User Manual
無線音頻模組Wireless Audio Module
Brand Name: InnoComm
Model Name: WB17
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WB17
User Guide
Copyright and third-party information as required
www.innocomm.comii
Revisions History
Date
2021/06/22
2021/08/09
Version
Number
0.0
0.1
Document Changes
Initial Draft
Statement update
Disclaimer
WB17 SOM are supplied “as is” and without warranties of any kind, express, implied, or statutory
including, but not limited to, any implied warranty for a particular purpose. No license is granted by
implication or otherwise under any patents or other intellectual property by application or use of
evaluation boards. Information furnished by InnoComm is believed to be accurate and reliable.
InnoComm reserves the right to change specifications or product description in this document at any
time without notice.
Should Buyer purchase or use InnoComm’s products for any such unintended or unauthorized
application, Buyer shall indemnify and hold InnoComm harmless against all claims and damages.
InnoComm is the trademarks of InnoComm Mobile Technology Corp. Other trademarks and
registered trademarks mentioned herein are the property of their respective owners.
www.innocomm.comiii
Table of Contents
1 Overview ................................................................................................................................................................................. 5
1.1 ... General Information ......................................................................................................................................................... 5
1.2 ... Architecture and Block Diagram ................................................................................................................................ 6
1.3 ... Feature Summary .............................................................................................................................................................. 6
1.4 ... Dimension .............................................................................................................................................................................. 7
1.5 ... Electrical Specification .................................................................................................................................................... 8
2 Main Hardware Components ......................................................................................................................................... 8
2.1 ... CPU ......................................................................................................................................................................................... 10
2.2 ... Memory ................................................................................................................................................................................ 10
2.3 ... Power Management IC ................................................................................................................................................. 10
2.4 ... eMMC Storage ................................................................................................................................................................... 11
2.5 ... Wi-Fi/Bluetooth Module .............................................................................................................................................. 11
3 WB17 iMX8M Mini Interfaces and Connectors .................................................................................................... 12
3.1 ... J101 Connector ................................................................................................................................................................. 12
3.2 ... J102 Connector ................................................................................................................................................................. 13
3.3 ... Power Signals .................................................................................................................................................................... 15
3.4 ... Ethernet ............................................................................................................................................................................... 15
3.5 ... USB ......................................................................................................................................................................................... 15
3.6 ... UARTs ................................................................................................................................................................................... 16
3.7 ... I2Cs......................................................................................................................................................................................... 16
3.8 ... eCSPI...................................................................................................................................................................................... 17
3.9 ... DSI Interface ...................................................................................................................................................................... 17
3.10 . SD/MMC ............................................................................................................................................................................... 18
3.11 . SAIs......................................................................................................................................................................................... 18
3.12 . SPDIF ..................................................................................................................................................................................... 20
4 User interface Getting start .......................................................................................................................................... 20
5 Reference Documents ..................................................................................................................................................... 21
www.innocomm.comiv
1 Overview
1.1 General Information
WB17 i.MX8M Mini SOM is a high-performance System on Module(SOM) which is designed based
on NXP®i.MX8MMini processor. i.MX8MMini integrate four ARM® Cotex-A53up to 1.8GHz and
oneCotex-M4 core processor for low power processing to provide industry-leading audio voice
processing for applications that scale from consumer home audio to voice assistance. It supports
1080p video encode and decode.
WB17 i.MX8M Mini SOM offers a wide range of interfaces - GPIOs,I2C, SPI, DSI,CSI, UART, USB,
RGMII and synchronous audio interface (SAI) that supports full duplex serial interfaces with frame
synchronization, such as I2S, AC97, TDM, and codec/DSP interfaces.
www.innocomm.com5
1.2 Architecture and Block Diagram
Figure 1-1 WB17 SOM Block Diagram
1.3 Feature Summary
NXP i.MX8M Mini CPU
1GB LPDDR4 RAM
8GB eMMC
1 x MIPI DSI
1 x MIPI CSI
Wi-Fi 802.11 a/b/g/n/ac, 2x2 MIMO
Bluetooth 5.x
1 x USB 2.0 OTG
1 x USB 2.0 Host
1x RGMII interface
1 x SD/MMC
Serial interfaces (2 x I2C, 3 x UART, 1 x SPI, 3 x SAI)
9 x GPIOs
1x PDM
1x SPDIF
www.innocomm.com6
1.4 Dimension
The dimension of WB17 i.MX8M Mini SOM is 45mm x 42mm x 0.8mm.
