FCC ID: UFE-ALT240ROB Floor Cleaning, Mopping Robot

CC2541 www.ti.com SWRS110D JANUARY 2012REVISED JUNE 2013 2.4-GHz Bluetooth low energy and Proprietary System-on-Chip Check for Samples: CC2541 1FEATURES 23 RF 2.4-GHz Bluetooth low energy Compliant and Proprietary RF System-on-Chip Supports 250-kbps, 500-kbps, 1-Mbps, 2-

Mbps Data Rates Excellent Link Budget, Enabling Long-

Range Applications Without External Front End Programmable Output Power up to 0 dBm Excellent Receiver Sensitivity (94 dBm at 1 Mbps), Selectivity, and Blocking Performance High-Performance and Low-Power 8051 Microcontroller Core With Code Prefetch In-System-Programmable Flash, 128- or 256-KB 8-KB RAM With Retention in All Power Modes Hardware Debug Support Extensive Baseband Automation, Including Auto-Acknowledgment and Address Decoding Retention of All Relevant Registers in All Power Modes Suitable for Systems Targeting Compliance Peripherals With Worldwide Radio Frequency Regulations: ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15

(US), and ARIB STD-T66 (Japan) Layout Few External Components Reference Design Provided 6-mm 6-mm QFN-40 Package Pin-Compatible With CC2540 (When Not Using USB or I2C) Low Power Active-Mode RX Down to: 17.9 mA Active-Mode TX (0 dBm): 18.2 mA Power Mode 1 (4-s Wake-Up): 270 A Power Mode 2 (Sleep Timer On): 1 A Power Mode 3 (External Interrupts): 0.5 A Wide Supply-Voltage Range (2 V3.6 V) TPS62730 Compatible Low Power in Active Mode RX Down to: 14.7 mA (3-V supply) TX (0 dBm): 14.3 mA (3-V supply) White space White space White space White space White space White space Microcontroller 1 Powerful Five-Channel DMA General-Purpose Timers (One 16-Bit, Two 8-Bit) IR Generation Circuitry 32-kHz Sleep Timer With Capture Accurate Digital RSSI Support Battery Monitor and Temperature Sensor 12-Bit ADC With Eight Channels and Configurable Resolution AES Security Coprocessor Two Powerful USARTs With Support for Several Serial Protocols 23 General-Purpose I/O Pins

(21 4 mA, 2 20 mA) I2C interface 2 I/O Pins Have LED Driving Capabilities Watchdog Timer Integrated High-Performance Comparator Development Tools CC2541 Evaluation Module Kit

(CC2541EMK) CC2541 Mini Development Kit (CC2541DK-

MINI) SmartRF Software IAR Embedded Workbench Available Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2Bluetooth is a trademark of Bluetooth SIG, Inc.. 3ZigBee is a registered trademark of ZigBee Alliance. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 20122013, Texas Instruments Incorporated CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com SOFTWARE FEATURES Bluetooth v4.0 Compliant Protocol Stack for CC2541 WITH TPS62730 TPS62730 is a 2-MHz Step-Down Converter Single-Mode BLE Solution Complete Power-Optimized Stack, Including Controller and Host GAP Central, Peripheral, Observer, or Broadcaster (Including Combination Roles) ATT / GATT Client and Server SMP AES-128 Encryption and Decryption L2CAP Sample Applications and Profiles Generic Applications for GAP Central and Peripheral Roles Proximity, Accelerometer, Simple Keys, and Battery GATT Services More Applications Supported in BLE Software Stack Multiple Configuration Options Single-Chip Configuration, Allowing Applications to Run on CC2541 Network Processor Interface for Applications Running on an External Microcontroller BTool Windows PC Application for Evaluation, Development, and Test 2.4-GHz Bluetooth low energy Systems APPLICATIONS Proprietary 2.4-GHz Systems Human-Interface Devices (Keyboard, Mouse, Remote Control) Sports and Leisure Equipment Mobile Phone Accessories Consumer Electronics With Bypass Mode Extends Battery Lifetime by up to 20%

Reduced Current in All Active Modes 30-nA Bypass Mode Current to Support Low-

Power Modes RF Performance Unchanged Small Package Allows for Small Solution Size CC2541 Controllable the combines The CC2541 DESCRIPTION The CC2541 is a power-optimized true system-on-

chip (SoC) solution for both Bluetooth low energy and proprietary 2.4-GHz applications. It enables robust network nodes to be built with low total bill-of-material costs. excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The CC2541 is highly suited for systems where ultralow power consumption is required. This is specified by various operating modes. Short transition times between operating modes further enable low power consumption. The CC2541 is pin-compatible with the CC2540 in the 6-mm 6-mm QFN40 package, if the USB is not used on the CC2540 and the I2C/extra I/O is not used on the CC2541. Compared to the CC2540, the CC2541 provides lower RF current consumption. The CC2541 does not have the USB interface of the CC2540, and provides lower maximum output power in TX mode. The CC2541 also adds a HW I2C interface. The CC2541 is pin-compatible with the CC2533 RF4CE-optimized IEEE 802.15.4 SoC. The CC2541 comes in two different versions:

CC2541F128/F256, with 128 KB and 256 KB of flash memory, respectively. For the CC2541 block diagram, see Figure 1. 2 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 www.ti.com SWRS110D JANUARY 2012REVISED JUNE 2013 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. integrated circuits be handled with ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. CC2541 Figure 1. Block Diagram Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: CC2541 SFRbusSFRbusMEMORYARBITRATOR8051CPUCOREDMAFLASHSRAMFLASH CTRLDEBUGINTERFACERESETRESET_NP2_4P2_3P2_2P2_1P2_0P1_4P1_3P1_2P1_1P1_0P1_7P1_6P1_5P0_4P0_3P0_2P0_1P0_0P0_7P0_6P0_532.768-kHzCRYSTALOSC32-MHZCRYSTALOSCHIGH SPEEDRC-OSC32-kHzRC-OSCCLOCK MUXandCALIBRATIONRAMUSART0USART1TIMER1 (16-Bit)TIMER3(8-bit)TIMER2(BLELLTIMER)TIMER4(8-bit)AESENCRYPTIONandDECRYPTIONWATCHDOG TIMERIRQCTRLFLASHUNIFIEDRF_PRF_NSYNTHMODULATORPOWER-ON RESETBROWN OUTRADIOREGISTERSPOWER MGT.CONTROLLERSLEEPTIMERPDATAXRAMIRAMSFRXOSC_Q2XOSC_Q1DSADCAUDIO/DCDIGITALANALOGMIXEDVDD(2 V3.6 V)DCOUPLON-CHIPVOLTAGEREGULATORLink Layer EngineFREQUENCYSYNTHESIZERI2CDEMODULATORRECEIVETRANSMITOP-ANALOG COMPARATORI/OCONTROLLER1-KB SRAMRadioArbiterFIFOCTRLSDASCL CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS(1) over operating free-air temperature range (unless otherwise noted) Supply voltage Voltage on any digital pin Input RF level Storage temperature range ESD (2) All supply pins must have the same voltage All pins, excluding pins 25 and 26, according to human-body model, JEDEC STD 22, method A114 All pins, according to human-body model, JEDEC STD 22, method A114 According to charged-device model, JEDEC STD 22, method C101 MIN 0.3 0.3 40 MAX 3.9 VDD + 0.3 3.9 10 125 2 1 500 UNIT V V dBm C kV kV V

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) CAUTION: ESD sesnsitive device. Precautions should be used when handling the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) Operating ambient temperature range, TA Operating supply voltage MIN NOM MAX 40 85 3.6 2 UNIT C V ELECTRICAL CHARACTERISTICS Measured on Texas Instruments CC2541 EM reference design with TA = 25C and VDD = 3 V, 1 Mbps, GFSK, 250-kHz deviation, Bluetooth low energy mode, and 0.1% BER PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RX mode, standard mode, no peripherals active, low MCU activity RX mode, high-gain mode, no peripherals active, low MCU activity TX mode, 20 dBm output power, no peripherals active, low MCU activity TX mode, 0 dBm output power, no peripherals active, low MCU activity Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-

MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-

MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention Power mode 3. Digital regulator off; no clocks; POR active;

RAM and register retention Low MCU activity: 32-MHz XOSC running. No radio or peripherals. Limited flash access, no RAM access. Timer 1. Timer running, 32-MHz XOSC used Timer 2. Timer running, 32-MHz XOSC used Timer 3. Timer running, 32-MHz XOSC used Timer 4. Timer running, 32-MHz XOSC used Sleep timer, including 32.753-kHz RCOSC ADC, when converting 17.9 20.2 16.8 18.2 270 1 0.5 6.7 90 90 60 70 0.6 1.2 mA A mA A mA Icore Core current consumption Iperi Peripheral current consumption

