FCC ID: Q2331307 Wireless Bluetooth module

P r e l i m i n a r y P r o d u c t O v e r v i e w T3130-7V10PO1-7600 A p r - 2 0 0 4 PBA 313 07 Singlestone Secure Mobile Solutions Preliminary Data Sheet, 11/2001 CONFIDENTIAL s t o p N e v e r t h i n k i n g . Singlestone PBA 313 07 For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com ABM, AOP, ARCOFI, ARCOFI-BA, ARCOFI-SP, DigiTape, EPIC-1, EPIC-S, ELIC, FALC54, FALC56, FALC-E1, FALC-LH, IDEC, IOM, IOM-1, IOM-2,IPAT-2, ISAC-P, ISAC-S, ISAC-S TE, ISAC-P TE, ITAC, IWE, MUSAC-A, OCTAT-P, QUAT-S, SICAT, SICOFI, SICOFI-2, SICOFI-4, SICOFI-4C, SLICOFI, are registered trademarks of Infineon Technologies AG. ACE, ASM, ASP, POTSWIRE, QuadFALC, SCOUT are trademarks of Infineon Technologies AG. BLUETOOTHT M is a trademark owned by its proprietor and used by Infineon Technologies AG under license. Edition 4/2004 Published by Infineon Technologies WS Sweden AB, Isafjordsgatan 16 SE-164 81 Kista Infineon Technologies AG All Rights Reserved. Attention please!

The information presented in this document does not constitute a part of any quotation or contract. Infineon Technologies especially emphazises the following:

As far as patents or other rights of third parties are concerned, liability is expressly excluded for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics or representation. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose!

Critical components1 of the Infineon Technologies AG, may only be used in life-support devices or systems 2 with the express written approval of Infineon Technologies AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life, such as, for example, in medical, air traffic, defense, or life-sustaining automotive applications. If they fail, it is reasonable to assume that the health of the user or another person may be endangered. Exclusion of Warranty and Liability The Software is provided "as is" and Infineon gives no warranty - expressly or implied - of any kind, including, but not limited to, warranties of merchantability or fitness for a particular purpose, nor does Infineon assume any liability whatsoever as to the performance of the Software. In addition, Infineon assumes no responsibility for the ability of the customer to use this Software for the purpose it was provided for, nor does Infineon assume responsibility for any claims, including, but not limited to, claims of infringement of intellectual property rights of third parties, arising from the customer's use of the Software. Preliminary Product Overview 2 4/2004 Table of Contents Singlestone PBA 313 07 1 Introduction ...................................................................................................................... 5 2 General Device Overview.............................................................................................. 6 General Features.............................................................................................................7 Block diagram.................................................................................................................8 Typical application .........................................................................................................8 2.1 2.2 2.3 2.4 Mechanical dimension and pad arrangement .................................................................9 2.5 Module pin-out.............................................................................................................. 10 2.6 Functional Block Diagram ............................................................................................ 11 2.7 System Integration and Applications............................................................................ 12 General description.................................................................................................. 12 2.7.1 3 Electrical Specifications .............................................................................................13 Absolute Maximum Ratings.......................................................................................... 13 Operating conditions.................................................................................................... 13 Latch-up immunity ........................................................................................................ 13 3.1 3.2 3.3 3.4 3.5 3.6 Quality .......................................................................................................................... 13 Capacitance .................................................................................................................. 14 Current consumption.................................................................................................... 14 3.7 3.8 3.9 3.7.1 DC Characteristics of Digital Part ................................................................................. 15 Pull Up characteristics on ResetQ ............................................................................. 16 Operational Range for RF part ...................................................................................... 16 3.9.1 3.9.2 3.9.3 AC/DC Characteristics of RF part.................................................................................. 16 Transmitter Characteristics....................................................................................... 17 RSSI ....................................................................................................................... 17 Receiver Characteristics........................................................................................... 18 Characteristics of externally supplied 32.768kHz clock signal............................... 18 3.10 4 Assembly and design guidelines .............................................................................19 General description of the module ............................................................................... 19 Printed Circuit Board design......................................................................................... 19 Solder paste printing .................................................................................................... 19 4.1 4.2 4.3 4.4 Assembly...................................................................................................................... 20 Component placement ............................................................................................. 20 Pin mark .................................................................................................................. 20 4.4.1 4.4.2 4.5 4.6 4.7 4.8 Soldering profile........................................................................................................... 21 Antenna ........................................................................................................................ 21 Shielding / EMC requirements....................................................................................... 21 Safety............................................................................................................................ 21 5 Type approvals and Qualification.............................................................................22 Bluetooth Qualification ................................................................................................. 22 5.1 Preliminary Product Overview 3 4/2004 5.2 5.3 FCC Modular Approval.................................................................................................. 22 R&TTE Approval ........................................................................................................... 22 Singlestone PBA 313 07 6 Module marking.............................................................................................................23 7 Package...........................................................................................................................24 8 References......................................................................................................................25 Preliminary Product Overview 4 4/2004 Singlestone PBA 313 07 1 Introduction The module is built around the BlueMoon Single Cellular chip (PMB 8761) which contains the radio, baseband, link manager and HCI functionality. For additional information regarding the PMB8761 such as firmware features, complete description of Infineon specific HCI commands and events, please refer to the latest version of the Data sheet for PMB8761, T8761-XV01Dx-7600. Preliminary Product Overview 5 4/2004 Singlestone PBA 313 07 2 General Device Overview Infineons Singlestone - PBA 313 07 is a ready-to-use Class2 Bluetooth module solution targeted for data and audio applications in the 10 meters personal area range. BLUETOOTH wireless technology is an open industry standard for short range wireless communication with both data and voice transmission capability (up to 723 kbit/s data asymmetrically or up to 3 voice channels simultaneously). Singlestone is a Bluetooth 1.1 pre-qualified component, so any further development and qualification efforts for the user are minimized. It is already hardware prepared for the upcoming Bluetooth 1.2 Standard, which will improve the quality of voice connections, support the co-existence with WLAN solutions using the same frequency band and accelerate the connection setup. Integrating the baseband, link manager and RF-transceiver, Singlestone closes the gap between the Bluetooth air interface (external antenna, 2.4 GHz ISM band) and the standardized host-controller-

interface (HCI), which is physically realized as a full-duplex UART port (HW-handshake optional). In parallel, the PCM interface is suitable for audio connections. Around Infineons BlueMoon Single Cellular PMB 8761 Bluetooth chip, all essential components for a complete Bluetooth solution are integrated in the Singlestone module. A 26 MHz temperature compensated crystal oscillator (TCXO) provides the highly accurate Bluetooth clock, an EPROM holds the application specific configuration data which is loaded after power-up reset, and an integrated balun-filter component ensures optimized RF matching between the chip and the external antenna. Only a 32.768 kHz real-time clock, which is available in most target applications, must be provided to the Singlestone module. Bluetooth stack software supporting the extended feature set of Infineons BlueMoon family and a comprehensive portfolio of Bluetooth profiles are available from our SW partners ported to a variety of host architectures. The device is designed for a broad range of wireless applications in the consumer, automotive and industrial segments, as well as for interconnection of cellular phones, desktop PCs, laptops, and PDAs. The device is available in a shielded LGA package (11.85 x 10.6 mm) with 8x9 pads. Preliminary Product Overview 6 4/2004 2.1 General Features Singlestone PBA 313 07 General Low power consumption, programmable Power down mode Chip in advanced low power CMOS technology External supply-voltage 3.0V..4.75 V, recommended 3.3 V +/- 5 %

Extended temperature range 40C .. +85C Interfaces UART for UART-HCI with HW-handshake (Baudrate up to 3 Mbaud) PCM interface (slave- and master-mode; programmable PCM slot allocation) JTAG GPIO for control of external devices Digital-Section Digital demodulation gives best performance in sensitivity, co- and adjacent channel performance Digital offset compensation and symbol synchronization / frame synchronization GFSK-modulator (over-sampling at typ. 9-bit-resolution) with amplitude adjustment and high-

performance A/D-converter for RX-data Digital part (Noise-shaper, Gaussian impulse filter) of S

-Fractional-N-PLL CVSD transcoder for voice conformant to BLUETOOTH wireless technology A-law, u-Law and linear PCM also possible Baseband and Linkmanager Firmware up to HCI in internal ROM 4 kbit E2PROM for storing Bluetooth device data RF and Analog Section Analog part of S detector and charge pump) on chip

-Fractional-N-PLL for receive and transmit path (multi-modulus-divider, phase Fully integrated and balanced VCO with integrated varactors and inductors. On chip 2.5 GHz RF driver amplifier up to + 5 dBm output power (Fine tuning in the range of -16 - +

5 dBm in 1.5 dB steps) Integrated LNA Fully integrated Balun, switch and antenna filter giving one single-ended RF interface, no additional external RF components Chip-integrated supply voltage regulator for VCO On module 26 MHz reference clock On module voltage regulator for single supply voltage. Typical sensitivity -83 dBm Typical output power +2.5 dBm Software Baseband, Link Manager and HCI functionality is incorporated by ProBlue Firmware in chip-

integrated ROM. Infineon specific HCI+ commands to support enhanced features Configuration data (e.g. Bluetooth device address) are loaded from internal E2PROM after reset. Optionally, configuration data may be provided by the host via HCI+ command. Package LGA 9 x 8 pads Preliminary Product Overview 7 4/2004 D D 2.2 Block diagram Singlestone PBA 313 07 UART HCI PCM V supply Low Power Clock 32.768 kHz Voltage Regulator EEPROM I 2 C PMB8761 Bluemoon Single Cellular Clock 26 MHz Singlestone PBA 313 07 Antenna Balun Antenna Filter Figure 2-1: Block diagram of the PBA 313 07 Singlestone module 2.3 Typical application Bluetooth Module PBA 313 07 Singlestone CLK32 V Supply PCM UART Host application Figure 2-2: Typical application diagram Preliminary Product Overview 8 4/2004 Singlestone PBA 313 07 2.4 Mechanical dimension and pad arrangement Below shows the modules pad layout. All dimensions are in mm. A B C D E F G H J 7 6 5 4 3 2 1 0 Figure 2-3 Mechanical dimensions, pad arrangement. Dimension Length Width Height Table 2-1 Mechanical dimensions with tolerances min. 11.65 10.40 1.6 typ. 11.85 10.6 1.8 max. 12.05 10.80 2.0 Unit mm mm mm Preliminary Product Overview 9 4/2004 Singlestone PBA 313 07 2.5 Module pin-out Table 2-2 represents the functional description of Singlestones connecting pads. Functionally non-

used pads (NC) are used as sacrifice pads or test pads, and must not be connected in an application. Pin Location Symbol Input/

Output During Reset D6 E6 E5 B5 D5 C2 D3 B0 C1 C3 G2 B4 C4 D4 B3 F2 F3 E2 J5 F0 G7 A0, A1, A4, A5 C5, C6 D1 E0, E1 E3, E4 F4, F5 G1, G6 H0, H4, H5, H6 J0, J4, J6 A2, A3 , A6, A7 B1, B2, B6, B7 C0, C7 D0, D2, D7 E7 G7 F1, F6, F7 G0, G3, G4, G5, H1, H2, H3, H7 J1, J2, J3, J7 UARTIN UARTOUT UARTRTS UARTCTS WAKEUP_HOST PCMIN PCMOUT PCMFR PCMCLK GPIO

(=GPIO0) TRST TCK TMS TDI TDO RESETQ WAKEUP_BT CLK32 ANT VSUPPLY NC (VDD) GND GND GND GND GND GND GND GND GND NC NC NC NC NC NC NC NC NC I O O I O I O I/O I/O I/O I I I I O I I I A S Tristate Pull-Up Pull-Down Tristate Pull-Down Tristate Pull-Down Pull-Down Pull-Down Pull-Down Pull-Down Input Pull-Up Pull-Up Tristate Pull-Up Input Input Function Comments After Reset Tristate Pull-Up UART-Input UART-Output (Pull-Up controlled by FW) Pull-Down UART-Request to Send (Pull-

Down/-Up controlled by FW) UART-Clear to Send Tristate Pull-Down Wake-up signal for host ) (Pull-

Down controlled by FW) PCM input Tristate Pull-Down PCM output (Pull-Down/-Up Pull-Down PCM frame (8kHz)(Pull-Down/-Up controlled by FW) controlled by FW) Pull-Down PCM clock (>64kHz) (Pull-Down/-

Up controlled by FW) Pull-Down General purpose Input/Output (Pull-

Down/Up controlled by FW) Input Input Pull-Up Pull-Up Tristate Pull-Up Input Pull-Down Test Reset (JTAG) Test Clock (JTAG) Test Mode Set (JTAG) Test Data Input (JTAG) Test Data Output (JTAG) Reset line (0:reset, 1:active) Wake-up signal from low power mode 32.768 kHz clock input RF input /output 50 ohms. Power Supply Regulated supply voltage for test purposes. Important that is leaved NC. Table 2-2 Module pin-out Preliminary Product Overview 10 4/2004 2.6 Functional Block Diagram PCM Interface Singlestone PBA 313 07 Baseband-

Control PMB8761 BlueMoon Single Cellular PCM-

Interface A/ m -Law CVSD Data-

RAM/

Control-

RAM

(Buffers) Par a Ser CRC/FEC Ser a Par CRC/FEC Encryption Digital Baseband Section Impulse Shaping Timers/

RF-Interface Fract.-N-

PLL Demodulator Control Information Frame-

Sync Symbol-

Recov. Offset-

Canc. Loop Filter RF Frequency Synthesizer

(Analog part of S

Fractional-N-PLL)

Transmitter Antenna Switch Balun +

filter Bluetooth Link-Control/

Link-Manager/

HCI-UART Digital Link Control Section Clocks Inter-

rupts UART Timer Watch-

dog Ports IC D -Clocks-PLL LNA Power management unit Analog Baseband Section Receiver Analog RF-Section I 2 C-

Interface E2PROM 26 MHz XO UART GPIO JTAG WAKEUP 32.768 kHz VSUPPLY (3.0V 4.75V) Figure 2-4: Singlestone PBA 313 07 Block diagram Preliminary Product Overview 11 4/2004 S D S D Singlestone PBA 313 07 2.7 System Integration and Applications 2.7.1 General description On the RF-side, Singlestone provides a 50 Ohm single-ended input/output to be directly connected to an external antenna. The design of the antenna is open to a broad spectrum (e.g. PCB antenna, ceramic antenna, external antenna) and can be optimized to the target application requirements. The HCI-interface is implemented as a full-duplex UART port which can be configured to be used in 2-

line or 4-line mode (with or without hardware handshake). If hardware handshake is not used then the UARTCTS pin must be grounded. The PCM interface is able to serve one Bluetooth SCO channel for voice data. Optionally, SCO channels may be linked to the host via the HCI-UART interface. Both the UART- and PCM-interfaces are assigned to the regulated voltage (2.7V) powered by VSUPPLY. VSUPPLY must be in the range of 3.0 to 4.75 V. General purpose input/output lines (GPIOs) can be controlled via HCI+ commands. Configuration data (e.g. Bluetooth device address) are loaded from internal E2PROM after reset. Optionally, configuration data may be provided by the host via HCI+ commands. Preliminary Product Overview 12 4/2004 3 Electrical Specifications Singlestone PBA 313 07 3.1 Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the module will result. VSUPPLY VI VO IIN TStorage Parameter Limit values Supply voltage range Input Voltage Range Output Voltage Range Input Current ESD integrity according to MIL-STD883D Method 3015.7 Maximum storage temperature range min.

-0.3

-0.3 0.3

- 10

-40 max. 6.0 3.75 3.0 10 1 125 Unit V V V mA kV C Table 3-1: Absolute maximum ratings Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to conditions beyond those indicated in the recommended operational conditions of this specification may affect device reliability. This is a stress rating only and functional operation of the device under these conditions or at any other condition beyond those indicated in the operational conditions of this specification is not implied. 3.2 Operating conditions Unless otherwise stated, the following characteristics apply operating conditions. Parameter Temperature VSUPPLY Table 3-2 Operating Conditions min.

-40C 3.0V typ.

+25C 3.3V max.

+85C 4.75V Remarks 3.3 Latch-up immunity Latch-up immunity is guaranteed in accordance with JEDEC-standard No. 17, EIA Jedec JC-40.2. 3.4 Quality For quality and reliability conditions se 105 63-PBA31301+ Uen. Preliminary Product Overview 13 4/2004 3.5 Capacitance T = 25C Symbol Parameter CIN COUT CIO input capacitance output capacitance I/O Table 3-3: Capacitance 3.6 Current consumption Regulator input voltage: VSUPPLY = 3.0..4.75V

1 2 3 4 Bluetooth mode HV3 WSE 0x02 WSE 0x03 Sniff mode Average Consumption min. max. typ. 32 40 2.2 3.0 2 3.5 4 3 Singlestone PBA 313 07 Limit Values min. max.

10 15 20 Unit pF pF pF Unit Test Conditions mA mA mA mA ACL link in sniff mode with max. interval 1.28 s scan interval, 11.25 ms scan, no interlaced scan 1.28 s scan interval, 2*11.25 ms scan, no interlaced scan 2.00 s sniff interval, sniff attempt =

1, sniff timeout = 0 Table 3-4: Average current for some Bluetooth modes. WSE means after HCI_Write_Scan_Enable. Preliminary Product Overview 14 4/2004 3.7 DC Characteristics of Digital Part VSUPPLY = 3.0V..4.75V. Singlestone PBA 313 07 Maximum allowed input levels are from -0.3V to 3.0V. Higher voltages up to 3.6V can be applied at UARTIN, UARTCTS, PCMIN, PCMFR, PCMCLK, TRST, TCK, TMS, TDI, RESETQ, CLK32, WAKEUP_BT. Symbol Parameter Test Condition

Input low voltage Input high voltage Output low voltage Output high voltage IOL=2.4mA IOL=100m A IOH=-2.4mA IOH=-100m A Output low voltage Output low voltage Output high voltage Output high voltage Pins: PCMCLK, PCMFR, PCMIN, UARTIN, UARTCTS, GPIO0 VIN LOW VIN HIGH Pins: PCMCLK, PCMFR, PCMOUT, UARTOUT, UARTRTS, GPIO0 VOUT LOW VOUT LOW VOUT HIGH VOUT HIGH Pins: WAKEUP_HOST VOUT LOW VOUT HIGH Pins: TRST, TCK, TMS, TDI VIN LOW VIN HIGH Pin: TDO VOUT LOW VOUT LOW VOUT HIGH VOUT HIGH Pin: WAKEUP_BT, CLK32 VILOSC VIHOSC Pin: RESETQ VIN LOW VIN HIGH Output low voltage Output low voltage Output high voltage Output high voltage IOL=2.4mA IOL=100m A IOH=-2.4mA IOH=-100m A Input low voltage Input high voltage Input low voltage Input high voltage Input low voltage Input high voltage IOL=100m A IOH=-100m A

Min 1.89 2.02 2.43 2.43 1.89 2.2 2.6 2.0 2.5 Limit Values typ

max 0.81 0.68 0.27 0.27 0.81 0.35 0.15 0.4 0.35 Unit V V V V V V V V V V V V V V V V V V Table 3-5: DC characteristics of digital part max. Load Capacitance

(during test) 30 pF 30 pF 30 pF PCMOUT PCMCLK PCMFRM Table 3-6: Pin characteristics Rise/Fall Time (for measurement of DC characteristics) 30 ns 30 ns 30 ns Symbol Parameter ILI ILO ILI, H ILO, H Input leakage current Output leakage current Input leakage current for 3.6V tolerant pins*

Output leakage current for UART and PCM domain pins Limit Values typ

min

Unit Test Condition A A A A 0V<V IN<2.7V 0V<V OUT<2.7V 0V<V IN<3.6V 0V<V OUT<2.7V max 1 1 1 1 Table 3-7: Leakage currents

* The following pins are 3.6 V tolerant: UARTIN, UARTCTS, PCMIN, PCMFR, PCMCLK, TRST, TCK, TMS, TDI, RESETQ, CLK32, WAKEUP_BT Preliminary Product Overview 15 4/2004 Pull-Up and Pull-Down Values Symbol UARTRTS UARTOUT WAKEUP_HOST PCMOUT PCMFR PCMCLK GPIO0 min 100 100 100 100 100 100 40 Pull-Up typ 160 160 160 160 160 160 100 max 230 230 230 230 230 230 200 Pull-Down typ 150 150 140 140 140 140 90 max 200 200 200 200 200 200 170 min 100 100 100 100 100 100 30 Table 3-8: Pull-Up / Pull-Down characteristics Singlestone PBA 313 07 Unit Test Condition A A A A A A A 3.7.1 Pull Up characteristics on ResetQ The ResetQ signal is pulled up to Vdd. In order for the chip to start up properly at power up the pull up is delayed. Below is a table stating the delay from applying a stable Vsupply to the module until the ResetQ goes high. Parameter Test Condition Unit Delay pull up of ResetQ Pull-up current ResetQ min max 50 500 s A Limit Values typ 26 270 3.8 Operational Range for RF part Within the operational range the module operates as described in the circuit description. The AC/DC characteristic limits are not guaranteed. Note: Power levels refer to 50W impedance

Parameter Remarks Symbol Unit RF input level RF input frequency Ambient temperature 1 2 3 Table 3-9: Operational range for the RF part PRFIN fRFIN TA Limit values min.

-40 max. 10 2500

+85 dBm MHz C 3.9 AC/DC Characteristics of RF part AC/DC characteristics involve the spread of values guaranteed within the specified supply voltage and ambient temperature range. Typical values are the median of the production. Preliminary Product Overview 16 4/2004 3.9.1 Transmitter Characteristics

Parameter Symbol Limit values Unit 1 2 3 4 5 6 7 Output power Output power Frequency deviation

(00001111 sequence) Frequency deviation

(0101 sequence) Relative frequency deviation (0101 sequence) In-band spurious emissions Out of band spurious emission f dev f dev f dev,0101/f dev,00001111 min.

-3.0

-1.0 140 115 0.8 typ. 1.0 1.0 158 140 0.95

*measurement method corresponding to Bluetooth test specification Table 3-10: Transmitter characteristics Singlestone PBA 313 07 Test Conditions max. 4.5 4 175 dBm dBm T=25C kHz 175 kHz

-20

-20

-40

-36

-30

-47

-47 dBc

@ 500kHz offset*

dBm @ 2MHz offset*

dBm @ 3MHz offset*

dBm 30MHz -1GHz dBm 1 - 12.75 GHz dBm 1.8 - 1.9 GHz dBm 5.15 -5.3 GHz 3.9.2 RSSI

Parameter Symbol Limit values Linear response lower limit Linear response upper limit 1 2 Table 3-11: RSSI min.

-40 typ.

-90 max.

-80 Unit dBm dBm Test Conditions Preliminary Product Overview 17 4/2004 3.9.3 Receiver Characteristics Singlestone PBA 313 07

1 2 3 4 5 Parameter Range/Location Limit values Unit Test Conditions Sensitivity (BER=10-3) Sensitivity (BER=10-3) Interference performance

(BER=10-3) a) Out of band blocking (BER=10-3) Y=M Y=M 1 Y=M-2 Y=M+2

(image) Y=M-3 Y=M+3

(adj. Image) Y= any other Bluetooth channel 30MHz f 2GHz 2GHz f 2.4GHz 2.5GHz f 3GHz 3GHz f 5GHz 5GHz f 12.75GHz c) Exceptions for LO spurious (based on measurements on golden board) Intermodulation performance

(BER=10-3) 1/3 fout 1/2 fout 1785MHz<f<1850MHz 2 fout min.

-71

-60

-30

-51

-27

-47

-27 5

-27

-27 5

-10 0

-10

-10

-10

-39 typ.

-85

-85

-68

-58

-23

-43

-25

-36

-22 8 8 5 0 0 0

-34 max.

-75

-81 dBm According to Bluetooth spec. dBm T=25C, nominal dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm transmitter frequency deviation 160kHz for wanted

(M) and interferer (Y), level wanted 60dBm measured at antenna input frequency deviation 160kHz for wanted

(M) and interferer (Y), level wanted 67dBm measured at antenna input frequency deviation 160kHz for wanted, unmodulated interferer, level wanted 67dBm, not at VCO frequency and mixing products of :3/2, measured at antenna input dBm dBm dBm dBm dBm frequency deviation 160kHz for wanted

(N), level 64dBm;

interferer (N+5) unmodulated, frequency deviation 160kHz for interferer

(N+10), measured at antenna input 6 Spurious Emission 30 MHz - 1 GHz 1 - 12.75 GHz

-57

-47 dBm dBm Table 3-12: Receiver characteristics (including Digital Demodulator and PAM-Receiver) 3.10 Characteristics of externally supplied 32.768kHz clock signal The 32.768kHz clock signal applied to CLK32 has to be a rectangular waveform with a duty cycle of 10% up to 90%. The frequency accuracy has to be better than 250ppm. The rise time and fall time of the 32.768kHz signal must be below 10m s. The amplitude must satisfy the requirements in Table 3-5. Preliminary Product Overview 18 4/2004 4 Assembly and design guidelines Singlestone PBA 313 07 4.1 General description of the module Singlestone is a Land Grid Array (LGA 8x9) module made for surface mounting. The pad diameter is 0.8 mm and the pitch 1.27 mm. All solder joints on the module will reflow during soldering on the mother board. All components and shield will stay in place due to wetting force. Surface treatment on the module pads is Nickel /Gold. Figure 1 shows the pad layout on the module, Seen from component side. Figure 4-1 Pad layout on the module (top view) 4.2 Printed Circuit Board design The land pattern on the PCB shall be according to the land pattern on the module, which means that the diameter of the LGA pads on the PCB shall be 0.8 mm. It is recommended that each pad on the PCB shall be surrounded by a solder mask clearance of about 75 m to avoid overlapping solder mask and pad. The solder pads must have wetability to eutectic solder. Electroless Ni/Au plating or OSP (Organic Surface Protection) is a common surface finish and is suitable for assembly. 4.3 Solder paste printing The solder paste deposited on the PCB by stencil printing has to be of eutectic or near eutectic tin lead composition (e.g. 63Sn37Pb or 62Sn36Pb2Ag). A no-clean solder paste is preferred, because cleaning of the solder joints which are under the module is difficult. Preferred thickness of the solder paste stencil is 100 - 127 m (4 - 5 mils). The apertures on the solder paste stencil shall be of the same size as the pads, 0.8 mm. Preliminary Product Overview 19 4/2004 4.4 Assembly Singlestone PBA 313 07 4.4.1 Component placement In order to assure a high yield soldering process good placement on the PCB is necessary. As a rule of thumb the tolerable misplacement is 150 m. This means that the Singlestone module can be assembled with a variety of placement systems. The recommendation is to pick and place the module with a nozzle in the centre of the shield. The nozzle diameter shall not be bigger than 4 mm. 4.4.2 Pin mark Pin 1 (A0) is marked on bottom footprint and on the top of the shield on the module according to fig 2a-b. Diameter of pin 1 mark on the shield is 0.40 mm. Pin 1 mark 0,92 Figure 2a: Top view 0,92 Figure 4-2 Pin mark Figure 2b: Bottom view Pin 1 mark mark Preliminary Product Overview 20 4/2004 Singlestone PBA 313 07 4.5 Soldering profile Generally all standard reflow soldering processes (vapour phase, convection, infra red) and typical temperature profiles used for surface mount devices are suitable for the Singlestone module. Wave soldering is not possible. Figure 4-3 shows an example of a suitable solder reflow profile. Figure 4-3 : Eutectic Sn/Pb-Solder Profile Singlestone shall be handled according to MSL3, which means a floor life of 168 h in 30C/60% r.h. 4.6 Antenna The antenna output routing should be 50 W (VSWR maintain the radio performance listed in this data sheet. For the routing underneath the module, the modules ground plane should be considered. The type approval for FCC and R&TTE have been done with an antenna gain of 1.6dBi. 2:1) all the way to the antenna in order to 4.7 Shielding / EMC requirements The module has its own RF shielding and is approved according to the standards by FCC and R&TTE. If the approval number is not visible on the outside when the module is utilised in the final product, an exterior label must state that there is a transmitter module inside the product (see Section 5.2). 4.8 Safety In the R&TTE directives there are safety requirements for high voltage applications. For complying with the R&TTE security requirements regarding usage in high voltage equipment, using 230V supply, the device shall be mounted un-resolvable or it needs to be ensured that it cannot cause a short circuit. Preliminary Product Overview 21 4/2004 Singlestone PBA 313 07 5 Type approvals and Qualification 5.1 Bluetooth Qualification The PBA 31307 is Bluetooth Qualified according to specification v1.1 with the ID: PBA31307. The covered functionality of this listing covers RF, Baseband and Link Manager. Since the PBA 31307 constitute a complete Bluetooth system, the pre-testing, listings and qualifications can be reused by reference by the end-customer. Please refer to the application note PBA 31307 Bluetooth Qualification & Type Approval for the details on the procedure to re-using the BT-qualification. 5.2 FCC Modular Approval This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. The modular transmitter is labeled with its own FCC ID number, but, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. The exterior label can use wording such as the following: Contains Transmitter Module FCC ID Q2331307 or Contains FCC ID Q2331307. Any similar wording that expresses the same meaning may be used. When reusing the Modular Approval, antenna related measurements might need to be redone. The antenna used for modular approval was a max 1.6dBi half-wave antenna from gigAnt (PCB Swivel 6076019). When using an other antenna a class II permissive change will be needed. For further details on the procedure for re-using the FCC type approval, please refer to the application note PBA 31307 Bluetooth Qualification & Type Approval. 5.3 R&TTE Approval This device complies with the requirements in the European Union and EFTA according to the following test specifications:

EN 300 328 EN 301 489 -1/17 The R&TTE approval for the PBA31307 - device is valid in the following countries:

Austria, Belgium, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Liechtenstein, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. The notification time for these countries to request additional testing and/or documentation are 4 weeks. Preliminary Product Overview 22 4/2004 Singlestone PBA 313 07 6 Module marking Marking 1, Description Infineon logotype 2. <PBA 313 07 R1A>

Product number with suffix and revision state according to purchase order. 3. <bbbbbb>

4. <XX>

Batch number Type of module:

Engineering Samples, XX=ES 5. <yyww2>

Manufacturing year (yy), week (ww) and factory code (2) ID Q23 FCC Identification number Bluetooth logotype. CE marking 6. <FCC 31307>

7 8. Table 6-1 Figure 6-1 Marking example Preliminary Product Overview 23 4/2004 Singlestone PBA 313 07 7 Package Singlestone is packed in tape on reel according to Figure 7-1. The tape is also the module dry pack as referred to in chapter 4.5. Figure 7-1 Tape on reel for Singlestone Preliminary Product Overview 24 4/2004 8 References 1. T8761-XV01D12 -7600 Preliminary Data Sheet PMB 8761 Singlestone PBA 313 07 Preliminary Product Overview 25 4/2004