Product specifications
(Bluetooth module) Product Model: F-3320 Document number: XZX_RD_SP_F 3320V1.0 Hardware version: V1.0 File version: V 1.0 Entry into force :2020-10-12
(Picture for reference only) Change record Revised content Page Revision date Revisi Audito Xiamen Sixin Micro Technology Co. Ltd New construction 2020-10-30 Li Jian 16 Copyright Xiamen Sixin Microtechnology Co., Ltd .2019.All rights reserved. Without the written permission of the Company, no unit or individual may extract or copy part or all of the contents of this document without authorization and shall not r on disseminate it in any form. Trademark Declaration And other Sixin micro trademarks are Xiamen Sixin Micro Technology Co., Ltd. trademark. All other trademarks or registered trademarks mentioned in this document are owned by their respective owners. Attention the products, services or features you purchase shall be subject to the commercial contract and terms of xiamen sixin micro-tech co., ltd. all or part of the products, services or features described in this document may not be within the scope of your purchase or use. Unless otherwise agreed in the contract, does not make any express or implied statement or guarantee of the contents of this document. Due to product version upgrades or other reasons, the contents of this document will be updated on a regular basis. Unless otherwise agreed, this document serves only as guidance for use and all statements, information and recommendations in this document do not constitute any express or implied warranty. Vers ion V1.0 Catalogue (Content) 1 Summary .............................................................................................................................................................. 4 2 Basic characteristics............................................................................................................................................. 4 3 Applications ......................................................................................................................................................... 4 4 Performance parameters ...................................................................................................................................... 5 7 Module Size Chart ................................................................................................................................................... 11 9 Notes ....................................................................................................................................................................... 15 10 Recommended reflux temperature ........................................................................................................................ 16 11 Applied circuits ..................................................................................................................................................... 16 1 Summary F -3320(QCC3021) Bluetooth module is an intelligent wireless audio data dual-mode transmission product developed by our company. It is a high-end and high-efficiency stereo wireless transmission scheme. The module adopts QCC3021 chip to provide high quality sound quality and compatibility for the module. Overall performance is more optimized.F -3320(QCC3021) Bluetooth module adopts driver-free mode. Customers only need to connect the module to the application product, which can quickly realize the wireless transmission of music and enjoy the fun of wireless music. 2 Basic characteristics PWM support 1 Microphone noise reduction and echo cancellation technology SBC,AA C audio codec Supports serial interface: UART (I2C/SPI) USB 2.0 Integrated lithium-ion charger Bluetooth v5.0 compliance specification 120MHz Qualcomm Audio DSP 32MHz Development Application Processor Flexible QSPI Flash Programming platform Advanced Audio Algorithm High performance 24 stereo audio interface Digital and analog microphone interfaces Flexible PIO controllers and LED pins with 3 Applications Bluetooth Audio Bluetooth headset No phone calls Bluetooth Wireless Audio Bluetooth Digital Transmission Application Support for mobile interconnection peripherals Bluetooth Smartphone 4 Performance parameters 4.1 Module parameters Wireless standards Antenna Frequency range Transmission power Receiving sensitivity Extended interface Support systems:
Audio decoding output:
Module dimensions Certification information Module parameters Bluetooth Bluetooth V5.0 PCB Antenna 2.402 GHz-2.480GHz CLASS1 Max=-95 DB PIO, SPI, AIO, UART, USB, I2S, I2C, PWM, MIC, LIN, SPK (L/R) Support for Android (android), Apple (IOS) and windows systems SBC,AAC 15 mm *24mm*2mm (LxWxH) SMD
4.2 Recommended working conditions Scope of operation Min
-40 Operating temperature range Battery 5V (USB VBUS) Digital I/O AIO/LED AUDIO-IN/OUT 4.3 Battery Input Pin Specification BAT Operating voltage Software power-off threshold Under voltage lockout rising threshold Under voltage lockout hysteresis USB dead/weak battery rising threshold USB dead/weak battery hysteresis 4.4 Charger Input Pin Specification VCHG Operating voltage (full device specification) Operating voltage (reduced charger specification) VCHG_PRESENT rising threshold VCHG_PRESENT hysteresis 3.0 4.75 1.7 0 0 Min 2.8
2.47 50 3.14 50 Min 4.75 4.0 3.4 70 Typical
3.7 5.0 1.8
Typical 3.7 3 2.6
3.3
Typical 5.0 5.0 3.6
Max
+85 4.6 6.5 3.6 6.5 1.95 Max 4.6
2.73 120 3.46 120 Max 6.5 6.5 4.0 150 Unit C V V V V V Unit V V V mV V mV Unit V V V mV Full operating range On chip pull-down (disabled when VCHG_PRESENT =1) 4.5 Battery charge Trickle charge mode VPRE threshold (reading) VPRE threshold (falling) Trickle charge current VCHG4.25V to 6.5V VBAT0V to 2.2V Full temperature range-10C to 125C Pre-charge mode VFAST threshold (reflecting) Configured by application software VFAST threshold (falling) hissesis Fast charge modes Internal fast charge accuracy VCHG5V VBAT3.4V Temperature25C Internal fast charge accuracy VCHG4.75V to 6.5V VBAT2V to 4.2V VCHG-VBAT V 0.55 temperature range-10C to 125C Internal fast charge accuracy (Low VCHG voltage) VCHG4.4V to 6.5V VBAT2V to 4.2V VCHG-VBAT 0.15 V Full temperature range-10C to 125C VCHG_PR ESENT 10
20 6.5 V 30 k Min 2 1.9 1 Typical 2.1 2.0
Max 2.2 2.1 50 Unit V V mA Min 2.8 2.9 3.0 2.4 0 1 2 3 0.15 Min 197(-1.5%) Typical 2.9 3.0 3.1 2.5 0.2 Typical 200 Unit Max V 3.0 V 3.1 V 3.2 V 2.6 V 0.25 Unit Max 203(+1.5%) mA 194 (-3%) 200 206 (+3%) mA 100 (-50%) 200 206 (+3%) mA Fast charge mode Battery Voltage VCHG5V Temperature25C Min 4.18 (-0.5%) Typical 4.2 Max 4.22 (+0.5%) V Unit Battery Voltage VCHG VFLOAT+50 mV to 6.5V Full temperature range-10C to 125C 4.16 (-1%) 4.2 4.24 (+1%) V Termination current 0 Termination accuracy as a percentage of fast charge Fast charge mode Voltage hysteresis on VBAT,VHYST,as a percentage of VFLOAT 7 17 27 37 1 2 3 0 1 2 3 13 23 33 43 Min 1.8%
Typical 2.4%
Max 3.0%
(75 mVat 4.2V)
(100 4.2V) mVat
(125 mVat 4.2V) 3%
3.6%
4.2%
mVat
(175 mVat 4.2V)
(125 mVat 4.2V)
(150 4.2V) 4.2%
4.8%
5.4%
mVat
(225 mVat 4.2V)
(175 mVat 4.2V)
(200 4.2V) 5.4%
6%
6.5%
mVat
(275 mVat 4.2V)
(225 mVat 4.2V)
(250 4.2V) 10 20 30 40 Min Charger headroom error mode 30 Headroom error threshold (falling) 95 Headroom error threshold (reading) Min Charger Vbat overvoltage mode 4.65 Overvoltage (reading)
Headroom error hysteresis Headroom error threshold (falling) 4.55 Charger with external transistor mode Min 0.2 External fast charge current,IFAST External pass device hfe 45 Charger with external transistor mode accuracy Full temperature range-10 C to 125C Typical 65 140 Typical 4.7 100 4.6 Typical
120 MAX Max 100 170 Max 4.75
4.65 Max 1.8 700 The accuracy is the sum of the following of current corresponding to 100mV drop across the external sense resistor 1 per cent accuracy of the external sense resistor Unit
Unit mV mV Unit V mV V Unit A
4.6 LED drive foot LED driver pads Open drain current LED pad resistance VIL input logic level low VIH input logic level high 4.7 Audio parameters High impedance state Current sink state V < V 0.5 Min
1.0 Typical
Max 5 50 12 0.4
Unit uA mA V V 4.7.1Class-AB DAC audio output Parameter Input Sample Width Input Sample Rate,Fsample Max Power Load SNR Min
8
16
Typ
32 101 Max 24 192 30 30K
Unit Bits kHz mW dBA THD+N
-90.5
dB Digital gain Stereo separation (rosstalk) -
-24 80
21.5
dB dB 4.7.2High-quality (HQ ADC) single-ended audio input Conditions
dBFS,32,and 16load 0
kHz fin =1 48 kHz Fsample B/W =20 Hz B/W =20 kHz A-Weighted