www.innocomm.com7
1.5 Electrical Specification
VSYS_5V5V input 2.7 5.5 V
NVCC_ENET_2V5 NVCC_ENET input 2.25 2.75 V
Symbol Parameter Minimum Maximum Unit
Table 1: Input Power Absolute Maximum Ratings
VDD_3V3 VDDIO_3V3 3.267 3.333 V
VDD_1V8 VDDIO_1V8 1.782 1.818 V
Symbol Parameter Minimum Maximum Unit
Table 2: Output Power Absolute Maximum Ratings
Symbol Parameter Typical Maximum Unit
Table 3: Input Current Absolute Maximum Ratings
IVSYS_5V 5V Current 260 850 mA
2 Main Hardware Components
WB17 i.MX8M Mini SOM has two 75-pin M.2 E-key golden finger. It integrates the NXP®i.MX8M
Mini, LPDDR4 Memory, eMMC, Power Manage IC (PMIC), and Wi-Fi/Bluetooth on the module.
www.innocomm.com8
Figure 2-1 – Top side of WB17 SOM
Figure 2-2 – Bottom side of WB17 SOM
www.innocomm.com9
2.1 CPU
The i.MX8M Mini processor integrate four ARM® Cotex-A53 up to 1.8GHz and one Cotex-M4 cores
to provide industry-leading audio, voice and video processing for applications.
The features of i.MX 8M Mini processors include the following:
• 4xARM Cortex-A53 plus ARM Cortex-M4
•
L1 Instruction Cache
32 KB L1 Instruction Cache for A53
16 KBL1 Instruction Cache for M4
•
L1 Data Cache (each core)
32 KB L1 Data Cache (A7)
16 KB L1Data Cache (M4)
The ARM Cortex-A53 Core complex shares
General interrupt controller (GIC)
Global timer
Unified instruction and data (1MB)
Snoop control unit (SCU)
2.2 Memory
•
2.3 Power Management IC
WB17 SOM is available with up to 2GB of LPDDR4 memory. The default configuration is 1GB
LPDDR4.
WB17 SOM features ROHM BD71847MWV power management IC. BD71847MWV is a
programmable power management IC integrates 6 buck regulators and 6 LDOs to provide all
power rails required by SoC and peripherals.
For system management, it provides the following features,
Support software shutdown or hardware power off
External wakeup source
PWROK signal for reset or power off
Output monitor
OVP, UVLO, TSD
www.innocomm.com10
2.4 eMMC Storage
The onboard eMMC device is connected on the SD3 pins of the i.MX 8MMini processor in an
8bit width configuration.
2.5 Wi-Fi/Bluetooth Module
The WB17 adopts Murata SP-XV1XA-A combo module that integrates wireless local area
network 802.11 a/b/g/n/ac2x2 MIMO and Bluetooth 5.x.
www.innocomm.com11
3 WB17 iMX8M Mini Interfaces and Connectors
WB17 use two M.2 E-key golden finger to connect with carrier board.
The tables below detail the pin assignment and functionality of these connectors.
3.1
J101 Connector
Table 3-1 J101 Connector
J101
Pin#
Signal Name
i.MX8M Mini
Pin #
Voltage
J101
Pin#
Signal Name
i.MX8M Mini
Pin #
Voltage
1 PDM_DATA3
3 PDM_DATA1
5 PDM_DATA2
7 SAI1_TXD2
9 SAI1_TXD1
11 SAI1_TXD3
13 GND
AC13
AC14
AD13
AG21
AF20
AF21
.
3.3V
3.3V
3.3V
3.3V
2 SAI1_TXFS
4 SAI1_TXD0
6 SAI1_TXC
8 PDM_DATA0
3.3V
10 GND
14 GND
3.3V
12 PDM_CLK
AC15
3.3V
15 SAI1_MCLK
AB18
3.3V
16 SAI1_RXD1
AF15
3.3V
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AB19
AG20
AC18
AD18
.
.
3.3V
3.3V
3.3V
3.3V
.
.
32 NVCC_ENENT_2V5
5V
34 GND
36 ENET_TXC
AG24
3.3V
.
.
