SPECIFICATION SPEC. NO. REV 1.9 DATE 07.20. 2012 PRODUCT NAME WL-211 APPROVED CHECKED PREPARED DCC ISSUE NAME AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
Only for TPV. AMPAK WL-211 Wi-Fi SIP Module Spec Sheet AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
Only for TPV. Revision History Date 2011/08/22 2011/09/27 2011/10/19 2011/12/23 2012/01/12 2012/03/09 2012/03/19 2012/05/03 2012/05/18 2012/07/20 Revision Content Revised By Version
-Initial released
-Modify physical dimensions
-Modify block diagram
-Add Power Consumption
-Modify dimension
-Add packing information
-More info to recommended footprint
-Pin description revised
-Modify Recommended Footprint
-Modify Physical Dimensions
-Modify Physical Dimensions Andy Andy Andy Andy Andy Andy Andy Bart Bart Bart 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
1 Only for TPV. Contents Revision History......................................................................................................... 1 Contents..................................................................................................................... 2 1. Introduction........................................................................................................... 3 2. Features ............................................................................................................... 4 3. Deliverables.......................................................................................................... 5 3.1 Deliverables.................................................................................................... 5 3.2 Regulatory certifications ................................................................................. 5 4. General Specification............................................................................................ 6 4.1 Wi-Fi RF Specification .................................................................................... 6 4.2 Voltages.......................................................................................................... 7 4.2.1 Absolute Maximum Ratings.................................................................... 7 4.2.2 Recommended Operating Ratings ......................................................... 7 5. Pin Assignments ................................................................................................... 8 5.1 PCB Pin Outline.............................................................................................. 8 5.2 Pin Definition .................................................................................................. 8 6. Dimensions......................................................................................................... 11 6.1 Physical Dimensions..................................................................................... 11 6.2 Recommended Footprint .............................................................................. 12 7. External clock reference ..................................................................................... 13 7.1 SDIO Pin Description.................................................................................... 13 8. Host Interface Timing Diagram ........................................................................... 14 8.1 Power-up Sequence Timing Diagram ........................................................... 14 8.2 SDIO Default Mode Timing Diagram............................................................. 14 8.3 SDIO High Speed Mode Timing Diagram ..................................................... 15 9. Recommended Reflow Profile ............................................................................ 16 10. Packing Information............................................................................................ 17 10.1 Label........................................................................................................... 17 10.2 Dimension................................................................................................... 18 10.3 MSL Level / Storage Condition ................................................................... 20 AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
2 Only for TPV. 1. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the Wi-Fi functionalities. The highly integrated WL-211 module makes the possibilities of web browsing, VoIP, headsets and other applications. With seamless roaming capabilities and advanced security, WL-211 can also interact with different vendors 802.11b/g/n Access Points in the wireless LAN. This wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE 802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for Wi-Fi. This compact module is a total solution for Wi-Fi technologies. The module is specifically developed for Smart phones and Portable devices. AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