-1 dBFS 32load kHz fin =1 48 kHz Fsample B/W =20 Hz B/W =20 kHz dBFS 0 30 mW 32load Digital gain resolution =1/32 Conditions
dB to 24dB analog gain 0 27 dB to 39dB analog gain kHz fin =1 48 kHz Fsample B/W =20 Hz B/W =20 kHz A-Weighted THD+N<0.1 per cent 2.4 V pk-pk input (0dB gain) kHz fin =1 48 kHz Fsample B/W =20 Hz B/W =20 kHz 2.4 V pk-pk input (0dB gain) Digital gain resolution =1/32 3 dB steps 3 Parameter Output Sample Width Output Sample Rate,Fsample Input level Input impedance SNR THD+N Digital gain Analog gain Min
8
Typ
20 10 101 Max 24 96 2.4
Unit Bits kHz V pk-pk k k dBA
-85
dB
-24 0
21.5 39 dB dB Stereo separation (rosstalk) -
80
dB 4.7.3High-quality (HQ ADC) differential audio input Min
8
SNR Conditions Parameter Output Sample Width
Output Sample Rate,Fsample -
Input level
dB to 24dB analog gain 0 Input impedance 27 dB to 39dB analog gain kHz fin =1 48 kHz Fsample B/W =20 Hz B/W =20 kHz A-Weighted THD+N<0.1 per cent 2.4 V pk-pk input (0dB gain) kHz fin =1 48 kHz Fsample B/W =20 Hz B/W =20 kHz 2.4 V pk-pk input (0dB gain) Digital gain resolution =1/32 3 dB steps 3
separation THD+N Digital gain Analog gain Stereo
(rosstalk) 4.7.4Microphone bias Parameter Output voltage, step =0.1 V) Output current capability Output noise Conditions
Crosstalk Between Microphones 4.8 Digital terminal features
B/W =20 Hz B/W =20 kHz Unweighted Using recommended application circuit Min 1.5 0.07 4.5
Min VDD_PADS supply 1.7
VIL input logic level low VIH input logic level high Drive current (configurable) VOL output logic level low,at max rated drive Typ
20 10 100 Max 24 96 2.4
Unit Bits kHz V pk-pk k k dBA
-91
dB
-24 0 80
21.5 39
dB dB dB Typ
5.1 80 Typ 1.8
Max 2.1 3.0 7.3
Unit V mA Vrms dB Max 3.6 0.22 x VDD_PADS
0.22 x VDD_PADS
Unit V V V mA V V
0.7 x VDD_PADS 2, 4, 8, 12 4
x 0.75 VDD_PADS 15 500 VOH output logic level high,at max rated drive
Strong pull (up & down) Weak pull (up & down) 65 2200 150 5000 k k 4.9 SYS_CTRL Enabling energy SYS_CTRL,switching threshold Rising threshold Falling threshold 5 R F parameters Parameters Min
0.4 Typ
Max 1.6
Unit V V Test conditions Working frequency Crystal frequency Output power Modulation bandwidth Frequency offset 0.01% BER received power 0.01%
sensitivity BER sensitivity Typical Maximu Unit Minimu m 2402 32 8 10
-91 m 2480 1 M Hz M Hz d Bm M Hz kHz d Bm d Bm Comment: All of the above test results areC room temperature 3.3 V power supply mode Pins AIO/LED[54,20]
All other pins All pins Specification JS-001-2017 JS-001-2017 JS-002-2014 Class 1C (1 000 V) 2(2000 V) C2a (500V) FOP F XTAL Launch R F TRP PBW Dev Receiving Max Input RXSENS 6 Static test Test Human Body Model Charge Device model 7 Module Size Chart 8.1 Module Footbit Definition Chart 8.2 Pin Function Description Symbol name Pin type Initial state State description DigitalBidirectional with programmable strength internal pullup/
pull-down DigitalBidirectional with programmable strength internal pullup/
pull-down DigitalBidirectional with programmable strength internal pullup/pull-down DigitalBidirectional with programmable strength internal pullup/
pull-down DigitalBidirectional with programmable Weak pull-down Weak pull-down Weak pull-down Weak pull-down Weak pull-down Programmable I/O line 21. Alternative function PCM_DOUT[2]
Programmable I/O line 20. Alternative function PCM_DOUT[1]
Programmable I/O line 19. Alternative function PCM_DIN[0]
Programmable I/O line 18. Alternative function PCM_DOUT[0]
Programmable I/O line 17. PIO-21 PIO-20 PIO-19 PIO-18 PIO-17 Foot posit ion P1 P2 P 3 P 4 P 5 strength internal pullup/
pull-down DigitalBidirectional with programmable strength internal pullup/pull-down DigitalBidirectional with programmable strength internal pullup/
pull-down DigitalBidirectional with programmable strength internal pullup/
pull-down DigitalBidirectional with programmable strength internal pullup/
pull-down Analog Weak pull-down Weak pull-down Strong pull-up Weak pull-down
PIO-16 PIO-15 PIO-6
[TBR_MOSI]
PIO-8
[TBR_CLK]
CHG_SENSE PIO-7 TBR_MISO P 11 PIO-1 REST DigitalBidirectional with programmable strength internal pullup/
pull-down DigitalBidirectional with programmable strength internal pullup/pull-down Strong pull-up Strong pull-up VBAT GND Analog VBAT_SENSE Analog CHG_EXT Analog V CHG Supply USBDN Digital USBDP Digital AIO_5 Analog or digital input/
open drain output.
