| manual | photos | label | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| app s | submitted / available | |||||||
|---|---|---|---|---|---|---|---|---|
| 1 2 3 4 5 | Users Manual | 1.35 MiB | February 10 2014 | |||||
| 1 2 3 4 5 | Internal Photos | 832.00 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | Internal Photos | 152.33 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | Internal Photos | 92.60 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | External Photos | 1.60 MiB | February 10 2014 | |||||
| 1 2 3 4 5 | External Photos | 828.46 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | External Photos | 104.61 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | ID Label/Location Info | 674.87 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | Cover Letter(s) | 20.78 KiB | / February 10 2014 | |||||
| 1 2 3 4 5 | Attestation Statements | 77.76 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | Cover Letter(s) | 20.83 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | Cover Letter(s) | 43.91 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Cover Letter(s) | 20.61 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | RF Exposure Info | February 10 2014 | ||||||
| 1 2 3 4 5 | RF Exposure Info | February 10 2014 | ||||||
| 1 2 3 4 5 | RF Exposure Info | February 10 2014 | ||||||
| 1 2 3 4 5 | RF Exposure Info | February 10 2014 | ||||||
| 1 2 3 4 5 | RF Exposure Info | February 10 2014 | ||||||
| 1 2 3 4 5 | RF Exposure Info | February 10 2014 | ||||||
| 1 2 3 4 5 | RF Exposure Info | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Setup Photos | 780.62 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Test Report | February 10 2014 | ||||||
| 1 2 3 4 5 | Parts List/Tune Up Info | 29.36 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | Parts List/Tune Up Info | 194.65 KiB | February 10 2014 | |||||
| 1 2 3 4 5 | Test Report | 317.54 KiB | February 10 2014 |
With Reg Safety Pre atory Not gulatory u ecautions ices 9/21/
updates 9/19/201
/2014 (ec
- S
- Regula 14 cology) Inntel 5th G Soluti Generatio ion Deve on Core lopment Process System (
sor-Base
(SDS) d U USER R MAN NUAL L Mode Docume Revisio Regulatory Info el: WSBUB-SDS ent Number: H320 on 0.93 May 201 ormation Septem 072 14 mber 2014 DRAFT T - Intel Confid dential N Notice:
I NFORMATION IN TH A ANY INTELLECTUAL P PRODUCTS, INTEL A I NTEL PRODUCTS P PATENT, COPYRIGH A APPLICATIONS. ntel may make chang I A All products, dates, an I ntel processors, chip c characterized errata a A Any code names featu p parties are not author r risk of the user. S Software and workloa a are measured using s o other information and F For more information I ntel, Intel Inside, the S States and other coun U Ultrabook products h http://www.intel.com/u M Material in this docum T This Ultrabook system T This Ultrabook system T This document contai
*
*Other names and bra C Copyright 2014 Inte ads used in performan specific computer syst performance tests to go to http://www.intel Intel logo, Intel vPro, ntries. are offered in multipl ultrabook. ment is intended as pr m is an engineering sa m is specifically design ns information on pro ands may be claimed el Corporation HIS DOCUMENT IS P L PROPERTY RIGHT ASSUMES NO LIABIL INCLUDING LIABILI HT OR OTHER INTEL PROVIDED IN CONN TS IS GRANTED BY T LITY WHATSOEVER TY OR WARRANTIE LLECTUAL PROPER NECTION WITH INTE THIS DOCUMENT. E R, AND INTEL DISCLA ES RELATING TO FIT RTY RIGHT. INTEL PR L PRODUCTS. NO EXCEPT AS PROVIDE AIMS ANY EXPRESS TNESS FOR A PART RODUCTS ARE NOT LICENSE, EXPRESS ED IN INTELS TERM S OR IMPLIED WARR ICULAR PURPOSE, T INTENDED FOR US S OR IMPLIED, BY E MS AND CONDITION RANTY, RELATING T MERCHANTABILITY SE IN MEDICAL, LIF ESTOPPEL OR OTHE NS OF SALE FOR SU TO SALE AND/OR U Y, OR INFRINGEMEN E SAVING, OR LIFE ERWISE, TO UCH SE OF NT OF ANY SUSTAINING ges to specifications a nd figures specified a sets, and desktop boa are available on reque ured are used interna rized by Intel to use co and product descriptio re preliminary based ards may contain des est. ally within Intel to iden ode names in advertis ons at any time, witho on current expectatio sign defects or errors out notice. ons, and are subject to known as errata, whi o change without noti ch may cause the pro tice. oduct to deviate from published specificatio ons. Current ntify products that are sing, promotion or ma in development and arketing of any produc not yet publicly annou ct or services and any unced for release. Cu y such use of Intel's i ustomers, licensees a nternal code names i and other third s at the sole nce tests may have be tems, components, so o assist you in fully ev l.com/performance. Centrino, Centrino In een optimized for per oftware, operations a aluating your contem rformance only on Inte nd functions. Any cha plated purchases, inc el microprocessors. P ange to any of those f cluding the performan Performance tests, su factors may cause the nce of that product wh uch as SYSmark and e results to vary. You hen combined with oth MobileMark, should consult her products. nside, Intel Core, Intel Atom, Pentium, Ultra abook, and RealSens se are trademarks of I Intel Corporation in th he United e models. Some mod dels may not be availa able in your market. C Consult your Ultraboo ok manufacturer. Fo or more information an nd details, visit oduct positioning and ample and may not be ned and tested for Mi oducts in the design p as the property of oth ser messaging. d not approved end us mains the property of e sold or leased; it rem crosoft* Windows* 8. 1, configured for Con t. phase of development hers. f Intel. nnected Standby oper ration. ntel 5th Generation I U USER MANUAL (Rev Core Processor-Ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 2 r revision history Revision 0.92 Description Added:
Fingerprint sensor inf formation 0.91 0.9 0.85 0.8 0.7 uctions for enabling W WWAN card instructions Updated:
Wireless WAN: instru Updated:
Wireless WAN SIM c Updated:
Introduction Left side features Using the keyboard GA adapter Using the HDMI to VG t Using the debug port shut down Standby and system ons Technical specificatio oubleshooting Configuration and tro T2) factory build with Intel RealSense 3D D camera. Update for Beta (DVT Updated:
Safety precautions (W Active Pen configurat Touchscreen configu tements) WWAN and Wi-Fi stat tion information ration information Da Jun ate ne 20, 2014 Ma ay 13, 2014 Ma ay 7, 2014 Ma ay 2, 2014 Ap pril 23, 2014 Initial release, Beta (D DVT2) factory build. Ap pril 15, 2014 DRAF T CONFIDENTIAL May 2014 3 ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS contents c s 1 1 2 2 n introduction utions safety preca ow the system getting to kn features system view left side e view right sid nel view front pa nel view rear pan using your s system ed getting starte ntations system orien mode laptop m mode tablet m mode display de tent mod e e protective sleeve using th uch screen using the tou customi zing the touch scre uchpad using the tou tive pen using the act zing the pen behav customi example es of applications s yboard using the key key commands function eyboard functions other ke meras using the ca cing webcam user-fac world fa acing camera (table een functions vior supporting an active e pen et mode) 6 7 8 8 9 9 1 11 1 11 2 12 2 12 3 13 3 13 4 14 5 15 5 15 6 16 7 17 7 17 0 20 1 21 2 22 4 24 5 25 5 25 5 25 6 26 6 26 7 27 3 4 5 e he WWAN hardware motion sensors t sensor SIM card ystems: enabling th micro SIM card u using the system m u using the fingerprint wireless WAN and S w beta (DVT2) sy installing the m Ethernet LAN jack u using the RJ45 Gb VGA adapter u using the HDMI to V m shut down standby and system s andby waking from sta y charging the battery c rt u using the debug por ations echnical specifica te c configuration and troubleshooting ystem BIOS entering the sys ystem boot device selecting the sy disconnect/connec system battery Real Time Cloc ck (RTC) CMOS re s regulatory notices r SAFETY WARNING S GS AND CAUTION S E EMC STATEMENT MENTS E ECOLOGY STATEM A ADDITIONAL INFO ORMATION for syst alSense 3D Cam Intel Rea CRIPTION DEVICE DESC NINGS AND CAUT SAFETY WARN ATEMENTS ECOLOGY STA ct switch set switch NS tems with the era F200 TIONS 28 30 31 31 32 33 34 35 35 35 36 37 38 38 38 38 39 40 40 40 43 43 Error! B Error! B Error! B Bookmark n Bookmark n Bookmark n ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 4 f figures figure 2-1 f figure 2-2 f figure 2-3 f figure 2-4 f figure 2-5 f figure 2-6 f figure 2-7 f figure 2-8 f figure 2-9 f figure 2-10 f figure 2-11 f figure 2-12 f figure 2-13 f figure 2-14 f figure 2-15 f figure 2-16 f figure 2-17 f figure 2-18 f figure 2-19 f figure 2-20 f figure 2-21 f figure 2-22 f figure 2-23 f getting started g aptop mode la otating to tablet ro ablet mode ta display mode d ent mode te s sleeve alignment fo active pen pocket a s sleeve alignment fo s system and sleeve i to ouch screen gestur ouch settings to d double-tap and pres d display settings o other settings ouchpad gestures to to ouchpad configurat in nstalling the active active pen buttons a p pen and touch scree navigational flicks n n navigational and ed customize flicks c e r laptop carry mode r tablet mode in tablet mode res s ss and hold settings tion pen battery en iting flicks ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS on keys ols on ssword ss rd ck keyboard 2D came 3D came world fac world fac world fac setting u setting u inserting using the VGA dis system b RTC CM rd layout and functio era configuration era configuration cing camera cing camera contro cing camera locatio up system login pas up fingerprint acces g the micro SIM car e Ethernet LAN jac splay adapter battery reset MOS reset standby system f and shutdown opti features ions figure 2-
figure 2-
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1 1 2 12 3 13 4 14 4 14 5 15 5 15 6 16 6 16 6 16 6 16 7 17 8 18 8 18 9 19 9 19 0 20 0 20 1 21 1 21 2 22 2 22 3 23 3 23 DRAF T CONFIDENTIAL 25 26 26 27 28 28 30 30 32 33 34 38 39 35 37 May 2014 5 i 1 ntroduct This 5th generatio on Intel Core P T c convertible device e featuring:
ion Processor-based Solution Develo pment System (S SDS) is a busines ss and consumer focused Ultraboo ok 2-in-1 13.3 3200 360-degree Intel vPro RJ45 Gigab using the R 180GB Inte interface) x 1800 QHD+ m e hinge fold-over o Technology w bit Ethernet jack (
RJ45 Gb Ethernet el Pro 2500 Seri ulti-finger touch d conversion mech with discrete TPM
(see t LAN jack) ies SSD (M.2 mo display hanism 2.0 and pop-out dule, SATA Two user-fa o Full H o Intel came World-facin Intel Dual PCIe Wi-Fi Intel Pro W acing camera opt HD 2D camera RealSense 3 era ng camera; 8 MP l Band Wireless-A w/BT 4.0 M.2 mo Wireless Display tions (see using t the cameras):
D Camera F200 with full HD 2D with LED flash AC 7265 (Stone odule
(WiDi) 5.0 with M Peak) 802.11ac 2x2 Miracast* support el XMM7160-bas Inte signed for Intel M Des eless Dock (see Wire o Maple Peak mo Nea ar Field Commun naptics* ForcePad Syn e using the touch
(see rig* DuoSense Pe N-tr gerprint sensor (s Fing set of sensors in Full amb bient light, user p connectors: full si IO c der, micro SIM, 3 read Mic rosoft* Windows*
Connected Stand as C sed LTE WWAN Maple Peak WiG Error! Referenc odule not include ications (NFC) an d* touchpad with hpad) en 2* Active Pen see Error! Refere ncluding accelero proximity, and bar ize HDMI out, 2x 3.5 mm combo au
* 8.1 with InstantG dby) w/ GNSS ig with optional W WiGig und.)1 e source not fou ed, late availability y ntenna multi-finger gestu ure support ctive pen)
(see using the ac t found.) ence source not e, compass, ometer, gyroscope e rometric pressure SDXC card USB 3.0 ports, S Gigabit LAN udio jack, RJ45 G so known Go* capability (al T This Ultrabook 2-
s system is designe l atest Intel platfor in-1 convertible d ed as a software rms. design represents development plat s many of the cap tform to aid in de pabilities of system livery of compelli ms based on the ng and differentia 5th Generation In ated software and ntel Core Proc d user experience cessor. This es for the ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 6 s safety preca utions WARNING G: READ THESE PRECAUTIONS P PRIOR TO USING Y YOUR DEVICE. er adapter provid s not user-service move the battery p maged crushed o posed to excessiv C. device in water, a e exercised during U Use only the powe T The battery pack i n not attempt to rem If f the device is dam If f the device is exp o over 100 degrees Do NOT drop the D C Caution should be h hearing loss. T This device may c c complies with Inte U US FDA performa ed with the device eable; the battery pack as damage t or severely droppe ve temperatures t e. Other power a y[ies] in this devic to the device or ba ed, to ensure safe the battery may fa adapters may ove ce cannot be easil attery pack may o e and proper ope ail. Do not expose erheat or damage ly replaced by us occur. eration, return it to e the device to en e the device. ers themselves. Do o Intel for servicin nvironments ng. as the device is no g long exposure to ot waterproof. O o excessive soun peration and dev nd levels from ear vice failure may oc rphones and head ccur. dphones as this c can cause contain an Intel ernational Standa ance standards fo RealSense 3D rd EN/IEC 60825 or laser products e D Camera module 5-1:2007 edition 2 except for deviati e that contains an 2 for a Class 1 las ons pursuant to L n integrated laser ser product. The Laser notice No. projector. The c camera also com 50, dated June 2 camera mplies with 24, 2007."