A23
B23
F23
D23
AG10
AF10
E6
.
.
A8
B8
A6
F15
E15
D6
B7
D10
D9
.
.
.
.
.
18 SAI1_RXD0
20 SAI1_RXFS
22 SAI1_RXC
3.3V
38 GND
3.3V
40 ENET_TX_CTL
42 ENET_TD2
3.3V
44 ENET_TD3
46 ENET_TD0
3.3V
48 ENET_TD1
3.3V
3.3V
50 GND
52 ENET_RXC
3.3V
54 GND
3.3V
56 ENET_RX_CTL
3.3V
58 ENET_RD0
3.3V
60 ENET_RD2
3.3V
3.3V
62 ENET_RD1
64 ENET_RD3
66 GND
70 ENET_MDIO
72 ONOFF
74 SYS_nRST
5V
AG9
3.3V
68 ENET_MDC
AG15
AG16
AF16
.
.
.
.
.
AF24
AG25
AF25
AG26
AF26
AF27
AE27
AD26
AD27
AC26
.
AC27
AB27
A25
.
3.3V
3.3V
3.3V
2.5V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
AE26
3.3V
17 GND
19 USB1_DN
21 USB1_DP
23 GND
33 USB1_VBUS
35 USB1_ID
37 GPIO1_IO08
39 GPIO1_IO09
41 GND
43 ECSPI2_SCLK
45 GND
47 ECSPI2_MISO
49 ECSPI2_MOSI
51 ECSPI2_SS0
53 UART2_RXD
55 UART2_TXD
57 UART3_RXD
59 UART3_TXD
61
I2C2_SCL
63
I2C2_SDA
65 GND
67 SPDIF_RX
69 VDD_3V3
71 GND
73 GND
75 VSYS_5V
J102 Connector
3.2
J102
Pin#
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Signal Name
Voltage
Signal Name
Voltage
Table 3-2 J102 Connector
J102
Pin#
i.MX8M
Mini
Pin #
.
A21
1
3
GND
PCIE_CLKN
3.3V
2
4
SD2_CLK
GND
i.MX8M
Mini
Pin #
W23
.
3.3V
6
8
10
12
14
16
18
32
34
36
SD2_nRST
SD2_CMD
SD2_DATA0
SD2_DATA1
SD2_DATA2
SD2_DATA3
SD2_nCD
20 GND
22 USB2_VBUS
SPDIF_TX
BOOT_MODE0
BOOT_MODE1
38 UART4_RXD
40 UART4_TXD
42
44
I2C3_SCL
I2C3_SDA
46 GND
48 DSI_DN3
50 DSI_DP3
52 GND
54 DSI_DN2
56 DSI_DP2
58 GND
60 DSI_DN1
64 GND
66 DSI_DN0
68 DSI_DP0
70 GND
72 DSI_CKN
74 DSI_CKP
AB26
AA27
AB23
AB24
V24
V23
AA26
.
F23
AF9
G26
G27
F19
F18
E10
F10
A13
B13
.
.
A12
B12
A10
B10
.
A9
B9
.
A11
B11
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
5V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
.
.
.
.
3.3V
3.3V
41
SAI2_MCLK
AD19
3.3V
B21
A19
B19
.
.
A20
B20
A23
B23
AC24
AC19
AB22
AC22
AD23
AD22
AF18
AG19
AG18
.
.
.
.
.
.
5
7
9
PCIE_CLKP
GND
PCIE_RXN
11
PCIE_RXP
13 GND
15
17
PCIE_TXN
PCIE_TXP
19 GND
21 USB2_DN
23 USB2_DP
33
35
37
SAI2_RXD
SAI2_RXFS
SAI2_RXC
39 GND
43 GND
51 GND
SAI2_TXD
SAI2_TXFS
SAI2_TXC
SAI1_RXD5
SAI1_RXD6
SAI1_RXD4
59 GND
63 GND
45
47
49
53
55
57
65
67
69
73
75
SAI3_TXD
SAI3_TXFS
SAI3_TXC
AF6
AC6
AG6
71 GND
SAI1_TXD7
SAI1_TXD4
AF23
AG22
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61
SAI3_MCLK
AD6
3.3V
62 DSI_DP1
3.3 Power Signals
Table 4-1 Power Signal Pins
Function
VSYS_5V
VDD_3V3
I/O
Description
Input power 5V
3.3V IO power
I
O
O
NVCC_ENET_2V5
2.5V Ethernet Power
3.4 Ethernet
One RGMII interface is supported.
