iSenseTek Technology, Inc Approval Sheet Model : BLE module (nRF51xxx) Part No : ISBLE1810-P51xxxxxA ISBLE1506-A51xxxxxA Datasheet Version : v2.1 Date : 2016/07/14 Approved Checked Designed Customer name Model P/N Checked Received 1 Index 1. Overall Introduction .................................................................................................... 3 1.1 1.2 Applications ........................................................................................................................ 3 Features .............................................................................................................................. 4 2. 3. P/N Number Define .................................................................................................... 5 Module Dimension ..................................................................................................... 6 3.1 3.2 3.3 Product Dimensions .......................................................................................................... 6 Pin Descriptions ................................................................................................................. 7 PCB Layout Guide........................................................................................................... 12 4. 5. 6. Main Chip Solution ................................................................................................... 13 Shipment Packing Information ................................................................................. 13 Specification ............................................................................................................ 14 6.1 Absolute Maximum Ratings ........................................................................................... 14 6.2 Operation Conditions ...................................................................................................... 15 6.3 Electrical Specifications .................................................................................................. 15 6.3.1 Radio Transceiver ........................................................................................................... 15 6.3.2 Transmitter Specifications .............................................................................................. 16 6.3.3 Receiver Specifications .................................................................................................. 17 6.3.4 Radio Timing Parameters............................................................................................... 19 6.3.5 RSSI Specifications ......................................................................................................... 19 6.3.6 CPU ................................................................................................................................... 19 6.3.7 Power Management ........................................................................................................ 20 7. Reference Circuit ....................................................................................................... 21 7.1 7.2 Schematic with Internal LDO ......................................................................................... 21 Schematic with Internal DC/DC Converter .................................................................. 22 8. 9. Development Kit ...................................................................................................... 23 Antenna Forbidden Zone Description ...................................................................... 25 10. Statements .............................................................................................................. 27 11. Document History .................................................................................................... 28 2 1. Overall Introduction iSenseTeks ISBLE is a Bluetooth smart (Bluetooth low energy or BLE) module designed based on Nordic solution. The feature of the module. Based on the Nordic nRF51822 SoC Multiple protocol of BLE & RF 2.4GHz & ANT+ upon customer preference Dimension:
Length Width Height Part No 18 0.3mm 10 0.3mm 1.95 0.2mm ISBLE1810-P51xxxxxA 15 0.3mm 6 0.3mm 2 0.2mm ISBLE1506-A51xxxxxA Low power requirements, Ultra-low peak, Average and idle mode power Consumption Compatible with a large installed based of mobiles phones, tablets and computers Fully coverage of wireless applications BLE & RF transmission switching may help products to fit all operation system BLE & RF transmission switching may help products to fit all kinds of hardwares 1.1 Applications Computer peripherals and I/O devices Mouse Keyboard Multi-touch trackpad Interactive entertainment devices Remote control Gaming controller Beacons Personal area networks Health/fitness sensor and monitor devices Medical devices Key-fobs + Wrist watch Remote control toys 3 1.2 Features 2.4GHz transceiver
-93 dBm sensitivity in Bluetooth low energy mode 250 kbps, 1 Mbps, 2 Mbps supported data rates TX Power -20 to +4 dBm in 4 dB steps TX Power -30 dBm Whisper mode RSSI (1 dB resolution) ARM Cortex-M0 32 bit processor Serial Wire Debug (SWD) Memory 256 kB or 128 kB embedded flash program memory 16 kB or 32 kB RAM Flexible Power Management Supply voltage range 1.8 V to 3.6 V 4.2 s wake-up using 16 MHz RCOSC 0.6 A at 3 V OFF mode 1.2 A at 3 V in OFF mode + 1 region RAM retention 2.6 A at 3 V ON mode, all blocks IDLE S100 series Soft Device ready On-air compatibility with nRF24L series 8/9/10 bit ADC - 8 configurable channels 32 General Purpose I/O Pins One 32 bit and two 16 bit timers with counter mode SPI Master/Slave Low power comparator Temperature sensor Two-wire Master (I2C compatible) UART (CTS/RTS) CPU independent Programmable Peripheral Interconnect (PPI) Quadrature Decoder (QDEC) AES HW encryption Real Timer Counter (RTC) 4 2. P/N Number Define Figure 1 : P/N Number Define 5 3. Module Dimension 3.1 Product Dimensions ISBLE1810-P51xxxxxA Figure 2 : Product Dimensions (ISBLE1810-P51xxxxxA) ISBLE1506-A51xxxxxA Figure 3 : Product Dimensions (ISBLE1506-A51xxxxxA) 6 Unit : mm 3.2 Pin Descriptions ISBLE1810-P51xxxxxA Figure 4 : Module Pin Descriptions (ISBLE1810-P51xxxxxA) Pin NO. Name Pin function Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 GND GND GND P0.21 P0.22 P0.23 P0.24 P0.25 AVDD P0.29 P0.28 DCC Ground The pad must be connected to a solid ground plane Ground The pad must be connected to a solid ground plane Ground The pad must be connected to a solid ground plane Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Power Analog power supply Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Power DC/DC output voltage to external LC filter VDD_NRF Power Power supply VDD_NRF Power Power supply 7 Pin NO. Name Pin function Description 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 GND GND P0.26 AIN0 XL2 P0.27 AIN1 XL1 P0.30 P0.00 Ground The pad must be connected to a solid ground plane Ground The pad must be connected to a solid ground plane Digital I/O General-purpose digital I/O Analog input ADC input 2 Analog output Connector for 32.768KHz crystal Digital I/O General-purpose digital I/O Analog input ADC input 2 Analog output Connector for 32.768KHz crystal Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O AREF0 Analog input ADC Reference voltage P0.01 AIN2 P0.02 AIN3 P0.03 AIN4 P0.04 AIN5 P0.05 AIN6 P0.06 AIN7 Digital I/O General-purpose digital I/O Analog input ADC input 2 Digital I/O General-purpose digital I/O Analog input ADC input 3 Digital I/O General-purpose digital I/O Analog input ADC input 4 Digital I/O General-purpose digital I/O Analog input ADC input 5 Digital I/O General-purpose digital I/O Analog input ADC input 6 Digital I/O General-purpose digital I/O Analog input ADC input 7 AREF1 Analog input ADC Reference voltage P0.07 N.C. GND P0.08 P0.09 P0.10 P0.11 P0.12 P0.13 P0.14 P0.15 P0.16 Digital I/O General-purpose digital I/O
/
/
Ground The pad must be connected to a solid ground plane Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O 8 Pin NO. Name Pin function Description 39 40 41 42 43 44 45 46 P0.17 Digital I/O General-purpose digital I/O SWDIO RESET Digital I/O Also HW debug and flash programming I/O Digital I/O System reset(active low). SWDCLK Digital input HW debug and flash programming. Connect a 12K ohm resister to GND for flash programming . P0.18 P0.19 P0.20 GND GND Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Ground The pad must be connected to a solid ground plane Ground The pad must be connected to a solid ground plane 1. Digital I/O pad with 5mA source/sink capability. Table 1 : Pin function (ISBLE1810-P51xxxxxA) ISBLE1506-A51xxxxxA Figure 5 : Module Pin Descriptions (ISBLE1506-A51xxxxxA) 9 Pin NO. Name Pin function Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 P0.18 P0.20 Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O SWDCLK Digital input HW debug and flash programming. Connect a 12K ohm resister to GND for flash programming . SWDIO RESET P0.17 P0.19 P0.16 P0.15 P0.12 P0.11 P0.09 P0.08 P0.14 P0.13 P0.10 GND P0.07 P0.05 AIN6 P0.06 AIN7 Digital I/O Also HW debug and flash programming I/O Digital I/O System reset(active low) Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Ground The pad must be connected to a solid ground plane Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Analog input ADC input 6 Digital I/O General-purpose digital I/O Analog input ADC input 7 AREF1 Analog input ADC Reference voltage P0.03 AIN4 P0.01 AIN2 P0.02 AIN3 P0.00 Digital I/O General-purpose digital I/O Analog input ADC input 4 Digital I/O General-purpose digital I/O Analog input ADC input 2 Digital I/O General-purpose digital I/O Analog input ADC input 3 Digital I/O General-purpose digital I/O AREF0 Analog input ADC Reference voltage GND DCC P0.04 AIN5 Ground The pad must be connected to a solid ground plane Power DC/DC output voltage to external LC filter Digital Input General-purpose digital I/O Analog input ADC input 5 10 Pin NO. Name Pin function Description 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 P0.31 P0.30 Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O VCC_nRF Power Power supply AVDD P0.29 P0.28 P0.27 AIN1 XL1 P0.26 AIN0 XL2 P0.24 P0.21 P0.22 P0.25 P0.23 RF GND GND Power Analog power supply Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Analog input ADC input 1 Analog input Connector for 32.768KHz crystal Digital I/O General-purpose digital I/O Analog input ADC input 0 Analog output Connector for 32.768KHz crystal Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O Digital I/O General-purpose digital I/O RFout 2.4GHz 50ohm RF out, not need to mount. Ground The pad must be connected to a solid ground plane Ground The pad must be connected to a solid ground plane 1. Digital I/O pad with 5mA source/sink capability. Table 2 : Pin function (ISBLE1506-A51xxxxxA) 11 3.3 PCB Layout Guide ISBLE1810-P51xxxxxA Figure 6 : PCB Layout Guide (ISBLE1810-P51xxxxxA) ISBLE1506-A51xxxxxA Figure 7 : PCB Layout Guide (ISBLE1506-A51xxxxxA) 12 4. Main Chip Solution RF IC Crystal Frequency Nordic nRF51822-QFAA Nordic nRF51822-CEAA 16MHz 16MHz Table 3 : Main Chip Solution 5. Shipment Packing Information Part Number Package ISBLE1810-P51822ACA ISBLE1506-A51822ACA 500 PCS/BOX 500 PCS/BOX Table 4 : Shipment Packing Information ISBLE1810-P51xxxxxA Figure 8 : Packing Information (ISBLE1810-P51xxxxxA) ISBLE1506-A51xxxxxA Figure 9 : Packing Information (ISBLE1810-P51xxxxxA) 13 6. Specification 6.1 Absolute Maximum Ratings Maximum ratings are the extreme limits the chip can be exposed to without causing permanent damage. Exposure to absolute maximum ratings for prolonged periods of time may affect the reliability of the chip. Table 5 specifies the absolute maximum ratings. Symbol Parameter Min. Max. Units Supply voltages VDD DEC2 VSS I/O pin voltage VIO
-0.3
+3.9 2 0
-0.3 VDD+0.3 Environmental QFN48 package Storage temperature MSL ESD HBM ESD CDM Moisture Sensitivity Level Human Body Model Charged Device Model Environmental WLCSP package Storage temperature MSL ESD HBM ESD CDM Flash memory Moisture Sensitivity Level Human Body Model Charged Device Model
-40
-40 Endurance Retention Number of times an address can be written between erase cycles 20000 1 10 years at 40 C 50 years at 25 C
+125 2 3 750
+125 1 4 500 2 1. Flash endurance is 20,000 erase cycles. The smallest element of flash that can be written is a 32 bit word. V V V V C kV V C kV V Write /
erase cycles times Table 5 : Absolute maximum ratings 14 6.2 Operation Conditions The operating conditions are the physical parameters that the chip can operate within as defined in Table 6. Symbol Parameter Notes Min. Typ. Max. Units Supply voltage, internal LDO setup Supply voltage, DC/DC converter setup Supply voltage, low voltage mode setup Supply rise time (0 V to VDD) Operating temperature 1 2 1.8 2.1 1.75 3.0 3.0 1.8 3.6 3.6 1.95 100
-25 25 75 V V V ms C DEC2 shall be connected to VDD in this mode. The on-chip power-on reset circuitry may not function properly for rise times outside the specified interval. Table 6 : Operating conditions VDD VDD VDD t R_VDD TA 1. 2. 6.3 Electrical Specifications 6.3.1 Radio Transceiver General radio characteristics Symbol Parameter Notes Min. Typ. Max. Units Test Level fOP PLLres f250 f1M f2M fBLE Operating frequencies. PLL programming resolution. Frequency deviation at 250 kbps. Frequency deviation at 1 Mbps. Frequency deviation at 2 Mbps. Frequency deviation at BLE. bpsFSK On-air data rate. 1 MHz channel spacing 2400 1 170 170 320 2483 MHz N/A MHz N/A kHz kHz kHz 2 2 2 4 225 250 275 kHz 250 2000 kbps N/A Radio current consumption Table 7 : General radio characteristics Symbol Parameter Notes Min. Typ. Max. Units Test Level ITX,+4dBm TX only run current at POUT = +4 dBm. ITX,0dBm ITX,-4dBm ITX,-8dBm TX only run current at POUT = 0 dBm. TX only run current at POUT = -4 dBm. TX only run current at POUT = -8 dBm. 15 1 1 1 1 16 10.5 8 7 mA mA mA mA 4 4 2 2 Symbol Parameter Notes Min. Typ. Max. Units Test Level ITX,-12dBm ITX,-16dBm ITX,-20dBm ITX,-30dBm ISTART,TX IRX,250 IRX,1M IRX,2M ISTART TX only run current at POUT = -12 dBm. TX only run current at POUT = -16 dBm. TX only run current at POUT = -20 dBm. TX only run current at POUT = -30 dBm. TX startup current. RX only run current at 250 kbps. RX only run current at 1 Mbps. RX only run current at 2 Mbps. RX startup current. 1 1 1 1 2 3 6.5 6 5.5 5.5 7 12.6 13 13.4 8.7 mA mA mA mA mA mA mA mA mA 2 2 2 2 1 1 4 1 1 1. Valid for data rates 250 kbps, 1 Mbps, and 2 Mbps. 2. Average current consumption (at 0 dBm TX output power) for TX startup (130 s), and when changing mode from RX toTX (130 s). 3. Average current consumption for RX startup (130 s), and when changing mode from TX to RX (130 s). Table 8 : Radio current consumption 6.3.2 Transmitter Specifications Symbol Description Min. Typ. Max. Units PRF PRFC PRFCR PWHISP PBW2 PBW1 PBW250 PRF1.2 PRF2.2 PRF1.1 PRF2.1 PRF1.250 PRF2.250 Maximum output power. RF power control range. RF power accuracy. RF power whisper mode. 20 dB bandwidth for modulated carrier (2 Mbps). 20 dB bandwidth for modulated carrier (1 Mbps). 20 dB bandwidth for modulated carrier (250 kbps). 1st Adjacent Channel Transmit Power. 2 MHz (2 Mbps). 2nd Adjacent Channel Transmit Power. 4 MHz (2 Mbps). 1st Adjacent Channel Transmit Power. 1 MHz (1 Mbps). 2nd Adjacent Channel Transmit Power. 2 MHz (1 Mbps). 1st Adjacent Channel Transmit Power. 1 MHz (250 kbps). 2nd Adjacent Channel Transmit Power. 2 MHz (250 kbps). 16 20 4 24
-30 4 dBm dB dB dBm 1800 2000 kHz 950 700 1100 kHz 800 kHz
-20 dBc
-45 dBc
-20 dBc
-40 dBc
-25 dBc
-40 dBc Test Level 4 2 1 2 2 2 2 2 2 2 2 2 2 Symbol Description Min. Typ. Max. Units Test Level tTX,30 tTX,60 Maximum consecutive transmission time, fTOL < 30 ppm. Maximum consecutive transmission time, fTOL < 60 ppm. 16 ms 4 ms 1 1 Table 9 : Transmitter specifications 6.3.3 Receiver Specifications Symbol Description Min. Typ. Max. Units Test Level Receiver operation Maximum received signal strength at < 0.1%
PER. Sensitivity (0.1% BER) at 2 Mbps. Sensitivity (0.1% BER) at 1 Mbps. Sensitivity (0.1% BER) at 250 kbps. Receiver sensitivity: Ideal transmitter. PRXMAX PRXSENS,2M PRXSENS,1M PRXSENS,250k PSENS IT 1 Mbps BLE PSENS DT Receiver sensitivity: Dirty transmitter.1 1 Mbps BLE RX selectivity - modulated interfering signal2 C/ICO C/I1ST C/I2ND C/I3RD C/I6th C/INth C/ICO C/I1ST C/I2ND C/I3RD C/I6th C/I12th C/INth 2 Mbps C/I co-channel. 1st ACS, C/I 2 MHz. 2nd ACS, C/I 4 MHz. 3rd ACS, C/I 6 MHz. 6th ACS, C/I 12 MHz. Nth ACS, C/I fi > 25 MHz. 1 Mbps C/I co-channel (1 Mbps). 1st ACS, C/I 1 MHz. 2nd ACS, C/I 2 MHz. 3rd ACS, C/I 3 MHz. 6th ACS, C/I 6 MHz. 12th ACS, C/I 12 MHz. Nth ACS, C/I fi > 25 MHz. 17 0
-85
-90
-96
-93
-91 12
-4
-24
-28
-44
-50 12 4
-24
-30
-40
-50
-53 dBm dBm dBm dBm dBm 1 2 2 2 2 dBm 2 dB dB dB dB dB dB dB dB dB dB dB dB dB 2 2 2 2 2 2 2 2 2 2 2 2 2 Symbol Description Min. Typ. Max. Units Test Level C/ICO C/I1ST C/I2ND C/I3RD C/I6th C/I12th C/INth C/ICO C/I1ST C/I2ND 250 kbps C/I co-channel. 1st ACS, C/I 1 MHz. 2nd ACS, C/I 2 MHz. 3rd ACS, C/I 3 MHz. 6th ACS, C/I fi > 6 MHz. 12th ACS, C/I 12 MHz. Nth ACS, C/I fi > 25 MHz. Bluetooth Low Energy RX selectivity C/I co-channel. 1st ACS, C/I 1 MHz. 2nd ACS, C/I 2 MHz. C/I3+N ACS, C/I (3+n) MHz offset [n = 0, 1, 2, . ]. C/IImage lmage blocking level. C/IImage1MHz Adjacent channel to image blocking level
(1 MHz). RX intermodulation3 P_IMD2Mbps P_IMD1Mbps P_IMD250kbps P_IMDBLE IMD performance, 2 Mbps, 3rd, 4th, and 5th offset channel. IMD performance, 1 Mbps, 3rd, 4th, and 5th offset channel. IMD performance, 250 kbps, 3rd, 4th, and 5th offset channel. IMD performance, 1 Mbps BLE, 3rd, 4th, and 5th offset channel. 4
-10
-34
-39
-50
-55
-60 10 1
-25
-51
-30
-31
-41
-40
-36
-39 dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm dBm 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 1. As defined in the Bluetooth Core Specification v4.0 Volume 6: Core System Package (Low Energy Controller Volume). 2. Wanted signal level at PIN = -67 dBm. One interferer is used, having equal modulation as the wanted signal. The input power of the interferer where the sensitivity equals BER = 0.1% is presented. 3. Wanted signal level at PIN = -64 dBm. Two interferers with equal input power are used. The interferer closest in fre-quency is not modulated, the other interferer is modulated equal with the wanted signal. The input power of interferers where the sensitivity equals BER = 0.1% is presented. Table 10 : Receiver specifications 18 6.3.4 Radio Timing Parameters Symbol Description 250 k 1 M 2 M BLE Jitter Units tTXEN Time between TXEN task and READY event. Time between DISABLE task 132 132 132 140 0 s tTXDISABLE and DISABLED event when the 10 4 3 4 1 s tRXEN radio was in TX. Time between the RXEN task and READY event. Time between DISABLE task 130 130 130 138 0 s tRXDISABLE and DISABLED event when the 0 tTXCHAIN tRXCHAIN radio was in RX. TX chain delay. RX chain delay. 5 12.5 Table 11 : Radio timing 0 1 3 0 0.5 2 0 1 3 1 0 0 s s s 6.3.5 RSSI Specifications Symbol Description Notes Min. Typ. Max. Units RSSIACC RSSI accuracy. Valid range
-50 dBm to -80 dBm. RSSIRESOLUTION RSSI resolution. RSSIPERIOD Sample period. RSSICURRENT Current consumption in addition to IRX. 8.8 1 250 6 dB dB s A Table 12 : RSSI specifications 6.3.6 CPU Symbol Description Min. Typ. Max. Units ICPU, FLASH ICPU, RAM ISTART, CPU tSTART, CPU Run current at 16 MHz (XOSC). Executing code from flash memory. Run current at 16 MHz (XOSC). Executing code from RAM. CPU startup current. IDLE to CPU execute. 4.1 2.4 600 0 mA mA A s Test Level 2 1 1 1 Test Level 2 1 1 1 Table 13 : RSSI specifications 19 6.3.7 Power Management Symbol Description Min. Typ. Max. Units IOFF IOFF, RET, 8k IOFF2ON tOFF2ON ION,16k ION,32k t1V2 I1V2XO16 I1V2XO32 I1V2RC16 Current in SYSTEM OFF, no RAM retention. Additional current in SYSTEM OFF per retained RAM block (8 kB). OFF to CPU execute transition current. OFF to CPU execute. SYSTEM-ON base current with 16 kB RAM enabled. SYSTEM-ON base current with 32 kB RAM enabled. Startup time for 1V2 regulator. Current drawn by 1V2 regulator and 16 MHz XOSC when both are on at the same time. Current drawn by 1V2 regulator and 32 MHz XOSC when both are on at the same time. Current drawn by 1V2 regulator and 16 MHz RCOSC when both are on at the same time. For HFCLK in 1 MHz mode3. Current drawn I1V2XO16,1M by 1V2 regulator and 16 MHz XOSC when both are on at the same time. For HFCLK in 1 MHz mode3. Current drawn I1V2XO32,1M by 1V2 regulator and 32 MHz XOSC when both are on at the same time. For HFCLK in 1 MHz mode3. Current drawn I1V2RC16,1M by 1V2 regulator and 16 MHz RCOSC when both are on at the same time. Startup time for the clock management system when the XTAL is in standby. Startup time for 1V7 regulator. Current drawn by 1V7 regulator. tXO t1V7 I1V7 FDCDC 0.6 1 0.6 1 400 9.6 2.6 1 3.8 1 2.3 810 2 840 2 880 2 520 2 560 2 630 2 2.3 10.6 2 3.6 105 Test Level 2 2 1 1 2 2 1 1 1 1 A A A s A A s A A A A 1 A 1 A 1 s s A 1 1 2 1 DC/DC converter current conversion factor. 0.65 4 1.2 4 1. 2. 3. 4. Add 1 A to the current value if the device is used in Low voltage mode. This number includes the current used by the automated power and clock management system. For details on 1 MHz mode, see Section 4.2 Timer/counters (TIMER) on page 33. FDCDC will vary depending on VDD and internal radio current consumption (IDD). Please refer to the nRF51 Series Refer-ence Manual, v3.0 or later, for a method to calculate IDD,DCDC. See Figure 11 on page 51 for a DC/DC conversion factor chart. Table 14 : Power management 20 7. Reference Circuit 7.1 Schematic with Internal LDO Figure 10 : Schematic with internal LDO 21 7.2 Schematic with Internal DC/DC Converter Figure 11 : Schematic with internal DC/DC converter 22 8. Development Kit Development Kit for ISBLE1810 Figure 12 : Development Kit for ISBLE1810 Support USB to UART for DTM use Button *4 and LED *4 32 Pin GPIO to 2.54mm Female Pin Holder Support Module Test Socket 23 Development Kit for ISBLE1506 Figure 13 : Development Kit for ISBLE1506 Support USB to UART for DTM use Button *4 and LED *4 32 Pin GPIO to 2.54mm Female Pin Holder Support Module Test Socket 24 9. Antenna Forbidden Zone Description The PCB and mechanism design need to meet antenna forbidden zone description Table. Otherwise affect the efficiency of the antenna. ISBLE1810-P51xxxxxA Figure 14 : Antenna Forbidden Zone Description (ISBLE1810-P51xxxxxA) Material \ Dimension A B C FR4 (without Copper) FR4 (with Copper) Metal Plastic 1mm 4mm 4mm 1mm 3mm 7mm 3.5mm 1mm 1mm 10mm 10mm 1mm Table 15 : Antenna Forbidden Zone List (ISBLE1810-P51xxxxxA) D 3mm 4mm 3mm 3mm 25 ISBLE1506-A51xxxxxA Figure 15 : Antenna Forbidden Zone Description (ISBLE1506-P51xxxxxA) Material \ Dimension A FR4 (without Copper) FR4 (with Copper) Metal Plastic 2mm 6mm 6mm 2mm B 3mm 6mm 6mm 2mm C 0.5mm 3mm 3mm D 5mm 8mm 8mm 0.5mm 3.5mm Table 16 : Antenna Forbidden Zone List (ISBLE1506-P51xxxxxA) 26 10. Statements Federal Communications Commission (FCC) Statement 15.21 You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the users authority to operate the equipment. 15.105(b) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1) this device may not cause harmful interference, and 2) this device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement :
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Note: The end product shall have the words Contains Transmitter Module FCC ID:
2AI2V-ISBLE1810X5 27 11. Document History Revision Date Description/Changes 1.0 1.1 2.0 2014/01/22 First Release 2014/09/18 Update EVB information 2016/04/25 New Approval Sheet 1. Modify ISBLE1506-A51xxxxxA capacitive C8C9 position. 2. Update P/N Number Define. P5 3. ISBLE1506-A51xxxxxA & ISBLE1810-P51xxxxxA add shielding 2.1 2016/07/14 Marking and test point for PCB Bottom layer. P6 4. Update PCB layout guide information. P12 5. Update development kit information & Photos. P2324 6. Add RF Exposure Warning Statement. P28 28