P 6 P 7 P 8 P 9 P 10 P 12 P 13 P 14 P15 P16 P17 P18 P19 P20 Alternative function PCM_SYNC Programmable I/O line 16. Alternative function PCM_CLK Programmable I/O line 15. Alternative function MCLK_OUT Programmable I/O line 6. Alternative function TBR_MOSI[0]
Programmable I/O line 8. Alternative function TBR_CLK Charger input sense pin after external mode sense-resistor.High impedance. NOTE If using internal charger or no charger,connect VCHG_SENSE direct to VCHG. Programmable I/O line 7. Alternative function TBR_MISO[0]
Automatically to RESET#mode when the device is unpowered,or off modes.Reconfigurable as a PIO after boot. Alternative function Programmable I/O line 1 Battery voltage sense input. defaults in Ground Battery voltage sense input. External charger transistor current control.Connect to base of external charger transistor as per application schematic. Supply to SMPS power switch from charger input. USB Full Speed device DI/O. IEC-61000-4-2(device level) ESD Protection USB Full Speed device D+I/O. IEC-61000-4-2(device level) ESD Protection General-purpose analog/digital input or open drain LED output. PIO-4 PIO-3 P21 P22 MFB
[SYS_CTRL]
Weak pull-down Weak pull-down DigitalBidirectional with programmable strength internal pullup/
pull-down DigitalBidirectional with programmable strength internal pullup/
pull-down Digital input
1V8_SMPS
LED0
[AIO_0]
LED1
[AIO_1]
LED2
[AIO_2]
MIC A N Analog or digital input/
open drain output. Analog or digital input/
open drain output. Analog or digital input/
open drain output. Analog MIC A P Analog MIC_BIAS MIC B N Analog Analog MIC B P Analog SPKR_RN Analog P23 P24 P25 P26 P27 P28 P29 P30 P31 P32 P33 Programmable I/O line 4. Alternative function TBR_MOSI[1]
Programmable I/O line 3. Alternative function TBR_MISO[2]
Typically connected to an ON/OFF push button.Boots device in response to a button press when power is still present from battery and/or charger but software has placed the device in the OFF or DORMANT state.Additionally useable as a digital input in normal operation.No pull. Additional function PIO[0]input only 1.8 V OUT General-purpose analog/digital input or open drain LED output. General-purpose analog/digital input or open drain LED output. General-purpose analog/digital input or open drain LED output. Microphone differential 1input, negative. Alternative function Differential audio line input left, negative Microphone differential 1input, positive. Alternative function Differential audio line input left, positive Mic bias output. Microphone differential 2input, negative. Alternative function Differential audio line input right, negative Microphone differential 2input, positive. Alternative function Differential audio line input right, positive Headphone/speaker differential right output,negative. Alternative function Differential right line output, negative
Headphone/speaker differential right output,positive. Alternative function Differential right line output, positive Headphone/speaker differential left output,negative. Alternative function Differential left line output, negative Headphone/speaker differential left output,positive. Alternative function Differential left line output, positive Programmable I/O line 2. Alternative function TBR_MISO[3]
Programmable I/O line 5. Alternative function TBR_MISO[1]
V8IN 3V3-1 Bluetooth transmit/receive. Ground Ground DigitalBidirectional with programmable strength internal pullup/
pull-down DigitalBidirectional with programmable strength internal pullup/
pull-down Weak pull-down Weak pull-down A. During the use of the module, please pay attention to avoid the influence of interference sources such as power amplifier, boost circuit and DC/DC circuit on the module, and avoid the module power supply circuit forming series circuit with high power circuit unit to reduce the B. If there are batteries, metal objects, LCD screens, horns, etc. next to the module antenna, the distance from the antenna is required to be at least 15 mm (as shown) SPKR_RP Analog SPKR_LN Analog SPKR_LP Analog PIO-2 PIO-5 GND ANT GND V8_SMPS 3V3-1 -
RF
9 Notes interference P34 P35 P36 P37 P38 P39 P40 P41 P42 C. PCB board: because metal will weaken the function of the antenna, when giving the module board, it is strictly forbidden to lay the ground and line under the module antenna. D. Because the metal case is shielding the RF signal, it is recommended not to install it in the metal case E. With regard to the use environment, wireless signals are easily affected by the surrounding environment, such as trees, metals and other obstacles will have a certain absorption of wireless signals, so in practical applications, the distance of data transmission is affected to a certain extent 10 Recommended reflux temperature Key features of the profile