Do not mo camera m damaged may resul odify, attempt to o module might caus in any manner. lt in hazardous ra he camera modul open or service th to exceed the Cl se the emissions Use of controls o or adjustments or e. adiation exposure le within this devi ass 1 level. Do n performance of p ice in any way. M not activate this d procedures other Modification or se device if the came r than those spec ervice of the era is ified herein For a additional inform See REG mation including ULATORY NOTI g RF exposure:
CES section. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 7 g getting to kn ow the syste em s system featu ures 1. User-fac 2. using the The SDS cing webcam and e cameras) S has two camera/m SKU A: standard 1 SKU B: Intel Rea 2D camera t light sensor (AL 3. Ambient S allows the system The ALS ng to the ambient lig accordin 3200 x 1800) multi 4. QHD+ (3 h-definition display The high videos, and other m photos, v oft* Windows* hom 5. Microso ey for quick navigat Home ke oximity sensor 6. User pro t-in proximity senso The built n wake and standby between s 8.1; intended for d Windows rs 7. Speaker rs are located on bo Speaker s provide high perfo speakers 8. Synaptic cs* ForcePad* To e sensitive touchpa Pressure ation. See using the specifica rint sensor (see u 9. Fingerp nger on sensor to lo Place fin 10. World-fa acing camera and P camera has an L This 8MP ablet mode. use in ta tenna location ind 11. NFC ant Near Fie eld Communications microphones (se ee microphone configu 1080P full HD webc alSense 3D Cam urations:
cam mera F200 plus 108 80P full HD LS) m to change the disp ght. i-touch display panel provides exc multimedia files. me key tion in tablet mode. play backlight auto matically cellent viewing featu ures for or determines when y modes. This com development with f n a user is within ra ponent is not functi future operating sys ange to switch ional with stems. oth sides of the sys ormance audio. uchpad ad compliant with M e touchpad for deta using the fingerprint og into Windows 8. d flash (for tablet m LED flash and is loc dicator s antenna for tap/p stem. The integrate ed stereo pad MS precision touchp ails. t sensor) 1. mode) cated on the keyboa ard face for pay and tap/connec ct usage. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAFT CONFIDENTIAL May 2014 8 left side view l w DXC (secure digi 6. SD e memory card s The 2 T TB. ystem power but 7. Sy e system indicato The The e power button h Standby mode the system in st return to active Shut down: Pre 2 seconds but le prompt to shut d Forced shut do more than 10 se down. ital extended ca slot supports SDX pacity) memory XC cards with me card slot mory up to ndicator light tton and power i or LED lights up w when the system ns:
as three function e: Press and relea ase the power bu tandby mode. Pre ess and release a mode. power button for ess and hold the onds to activate a ess than 10 seco down the system
. own: Press and h hold the power bu econds to force a an immediate sys is active. tton to put again to more than slider utton for stem shut 1. Power (DC) i 1 Insert the bun battery pack a battery. input port and p ndled power adap and supply powe power status ind pter into this port r to the system. S icator to charge the See charging the 2. USB 3.0 port 2 This Universa rate of up to 5 provides pow while in stand 3. Main system 3 This switch is necessary for disconnect m main system switch for det 4. Headphone/
4 The combo p speakers or h 5. Real Time C 5 This switch is necessary for a system rese battery provid information s CMOS reset sw t, compliant with al Serial Bus 3.0 (
5 Gbit/s and is ba wer for charging ot dby state. m battery disconn s for debug and v r normal usage. I main system batte battery. See syst tails. microphone com port allows connec headphones, or c lock (RTC) CMO s for debug and v r normal usage. I et and clear CMO des constant pow uch as time and d witch for details. h USB charging
(USB 3.0) port pr ackward compatib ther devices such spec 1.2 r rovides a transfer ble to USB 2.0. A Also h as cell phones nect/connect sw alidation purpose nsert pin or pape ry. Press again to tem battery disco witch es and should not er clip, press to o reconnect the onnect/connect t be mbo jack port ction of the SDS t connection to an e OS reset switch alidation purpose nsert pin or pape OS settings. The R wer for storing sys date. See Real T to amplified external micropho one. t be rce es and should not er clip, press to fo Real Time Clock stem BIOS setting ime Clock (RTC) gs r right side vie ew ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 9 es the SDS displ ay orientation in a all modes (laptop p, tablet, display, a and tent.) ume. ume. k button 8. Rotation loc 8 ock button secur The rotation l button 9. Volume up b 9 ease system volu Press to incre wn button 10. Volume dow 1 rease system volu Press to decr t 11. USB 3.0 port 1 This Universa al Serial Bus 3.0 (
12. HDMI port 1 Full size Type 13. RJ45 Gb Eth 1 Use the LAN e A HDMI version hernet LAN jack port to connect to
(USB 3.0) port pr rovides a transfer r rate of up to 5 G Gbit/s and is backw ward compatible n 1.4a port for pro ojecting audio and d video to externa al sources includi ing televisions an nd audio receivers s. o a network. See using the RJ45 G Gb Ethernet LAN jack for more inf formation. to USB 2.0. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 10 f front panel v view 14. World-fa Dual wor acing microphon ld-facing microph nes hone, used with w world-facing came era. 15. Lid Inse lift area ert fingers and lift t to open system lid. r rear panel vi iew s 16. Air vents Keep the systems air ven performa nce. M card slot ed for LTE/3G W with system. Con r a micro SIM car into the pin hole less WAN and SI 17. Micro SIM To be use included carrier fo small pin See wirel ts clear of obstru ction for optimal WAN connectivity ntact your cellular rd. Insert the end to remove the ca M card. y. Micro SIM card d not s r communications of a paper clip o r a slot. ard tray from the s 18. Deb Deb See bug port bug port (should n e using the debug not be necessary g port. y for normal syste em use.) ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 11 2 2 using g your sy ed g getting starte ystem W WARNING: To av afety precautions. s void injury, read im mportant safety in nformation in figu ure 2-1 gettting started tem the first time:
T To start your syst all components fr rom the box and 1. Remove s. materials 2. Flip the s system to Laptop the protective sle 3. Remove 4. Connect the AC power co the cord t to the system and connecte ed to power sourc t) to fully charge b overnight e power button. 5. Press the 6. Follow on nscreen directions stem does not in NOTE: This sys N on key. A Micros activatio to activate the o required ce. this devi Mode (see syste eeve. rd to the AC/DC a d plug into an out ce for a few hours battery. s to configure sys clude an operat soft* MSDN* pro operating system packaging m orientations.) adapter; connect tlet. Leave system m s (preferably stem. ting system duct key is m installed on ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 12 s system orien T The system has f t the system and a ntations four different orien s a keyboard cov e laptop mode l L Laptop mode is th he standard comp a alignment for gen neral computer fu la f figure 2-2 aptop mode ntation modes: la ver in tablet mode aptop, tablet, disp e. lay, and tent. The e included protec ctive sleeve functi ions as a carrying g case for puter usage mode nctions while wor e, with the displa rking at a desk or y screen tilted up r with the comput p at an angle to th er on your lap. he keyboard. This s mode provides comfortable ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 13 t tablet mode T This mode offers k keyboard and tou Y You can use the w f figure 2-3 shows o orientation so sys S See figure 2-7 for the ability to use uchpad are disabl world-facing cam how to rotate the stem movements r instructions on u the system as a ed in this mode f mera (see using th e system from lap dont result in dis using the protectiv modern Windows for proper handlin he cameras) in tab top to tablet mod splay rotation. ve sleeve to cove s* 8.1 touchscree ng of the system w blet mode to take e. The rotation lo en tablet, without without accidenta e pictures and vid ock switch located using the keyboa al key strikes. deo. d on right side of ard or touchpad. T The the device locks the display er the keyboard w while in tablet mod de. f figure 2-3 ro otating to tablet figure 2-4 tablet mode DRAF T CONFIDENTIAL May 2014 14 ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS e display mode d ers a convenient D Display mode offe s system, or for usi ng the system in d desk or your lap. You can use the e while in this mod k keyboard surface ve sleeve for p u using the protecti orientation for vie touchscreen mod protective sleeve de (see ewing media on y de while placed o e to cover the your on a proper sleeve alig gnment.) ode e offers an altern using your touch tent mo Tent mode media or u native orientation screen. to display mode f for viewing f figure 2-5 d display mode figure 2-6 tent mode e ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 15 u using the pro otective slee T The protective sle eeve provided wit d damage and as a a keyboard cover a alignment. The pr rotective sleeve in h pen to bottom o Note: do not push N s f figure 2-7 sleeve alignment f eve th your system ca to protect agains ncludes a storage of pocket; constan for laptop carry m an be used as bot st dirt or spills whe e pocket for the a nt pressure on pe mode th a carrying case en in tablet or dis active pen. en tip may result i figure 2-8 e when the syste splay mode. figure em is not in use to e 2-7 and figure 2 o help protect aga 2-9 show proper s ainst sleeve in damage or redu active pen duced battery life. n pocket f figure 2-9 s sleeve alignment f for tablet mode figure 2-10 0 system an nd sleeve in tablet t mode ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 16 u using the tou uch screen T The system is eq uipped with a mu ulti-touch HD disp play screen suppo orting the followin g standard gestu ures. f figure 2-11 to ouch screen gest tures Left edg Swipe f shuffle t ge swipe of the screen to rom the left edge the running apps
. edge swipe rom the right edg the charms bar. Right e Swipe f launch t ge of the screen to o Tap a To m drag To cl the ru botto and hold move an app, tap a it to a new locatio ose an app, tap a unning app and d om of the screen t tile and and hold the app on. and hold the top s side of e drag it down to the to close it. Zoom Bring Zoom Sprea m out g together two fing m in ad apart two fing gers on the displa ay. y. ers on the display Top edg In the S edge of bar. In a run of the sc ge swipe Start screen, swip f the screen to vie e from the top ew the All Apps ning app, swipe f creen to view its from the top edge e menu. Scroll Touch a on the d text, or and slide a finger display to scroll th other content. in any direction hrough pictures, g Drag ch and drag your f Touc move e an item to a new finger on the disp w location. play to Rota Touc hand ate ch an item with tw d to rotate. (Not al wo fingers and twi ll items rotate.) st your F For more details: h http://windows.micro osoft.com/en-US/w windows-8/get-starte ed c customizing T Touch screen fun the touch sc nctions including d creen functio double-tap, press ons s and hold, and vi isual touch feedb back can be config gured to optimize e your user exper rience. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 17 Go to Control Pa G anel > Hardware and Sound > Pe en and Touch >