Connector
PIN#
J101
21
J101
36, 40, 42,44,46, 48, 52, 56, 58, 60, 62,
64, 68
Table 4-3 Ethernet Signal Pins
Function
I/O Description
NVCC_ENET_2V5
O
Ethernet POWER
RGMII interface
IO RGMII
The USB interface which provides high speed USB functionality conforms to the USB2.0. The OTG
controller conforms to OTG2.0 specification.
Connector
PIN#
J101
71, 73, 75
J101
69
J101
32
3.5 USB
Connector
PIN#
J101
33
J101
35
J102
22
J101
21
J101
19
J102
23
J102
21
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Table 4-4 USB Signal Pins
Function
I/O Description
USB1_VBUS
USB1_ID
USB2_VBUS
USB1_DP
USB1_DN
USB2_DP
USB2_DN
I
I
I
USB1_VBUS
USB1_ID
USB2_VBUS
IO USB1_DP
IO USB1_DN
IO USB2_DP
IO USB2_DN
3.6 UARTs
Each of the UART interface support the following serial data transmit/receive protocols and
configurations:
• 7- or 8-bit data words, 1 or 2 stop bits, programmable parity (even, odd or none)
• Programmable baud rates up to 4 Mbps. This is a higher max baud rate relative to the 1.875
MHz, which is stated by the TIA/EIA-232-F standard.
• 32-byte FIFO on Tx and 32 half-word FIFO on Rx supporting auto-baud
Connector
PIN#
J101
55
J101
53
J102
40
J101
38
J101
59
J101
57
3.7
I2Cs
Connector
PIN#
J102
44
J102
42
J101
61
J101
63
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Table 4-5 UART Signal Pins
Function
I/O Description
UART2_TXD
O UART2_TXD
UART2_RXD
I
UART2_RXD
UART4_TXD
O UART4_TXD
UART4_RXD
I
UART4_RXD
UART3_TXD
O UART3_TXD
UART3_RXD
I
UART3_RXD
Table 4-6 I2C Signal Pins
Function
I2C3_SDA
I2C3_SCL
I2C2_SCL
I2C2_SDA
I/O Description
IO
I2C3_SDA
IO
I2C3_SCL
IO
I2C2_SCL
IO
I2C2_SDA
WB17 has TWO I2C interfaces which provide serial interface for external devices. Data rates of up
to 400 kbps are supported.
3.8 ECSPI
WB17supports one full-duplex Enhanced Configurable Serial Peripheral Interface (ECSPI).
The ECSPI contain a 64x32 receive buffer and a 64x32 transmit buffer.
3.9 DSI Interface
WB17 provides a 4-lanes MIPI display interface operating up to 1080p60 resolution.
Table 4-8 DSI Signal Pins
Connector
PIN#
J101
49
J101
47
J101
43
J101
51
Connector
PIN#
J102
74
J102
72
J102
68
J102
66
J102
62
J102
60
J102
56
J102
54
J102
50
J102
48
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Table 4-7eSPI Signal Pins
Function
I/O Description
ECSPI2_MOSI
O
ECSPI2_MOSI
ECSPI2_MISO
I
ECSPI2_MISO
ECSPI2_SCLK
O
ECSPI2_SCLK
ECSPI2_SS0
O
ECSPI2_SS0
Function
DSI_CLKP
DSI_CLKM
DSI_D0P
DSI_D0M
DSI_D1P
DSI_D1M
DSI_D2P
DSI_D2M
DSI_D3P
DSI_D3M
I/O Description
O DSI_CLKP
O DSI_CLKM
O DSI_D0P
O DSI_D0M
O DSI_D1P
O DSI_D1M
O DSI_D2P
O DSI_D2M
O DSI_D3P
O DSI_D3M
3.10 SD/MMC
Fully compatible with MMC command/response set and Physical Layer as defined in the
Multimedia Card System Specification, v5.0/v4.4/v4.41/v4.4/v4.3/v4.2.
Fully compatible with SD command/response sets and Physical Layer as defined in the SD
Memory Card Specifications v 3.0 including high-capacity SDXC cards up to 2 TB.
Fully compatible with SDIO command/response sets and interrupt/Read-Wait mode as
defined in the SDIO Card Specification, Part E1, v. 3.0
•
•
Connector
PIN#
J102
6
J102
8
J102
18
J102
10
J102
12
J102
14
J102
16
Table 4-11 SD/MMC Signal Pins
Function
SD2_nRST
SD2_CMD
I/O Description
O
SD2 Rest
O
SD2_CMD
SD2_nSDCD
I
SD2 Card detection
SD2_DATA0
IO
SD2_DATA0
SD2_DATA1
IO
SD2_DATA1
SD2_DATA2
IO
SD2_DATA2
SD2_DATA3
IO
SD2_DATA3
3.11 SAIs
The SAI interface provides a synchronous audio interface (SAI) that supports full duplex serial
interfaces with frame synchronization, such as I2S, AC97, TDM and codec/DSP interfaces.
Table 4-12 SAI1 Signal Pins
Connector
PIN#
Function
J101
15
J101
22
J101
20
J101
18
J101
16
J102
3
J102
SAI1_MCLK
SAI1_RXC
SAI1_RXFS
SAI1_RXD0
SAI1_RXD1
SAI1_RXD2
SAI1_RXD3
www.innocomm.com18
I/O
O
I
I
I
I
I
I
Description
SAI1_MCLK
SAI1_RXC
SAI1_RXFS
SAI1_RXD0
SAI1_RXD1
SAI1_RXD2
SAI1_RXD3
SAI1_RXD4
SAI1_RXD5
SAI1_RXD6
SAI1_TXFS
SAI1_TXC
SAI1_TXD0
SAI1_TXD1
SAI1_TXD2
SAI1_TXD3
SAI1_TXD4
SAI1_TXD7
SAI2_MCLK
SAI2_RXC
SAI2_RXFS
SAI2_RXD
SAI2_TXC
SAI2_TXFS
SAI2_TXD
SAI3_MCLK
SAI3_TXC
SAI3_TXFS
SAI3_TXD
Connector
PIN#
Function
I/O Description
Table 4-13 SAI2,3,5 Signal Pins
I
I
I
O
O
O
O
O
O
O
O
O
I
I
I
O
O
O
O
O
O
O
SAI1_RXD4
SAI1_RXD5
SAI1_RXD6
SAI1_TXFS
SAI1_TXC
SAI1_TXD0
SAI1_TXD1
SAI1_TXD2
SAI1_TXD3
SAI1_TXD4
SAI1_TXD7
SAI2_MCLK
SAI2_RXC
SAI2_RXFS
SAI2_RXD
SAI2_TXC
SAI2_TXFS
SAI2_TXD
SAI3_MCLK
SAI3_TXC
SAI3_TXFS
SAI3_TXD
5
J102
57
J102
53
J102
55
J101
2
J101
6
J101
4
J101
9
J101
7
J101
11
J102
75
J102
73
J102
41
J102
37
J102
35
J102
338
J102
49
J102
47
J102
45
J102
61
J102
69
J102
67
J102
65
www.innocomm.com19
3.12 SPDIF
WB17 SOM supports Sony/Philips Digital Interface with 24-bit data width.
Table 4-15 SPDIF Signal Pins
Connector
PIN#
J101
67
J102
32
Function
SPDIF_RX
SPDIF_TX
I/O
I
O
Description
SPDIF_RX
SPDIF_TX
4 User interface Getting start
The SOM can function power on 5V DC input, once system start, WB17 can use EVB HDMI
output or use USB sharing to external monitor for control.
www.innocomm.com20
You can use App for any application like play video, music etc.
5 Reference Documents
i.MX 8M Family of Applications Processors Datasheet
i.MX 8MMini Applications Processor Reference Manual
BD71847MWV Data sheet
1.
2.
3.
4. Murata SP-XV1XA-A Combo Wi-Fi Module Datasheet
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Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
15.19
15.105
15.21
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void the authority to
operate equipment.
This device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter.
End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for
satisfying RF exposure compliance.
For product available in the USA/Canada market, only channel 1~11 can be operated. Selection of other channels is not
possible
FCC RF Radiation Exposure Statement:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement
of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the
antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure
limits set forth for an population/uncontrolled environment can
be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this
equipment.