(Adds to core current Icore for each peripheral unit activated) 4 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 CC2541 www.ti.com SWRS110D JANUARY 2012REVISED JUNE 2013 GENERAL CHARACTERISTICS Measured on Texas Instruments CC2541 EM reference design with TA = 25C and VDD = 3 V PARAMETER WAKE-UP AND TIMING Power mode 1 Active Power mode 2 or 3 Active Active TX or RX RX/TX turnaround RADIO PART RF frequency range Data rate and modulation format TEST CONDITIONS MIN TYP MAX UNIT Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16-MHz RCOSC Crystal ESR = 16 . Initially running on 16-MHz RCOSC, with 32-MHz XOSC OFF With 32-MHz XOSC initially on Proprietary auto mode BLE mode Programmable in 1-MHz steps 2 Mbps, GFSK, 500-kHz deviation 2 Mbps, GFSK, 320-kHz deviation 1 Mbps, GFSK, 250-kHz deviation 1 Mbps, GFSK, 160-kHz deviation 500 kbps, MSK 250 kbps, GFSK, 160-kHz deviation 250 kbps, MSK 4 120 500 180 130 150 s s s s s 2379 2496 MHz RF RECEIVE SECTION Measured on Texas Instruments CC2541 EM reference design with TA = 25C, VDD = 3 V, fc = 2440 MHz PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 2 Mbps, GFSK, 500-kHz Deviation, 0.1% BER Receiver sensitivity Saturation Co-channel rejection In-band blocking rejection Frequency error tolerance (1) Symbol rate error tolerance (2) 2 Mbps, GFSK, 320-kHz Deviation, 0.1% BER Receiver sensitivity Saturation Co-channel rejection BER < 0.1%

Wanted signal at 67 dBm 2 MHz offset, 0.1% BER, wanted signal 67 dBm 4 MHz offset, 0.1% BER, wanted signal 67 dBm 6 MHz or greater offset, 0.1% BER, wanted signal 67 dBm Including both initial tolerance and drift. Sensitivity better than 67dBm, 250 byte payload. BER 0.1%

Maximum packet length. Sensitivity better than67dBm, 250 byte payload. BER 0.1%

BER < 0.1%

Wanted signal at 67 dBm 2 MHz offset, 0.1% BER, wanted signal 67 dBm 4 MHz offset, 0.1% BER, wanted signal 67 dBm 6 MHz or greater offset, 0.1% BER, wanted signal 67 dBm Including both initial tolerance and drift. Sensitivity better than 67 dBm, 250 byte payload. BER 0.1%

Maximum packet length. Sensitivity better than 67 dBm, 250 byte payload. BER 0.1%

In-band blocking rejection Frequency error tolerance(1) Symbol rate error tolerance (2) 300 120 dBm dBm dB dB 300 kHz 120 ppm dBm dBm dB dB 90 1 9 2 36 41 86 7 12 1 34 39 300 120 300 kHz 120 ppm

(1) Difference between center frequency of the received RF signal and local oscillator frequency

(2) Difference between incoming symbol rate and the internally generated symbol rate Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: CC2541 CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com RF RECEIVE SECTION (continued) Measured on Texas Instruments CC2541 EM reference design with TA = 25C, VDD = 3 V, fc = 2440 MHz PARAMETER TEST CONDITIONS 1 Mbps, GFSK, 250-kHz Deviation, Bluetooth low energy Mode, 0.1% BER MIN TYP MAX UNIT Receiver sensitivity (3) (4) Saturation(4) Co-channel rejection(4) In-band blocking rejection (4) Out-of-band blocking rejection(4) Intermodulation(4) Frequency error tolerance (5) High-gain mode Standard mode BER < 0.1%

Wanted signal 67 dBm 1 MHz offset, 0.1% BER, wanted signal 67 dBm 2 MHz offset, 0.1% BER, wanted signal 67 dBm 3 MHz offset, 0.1% BER, wanted signal 67 dBm

>6 MHz offset, 0.1% BER, wanted signal 67 dBm Minimum interferer level < 2 GHz (Wanted signal 67 dBm) Minimum interferer level [2 GHz, 3 GHz] (Wanted signal 67 dBm) Minimum interferer level > 3 GHz (Wanted signal 67 dBm) Minimum interferer level Including both initial tolerance and drift. Sensitivity better than -67dBm, 250 byte payload. BER 0.1%

Maximum packet length. Sensitivity better than 67 dBm, 250 byte payload. BER 0.1%

Symbol rate error tolerance (6) 1 Mbps, GFSK, 160-kHz Deviation, 0.1% BER Receiver sensitivity (7) Saturation Co-channel rejection BER < 0.1%

Wanted signal 10 dB above sensitivity level 1-MHz offset, 0.1% BER, wanted signal 67 dBm 2-MHz offset, 0.1% BER, wanted signal 67 dBm 3-MHz offset, 0.1% BER, wanted signal -67 dBm

>6-MHz offset, 0.1% BER, wanted signal 67 dBm Including both initial tolerance and drift. Sensitivity better than 67 dBm, 250-byte payload. BER 0.1%

Maximum packet length. Sensitivity better than 67 dBm, 250-byte payload. BER 0.1%

BER < 0.1%

Wanted signal 67 dBm 1-MHz offset, 0.1% BER, wanted signal 67 dBm 2-MHz offset, 0.1% BER, wanted signal 67 dBm

>2-MHz offset, 0.1% BER, wanted signal 67 dBm Including both initial tolerance and drift. Sensitivity better than 67 dBm, 250-byte payload. BER 0.1%

Maximum packet length. Sensitivity better than 67 dBm, 250-byte payload. BER 0.1%

In-band blocking rejection Frequency error tolerance(5) Symbol rate error tolerance (6) 500 kbps, MSK, 0.1% BER Receiver sensitivity(7) Saturation Co-channel rejection In-band blocking rejection Frequency error tolerance Symbol rate error tolerance mode. 94 88 5 6 2 26 34 33 21 25 7 36 91 0 9 2 24 27 32 99 0 5 20 27 28 dBm dBm dB dB dBm dBm 250 kHz 80 ppm dBm dBm dB dB 200 kHz 80 ppm dBm dBm dB dB 250 80 200 80 150 80 150 kHz 80 ppm

(3) The receiver sensitivity setting is programmable using a TI BLE stack vendor-specific API command. The default value is standard

(4) Results based on standard-gain mode.

(5) Difference between center frequency of the received RF signal and local oscillator frequency

(6) Difference between incoming symbol rate and the internally generated symbol rate

(7) Results based on high-gain mode. 6 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 www.ti.com SWRS110D JANUARY 2012REVISED JUNE 2013 RF RECEIVE SECTION (continued) Measured on Texas Instruments CC2541 EM reference design with TA = 25C, VDD = 3 V, fc = 2440 MHz PARAMETER TEST CONDITIONS MIN TYP MAX UNIT CC2541 250 kbps, GFSK, 160 kHz Deviation, 0.1% BER Receiver sensitivity (8) Saturation Co-channel rejection BER < 0.1%

Wanted signal -67 dBm 1-MHz offset, 0.1% BER, wanted signal 67 dBm 2-MHz offset, 0.1% BER, wanted signal 67 dBm

>2-MHz offset, 0.1% BER, wanted signal 67 dBm Including both initial tolerance and drift. Sensitivity better than 67 dBm, 250-byte payload. BER 0.1%

Maximum packet length. Sensitivity better than 67 dBm, 250-byte payload. BER 0.1%

BER < 0.1%

Wanted signal -67 dBm 1-MHz offset, 0.1% BER, wanted signal 67 dBm 2-MHz offset, 0.1% BER, wanted signal 67 dBm

>2-MHz offset, 0.1% BER, wanted signal 67 dBm Including both initial tolerance and drift. Sensitivity better than 67 dBm, 250-byte payload. BER 0.1%

Maximum packet length. Sensitivity better than 67 dBm, 250-byte payload. BER 0.1%

f < 1 GHz f > 1 GHz In-band blocking rejection Frequency error tolerance (9) Symbol rate error tolerance (10) 250 kbps, MSK, 0.1% BER Receiver sensitivity (11) Saturation Co-channel rejection In-band blocking rejection Frequency error tolerance Symbol rate error tolerance ALL RATES/FORMATS Spurious emission in RX. Conducted measurement Spurious emission in RX. Conducted measurement 98 0 3 23 28 29 99 0 5 20 29 30 67 57 dBm dBm dB dB 150 kHz 80 ppm dBm dBm dB dB 150 kHz 80 ppm dBm dBm 150 80 150 80

(8) Results based on standard-gain mode.