Touch to configu ure your touch scr reen functions. Choose D of the Pen configure show) visu Double-tap or Pres n and Touch pop your Touch Feed ual feedback whe ss and hold from up window. Click dback settings to en you touch your the Touch tab k Settings. Or, show (or not r display. In th box finis he Double-Tap S x, choose the sett shed. ettings or Press a ting you want to c and Hold Settings customize. Select s dialog t OK when figure 2-12 2 touch settin gs figu re 2-13 doub ble-tap and press s and hold setting gs Y You can also cus F From this menu y tomize settings th you can configure hrough the Table e pen and touch s t PC Settings me settings, calibrate enu (go to Contro the display (not r ol Panel > Hardw recommended) a ware and Sound and change the ha
> Tablet PC Set andedness of the ttings.) e display. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 18 The Display t touch display is not recomm tab includes displ y configuration op mended. ay, orientation, a tions. The Calibr nd pen and rate function The Ot setting ther tab includes configuration. handedness and pen and touch figure 2-14 d display settings figure 2 2-15 other sett ings ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 19 u using the tou T The system is eq v variable pressure uchpad uipped with a pre e detection and a essure-sensitive S maximized gestu Synaptics* ForceP ure area for a fast Pad* touchpad. T t and fluid Window The ForcePad is a ws 8 user experie a multi-finger, but ence. tton-less touchpa ad with figur re 2-16 touchpa ad gestures T The Synaptics dri s standard touch ge p pinches, swipes, f finger flicks. T The Synaptics Ge o options for multi-f h help navigate, zo d documents and p f figure 2-17 shows S Synaptics Gestur t through the pointi a application. iver incorporates estures including finger scrolling, a and all rs esture Suite offer es to finger flick gesture om, and manipula ate programs. s how to reach th re Suite software ing device proper rties e f figure 2-17 to ouchpad configur ration F For more details:
http://www.syna aptics.com/solutio ons/products/force epad ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 20 with this system is s a high accuracy y pressure sensit tive pen with butto on, hover, and flic ck figure 2-18 installing the a active pen battery y tive pen ve pen included w ense Pen 2* activ orts the following:
active pen suppo HWR) ing recognition (H ng (including HW WR/search) n ument annotation oks and curriculum m annotation tion tools ation/white-board and graphics edia (photo anno nfrastructure (Fla tation) ash and AIR) ing u using the act T The N-trig* DuoS c capabilities. The a Handwrit Note taki PDF/docu E-textboo Presenta Collabora Drawing Digital me Internet in Games T The DuoSense P l evels of pressure e experience. Touc o objects or to hand en 2 acts like a re e sensitivity for a ch the pen tip to th dwrite or markup 256 distinct egular pen, with 2 aper natural pen-on-pa he display to sele ect onscreen in an application
. f figure 2-19 active pen buttons a s Tap or hold butt on when touching g tip to screen to Right Click or fo or application spe ecific functions. Press button for r Eraser tool or o other application s specific function. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 21 c customizing C Customize the ac n navigational flicks the pen beh ctive pen behavio s and editing flick havior r to optimize you ks (up, down, left, r user experience right, and diagon e. You can custom nals), as shown in mize navigational n figure 2-20 thro l flicks (up, down ugh figure 2-23.
, left, and right) o or N Note: a right mou M Microsoft* Window J Journal*, Microso use click function ws* 8.1 Pen Con oft Office*, Sticky can be achieved figuration applet. Notes*, and the S by touching and This functionality Snipping Tool*. holding the pen t y is available in th tip to the display. he Windows Desk This option can b ktop interface, as be configured in t s well as in Windo the ows P Pen gestures can C Control Panel >
n be configured in Hardware and S n the Microsoft W Sound > Pen and indows 8/8.1 pen d Touch > Pen O n configuration ap Options. pplet here:
f figure 2-20 p pen and touch scr reen fig gure 2-21 na avigational flicks In the Pen window, se and Touch pop u elect the Flicks ta up ab. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS On the Flic Navigation down, left, cks tab, select nal flicks to config and right flicks. ure up, DRAF T CONFIDENTIAL May 2014 22 f figure 2-22 n navigational and e editing flicks figur re 2-23 cu ustomize flicks In the Pen window, se and Touch pop u elect the Flicks ta up ab. On the Flic Navigation flicks to co right and d cks tab, select nal flicks and editi onfigure up, down diagonal flicks. ng
, left, The pen supports T Scroll forw Drag up/d Copy: flic Paste: flic Undo: flic Delete: fl s multiple flick ges ward/backward: f drag down: flick t ck the pen upward ck the pen downw ck the pen downw ick the pen upwa stures, including flick the pen to th he pen upward o d at a diagonal to ward at a diagona ward at a diagona ard at a diagonal t the following:
e left across the s n the screen to d o the right corner al to the right corn al to the left corne to the left corner o orward. screen to scroll b rag up, or downw of the screen to c ner of the screen er of the screen to of the screen to d backward or to the e right to scroll fo ward to drag down n. copy. to paste. o undo. delete. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 23 s supporting environ nment app p name app description pen button support pen pressure sensitivity examples of f applications e n a an active pe ffers a broad rang T The active pen of erent applications u users across diffe cations available s small list of applic s support an active pen. applications are NOTE: These a N Solution Development S nd ge of functions an s. This chart provi ides a at in the market tha not included wit System. th the F For more details:
h http://www.n-
t trig.com/Content.as spx?Page=TechDu uoSenseActivePen Microsoft t Windows s Desktop interface ArtRage* 4 BlueBeam* R Corel* Paint I Grahl* PDF A Microsoft* Ma 6.2 PDF Dra Revu*
It Touch*
Annotator*
ath Input Panel Pen mat PDF Dra awing F annotation awing F annotation n-to-text for writing thematical equations Microsoft* Of ffice 2013 Suite Microsoft* On 2013) Microsoft* Sn neNote* (Office Not te taking nipping Tool Ann notation Microsoft t Windows s 8 Live Tiles s modern interface Xoanan* Doo odleinator*
Cre anim eating doodle mations MyScript* No otes Mobile*
Not te taking Spritehand* P Physamajig*
Doo odling physics game Halfbrick* Fru uit Ninja*
Gam me Autodesk* Sk Express ketchbook*
Dra awing Yes Yes Yes Yes Yes Yes Yes Yes No Yes No No Yes Yes Yes Yes Yes No Yes Yes Yes No Yes No No Yes ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 24 u using the key T The system has a yboard a full size backlit k keyboard. Stand ard keyboard fun nction commands commands function key f k keyboard layout a f figure 2-24 and function keys and shortcuts ar re supported. other keyb board functio ons boot up keys F2 = BIOS F7 = boot o
:
setup options Windows sho http://windo ortcuts:
ows.microsoft.com m/en-US/windowws7/using-your-ke eyboard ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 25 u using the ca T The system includ meras des a user-facing g webcam (in two different configu rations) and a wo orld-facing camer ra for use in table et mode. u user-facing w T The user-facing w webcam webcam is located d at the top of the e display screen a and is used for pi ctures, video and d video conferenc cing. ailable with two u user-facing T The system is ava w webcam options:
gure 2-25 fi 2D D camera configu uration SKU A A: standard 1080 0P full HD webca am fi gure 2-26 3D D camera configu uration SKU B
: Intel RealSen plus 1080P fu nse 3D Camera a F200 a ull HD 2D camera S See Recyclable:
u unsorted municip e ensure safe an e environment. T r recyclable comp d development use recycling, or recy r y your local au e environmental re ntel 5th Generation I U USER MANUAL (Rev Do not dispose o pal waste. Recy nd proper prote his device con ponents. At e, return the dev ycle in a manner thorities. Re gulations for pro of this device in cle properly to ection of the ntains certain the end of vice to Intel for r acceptable to efer local per recycling. to Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 26 Battery Pack:
to remove the evice or battery ies] in this dev d by users them rate Material: L contains Perch g may apply. S sc.ca.gov/haza tice is required ions, Title 22, D nagement Prac s. This device s Perchlorate m Lithium attempt to the de battery[
replaced Perchlor Battery handling www.dts This not Regulati Best Ma Material contains Power E fficiency (as sh ws 8.1 installed
(Window Balanced Power B Put C Batte Put C
(Plug Except to recy battery pack a y pack may occu ice cannot be e mselves. cle, do not s damage ur. The easily Lithium (Coin C lorate material See rdouswaste/pe by California C Division 4.5, Ch ctices for Perchl includes a batt material. Cell) special rchlorate. ode of hapter 33:
orate tery which Settings hipped) Default
):
r Plan:
Computer to Sle eep (On s. ery): 4 minutes eep Computer to Sle gged In): 10 mi inutes. H Hibernate: Criti C Critical Battery cal Battery Act Level reaches 2 ion when 2%. for important safe ety and regulator ry information. w world facing camera (tab blet mode) T The world facing camera is located d on the keyboard d ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS figuure 2-27 wo orld facing camerra DRAF T CONFIDENTIAL May 2014 27 p panel face and is u up in tablet mode c correctly orient th used in tablet mo e with the hinges p he world facing ca ode. Hold the sys pointing down to amera. stem f figure 2-28 w world facing came era controls figu ure 2-29 wo orld facing camer ra location u using the sys S Sensors integrate Accelerom stem motion ed into the system meter and gyrosc isplay as the syst sensors m detect orientatio cope: detects mo tem orientation ch portrait d on, movement, an otion and orientat hanges while in ta nd ambient light. ion changes, for ablet mode. example to shift t the on-screen ima age from landsca ape to ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 28 Ambient rooms or Near Fiel operation with Micro Infrared (
sensor is Barometr navigatio developin Light Sensor (AL to conserve batte d Communication ns within Windows osoft Windows 8.
