6223C-PUD
Wi-Fi 2.4G 1T1R 11n + BT 4.2
Module specification
FN-LINK TECHNOLOGY LIMITED
Proprietary & Confidential Information
6223C-PUDModule specification
Office: 6th Floor, Building U6, Junxiang U8, Hangcheng Avenue, Baoan District,
Shenzhen city, Guangdong Province, China
Factory: No. 8 litong Road, Liuyang Economic and Technological Development
Zone, Changsha, Hunan, China
Telephone: + 86-755-2955-8186
Website: www.fn-link.com
客户承认 :
公司
标题
签名
日期
欧智通
FN-LINK TECHNOLOGY LIMITED
Proprietary & Confidential Information
变更履历
版本
日期
描述
1.0
1.1
1.2
1.3
1.3
1.4
2018/10/18 New version
2018/12/18 Modify the telephone number
2018/12/25 Modify the office and TEL
2021/04/13 Proofread specification details
2021/05/20 Supplementary Material list
2021/07/12 Modifying Bluetooth Specifications
6223C-PUD
核准
Jacky
Lxy
Lxy
Szs
Szs
QJP
编辑
Lzm
Lzm
Lzm
Lxy
Lxy
Lxy
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CONTENTS
6223C-PUD
1 Overview....................................................................................................................................1
1.1 Introduction......................................................................................................................... 1
1.2 Features.............................................................................................................................. 1
1.4 General Specification........................................................................................................ 2
1.5 Recommended Operating Rating....................................................................................3
※1.6 EEPROM Information....................................................................................................3
2 Wi-Fi RF Specification....................................................................................................... 4
2.1 2.4GHz RF Specification.................................................................................................. 4
2.2 5GHz RF Specification......................................................................................................5
3 Bluetooth Specification.....................................................................................................7
3.1 Bluetooth Specification..................................................................................................... 7
4 Pin Assignments................................................................................................................. 8
4.1 Pin Outline............................................................................................................................8
4.2 Pin Definition........................................................................................................................9
5 Dimensions...........................................................................................................................12
5.1 Module Picture................................................................................................................... 12
5.2 Physical Outline.............................................................................................................12
5.3 Module Physical Dimensions...................................................................................13
5.4 Connector Specification..........................................................................................13
5.5 Marking Description................................................................................................ 14
6 Host Interface Timing Diagram....................................................................................... 15
6.1 PCIe Bus during Power On Sequence..........................................................................15
6.2 PCIe PERST# Timing Sequence................................................................................... 15
6.3 Power Off Sequence........................................................................................................ 16
7 Reference Design................................................................................................................ 17
8 Ordering Information......................................................................................................... 18
9 The Key Material List.......................................................................................................... 18
10 Recommended Reflow Profile.......................................................................................19
11 Package Information.........................................................................................................20
11.1 Reel....................................................................................................................................20
11.2 Carrier Tape Detail...........................................................................................................20
11.3 Packaging Detail...............................................................................................................21
12. Moisture sensitivity............................................................................................................ 21
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1. Overview
1.1 Introduction
6223C-PUD
6223C-PUD is a highly integrated module that supports 802.11b/g/n 1T1R, PCIe port,
USB Bluetooth port and wifi speed up to 150Mbps. Bluetooth supports V2.1+V4.2
systems.
1.2 Features
12 x16 the LGA encapsulation
Anyway IEee802.11b /g/n+BT v2.1/v4.2 system, BLE4.0 dual-mode
Subscribed 2.4g 11n supports a maximum speed of 150Mbps
Anyway Wifi data interface supports PCIe V1.1
Slim Bluetooth data interface supports USB 2.0 and SUPPORTS PCM
Footed supports IEee802.11e/I, WAPI
Anyway WiFi supports P2P apps
BLOCK DIAGRAM:
Confidential
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6223C-PUD
1.2 General Specification
Module type
6223C-PUD
describe
size
Wi-fi interface
BT interface
Working temperature
Wi-Fi/Bluetooth module
L x W x H: 16 x 12 x 1.65 mm
PCI-e
USB / PCM
0°C to 70°C
Storage temperature
-40°C to 80°C
RoHS
RoHS directive
1.4 Recommended Operating Rating
All hardware components are fully compliant with EU
Working temperature
VDD
VDDIO
Min.
0
3.15
3.15
Typ.
25
3.3
3.3
Max.
70
3.45
3.45
Unit
deg.C
V
V
VCC33 = 3.3V(Unit:mA)
Wi-Fi on Mode
150.15
power dissipation
(2.4G HT40)
TX
RX
(2.4G HT40)
※1.5 EEPROM information
wifi
Reg Domain
Channels 1-11 with active scan
300
158
Vendor ID
Device ID
BT
Vendor ID
Product ID
0x10EC
0xD723
0x0BDA
0xD723
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6223C-PUD
2 Wi-Fi Rf specification
2.1 2.4GHz Rf specification
features
WLAN standard
Frequency range
Channel number
The output power
spectrum
The frequency error
describe
802.11b: DSSS (CCK, DQPSK, DBPSK)
802.11g/n: OFDM (64QAM, 16QAM, QPSK, BPSK)
802.11b/g/n(HT20): 2412MHz to 2462MHz
802.11n(HT40): 2422MHz to 2452MHz
802.11b/g/n(HT20): 11
802.11n(HT40):7
11Mbps : 12 dBm ± 1.5 dB @ EVM -9dB
54Mbps : 12 dBm ± 1.5 dB @ EVM -25dB
: 12 dBm ± 1.5 dB @ EVM -28dB
MCS7
符合 IEEE 标准
±20 ppm
The test item
Typical Value
Typical Value
Receive Sensitivity
1Mbps
2Mbps
PER @ -92 dBm
PER @ -90 dBm
(11b,20MHz)@8%PER
- 5.5Mbps
PER @ -87 dBm
Receive Sensitivity
- 12Mbps
PER @ -87 dBm
(11g,20MHz)@10%
- 18Mbps
PER @ -84 dBm
PER
-
-
-
-
- 11Mbps
PER @ -85 dBm
6Mbps
9Mbps
PER @ -89 dBm
PER @ -88 dBm
- 24Mbps
PER @ -81 dBm
- 36Mbps
PER @ -78 dBm
- 48Mbps
PER @ -73 dBm
- 54Mbps
PER @ -71 dBm
- MCS=0
- MCS=1
- MCS=2
- MCS=3
- MCS=4
- MCS=5
- MCS=6
- MCS=7
PER @ -89 dBm
PER @ -86 dBm
PER @ -84 dBm
PER @ -80 dBm
PER @ -77 dBm
PER @ -72 dBm
PER @ -71 dBm
PER @ -69 dBm
≤-83
≤-80
≤-79
≤-76
≤-85
≤-84
≤-82
≤-80
≤-77
≤-73
≤-69
≤-68
≤-85
≤-82
≤-80
≤-77
≤-73
≤-69
≤-68
≤-67
Receive Sensitivity
(11n,20MHz)@10%
PER
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Receive Sensitivity
(11n,20MHz)@10%
PER
6223C-PUD
- MCS=0
PER @ -88 dBm
- MCS=1
PER @ -85 dBm
- MCS=2
PER @ -83 dBm
- MCS=3
PER @ -79 dBm
- MCS=4
PER @ -76 dBm
- MCS=5
PER @ -71 dBm
- MCS=6
PER @ -69 dBm
- MCS=7
PER @ -67 dBm
≤-82
≤-79
≤-77
≤-74
≤-70
≤-66
≤-65
≤-64
Maximum Input Level
802.11b : -10 dBm
802.11g/n : -20 dBm
Antenna Reference
2 dBi peak gain
3 Bluetooth Specification
3.1 Bluetooth Specification
Feature
Description
General Specification
standard
BT v2.1+v4.2/BLE4.0.
Data interface
USB2.0
Antenna reference
2 dBi peak gain
Frequency range
2402MHz-2480MHz
Channel number
79 channels
Modulation method
GFSK, π/4-DQPSK, 8DPSK
Rf specifications
Output power (Class 1)
2 dBm
Minimum
maximum
8 dBm
Sensitivity@ BER=0.1%
for GFSK (1Mbps)
Sensitivity@ BER=0.01%
for π/4-DQPSK (2Mbps)
Sensitivity@ BER=0.01%
for 8DPSK (3Mbps)
typical
5 dBm
-92 dBm
-86 dBm
-85 dBm
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Maximum input level
π/4-DQPSK (2Mbps) :-20dBm
4 Pin Assignments
4.1 Pin Outline
GFSK (1Mbps):-20dBm
8DPSK (3Mbps) :-20dBm
< TOP VIEW >
GND
G1
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
G4
GND
NC
NC
NC
3_3V
3_3V
GND
NC
NC
NC
NC
LTE_RX
LTE_TX
LTE_PRI
NC
NC
NC
GND
NC
NC
GND
NC
NC
GND
HOST_WAKE_DEV
NC
NC
SUSCLK
WLAN EN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
GND
G5
G9
GND
GND
G6
G10
GND
GND
G7
G11
GND
GND
G8
G12
GND
GND
G2 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 G3
GND
6223C-PUD
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
GND
GND
GND
3.3V
3.3V
NC
USB_D+
USB_D-
GND
NC
NC
LED#1
LED#2
BT_EN
GND
PCM_CLK
PCM_OUT
PCM_IN
PCM_SYNC
GND
NC
NC
NC
NC
NC
NC
NC
NC
4.2 Pin Definition
Name
Pin
Type
Description
Level
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LTE_RX
LTE_TX
I/O
I/O
13
LTE_PRI
I/O
LTE coexist signal
LTE coexistence signal
LTE coexistence signal
Share with GPIO12
0: internal NV memory select
1: External EEPROM select
6223C-PUD
3.3V
3.3V
VDDIO
VDDIO
VDDIO
No connect
No connect
No connect
power input
power input
grounding
No connect
No connect
No connect
No connect
No connect
No connect
No connect
grounding
No connect
No connect
grounding
No connect
No connect
grounding
No connect
No connect
1
2
3
4
5
6
7
8
9
10
11
12
14
15
16
17
18
19
20
21
22
23
24
25
26
NC
NC
NC
3_3V
3_3V
GND
NC
NC
NC
NC
GND
GND
NC
NC
NC
NC
NC
NC
NC
NC
NC
GND
HOST_WAK
E_DEV
27
SUSCLK
28
WLAN EN
－
－
－
P
P
－
－
－
－
－
－
－
－
－
－
－
－
－
－
－
I/O
－
－
I
I
Host wake up DEV, GPIO13
VDDIO
External RTC input(32.768kHz)
Share with GPIO15
0: USB1.2 or 2.0
1: otherwise
WLAN EN
1: WLAN on,PCIe on (default)
VDDIO
VDD
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29
PCIe_WAKE O/D
CLKREQ I/O/D
0: WLAN off, PCIe off
Power management event: open drain,active low.
Used to reactivate the PCIe slot’s main power rails
and reference clocks.
Share with BT wake up host function via sideband signals.
PCI-e reference clock request signal.
Can be shared with BTdevice clock request function
6223C-PUD
VDDIO
VDDIO
VDDIO
PERST
GND
REFCLKN0
REFCLKP0
GND
HSON
HSOP
GND
HSIN
HSIP
GND
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
I
－
I
I
－
O
O
－
I
I
－
－
－
－
－
－
－
－
－
－
－
－
－
－
－
－
－
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
PCI-e reset signal:active low.
grounding
PCI-E CLK Difference -
PCI-E CLK Difference +
grounding
PCI-E Data Out Difference -
PCI-E Data Out Difference +
grounding
PCI-E Data IN Difference -
PCI-E Data IN Difference +
grounding
No connect
No connect
No connect
No connect
No connect
No connect
No connect
No connect
No connect
No connect
No connect
No connect
No connect
No connect
No connect
grounding
GND
PCM_SYNC I/O
PCM_IN
I
PCM sync signal
PCM data input
VDDIO
VDDIO
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PCM Data output
PCM clock
grounding
1:BT on, USB on (default)
0: BT off, USB off
BT link LED,active low.
WLAN link LED,active low.
6223C-PUD
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
No connect
No connect
grounding
USB differential -
USB differential +
No connect
grounding
grounding
Main power voltage source input 3.3V
Main power voltage source input 3.3V
3.3V
3.3V
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74~76
G1-G12
PCM_OUT
PCM_CLK
GND
BT_EN
LED#2
LED#1
NC
NC
GND
USB_D-
USB_D+
NC
3.3V
3.3V
GND
GND
O
I/O
－
I
O
O
－
－
－
I/O
I/O
－
P
P
－
－
5. Dimensions
5.1 Module picture
L x W : 16 x 12 (+0.3/-0.1) mm
P:POWER I:INPUT O:OUTPUT VDDIO:3.3V
H: 1.65 (±0.2) mm
重量
0.69g
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6223C-PUD
5.2 Physical Outline
(Unit: mm)
< TOP VIEW >
2.85
5
5
1
.
0.50
3.0
.
0
3
0
9
2
1
.
0
7
0
.
5
1
0
.
PIN:1
.
5
2
00
2
0
.
0
3
0
.
)
1
.
0
-
/
3
.
0
+
(
6
1
0
3
4
1
.
0
5
0
.
.
3
0
5
2
0
.
0.50
.
5
1
0
0.15
0.70
0.30
6.30
0.20
0.25
0.30
0.15
.
0
5
0
0.25
10.30
12(+0.3/-0.1)
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6223C-PUD
5
5
.
1
0
0
3
.
0
9
2
1
.
5.3 Module Physical Dimensions
(Unit: mm)
0
0
.
6
1
0
3
4
1
.
5
2
0
.
0
5
0
.
0
3
.
0
5
2
0
.
5
8
.
0
5
2
0
.
0
5
.
0
0
3
0
.
0
9
0
.
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5.4 Connector Specification
6223C-PUD
0.30±0.03
A
0
3
.
1
0
7
1
.
0
0
1
.
0
0
1
.
0
2
.
0
A
1.70
2.00
3
2
0.45
1
SECTION: A-A
0
6
0
.
1.50
-X-
0.08 Max
5.5 Marking Description
< TOP VIEW >
6. Host Interface Timing Diagram
6.1 Bus during Power On Sequence
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The boot timing diagram is only for cold boot;
If system goes to S3, S4 or reboot without power off 3v3, BT_DIS is not allowed to be
6223C-PUD
asserted;
BT_DIS low duty require at least 5ms;
Do not driving any USB signal when BT_DIS is low;
Ton: the main power ramp up duration
TPRVRL: power valid to CLKREQ# output active
TPVPGL: power valid to PERST# input inactve
TPERST#-CLK: reference clock stable before PERST# inactive
TonBT: the time interval to turn on BT after PERST# de-asserted
Tattach: the interval between BT_DIS to USB attached state
TATTDB: the debounce interval with a minimal duration of 100ms that provide by USB
system software
TSE0 Reset: USB host send SE0 Reset duration
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6223C-PUD
6.2 PCIe PERST# Timing Sequence
6.3 Power Off Sequence
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6223C-PUD
7. Reference Design
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6223C-PUD
Schematics
Confidential
8.Ordering Information
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6223C-PUD
Part No.
FG6223CPUD-W1
Description
RTL8723DE, b/g/n, Wi-Fi+BLE4.2, 1T1R, 12X16mm,
PCIE+USB, PCB V3.0,双天线座
9.The Key Material List
crystal
1612/2016,40MHZ,15pF,10ppm
ECEC,HOSONIC,TKD,JWT
PCB
6223C-PUD V3.0,green, 4L, 12X16X0.4mm
XY-PCB,KX-PCB,SL-PCB,S
unlord,Brain-power PCB
RTL8723DE-VB-CG QFN56P
Realtek
6223C-PUD-V3.0 屏 蔽 盖
尺 寸
11.35x15.35x1.25mm 洋白铜,无定位脚,带
绝缘层
信太，精力通
antenna
4 generation antenna base
佳沃，创迪尔
Main
chip
Shielding
cover
The
seat
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6223C-PUD
10.Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : (cid:0)2 times
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6223C-PUD
11 Package Information
11.1 Reel
A roll of 2000pcs
11.2 Carrier Tape Detail
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6223C-PUD
11.3 Packaging Detail
12. Moisture sensitivity
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The Modules is a Moisture Sensitive Device level 3, in according with standard
6223C-PUD
IPC/JEDEC
J-STD-020, take care
all the relatives requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity
(RH).
b) Environmental condition during the production: 30°C / 60% RH according to
IPC/JEDEC J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process
must
be 168 hours if condition
b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
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FCC Statement
FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247
Integral FPC Antenna , Antenna gain 2dBi
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement
The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in
any portable device. This modular complies with FCC RF radiation exposure limits set forth for an
uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any
other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm
between the radiator and user body.
If the FCC identification number is not visible when the module is installed inside another device, then the
outside of the device into which the module is installed must also display a label referring to the enclosed
module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID:
2AATL-6223C-PUD Or Contains FCC ID: 2AATL-6223C-PUD ”
When the module is installed inside another device, the user manual of the host must contain below warning
statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference;
(2) This device must accept any interference received, including interference that may cause undesired
operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions as described
in the user documentation that comes with the product.
Any company of the host device which install this modular with modular approval should perform the test of
radiated & conducted emission and spurious emission, etc. according to FCC part 15C : 15.247 and 15.209
& 15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209
& 15.207 ,15B Class B requirement，then the host can be sold legally.