K255B-SR
Wi-Fi Dual-band 1X1 11a/b/g/n/ac +Bluetooth 5.0
Combo Module Datasheet
FN-LINK TECHNOLOGY LIMITED
Proprietary & Confidential Information
K255B-SR Module Datasheet
Office: 6 Floor, Building U6, Junxiang U8 Park,
Hangcheng Avenue, Bao'an District,
Shenzhen City, CHINA
Factory: No.8, Litong Road, Liuyang Economic & Technical
Development Zone, Changsha, Hunan, CHINA
TEL: +86-755-2955-8186
Website: www.fn-link.com
FN-LINK TECHNOLOGY LIMITED
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Revision History
K255B-SR
Version Date
Revision Content
1.0
2021/02/23 Draft version
Draft
Lgp
Approved
Szs
2.0
2021/03/18
Lgp
Szs
Correct typo;
Update RF specification;
Update Pin definition;
Add module picture
3.0
4.0
5.0
2021/04/12 Update marking description
2021/05/20
Update RF specification;
Update module picture
2021/05/21 Add general version module info
Lgp
Lgp
Lgp
Szs
Szs
Szs
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CONTENTS
K255B-SR
1 Overview....................................................................................................................................2
1.1 Introduction......................................................................................................................... 2
1.2 Features.............................................................................................................................. 2
1.3 General Specification........................................................................................................ 3
1.4 Recommended Operating Rating....................................................................................3
※1.5 EEPROM Information....................................................................................................3
2 Wi-Fi RF Specification........................................................................................................... 4
2.1 2.4GHz RF Specification.................................................................................................. 4
2.2 5GHz RF Specification......................................................................................................5
3 Bluetooth Specification.........................................................................................................7
3.1 Bluetooth Specification..................................................................................................... 7
4 Pin Assignments..................................................................................................................... 8
4.1 Pin Outline...........................................................................................................................8
4.2 Pin Definition.......................................................................................................................8
5 Dimensions.............................................................................................................................11
5.1 Module Picture..................................................................................................................11
5.2 Marking Description.........................................................................................................11
5.3 Module Physical Dimensions.........................................................................................12
5.4 Layout Recommendation............................................................................................... 13
6 Host Interface Timing Diagram......................................................................................... 14
6.1 system power on sequence........................................................................................... 14
6.2 SDIO Pin Description...................................................................................................... 15
6.3 SDIO Default Mode Timing Diagram............................................................................ 15
6.4 SDIO High Speed Mode Timing Diagram....................................................................16
6.5 SDIO Bus Timing Specifications in SDR Modes.........................................................17
6.6 SDIO Bus Timing Specifications in DDR50 Mode......................................................19
7 Reference Design................................................................................................................. 21
8 Ordering Information........................................................................................................... 21
9 The Key Material List........................................................................................................... 22
10 Recommended Reflow Profile.........................................................................................23
11 Package Information.......................................................................................................... 24
11.1 Reel..................................................................................................................................24
11.2 Carrier Tape Detail.........................................................................................................24
11.3 Packaging Detail............................................................................................................ 25
11.4 Moisture sensitivity........................................................................................................ 25
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K255B-SR
1 Overview
1.1 Introduction
and BLE mode.
1.2 Features
K255B-SR support 1-stream 802.11a/b/g/n/ac solution with MU-MIMO STA mode with
Bluetooth smart ready controller, SDIO 3.0 interface, HS-UART mixed interface.
It
combines WLAN MAC, a 1T1R WLAN baseband, RF in a single chip.
Module complies with IEEE 802.11 a/b/g/n/ac standard and the speed can achieve up to
80MHz bandwidth and PHY data rate of 433Mbps.
Module complies with Bluetooth core specification V5.0, support both classic BDR/EDR
CMOS MAC, Baseband PHY and RF in a single chip for IEEE 802.11 a/b/g/n/ac
Support 802.11ac 1x1, compliant with MU-MIMO STA mode
SDIO 3.0 interface for WLAN, with rate up to 208MHz
802.11ac support maximum rate up to 433Mbps in 80MHz bandwidth
Support HS-UART and PCM host interface for BT
Supports Bluetooth V5.0 features
Dual mode BT 5.0 supporting BDR, EDR, LE1M, LE2M and LE8S rates
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Block Diagram:
K255B-SR
1.3 General Specification
Model Name
K255B-SR
Product Description
Support Wi-Fi/Bluetooth functionalities
Dimension
Wi-Fi Interface
L x W x H: 15 x 13 x 2.15 mm (typical)
Support SDIO 3.0
BT Interface
UART / PCM
Operating temperature
0°C to 70°C
Storage temperature
-40°C to 85°C
1.4 Recommended Operating Rating
Min.