(9) Difference between center frequency of the received RF signal and local oscillator frequency

(10) Difference between incoming symbol rate and the internally generated symbol rate

(11) Results based on high-gain mode. Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: CC2541 CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com RF TRANSMIT SECTION Measured on Texas Instruments CC2541 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output power Delivered to a single-ended 50- load through a balun using maximum recommended output power setting Delivered to a single-ended 50- load through a balun using minimum recommended output power setting Programmable output power Delivered to a single-ended 50- load through a balun using range minimum recommended output power setting f < 1 GHz Spurious emission conducted f > 1 GHz measurement 0 23 23 52 48 dBm dB dBm dBm Optimum load impedance Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) Differential impedance as seen from the RF port (RF_P and RF_N) toward the antenna 70 +j30 Designs with antenna connectors that require conducted ETSI compliance at 64 MHz should insert an LC resonator in front of the antenna connector. Use a 1.6-nH inductor in parallel with a 1.8-pF capacitor. Connect both from the signal trace to a good RF ground. CURRENT CONSUMPTION WITH TPS62730 Measured on Texas Instruments CC2541 TPA62730 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz, 1 Mbsp, GFSK, 250-kHz deviation, Bluetooth low energy Mode, 1% BER(1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Current consumption RX mode, standard mode, no peripherals active, low MCU activity, MCU at 1 MHz RX mode, high-gain mode, no peripherals active, low MCU activity, MCU at 1 MHz TX mode, 20 dBm output power, no peripherals active, low MCU activity, MCU at 1 MHz TX mode, 0 dBm output power, no peripherals active, low MCU activity, MCU at 1 MHz 14.7 16.7 13.1 14.3 mA

(1) 0.1% BER maps to 30.8% PER 32-MHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2541 EM reference design with TA = 25C and VDD = 3 V PARAMETER Crystal frequency Crystal frequency accuracy requirement (1) Equivalent series resistance Crystal shunt capacitance Crystal load capacitance Start-up time Power-down guard time ESR C0 CL TEST CONDITIONS The crystal oscillator must be in power down for a guard time before it is used again. This requirement is valid for all modes of operation. The need for power-down guard time can vary with crystal type and load. MIN 40 6 1 10 3 TYP MAX UNIT MHz 32 40 60 7 16 ppm pF pF ms ms 0.25

(1) Including aging and temperature dependency, as specified by [1]

8 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 www.ti.com SWRS110D JANUARY 2012REVISED JUNE 2013 CC2541 32.768-kHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2541 EM reference design with TA = 25C and VDD = 3 V PARAMETER TEST CONDITIONS Crystal frequency Crystal frequency accuracy requirement (1) Equivalent series resistance Crystal shunt capacitance Crystal load capacitance Start-up time ESR C0 CL MIN 40

(1) Including aging and temperature dependency, as specified by [1]

32-kHz RC OSCILLATOR Measured on Texas Instruments CC2541 EM reference design with TA = 25C and VDD = 3 V. PARAMETER TEST CONDITIONS MIN Calibrated frequency (1) Frequency accuracy after calibration Temperature coefficient (2) Supply-voltage coefficient (3) Calibration time (4) 32.768 TYP MAX UNIT kHz ppm k pF pF s 40 130 2 16 40 0.9 12 0.4 TYP MAX UNIT kHz 32.753 0.2%

0.4 3 2

%/C

%/V ms

(1) The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977.

(2) Frequency drift when temperature changes after calibration

(3) Frequency drift when supply voltage changes after calibration

(4) When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC32K_CALDIS is set to 0. 16-MHz RC OSCILLATOR Measured on Texas Instruments CC2541 EM reference design with TA = 25C and VDD = 3 V PARAMETER TEST CONDITIONS MIN Frequency (1) Uncalibrated frequency accuracy Calibrated frequency accuracy Start-up time Initial calibration time (2) TYP 16 18%

0.6%

10 50 MAX UNIT MHz s s

(1) The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2.

(2) When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC_PD is set to 0. Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: CC2541 CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com RSSI CHARACTERISTICS Measured on Texas Instruments CC2541 EM reference design with TA = 25C and VDD = 3 V 2 Mbps, GFSK, 320-kHz Deviation, 0.1% BER and 2 Mbps, GFSK, 500-kHz Deviation, 0.1% BER PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Useful RSSI range (1) RSSI offset(1) Absolute uncalibrated accuracy (1) Step size (LSB value) All Other Rates/Formats Useful RSSI range (1) RSSI offset(1) Absolute uncalibrated accuracy (1) Step size (LSB value) Reduced gain by AGC algorithm High gain by AGC algorithm Reduced gain by AGC algorithm High gain by AGC algorithm Standard mode High-gain mode Standard mode High-gain mode 64 64 79 99 6 1 64 64 98 107 3 1 dB dBm dB dB dB dBm dB dB

(1) Assuming CC2541 EM reference design. Other RF designs give an offset from the reported value. FREQUENCY SYNTHESIZER CHARACTERISTICS Measured on Texas Instruments CC2541 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz PARAMETER TEST CONDITIONS MIN Phase noise, unmodulated carrier At 1-MHz offset from carrier At 3-MHz offset from carrier At 5-MHz offset from carrier ANALOG TEMPERATURE SENSOR Measured on Texas Instruments CC2541 EM reference design with TA = 25C and VDD = 3 V PARAMETER TEST CONDITIONS MIN Output Temperature coefficient Voltage coefficient Initial accuracy without calibration Accuracy using 1-point calibration Current consumption when enabled Measured using integrated ADC, internal band-gap voltage reference, and maximum resolution MAX UNIT dBc/Hz TYP 109 112 119 TYP MAX 1480 4.5 1 10 5 0.5 UNIT 12-bit

/ 1C 0.1 V C C mA COMPARATOR CHARACTERISTICS TA = 25C, VDD = 3 V. All measurement results are obtained using the CC2541 reference designs, post-calibration. TEST CONDITIONS MIN PARAMETER Common-mode maximum voltage Common-mode minimum voltage Input offset voltage Offset vs temperature Offset vs operating voltage Supply current Hysteresis V TYP MAX UNIT VDD 0.3 1 16 4 230 0.15 mV V/C mV/V nA mV 10 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 www.ti.com ADC CHARACTERISTICS TA = 25C and VDD = 3 V PARAMETER TEST CONDITIONS Input voltage VDD is voltage on AVDD5 pin External reference voltage VDD is voltage on AVDD5 pin External reference voltage differential VDD is voltage on AVDD5 pin Input resistance, signal Full-scale signal (1) CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 Simulated using 4-MHz clock speed Peak-to-peak, defines 0 dBFS Single-ended input, 7-bit setting Single-ended input, 9-bit setting Single-ended input, 10-bit setting Single-ended input, 12-bit setting Differential input, 7-bit setting Differential input, 9-bit setting Differential input, 10-bit setting Differential input, 12-bit setting 10-bit setting, clocked by RCOSC 12-bit setting, clocked by RCOSC 7-bit setting, both single and differential Single ended input, 12-bit setting, 6 dBFS(1) Differential input, 12-bit setting, 6 dBFS(1) Single-ended input, 12-bit setting(1) Differential input, 12-bit setting(1) Single-ended input, 12-bit setting, 6 dBFS(1) Differential input, 12-bit setting, 6 dBFS(1) Differential input, 12-bit setting, 1-kHz sine

(0 dBFS), limited by ADC resolution Single ended input, 12-bit setting, 1-kHz sine

(0 dBFS), limited by ADC resolution Midscale 12-bit setting, mean(1) 12-bit setting, maximum(1) 12-bit setting, mean(1) 12-bit setting, maximum(1) 12-bit setting, mean, clocked by RCOSC 12-bit setting, max, clocked by RCOSC Single ended input, 7-bit setting(1) Single ended input, 9-bit setting(1) Single ended input, 10-bit setting(1) Single ended input, 12-bit setting(1) Differential input, 7-bit setting(1) Differential input, 9-bit setting(1) Differential input, 10-bit setting(1) Differential input, 12-bit setting(1) 7-bit setting 9-bit setting 10-bit setting 12-bit setting MIN 0 0 0 TYP MAX VDD VDD VDD 197 2.97 5.7 7.5 9.3 10.3 6.5 8.3 10 11.5 9.7 10.9 020 75.2 86.6 70.2 79.3 78.8 88.9

>84

>84 3 0.68%

0.05 0.9 4.6 13.3 10 29 35.4 46.8 57.5 66.6 40.7 51.6 61.8 70.8 20 36 68 132 UNIT V V V k V bits kHz dB dB dB dB mV LSB LSB dB s ENOB(1) Effective number of bits Useful power bandwidth THD Total harmonic distortion Signal to nonharmonic ratio CMRR Common-mode rejection ratio Crosstalk Offset Gain error DNL Differential nonlinearity INL Integral nonlinearity SINAD