(IR) user proximit not currently sup ric pressure: dete n capabilities. T ng future applicat S): detects room ery power in low ns (NFC): detect s or for faster on-
.1 Proximity Serv y: detects heat a pported under Wi ects changes in a The barometric pr ions or operating m light intensity, fo light room. ts other NFC ena
-line payment tran vice APIs and Inte and/or human pre ndows 8.1 and is air pressure, such essure sensor is systems or example to adj ust onscreen disp play brightness to o improve readab bility in bright bled devices (suc nsactions at appr el Identity Protec esence to prompt s intended for use h as with elevation currently not sup ch as smartphone ropriately enabled ction Technology the system to wa e in developing fu n changes, and c pported under Win es or credit cards d web sites. The y middleware for ake up or to enter uture applications can be used to fac ndows 8.1 and is s) to initiate data t e NFC solution is Tap and Pay se r standby mode. or operating syst cilitate improved intended for use transfer compliant ervices. The IR tems. indoor e in T The system also e enabled devices (
t transactions at ap P Protection Techn includes a Near F
(such as smartph ppropriately enab ology middleware Field Communica hones or credit ca bled web sites. T e for Tap and Pa ation (NFC) soluti ards) to initiate da The NFC solution ay services. on to detect othe ata transfer opera is compliant with r NFC enabled d ations within Micro h Windows 8.1 Pr evices. The ante osoft* Windows*
roximity Service A nna detects othe or for faster on-lin APIs and Intel Id r NFC ne payment dentity ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 29 u using the fin T The fingerprint se s setting up fingerp F Fingerprint acces gerprint sen ensor can be used print access. If yo ss can be set up f sor d in place of typin ou already have a for each user acc ng a password to a system login pa ount on the syste streamline the sy ssword for the sp em; multiple finge ystem login proce pecific user accou erprints can be as ess. Set up a sys unt, skip to setting ssociated with eac stem login passw g up fingerprint a ch user account. word prior to ccess. F First, set up a sy s specific user acc a at system login, th ystem login pass count. Select the hen:
sword for a e desired account t figure 2-30 0 setting up sy ystem login passw word y Charms bar. 1. Swipe fro 2. Select Se 3. Select Ch 4. Select Ac 5. Select Sig 6. Select Ad om right to display ettings. hange PC Setting ccounts. gn in options. dd password. gs. N Next, set up fing gerprint access:
figure 2-31 setting up fin ngerprint access 1. Same pa password Fingerpri 2. Log in us 3. Using firm not swipe 4. When 8 t complete 5. Optional, from a dif different u S Sign out, sign bac i n options) to con th as setting up t d, but for Step 6, nt. sing your system m pressure, tap/h e) to the sensor 8 taps have been s ed, select Finish. add another fing fferent finger, diff user). ck in (choose Fin firm your fingerpr he system login choose Add unde er login password. old your finger (d 8 times. uccessful do gerprint (up to 12, ferent hand, or gerprint under Si rint access. gn ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 30 w wireless WA A A micro SIM card C Contact your cellu b beta (DVT2 an D Due to safety and b below if you choo AN and SIM c d must be installed ular communicati nd DVT3) syste d regulatory certif ose to enable the card o use the integrat d in the system to micro SIM card. ons carrier for a m the WWAN ha ems: enabling l Beta (DVT2 and fication issues, al WWAN hardware e. ted LTE/3G WWA AN connectivity. M Micro SIM card n ot included with s system. ardware d DVT3) systems are shipped with h WWAN hardwar re disabled. Follo ow the steps N Note:
RF ex anten trans xposure: This en nna structure mus mit antenna struc ngineering sampl st be at least 20 c cture is located o e system contain cm from the user n the top right ed ns a WWAN wirele or nearby person ge of the LCD dis ess radio that tra ns in all usage or splay. nsmits RF energy rientations of the s y. The transmit system. The WW WAN
:
WWAN hardware standby and syste system off (see s on, IMMEDIATEL LY press F2 to en em shut down.) nter the system nabled status:
ff (see standby an EDIATELY press nd system shut d F2 to enter the sy down.) ystem 1. 2. 3. 4. 5. 6. S Steps to enable W Power Power BIOS. Select Select Select Select USB2 p Select from En Press F 8. 9. Press E 10. Select 7. Intel Advanced. PCH-IO Configur USB Configuratio USB Physical Co port to Enabled. USB Per-Connec nabled to Disable F4 to save setting Esc three times. Continue to exit B ration. on. onnector #2 and c ctor Disable at top ed. gs. BIOS setup. change from Disa able p of list and chan ge ble at top of list an nd change
#2 and change fro om Enabled Steps to c check WWAN En Power system of Power on, IMME BIOS. Select Intel Adva Select PCH-IO C Select USB Con Select USB Per-
from Disabled to Select USB Phys to Disable USB2 Select F4 to sav Press Esc three Select Continue 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. anced. Configuration. nfiguration.
-Connector Disab o Enabled. ysical Connector #
2 port. ve settings. times. to exit BIOS setu up. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 31 i nstalling the m micro SIM card WARN ING: MAKE SUR RE SYSTEM IS FUL LLY POWERED O FF BEFORE INSER RTING THE SIM C CARD TRAY WARN ING: INSERTING TO INSERT G THE SIM CARD T CORRECTLY, MA TRAY INCORRECT AKE SURE PIN HO TLY CAN CAUSE OLE IS LOCATED C DAMAGE TO THE CLOSER TO DEBU E SYSTEM. UG PORT. 2-32):
erting micro SIM Procedure for ins P wer the system co Pow 1. nvert system to L 2. Con 3. rn system upside Tur ert the end of a p Inse 4. ert card as shown 5. Inse ert card with pin h Inse 6. rn system on. 7. Tur e the Windows ne 8. Use in nserting the micro f figure 2-32 card (see figure ompletely off. aptop Mode and down so system aper clip or a sm n in step 3 of figu hole to side of slo etwork device set o SIM card close the lid. p. label is facing up all pin into the pin n hole to remove re 2-32. ot closer to debug g port. the card tray from m the slot. ttings application to configure wire less WAN netwo rk connectivity. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 32 u using the RJ J45 Gb Ether rnet LAN jac ck s delicate and ma mage. Different ay not always pr rovide a secure n may result in a m network cables m figure 2-3 33 using the etwork cable con more secure conn Ethernet LAN jac nnection. Handle nection. ck e the RJ45 connec ctor N Note:
The R with To use the LAN ja T 1. Gently pre 2. Carefully l outward. 3. Plug in yo 4. When finis bracket in, RJ45 connector is care to avoid da ack:
ess in on the jack ift up on the top b to pop it out. bracket, unfolding g it ur cable. shed, carefully re
, and press back move cable, fold into system. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 33 u using the HD T The HDMI to VGA DMI to VGA a A adapter is used adapter d to connect the s system to a VGA monitor or projec ctor. figure 2-34 VGA dispplay adapter T To activate the di 1. Connect located o 2. Connect 3. Press the p key to 4. Choose a screen on splay:
the HDMI end of on the right side o the VGA end of t e Windows key (to o open the display a display option: e nly. the adapter to th of the system. he adapter to a V o the left of the A y pop up. extend, duplicate e HDMI port VGA display. Alt key) and the or second ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 34 standby and s system shu s t table 2-1 standby and shutd t down down options o options steps u using the Windows Charms bar u using Ctrl + Alt + D elete on the keyboa ard f from the login scree en u using Alt + F4 on th he keyboard u using the system po ower button f forced shutdown (w when system locks up) Using the touchscr then tap Power a Simultaneously pre lower right corner a From the login scre select Sleep, Shu From the Windows out, Sleep, Shut Press and hold the than 10 seconds to or Restart from th Press and hold the down. Use of this o reen swipe from the nd select Sleep, ess Ctrl/Alt/Delete and select Sleep, een instead of ente ut down, or Restar s desktop press Alt down, or Restart e system power but o launch the Shut D he drop-down list. e system power but option should be av e right edge of the Shut down or Res keys to bring up the Shut down, or Re ering a password ta rt.
+F4 to launch the from the drop-dow tton on the left side Down Windows me display to access t start. e log-out screen. T estart. ap the Power icon Shut Down Window wn list. e of the system for m enu; then select S the Charms bar, tap p Settings, Then tap the Powe er icon in n in lower right corn ner and ws menu; then sele ect Sign more than 2 secon ign out, Sleep, S ds but less hut down, tton for more than 1 voided if possible; a 10 seconds to force any unsaved data w e an immediate sys will be lost. stem shut w waking from To wake the syste T from clos from any standby em from standby sed lid laptop mod other open lid or mode:
de simply open th r tablet mode pres he system lid ss the system pow wer button e battery c charging the I IMPORTANT! Us se only the bundle d power adapter I Insert the bundled of the batterys ch visual indication o v o Solid Gre een:
The U o Solid Ora The U ange:
o Blinking O The U Orange:
o Lights Of ff:
The U ed power adapter into the power po harge status:
Ultrabook system Ultrabook system Ultrabook system Ultrabook system r to charge the ba ort to charge the b attery pack and su battery pack and upply power to th supply power to t he system. the system. The two-color LED pr rovides a is plugged in to a is plugged in to a is running on the is running on the a power source a a power source a e battery and the e battery and the and the battery po and the battery po battery power is battery power is ower is 100%. ower is between 0 less than 10%. between 10% an 0% and 100%. nd 100%. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 35 u using the de T This port is for de d debug port requir I Insert a small flat bug port ebug and validatio res a dedicated de screwdriver into on purposes for u ebug card not inc the slot on the ba use by Intel and s cluded with the sy ack of the system hould not be nec ystem. m to remove the d essary for norma al use and softwa re development. Use of the ebug port cover. Insert the debug card into the ope en port. DRAF T CONFIDENTIAL May 2014 36 ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS 3 3 t table 3-1 t technical s system features specifica ations feature Form factor and w weight Processor Graphics OS Display Memory Storage Communications Camera & Mics IO connectors Connected standb by Sensors Battery Power adapter 6 mm, compliant w ouch touchpad ell-ULT dual core), uded with system fo ntGo (Connected S h PSR, 5+-finger mu GA)
), M.2 (NGFF) mo ne Peak) 802.11ac 0 GHz 802.11ad W led in system eld Communication ntel XMM 7160 silic Intel RealSense 3 e, ~3.4 lbs., z = 18.6 ard, 5 finger multi-to Processor (Broadwe ustomer Letter inclu n5, GT2) 1* supporting Instan 0 x 1800), eDP with ng at 1333 MHz (B SSD (Temple Star ess-AC 7265 (Ston tel Maple Peak 60 k module not install 547) NFC (Near Fie WWAN w/ GNSS (In camera (SKU A) or n descriptio 2-in-1 Convertible 13.3 Full-s size backlit keyboa 5th G Gen Intel Core P uency (see Dear Cu frequ HD Graphics (Gen Intel Micro osoft* Windows 8.1
, 16:9, QHD (3200 13.3 B LP-DDR3 operatin 8 GB 180G GB Intel Pro 2500 S Dual Band Wirele Intel gned to support Int Desi face) Maple Peak interf NXP NPC100 (aka PN5 7160 4G LTE/3G W FIH7 080p user-facing c 2D 1 indic cator era with flash 8 MP P world-facing came r 3x lid (SKU B) or d (2d Uf camera) or 2x lid MI out (1.4b) , 2x US SB 3.0 ports with U HDM N jack, RJ45 Gigabit LAN indows 8.1 Connec cted Standby requir compliance with W Full c d r Optimizer-enabled
- and Intel Power S0ix-
, accelerometer, gy ALS, yroscope, compass
, NFC (for tap usag Finge erprint sensor S/GNSS (on WWAN GPS Whr, Lithium-ion, Sim 50W Delta a ADP-45BE AA N), sensor fusion mplo* 2s2p arrange Input : 100~240 V ement V /1.3A , 50~60 Hz and 2x base array USB charging spec with 2014 Intel Ultr rabook Definition n Rev. 1.3 15 W TDP, interna or more information al or PQS sample 2 n) 2.0 GHz or greater base Standby) ulti-touch with Activ ve Digitizer odule, SATA interfa c 2x2 PCIe Wi-Fi w iGig + 2x2 802.11a ace w/BT 4.0 M.2 modu ac WLAN + Bluetoo le oth 4.0 M.2 module e, PCIe / USB n) Galapagos mod on), M.2 module, U 3D+ 2D 1080p use dule with antenna b USB interface er-facing camera (S booster, NCI interfa ace SKU B) with LED ac ctivity s digital microphones 1.2 support) SDXC C card reader, micr roSIM, 3.5 mm com mbo audio rements ges), IR proximity, b barometric pressur re Output: 20 V / 2.2 25 A, 45 W ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 37 nd troub leshooti ing ration an c 4 configur 4 ystem BIOS entering the sy e ystem off (see sta 1. Power sy andby and system n, IMMEDIATELY 2. Power on Y press F2 to ente 3. Configure e settings as desi ired. 4 to save settings s. 4. Select F4 c until you return 5. Press Es 6. Select Co ontinue to exit BIO to main BIOS me OS setup. enu. m shut down.) er the system BIO OS. s selecting the s P Press F7 during s system boot de system power on evice n to select boot d evice or to boot to the EDK shell
. s system battery I If your system sto p provides the elect y disconnect/co ops responding o trical equivalent o onnect switch r fails to boot, the of removing the b e system battery r battery from the sy reset switch ystem. figure 4-1 system bbattery reset To disconnect the T Insert a p found. 1. e battery from the pin or paper clip a e system:
as shown in Error r! Reference sou urce not 2. Press in a 3. Wait a few 4. Repeat S 5. Power sy and release to dis w seconds. Step 2 to reconne ystem up as usua ct battery. al. sconnect the batt tery. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 38 R Real Time Clo T The RTC provide s system CMOS re i nto hole on side ck (RTC) CMO s constant power gion. To restore f of system, press h OS reset switc omized BIOS sett r for storing custo factory default va alues insert pin or and release. ings in the r paper clip figure 4-2 RTC CMMOS reset ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 39 5 5 R REGULA ATORY N T This informatio N ENGINEERI SYSTEM IS AN r test, evaluatio is provided for esigned to m eet or excee NOTICES S ept with the de on should be ke PMENT DEVIC ING DEVELOP nstration purpo on, and demon ed internation nal Safety, E THIS S This device is de S SAFETY WA ARNINGS AN ND CAUTIO ONS evice for future CE. NOT OFF oses only as pe MC, RF and E e reference. ERED FOR SA ermitted in you Environment SE. ALE OR LEAS ur region. This s device s. tal standards apter provided ot user-servicea attempt to rem ged crushed or with the device able; the batter ove the battery severely dropp e. Other power ry[ies] in this d y pack as dama ed, to ensure s r adapters may evice cannot be age to the devic safe and proper overheat or da e easily replace ce or battery pa r operation, ret amage the devi ed by users ck may occur. for turn it to Intel f ce. 1. Use only 2. The bat themse 3. If the d servicin 4. If the d environ 5. Do NOT 6. Caution can cau 7. This de camera also co 50, dat Do not m the c is da here y the power ada ttery pack is no elves. Do not a device is damag ng. device is expose nments over 10 drop the device n should be exe use hearing loss evice may conta a complies with mplies with US ted June 24, 20 modify, attemp camera module amaged in any ein may result in ed to excessive 00 degrees C. e in water, as t ercised during lo s. ain an Intel R International S S FDA performa 007."
