H158A-S Wi-Fi Single-band 1X1 802.11b/g/n SDIO Module Datasheet H158A-S Module Datasheet Office: 6 Floor, Building U6, Junxiang U8 Park, Hangcheng Avenue, Bao'an District, Shenzhen City, CHINA Factory: No.8, Litong Road, Liuyang Economic & Technical Development Zone, Changsha, Hunan, CHINA TEL: +86-755-2955-8186 Website: www.fn-link.com Customer Approval :
Company Title Signature Date Fn-Link FN-LINK TECHNOLOGY LIMITED Proprietary & Confidential Information Revision History Version Date Revision Content 1.0 2020/12/23 New version Draft Lxy Approved SZS H152A-S CONTENTS H158A-S 1 Overview....................................................................................................................................1 1.1 Introduction......................................................................................................................... 1 1.2 Features.............................................................................................................................. 1 1.3 General Specification........................................................................................................ 2 1.4 Recommended Operating Rating....................................................................................2 1.5 Current informations..........................................................................................................2 1.6 EEPROM Information....................................................................................................3 2 General Specification.............................................................................................................3 2.1 Wi-Fi RF Specifications.....................................................................................................3 3 Pin Assignments..................................................................................................................... 4 3.1 Pin Outline...........................................................................................................................4 3.2 Pin Definition.......................................................................................................................5 4 Dimensions...............................................................................................................................6 4.1 Module Picture................................................................................................................... 6 4.2 Marking Description...........................................................................................................7 4.3 Module Physical Dimensions........................................................................................... 7 4.4 Layout Reference...............................................................................................................8 6 Host Interface Timing Diagram............................................................................................8 6.1 SDIO Pin Description........................................................................................................ 8 6.2 SDIO Default Mode Timing Diagram.............................................................................. 9 6.3 SDIO Power-on sequence................................................................................................9 7 Reference Design................................................................................................................. 12 8 Ordering Information........................................................................................................... 12 9 The Key Material List........................................................................................................... 13 10 Environmental Requirements......................................................................................... 13 10.1 Recommended Reflow Profile.....................................................................................13 10.2 Patch Wi-Fi modules installed before the notice...................................................... 13 11 Package................................................................................................................................. 15 11.1 Reel..................................................................................................................................15 11.2 Packaging Detail............................................................................................................ 15 12.3 Moisture sensitivity........................................................................................................ 16 FN-LINK TECHNOLOGY LIMITED Proprietary & Confidential Information H158A-S 1 Overview 1.1 Introduction H158A-S is a highly integrated and excellent performance Wireless LAN (WLAN) SDIO2.0 network interface device. Based on iCOMM chipset SV6158P. support 802.11b/g/n standard. 1.2 Features Operate at ISM frequency bands (2.4GHz) CMOS MAC, Baseband PHY, and RF in a single chip for 802.11b/g/n compatible WLAN Wi-Fi 1 T 1 R allow data rates supporting up to 150 Mbps PHY rates 1bit/4bits mode supported,clock up to 50Mhz Block Diagram:
FN-LINK TECHNOLOGY LIMITED 1 Proprietary & Confidential Information H158A-S 1.3 General Specification Model Name H158A-S Product Description Support Wi-Fi functionalities Dimension Wi-Fi Interface L x W x T: 12 x 12 x 2.2 mm (typical) Support SDIO Operating temperature
-10C to 70C Storage temperature
-40C to +85C 1.4 Recommended Operating Rating Operating Temperature VBAT VDDIO 1.5 Current informations Min. Typ. Max. Unit
-10 3.0 1.7 25 3.3 1.8 or 3.3 70 3.6 3.6 deg.C V V current 802.11b TX mode 802.11g TX mode 802.11n HT20 TX mode 802.11n HT40 TX mode RX mode Saving mode DTIM3 BLE TX BLE RX Vcc=3.3V, Ta=25C, unit: mA Typ. Max. 11Mbps 186.6 54Mbps 158 MCS7 159.4 MCS7 161 35.7 0.21 90.3 33 FN-LINK TECHNOLOGY LIMITED 2 Proprietary & Confidential Information H158A-S 1.6 EEPROM Information WI-FI Vendor ID Product ID
2 General Specification 2.1 Wi-Fi RF Specifications Feature Description WLAN Standard Frequency Range Number of Channels IEEE 802.11 b/g/n Wi-Fi compliant 2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) 2.4GHzCh1 ~ Ch14 Spectrum Mask Min. b/g/n Typ. b/g/n Max. b/g/n Unit b/g/n 1st side lobes(to fc 11MHZ) 2st side lobes(to fc 22MHZ)
-43/-30/-40
-52/-33/-58
Freq. Tolerance Test Items
-20/-20/-20
Typical Value 20/20/20 802.11b /11Mbps : 17dBm 2 dB Output Power 802.11g /54Mbps : 15dBm 2 dB 802.11n /MCS7 : 15dBm 2 dB dBr dBr ppm EVM EVM -9dB EVM -26dB EVM -28dB Test Items TYP Test Value Standard Value SISO Receive Sensitivity
1Mbps 2Mbps PER @ -94 dBm PER @ -92 dBm
(11b,20MHz) @8% PER
- 5.5Mbps PER @ -91 dBm SISO Receive Sensitivity
(11g,20MHz) @10% PER
- 11Mbps PER @ -89 dBm
6Mbps 9Mbps PER @ -89 dBm PER @ -88 dBm
- 12Mbps PER @ -87 dBm
- 18Mbps PER @ -84 dBm
- 24Mbps PER @ -81 dBm
- 36Mbps PER @ -78 dBm
- 48Mbps PER @ -73 dBm
- 54Mbps PER @ -71 dBm
-83
-80
-79
-76
-85
-84
-82
-80
-77
-73
-69
-68 FN-LINK TECHNOLOGY LIMITED 3 Proprietary & Confidential Information
- MCS=0 PER @ -89 dBm
- MCS=1 PER @ -86 dBm
- MCS=2 PER @ -84 dBm SISO Receive Sensitivity
- MCS=3 PER @ -80 dBm
(11n,20MHz) @10% PER
- MCS=4 PER @ -77 dBm
- MCS=5 PER @ -72 dBm
- MCS=6
- MCS=7 PER @ -71 dBm PER @ -70 dBm
- MCS=0, PER @ -89 dBm
- MCS=1, PER @ -85 dBm
- MCS=2, PER @ -83 dBm SISO Receive Sensitivity
- MCS=3, PER @ -80 dBm
(11n ,40MHz) @10% PER
- MCS=4, PER @ -76 dBm
- MCS=5, PER @ -71 dBm
- MCS=6, PER @ -70 dBm
- MCS=7, PER @ -68 dBm 802.11b : -10 dBm 802.11g/n : -20 dBm Maximum Input Level H158A-S
-85
-82
-80
-77
-73
-69
-68
-67
-82
-79
-77
-74
-70
-66
-65
-64 Antenna Reference Small antennas with 0~2 dBi peak gain 3 Pin Assignments 3.1 Pin Outline
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FN-LINK TECHNOLOGY LIMITED 4 Proprietary & Confidential Information H158A-S 3.2 Pin Definition Pin #
Name Description 1 2 3 4 5 6~8 9 10~11 12 13 14 15 16 17 GND ANT GND NC GPIO12 NC VCC33 NC RST WL_HOST_WAKE SDIO_DATA_2 SDIO_DATA_3 SDIO_DATA_CMD SDIO_DATA_CLK GND RF OUTPUT GND NC Default low setting to SDIO mode, pull high into SPI mode NC 3.3V IN NC Reset, default pull high,active low WLAN WAKE HOST,GPIO14 SDIO_D2, GPIO17 SDIO_D3, GPIO18 SDIO_CMD, GPIO19 SDIO_CLK, GPIO20 FN-LINK TECHNOLOGY LIMITED 5 Proprietary & Confidential Information H158A-S 18 19 20 21 22 23~30 31 32 33 34~35 36 37 38 39~44 SDIO_DATA_D0 SDIO_DATA_D1 GND NC VDIO NC GND NC GND NC GND GPIO01 GPIO00 NC SDIO_D0, GPIO21 SDIO_D1, GPIO22 GND NC 1.8 or 3.3V NC GND NC GND NC GND UART LOG TX UART LOG RX NC P:POWER I:INPUT O:OUTPUT 4 Dimensions 4.1 Module Picture L x W : 12 x 12 (+0.3/-0.1) mm H: 2.2 (0.2) mm Weight 0.55g FN-LINK TECHNOLOGY LIMITED 6 Proprietary & Confidential Information 4.2 Marking Description H158A-S 4.3 Module Physical Dimensions FN-LINK TECHNOLOGY LIMITED 7 Proprietary & Confidential Information 4.4 Layout Reference
(unit: mm ) H158A-S 6 Host Interface Timing Diagram 6.1 SDIO Pin Description The module supports SDIO version 2.0 for all 1.8V 4-bit UHSI speeds: SDR12(25 Mbps), and SDR25(50Mbps) in addition to the 3.3V default speed(25MHz) and high speed (50 MHz). SDIO Pin Description FN-LINK TECHNOLOGY LIMITED 8 Proprietary & Confidential Information H158A-S SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait DATA3 Data Line 3 CLK CMD Clock Command Line 6.2 SDIO Default Mode Timing Diagram 6.3 SDIO Power-on sequence Figure 4 shows the power-on sequence of the SV615XP from power-up to firmware FN-LINK TECHNOLOGY LIMITED 9 Proprietary & Confidential Information download, including the initial device power-on reset evoked by LDO_EN signal. The LDO_EN input level must be kept the same as VDDIO voltage level. After initial power-on, the LDO_EN signal can be held low to turn off the SV615XP or pulsed low to induce a subsequent reset. After LDO_EN is assert and host starts the power-on sequence of the SV615XP. From that point, the typical SV615XP power-on sequence is H158A-S shown below:
1. Within 1.3 millisecond, the internal power-on reset (POR) will be done. And host could download firmware code of DPLL setting if the crystal is not default setting, 26MHz. The internal running clock is crystal frequency. 2. After 100us of DPLL settling time, host could set internal clock to full speed and finish all the downloading of firmware code. FN-LINK TECHNOLOGY LIMITED 10 Proprietary & Confidential Information H158A-S The SV615XP LDO_EN pin can be used to completely reset the entire chip. After this signal has been de-asserted, the SV615XP is in off mode waits for host communication. Until then, the MAC, BB, and SOC blocks are powered off and all modules are held in reset. Once the host has initiated communication, the SV615XP turns on its crystal and later on DPLL. After all clocks are stable and running, the resets to all blocks are automatically de-asserted. FN-LINK TECHNOLOGY LIMITED 11 Proprietary & Confidential Information H158A-S HOST R21 NC/47K R20 NC/47K R19 NC/47K R18 NC/47K SDIO_D2 SDIO_D3 SDIO_CMD SDIO_CLK SDIO_D0 SDIO_D1 RST RST SDIO_D2 SDIO_D3 SDIO_CMD SDIO_CLK SDIO_D0 SDIO_D1 C39 NC/10pf WAKE HOST GPIO12 DEV WAKE HOST GPIO TP1 TP2 X R _ G O L _ 0 T R A U X T _ G O L _ 0 T R A U 4 4 3 4 2 4 1 4 0 4 9 3 8 3 7 3 6 3 5 3 4 3 C N C N C N C N C N C N C N C N D N G X R _ T R A U X T _ T R A U VDDIO 7 Reference Design OUTLINE 1 2 3 4 5 6 7 8 9 10 11 GND WL_ANT GND NC GPIO12 NC NC NC VCC NC NC L1 10pF WL_ANT C1 NP GPIO12 C2 NP 3.3V C3 22uF Note:
1. RF trace as short as possible . 33 32 31 30 29 28 27 26 25 24 23 GND NC GND NC NC NC NC NC NC NC NC T S O H E K A W 2 _ A T A D _ O I D S 3 _ A T A D _ O I D S T S R D M C _ A T A D _ O I D S K L C _ A T A D _ O I D S 0 _ A T A D _ O I D S 1 _ A T A D _ O I D S D N G C N O I D D V 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 1 0 2 1 2 2 2 T S O H E A K W T S R 22R 22R 22R 22R 22R 22R R1 R5 R6 R7 R8 R9 O I D D V VDDIO C8 10uF SDIO_D1 SDIO_D0 SDIO_CLK SDIO_CMD SDIO_D3 SDIO_D2 8 Ordering Information Part No. Description FN-LINK TECHNOLOGY LIMITED 12 Proprietary & Confidential Information FGH158ASXX-00 H158A-S SV6158P,b/g/n,WiFi 2.4G,1T1R,SDIO,, 9 The Key Material List Crystal 3225 24MHZ CL=12pF,10ppm PCB H158A-S-V1.0 green, 4L, 12X12X0.8mm Chipset SV6158,11b/g/n, SDIO WiFi, 4x4mm,QFN32 Inductor Shielding H158A-S-V1.0 0603 4.7uH,20%,400mA 10 Environmental Requirements 10.1 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250C Number of Times : 2 times ECEC,HOSONIC,TKD,JW T XY-PCB,LX-PCB,SL-PCB, Sunlord iCOMMSEMI Sunlordcenkeceaiya 10.2 Patch Wi-Fi modules installed before the notice Wi-Fi module installed note:
FN-LINK TECHNOLOGY LIMITED 13 Proprietary & Confidential Information 1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness H158A-S When open a stencil. 2. Take and use the WIFI module, please insure the electrostatic protective measures. 3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 for the MID motherboard. About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 , relative humidity: < 90% r.h. 2. The module vacuum packing once opened, time limit of the assembly:
Card:1) check the humidity display value should be less than 30% (in blue), such as:
30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption. 2.) factory environmental temperature humidity control: -30 , 60% r.h.. 3). Once opened, the workshop the preservation of life for 168 hours. 3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption. 2). The baking temperature: 125 , 8 hours. 3). After baking, put the right amount of desiccant to seal packages. FN-LINK TECHNOLOGY LIMITED 14 Proprietary & Confidential Information 11 Package 11.1 Reel A roll of 2000pcs H158A-S 11.2 Packaging Detail the take-up package Using self-adhesive tape Size of black tape:24mm*32.6m the cover tape :21.3mm*32.6m Color of plastic disc:blue A roll of 2000pcs FN-LINK TECHNOLOGY LIMITED 15 Proprietary & Confidential Information H158A-S NY bag size:420mm*450mm size 335*335*55mm The packing case size:335*255*360mm 12.3 Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40C and <90% relative humidity
(RH). b) Environmental condition during the production: 30C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5. c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) IPC/JEDEC J-STD-033A paragraph 5.2 is respected d) Baking is required if conditions b) or c) are not respected FN-LINK TECHNOLOGY LIMITED 16 Proprietary & Confidential Information e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more H158A-S FN-LINK TECHNOLOGY LIMITED 17 Proprietary & Confidential Information Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this equipment. This device complies with Part 15 of the FCC Rules. (15.247) Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. Radiation Exposure Statement: This equipment complies with FCC radiation expo-sure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2AATL-H158A-S This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio. This Module have RF shielding and is tested and approved as standalone configuration, additional evaluation may be required for any system integrated this radio module.