mode is disabled. L: Sleep mode is enabled.

(default L ) Module wakes up the host Sleep status indicator H: The module is in wakeup state. L: The module is in sleep state. Network mode indicator. General Purpose I/O pins. G8 GPIO2 I/O General Purpose I/O Typ.

(V)

Max.

(V) 0.54 0 1.44 1.8 1.8 0

0.36 Comments high to VCC_EXT on your board. If not use, please leave it open. 1.26 1.8 1.8

VIL VOH VOL VIH VIL 0

0.54

VOH VOL VOH 1.44 0 1.8

1.8 0.36 NOT support, please use RING as wake_up out 1.44 1.8 1.8

VOL 0

0.36

VOH VOL VOH VOL VIH VIL VOH VOL 1.44 0 1.44 0 VIH VIL 1.44 0 1.8

1.8

1.8 0.36 1.8 0.36 1.26 1.8 0 1.8

1.8 0.36

Default configuration is input pull down. Default configuration is input pull Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 14 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Pin No. Description Pad Type Parameter Min.

(V) D3 GPIO3 I/O F8 GPIO4 I/O H8 GPIO5 I/O L2 JTAG_TMS M2 JTAG_TRST_N K2 JTAG_TCK L1 JTAG_TDO M1 JTAG_TDI K1 ADC_1 J1 ADC_2 I I I O I AI AI VIH VIL VOH VOL VIH VIL VOH VOL VIH VIL VOH VOL VIH VIL VIH VIL VIH VIL VIH VIL VOH VOL VIH VIL

pins. General Purpose I/O pins. General Purpose I/O pins. General Purpose I/O pins. JTAG test mode select JTAG test reset JTAG test clock JTAG test data output JTAG test serial data input Conversion interface for analog signals to digital signals VIH VIL 1.44 0 VIH VIL 1.44 0 VIH VIL 1.44 0 VIH VIL 1.26 0 1.26 0 1.26 0 1.44 0 1.26 0

-0.036 Typ.

(V) Max.

(V) 1.26 1.8 Comments down. 0 1.8

1.8 0.36 1.26 1.8 0 1.8

1.8 0.36 1.26 1.8 Default configuration is input pull down. Default configuration is input pull down. Default configuration is input pull down. 0 1.8

1.8

1.8 0.54 1.8 0.54 1.8 0.54 1.8 0.36 1.8 0.54

1.836 The ADCs resolution is 10bit

Conversion interface for analog signals to digital signals

-0.036

1.836 Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 15 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Description Pad Type Parameter Min.

(V) Comments Max.

(V) System power -

on System power -

off System reset, active low.

Typ.

(V) 1.8 1.8 1.8

Pin No. D8 Pin Name POWER_ON J3 POWER_OFF F9 RESIN_N K8 BOOT_MODE K10 VCC_EXT L9 VCC_Module L10 VCC_Module P3 RF_ANT A3 Reserved B2 Reserved B3 Reserved C3 Reserved I I I I PO PI PI RF

Not support, will cancel it Not support, will cancel it Please add a pull-high resister to 1.8V on your board (not VCC_EXT). Please design a pull-high resister to VCC_EXT and a pull down resister to Ground on your board, default pull high resister is on the PCB board. Max current is 10mA Max current is about 300mA Boot mode configure H: boot from flash L: boot from host VIH 1.26 1.8 1.8 VIL 0

0.54 Pin for external power output Power supply Input Power supply input RF pin of module Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open.

1.71 1.8 1.89 3.3 3.8 4.2 3.3 3.8 4.2

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 16 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin No. G9 Pin Name Reserved G10 Reserved F10 Reserved E9 Reserved J10 Reserved H9 Reserved C5 Reserved G2 Reserved G3 Reserved H2 Reserved H3 Reserved P8 Reserved C4 Reserved A1 NC Description Pad Type Parameter Min.

(V) Typ.

(V) Max.

(V) Comments

Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Reserved, please keep this pin open. Not connected

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 17 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Description Pad Type Parameter Min.

(V) Typ.

(V) Max.

(V) Comments Pin No. A10 P1 P10 A2 A9 B1 NC NC NC GND GND GND B10 GND C8 E1 E5 E6 GND GND GND GND E10 GND F5 F6 G5 G6 H5 H6 GND GND GND GND GND GND H10 GND GND GND GND GND GND GND GND GND GND GND GND J2 J5 J6 J9 K5 K6 K9 M3 M4 M5 M6

Not connected Not connected Not connected Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 18 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin Name Description Pad Type Parameter Min.

(V) Typ.

(V) Max.

(V) Comments Pin No. M7 M8 M9 GND GND GND M10 GND N1 N2 N3 N4 N5 N6 N7 N8 N9 GND GND GND GND GND GND GND GND GND N10 GND P2 P4 P5 P6 P7 P9 GND GND GND GND GND GND

Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground

I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog signal input; PI indicates power input pins; PO indicates power output pins;

P indicates power pins. VIL indicates low-level input voltage; VIH indicates high-level input voltage; VOL indicates low-

level output voltage; VOH indicates high-level output voltage. The NC (Not Connected) pins are floating and there are no signal connected to these pins. The Reserved pins are internally connected to the module. Therefore, these pins should not be used, otherwise they may cause problems. Please contact with us for more details about this information. Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 19 HUAWEI ME309-562 eMTC LGA Module Hardware Guide 4 Mechanical Specifications 4.1 About This Chapter Storage Requirement Moisture Sensitivity Dimensions Customer PCB Design 4.2 Storage Requirement The module must be stored and sealed properly in vacuum package under a temperature below 40C and the relative humidity less than 90% in order to ensure the weldability within 12 months. 4.3 Moisture Sensitivity The moisture sensitivity is level 3. After unpacking, the module must be assembled within 168 hours under the environmental conditions that the temperature is lower than 30C and the relative humidity is less than 60%. If the preceding conditions cannot be met, the module needs to be baked according to the parameters specified in Table 4-1 . Table 4-1 Baking parameters Baking Temperature 125C5C Baking Condition Relative humidity 60%

Baking Duration Remarks 8 hours Refer to JESD-033C in detail Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033. 4.4 Dimensions Figure 4-1 shows the dimensions of the ME309-562 module in details. Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 20 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 4-1 Dimensions (Unit: mm) The detail information about the corner and the module pin description top view:

1. 2. the yellow pins, diameter is 0.76 mm, pitch is 1.35 mm, the blue pins, diameter is 0.89 mm, pitch is 1.60 mm. Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 21 HUAWEI ME309-562 eMTC LGA Module Hardware Guide 4.5 Customer PCB Design 4.5.1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel Immersion Gold (ENIG). Organic Solderability Preservative (OSP) may also be used, ENIG preferred. 4.5.2 PCB Pad Design To achieve assembly yields and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows:

Figure 4-2 Footprint design of customer's PCB (Unit: mm) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 22 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Some detail information about the recommend module footprint:

1. 2. the yellow pins, diameter is 0.71 mm, pitch is 1.35 mm, the blue pins, diameter is 0.81 mm, pitch is 1.60 mm. Figure 4-3 Detail information about the recommend module footprint Figure 4-4 Recommended Package Size on HUAWEI motherboard (Unit: mm) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 23 HUAWEI ME309-562 eMTC LGA Module Hardware Guide 4.5.3 Solder Mask Non Solder Mask Defined (NSMD) is recommended. In addition, the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved. The solder mask must be 100 m150 m larger than the pad, that is, the single side of the solder mask must be 50 m75 m larger than the pad. The specific size depends on the processing capability of the PCB manufacturer. 4.5.4 Requirements on PCB Layout To reduce deformation, a thickness of at least 1.0 mm is recommended. Other devices must be located more than 3 mm (5 mm recommended) away from the two parallel sides of the LGA module (rework requirement),and other sides with 0.6 mm. The minimum distance between the LGA module and the PCB edge is 0.3 mm. When the PCB layout is double sided, the LGA module must be placed on the second side for assembly; so as to avoid module dropped from PCB or component (located in module) re-melding defects caused by uneven weight. Customers PCB together with ME309-562 should be placed in an enclosed box to reduce the impact of high humidity as far as possible. The bottom of the module is not allowed to put non-ground line or non-ground hole. If the design can not be achieved, then the non-gound line and hole must be covered by green oil. 4.5.5 Stencil Design It is recommended that the stencil for the LGA module be 0.15 mm in thickness. The stencil design is shown as Figure 4-5 :

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 24 HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 4-5 Recommended stencil design of LGA module (Unit: mm) The stencil design has been qualified for HUAWEI motherboard assembly, customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect. Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 25

		frequency	equipment class	purpose
1	2018-02-09	1860 ~ 1900	PCB - PCS Licensed Transmitter	Original Equipment
2			JBP - Part 15 Class B Computing Device Peripheral

Application Forms

app s	Applicant Information
1 2	Effective	2018-02-09
1 2	Applicant's complete, legal business name	Huawei Technologies Co.,Ltd
1 2	FCC Registration Number (FRN)	0003748860
1 2	Physical Address	Administration Building, Headquarters of Huawei
1 2		Shenzhen, N/A
1 2		China

app s	TCB Information
1 2	TCB Application Email Address	v******@tuvam.com
1 2	TCB Scope	B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
1 2	TCB Scope	A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices

app s	FCC ID
1 2	Grantee Code	QIS
1 2	Equipment Product Code	ME309-562

app s	Person at the applicant's address to receive grant or for contact
1 2	Name	Z**** X****
1 2	Telephone Number	+86-7********
1 2	Fax Number	+86-7********
1 2	E-mail	z******@huawei.com

app s	Technical Contact
		n/a

app s	Non Technical Contact
		n/a

app s	Confidentiality (long or short term)
1 2	Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?:	Yes
1 2	Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?:	Yes
1 2	If so, specify the short-term confidentiality release date (MM/DD/YYYY format)	08/01/2018
	if no date is supplied, the release date will be set to 45 calendar days past the date of grant.

app s	Cognitive Radio & Software Defined Radio, Class, etc
1 2	Is this application for software defined/cognitive radio authorization?	No
1 2	Equipment Class	PCB - PCS Licensed Transmitter
1 2	Equipment Class	JBP - Part 15 Class B Computing Device Peripheral
1 2	Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant)	eMTC Module
1 2	Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application?	No
1 2	Modular Equipment Type	Single Modular Approval
1 2	Purpose / Application is for	Original Equipment
1 2	Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization?	Yes
1 2	Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization?	No
1 2	Grant Comments	Single Modular Approval. Output power is conducted. This device is to be used in mobile or fixed applications only. Antenna gain including cable loss must not exceed 2.5 dBi in all the grant listed bands, for the purpose of satisfying the requirements of 2.1043 and 2.1091. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons. The final product operating with this transmitter must include operating instructions and antenna installation instructions, for end-users and installers to satisfy RF exposure compliance requirements. Compliance of this device in all final product configurations is the responsibility of the Grantee. Installation of this device into specific final products may require the submission of a Class II permissive change application containing data pertinent to RF Exposure, spurious emissions, ERP/EIRP, and host/module authentication, or new application if appropriate.
1 2	Is there an equipment authorization waiver associated with this application?	No
1 2	If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded?	No

app s	Test Firm Name and Contact Information
1 2	Firm Name	Global Compliance and Testing Center of Huawei Tec
1 2	Name	P**** Z****
1 2	Telephone Number	86-75********
1 2	E-mail	z******@huawei.com

Equipment Specifications
	Line	Rule Parts	Grant Notes	Lower Frequency	Upper Frequency	Power Output	Tolerance	Emission Designator	Microprocessor Number
1	1	24E		1852.5	1907.5	0.19	21.12 Hz	1M14G7D
1	2	24E		1855	1905	0.19	22.66 Hz	1M16G7D
1	3	24E		1855	1905	0.19	22.66 Hz	1M02W7D
1	4	24E		1857.5	1902.5	0.19	22.61 Hz	1M17G7D
1	5	24E		1857.5	1902.5	0.18	22.61 Hz	1M04W7D
1	6	24E		1860	1900	0.18	20.51 Hz	1M16G7D
1	7	24E		1860	1900	0.18	20.51 Hz	1M03W7D
1	8	27		1712.5	1752.5	0.18	24.37 Hz	1M17G7D
1	9	27		1712.5	1752.5	0.18	24.37 Hz	1M04W7D
1	1	27		1715	1750	0.2	22.35 Hz	1M17G7D
1	11	27		1715	1750	0.19	22.35 Hz	1M03W7D
1	12	27		1717.5	1747.5	0.19	23.36 Hz	1M18G7D
1	13	27		1717.5	1747.5	0.19	23.36 Hz	1M04W7D
1	14	27		1720	1745	0.18	23.33 Hz	1M19G7D
1	15	27		1720	1745	0.19	23.33 Hz	1M05W7D
1	16	27		701.5	713.5	0.21	23.69 Hz	1M18G7D
1	17	27		701.5	713.5	0.22	23.69 Hz	1M02W7D
1	18	27		704	711	0.22	22.72 Hz	1M15G7D
1	19	27		704	711	0.22	22.72 Hz	1M02W7D
1	2	27		779.5	784.5	0.2	22.14 Hz	1M15G7D
1	21	27		779.5	784.5	0.19	22.14 Hz	1M01W7D
1	22	27		782	782	0.2	22.61 Hz	1M17G7D
1	23	27		782	782	0.2	22.61 Hz	1M03W7D
1	24	24E		1852.5	1907.5	0.19	21.12 Hz	1M05W7D
	Line	Rule Parts	Grant Notes	Lower Frequency	Upper Frequency	Power Output	Tolerance	Emission Designator	Microprocessor Number
2	1	15B

some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details