t to open or se e might cause t manner. Use o n hazardous ra temperatures the battery ma ay fail. Do not e expose the devi ice to the device is no ong exposure to ot waterproof. o excessive sou Operation and und levels from device failure m m earphones and may occur. d headphones a as this RealSense 3D Standard EN/IE nce standards Camera modu EC 60825-1:200 for laser produ le that contains 07 edition 2 for cts except for d s an integrated r a Class 1 lase deviations purs d laser projecto er product. The suant to Laser n r. The e camera notice No. rvice the came he emissions to of controls or ad diation exposu ra module with o exceed the C djustments or p re. hin this device i lass 1 level. Do performance of in any way. Mo o not activate t f procedures ot odification or se this device if th ther than those ervice of he camera e specified ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 40 E EMC STATE Federal Com This equ the FCC installat accorda guarante to radio try to co EMENTS munications C uipment has be Rules. These li ion. This equip nce with the ins ee that interfer or television re orrect the interf Commission R en tested and f imits are design ment generates structions, may rence will not oc eception, which ference by one egulatory Sta found to comply ned to provide s, uses, and ca y cause harmfu ccur in a partic h can be determ or more of the tement y with the limit reasonable pro n radiate radio l interference t ular installation mined by turning e following mea ts for a Class B otection against frequency ene o radio commu n. If this equipm g the equipmen sures:
digital device, t harmful interf ergy and, if not unications. How ment does caus nt off and on, t pursuant to Pa ference in a res installed and u wever, there is n se harmful inter he user is enco art 15 of idential used in no rference ouraged to Reorient or r Increase the Connect the Consult the d relocate the rec separation bet equipment into dealer or an ex
. ceiving antenna pment and rece tween the equip a circuit differen o an outlet on a perienced radio o/TV technician eiver. nt from that to for help. which the rece eiver is connect ed. Caution n: To assure continued FCC compliance op eration is subje ect to the follow wing two condit tions:
may not cause h must accept any harmful interfe y interference r rence. received, includ 1 1) This device m 2 2) This device m C Changes or mod o operate the equ difications not e uipment. ding interferenc ce that may cau use undesired o operation. expressly appro oved by Intel C orporation coul ld void the deve eloper's author rity to This dev vice complies w with the applicab ble FCC rules. F FCC ID: RMXWS SBUB-SDS FCC RF Expo This equ antenna sure Stateme uipment complie a must not be co nt es with FCC RF o-located or op F exposure limit perating in conj ts set forth for a unction with an an uncontrolled ny other antenn d environment. na or transmitte This device an er. The most ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL d its May 2014 41 conserva accorda ative SAR meas nce with the Us sured was 1.49 ser Guide and t 9W/kg which is the content of t below the FCC the FCC applica limit of 1.6W/k ation. kg. Usage of t he device shou ld be in CE Mark vice can be ope nce with the es mmunications Te sign and 2006/
rated in EU wit ssential requirem erminal Equipm
/95/EC Low V hout restriction ments and othe ment, 2004/108 Voltage. This dev complian Telecom Ecode ns indoors. Int er relevant prov 8/EC EMC, 20 el Corporation visions and Dire 011/65/EU - Ro hereby declare ective 1999/5/
oHS, 2012/19/E es that this Ultra abook is in
/EC Radio an d EU - WEEE, 200 09/125/EU I Industry Cana This dev conditio ada (IC) Notic vice complies w ns:
e with Industry Ca anada license-e xempt RSS sta andard(s). Ope eration is subjec ct to the follow ing two 1 1) this device m 2 2) this device m d device. may not cause in must accept any nterference, y interference, i including interf ference that ma ay cause undes ired operation of the C Changes or mod o operate the equ difications not e uipment. expressly appro oved by Intel C orporation coul ld void the deve eloper's author rity to This equ most co and the uipment complie nservative SAR content of the ry Canada radia es with Industr R measured was s 1.49W/kg. U IC application. ation exposure Usage of the de limits set forth evice should be for an uncontr e in accordance rolled environm with the User ment. The Guide I C:1000V-WSBU UBSDS Franais s - Canada C Cet appareil est d dispositif est au l utilisateur du d s susceptible de c t conforme avec utorise seulem dispositif doit compromettre l c le licence-exe ent aux deux c tre prt acce e fonctionneme empt standard conditions suiva pter tout brouil ent du dispositi RSS(s) d'Indus antes : (1) il ne llage radiolect if. strie Canada. L e doit pas produ trique reu, m Lutilisation de c uire de brouilla me si ce brouil ce ge, et (2) llage est ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 42 C Cet quipement e environnement l'
'appareil doit t C Canada. t est conforme non contrl. L tre en conform Industrie Cana Le SAR la plus c it avec le Guid da limites d'ex conservatrice m de de l'utilisate position aux ra mesure tait d ur et le conten ayonnements d de 1.49W/kg. L u de la demand finies pour un L'utilisation de de d'Industrie Wireless (RF) W Interface T This developme b be restricted or b be required. T This device may in nstallation of a s service provider r requires the exp ent device includ prohibited by r des a wireless regional or nati
(Radio Frequen ional regulation ncy, RF) transm ns; a license for mitter. Operatio r development/
on of the transm
/experimental u mitter may use may y contain a Wire SIM card (or o r (carrier) for y plicit approval o eless Wide Area other network a your location. A of a network se a Network (WW access means) w Authorization to ervice provider WAN) data card which must be o operate a dev
(carrier). Operation of obtained from velopment devi WWAN requires a licensed netw ce on a live net s the work twork F Franais Can u utilisation est so
(
2) cet appareil f onctionnement nada Cet appar oumise Les d doit accepter T t du dispositif. reil est conform eux conditions Toute interfren me avec Industr suivantes: (1) nce, y compris rie Canada RSS cet appareil ne les interfrenc S standard exem e peut pas prov ces qui peuvent mpts de licence voquer d'interf t causer un mau e (s). Son rences et uvais STATEMENT ble: Do not dis on of the enviro he device to Int mental regulati TS spose of this de onment. This de tel for recycling ons for proper evice in unsorte evice contains c g, or recycle in recycling. ed municipal wa certain recyclab a manner acce aste. Recycle p ble components eptable to your properly to ensu s. At the end o local authoritie ure safe and pr of development es. Refer to loc oper t use, cal Battery Pack:
ay occur. The b Except to recy battery[ies] in t cle, do not atte this device cann empt to remove not be easily re e the battery pa placed by users ack as damage s themselves. to the device o or battery rate Material: L sc.ca.gov/haza Lithium (Coin C rdouswaste/pe ell) Battery con rchlorate. This ntains Perchlora notice is requi ate material red by Californ special handlin ia Code of Regu ng may apply. ulations, Title 2 See 22, ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 43 ECOLOGY S E Recyclab protectio return th environm Lithium pack ma Perchlor www.dts ement Practice es for Perchlorat te Materials. Th his device inclu udes a battery w which 4.5, Chapter 3 s Perchlorate m Division contains Power E fficiency (as sh Balanced Power B Put C Put C 33: Best Manag material. hipped) Default r Plan:
Computer to Sle Computer to Sle Settings (Wind dows 8.1 install led):
eep (On Battery eep (Plugged In y): 4 minutes. n): 10 minutes H Hibernate: Criti cal Battery Act ion when Critic cal Battery Leve el reaches 2%. ntel 5th Generation I U USER MANUAL (Rev Core Processor-ba v 0.93) ased SDS DRAF T CONFIDENTIAL May 2014 44
| 1 2 3 4 5 | Users Manual | 1.35 MiB | February 10 2014 |
Intel? Ultrabook System: BiDA Say ENGINEERING SAMPLE/DEVELOPMENT PRODUCT - NOT FOR SALE OR LEASE Property of intel Corporation Model/EI 3: WSBUB-SDS
: This device is for engineering product evaluation and development use as permitted in Technical Support: Contact: SB, Support@inteLcom Yourrepion. Isha not bemarkete, tered forsale eae. Ths device complies with Operating System Activation: A Microsoft MS Product Key is Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this raqred toactivate the Installed operating system, device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Product Code: UBWECSINO MM#: 936696 INTEL CONFIDENTIAL- Commercial Trade Secret of Intel Corporation. Intel, the Intel, and Uttrabook are trademarks of intel Corporation in the US. and/or other countries. For applicable power supply, refer to the user instructions Copyright 2014, intel Corporation. All rights reserved. Senko SAAS This device complies with Canadian ICES-003. CAN ICES-3 (B)/NMB-3(8) FCC ID: RMXWSBUB-SDS IC: 1000v-WwsBUBSDS Other names and brands may be claimed as the property of others. DC Input/ RA: 20V 2.254 Contains FCCID: PD97265NG Contains IC: 1000M-7265NG Contains IC:6719C-NF2 Intel Corporation =|" RR: RSNA] Assembled in China/Z=*P ls8 3& TUVIEC60950-1/A1:2009 COntanS REC REIN ores:
Aun Corporate Quay TO ENSURE SAFETY REFER TO THE SAFETY DOCUMENT ission College Blvd. Santa Clara, CAUSA 95054 123456-001 FZ @ FE HOREL ALLE DRAFT