3 Only for TPV. 2. Features Single-band 2.4GHz IEEE 802.11b/g/n Supports standard interfaces SDIO v2.0(50MHz, 4-bit and 1-bit) and generic SPI(up to 50MHz) Integrated ARM Cortex-M3TM CPU with on-chip memory enables running IEEE802.11 firmware that can be field-upgraded with future features. Supports per packet Rx antenna diversity Security:
i. Hardware WAPI acceleration engine ii. AES and TKIP in hardware for faster data encryption and IEEE 802.11i compatibility iii. WPATM and WPA2TM - (Personal) support for powerful encryption and authentication A simplified block diagram of the module is depicted in the figure below. AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
4 Only for TPV. 3. Deliverables 3.1 Deliverables The following products and software will be part of the product. Module with packaging Evaluation Kits Software utility for integration, performance test. Product Datasheet. Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification. For module approval, the platforms antennas are required for the certification. AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
5 Only for TPV. 4. General Specification 4.1 Wi-Fi RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25C Feature Product Name WLAN Standard Host Interface Dimension Frequency Range Number of Channels Modulation Output Power Receive Sensitivity
(11n,20MHz)
@10% PER Receive Sensitivity (11g)
@10% PER Receive Sensitivity (11b)
@8% PER Description WL-211 Wi-Fi SIP Module IEEE 802.11b/g/n, WiFi compliant SDIO L x W x H: 9.5 x 9.5 x 1.5 (typical) mm 2.412 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) 11 for North America, 13 for Europe, and 14 for Japan 802.11b : DQPSK, DBPSK, CCK 802.11g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11b /11Mbps : 16 dBm 1.5 dB @ EVM -9dB 802.11g /54Mbps : 15 dBm 1.5 dB @ EVM -25dB 802.11n /65Mbps : 14 dBm 1.5 dB @ EVM -28dB
- MCS=0 PER @ -85 1dBm, typical
- MCS=1 PER @ -84 1dBm, typical PER @ -82 1dBm, typical
- MCS=2
- MCS=3 PER @ -80 1dBm, typical PER @ -77 1dBm, typical
- MCS=4 PER @ -73 1dBm, typical
- MCS=5
- MCS=6 PER @ -71 1dBm, typical
- MCS=7 PER @ -69 1dBm, typical PER @ -87 1dBm, typical
- 6Mbps
- 9Mbps PER @ -86 1dBm, typical PER @ -85 1dBm, typical
- 12Mbps
- 18Mbps PER @ -83 1dBm, typical PER @ -81 1dBm, typical
- 24Mbps PER @ -78 1dBm, typical
- 36Mbps
- 48Mbps PER @ -74 1dBm, typical PER @ -72 1dBm, typical
- 54Mbps PER @ -90 1dBm, typical
- 1Mbps
- 2Mbps PER @ -89 1dBm, typical PER @ -87 1dBm, typical
- 5.5Mbps
- 11Mbps PER @ -84 1dBm, typical AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
6 Only for TPV. Data Rate Data Rate
(20MHz ,Long GI,800ns) Data Rate
(20MHz ,short GI,400ns) Maximum Input Level Operating temperature Storage temperature Humidity 802.11b : 1, 2, 5.5, 11Mbps 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps 802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps 802.11b : -10 dBm 802.11g/n : -20 dBm
-30C to 85C
-40C to 85C Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing 4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol VBAT VDDIO Description Input supply Voltage Digital/Bluetooth/SDIO/SPI I/O Voltage Min. Max. Unit V
-0.5 V
-0.5 6.5 4.1 4.2.2 Recommended Operating Ratings Test conditions: At room temperature 25C Symbol VBAT VDDIO Min. 3.0 1.7 2.97 Typ. 3.6 1.8 3.3 Max. 4.8 1.92 3.6 Unit V V V Note: The voltage of VDDIO is depended on system I/O voltage. Test conditions: At operating temperature -10C ~65C Symbol VBAT VDDIO Min. 3.0 1.7 Typ. 3.6
-
Max. 4.8 3.35 Unit V V Note: VDDIO operating voltage range from 1.7V to 3.35V at operating temperature is guaranteed. AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
7 Only for TPV. 5. Pin Assignments 5.1 PCB Pin Outline Name 5.2 Pin Definition NO 1 2 3 WLAN_ANT JTAG_TRST_L GND
< TOP VIEW >
Type I/O I Description RF signal I/O port Ground JTAG interface, if JTAG not used unconnected (NC) JTAG interface, if JTAG not used unconnected (NC) 4 JTAG_TDO_UART_TX O this pin. This pin is also muxed with UART_TX, 5 JTAG_TDI_UART_RX I this pin. This pin is also muxed with UART_RX, which can be enabled by software JTAG interface, if JTAG not used unconnected (NC) 6 7 8 9 10 11 12 13 JTAG_TCK JTAG_TMS GND OSC_IN OSC_OUT GND RF_SW_CTRL0 RF_SW_CTRL3 I I I I/O which can be enabled by software JTAG interface, if JTAG not used unconnected (NC) JTAG interface, if JTAG not used unconnected (NC) Ground XTAL oscillator input XTAL oscillator output Ground Floating (Dont connected to ground) Floating (Dont connected to ground) AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