(THD+N) Signal-to-noise-and-distortion Conversion time

(1) Measured with 300-Hz sine-wave input and VDD as reference. Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: CC2541 CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 ADC CHARACTERISTICS (continued) TA = 25C and VDD = 3 V PARAMETER Power consumption Internal reference VDD coefficient Internal reference temperature coefficient Internal reference voltage CONTROL INPUT AC CHARACTERISTICS TA = 40C to 85C, VDD = 2 V to 3.6 V TEST CONDITIONS MIN www.ti.com TYP MAX 1.2 4 UNIT mA mV/V 0.4 1.24 mV/10C V PARAMETER System clock, fSYSCLK tSYSCLK = 1/ fSYSCLK RESET_N low duration Interrupt pulse duration TEST CONDITIONS MIN TYP MAX UNIT The undivided system clock is 32 MHz when crystal oscillator is used. The undivided system clock is 16 MHz when calibrated 16-MHz RC oscillator is used. See item 1, Figure 2. This is the shortest pulse that is recognized as a complete reset pin request. Note that shorter pulses may be recognized but do not lead to complete reset of all modules within the chip. See item 2, Figure 2.This is the shortest pulse that is recognized as an interrupt request. 16 1 20 32 MHz s ns Figure 2. Control Input AC Characteristics 12 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 RESET_NPx.nT0299-0112 TEST CONDITIONS www.ti.com SPI AC CHARACTERISTICS TA = 40C to 85C, VDD = 2 V to 3.6 V PARAMETER SCK period SCK duty cycle SSN low to SCK SCK to SSN high MOSI early out MOSI late out MISO setup MISO hold SCK duty cycle MOSI setup MOSI hold MISO late out t1 t2 t3 t4 t5 t6 t7 t10 t11 t9 Operating frequency Master, RX and TX Slave, RX and TX Master Master Slave Master Slave Master, load = 10 pF Master, load = 10 pF Master Master Slave Slave Slave Slave, load = 10 pF Master, TX only Master, RX and TX Slave, RX only Slave, RX and TX CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 MIN 250 250 63 63 63 63 90 10 35 10 TYP MAX UNIT 50%

50%

ns ns ns ns ns ns ns ns ns ns ns MHz 7 10 95 8 4 8 4 Figure 3. SPI Master AC Characteristics Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Links: CC2541 SCKSSNMOSIMISOD0D1XD0Xt2t4t6t7t5t3XT0478-01 CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com Figure 4. SPI Slave AC Characteristics DEBUG INTERFACE AC CHARACTERISTICS TA = 40C to 85C, VDD = 2 V to 3.6 V PARAMETER fclk_dbg t1 t2 t3 t4 t5 t6 t7 t8 Debug clock frequency (see Figure 5) Allowed high pulse on clock (see Figure 5) Allowed low pulse on clock (see Figure 5) EXT_RESET_N low to first falling edge on debug clock (see Figure 7) Falling edge on clock to EXT_RESET_N high (see Figure 7) EXT_RESET_N high to first debug command (see Figure 7) Debug data setup (see Figure 6) Debug data hold (see Figure 6) Clock-to-data delay (see Figure 6) TEST CONDITIONS MIN TYP MAX 12 35 35 167 83 83 2 4 Load = 10 pF 30 UNIT MHz ns ns ns ns ns ns ns ns Figure 5. Debug Clock Basic Timing 14 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 TimeDEBUG_CLKP2_2t1t21/fclk_dbgT0436-01T0479-01SCKSSNMOSIMISOD0D1XD0Xt2t3Xt8t10t11t9 www.ti.com SWRS110D JANUARY 2012REVISED JUNE 2013 CC2541 Figure 6. Debug Enable Timing Figure 7. Data Setup and Hold Timing TIMER INPUTS AC CHARACTERISTICS TA = 40C to 85C, VDD = 2 V to 3.6 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input capture pulse duration Synchronizers determine the shortest input pulse that can be recognized. The synchronizers operate at the current system clock rate (16 MHz or 32 MHz). 1.5 tSYSCLK Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Links: CC2541 TimeDEBUG_CLKP2_2DEBUG_DATA(to CC2541)P2_1DEBUG_DATA(from CC2541)P2_1t6t8t7RESET_NTimeDEBUG_CLKP2_2t3t4t5T0437-01 CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com DC CHARACTERISTICS TA = 25C, VDD = 3 V PARAMETER Logic-0 input voltage Logic-1 input voltage Logic-0 input current Logic-1 input current I/O-pin pullup and pulldown resistors Logic-0 output voltage, 4- mA pins Logic-1 output voltage, 4-mA pins Logic-0 output voltage, 20- mA pins Logic-1 output voltage, 20-mA pins TEST CONDITIONS Input equals 0 V Input equals VDD Output load 4 mA Output load 4 mA Output load 20 mA Output load 20 mA MIN 2.4 50 50 2.5 2.5 TYP MAX 0.5 20 50 50 0.5 0.5 UNIT V V nA nA k V V V V PIN DESCRIPTIONS The CC2541 pinout is shown in Figure 8 and a short description of the pins follows. DEVICE INFORMATION NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip. Figure 8. Pinout Top View 16 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 CC2541RHAPackage(Top View)P0_1RESET_NP2_3 / OSC32K_Q2AVDD6NCR_BIASP0_2P0_0AVDD4P0_3AVDD1P0_4AVDD2P0_5RF_NP0_6RF_PP0_7AVDD3XOSC_Q1P1_0XOSC_Q2AVDD5P2_2P2_4 / OSC32K_Q1SCLP2_1SDAP2_0GNDP1_7P1_5P1_6P1_4DVDD1P1_3P1_1DCOUPLP1_2DVDD230129228327426525624227923218101820333117193432163515361437133812391140GNDGround Pad CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 PIN DESCRIPTIONS DESCRIPTION 2-V3.6-V analog power-supply connection 2-V3.6-V analog power-supply connection 2-V3.6-V analog power-supply connection 2-V3.6-V analog power-supply connection 2-V3.6-V analog power-supply connection 2-V3.6-V analog power-supply connection 1.8-V digital power-supply decoupling. Do not use for supplying external circuits. 2-V3.6-V digital power-supply connection 2-V3.6-V digital power-supply connection Connect to GND The ground pad must be connected to a solid ground plane. Not connected Port 0.0 Port 0.1 Port 0.2 Port 0.3 Port 0.4 Port 0.5 Port 0.6 Port 0.7 Port 1.0 20-mA drive capability Port 1.1 20-mA drive capability Port 1.2 Port 1.3 Port 1.4 Port 1.5 Port 1.6 Port 1.7 Port 2.0 Port 2.1 / debug data Port 2.2 / debug clock Port 2.3/32.768 kHz XOSC PIN TYPE Power (analog) Power (analog) Power (analog) Power (analog) Power (analog) Power (analog) Power (digital) Power (digital) Power (digital) Ground pin PIN 28 27 24 29 21 31 40 39 10 1 Ground 4 19 18 17 16 15 14 13 12 11 9 8 7 6 5 38 37 36 35 34 33 Unused pins Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O, Analog I/O 32 30 20 26 25 2 3 22 23 Digital I/O, Analog I/O Port 2.4/32.768 kHz XOSC Analog I/O Digital input RF I/O RF I/O I2C clock or digital I/O I2C clock or digital I/O Analog I/O Analog I/O External precision bias resistor for reference current Reset, active-low Negative RF input signal to LNA during RX Negative RF output signal from PA during TX Positive RF input signal to LNA during RX Positive RF output signal from PA during TX Can be used as I2C clock pin or digital I/O. Leave floating if not used. If grounded disable pull up Can be used as I2C data pin or digital I/O. Leave floating if not used. If grounded disable pull up 32-MHz crystal oscillator pin 1 or external clock input 32-MHz crystal oscillator pin 2 www.ti.com PIN NAME AVDD1 AVDD2 AVDD3 AVDD4 AVDD5 AVDD6 DCOUPL DVDD1 DVDD2 GND GND NC P0_0 P0_1 P0_2 P0_3 P0_4 P0_5 P0_6 P0_7 P1_0 P1_1 P1_2 P1_3 P1_4 P1_5 P1_6 P1_7 P2_0 P2_1/DD P2_2/DC P2_3/

OSC32K_Q2 P2_4/

OSC32K_Q1 RBIAS RESET_N RF_N RF_P SCL SDA XOSC_Q1 XOSC_Q2 Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Links: CC2541 CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com BLOCK DIAGRAM A block diagram of the CC2541 is shown in Figure 9. The modules can be roughly divided into one of three categories: CPU-related modules; modules related to power, test, and clock distribution; and radio-related modules. In the following subsections, a short description of each module is given. Figure 9. CC2541 Block Diagram 18 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 SFRbusSFRbusMEMORYARBITRATOR8051CPUCOREDMAFLASHSRAMFLASH CTRLDEBUGINTERFACERESETRESET_NP2_4P2_3P2_2P2_1P2_0P1_4P1_3P1_2P1_1P1_0P1_7P1_6P1_5P0_4P0_3P0_2P0_1P0_0P0_7P0_6P0_532.768-kHzCRYSTALOSC32-MHZCRYSTALOSCHIGH SPEEDRC-OSC32-kHzRC-OSCCLOCK MUXandCALIBRATIONRAMUSART0USART1TIMER1 (16-Bit)TIMER3(8-bit)TIMER2(BLELLTIMER)TIMER4(8-bit)AESENCRYPTIONandDECRYPTIONWATCHDOG TIMERIRQCTRLFLASHUNIFIEDRF_PRF_NSYNTHMODULATORPOWER-ON RESETBROWN OUTRADIOREGISTERSPOWER MGT.CONTROLLERSLEEPTIMERPDATAXRAMIRAMSFRXOSC_Q2XOSC_Q1DSADCAUDIO/DCDIGITALANALOGMIXEDVDD(2 V3.6 V)DCOUPLON-CHIPVOLTAGEREGULATORLink Layer EngineFREQUENCYSYNTHESIZERI2CDEMODULATORRECEIVETRANSMITOP-ANALOG COMPARATORI/OCONTROLLER1-KB SRAMRadioArbiterFIFOCTRLSDASCL CC2541 www.ti.com SWRS110D JANUARY 2012REVISED JUNE 2013 BLOCK DESCRIPTIONS A block diagram of the CC2541 is shown in Figure 9. The modules can be roughly divided into one of three categories: CPU-related modules; modules related to power, test, and clock distribution; and radio-related modules. In the following subsections, a short description of each module is given. CPU and Memory The 8051 CPU core is a single-cycle 8051-compatible core. It has three different memory access busses (SFR, DATA, and CODE/XDATA), a debug interface, and an 18-input extended interrupt unit. The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical memories and all peripherals through the SFR bus. The memory arbiter has four memory-access points, access of which can map to one of three physical memories: an SRAM, flash memory, and XREG/SFR registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same physical memory. The SFR bus is drawn conceptually in Figure 9 as a common bus that connects all hardware peripherals to the memory arbiter. The SFR bus in the block diagram also provides access to the radio registers in the radio register bank, even though these are indeed mapped into XDATA memory space. The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power mode 2 and mode 3). The 128/256 KB flash block provides in-circuit programmable non-volatile program memory for the device, and maps into the CODE and XDATA memory spaces. Peripherals Writing to the flash block is performed through a flash controller that allows page-wise erasure and 4-bytewise programming. See User Guide for details on the flash controller. A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors that can be located anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface, etc.) can be used with the DMA controller for efficient operation by performing data transfers between a single SFR or XREG address and flash/SRAM. Each CC2541 contains a unique 48-bit IEEE address that can be used as the public device address for a Bluetooth device. Designers are free to use this address, or provide their own, as described in the Bluetooth specfication. The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which is associated with one of four interrupt priorities. I/O and sleep timer interrupt requests are serviced even if the device is in a sleep mode (power modes 1 and 2) by bringing the CC2541 back to the active mode. The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging. Through this debug interface, it is possible to erase or program the entire flash memory, control which oscillators are enabled, stop and start execution of the user program, execute instructions on the 8051 core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possible to perform in-

circuit debugging and external flash programming elegantly. The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral modules control certain pins or whether they are under software control, and if so, whether each pin is configured as an input or output and if a pullup or pulldown resistor in the pad is connected. Each peripheral that connects to the I/O pins can choose between two different I/O pin locations to ensure flexibility in various applications. The sleep timer is an ultralow-power timer that can either use an external 32.768-kHz crystal oscillator or an internal 32.753-kHz RC oscillator. The sleep timer runs continuously in all operating modes except power mode 3. Typical applications of this timer are as a real-time counter or as a wake-up timer to get out of power mode 1 or mode 2. A built-in watchdog timer allows the CC2541 to reset itself if the firmware hangs. When enabled by software, the watchdog timer must be cleared periodically; otherwise, it resets the device when it times out. Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Links: CC2541 CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It can also be configured in IR generation mode, where it counts timer 3 periods and the output is ANDed with the output of timer 3 to generate modulated consumer IR signals with minimal CPU interaction. Timer 2 is a 40-bit timer. It has a 16-bit counter with a configurable timer period and a 24-bit overflow counter that can be used to keep track of the number of periods that have transpired. A 40-bit capture register is also used to record the exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission ends. There are two 16-bit output compare registers and two 24-bit overflow compare registers that can be used to give exact timing for start of RX or TX to the radio or general interrupts. Timer 3 and timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of the counter channels can be used as PWM output. USART 0 and USART 1 are each configurable as either an SPI master/slave or a UART. They provide double buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex applications. Each USART has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other uses. When configured as SPI slaves, the USARTs sample the input signal using SCK directly instead of using some oversampling scheme, and are thus well-suited for high data rates. The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with 128-bit keys. The AES core also supports ECB, CBC, CFB, OFB, CTR, and CBC-MAC, as well as hardware support for CCM. The ADC supports 7 to 12 bits of resolution with a corresponding range of bandwidths from 30-kHz to 4-kHz, respectively. DC and audio conversions with up to eight input channels (I/O controller pins) are possible. The inputs can be selected as single-ended or differential. The reference voltage can be internal, AVDD, or a single-

ended or differential external signal. The ADC also has a temperature-sensor input channel. The ADC can automate the process of periodic sampling or conversion over a sequence of channels. The I2C module provides a digital peripheral connection with two pins and supports both master and slave operation. I2C support is compliant with the NXP I2C specification version 2.1 and supports standard mode (up to 100 kbps) and fast mode (up to 400 kbps). In addition, 7-bit device addressing modes are supported, as well as master and slave modes. The ultralow-power analog comparator enables applications to wake up from PM2 or PM3 based on an analog signal. Both inputs are brought out to pins; the reference voltage must be provided externally. The comparator output is connected to the I/O controller interrupt detector and can be treated by the MCU as a regular I/O pin interrupt. 20 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 www.ti.com SWRS110D JANUARY 2012REVISED JUNE 2013 TYPICAL CHARACTERISTICS CC2541 RX CURRENT vs TEMPERATURE TX CURRENT vs TEMPERATURE Figure 10. Figure 11. RX SENSITIVITY TEMPERATURE vs TX POWER vs TEMPERATURE Figure 12. Figure 13. RX CURRENT vs SUPPLY VOLTAGE TX CURRENT vs SUPPLY VOLTAGE Figure 14. Figure 15. Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Links: CC2541 1616.51717.51818.51919.52022.22.42.62.833.23.43.6Voltage (V)Current (mA)1 Mbps GFSK 250 kHzStandard Gain SettingInput = 70 dBmTA = 25CG005 1616.51717.51818.51919.52022.22.42.62.833.23.43.6 Voltage (V)Current (mA)TX Power Setting = 0 dBmTA = 25CG006 92908886844020020406080Temperature (C)Level (dBm)1 Mbps GFSK 250 kHzStandard Gain SettingVCC = 3 VG003 4.02.00.02.04.04020020406080Temperature (C)Level (dBm)TX Power Setting = 0 dBmVCC = 3 VG004 16.51717.51818.5194020020406080Temperature (C)Current (mA)1 Mbps GFSK 250 kHzStandard Gain SettingInput = 70 dBmVCC = 3 VG001 1717.51818.51919.54020020406080Temperature (C)Current (mA)TX Power Setting = 0 dBmVCC = 3 VG002 CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) RX SENSITIVITY vs SUPPLY VOLTAGE TX POWER vs SUPPLY VOLTAGE Figure 16. Figure 17. RX SENSITIVITY vs FREQUENCY TX POWER vs FREQUENCY Figure 18. Figure 19. Table 1. Output Power(1)(2) TXPOWER Setting Typical Output Power (dBm) 0xE1 0xD1 0xC1 0xB1 0xA1 0x91 0x81 0x71 0x61 0x51 0x41 0x31 0 2 4 6 8 10 12 14 16 18 20 23

(1) Measured on Texas Instruments CC2541 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz. See SWRU191 for recommended register settings.

(2) 1 Mbsp, GFSK, 250-kHz deviation, Bluetooth low energy mode, 1% BER 22 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 9290888684240024102420243024402450246024702480Frequency (MHz)Level (dBm)1 Mbps GFSK 250 kHzStandard Gain SettingTA = 25CVCC = 3 VG009 42024240024102420243024402450246024702480Frequency (MHz)Level (dBm)TX Power Setting = 0 dBmTA = 25CVCC = 3 VG010 929088868422.22.42.62.833.23.43.6Voltage (V)Level (dBm)1 Mbps GFSK 250 kHz Standard Gain SettingTA = 25CG007 4202422.22.42.62.833.23.43.6Voltage (V)Level (dBm)TX Power Setting = 0 dBmTA = 25CG008 www.ti.com SWRS110D JANUARY 2012REVISED JUNE 2013 Table 2. Output Power and Current Consumption Typical Output Power (dBm) 0 20 Typical Current Consumption

(mA)(1) 18.2 16.8 Typical Current Consumption With TPS62730 (mA)(2) 14.3 13.1 CC2541

(1) Measured on Texas Instruments CC2541 EM reference design with TA = 25C, VDD = 3 V and fc =

2440 MHz. See SWRU191 for recommended register settings.

(2) Measured on Texas Instruments CC2541 TPS62730 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz. See SWRU191 for recommended register settings. TYPICAL CURRENT SAVINGS WHEN USING TPS62730 Figure 20. Current Savings in TX at Room Temperature Figure 21. Current Savings in RX at Room Temperature The application note (SWRA365) has information regarding the CC2541 and TPS62730 combo board and the current savings that can be achieved using the combo board. Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Links: CC2541 Current Consumption RX SGCLKCONMOD 0xBF0510152025Current (mA)0510152025303540Current Savings (%)2.12.42.733.33.6Supply (V)DC/DC OFFDC/DC ONCurrent SavingsCurrent Consumption TX 0 dBm02.12.42.733.33.6Supply (V)0510152025Current (mA)0510152025303540Current Savings (%)DC/DC OFFDC/DC ONCurrent Savings CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 www.ti.com APPLICATION INFORMATION Few external components are required for the operation of the CC2541. A typical application circuit is shown in Figure 22.

(1) 32-kHz crystal is mandatory when running the BLE protocol stack in low-power modes, except if the link layer is in the standby state (Vol. 6 Part B Section 1.1 in [1]). NOTE: Different antenna alternatives will be provided as reference designs. Figure 22. CC2541 Application Circuit Table 3. Overview of External Components (Excluding Supply Decoupling Capacitors) Component Description C401 R301 Decoupling capacitor for the internal 1.8-V digital voltage regulator Precision resistor 1%, used for internal biasing Value 1 F 56 k Input/Output Matching When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. See reference design, CC2541EM, for recommended balun. 24 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 GNDSCLSDANCP1_5DVDD2P1_1P1_2P1_3P1_42-V to 3.6-V Power SupplyR301XTAL1C221C231XTAL2C321C331C40132-kHzCrystal(1)CC2541DIEATTACHPADRBIASAVDD4AVDD1AVDD2RF_NAVDD5XOSC_Q1XOSC_Q2AVDD3RF_PP1_0P0_7P0_6P0_5P0_4RESET_NP0_0P0_1P0_2P0_3DCOUPLDVDD1P1_6P1_7P2_0AVDD6P2_4/XOSC32K_Q1P2_3/XOSC32K_Q2P2_2P2_1Antenna(50)W12345678910111213141516171819202122232425262728293031323334353637383940Power Supply Decoupling Capacitors are Not ShownDigital I/O Not Connected www.ti.com SWRS110D JANUARY 2012REVISED JUNE 2013 Crystal An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See 32-MHz CRYSTAL OSCILLATOR for details. The load capacitance seen by the 32-MHz crystal is given by:

CC2541

(1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is given by:

A series resistor may be used to comply with the ESR requirement. On-Chip 1.8-V Voltage Regulator Decoupling The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor

(C401) for stable operation. Power-Supply Decoupling and Filtering Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application. TI provides a compact reference design that should be followed very closely.

(2) References 1. Bluetooth Core Technical Specification document, version 4.0 http://www.bluetooth.com/SiteCollectionDocuments/Core_V40.zip 2. CC253x System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications/CC2541 System-on-

Chip Solution for 2.4-GHz Bluetooth low energy Applications (SWRU191) 3. Current Savings in CC254x Using the TPS62730 (SWRA365). Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-

based wireless applications for use in industrial and consumer applications. Our selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1- and 2.4-GHz frequency bands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with fellow engineers from all over the world. With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. We make RF easy!

The following subsections point to where to find more information. Copyright 20122013, Texas Instruments Incorporated Submit Documentation Feedback 25 Product Folder Links: CC2541 Lparasitic3213311CC11CC=++Lparasitic2212311CC11CC=++CC2541 SWRS110D JANUARY 2012REVISED JUNE 2013 Texas Instruments Low-Power RF Web Site Forums, videos, and blogs RF design help E2E interaction Join us today at www.ti.com/lprf-forum. www.ti.com Texas Instruments Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including:

RF circuit, low-power RF, and ZigBee design services RF certification services and RF circuit manufacturing Need help with modules, engineering services or development tools?

Search the Low-Power RF Developer Network tool to find a suitable partner. www.ti.com/lprfnetwork Low-power RF and ZigBee module solutions and development tools Low-Power RF eNewsletter The Low-Power RF eNewsletter keeps you up-to-date on new products, news releases, developers news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information. Sign up today on www.ti.com/lprfnewsletter Spacer REVISION HISTORY Changes from Original (January 2012) to Revision A Page Changed data sheet status from Product Preview to Production Data ................................................................................ 1 Changes from Revision A (February 2012) to Revision B Page Changed the Temperature coefficient Unit value From: mV/C To: / 0.1C ....................................................................... 10 Changed Figure 22 text From: Optional 32-kHz Crystal To: 32-kHz Crystal

..................................................................... 24 Changes from Revision B (August 2012) to Revision C Page Changed the "Internal reference voltage" TYP value From 1.15 V To: 1.24 V .................................................................. 12 Changed pin XOSC_Q1 Pin Type From Analog O To: Analog I/O, and changed the Pin Description .............................. 17 Changed pin XOSC_Q2 Pin Type From Analog O To: Analog I/O .................................................................................... 17 Changes from Revision C (November 2012) to Revision D Page Changed the RF TRANSMIT SECTION, Output power TYP value From: 20 To: 23 ....................................................... 8 Changed the RF TRANSMIT SECTION, Programmable output power range TYP value From: 20 To: 23 ........................ 8 Added row 0x31 to Table 1 ................................................................................................................................................. 22 26 Submit Documentation Feedback Copyright 20122013, Texas Instruments Incorporated Product Folder Links: CC2541 www.ti.com PACKAGING INFORMATION Orderable Device CC2541F128RHAR Status

(1) ACTIVE Package Type Package Drawing VQFN CC2541F128RHAT ACTIVE VQFN CC2541F256RHAR ACTIVE VQFN CC2541F256RHAT ACTIVE VQFN PACKAGE OPTION ADDENDUM 23-Sep-2014 Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples RHA RHA RHA RHA 40 40 40 40 Qty 2500 250 2500 250

(2)

(6)

(3)

(4/5) Green (RoHS

& no Sb/Br) Green (RoHS

& no Sb/Br) Green (RoHS

& no Sb/Br) Green (RoHS

& no Sb/Br) CU NIPDAU Level-3-260C-168 HR

-40 to 85 CU NIPDAU Level-3-260C-168 HR

-40 to 85 CU NIPDAU Level-3-260C-168 HR

-40 to 85 CU NIPDAU Level-3-260C-168 HR

-40 to 85 CC2541 F128 CC2541 F128 CC2541 F256 CC2541 F256

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

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*All dimensions are nominal Device Package Type Package Drawing Pins SPQ CC2541F128RHAR CC2541F128RHAT CC2541F256RHAR CC2541F256RHAT VQFN VQFN VQFN VQFN RHA RHA RHA RHA 40 40 40 40 2500 250 2500 250 Reel Diameter

(mm) 330.0 180.0 330.0 180.0 Reel Width W1 (mm) A0

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1 Quadrant 16.4 16.4 16.4 16.4 6.3 6.3 6.3 6.3 6.3 6.3 6.3 6.3 1.5 1.5 1.5 1.5 12.0 12.0 12.0 12.0 16.0 16.0 16.0 16.0 Q2 Q2 Q2 Q2 Pack Materials-Page 1 www.ti.com 13-Nov-2014 PACKAGE MATERIALS INFORMATION