<>) Intel Ultrabook Development System: @id 7s HL intel) property of intel Corporation Product Code: UBWBCSINQ Model/!5: WSBUB-SDS MM#: 936696 INTEL CONFIDENTIAL- Commercial Trade Secret of Intel Corporation. Intel, the Intel logo, and Ultrabook are trademarks of Intel Corporation in the U.S. and/or other countries. Intel Corporation EP)": BARA Attn: Corporate Quality 2200 Mission College Blvd. Santa Clara, CA USA 95054, Copyright 2014, Intel Corporation. All rights reserved. Other names and brands may be claimed as the property of others. y440967-001 FZ f Technical Support: Contact: [email protected] Operating System Activation: A Microsoft MSDN Product Key is required to activate the installed operating system, For applicable power supply, refer to the user instructions NAAM ERAMS, SRLS DC Input/Ei tlt A: 20V=2.250 Assembled in China/ s HSH ee CE own FE a ENGINEERING SAMPLE/DEVELOPMENT PRODUCT - NOT FOR SALE OR LEASE. This devices for engineering product evaluation and development use as permitted in your region Itshall not be marketed, or offered forsale or lease. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device complies with Canadian ICES-003, CAN ICES-3 (8)/NMB-3(8) FOCID: RMXWSBUB-SDS tc: 1000v-wsBUBSDS TUV IEC60950-1/a1-2009 TO ENSURE SAFETY, REFERENCE THE SAFETY DOCUMENT AMRESAORE LS
| 1 2 3 4 5 | ID Label/Location Info | 674.87 KiB | February 10 2014 |
October 24, 2014 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 Subject: Long-Term Confidentiality Request for Antenna Information. FCC ID: RMXWSBUB-SDS To whom it may concern, We hereby respectfully request that under the provision of 47 CFR 0.459 and 0.457(d) that the antenna documents submitted earlier with our application for certification be provided with long-term confidential status. Antenna Info 01.pdf (NFC) Antenna Info 02.pdf (WiFi/BT) Antenna Info 03.pdf (WWAN) I originally approved that the antenna information be placed in the public domain, but then after the grant was issued it was brought to my attention that the documents contain Intellectual Property secrets between Intel and our suppliers. Substantial competitive harm to us and/or our suppliers could result should the antenna information remain available in the public domain. I am aware that the antenna exhibits for which I am requesting post-grant confidentiality have been publically available since the date of the grant
(October 2, 2014). If you have any questions please feel free to contact Mike Lowe +1 (503) 712-5298. Sincerely, Michael M Lowe Product Regulatory Engineer Intel Corporation Intel Corporation 2111 NE 25th Ave. Hillsboro, OR 97124
| 1 2 3 4 5 | Cover Letter(s) | 20.78 KiB | / February 10 2014 |
September 9, 2014 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 RE: FCC-ID: RMXWSBUB-SDS To Whom it May Concern:
We attest to the following:
the 5600 - 5650 MHz band. Sincerely, Michael M Lowe Product Regulatory Engineer Intel Corporation Per FCC KDB 443999 D01 v01r02 and RSS 210 Annex 9, this device will not transmit in Per FCC KDB 848637 D01 V01, the device is a client device with no radar detection capability. The client software and associated drivers will not initiate any transmission on DFS frequencies without initiation by a master. This includes restriction on transmissions for beacons and support for ad-hoc peer-to-peer modes. Per FCC KDB 594280 D01 v02r01, the device complies with the requirements for software configuration control. The device meets the definition of FCC 15.202 client device and does not have the ability to be configured by end users or professional installers to operate outside the authorized bands Per FCC 15.407(c), the device will automatically discontinue transmission in case of either absence of information to transmit or operational failure. Intel Corporation 2111 NE 25th Ave. Hillsboro, OR 97124
| 1 2 3 4 5 | Attestation Statements | 77.76 KiB | February 10 2014 |
FCC Compliance Opinion WTD 13.4.9 Information about the Applicant Grantee (Company Name) FCC Contact Person Address City, State, Zip Job Number Model FCC ID Agent Approval Type Equipment Class Intel Corporation Michael Lowe 2111 NE 25th Ave Hillsboro, OR 97124 INTE5426 Laptop/Tablet Convertible RMXWSBUB-SDS Original DXX Part 15, Low Power Communications Transmitter DSS Part 15, Spread Spectrum Transmitter DTS Digital Transmission System, NII Unlicensed National Information Infrastructure Tx PCB Part 22,24,27 Transmitter 15.225, 15.247, 15.407, 22h, 24e, 27 Rule Part Overview This application is for the original approval of a laptop/tablet convertible converter manufactured by Intel Corporation. The device contains an NFC radio, a WWAN radio, and a WLAN/Bluetooth radio. The WWAN radio is a 3G/4G device operating in the CLR 850, PCS 1900, and AWS 1700 bands;
and LTE 2, 4, 5, 7, 13 and 17 bands. The WLAN/Bluetooth radio is an 802.11 a/b/g/n/ac 2x2 MIMO radio. The WLAN radio operates in the DFS frequency bands as a client device only and is not able to initiate transmission. Confidentiality requested for allowed files. Request is properly addressed and referenced. Recommendation All items have been resolved and completed to my satisfaction; therefore I recommend this application for approval. Signature Dave Tolman, TCB Committee 9/23/2014 INTE5426
| 1 2 3 4 5 | Cover Letter(s) | 20.83 KiB | February 10 2014 |
September 9, 2014 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 Subject: Original Application FCC ID: RMXWSBUB-SDS Dear Application Examiner:
Intel Corporation is submitting this application for certification of their Model WSBUB-SDS, under FCC ID: RMXWSBUB-SDS. The device is a laptop / tablet convertible computer containing a NFC radio. Previously certified WWAN (FCC ID: RYQ-NF2) and WLAN / Bluetooth (FCC ID:
PD97265NG) modular radios are installed. System authorization is sought under FCC 15.225, 15.247, FCC 15.407, FCC 22H, FCC 24E and FCC 27 The WWAN radio is 3G / 4G device operating in the CLR 850, PCS 1900, and AWS 1700 bands;
and LTE 2, 4, 5, 7, 13, and 17 bands. The WLAN / Bluetooth module contains an 802.11abgnac 2x2 MIMO radio. The 2.4 and 5 GHz band use 20 & 40 MHz channel bandwidths for Chain A or B, and A+B combinations. The 5 GHz bands also support 802.11 ac for 20, 40, and 80 MHz channel bandwidths for Chain A or B, and A+B combinations. It also contains a Bluetooth 4.0 radio. The WLAN radio can operate in the DFS frequency bands as a client device only. It has no radar detection and no ad-hoc capability. Intel Corporation declares that the product cannot transmit between 5600 5650 MHz. A DFS test for a client device was performed. The laptop computer can be used closer than 20 cm to the users torso so a SAR evaluation was performed. The main antenna for the WWAN radio is co-located with a proximity sensor. Once the sensor is triggered, the output power is lowered for all WWAN bands. An evaluation of the proximity sensor is contained in the SAR report. The antennas are integral to the laptop computer. They are not user accessible so they meet the requirements of FCC 15.203. The receiver portion of the WWAN radio has been verified to FCC 15B requirements. The laptop computer has been DoC authorized as a Class B computing device. System testing of the NFC radio in the laptop. The following is a summary of the reports submitted with this application:
Type Purpose EMC:
15.225 EMC:
15.247 15.407 Stand-alone module testing of the WLAN / Bluetooth module. Used to demonstrate compliance for antenna port direct connect measurements, and spurious radiated emissions. Stand-alone module testing of the WLAN / Bluetooth module. Used to demonstrate compliance for DFS as a client device. Stand alone module testing of the WWAN module. Used to demonstrate compliance for antenna port direct connect measurements, radiated power and spurious radiated emissions. System level testing of the WWAN module in the laptop computer for radiated power. Reports NWEMC Report INTE5437.1 AT4 Reports 41273RRF.001 41273RRF.002 41273RRF.003 AT4 Report 41273RRF.004 Sporton Lab Reports FG352141A, FG352141B, FG352141-01A, FG352141-01B NWEMC Report INTE5452 System level testing used to demonstrate compliance of AC power line conducted emissions. NWEMC Report INTE5492 System level SAR evaluation of the WWAN module in the laptop. Also includes testing of the proximity sensor. NWEMC Report INTE5478 System level SAR evaluation of the WLAN module in the laptop. NWEMC Report INTE5434 DFS:
15.407 EMC:
22H 24E 27 EMC:
22H 24E 27 EMC 15.207 SAR:
2.1093 SAR:
2.1093 Best regards, Michael M Lowe Product Regulatory Intel Corporation Intel Corporation 2111 NE 25th Ave. Hillsboro, OR 97124
| 1 2 3 4 5 | Cover Letter(s) | 43.91 KiB | February 10 2014 |
August 18, 2014 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 Subject: Long-Term Confidentiality Request FCC ID: RMXWSBUB-SDS To whom it may concern, We hereby respectfully request that under the provision of 47 CFR 0.459 and 0.457(d) the documents attached with this application for certification be provided with long-term confidential status. Schematics Block Diagrams Operation Descriptions Any exhibit / information for which we have requested confidentiality, but which may not be accorded such treatment by the FCC, should be returned to us. The documents attached contain trade secrets that are treated as confidential by us. Substantial competitive harm to us could result should they be made available to the public. If you have any questions please feel free to contact Mike Lowe +1 (503) 712-5298. Sincerely, Michael M Lowe Product Regulatory Engineer Intel Corporation Intel Corporation 2111 NE 25th Ave. Hillsboro, OR 97124
| 1 2 3 4 5 | Cover Letter(s) | 20.61 KiB | February 10 2014 |
Tune Up Procedure Statement WiFi/BT 7265NGW For Model 7265NGW WiFi/Bluetooth card all final output power levels and operational parameters are programmed into the non-volatile memory (NVM) during the assembly process. All output levels are verified prior to shipping to assure compliance and no further tuning is necessary. The information programmed into the NVM is not accessible and cannot be changed by the end user/installer in any way.