8 Only for TPV. GND SR_VLX CLK_32K VIN_LDO WL_RST_N GND VBAT SDIO_CLK SDIO_CMD GND GND GND GND VIO SDIO_DATA_1 SDIO_DATA_3 SDIO_DATA_2 SDIO_DATA_0 I I I/O I/O I I/O I/O I/O I O I I 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 WRF_GPIO_OUT TCXO_IN GPIO_5 GPIO_4 GPIO_3 GPIO_1 GPIO_0 GND GND GND GND GND GND GND GND GND GND VDD_TCXO XTAL_PU O GND Ground Ground Ground Ground Digital I/O Voltage input Sleep clock (32.768KHz) input SDIO data line 2 SDIO data line 0 SDIO clock SDIO command line SDIO data line 1 SDIO data line 3 Internal DC-DC regulator input Ground Internal DC-DC regulator output Ground DC voltage input Active low WLAN reset signal Ground Ground Ground Ground Floating (Dont connected to ground) Ground Ground Ground Ground Ground Ground Floating (Dont connected to ground) Ground Floating (Dont connected to ground) Floating (Dont connected to ground) Floating (Dont connected to ground) Floating (Dont connected to ground) O Mode selection, Low for SDIO, High for SPI mode WL_Host Wake, Floating (Dont connected to ground) AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
9 Only for TPV. 52 53 54 55 56 57 58 59 60 61 GND GND GND GND GND GND GND GND GND GND Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
10 Only for TPV. 6. Dimensions 6.1 Physical Dimensions
(Unit: mm)
< TOP VIEW >
< Side View >
1.7 (MAX)
< TOP VIEW >
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
11 Only for TPV. 6.2 Recommended Footprint
(Unit: mm)
< TOP VIEW >
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
12 Only for TPV. 7. External clock reference External LPO signal characteristics Parameter Nominal input frequency Frequency accuracy Duty cycle Input signal amplitude Signal type Input impedance Clock jitter (integrated over 300Hz 15KHz) LPO Clock 32.768 30 30 - 70 1600 to 3300 Square-wave or sine-wave
>100k
<5
<1 Units kHz ppm
%
mV, p-p
-
pF Hz 7.1 SDIO Pin Description The WL-211 supports SDIO version 1.2 for both 1-bit (25 Mbps), 4-bit modes (100 Mbps), and high speed 4-bit (50 MHz clocks 200 Mbps). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This out-of-band interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided. Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B) Function 1 Backplane Function to access the internal System On Chip (SOC) address space (Max BlockSize / ByteCount = 64B) Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max BlockSize / ByteCount = 512B) SDIO Pin Description SD 4-Bit Mode DATA0 Data Line 0 DATA2 DATA1 Data Line 1 or Interrupt Data Line 2 or Read Wait DATA3 Data Line 3 CLK CMD Clock Command Line SD 1-Bit Mode DATA Data Line DO SPI Mode Data Output IRQ Interrupt IRQ Interrupt RW Read Wait NC Not Used Not Used NC CLK Clock CMD Command Line Card Select CS SCLK Clock DI Data Input AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
13 Only for TPV. 8. Host Interface Timing Diagram 8.1 Power-up Sequence Timing Diagram WL_RST_N: Low asserting Reset for WLAN Core. This pin must be driven high or low (not left floating). 8.2 SDIO Default Mode Timing Diagram AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
14 Only for TPV. 8.3 SDIO High Speed Mode Timing Diagram AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
15 Only for TPV. 9. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250C Number of Times : 2 times 10 250 2.5C/sec 40~70 sec 2.5 /sec AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
16 Only for TPV. 10. Packing Information 10.1 Label Label A Anti-static and humidity notice Label B MSL caution / Storage Condition Label C Inner box label . Label D Carton box label . AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
17 Only for TPV. 10.2 Dimension AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
18 Only for TPV. Humidity indicator Desiccant B A C C D AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
19 Only for TPV. 10.3 MSL Level / Storage Condition NOTE : Accumulated baking time should not exceed 96hrs AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:
20 Only for TPV. This de the fol interfer includin This eq Class B are desi resident frequen instruct Howeve installat televisio and on, followin
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:Y9E-IAD1 pliance requ 0cm/low pow ly for use in maintained eled in a vis 18002. The uirements ar wer) n device wh d between th ible area wi e grantee's F re met. enna and here the ante he antenna a ith the FCC ID can n be Manuaal Informattion To the End User The OEEM integrat regardinng how to i end prooduct whic The endd as showw oor has to b nnstall or re hh integrates user manuual shall in in this mannual. ee aware not to provide mmove this RRF module i tthis modulee. cclude all reqquired regul iinformationn to the end nn the userss manual of user the atory informm ation/warnning 22