WB15 User Guide Copyright and third-party information as required www.innocomm.comii Revisions History Version Number Document Changes Initial Draft Official release Add Disclaimer; Add Chapter1.5 Update Diagram Remove Optional I/O J103 Date 2019/02/15 2019/04/02 2019/08/02 2019/08/21 2019/10/17 0.0 1.0 1.1 1.2 1.3 Disclaimer WB15 SOM are supplied as is and without warranties of any kind, express, implied, or statutory including, but not limited to, any implied warranty for a particular purpose. No license is granted by implication or otherwise under any patents or other intellectual property by application or use of evaluation boards. Information furnished by InnoComm is believed to be accurate and reliable. InnoComm reserves the right to change specifications or product description in this document at any time without notice. Should Buyer purchase or use InnoComms products for any such unintended or unauthorized application, Buyer shall indemnify and hold InnoComm harmless against all claims and damages. InnoComm is the trademarks of InnoComm Mobile Technology Corp.Other trademarks and registered trademarks mentioned herein are the property of their respective owners. www.innocomm.comiii Table of Contents 1 Overview ................................................................................................................................................................................. 5 1.1 ... General Information ......................................................................................................................................................... 5 1.2 ... Architecture and Block Diagram ................................................................................................................................ 6 1.3 ... Feature Summary .............................................................................................................................................................. 6 1.4 ... Dimension .............................................................................................................................................................................. 7 1.5 ... Electrical Specification .................................................................................................................................................... 8 2 Main Hardware Components ......................................................................................................................................... 8 2.1 ... CPU ......................................................................................................................................................................................... 10 2.2 ... Memory ................................................................................................................................................................................ 10 2.3 ... Power Management IC ................................................................................................................................................. 10 2.4 ... eMMC Storage ................................................................................................................................................................... 11 2.5 ... Wi-Fi/Bluetooth Module .............................................................................................................................................. 11 3 WB15 iMX8M Mini Interfaces and Connectors .................................................................................................... 12 3.1 ... J101 Connector ................................................................................................................................................................. 12 3.2 ... J102 Connector ................................................................................................................................................................. 