| 1 2 3 4 5 | Parts List/Tune Up Info | 29.36 KiB | February 10 2014 |
Tune Up Procedure Tune-up procedure During manufacturing each device is individually calibrated. Measurement is performed in a fully calibrated setup using an Agilent 8960 base station simulator (system tester). Measurement procedure is outlined below:
Measurement Procedure:
1. Set the device to operational voltage and on a predefined channel in a special test mode. 2. The actual output power is measured at several power levels. 3. The gain factors of each individual device are adjusted until the target value is met. The appropriate gain control settings for each output power level are stored in each device individually (for each power level). 4. The maximum gains of each individual device are adjusted and measured until the target value is met. The production target power with tolerance compiles with the maximum power in test report. Then these appropriate gain settings are stored in each device individually. The user has no possibility to change these settings later on, and during manufacturing each device will be individual calibrated in this range. The measurement is done in a fully calibrated setup, which is based on the base station simulator. Furthermore, the highest power level is verified afterwards in a call measurement on each channel. Please find below target values of the maximum level of the production unit:
Nominal Target Burst Average power for Production Unit Mode GSM 850 GSM 1900
(Nominal)
(Nominal) GPRS/EDGE (GMSK, 1 Tx slot) 32.51 29.51 GPRS/EDGE (GMSK, 2 Tx slots) 32.51 29.51 GPRS/EDGE (GMSK, 3 Tx slots) 321 291 GPRS/EDGE (GMSK, 4 Tx slots) 31.51 27.51 EDGE (8PSK, 1 Tx slot) 271 261 EDGE (8PSK, 2 Tx slots) 271 261 EDGE (8PSK, 3 Tx slots) 261 251 EDGE (8PSK, 4 Tx slots) 251 241 Power unit: dBm Nominal Target Power for Production Unit Mode WCDMA Band V WCDMA Band II WCDMA Band IV
(Nominal)
(Nominal)
(Nominal) RMC 12.2K HSDPA Subtest-1 DC-HSDPA Subtest-1 HSUPA Subtest-5 23.51 23.51 23.51 231 23.51 23.51 23.51 231 23.51 23.51 23.51 231 Power unit: dBm HSPA and HSPA+ Target MPR level Since the tolerance of each subtest may differ across all subtests, the MPR deviations are expected for some HSPA and HSPA+ subtests which may differ from the specification of 3GPP, according to the chipset implementation in this model. The MPR settings are permanently implemented configured into firmware and cannot be disabled by the end user or UMTS carrier network. The target MPR level shown below:
HSDPA Subtest Band V Band II Band IV 1 2 3 4 1 2 3 4 1 2 3 4 5 DC-HSDPA Subtest Band V Band II Band IV HSUPA Subtest Band V Band II Band IV 0 0 0.5 0.5 0 0 0.5 0.5 0 2 1 2 0 Unit: dB 0 0 0.5 0.5 0 0 0.5 0.5 0 2 1 2 0 0 0 0.5 0.5 0 0 0.5 0.5 0 2 1 2 0 Nominal Target Power for Production Unit LTE Band 2 Modulation BW (MHz) RB size Nominal Power QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM 20 20 20 20 15 15 15 15 10 10 10 10 5 5 5 5 3 3 3 3 1.4 1.4 1.4 1.4 Target MPR 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 Power unit: dBm 18
> 18 18
> 18 16
> 16 16
> 16 12
> 12 12
> 12 8
> 8 8
> 8 4
> 4 4
> 4 5
> 5 5
> 5 Nominal Target Power for Production Unit LTE Band 4 Modulation BW (MHz) RB size Nominal Power QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM 20 20 20 20 15 15 15 15 10 10 10 10 5 5 5 5 3 3 3 3 1.4 1.4 1.4 1.4 Target MPR 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 Power unit: dBm 18
> 18 18
> 18 16
> 16 16
> 16 12
> 12 12
> 12 8
> 8 8
> 8 4
> 4 4
> 4 5
> 5 5
> 5 Nominal Target Power for Production Unit LTE Band 5 Modulation BW (MHz) RB size Nominal Power QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM 10 10 10 10 5 5 5 5 3 3 3 3 1.4 1.4 1.4 1.4 20 20 20 20 15 15 15 15 10 10 10 10 5 5 5 5 12
> 12 12
> 12 8
> 8 8
> 8 4
> 4 4
> 4 5
> 5 5
> 5 18
> 18 18
> 18 16
> 16 16
> 16 12
> 12 12
> 12 8
> 8 8
> 8 Target MPR 22.51 22.51 221 221 22.51 22.51 221 221 22.51 22.51 221 221 22.51 22.51 221 221 Target MPR 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 22.51 22.51 21.51 21.51 Power unit: dBm 0.5 0.5 0.5 0.5 0 0 0 0 0 0 0 0 0.5 0.5 0.5 0.5 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 Power unit: dBm Nominal Target Power for Production Unit LTE Band 7 Modulation BW (MHz) RB size Nominal Power Nominal Target Power for Production Unit LTE Band 13 Modulation BW (MHz) RB size Nominal Power Power unit: dBm Nominal Target Power for Production Unit LTE Band 17 Modulation BW (MHz) RB size Nominal Power 10 10 10 10 5 5 5 5 10 10 10 10 5 5 5 5 12
> 12 12
> 12 8
> 8 8
> 8 12
> 12 12
> 12 8
> 8 8
> 8 Target MPR 22.51 22.51 221 221 22.51 22.51 221 221 Target MPR 22.51 22.51 221 221 22.51 22.51 221 221 Power unit: dBm 0.5 0.5 0 0 0 0 0.5 0.5 0.5 0.5 0 0 0 0 0.5 0.5 QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM QPSK QPSK 16QAM 16QAM LTE Target MPR level The device implements maximum power reduction per 3GPP 36.101 requirements where the MPR target is as below table. The MPR settings are permanently implemented configured into firmware and cannot be disabled by the end user or LTE carrier network. The following table lists the target MPR level:
For Band 2:
Channel bandwidth / Transmission bandwidth configuration [RB]
MPR Target
(dB) Modulation QPSK 16 QAM 16 QAM 1.4 MHz
> 5 5
> 5 3 MHz
> 4 4
> 4 5 MHz
> 8 8
> 8 10 MHz
> 12 12
> 12 15 MHz
> 16 16
> 16 20 MHz
> 18 18
> 18 1.4 MHz 1 1 2 MHz MHz 10 MHz 15 MHz 20 MHz 1 1 2 1 1 2 1 1 2 For Band 4:
Channel bandwidth / Transmission bandwidth configuration [RB]
MPR Target
(dB) Modulation QPSK 16 QAM 16 QAM 1.4 MHz
> 5 5
> 5 3 MHz
> 4 4
> 4 5 MHz
> 8 8
> 8 10 MHz
> 12 12
> 12 15 MHz
> 16 16
> 16 20 MHz
> 18 18
> 18 1.4 MHz 1 1 2 MHz MHz 10 MHz 15 MHz 20 MHz 1 1 2 1 1 2 1 1 2 For Band 5:
Modulation QPSK 16 QAM 16 QAM For Band 7:
Modulation QPSK 16 QAM 16 QAM For Band 13:
Modulation QPSK 16 QAM 16 QAM Channel bandwidth / Transmission bandwidth configuration [RB]
1.4 MHz
> 5 5
> 5 5 MHz
> 8 8
> 8 3 MHz
> 4 4
> 4 10 MHz
> 12 12
> 12 5 MHz
> 8 8
> 8 15 MHz
> 16 16
> 16 Channel bandwidth / Transmission bandwidth configuration [RB]
10 MHz
> 12 12
> 12 1.4 MHz 1 1 2 20 MHz
> 18 18
> 18 MHz 5 1 1 2 MPR Target
(dB) MHz MHz MPR Target
(dB) 10 MHz 15 MHz 5 1 1 2 1 1 2 10 MHz 1 1 2 20 MHz 1 1 2 Channel bandwidth / Transmission bandwidth configuration [RB]
MPR Target
(dB) 5 MHz
> 8 8
> 8 10 MHz
> 12 12
> 12 MHz 5 1 1 2 10 MHz 1 1 2 3 1 1 2 3 1 1 2 5 1 1 2 5 1 1 2 3 1 1 2 1 1 2 3GPP MPR
(dB) 1 1 2 3GPP MPR
(dB) 1 1 2 3GPP MPR
(dB) 1 1 2 3GPP MPR
(dB) 1 1 2 3GPP MPR
(dB) 1 1 2 For Band 17:
Modulation QPSK 16 QAM 16 QAM Channel bandwidth / Transmission bandwidth configuration [RB]
MPR Target
(dB) 5 MHz
> 8 8
> 8 10 MHz
> 12 12
> 12 MHz 5 1 1 2 10 MHz 1 1 2 3GPP MPR
(dB) 1 1 2
| 1 2 3 4 5 | Parts List/Tune Up Info | 194.65 KiB | February 10 2014 |
| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2014-10-02 | 13.56 ~ 13.56 | DXX - Part 15 Low Power Communication Device Transmitter | Original Equipment |
| 2 | 5755 ~ 5795 | DTS - Digital Transmission System | ||
| 3 | 5720 ~ 5720 | NII - Unlicensed National Information Infrastructure TX | ||
| 4 | 2514 ~ 2527 | PCB - PCS Licensed Transmitter | ||
| 5 | 2402 ~ 2480 | DSS - Part 15 Spread Spectrum Transmitter |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 2 3 4 5 | Effective |
2014-10-02
|
||||
| 1 2 3 4 5 | Applicant's complete, legal business name |
Intel Corporation
|
||||
| 1 2 3 4 5 | FCC Registration Number (FRN) |
0022327183
|
||||
| 1 2 3 4 5 | Physical Address |
5200 NE Elam Young Parkway
|
||||
| 1 2 3 4 5 |
Hillsboro, Oregon 97124
|
|||||
| 1 2 3 4 5 |
United States
|
|||||
| app s | TCB Information | |||||
| 1 2 3 4 5 | TCB Application Email Address |
d******@nwemc.com
|
||||
| 1 2 3 4 5 | TCB Scope |
A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices
|
||||
| 1 2 3 4 5 |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
|||||
| 1 2 3 4 5 |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
|||||
| app s | FCC ID | |||||
| 1 2 3 4 5 | Grantee Code |
RMX
|
||||
| 1 2 3 4 5 | Equipment Product Code |
WSBUB-SDS
|
||||
| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 2 3 4 5 | Name |
M******** L****
|
||||
| 1 2 3 4 5 | Title |
Product Regulatory Engineer
|
||||
| 1 2 3 4 5 | Telephone Number |
15036********
|
||||
| 1 2 3 4 5 | Fax Number |
15036********
|
||||
| 1 2 3 4 5 |
M******@Intel.com
|
|||||
| app s | Technical Contact | |||||
| n/a | ||||||
| app s | Non Technical Contact | |||||
| n/a | ||||||
| app s | Confidentiality (long or short term) | |||||
| 1 2 3 4 5 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 2 3 4 5 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 2 3 4 5 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 2 3 4 5 | Equipment Class | DXX - Part 15 Low Power Communication Device Transmitter | ||||
| 1 2 3 4 5 | DTS - Digital Transmission System | |||||
| 1 2 3 4 5 | NII - Unlicensed National Information Infrastructure TX | |||||
| 1 2 3 4 5 | PCB - PCS Licensed Transmitter | |||||
| 1 2 3 4 5 | DSS - Part 15 Spread Spectrum Transmitter | |||||
| 1 2 3 4 5 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | WSBUB-SDS | ||||
| 1 2 3 4 5 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
| 1 2 3 4 5 | Modular Equipment Type | Does not apply | ||||
| 1 2 3 4 5 | Purpose / Application is for | Original Equipment | ||||
| 1 2 3 4 5 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
| 1 2 3 4 5 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 2 3 4 5 | Grant Comments | Power output listed is conducted. The antenna(s) used for this transmitter must not be co-located with any other transmitters except in accordance with FCC multi-transmitter product procedures. Device is a 2 x 2 MIMO configuration, enabled for either 2.4 or 5 GHz band and has 20 MHz and 40 MHz bandwidth operations as described in this filing. This device contains functions that are not operational in U.S. and its Territories; filings under this FCC ID are approved only for US operations. The highest reported SAR for stand-alone, simultaneous exposure conditions, and SPLSR are: 1.30 W/kg; 2.68 W/kg; and 0.04 respectively. | ||||
| 1 2 3 4 5 | Power output listed is conducted. The antenna(s) used for this transmitter must not be co-located with any other transmitters except in accordance with FCC multi-transmitter product procedures. This transmitter is restricted to indoor use only within the 5.15-5.25GHz and 5.47-5.725GHz bands. Device is a 2 x 2 MIMO configuration, enabled for either 2.4 or 5 GHz band and has 20 MHz, 40 MHz and 80 MHz bandwidth operations as described in this filing. The highest reported SAR for stand-alone, simultaneous exposure conditions, and SPLSR are: 1.49 W/kg; 2.87 W/kg; and 0.04 respectively. | |||||
| 1 2 3 4 5 | Power output listed is conducted. The antenna(s) used for this transmitter must not be co-located with any other transmitters except in accordance with FCC multi-transmitter product procedures. Only the antenna(s) evaluated for this filing may be used. This device contains functions that are not operational in U.S. and its Territories; filings under this FCC ID are approved only for US operations. The highest reported SAR for stand-alone, simultaneous exposure conditions, and SPLSR are: 1.38 W/kg; 2.87 W/kg; and 0.04 respectively. | |||||
| 1 2 3 4 5 | Output power listed is conducted. | |||||
| 1 2 3 4 5 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 2 3 4 5 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 2 3 4 5 | Firm Name |
Northwest EMC, Inc.