This device meets all the other requirements specified in Part 15E, Section 15.407 of the FCC Rules.
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This module is intended for OEM integrators only. Per FCC KDB 996369 D03 OEM Manual v01 guidance, the following
conditions must be strictly followed when using this certified module:
KDB 996369 D03 OEM Manual v01 rule sections:
2.2 List of applicable FCC rules
This module has been tested for compliance to FCC Part 15
2.3 Summarize the specific operational use conditions
The module is tested for standalone mobile RF exposure use condition. Any other usage conditions such as co-location
with other transmitter(s) or being used in a portable condition will need a separate reassessment through a class II
permissive change application or new certification.
2.4 Limited module procedures
Not applicable.
2.5 Trace antenna designs
Not applicable.
2.6 RF exposure considerations
This equipment complies with FCC mobile radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. If the
module is installed in a portable host, a separate SAR evaluation is required to confirm compliance with relevant FCC
portable RF exposure rules.
2.7 Antennas
The following antennas have been certified for use with this module; antennas of the same type with equal or lower gain
may also be used with this module. The antenna must be installed such that 20 cm can be maintained between the
antenna and users.
Antenna Type & Antenna Connector:
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2.8 Label and compliance information
The final end product must be labeled in a visible area with the following: “Contains FCC ID:YAIWB17”. The grantee's
FCC ID can be used only when all FCC compliance requirements are met.
2.9 Information on test modes and additional testing requirements
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This transmitter is tested in a standalone mobile RF exposure condition and any co-located or simultaneous transmission
with other transmitter(s) or portable use will require a separate class II permissive change re-evaluation or new
certification.
2.10 Additional testing, Part 15 Subpart B disclaimer
This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B
(unintentional radiator) rule requirement applicable to the final host. The final host will still need to be reassessed for
compliance to this portion of rule requirements if applicable.
As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module installed.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or co-location with another
transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final
product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the
transmitter) and obtaining a separate FCC authorization.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the
antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency
exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any
changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this
equipment.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF
module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
OEM/Host manufacturer responsibilities
OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be
reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed
on the US market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential
requirements of the FCC rules. This module must not be incorporated into any other device or system without retesting for
compliance as multi-radio and combined equipment
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Industry Canada statement:
This device complies with ISED’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio exempts de licence. L’exploitation est
autorisée aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif
doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable.
Industry Canada ICES-003 Compliance Label:
CAN ICES-3 (B)/NMB-3(B
Co-located
This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter.
The transmitter may not be co-located with any other transmitter or antenna
(i) the device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful
interference to co-channel mobile satellite systems; f
(ii) or devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz
shall be such that the equipment still complies with the e.i.r.p. limits specified for point-to-point and non-point-to-point
operation as appropriate; and
(iii) the worst-case tilt angle(s) necessary to remain compliant with the e.i.r.p. elevation mask requirement set forth in
Section 6.2.2(3) shall be clearly indicated.
Co-situé
Cet appareil et son antenne (s) ne doivent pas être situés ou fonctionner en conjonction avec une autre antenne ou
émetteur.
Le émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
(i) l'appareil pour fonctionner dans la bande 5150-5250 MHz est réservé à une utilisation en intérieur afin de réduire les
risques d'interférences nuisibles à la co-canal systèmes mobiles par satellite;
(ii) pour les appareils avec antenne (s) détachable, le gain d'antenne maximal autorisé pour les appareils dans la bande
5725-5850 MHz doit être telle que l'équipement satisfait encore la pire limites spécifiées pour le point-à-point et non point-
à-point, le cas échéant; opération et
(iii) l'angle d'inclinaison du pire (s) nécessaire pour rester conforme à la pire exigence de masque d'élévation énoncées
dans la section 6.2.2 (3) doit être clairement indiqué.
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Radiation Exposure Statement:
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with greater than 20cm between the radiator & your body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements ISED établies pour un environnement non
contrôlé. Cet équipement doit être installé et utilisé à plus de 20 cm entre le radiateur et votre corps.
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This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed and operated with greater than 20cm between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions
suivantes: (Pour utilisation de dispositif module)
1) L'antenne doit être installé et exploité avec plus de 20 cm entre l'antenne et les utilisateurs, et
2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires.
Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité
supplémentaires requis pour ce module installé.
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