13 3.3 ... Power Signals .................................................................................................................................................................... 15 3.4 ... Ethernet ............................................................................................................................................................................... 15 3.5 ... USB ......................................................................................................................................................................................... 15 3.6 ... UARTs ................................................................................................................................................................................... 16 3.7 ... I2Cs......................................................................................................................................................................................... 16 3.8 ... eCSPI...................................................................................................................................................................................... 17 3.9 ... DSI Interface ...................................................................................................................................................................... 17 3.10 . SD/MMC ............................................................................................................................................................................... 18 3.11 . SAIs......................................................................................................................................................................................... 18 3.12 . SPDIF ..................................................................................................................................................................................... 20 4 User interface Getting start .......................................................................................................................................... 20 5 Reference Documents ..................................................................................................................................................... 21 www.innocomm.comiv 1 Overview 1.1 General Information WB15i.MX8M Mini SOM is a high-performance System on Module(SOM) which is designed based on NXPi.MX8MMini processor. i.MX8MMini integrate fourARM Cotex-A53up to 1.8GHz and oneCotex-M4 core processor for low power processingto provide industry-leading audio voiceprocessing for applications that scale from consumer home audio to voice assistance.It supports 1080p video encode and decode. WB15i.MX8M Mini SOM offers a wide range of interfaces - GPIOs,I2C, SPI, DSI,CSI, UART, USB, RGMII and synchronous audio interface (SAI) that supports full duplex serial interfaces with frame synchronization, such as I2S, AC97, TDM, and codec/DSP interfaces. www.innocomm.com5 1.2 Architecture and Block Diagram Figure 1-1 WB15 SOM Block Diagram 1.3 Feature Summary 1GB LPDDR4 RAM 8GB eMMC 1 x MIPI DSI 1 x MIPI CSI NXP i.MX8M Mini CPU Wi-Fi 802.11 a/b/g/n/ac, 2x2 MIMO Bluetooth 4.2 1 x USB 2.0 OTG 1 x USB 2.0 Host 1x RGMII interface 1 x SD/MMC Serial interfaces (2 x I2C, 3 x UART, 1 x SPI, 3 x SAI) 9 x GPIOs 1x PDM 1x SPDIF www.innocomm.com6 1.4 Dimension The dimension of WB15i.MX8M Mini SOM is 45mm x 42mm x 0.8mm. www.innocomm.com7 1.5 Electrical Specification Symbol Parameter Minimum Maximum Unit VSYS_5V5V input 2.7 5.5 V NVCC_ENET_2V5 NVCC_ENET input 2.25 2.75 V Table 1: Input Power Absolute Maximum Ratings Symbol Parameter Minimum Maximum Unit VDD_3V3 VDDIO_3V3 3.267 3.333 V VDD_1V8 VDDIO_1V8 1.782 1.818 V Table 2: Output Power Absolute Maximum Ratings IVSYS_5V 5V Current 260 850 mA Symbol Parameter Typical Maximum Unit Table 3: Input Current Absolute Maximum Ratings 2 Main Hardware Components WB15-i.MX8M Mini SOM has two75-pin M.2 E-key golden finger.It integrates the NXPi.MX8M Mini, LPDDR4 Memory,eMMC, Power Manage IC (PMIC), and Wi-Fi/Bluetooth on the module. Figure 2-1 Top side of WB15 SOM www.innocomm.com8 Figure 2-2 Bottom side of WB15 SOM www.innocomm.com9 2.1 CPU The i.MX8M Mini processor integrate four ARM Cotex-A53 up to 1.8GHz and one Cotex-M4 coresto provide industry-leading audio, voice and video processing for applications. The features of i.MX 8M Mini processors include the following:
4xARM Cortex-A53 plus ARM Cortex-M4 L1 Instruction Cache 32 KB L1 Instruction Cache for A53 16 KBL1 Instruction Cache for M4 L1 Data Cache (each core) 32 KB L1 Data Cache (A7) 16 KB L1Data Cache (M4) The ARM Cortex-A53 Core complex shares General interrupt controller (GIC) Global timer Unified instruction and data (1MB) Snoop control unit (SCU) 2.2 Memory 2.3 Power Management IC WB15 SOM is available with up to 2GB of LPDDR4 memory. The default configuration is 1GB LPDDR4. WB15 SOM featuresRohm BD71847MWV power management IC. BD71847MWV is a programmable power management IC integrates 6 buck regulators and 6 LDOs to provide all power rails required by SoC and peripherals. For system management, it provides the following features, Support software shutdown or hardware power off External wakeup source PWROK signal for reset or power off Output monitor OVP, UVLO, TSD www.innocomm.com10 2.4 eMMC Storage The onboard eMMC device is connected on the SD3 pins of the i.MX 8MMini processor in an 8bit width configuration. 2.5 Wi-Fi/Bluetooth Module The WB15 adopts MurataSP-XV1VA-Acombo module that integrates wireless local area network802.11 a/b/g/n/ac2x2 MIMO and Bluetooth 4.2. www.innocomm.com11 3 WB15 iMX8MMini Interfaces and Connectors WB-15 use two M.2 E-key golden finger to connect with carrier board. The tables below detail the pin assignment and functionality of these connectors. J101 Pin#
Signal Name i.MX8M Mini Voltage J101 Pin#
Signal Name i.MX8M Mini Voltage 3.1 J101 Connector Table 3-1 J101 Connector 1 PDM_DATA3 3 PDM_DATA1 5 PDM_DATA2 7 SAI1_TXD2 9 SAI1_TXD1 11 SAI1_TXD3 13 GND Pin #
AC13 AC14 AD13 AG21 AF20 AF21
. 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 2 SAI1_TXFS 4 SAI1_TXD0 6 SAI1_TXC 8 PDM_DATA0 10 GND 12 PDM_CLK 14 GND www.innocomm.com12 Pin #
AB19 AG20 AC18 AD18
. 3.3V 3.3V 3.3V 3.3V
. AC15 3.3V 15 SAI1_MCLK AB18 3.3V 16 SAI1_RXD1 AF15 3.3V 32 NVCC_ENENT_2V5 5V 34 GND AG24 3.3V
. A23 B23 F23 D23 AG10 AF10 E6
. A8 B8 A6 F15 E15 D6 B7 D10 D9
. 3.3V 44 ENET_TD3 18 SAI1_RXD0 20 SAI1_RXFS 22 SAI1_RXC 36 ENET_TXC 38 GND 40 ENET_TX_CTL 42 ENET_TD2 56 ENET_RX_CTL 46 ENET_TD0 48 ENET_TD1 50 GND 52 ENET_RXC 54 GND 58 ENET_RD0 60 ENET_RD2 62 ENET_RD1 64 ENET_RD3 66 GND 70 ENET_MDIO 72 ONOFF 74 SYS_nRST 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 5V AG9 3.3V 68 ENET_MDC 17 GND 19 USB1_DN 21 USB1_DP 23 GND 33 USB1_VBUS 35 USB1_ID 37 GPIO1_IO08 39 GPIO1_IO09 41 GND 43 ECSPI2_SCLK 45 GND 47 ECSPI2_MISO 49 ECSPI2_MOSI 51 ECSPI2_SS0 53 UART2_RXD 55 UART2_TXD 57 UART3_RXD 59 UART3_TXD 61 I2C2_SCL 63 I2C2_SDA 65 GND 67 SPDIF_RX 69 VDD_3V3 71 GND 73 GND 75 VSYS_5V 3.2 J102 Connector 3.3V 3.3V 3.3V 2.5V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V AG15 AG16 AF16
. AF24 AG25 AF25 AG26 AF26 AF27 AE27 AD26 AD27 AC26
. AC27 AB27 A25
. AE26 3.3V Table 3-2 J102 Connector Signal Name Voltage Signal Name Voltage J102 Pin#
1 3 GND PCIE_CLKN i.MX8M Mini Pin #
. A21 J102 Pin#
3.3V 2 4 SD2_CLK GND i.MX8M Mini Pin #
W23
. 3.3V www.innocomm.com13 6 8 10 12 14 16 18 32 34 36 SD2_nRST SD2_CMD SD2_DATA0 SD2_DATA1 SD2_DATA2 SD2_DATA3 SD2_nCD 20 GND 22 USB2_VBUS SPDIF_TX BOOT_MODE0 BOOT_MODE1 38 UART4_RXD 40 UART4_TXD 42 44 I2C3_SCL I2C3_SDA 46 GND 48 DSI_DN3 50 DSI_DP3 52 GND 54 DSI_DN2 56 DSI_DP2 58 GND 60 DSI_DN1 64 GND 66 DSI_DN0 68 DSI_DP0 70 GND 72 DSI_CKN 74 DSI_CKP AB26 AA27 AB23 AB24 V24 V23 AA26
. F23 AF9 G26 G27 F19 F18 E10 F10 A13 B13
. A12 B12 A10 B10
. A9 B9
. A11 B11 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 5V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V