|
||||
| 1 2 3 4 5 | Name |
G******** K****
|
||||
| 1 2 3 4 5 | Telephone Number |
503-8********
|
||||
| 1 2 3 4 5 | Fax Number |
503-8********
|
||||
| 1 2 3 4 5 |
g******@nwemc.com
|
|||||
| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 15C | CC | 13.56000000 | 13.56000000 | ||||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 2 | 1 | 15C | CC | 2402 | 2480 | 0.002 | |||||||||||||||||||||||||||||||||||
| 2 | 2 | 15C | CC MO | 2412 | 2462 | 0.104 | |||||||||||||||||||||||||||||||||||
| 2 | 3 | 15C | CC MO | 2422 | 2452 | 0.054 | |||||||||||||||||||||||||||||||||||
| 2 | 4 | 15C | CC MO | 5745 | 5825 | 0.045 | |||||||||||||||||||||||||||||||||||
| 2 | 5 | 15C | CC MO | 5755 | 5795 | 0.089 | |||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 3 | 1 | 15E | CC MO | 5180 | 5240 | 0.028 | |||||||||||||||||||||||||||||||||||
| 3 | 2 | 15E | CC MO | 5190 | 5230 | 0.044 | |||||||||||||||||||||||||||||||||||
| 3 | 3 | 15E | CC MO ND | 5260 | 5320 | 0.047 | |||||||||||||||||||||||||||||||||||
| 3 | 4 | 15E | CC MO ND | 5270 | 5310 | 0.092 | |||||||||||||||||||||||||||||||||||
| 3 | 5 | 15E | CC MO ND | 5500 | 5700 | 0.058 | |||||||||||||||||||||||||||||||||||
| 3 | 6 | 15E | CC MO ND | 5510 | 5670 | 0.047 | |||||||||||||||||||||||||||||||||||
| 3 | 7 | 15E | CC MO ND | 5720 | 5720 | 0.044 | |||||||||||||||||||||||||||||||||||
| 3 | 8 | 15E | CC MO ND | 5710 | 5710 | 0.044 | |||||||||||||||||||||||||||||||||||
| 3 | 9 | 15E | CC MO ND | 5530 | 5690 | 0.091 | |||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 4 | 1 | 22H | 824.2 | 848.8 | 1.958 | 0.02 ppm | 246KGXW | ||||||||||||||||||||||||||||||||||
| 4 | 2 | 22H | 824.2 | 848.8 | 0.4966 | 0.02 ppm | 250KG7W | ||||||||||||||||||||||||||||||||||
| 4 | 3 | 22H | 826.4 | 846.6 | 0.2323 | 0.01 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
| 4 | 4 | 22H | 824.7 | 848.3 | 0.1945 | 0.007 ppm | 1M14G7D | ||||||||||||||||||||||||||||||||||
| 4 | 5 | 22H | 824.7 | 848.3 | 0.1734 | 0.007 ppm | 1M18D7W | ||||||||||||||||||||||||||||||||||
| 4 | 6 | 22H | 825.5 | 847.5 | 0.2099 | 0.007 ppm | 2M73G7D | ||||||||||||||||||||||||||||||||||
| 4 | 7 | 22H | 825.5 | 847.5 | 0.1762 | 0.007 ppm | 2M74D7W | ||||||||||||||||||||||||||||||||||
| 4 | 8 | 22H | 826.5 | 846.5 | 0.2094 | 0.007 ppm | 4M54G7D | ||||||||||||||||||||||||||||||||||
| 4 | 9 | 22H | 826.5 | 846.5 | 0.1742 | 0.008 ppm | 4M50D7W | ||||||||||||||||||||||||||||||||||
| 4 | 1 | 22H | 829 | 844 | 0.2113 | 0.007 ppm | 9M13G7D | ||||||||||||||||||||||||||||||||||
| 4 | 11 | 22H | 829 | 844 | 0.1795 | 0.007 ppm | 9M07D7W | ||||||||||||||||||||||||||||||||||
| 4 | 12 | 24E | 1850.2 | 1909.8 | 0.955 | 0.01 ppm | 248KGXW | ||||||||||||||||||||||||||||||||||
| 4 | 13 | 24E | 1850.2 | 1909.8 | 0.4169 | 0.01 ppm | 254KG7W | ||||||||||||||||||||||||||||||||||
| 4 | 14 | 24E | 1852.4 | 1907.6 | 0.2606 | 0.01 ppm | 4M10F9W | ||||||||||||||||||||||||||||||||||
| 4 | 15 | 24E | 1850.7 | 1903.3 | 0.1611 | 0.003 ppm | 1M12G7D | ||||||||||||||||||||||||||||||||||
| 4 | 16 | 24E | 1850.7 | 1903.3 | 0.1361 | 0.003 ppm | 1M14D7W | ||||||||||||||||||||||||||||||||||
| 4 | 17 | 24E | 1851.5 | 1908.5 | 0.1746 | 0.004 ppm | 2M73G7D | ||||||||||||||||||||||||||||||||||
| 4 | 18 | 24E | 1851.5 | 1908.5 | 0.1384 | 0.003 ppm | 2M74D7W | ||||||||||||||||||||||||||||||||||
| 4 | 19 | 24E | 1852.5 | 1907.5 | 0.1862 | 0.004 ppm | 4M52G7D | ||||||||||||||||||||||||||||||||||
| 4 | 2 | 24E | 1852.5 | 1907.5 | 0.1493 | 0.004 ppm | 4M52D7W | ||||||||||||||||||||||||||||||||||
| 4 | 21 | 24E | 1855 | 1905 | 0.2065 | 0.003 ppm | 9M13G7D | ||||||||||||||||||||||||||||||||||
| 4 | 22 | 24E | 1855 | 1905 | 0.1758 | 0.003 ppm | 9M10D7W | ||||||||||||||||||||||||||||||||||
| 4 | 23 | 24E | 1857.5 | 1902.5 | 0.1472 | 0.003 ppm | 13M6G7D | ||||||||||||||||||||||||||||||||||
| 4 | 24 | 24E | 1857.5 | 1902.5 | 0.1274 | 0.003 ppm | 13M6D7W | ||||||||||||||||||||||||||||||||||
| 4 | 25 | 24E | 1860 | 1900 | 0.1799 | 0.004 ppm | 18M8G7D | ||||||||||||||||||||||||||||||||||
| 4 | 26 | 24E | 1860 | 1900 | 0.1556 | 0.003 ppm | 18M8D7W | ||||||||||||||||||||||||||||||||||
| 4 | 27 | 27 | 1712.4 | 1752.6 | 0.2371 | 0.01 ppm | 5M08F9W | ||||||||||||||||||||||||||||||||||
| 4 | 28 | 27 | 1710.7 | 1754.3 | 0.1782 | 0.003 ppm | 1M17G7D | ||||||||||||||||||||||||||||||||||
| 4 | 29 | 27 | 1710.7 | 1754.3 | 0.1578 | 0.003 ppm | 1M13D7W | ||||||||||||||||||||||||||||||||||
| 4 | 3 | 27 | 1711.5 | 1753.5 | 0.1858 | 0.004 ppm | 2M75G7D | ||||||||||||||||||||||||||||||||||
| 4 | 31 | 27 | 1711.5 | 1753.5 | 0.1581 | 0.004 ppm | 2M75D7W | ||||||||||||||||||||||||||||||||||
| 4 | 32 | 27 | 1712.5 | 1752.5 | 0.1799 | 0.003 ppm | 4M56G7D | ||||||||||||||||||||||||||||||||||
| 4 | 33 | 27 | 1712.5 | 1752.5 | 0.1585 | 0.004 ppm | 4M54D7W | ||||||||||||||||||||||||||||||||||
| 4 | 34 | 27 | 1715 | 1750 | 0.1816 | 0.004 ppm | 9M20G7D | ||||||||||||||||||||||||||||||||||
| 4 | 35 | 27 | 1715 | 1750 | 0.1611 | 0.003 ppm | 9M16D7W | ||||||||||||||||||||||||||||||||||
| 4 | 36 | 27 | 1717.5 | 1747.5 | 0.1837 | 0.004 ppm | 13M6G7D | ||||||||||||||||||||||||||||||||||
| 4 | 37 | 27 | 1717.5 | 1747.5 | 0.1671 | 0.003 ppm | 13M6D7W | ||||||||||||||||||||||||||||||||||
| 4 | 38 | 27 | 1720 | 1745 | 0.1919 | 0.003 ppm | 18M8G7D | ||||||||||||||||||||||||||||||||||
| 4 | 39 | 27 | 1720 | 1745 | 0.1589 | 0.003 ppm | 18M9D7W | ||||||||||||||||||||||||||||||||||
| 4 | 4 | 27 | 2506.5 | 2567.5 | 0.1977 | 0.003 ppm | 4M55G7D | ||||||||||||||||||||||||||||||||||
| 4 | 41 | 27 | 2506.5 | 2567.5 | 0.1675 | 0.003 ppm | 4M52D7W | ||||||||||||||||||||||||||||||||||
| 4 | 42 | 27 | 2509 | 2562 | 0.1841 | 0.003 ppm | 9M23G7D | ||||||||||||||||||||||||||||||||||
| 4 | 43 | 27 | 2509 | 2562 | 0.1521 | 0.003 ppm | 9M13D7W | ||||||||||||||||||||||||||||||||||
| 4 | 44 | 27 | 2511.5 | 2562.5 | 0.2004 | 0.003 ppm | 13M6G7D | ||||||||||||||||||||||||||||||||||
| 4 | 45 | 27 | 2511.5 | 2562.5 | 0.1633 | 0.003 ppm | 13M6D7W | ||||||||||||||||||||||||||||||||||
| 4 | 46 | 27 | 2514 | 2527 | 0.2061 | 0.003 ppm | 18M1G7D | ||||||||||||||||||||||||||||||||||
| 4 | 47 | 27 | 2514 | 2527 | 0.1698 | 0.003 ppm | 18M1D7W | ||||||||||||||||||||||||||||||||||
| 4 | 48 | 27 | 779.5 | 784.5 | 0.1991 | 0.007 ppm | 4M54G7D | ||||||||||||||||||||||||||||||||||
| 4 | 49 | 27 | 779.5 | 784.5 | 0.1799 | 0.008 ppm | 4M52D7W | ||||||||||||||||||||||||||||||||||
| 4 | 5 | 27 | 782 | 782 | 0.2051 | 0.007 ppm | 9M20G7D | ||||||||||||||||||||||||||||||||||
| 4 | 51 | 27 | 782 | 782 | 0.1875 | 0.008 ppm | 9M13D7W | ||||||||||||||||||||||||||||||||||
| 4 | 52 | 27 | 706.5 | 713.5 | 0.2138 | 0.009 ppm | 4M54G7D | ||||||||||||||||||||||||||||||||||
| 4 | 53 | 27 | 706.5 | 713.5 | 0.1858 | 0.009 ppm | 4M50D7W | ||||||||||||||||||||||||||||||||||
| 4 | 54 | 27 | 709 | 711 | 0.2148 | 0.007 ppm | 9M17G7D | ||||||||||||||||||||||||||||||||||
| 4 | 55 | 27 | 709 | 711 | 0.1897 | 0.008 ppm | 9M10D7W | ||||||||||||||||||||||||||||||||||
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 5 | 1 | 15C | CC | 2402.00000000 | 2480.00000000 | 0.0030000 | |||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC
