6222C-PUC
Wi-Fi Dual-band 2T2R 11ac +Bluetooth 5
Combo Module Datasheet
FN-LINK TECHNOLOGY LIMITED
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6222C-PUC Module Datasheet
Office: 6 Floor, Building U6, Junxiang U8 Park,
Hangcheng Avenue, Bao'an District,
Shenzhen City, CHINA
Factory: No.8, Litong Road, Liuyang Economic & Technical
Development Zone, Changsha, Hunan, CHINA
TEL: +86-755-2955-8186
Website: www.fn-link.com
Customer Approval :
Company
Title
Signature
Date
Fn-Link
FN-LINK TECHNOLOGY LIMITED
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6222C-PUC
Revision History
Version Date
Revision Content
1.0
2021/02/04 Draf Version
Draft
Lgp
Approved
Szs
2.0
2021/03/13
Update RF spec;
Lgp
Szs
Update power consumption data;
Update EEPROM information;
Update host interface timing
diagram
3.0
2021/04/08 Update RF spec
Lgp
Szs
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CONTENTS
6222C-PUC
1 Overview....................................................................................................................................1
1.1 Introduction......................................................................................................................... 1
1.2 Features.............................................................................................................................. 1
1.4 General Specification........................................................................................................ 2
1.5 Recommended Operating Rating....................................................................................3
※1.6 EEPROM Information....................................................................................................3
2 Wi-Fi RF Specification........................................................................................................... 4
2.1 2.4GHz RF Specification.................................................................................................. 4
2.2 5GHz RF Specification......................................................................................................5
3 Bluetooth Specification.........................................................................................................7
3.1 Bluetooth Specification..................................................................................................... 7
4 Pin Assignments..................................................................................................................... 8
4.1 Pin Outline...........................................................................................................................8
4.2 Pin Definition.......................................................................................................................9
5 Dimensions.............................................................................................................................12
5.1 Module Picture................................................................................................................. 12
5.2 Connector Specification..................................................................................................12
5.3 Marking Description.........................................................................................................13
5.4 Module Physical Dimensions.........................................................................................13
5.5 Layout Recommendation............................................................................................... 14
6 Host Interface Timing Diagram......................................................................................... 15
6.1 PCIe Bus during Power On Sequence.........................................................................15
6.2 PCIe PERST# Timing Sequence.................................................................................. 15
6.3 Power Off Sequence....................................................................................................... 16
6.4 BT_DIS Timing Sequence..............................................................................................16
6.5 Platform state transitions................................................................................................16
7 Reference Design................................................................................................................. 17
8 Ordering Information........................................................................................................... 18
9 The Key Material List........................................................................................................... 18
10 Recommended Reflow Profile.........................................................................................19
11 Package Information.......................................................................................................... 20
11.1 Reel..................................................................................................................................20
11.2 Carrier Tape Detail.........................................................................................................20
11.3 Packaging Detail............................................................................................................ 21
11.4 Moisture sensitivity........................................................................................................ 21
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6222C-PUC
1 Overview
1.1 Introduction
Fn-Link Technology would like to announce a low-cost and low-power consumption
module which has all of the Wi-Fi functionalities. It is a highly-integrated IEEE 802.11
a/b/g/n/ac MAC/Baseband/RF WLAN single chip. For Wireless LAN(WLAN)operation.
The integrated module provides PCIe interface for Wi-Fi . The module provides simple
legacy and 20MHz/40MHz/80MHz co-existence mechanisms to ensure backward and
network compatibility
The wireless module complies with IEEE 802.11 a/b/g/n/ac 2x2 MIMO standard and it
can achieve up to a speed of 866.7Mbps to connect the wireless LAN. The integrated
module provides PCIe interface for Wi-Fi, USB/ PCM interface for Bluetooth.
This compact module is a total solution for a combination of Wi-Fi and Bluetooth v5.0
technologies. The module is specifically developed for all portable devices.
1.2 Features
IEEE 802.11a/b/g/n/ac compatible WLAN
Supports 20/40MHz at 2.4GHz and supports 20/40/80MHz at 5GHz
Supports 802.11ac 2x2, Wave-2 compliant with MU-MIMO
Complete 802.11n MIMO solution for 2.4GHz and 5GHz band
Supports low power PCIe(Base Specification Revision 1.1) interface for WLAN and
USB(2.0 FS-mode)/PCM interface for Bluetooth
Supports Bluetooth 5.0 system
Compatible with Bluetooth v2.1+EDR
Dual Mode support: Simultaneous LE and BR/EDR
Enhanced BT/Wi-Fi Coexistence Control to improve transmission quality in different
profiles
Supports Bluetooth for class1, class2 and class3 power level transmissions without
requiring an external PA
Integrated 32K oscillator for power management
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1.3 Block Diagram
6222C-PUC
1.4 General Specification
Model Name
6222C-PUC
Product Description
Support Wi-Fi/Bluetooth functionalities
Dimension
L x W x H: 16x 12x 1.8 (typical) mm
Wi-Fi Interface
Support PCIe
BT Interface
USB/ PCM
Operating temperature
0°C to70°C
Storage temperature
-55°C to 85°C
RoHS
directive
All hardware components are fully compliant with EU RoHS
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1.5 Recommended Operating Rating
6222C-PUC
Operating Temperature
VDD33
Min.
Typ.
Max.
Unit
0
3.0
25
3.3
70
3.6
deg.C
V
VDD33 = 3.3V(Unit:mA)
Wi-Fi on Mode
(2.4G 1M)
(2.4G HT40)
(2.4G HT40)
TX
(5G 6M)
TX
TX
RX
TX
RX
(5G vHT80)
(5G vHT80)
BT on
BT Hopping
BT TX
BT RX
175
710
280
204
650
265
208
20
80
130
95
Power Consumption
※1.6 EEPROM Information
Wi-Fi
Vendor ID
Product ID
10EC
C822
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6222C-PUC
2 Wi-Fi RF Specification
2.1 2.4GHz RF Specification
Feature
WLAN Standard
Frequency Range
Number of Channels
Output Power
Description
IEEE 802.11b/g/n Wi-Fi compliant
802.11b/g/n(HT20):2412MHz to 2462MHz
802.11n(HT40): 2422MHz to 2452MHz
802.11b/g/n(HT20):11 802.11n(HT40):7
802.11b /11Mbps : 17 dBm ± 1.5 dB @ EVM -9dB
802.11g /54Mbps : 16 dBm ± 1.5 dB @ EVM -25dB
802.11n /MCS7 : 15 dBm ± 1.5 dB @ EVM -28dB
Other data rates output power are defined by driver’s
power by rates mechanism
Spectrum Mask
Min. b/g/n
Typ. b/g/n
Max. b/g/n
Unit b/g/n
1st
side lobes(to fc ±
11MHZ)
22MHZ)
2st
side lobes(to fc ±
-
-
-48/-33/-37
-59/-54/-56
-
-
Freq. Tolerance
-20/-20/-20
-
20/20/20
Test Items
Receive Sensitivity
(11b) @8% PER
Receive Sensitivity
(11g) @10% PER
Test Value
Standard Value
-
-
1Mbps
PER ≤ -92dBm ≤-83dBm
- 11Mbps
PER ≤ -84dBm ≤-76dBm
6Mbps
PER ≤ -89dBm ≤-85dBm
- 54Mbps
PER ≤ -70dBm ≤-68dBm
dBr
dBr
ppm
Receive
Sensitivity
- MCS=0
PER ≤ -88dBm ≤-85dBm
(11n,20MHz) @10% PER
- MCS=7
PER ≤ -68dBm ≤-67dBm
Sensitivity
Receive
(11n,40MHz) @10% PER
- MCS=0
PER ≤ -85dBm ≤-82dBm
- MCS=7
PER ≤ -65dBm ≤-64dBm
Maximum Input Level
802.11b : -10 dBm
802.11g/n : -20 dBm
Antenna Reference
Small antennas with 0~2 dBi peak gain
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6222C-PUC
2.2 5GHz RF Specification
Conditions : VBAT=3.3V ; VDDIO=3.3V ; Temp:25°C
Feature
WLAN Standard
Description
IEEE 802.11a/n/ac, Wi-Fi compliant
Frequency Range
Band 1 : 5180MHz-5240MHz;
Band2:5260MHz~5320MHz
Band3:5500MHz~5700MHz;
Band 4 : 5745MHz-5825MHz
Number of Channels
Output Power
Band 1: 802.11a/802.11n(HT20)/802.11ac(HT20): 4,
802.11n(HT40)/802.11ac(HT40):2,802.11ac(HT80):1
Band2:802.11a/802.11n(HT20)/802.11ac(HT20):4,
802.11n(HT40)/802.11ac(HT40):2,802.11ac(HT80):1
Band3:802.11a/802.11n(HT20)/802.11ac(HT20):11,
802.11n(HT40)/802.11ac(HT40):5,802.11ac(HT80):3
Band4:802.11a/802.11(HT20)/802.11ac(HT20):5,
802.11n(HT40)/802.11ac(HT40): 2, 802.11ac(HT80): 1
802.11a /54Mbps : 16 dBm ± 1.5 dB @ EVM -25dB
802.11n /MCS7 : 15 dBm ± 1.5 dB @ EVM -28dB
802.11ac /MCS9 : 13 dBm ± 1.5 dB @ EVM -32dB
Other data rates output power are defined by driver’s
power by rates mechanism
Test Items
Test Value
Receive Sensitivity
-
6Mbps
PER ≤ -89dBm
(11a, 20MHz)@10% PER
- 54Mbps
PER ≤ -70dBm
Receive
Sensitivity
- MCS=0
PER ≤ -88dBm
(11n,20MHz)@10% PER
- MCS=7
PER ≤ -68dBm
Receive
Sensitivity
- MCS=0
PER ≤ -85dBm
(11n,40MHz)@10% PER
- MCS=7
PER ≤ -65dBm
Receive Sensitivity
- MCS=0
PER ≤ -86dBm
(11ac,20MHz)@10% PER
- MCS=8
PER ≤ -63dBm
Receive Sensitivity
- MCS=0
PER ≤ -83dBm
(11ac,40MHz)@10% PER
- MCS=9
PER ≤ -59dBm
Receive Sensitivity
- MCS=0
PER ≤ -82dBm
(11ac,80MHz)@10% PER
- MCS=9
PER ≤ -56dBm
Maximum Input Level
802.11a/n : -30 dBm
Standard Value
≤-85dBm
≤-68dBm
≤-85dBm
≤-67dBm
≤-85dBm
≤-65dBm
≤-83dBm
≤-60dBm
≤-80dBm
≤-55dBm
≤-79dBm
≤-54dBm
Antenna Reference
Small antennas with 0~2 dBi peak gain
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15GHz(20MHz) Channel table
Band range
5180MHz~5240MHz
5260MHz~5320MHz
5550MHz~5700MHz
5745MHz~5825MHz
Operating Channel
Numbers
36
40
44
48
52
56
60
64
100
104
108
112
116
120
124
128
132
136
140
149
153
157
161
165
6222C-PUC
Channel center
frequencies(MHz)
5180
5200
5220
5240
5260
5280
5300
5320
5500
5520
5540
5560
5580
5600
5620
5640
5660
5680
5700
5745
5765
5785
5805
5825
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6222C-PUC
3 Bluetooth Specification
3.1 Bluetooth Specification
Feature
Description
General Specification
Bluetooth Standard
Bluetooth V5.0 of 1, 2 and 3 Mbps.
Host Interface
USB
Antenna Reference
Small antennas with 0~2 dBi peak gain
Frequency Band
2402 MHz ~ 2480 MHz
Number of Channels
79 channels
Modulation
GFSK, π/4-DQPSK,8DPSK
RF Specification
Output Power
Sensitivity @ BER=0.1%
for GFSK (1Mbps)
Sensitivity @ BER=0.01%
for π/4-DQPSK (2Mbps)
Sensitivity @ BER=0.01%
for 8DPSK (3Mbps)
Min.
Max.
Typical.
4 dBm
-70 dBm
-70 dBm
-70 dBm
Maximum Input Level
π/4-DQPSK (2Mbps) :-20dBm
GFSK (1Mbps):-20dBm
8DPSK (3Mbps) :-20dBm
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6222C-PUC
4 Pin Assignments
4.1 Pin Outline
< TOP VIEW >
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4.2 Pin Definition
NO
Name
Type
Description
Voltage
6222C-PUC
LTE_COEX3
I/O LTE coexist signal
G_BT/NC
－
connect to GND
G_BT or No connect, NC if not use, do not
LTE_RXD
LTE_TXD
NC
NC
NC
3_3V
3_3V
GND
NC
NC
NC
NC
GND
NC
NC
NC
NC
NC
NC
GND
GND
NC
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
29
30
31
32
33
HOST_WAKE_BT
SUSCLK
28 WL_EN
PCIe_WAKE
CLKREQ
PERST
GND
REFCLKN0
－ No connect
－ No connect
－ No connect
P Main power voltage source input 3.3V
P Main power voltage source input 3.3V
－ Ground connections
－ No connect
－ No connect
－ No connect
－ No connect
I
LTE coexist signal
O LTE coexist signal
－ No connect
－ No connect
－ Ground connections
－ No connect
－ No connect
－ Ground connections
－ No connect
－ No connect
－ Ground connections
Host wake up BT
I
－ No connect
－ Ground connections
I
External sleep clock input(32.768KHz)
－ WLAN enable pin, High: enable,Low:disable
OD PCIe wake up host
OD PCIe reference clock request signal
PD PCIe reset module
－ Ground connections
I
PCIe CLK Difference -
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
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34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
PCM_SYNC
PCM_IN
PCM_OUT
PCM_CLK
GND
6222C-PUC
REFCLKP0
GND
PETN0
PETP0
GND
PERN0
PERP0
GND
PCIe CLK Difference +
I
－ Ground connections
O PCIe Data Out Difference -
O PCIe Data Out Difference +
－ Ground connections
I
PCIe Data IN Difference -
PCIe Data IN Difference +
I
－ Ground connections
－ No connect
－ No connect
EESK/NC
－
connect to GND
EESK or No connect, NC if not use, do not
－ No connect
－ No connect
－ No connect
－ No connect
－ No connect
－ No connect
－ No connect
－ No connect
－ No connect
－ No connect
－ No connect
－ No connect
I/O PCM sync signal
I
PCM data input
O PCM Data output
I/O PCM clock
－ Ground connections
BT_WAKE_HOST O Bluetooth wake up host
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
63
BT_EN
I
This pin can externally shut down the
module BT function when BT_EN is pulled
Low. When this pin is pulled low, USB
64
65
LED#2
LED#1
interface will be also disabled.
O BT link LED, active low.
O WLAN link LED, active low.
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6222C-PUC
G_WL/NC
－
HOST_WAKE_BT
66
67
68
69
70
71
72
73
GND
USB_D-
USB_D+
GND
3.3V
3.3V
G_WL or No connect, NC if not use, do not
connect to GND
Host wake up BT, active high
I
－ Ground connections
I/O USB difference line for BT
I/O USB difference line for BT
－ Ground connections
P Main power voltage source input 3.3V
P Main power voltage source input 3.3V
－ Ground connections
－ Ground connections
3.3V
3.3V
3.3V
74~96 GND
G1-G12 GND
P: POWER I: INPUT O: OUTPUT
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6222C-PUC
5 Dimensions
5.1 Module Picture
L x W : 16 x 12 (+0.3-0.1) mm
H: 1.8 (±0.2) mm
Weight
0.75(±0.1)g
5.2 Connector Specification
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5.3 Marking Description
< TOP VIEW >
6222C-PUC
5.4 Module Physical Dimensions
(Unit: mm)
< TOP VIEW >
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5.5 Layout Recommendation
(Unit: mm)
6222C-PUC
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6222C-PUC
6 Host Interface Timing Diagram
6.1 PCIe Bus during Power On Sequence
6.2 PCIe PERST# Timing Sequence
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6.3 Power Off Sequence
6222C-PUC
6.4 BT_DIS Timing Sequence
6.5 Platform state transitions
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7 Reference Design
6222C-PUC
Note:
1. ANT_A, ANT_B are all support 2.4G/5G function, ANT_B is support Bluetooth also;
2. The module requires independent power supply, supply capacity ≥ 1000mA and ripple
less than 150mV;
3. Do not share power with amplifier, camera, etc.
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6222C-PUC
8 Ordering Information
Part No.
FG6222CPUC-00
Description
RTL8822CE-CG, a/b/g/n/ac, Wi-Fi+BT5.0, 2T2R, 12X16mm,
PCIE+USB, PCB Version V1.0
9 The Key Material List
Item Part Name
Description
Manufacturer
1
2
3
4
5
6
Inductor
2016 2.2UH ±20%,
Sunlord, Ceaiya, Cenker
Diplexer
1608 Dual-band, dual-mode
Glead, Walsin, ACX, Murata,
2.4GHz/5GHz WLAN
MAG.LAYERS
Crystal
1612 40MHz 12pF ±10ppm
Chipset
RTL8822CE-CG
6222C-PUC
12X16X0.5mm
ECEC, TKD, Hosonic, JWT,
TXC
Realtek
Brain-power, KX-pc，Sunlord,
Piotek
Shielding
6222C-PUC
V1.0
Shielding
Suntech, JLitong
PCB
TG180
Cover
cover
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6222C-PUC
10 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : 2 times
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6222C-PUC
11 Package Information
11.1 Reel
A roll of 2000pcs
11.2 Carrier Tape Detail
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11.3 Packaging Detail
6222C-PUC
11.4 Moisture sensitivity
The Modules is a Moisture Sensitive Device level 3,
in according with standard
IPC/JEDEC J-STD-020, take care
all the relatives requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity
(RH).
b) Environmental condition during the production: 30°C / 60% RH according to
IPC/JEDEC J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process
must be 168 hours if condition
b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
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6222C-PUC
FCC Statement
FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247
FPC Antenna , Antenna gain 2.35dBi
This device complies with part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.Any Changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate the equipment.Note:
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful
interference in a residential
installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful
interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures: — Reorient or relocate the receiving antenna. — Increase the separation
between the equipment and receiver.—Connect the equipment into an outlet on a circuit
from that to which the receiver is connected. — Consult the dealer or an
different
experienced radio/TV technician for help.FCC Radiation Exposure Statement This
modular complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment. This transmitter must not be co-located or operating in conjunction with
any other antenna or transmitter. If the FCC identification number is not visible when the
module is installed inside another device, then the outside of the device into which the
module is installed must also display a label referring to the enclosed module. This
exterior label can use wording such as the following: “ Contains Transmitter Module
FCC ID: 2AATL-6222C-PUC Or Contains FCC ID: 2AATL-6222C-PUC ” When the
module is installed inside another device, the user manual of the host must contain
below warning statements;
following two conditions:
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the
2. (1)This device may not cause harmful interference;(2)This device must accept any
interference received, including interference that may cause undesiredoperation.Note:
This equipment has been tested and found to comply with the limits for a Class B digital
device,pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection againstharmful
interference in a residential
installation. This
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6222C-PUC
equipment generates, uses and can radiate radiofrequency energy and, if not installed
and used in accordance with the instructions, may cause harmfulinterference to radio
communications.However, there is no guarantee that interference will not occur in a
particular installation.
If
this equipmentdoes cause harmful
interference to radio or
television reception, which can be determined by turning theequipment off and on, the
user is encouraged to try to correct the interference by one or more of thefollowing
measures:
— Reorient or relocate the receiving antenna. — Increase the separation between the
equipment and receiver. — Connect the equipment into an outlet on a circuit different
from that to which the receiver is connected. — Consult the dealer or an experienced
radio/TV technician for help. 2.Changes or modifications not expressly approved by the
party responsible for compliance could void theuser's authority to operate the
equipment.The devices must be installed and used in strict accordance with the
manufacturer's instructions as describedin the user documentation that comes with the
this modular with modular
the host device which install
product.Any company of
approval should perform the test ofradiated & conducted emission and spurious
emission, etc. according to FCC part 15C : 15.247 and 15.209& 15.207 ,15B Class B
requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209&
15.207 ,15B Class B requirement，then the host can be sold legally.
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