. 3.3V 3.3V 41 SAI2_MCLK AD19 3.3V 5 7 9 PCIE_CLKP GND PCIE_RXN 11 PCIE_RXP 13 GND 15 17 PCIE_TXN PCIE_TXP 19 GND 21 USB2_DN 23 USB2_DP 33 35 37 SAI2_RXD SAI2_RXFS SAI2_RXC 39 GND 43 GND 51 GND SAI2_TXD SAI2_TXFS SAI2_TXC SAI1_RXD5 SAI1_RXD6 SAI1_RXD4 59 GND 63 GND SAI3_TXD SAI3_TXFS SAI3_TXC SAI1_TXD7 SAI1_TXD4 71 GND 45 47 49 53 55 57 65 67 69 73 75 B21 A19 B19
. A20 B20 A23 B23 AC24 AC19 AB22
. AC22 AD23 AD22 AF18 AG19 AG18 AF6 AC6 AG6 AF23 AG22 www.innocomm.com14 61 SAI3_MCLK AD6 3.3V 62 DSI_DP1 3.3 Power Signals Table 4-1 Power Signal Pins Function VSYS_5V VDD_3V3 I/O Description Input power 5V 3.3V IO power I O O NVCC_ENET_2V5 2.5V Ethernet Power 3.4 Ethernet One RGMII interface is supported. Connector PIN#
J101 21 J101 36, 40, 42,44,46, 48, 52, 56, 58, 60, 62, 64, 68 3.5 USB Table 4-3 Ethernet Signal Pins Function I/O Description NVCC_ENET_2V5 O Ethernet POWER RGMII interface IO RGMII The USB interface which provides high speed USB functionality conforms to the USB2.0. The OTG controller conforms to OTG2.0 specification. Table 4-4 USB Signal Pins Function I/O Description USB1_VBUS USB1_ID USB2_VBUS USB1_DP USB1_DN USB2_DP USB2_DN I I I USB1_VBUS USB1_ID USB2_VBUS IO USB1_DP IO USB1_DN IO USB2_DP IO USB2_DN www.innocomm.com15 Connector PIN#
J101 71, 73, 75 J101 69 J101 32 Connector PIN#
J101 33 J101 35 J102 22 J101 21 J101 19 J102 23 J102 21 3.6 UARTs Each of the UART interface support the followingserial data transmit/receive protocols andconfigurations:
7- or 8-bit data words, 1 or 2 stop bits, programmable parity (even, odd or none) Programmable baud rates up to 4 Mbps. This is a higher max baud rate relative to the 1.875 MHz, which is stated by the TIA/EIA-232-F standard. 32-byte FIFO on Tx and 32 half-word FIFO on Rx supporting auto-baud I2Cs Connector PIN#
J101 55 J101 53 J102 40 J101 38 J101 59 J101 57 3.7 Connector PIN#
J102 44 J102 42 J101 61 J101 63 www.innocomm.com16 Table 4-5 UART Signal Pins Function I/O Description UART2_TXD O UART2_TXD UART2_RXD I UART2_RXD UART4_TXD O UART4_TXD UART4_RXD I UART4_RXD UART3_TXD O UART3_TXD UART3_RXD I UART3_RXD Table 4-6 I2C Signal Pins Function I2C3_SDA I2C3_SCL I2C2_SCL I2C2_SDA I/O Description IO I2C3_SDA IO I2C3_SCL IO I2C2_SCL IO I2C2_SDA WB15 hasTWO I2C interfaces which provide serial interface for external devices. Datarates of up to 400 kbps are supported. 3.8 eCSPI WB15supports one full-duplex Enhanced Configurable Serial Peripheral Interface (ECSPI). The ECSPI contain a 64x32 receive buffer and a 64x32 transmit buffer. 3.9 DSI Interface WB15 provides a 4-lanes MIPI display interface operating up to 1080p60 resolution. Table 4-8 DSI Signal Pins Connector PIN#
J101 49 J101 47 J101 43 J101 51 Connector PIN#
J102 74 J102 72 J102 68 J102 66 J102 62 J102 60 J102 56 J102 54 J102 50 J102 48 www.innocomm.com17 Table 4-7eSPI Signal Pins Function I/O Description ECSPI2_MOSI O ECSPI2_MOSI ECSPI2_MISO I ECSPI2_MISO ECSPI2_SCLK O ECSPI2_SCLK ECSPI2_SS0 O ECSPI2_SS0 Function DSI_CLKP DSI_CLKM DSI_D0P DSI_D0M DSI_D1P DSI_D1M DSI_D2P DSI_D2M DSI_D3P DSI_D3M I/O Description O DSI_CLKP O DSI_CLKM O DSI_D0P O DSI_D0M O DSI_D1P O DSI_D1M O DSI_D2P O DSI_D2M O DSI_D3P O DSI_D3M 3.10 SD/MMC Fully compatible with MMC command/response setand Physical Layer as defined in the MultimediaCard System Specification,v5.0/v4.4/v4.41/v4.4/v4.3/v4.2. Fully compatible with SD command/response sets and Physical Layer as defined in the SD Memory Card Specifications v 3.0 including high-capacity SDXC cards up to 2 TB. Fully compatible with SDIO command/response sets and interrupt/Read-Wait mode as defined in the SDIO Card Specification, Part E1, v. 3.0 Connector PIN#
J102 6 J102 8 J102 18 J102 10 J102 12 J102 14 J102 16 Table 4-11 SD/MMC Signal Pins Function SD2_nRST SD2_CMD I/O Description O SD2 Rest O SD2_CMD SD2_nSDCD I SD2 Card detection SD2_DATA0 IO SD2_DATA0 SD2_DATA1 IO SD2_DATA1 SD2_DATA2 IO SD2_DATA2 SD2_DATA3 IO SD2_DATA3 3.11 SAIs The SAI interface provides a synchronous audiointerface (SAI) that supports full duplex serial interfaceswith frame synchronization, such as I2S, AC97, TDMand codec/DSP interfaces. Table 4-12 SAI1 Signal Pins Connector PIN#
Function J101 15 J101 22 J101 20 J101 18 J101 16 J102 3 J102 SAI1_MCLK SAI1_RXC SAI1_RXFS SAI1_RXD0 SAI1_RXD1 SAI1_RXD2 SAI1_RXD3 www.innocomm.com18 I/O O I I I I I I Description SAI1_MCLK SAI1_RXC SAI1_RXFS SAI1_RXD0 SAI1_RXD1 SAI1_RXD2 SAI1_RXD3 SAI1_RXD4 SAI1_RXD5 SAI1_RXD6 SAI1_TXFS SAI1_TXC SAI1_TXD0 SAI1_TXD1 SAI1_TXD2 SAI1_TXD3 SAI1_TXD4 SAI1_TXD7 SAI2_MCLK SAI2_RXC SAI2_RXFS SAI2_RXD SAI2_TXC SAI2_TXFS SAI2_TXD SAI3_MCLK SAI3_TXC SAI3_TXFS SAI3_TXD Connector PIN#
Function I/O Description Table 4-13 SAI2,3,5 Signal Pins I I I O O O O O O O O O I I I O O O O O O O SAI1_RXD4 SAI1_RXD5 SAI1_RXD6 SAI1_TXFS SAI1_TXC SAI1_TXD0 SAI1_TXD1 SAI1_TXD2 SAI1_TXD3 SAI1_TXD4 SAI1_TXD7 SAI2_MCLK SAI2_RXC SAI2_RXFS SAI2_RXD SAI2_TXC SAI2_TXFS SAI2_TXD SAI3_MCLK SAI3_TXC SAI3_TXFS SAI3_TXD 5 J102 57 J102 53 J102 55 J101 2 J101 6 J101 4 J101 9 J101 7 J101 11 J102 75 J102 73 J102 41 J102 37 J102 35 J102 338 J102 49 J102 47 J102 45 J102 61 J102 69 J102 67 J102 65 www.innocomm.com19 3.12 SPDIF WB15 SOM supports Sony/Philips Digital Interface with 24-bit data width. Connector PIN#
J101 67 J102 32 Function SPDIF_RX SPDIF_TX Table 4-15 SPDIF Signal Pins I/O I O Description SPDIF_RX SPDIF_TX 4 User interface Getting start The SoM can function power on 5V DC input, once system start, WB15 can use EVB HDMI output or use USB sharing to external monitor for control. www.innocomm.com20 You can use App for any application like play video, music etc. 5 Reference Documents i.MX 8M Family of Applications Processors Datasheet i.MX 8MMini Applications Processor Reference Manual BD71847MWV Data sheet 1. 2. 3. 4. Murata SP-XV1VA-A Combo Wi-Fi Module Datasheet www.innocomm.com21 Antenna gain BT/LE WLAN 2.4GHz WIFI 5G www.innocomm.com22 Indoor Use Statement Caution: This product operates in the frequency band 5.1805.240 GHz. It is restricted to indoor operation only. 1. P15.21 Information to user. WARNING Notice:
Any changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment. Aucune modification apporte { lappareil par lutilisateur, quelle quen soit la nature. Tout changement ou modification peuvent annuler le droit dutilisation de lappareil par lutilisateur. 2. P15.105 Information to the user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. www.innocomm.com23 To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power
(e.i.r.p.) is not more than that permitted for successful communication. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
1. This device may not cause interference, and 2. This device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil numrique de la classe B est conforme la norme NMB-003 Canada. Pour rduire le risque dinterfrence aux autres utilisateurs, le type dantenne et son gain doivent tre choisies de faon que la puissance isotrope rayonne quivalente (PIRE) ne dpasse pas ce qui est ncessaire pour une communication russie. Cet appareil est conforme la norme RSS Industrie Canada exempts de licence norme(s). Son fonctionnement est soumis aux deux conditions suivantes:
1. Cet appareil ne peut pas provoquer dinterfrences et 2. Cet appareil doit accepter toute interfrence, y compris les interfrences qui peuvent causer un mauvais fonctionnement du dispositif. 3. P15.19 FCC Labelling requirements Notice:
This device complies with Part 15 of the FCC Rules and Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils www.innocomm.com24 radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. 4.FCC/IC RF Radiation Exposure Statement:
FCC 1. This Transmitter must not be colocated or operating in conjunction with any other antenna or transmitter. 2. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. Caution:
1.L'metteur ne doit pas tre colocalis ni fonctionner conjointement avec autre antenne ou autre metteur. 2.Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non contrl. L'antenne doit tre install de faon garder une distance minimale de 20 centimtres entre la source de rayonnements et votre corps. 1) The device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
2) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit;
3) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits specified for point-to-point and non-point-to-point operation as appropriate;
and The high-power radars are allocated as primary users (i.e. priority users) of the bands 5250-5350 MHz and 5650-5850 MHz and that these radars could cause interference and/or damage to LE-LAN devices. www.innocomm.com25 DFS (Dynamic Frequency Selection) products that operate in the bands 5250- 5350 MHz, 5470-5600MHz, and 5650-5725MHz. Avertissement:
1) Le dispositif fonctionnant dans la bande 5150-5250 MHz est rserv uniquement pour une utilisation lintrieur afin de rduire les risques de brouillage prjudiciable aux systmes de satellites mobiles utilisant les mmes canaux;
2) Le gain maximal dantenne permis pour les dispositifs avec antenne(s) amovible(s) utilisant les bandes 5250-5350 MHz et 5470-5725 MHz doit se conformer la imitation P.I.R.E.;
3) Le gain maximal dantenne permis pour les dispositifs avec antenne(s) amovible(s) utilisant la bande 5725-5850 MHz doit se conformer la limitation P.I.R.E spcifie pour l exploitation point point et non point point, selon le cas. En outre, les utilisateurs devraient aussi tre aviss que les utilisateurs de radars de haute puissance sont dsigns utilisateurs principaux (c.--d., quils ont la priorit) pour les bandes 5250-5350 MHz et 5650-5850 MHz et que ces radars pourraient causer du brouillage et/ou des dommages aux dispositifs LAN-EL. Les produits utilisant la technique dattnuation DFS (slection dynamique des rquences) sur les bandes 5250- 5350 MHz, 5470-5600MHz et 5650-5725MHz. Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Dclaration dexposition aux radiations:
Cet quipement est conforme aux limites dexposition aux rayonnements IC tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. www.innocomm.com26 5.FCC/IC RF Radiation Exposure Statement:
This radio transmitter [20480-WB15] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Cet metteur radio [20480-WB15] a t approuv par Innovation, Sciences et Dveloppement conomique Canada pour fonctionner avec les types d'antenne numrs ci-dessous, avec le gain maximal autoris indiqu. Les types d'antennes non inclus dans cette liste qui ont un gain suprieur au gain maximum indiqu pour tout type rpertori sont strictement interdits pour l'utilisation avec cet appareil. Notice to OEM integrator Must use the device only in host devices that meet the FCC/ISED RF exposure category of mobile, which means the device is installed and used at distances of at least 20cm from persons. The end user manual shall include FCC Part 15 /ISED RSS GEN compliance statements related to the transmitter as show in this manual. Host manufacturer is responsible for compliance of the host system with module installed with all other applicable requirements for the system such as Part 15 B, ICES 003. Host manufacturer is strongly recommended to confirm compliance with FCC/ISED requirements for the transmitter when the module is installed in the host. Must have on the host device a label showing Contains FCC ID: YAIWB15IC: 20480-WB15 l'hte doit utiliser l'instrument uniquement dans des dispositifs qui rpondent la fcc / (cat gorie d'exposition rf www.innocomm.com27 mobile, ce qui signifie le dispositif est install et utilis une distance d'au moins 20 cm de personnes. le manuel de l'utilisateur final doit inclure la partie 15 / (fac rss gen dclarations de conformit relatives l'metteur que de montrer dans ce manuel. le fabricant est responsable de la conformit de l'hte, le systme d'accueil avec le module install avec toutes les autres exigences applicables du systme comme la partie 15 b, ices - 003. accueillir le fabricant est fortement recommand de confirmer la conformit avec les exigences de la fcc
(metteur lorsque le module est install dans l'hte. le dispositif d'accueil doivent avoir une tiquette indiquant contient FCC ID: YAIWB15IC:
20480-WB15 www.innocomm.com28 InnoComm Mobile Technology Corporation 6 3 3F, No.6, HsinAnn Rd, Hsinchu Science Park, Hsinchu 30078, Taiwan 03-578-1868 www.innocomm.com29