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Owners Guide EN Table of Contents Whats In the Box Robot Anatomy Setup Guide Choosing the Right Braava jet Pad How iRobot Braava jet Cleans Tips for Best Performance Troubleshooting Regular Robot Care Safety and Compliance Information 2 4 8 18 20 28 30 32 38 Braava jet Owners Guide 1 Whats In the Box iRobot Braava jet Robot Lithium Ion Battery Battery Charger iRobot Braava jet Cleaning Pads (type and quantity of cleaning pads may vary by model)

(2) Wet Mopping Pads (Blue)

(2) Damp Sweeping Pads (Orange)

(2) Dry Sweeping Pads (White) 2 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 3 Pad and battery quantities may vary by model ENEN Robot Anatomy Top View - Front Handle CLEAN Button Precision Jet Spray Nozzle Braava jet Cleaning Pad Top View - Back Pad Eject Button Tank Cap Battery 4 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 5 ENEN Robot Anatomy Bottom View Front Cliff Sensors Pad Reader Pad Tracks Wheels Rear Cliff Sensors iRobot Braava jet Cleaning Pads Wet Mopping

(Blue) Damp Sweeping

(Orange) Dry Sweeping

(White) Washable Wet Mopping (Blue)

(Included with select models. Also available for purchase as an accessory.) 6 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 7 ENEN Charge Insert Setup Guide Follow these simple steps to get started with your Braava jet Mopping Robot. 1 Charge & Insert the Battery Remove the battery and put it in the battery charger. The indicator light will blink amber while the battery is charging. The light will switch to solid green when the battery is fully charged. The wall charger automatically goes into low-power mode when the battery is fully charged to maintain the life of the battery and limit power usage. The battery will fully charge within 2 hours. Insert the fully charged battery into the robot. Battery Tip #1: For best results in rooms with a lot of furniture fully charge the battery for 2 hours before using the robot. Battery Tip #2: iRobot also offers additional batteries and chargers as accessories for purchase, so you can always have a charged battery ready to go. 8 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 9 ENEN Setup Guide 2 Select a Braava jet Cleaning Pad Choose a cleaning pad that matches how you want to clean your floor. Your robot comes with a sample pack of Wet Mopping, Damp Sweeping, and Dry Sweeping Braava jet cleaning pads. Braava jet will automatically recognize the pad and adjust its cleaning behavior based on the pad you choose. Cleaning Tip: Before using a Wet Mopping or Damp Sweeping pad, use a Dry Sweeping pad or vacuum to clean loose debris. Pad Type Cleaning Motion and Wetness Level Cleaning Agent Cleaning Agent Wet Mopping

(Blue) Damp Sweeping

(Orange) Dry Sweeping

(White) Washable Wet Mopping

(Blue)

(Included with select models. Also available for purchase as an accessory.) 10 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 11 ENEN Setup Guide 3 Slide in a Cleaning Pad 4 Fill the Robot with Water Slide a Braava jet pad into the track on the bottom of the robot until it clicks into place. You can attach a Braava jet pad from either side of the robot. Fill the robot if you choose Wet Mop or Damp Sweep. Lift the robot handle to find the tank cap and lift and swivel it open. Slowly fill the tank to the top with warm water. Turn the cap back and close. Lower the robot handle before starting the robot. Do not use any other cleaning solution with your robot other than water. Cleaning Tip: For easier filling, tilt the robot downward and fill slowly with water. Note: If you are using a Dry Sweeping Pad, skip to Step 5. 12 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 13 ENEN See How iRobot Braava jet Cleans section for more details on placement and cleaning pattern behavior. Setup Guide 5 Just Press CLEAN Place your robot in the lower left corner of the area you want to clean, about a foot away from any walls. Press CLEAN once to wake up the robot. Press CLEAN again to start the cleaning cycle. The robot will clean up to 150 ft2 while mopping, and up to 200 ft2 while damp or dry sweeping.*

Braava jet will finish by cleaning the edges and perimeters of your room, furniture and toilets. Cleaning Tip: When it has finished cleaning, Braava jet returns to where it started and powers off.

*Tested in iRobots Home Test Lab on hard floors. 14 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 15 ENEN Setup Guide 6 Eject the Cleaning Pad and Prepare iRobot Braava jet for Next Use To eject the cleaning pad without touching the dirt, lift the handle and pull back on the Pad Eject Button. Disposable cleaning pads can be dropped directly into the trash and Washable Cleaning Pads (sold separately) can be dropped into the laundry bin. Remove the battery and put it in the wall charger so it can charge for the next cleaning. Empty the water tank before storing the robot. Braava jet can be stored wheels-down or on its side with the battery side down. 16 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 17 ENEN Choosing the Right Braava jet Pad Choose the right cleaning pad for your cleaning needs. OVERVIEW RECOMMENDED FOR Pad Type Cleaning Motion and Wetness Level Fresh Scent Dust Hair Dirt

*

Sticky Spots Cleaning Agent Cleaning Agent Wet Mopping

(Blue) Damp Sweeping

(Orange) Dry Sweeping

(White) Washable Wet Mopping

(Blue)

(Included with select models. Also available for purchase as an accessory.) 18 For Customer Care go to www.irobot.com/support

*Tested on dried coffee and soda. Braava jet Owners Guide 19 ENEN How iRobot Braava jet Cleans Braava jet is designed to intelligently navigate and clean typical kitchens and bathrooms each time it runs, up to 150 ft2 while wet mopping and up to 200 ft2 while damp and dry sweeping.*

Where to Place the Robot in a Room Place the robot in the lower left of the area you want it to clean. The robot will systematically clean the area to the right and in front of where it started. The robot will start by cleaning to the right until it encounters a wall or other barrier. When the robot has cleaned as far as it can to the right, the robot will continue to the area in front and to the right of where it started. The robot will stop cleaning and will return to where it started once it has cleaned an entire enclosed space or has cleaned up to 150 ft2 while wet mopping or up to 200 ft2 while damp and dry sweeping.

*Tested in iRobots Home Test Lab on hard floors in damp/dry mode. 20 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 21 ENEN How iRobot Braava jet Cleans 22 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 23 ENEN How iRobot Braava jet Cleans Braava jet does not spray furniture or walls. Before the robot sprays, it will back up to ensure its only spraying a portion of the floor it knows is clear. As Braava jet finds edges, chair legs, and other obstacles, it will clean around them and then return to its original path and resume cleaning. After Braava jet has cleaned the entire space, it finishes the job by cleaning along edges, walls, furniture, and other obstacles a second time. Once Braava jet finishes its cleaning job, it returns to where it started, plays a tone so you know its done, and powers off. Braava jet creates a new map every time it cleans. iRobot Braava jet adjusts its cleaning pattern based on the cleaning pad you choose. When you attach a Braava jet Wet Mopping Pad or Washable Wet Mopping Pad

(blue), Braava jet mops your floors with triple-pass coverage, moving similarly to how you would mop yourself. The robot drives forward a short distance to one side, backs up slightly, then moves forward to the other side. It alternates to the left and right as it progresses through the room, providing triple-pass coverage of each section of your floor. With a Braava jet Damp Sweeping Pad (orange), Braava jet cleans your floors with gentle yet thorough double-pass cleaning. It first drives forward a short dis-

tance and then backs up in a straight line, continuing this back and forth pattern as it cleans the area. When you attach a Braava jet Dry Sweeping Pad (white), Braava jet swiftly moves forward in a straight line for single-pass coverage of the area. 24 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 25 ENEN How iRobot Braava jet Cleans Creating an Invisible Barrier You can create an invisible barrier with the Virtual Wall Mode so that the robot will avoid cleaning part of a room or a different floor type. Begin with the robot powered off. When placing the robot, note that the invisible line will be created in line with the back of the robot. To activate Virtual Wall Mode, start with a powered-off robot and press and hold the CLEAN button until two blue lines appear on the top of the robot. The blue lines will indicate that the Virtual Wall Mode has been activated. Once in Virtual Wall Mode, the robot will mark an invisible boundary in its internal map, extending out to each side (see illustration). As the robot cleans your floor, it will not go beyond the invisible line. Once the robot is in place, just press CLEAN to start the job. Virtual Wall Mode will turn off automatically when the robot completes its job. To manually clear a Virtual Wall Mode cleaning cycle and turn off the robot, press and hold the CLEAN button until all indicators turn off. Cleaning Tip: You can also use Virtual Wall Mode to divide a larger room into smaller areas to help Braava jet clean more efficiently. 26 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 27 ENEN Tips for Best Performance General Cleaning Tips For best results, use a Dry Sweeping Pad or vacuum to pick up dirt and dust before running your robot with a Wet Mopping or Damp Sweeping Pad. To pause your robot during a cleaning cycle, press the CLEAN button. To resume the cleaning cycle, press the CLEAN button again. Do not pick up and move your robot while it is cleaning the robot will end its cleaning run if you do. Always fill Braava jet to the top with water and check for any air bubbles before closing the tank cap. Only use water inside your robot. Cleaning solutions, even natural ones, can clog the spray nozzle and break down the materials inside the robot. Your robot will only run with Braava jet Pads, which are specifically made for the robot. Braava jet cleans best on smooth hard surfaces and may not perform as well on uneven tiles, heavily waxed floors or rough surfaces like slate or brick which may snag the cleaning pads. 28 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 29 ENEN Troubleshooting Braava jet will tell you something is wrong by alerting you with sounds and lights. If the problem is not resolved, learn more online at www.irobot.com/support or contact Customer Service at (877) 855-8593. Repeating Error Messages If your robot remains on after an error occurs, press the bumper toward the body of the robot once to repeat the message. If your robot has turned off after an error occurs, press CLEAN to turn it on. If the error is ongoing, the robot will repeat the message. Visit www.irobot.com/support to view a complete error table. Rebooting Instructions For some errors, rebooting Braava jet may resolve the problem. To reboot Braava jet, press and hold CLEAN for 10 seconds until you hear an audible tone. Take out the battery and insert it again. Press CLEAN again to turn the robot back on. Precision Jet Spray Troubleshooting If the robot is not spraying or is spraying unevenly and you have checked that the tank has enough water and can hear the pump running, contact Customer Service at (877) 855-8593. Water Level Troubleshooting If you encounter problems with the amount of water Braava jet uses on your floors in wet mopping or damp sweeping modes, contact Customer Service at

(877) 855-8593. 30 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 31 ENEN Regular Robot Care Follow these tips to keep your iRobot Braava jet running at peak performance. Cleaning the Cliff Sensors and Pad Reader Clean the sensors on the bottom of your robot with a damp cloth. Front Cliff Sensors Pad Reader Rear Cliff Sensors Cleaning the Wheels Pull off any visible debris or hair that gathers around the wheels. Wheels 32 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 33 ENEN Regular Robot Care Cleaning the Body of the Robot Use a damp cloth to lightly wipe off any dirt on its body or bumper. Cleaning the Precision Jet Spray Nozzle Wipe clean with a damp cloth. 34 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 35 Precision Jet Spray Nozzle ENEN Regular Robot Care Cleaning the Tank If you notice an odor in the tank, fill the tank with hot tap water. Do not use boiling water. Close the cap and lightly shake the robot. Rinse the tank and repeat. Allow the tank to dry with the cap open before using your robot. Caring for Washable Cleaning Pads (sold separately) After using washable cleaning pads to clean, hand washing and air drying is recommended for regular maintenance. The cleaning pad can be washed up to 50 times* before replacing. If using a washing machine, wash on warm cycle and air dry. Do not wash with delicates. 36 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 37

*Tested in washing machine. Do not wash with delicates. ENEN Safety and Compliance Information EN THIS APPLIANCE CAN BE USED BY CHILDREN AGED FROM 8 YEARS AND ABOVE AND PERSONS WITH REDUCED PHYSICAL, SENSORY OR MENTAL CAPABILITIES OR LACK OF EXPERIENCE AND KNOWLEDGE IF THEY HAVE BEEN GIVEN SUPERVISION OR INSTRUCTION CONCERNING USE OF THE APPLIANCE IN A SAFE WAY AND UNDERSTAND THE HAZARDS INVOLVED. CHILDREN SHALL NOT PLAY WITH THE APPLIANCE. CLEANING AND USER MAINTENANCE SHALL NOT BE MADE BY CHILDREN WITHOUT SUPERVISION. CAUTION: DO NOT EXPOSE THE ELECTRONICS OF BRAAVA JET, ITS BATTERY, OR ITS BATTERY CHARGER. THERE ARE NO USER-

SERVICEABLE PARTS INSIDE. REFER SERVICING TO QUALIFIED SERVICE PERSONNEL. PLEASE ENSURE VOLTAGE RATING FOR ENCLOSED BATTERY CHARGER MATCHES STANDARD OUTLET VOLTAGE. To reduce the risk of injury or damage, keep these safety precautions in mind when setting up, using, and maintaining your robot:

General Safety Instructions Retain the safety and operating instructions for future reference. Read all safety and operating instructions before operating your robot. Heed all warnings on your robot, battery, battery charger, and in the owners guide. Follow all operating and use instructions. Be aware that floors may be slippery after wet cleaning with Braava jet. Braava jet operates quietly. Take care when walking in the area the robot is cleaning to avoid stepping on it and tripping. Refer all non-routine servicing to iRobot. 38 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 39 EN Safety and Compliance Information The symbol on the product or its packaging indicates:

Use Restrictions Do not dispose of electrical appliances as unsorted municipal waste, use separate collection facilities. Contact your local authority for information regarding the collection systems available. If electrical appliances are disposed of in landfills or dumps, hazardous substances can leak into the groundwater and get into the food chain, damag-

ing your health and well-being. When replacing old batteries, please contact your local or regional waste authority for more information on collection, reuse and recycling programs. Your robot is for indoor use on hard surface floors only. Your robot is not a toy. Do not sit or stand on this device. Small children and pets should be supervised when your robot is operating. Braava jet has electrical parts. Do not submerge it in water. Clean with a cloth dampened with water only. Do not use this device to pick up anything that is burning or smoking. Do not use this device to pick up large debris, bleach, paint, or other chemicals. Before using Braava jet, remove fragile objects from the cleaning area, including objects on furniture that can fall if the furniture is pushed or bumped. Move any power cords as well as cords for blinds and curtains out of the way to reduce the risk of objects being pulled down. If the room to be cleaned contains a balcony, a physical barrier should be used to prevent access to the balcony and ensure safe operation. Make sure a cleaning pad is attached for safe operation. When wet cleaning, do not use Braava jet in areas where wetness can damage unfinished or unsealed floors or delicate carpeting or rugs. 40 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 41 Operate and store your robot in room temperature environments only. Children should be supervised to ensure they do not play with the robot. Cleaning and maintenance should not be performed by children without supervision. Do not place anything on top of your robot. Do not operate the robot in areas with exposed electrical outlets in the floor. ENEN Safety and Compliance Information Battery and Charging Before every use, check the battery pack for any sign of damage or leakage. Do not charge damaged or leaking battery packs. Charge indoors only. Only use the included battery charger to charge the iRobot Braava jet battery. Charge using a standard outlet only. Product may not be used with any type of power converter. Use of other power converters will immediately void the warranty. Please ensure voltage rating for enclosed battery charger matches standard outlet voltage. Never handle the battery charger with wet hands. Only use rechargeable battery packs with the correct specifications supplied with your robot by iRobot (model number 4446040). For replacement battery pack, visit www.irobot.com. Always charge and remove the battery from your robot before long-term storage or transportation. Always remove battery pack before cleaning your robot. Keep battery pack clean and dry. Wipe the cell or battery terminals with a clean dry cloth if they become dirty. Do not crush, dismantle or shred battery packs. Do not subject cells or batteries to mechanical shock. Do not heat the battery pack or place the battery pack near any heat source. Do not store in direct sunlight. Do not incinerate the battery pack. Do not short-circuit the battery pack. Do not submerge the battery pack in any liquid. The battery pack must be removed from the robot before disposal. When disposing of the battery pack, contact your local or regional waste authority for more information on collection, reuse and recycling programs. In the event of cell leaking, do not allow the liquid to come in contact with the skin or eyes. If contact has been made, wash the affected area with copious amounts of water and seek medical advice. If you need to ship your Braava jet lithium ion battery for any reason, contact Customer Care for shipping instructions and appropriate labels. Never ship a leaking or physically damaged lithium ion battery. 42 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 43 ENEN Safety and Compliance Information For EU Declaration of Conformity information, visit www.irobot.com/compliance. FCC Compliance Information:

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: 1) This device may not cause interference, and 2) this device must accept any interference, including interference that may cause undesired operation of the device. Changes or modifications not expressly approved by iRobot Corporation could void the users authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules as well as ICES-003 Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference to radio communication will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

the receiver is connected.

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which

- Consult the dealer or an experienced radio/TV technician for help. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than the necessary for successful communication. 44 For Customer Care go to www.irobot.com/support Braava jet Owners Guide 45 ENEN 2016 iRobot Corporation, 8 Crosby Drive, Bedford, MA 01730 USA. All rights reserved. iRobot and Virtual Wall are registered trademarks of iRobot Corporation. Braava jet is a trademark of iRobot Corporation. WC: 4491844 v3