0
3.15
1.62
Typ.
Max.
Unit
25
3.3
1.8
70
3.45
1.98
deg.C
V
V
Operating Temperature
VCC33
VDDIO
※1.5 EEPROM Information
WI-FI
ID
TBD
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2 Wi-Fi RF Specification
2.1 2.4GHz RF Specification
K255B-SR
-
-
-
-
Feature
Description
WLAN Standard
Frequency Range
Number of Channels
IEEE 802.11 b/g/n Wi-Fi compliant
2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band)
2.4GHz:Ch1 ~ Ch14
Spectrum Mask
Min. b/g/n
Typ. b/g/n
Max. b/g/n
Unit b/g/n
1st side lobes(to fc ± 11MHZ)
2st side lobes(to fc ± 22MHZ)
-43/-30/-40
-52/-33/-58
-
-
Freq. Tolerance
Test Items
-20/-20/-20
-
Typical Value
20/20/20
EVM
dBr
dBr
ppm
802.11b /11Mbps: 15dBm ± 2.0 dB
EVM ≤ -9dB
802.11g /54Mbps: 16dBm ± 2.0 dB
EVM ≤ -25dB
Output Power
Test Items
802.11n /MCS7(HT20):
15dBm ± 2.0 dB
802.11n /MCS7(HT40):
14dBm ± 2.0 dB
TYP Test Value
SISO Receive Sensitivity
1Mbps
≤ -92 dBm
(11b,20MHz) @8% PER
- 11Mbps
≤ -82 dBm
SISO Receive Sensitivity
6Mbps
≤ -88 dBm
(11g,20MHz) @10% PER
- 54Mbps
≤ -71 dBm
SISO Receive Sensitivity
- MCS=0
(11n,20MHz) @10% PER
- MCS=7
≤ -87 dBm
≤ -69 dBm
SISO Receive Sensitivity
- MCS=0
≤ -84 dBm
(11n ,40MHz) @10% PER
- MCS=7
≤ -66 dBm
Maximum Input Level
802.11b: -10 dBm
802.11g/n: -20 dBm
EVM ≤ -28dB
EVM ≤ -28dB
Standard Value
≤ -85 dBm
≤ -76 dBm
≤ -82 dBm
≤ -65 dBm
≤ -82 dBm
≤ -64 dBm
≤ -79 dBm
≤ -61 dBm
Antenna Reference
Small antennas with 0~2 dBi peak gain
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2.2 5GHz RF Specification
Feature
WLAN Standard
Frequency Range
Number of Channels
Test Items
Description
IEEE 802.11a/n/ac 1x1, Wi-Fi compliant
5.150 GHz ~ 5.850 GHz (5.0 GHz Band)
5.0GHz:Please see the table1
Output Power
Typical Value
802.11a /54Mbps:
14 dBm ± 2.0 dB
802.11n /MCS7(HT20):
14dBm ± 2.0 dB
802.11n /MCS7(HT40):
13dBm ± 2.0 dB
802.11ac /MCS8(vHT20):
13 dBm ± 2.0 dB
802.11ac /MCS9(vHT40):
12dBm ± 2.0 dB
802.11ac /MCS9(vHT80):
11 dBm ± 2.0 dB
Test Value
6Mbps
-
Test Items
Receive Sensitivity (11a,
≤ -88 dBm
20MHz) @10% PER
- 54Mbps
≤ -70 dBm
Receive
Sensitivity
- MCS=0
(11n,20MHz) @10% PER
- MCS=7
Receive
Sensitivity
- MCS=0
(11n,40MHz) @10% PER
- MCS=7
Receive Sensitivity
- MCS=0
(11ac,20MHz) @10% PER
- MCS=8
Receive Sensitivity
- MCS=0
(11ac,40MHz) @10% PER
- MCS=9
Receive Sensitivity
- MCS=0
(11ac,80MHz) @10% PER
- MCS=9
≤ -87 dBm
≤ -69 dBm
≤ -84 dBm
≤ -66 dBm
≤ -86 dBm
≤ -65 dBm
≤ -83 dBm
≤ -58 dBm
≤ -81 dBm
≤ -55 dBm
Maximum Input Level
802.11a/n: -30 dBm
Antenna Reference
Small antennas with 0~2 dBi peak gain
Conditions : VBAT=3.3V ; VDDIO=1.8V ; Temp:25°C
Note: The RF specification will be updated in future version.
K255B-SR
EVM
EVM ≤ -25dB
EVM ≤ -28dB
EVM ≤ -28dB
EVM ≤ -30dB
EVM ≤ -32dB
EVM ≤ -32dB
Standard Value
≤ -82 dBm
≤ -65 dBm
≤ -82 dBm
≤ -64 dBm
≤ -79 dBm
≤ -61 dBm
≤ -82 dBm
≤ -59 dBm
≤ -79 dBm
≤ -54 dBm
≤ -76 dBm
≤ -51 dBm
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15GHz(20MHz) Channel table
Band range
Operating Channel
Channel center frequencies
Numbers
(MHz)
K255B-SR
5180MHz~5240MHz
5260MHz~5320MHz
5550MHz~5700MHz
5745MHz~5825MHz
36
40
44
48
52
56
60
64
100
104
108
112
116
120
124
128
132
136
140
149
153
157
161
165
5180
5200
5220
5240
5260
5280
5300
5320
5500
5520
5540
5560
5580
5600
5620
5640
5660
5680
5700
5745
5765
5785
5805
5825
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K255B-SR
3 Bluetooth Specification
3.1 Bluetooth Specification
Feature
Description
General Specification
Bluetooth Standard
Bluetooth V5.0
Host Interface
UART
Antenna Reference
Small antennas with 0~2 dBi peak gain
Frequency Band
2402 MHz ~ 2480 MHz
Number of Channels
79 channels
Modulation
GFSK, π/4-DQPSK,8DPSK
RF Specification
Output Power
Sensitivity @ BER=0.1%
for GFSK (1Mbps)
Sensitivity @ BER=0.01%
for π/4-DQPSK (2Mbps)
Sensitivity @ BER=0.01%
for 8DPSK (3Mbps)
Min.
2
Typical.
4
Max.
6
-70 dBm
-70 dBm
-70 dBm
Maximum Input Level
π/4-DQPSK (2Mbps): -20dBm
GFSK (1Mbps): -20dBm
8DPSK (3Mbps): -20dBm
Note: The RF specification will be updated in future version.
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K255B-SR
4 Pin Assignments
4.1 Pin Outline
< TOP VIEW >
4.2 Pin Definition
NO
Name
Typ
1
2
3
4
GND
ANT0
GND
GND
e
- Ground connections
I/O RF I/O port for BT
- Ground connections
- Ground connections
Description
Voltage
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5
6
7
8
9
10
11
12
13
14
15
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
K255B-SR
ANT1/NC
-
Dual band Wi-Fi RF I/O for FGK255BSRX-00;
ANT2/NC
I/O
NC for FGK255BSRX-00
Dual band Wi-Fi RF I/O for FGK255BSRX-XM;
GND
GND
GND
GND
GND
GND
GND
NC
- Ground connections
- Ground connections
- Ground connections
- Ground connections
NC for FGK255BSRX-XM
- Ground connections
- Ground connections
- Ground connections
- No connect
CHIP_EN
low, default high
CHIP_EN
I
This pin can externally shut down WLAN function when pulled
16 WL_WAKE_HOST O WLAN wake-up HOST
SDIO_CMD
I/O SDIO command line
SDIO_ CLK
I/O SDIO clock line
SDIO_DATA_3
I/O SDIO data line 3
SDIO_DATA_2
I/O SDIO data line 2
SDIO_DATA_0
I/O SDIO data line 0
SDIO_DATA_1
GND
NC
NC
NC
PCM_SYNC
I/O SDIO data line 1
- Ground connections
- No connect
- No connect
- No connect
I/O PCM sync signal
PCM_IN
I PCM data input
PCM_OUT
O PCM Data output
PCM_CLK
I/O PCM clock
RTC_CLK
I
External Low Power Clock input (32.768KHz)
GND
NC
VDDIO
NC
If not used keep NC
- Ground connections
- No connect
P I/O Voltage supply input
- No connect
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1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
K255B-SR
3.3V
1.8V
1.8V
1.8V
1.8V
36
37
38
39
40
41
42
43
44
45
46
47
48
VCC33
NC
NC
GND
UART_TXD
P Main power voltage source input
- No connect
- No connect
- Ground connections
O Bluetooth UART interface
UART_RXD
I Bluetooth UART interface
UART_RTS_N
O Bluetooth UART interface
UART_CTS_N
NC
NC
GND
GND
I Bluetooth UART interface
- No connect
- No connect
- Ground connections
MUX Uart BT Print Out
If not used keep NC
- Ground connections
ANT_SEL/NC
O
49 HOST_WAKE_BT
I
The function of this PIN will be updated in
1.8V
HOST wake-up Bluetooth device
future version
Bluetooth device to wake-up HOST
50 BT_WAKE_HOST O
The function of this PIN will be updated in
1.8V
P:POWER I:INPUT O:OUTPUT VDDIO:1.8V
future version
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K255B-SR
5 Dimensions
5.1 Module Picture
L x W : 15 x 13 (+0.3/-0.1) mm
FGK255BSRX-XM:
FGK255BSRX-00:
H: 2.15 (±0.2) mm
5.2 Marking Description
Weight
0.81 (±0.1) g
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5.3 Module Physical Dimensions
(Unit: mm)
< TOP VIEW >
6,5
K255B-SR
6,5
5,625
4,75
4,25
3,85
3,35
2,95
2,45
2,05
1,55
1,15
0,65
0,25
5
7
,
5
2
6
16
,
,
66
5
,
,
2
75
,
34
,
84
,
43
,
93
2
,
,
5
622
,
11
1
,
7
0
,
2
0
,
5
7
,
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5.4 Layout Recommendation
(Unit: mm)
< TOP VIEW >
6,5
K255B-SR
6,75
6,5
5,625
4,75
4,25
3,85
3,35
2,95
2,45
2,05
1,55
1,15
0,65
0,25
5
7
,
7
5
,
7
5
2
6
16
,
,
66
5
,
,
2
75
,
34
,
84
3
,
,
4
93
2
,
,
5
622
,
11
1
,
7
,
0
2
,
0
5
,
7
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6 Host Interface Timing Diagram
6.1 system power on sequence
K255B-SR
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6.2 SDIO Pin Description
The module supports SDIO version 3.0 for all 1.8V to 3.3V.
K255B-SR
SDIO Pin Description
SD 4-Bit Mode
DATA0 Data Line 0
DATA1 Data Line 1 or Interrupt
DATA2 Data Line 2 or Read Wait
DATA3 Data Line 3
CLK
CMD
Clock
Command Line
6.3 SDIO Default Mode Timing Diagram
Parameter
Symbol Minimum Typical Maximum Unit
SDIO CLK(All values are referred to minimum VIH and maximum VILb)
Frequency - Data Transfer mode
Frequency - Identification mode
Clock low time
Clock high time
Clock rise time
Clock low time
Input setup time
Input hold time
Inputs:CMD, DAT(referenced to CLK)
fPP
fOD
tWL
tWH
tTLH
tTHL
tISU
tIH
0
0
10
10
-
-
5
5
-
-
-
-
-
-
-
-
25
400
10
10
-
-
-
-
MHz
kHz
ns
ns
ns
ns
ns
ns
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Outputs:CMD, DAT(referenced to CLK)
Output delay time - Data Transfer mode
tODLY
Output delay time - Identification mode
tODLY
0
0
-
-
14
50
ns
ns
K255B-SR
a. Timing is based on CL ≤ 40 pF load on CMD and Data.
b. Min(Vih) = 0.7 × VDDIO and max(Vil) = 0.2 × VDDIO.
6.4 SDIO High Speed Mode Timing Diagram
Parameter
Symbol Minimum Typical Maximum Unit
SDIO CLK(all values are referred to minimum VIH and maximum VILb)
Frequency - Data Transfer mode
Frequency - Identification mode
Clock low time
Clock high time
Clock rise time
Clock low time
Input setup time
Input hold time
Inputs:CMD, DAT(referenced to CLK)
Outputs:CMD, DAT(referenced to CLK)
Output delay time - Data Transfer mode
tODLY
Output delay time - Identification mode
tODLY
2.5
Total system capacitance(each line)
CL
a.
Timing is based on CL ≤ 40 pF load on CMD and Data.
b. Min(Vih) = 0.7 × VDDIO and max(Vil) = 0.2 × VDDIO.
fPP
fOD
tWL
tWH
tTLH
tTHL
tISU
tIH
0
0
7
7
-
-
6
2
-
-
-
-
-
-
-
-
-
-
-
-
-
50
400
-
-
3
3
-
-
-
14
40
MHz
kHz
ns
ns
ns
ns
ns
ns
ns
ns
pF
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6.5 SDIO Bus Timing Specifications in SDR Modes
K255B-SR
Clock timing(SDR Modes)
Parametwer Symbol
Minimum Maximum Unit
Comments
-
-
tCLK
40
20
10
4.8
-
-
-
-
-
tCR, tCF
0.2 × tCLK
tCR, tCF < 2.00 ns (max)@100 MHz,
ns
ns
ns
ns
ns
SDR12 mode
SDR25 mode
SDR50 mode
SDR104 mode
CCARD = 10 pF
CCARD = 10 pF
tCR, tCF < 0.96 ns (max)@208 MHz,
Clock duty
-
30
70
%
-
Card Input timing (SDR Modes)
Symbol
Minimum Maximum Unit
Comments
SDR104 Mode
SDR50 Mode
tIS
tIH
tIS
tIH
1.70a
0.80
3.00
0.80
-
-
-
-
a. SDIO 3.0 specification value is 1.40 ns.
ns
ns
ns
ns
CCARD = 10pF, VCT = 0.975V
CCARD = 5pF, VCT = 0.975V
CCARD = 10pF, VCT = 0.975V
CCARD = 5pF, VCT = 0.975V
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Card output timing (SDR Modes up to 100MHz)
K255B-SR
Symbol Minimum Maximum Unit Comments
-
-
1.5
tODLY
tODLY
tOH
a.
SDIO 3.0 specification value is 7.5 ns.
7.85a
14.0
-
ns
ns
ns
tCLK≥10 ns CL=30 pF using driver type B for SDR50
tCLK≥20 ns CL=40 pF using for SDR12, SDR25
Hold time at the tODLY(min) CL=15 pF
Card output timing (SDR Modes 100MHz to 208MHz)
Symbol Minimum Maximum Unit Comments
tOP
△tOP
tODW
0
-350
0.6
2
-
UI
ps
UI
Card output phase
tODW = 2.88 ns @ 208 MHz
+1550
Delay variation due to temp change after tuning
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△tOP = +1550 ps for junction temperature of △tOP = 90 degrees during operation
△tOP = -350 ps for junction temperature of △tOP = -20 degrees during operation
△tOP = +2600 ps for junction temperature of △tOP = -20 to +125 degrees during operation
K255B-SR
6.6 SDIO Bus Timing Specifications in DDR50 Mode
parameter Symbol Minimum Maximum Unit
Comments
-
-
tCLK
tCR, tC
-
DDR50 mode
ns
ns
0.2 ×tCLK
tCR, tCF < 4.00 ns (max)@50 MHz,
Clock duty
-
55
%
-
CCARD = 10 pF
20
-
45
Data Timing
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K255B-SR
Symbol Minimum Maximum Unit Comments
Output delay time
tODLY
13.7
CCARD < 30 pF (1 Card)
Output hold time
tOH
CCARD < 15 pF (1 Card)
parameter
Input CMD
Input setup time
Input hold time
Output CMD
Input DAT
Input setup time
Input hold time
Output CMD
tISU
tIH
tISU2x
tIH2x
6
0.8
-
1.5
3
0.8
Output delay time
tODLY2x
-
7.85a
Output hold time
tODLY2x
1.5
a.
SDIO 3.0 specification value is 7.0 ns
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
ns
ns
CCARD < 10 pF (1 Card)
CCARD < 10 pF (1 Card)
CCARD < 10 pF (1 Card)
CCARD < 10 pF (1 Card)
CCARD < 25 pF (1 Card)
CCARD < 15 pF (1 Card)
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7 Reference Design
K255B-SR
Note: The function of PIN49 and PIN50 will be updated in future version.
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K255B-SR
8 Ordering Information
Part No.
FGK255BSRX-XM
FGK255BSRX-00
Description
W155S1, a/b/g/n/ac, Wi-Fi, BT5.0, 1T1R, SDIO+UART, 2
Antenna version, 13x15mm(XIAOMI VERSION)
W155S1, a/b/g/n/ac, Wi-Fi, BT5.0, 1T1R, SDIO+UART, 2
Antenna version, 13x15mm(GENERAL VERSION)
9 The Key Material List
Item Part Name
Description
Manufacturer
Inductor
2016 2.2uH,±20%
Sunlord, Ceaiya, Cenker
Diplexer
1608 Dual-band, dual-mode
Glead, Walsin, ACX, Murata,
2.4GHz/5GHz WLAN
MAG.LAYERS
ECEC, TKD, Hosonic, JWT,
Crystal
2016 40MHz
Chipset
W155S1
PCB
FR4, 4 LAYER, GREEN
XY-PCB, GDKX, Sunlord,
1
2
3
4
5
TXC
Amlogic
SLPCB
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K255B-SR
10 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : 260°C
Number of Times : 2 times
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K255B-SR
11 Package Information
11.1 Reel
A roll of 1500pcs
11.2 Carrier Tape Detail
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11.3 Packaging Detail
K255B-SR
11.4 Moisture sensitivity
The Modules is a Moisture Sensitive Device level 3,
in according with standard
IPC/JEDEC J-STD-020, take care
all the relatives requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity
(RH).
b) Environmental condition during the production: 30°C / 60% RH according to
IPC/JEDEC J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process
must be 168 hours if condition
b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
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