- Initial Ramp=1-2.5/ sec to 175equilibrium
- Equilibrium time=60 to 80seconds Ramp to Maximum temperature (250)=3/ sec Max
- Time above liquidus temperature(217 seconds 45-90
- Device absolute maximum reflow temperature250 11 Applied circuits
(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (15.107 and if applicable 15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in 15.101. Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. The final host device, into which this RF Module is integrated" has to be labeled with an auxiliary label stating the FCC ID of the RF Module, such as "Contains FCC ID: OMCBTAUD2
"This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
(1)this device may not cause harmful interference, and
(2)this device must accept any interference received, including interference that may cause undesired operation."
"Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the users authority to operate the equipment."
the Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into the host device. RF Exposure Warning Statements:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment shall be installed and operated with minimum distance 20cm between the radiator & body. The final host device, into which this RF Module is integrated" has to be labeled with an auxiliary label stating the IC of the RF Module, such as" Contains transmitter module IC: 3673A-BTAUD2 Le priphrique hte final, dans lequel ce module RF est intgr "doit tre tiquet avec une tiquette auxiliaire indiquant le CI du module RF, tel que" Contient le module metteur IC: 3673A-BTAUD2 This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:
(1) This device may not cause interference.
(2) This device must accept any interference, including interference that may cause undesired operation of the device. Lmetteur/rcepteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
(1) L' appareil ne doit pas produire de brouillage;
(2) L' appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'
en compromettre le fonctionnement. Radio Frequency Exposure Statement for IC The device has been evaluated to meet general RF exposure requirements. The device can be used in mobile exposure conditions. The min separation distance is 20cm. Dclaration d'exposition aux radiofrquences pour IC L'appareil a t valu pour rpondre aux exigences gnrales en matire d'exposition aux RF. L'appareil peut tre utilis dans des conditions d'exposition mobiles. La distance de sparation minimale est de 20 cm. Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal. 3) The module contains power supply regulation on the module. 4) The module contains a permanently attached antenna. 5) The module demonstrates compliance in a stand-alone configuration. 6) The module is labeled with its permanently affixed FCC ID label. 7) The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. 8) The module complies with RF exposure requirements. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help Co-location Warning:
This equipment could not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with the FCC multi-transmitter product procedures. Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules FCC Part 15.247 2.3 Specific operational use conditions This transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This information also extends to the host manufacturers instruction manual. 2.4 Limited module procedures Not applicable 2.5 Trace antenna designs It is not applicable as trace antenna which is not used on the module. 2.6 RF exposure considerations This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This compliance to FCC radiation exposure limits for an uncontrolled environment, and minimum of 20cm separation between antenna and body. The host product manufacturer would provide the above information to end users in their end-product manuals. 2.7 Antennas PCB antenna; 0dBi; 2.402 GHz2.480GHz 2.8 Label and compliance information The end product must carry a physical label or shall use e-labeling followed KDB784748D01 and KDB 784748 stating Contains Transmitter Module FCC ID: OMCBTAUD2. 2.9 Information on test modes and additional testing requirements For more information on testing, please contact the manufacturer. 2.10 Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed when contains digital circuity.