BM10_AN R3 BLE Single Mode Module Product Specification Model Name Project code Description Revision Issue Date BM10_AN R3 CBM10 BLE Single Mode Module 1.0 2022/02/11 Reviewed by Sky He Approved by Taka Wei Issued by Aaron Lai REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification Revision History Revision Released Date Comments/Remark 1.0 2022/02/11 Initial release Author Aaron Lai 2022 InnoComm Mobile Technology Corp. Disclaimer BM10_AN R3 BLE MODULE is supplied as is and without warranties of any kind, express, implied, or statutory including, but not limited to, any implied warranty for a particular purpose. No license is granted by implication or otherwise under any patents or other intellectual property by application or use of evaluation boards. Information furnished by InnoComm is believed to be accurate and reliable. InnoComm reserves the right to change specifications or product descriptions in this document at any time without notice. Should Buyer purchase or use InnoComms products for any such unintended or unauthorized application, Buyer shall indemnify and hold InnoComm harmless against all claims and damages. InnoComm is the trademark of InnoComm Mobile Technology Corp. Other trademarks and registered trademarks mentioned herein are the property of their respective owners. 2/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification ABLE OF CONTENT 1. INTRODUCTION ..................................................................................... 4 2. GENERAL INFORMATION ..................................................................... 5 2.1 KEY FEATURES ..................................................................................... 5 2.2 BLOCK DIAGRAM .................................................................................. 6 3. PIN MAP AND SIGNAL DESCRIPTION ................................................. 7 3.1 REFERENCE CIRCUIT ........................................................................... 8 4. ELECTRICAL CHARACTERISTICS ....................................................... 9 4.1 RECOMMENDED OPERATING RANGE ................................................ 9 4.2 POWER CONSUMPTION ....................................................................... 9 5. RF CHARACTERISTICS ....................................................................... 10 6. MECHANICAL INFORMATION ............................................................ 11 7. PCB LAYOUT RECOMMENDATION .................................................... 12 8. MODULE PLACEMENT AND LAYOUT GUIDE .................................... 13 9. SMT SOLDER REFLOW RECOMMENDATION ................................... 14 10. PRODUCT AND DOCUMENTATION SUPPORT .................................. 15 10.1. DEVELOPMENT SUPPORT .............................................................. 15 10.2. DOCUMENTATION SUPPORT .......................................................... 16 10.3. COMMUNITY RESOURCES .............................................................. 17 3/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 1. INTRODUCTION Based on TIs outstanding CC2652R7 BLE technology, Innocomms BM10_AN R3 module is a wireless microcontroller (MCU) targeting Bluetooth 5.2 low-energy applications. With very low active RF and MCU current and low-power mode current consumption, it provides excellent battery life and allows for operation on small coin cell batteries and in energy-harvesting applications and embedded PCB antenna. BM10_AN R3 module contains a powerful 32-bit Cortex M4F running up to 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultra-low-power sensor controller. Bluetooth low energy controller and host libraries are embedded in ROM and run partly on an ARM Cortex-M0 processor. This architecture improves overall system performance and power consumption and frees up significant amounts of flash memory for the application. 4/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 2. General Information 2.1 Key Features RF 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC Excellent receiver sensitivity -101 dBm for 125kbps LE Coded Programmable output power up to +5 dBm Suitable for systems targeting compliance with worldwide radio frequency regulations ETSI EN 300 328, EN 300 440 Cat. 2 and 3 FCC CFR47 Part 15 ARIB STD-T66 Few External Components 25.45 mm 16.7 mm 2.2 mm, 40 pin LCC Package Active-Mode RX: 6.4 mA Active-Mode TX at +5 dBm: 9.7 mA Active-mode CoreMark: 3.1 mA 0.9 A standby mode, RTC, 144KB RAM 0.1 A shutdown mode, wake-up on pin Layout Low Power Wide supply voltage range: 1.9 3.8V Peripherals Application Digital peripherals can be routed to any GPIO Four 32-bit or eight 16-bit general-purpose timers 12-bit ADC, 200k samples per second, 8 channels 8-bit DAC Two comparators Programmable current source Two UART, two SSI, I2C, I2S Real-time clock (RTC) Integrated temperature and battery monitor 2400 to 2500 MHz ISM and SRD systems with down to 4 kHz of receive bandwidth Building Automation Building security systems motion detector, electronic smart lock, door and window sensor, garage door system, gateway HVAC thermostat, wireless environmental sensor, HVAC system controller, gateway Fire safety system smoke and heat detector, fire alarm control panel (FACP) Video surveillance IP network camera Elevators and escalators elevator main control panel for elevators and escalators Industrial transport asset tracking Factory automation and control Medical Electronic point of sale (EPOS) Electronic Shelf Label (ESL) Communication equipment Wired networking wireless LAN or Wi-Fi access points, edge router, small business router Personal electronics Home theater & entertainment smart-speakers, smart display, set-top box Wearables (non-medical) smart trackers, smart clothing 5/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 2.2 Block Diagram 6/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 3. PIN Map and Signal Description Pin #
1 Pin Name GND Direction/Type Power Description Ground GPIO, high-drive capability GPIO, high-drive capability GPIO, high-drive capability 1.9V to 3.8V DIO supply GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO Ground GPIO GPIO GPIO GPIO GPIO Digital Digital Digital Digital Digital Digital Digital Digital Power Digital Digital Digital Digital Digital Digital Digital Digital Power Power Digital Digital Digital Digital Digital Power Digital 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 DIO_0 DIO_1 DIO_2 DIO_3 DIO_4 DIO_5 DIO_6 DIO_7 VDDS2 DIO_8 DIO_9 DIO_10 DIO_11 DIO_12 DIO_13 DIO_14 DIO_15 VDDS3 nRESET DIO_16 DIO_17 GND DIO_18 DIO_19 DIO_20 DIO_21 DIO_22 VDD DIO_23 DIO_24 DIO_25 DIO_26 DIO_27 DIO_28 DIO_29 DIO_30 GND JTAG_TMSC Digital I/O JTAG_TMSC, high-drive capability JTAG_TCKC Digital I/O JTAG_TCKC 1.9V to 3.8V DIO supply Digital I/O Digital I/O GPIO, JTAG_TDO, high-drive capability GPIO, JTAG_TDI, high-drive capability Digital or Analog Digital or Analog Digital or Analog Digital or Analog Digital or Analog Digital or Analog Digital or Analog Digital or Analog Power 1.9V to 3.8V main chip supply Reset, active-low, with internal pull-up GPIO, Analog capability GPIO, Analog capability GPIO, Analog capability GPIO, Analog capability GPIO, Analog capability GPIO, Analog capability GPIO, Analog capability GPIO, Analog capability Ground 7/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 3.1 Reference Circuit 8/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 4. ELECTRICAL CHARACTERISTICS 4.1 Recommended Operating Range PARAMETER Operating ambient temperature range, TA Operating supply voltage CONDITIONS For operation in battery-powered and 3.3V systems MIN NOM MAX UNIT 40 85 C 1.9 3.8 V 4.2 Power Consumption Unless noted, all specifications are at 25 C and Vbat = 3.0 V. PARAMETER Reset and Shutdown Standby with cache retention Power consumption radio RX Power consumption radio TX Power consumption radio TX TEST CONDITIONS 1. Reset. RESET_N pin asserted or VDDSbelo power-on-reset threshold 2. Shutdown. No clocks running, no retention RTC running, CPU, 144KB RAM, and (partial) register retention. XOSC_LF With DC/DC With DC/DC, 0 dBm output power With DC/DC, 5 dBm output power MIN TYP 100 MAX UNIT nA 2.4 6.4 7.3 9.7 uA mA mA mA 9/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 5. RF Characteristics 125 kbps LE Coded Unless noted, all specifications are at 25 C, Vbat = 3.0 V and fRF = 2440MHz. PARAMETER RX Receiver sensitivity TEST CONDITIONS Differential mode. BER = 103 MIN TYP
-101 MAX UNIT dBm 500 kbps LE Coded PARAMETER RX Receiver sensitivity 2 Mbps GFSK PARAMETER RX Receiver sensitivity TEST CONDITIONS Differential mode. BER = 103 MIN TYP
-98 MAX UNIT dBm TEST CONDITIONS Differential mode, measured in 50 single-ended, BER=10-
3 MIN TYP
-91 MAX UNIT dBm 1 Mbps GFSK TEST CONDITIONS PARAMETER Differential mode, measured in 50 single-ended, BER=10-
RX Receiver sensitivity 3 Differential mode, delivered to a single-ended 50 load Max output power through a balun Output power programmable range Delivered to a single-ended 50- load through a balun Spurious emission conducted measurement f < 1 GHz, outside restricted bands f < 1 GHz, restricted bands ETSI f < 1 GHz, restricted bands FCC f > 1 GHz, including harmonics MIN MAX UNIT dBm TYP
-96
+5 26
<-36
<-54
<-55
<-42 dBm dBm dBm dBm dBm dBm Note:
(1) BM10_AN R3 module is with Internal bias mode design and related SW setting need to match with Internal bias mode.
(2) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2(Europe)and 3, FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).
(3) To review TI measured of documentation, navigate to the device product folder on ti.com (CC2652R7) 10/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 6. Mechanical Information 11/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 7. PCB Layout Recommendation 12/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 8. Module Placement and Layout Guide Placement Note: Please refer to BM10_AN R3 Module_Placement guideline v1.0.pdf Layout Note: Do not route any trace under the module to avoid interference.
(O) (X) 13/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 9. SMT Solder Reflow Recommendation Note: Allowable reflow soldering times: 2 times based on recommended reflow profile. 14/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification 10. Product and Documentation Support 10.1. Development Support TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrated and debug software and hardware modules. The following products support the development of the CC2652 R7 device applications:
Tools and Software:
The CC2652R7 device is supported by a variety of software and hardware development tools. Development Kit:
The CC2652R7 LaunchPad Development Kit enables the development of high-performance wireless applications that benefit from the low-power operation. The kit features the CC2652R7 SimpleLink Wireless MCU, which allows you to quickly evaluate and prototype 2.4-GHz wireless applications such as Bluetooth 5 Low Energy, Zigbee, and Thread, plus combinations of these. The kit works with the LaunchPad ecosystem, easily enabling additional functionality like sensors, display, and more. The built-in EnergyTrace software is an energy-based code analysis tool that measures and displays the applications energy profile and helps to optimize it for ultra-low-power consumption. See Table 5-1 for guidance in selecting the correct device for single-protocol products. Software:
The SimpleLink CC13xx and CC26xx Software Development Kit (SDK) provide a complete package for the development of wireless applications on the CC13XX / CC26XX family of devices. The SDK includes a comprehensive software package for the CC2652R7 device, including the following protocol stacks:
Bluetooth Low Energy 4 and 5.2 Thread (based on OpenThread) Zigbee 3.0 Wi-SUN TI 15.4-Stack - an IEEE 802.15.4-based star networking solution for Sub-1 GHz and 2.4 GHz Proprietary RF - a large set of building blocks for building proprietary RF software Multiprotocol support - concurrent operation between stacks using the Dynamic Multiprotocol Manager (DMM) The SimpleLink CC13XX-CC26XX SDK is part of TIs SimpleLink MCU platform, offering a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. For more information about the SimpleLink MCU platform, visit http://www.ti.com/simplelink. Development Tools:
Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking you through each step of the application development flow. Familiar tools and interfaces allow users to get started faster than ever before. Code Composer Studio combines the advantages of the Eclipse software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment for embedded developers. CCS has support for all SimpleLink Wireless MCUs and includes support for EnergyTrace software
(application energy usage profiling). A real-time object viewer plugin is available for TI-RTOS, part of the SimpleLink SDK. Code Composer Studio is provided free of charge when used in conjunction with the XDS debuggers included on a LaunchPad Development Kit. 15/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification Code Composer Studio (CCS) Cloud is a web-based IDE that allows you to create, edit and build CCS and Energia projects. After you have successfully built your project, you can download and run it on your connected LaunchPad. Basic debugging, including features like setting breakpoints and viewing variable values, is now supported with CCS Cloud. IAR Embedded Workbench is a set of development tools for building and debugging embedded system applications using assembler, C and C++. It provides a completely integrated development environment that includes a project manager, editor, and build tools. IAR has support for all SimpleLink Wireless MCUs. It offers broad debugger support, including XDS110, IAR I-jet, and Segger J-Link. A real-time object viewer plugin is available for TI-RTOS, part of the SimpleLink SDK. IAR is also supported out-of-the-box on most software examples provided as part of the SimpleLink SDK. A 30-day evaluation or a 32 KB size-limited version is available through iar.com. SmartRF Studio is a Windows application that can be used to evaluate and configure SimpleLink Wireless MCUs from Texas Instruments. The application will help designers of RF systems to easily evaluate the radio at an early stage in the design process. It is especially useful for the generation of configuration register values and practical testing and debugging of the RF system. SmartRF Studio can be used either as a standalone application or together with applicable evaluation boards or debug probes for the RF device. Features of the SmartRF Studio include:
Link tests - transmit and receive packets between nodes Antenna and radiation tests - set the radio in continuous wave TX and RX states Link Export radio configuration code for use with the TI SimpleLink SDK RF driver Custom GPIO configuration for signaling and control of external switches Sensor Controller Studio is used to write, test and debug code for the Sensor Controller peripheral. The tool generates a Sensor Controller Interface driver, a set of C source files compiled into the System CPU application. These source files also contain the Sensor Controller binary image and allow the System CPU application to control and exchange data with the Sensor Controller. Features of the Sensor Controller Studio include:
Ready-to-use examples for several common use cases Full toolchain with built-in compiler and assembler for programming in a C-like programming language Provides rapid development by using the integrated sensor controller task testing and debugging functionality, including visualization of sensor data and verification of algorithms CCS UniFlash is a standalone tool used to program on-chip flash memory on TI MCUs. UniFlash has a GUI, command line, and scripting interface. CCS UniFlash is available free of charge. For a complete listing of development-support tools for the CC2652R7 platform, visit the Texas Instruments website athttp://www.ti.com. Contact InnoComm Mobile Technology Corporation sales office or authorized distributor for information on pricing and availability. 10.2. Documentation Support To receive notification of documentation updates on data sheets, errata, application notes, and similar, navigate to the device product folder on ti.com/product/CC2652R7. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. The current documentation that describes the CC2652R7 devices, related peripherals, and other technical collateral is listed in the following. TI Resource Explorer Software examples, libraries, executables, and documentation are available for your device and development board. Errata The silicon errata describes the known exceptions to the functional specifications for each silicon revision of the device and description on how to recognize a device revision. 16/17 InnoComm Mobile Technology Confidential REV 1.0 02/11/2022 iCOM_BM10_AN R3 Module Product Specification Application Reports All application reports for the CC2652R7 device are found on the device product folder at:
ti.com/product/CC2652R7/#tech-docs. Technical Reference Manual (TRM) The TRM provides a detailed description of all modules and peripherals available in the device family. 10.3. Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 17/17 InnoComm Mobile Technology Confidential