all | frequencies |
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User Manual | Users Manual | 1.67 MiB | January 08 2017 | |||
1 | Cover Letter(s) | January 08 2017 | ||||||
1 | Cover Letter(s) | January 08 2017 | ||||||
1 | External Photos | January 08 2017 | ||||||
1 | Internal Photos | January 08 2017 | ||||||
1 | ID Label/Location Info | January 08 2017 | ||||||
1 | Cover Letter(s) | January 08 2017 | ||||||
1 | RF Exposure Info | March 08 2017 / January 08 2017 | ||||||
1 | Test Setup Photos | January 08 2017 | ||||||
1 | Test Report | January 08 2017 |
1 | User Manual | Users Manual | 1.67 MiB | January 08 2017 |
a module solution provider ZB7412-00 SimpleLinkTM Bluetooth Low Energy Wireless MCU Module TI CC2640R2F Solution Datasheet Revision 0.3 Prepared By Reviewed By Approved By
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Copyright JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 Index 1. OVERVIEW ....................................................................................................................................... 3 1.1. GENERAL FEATURES ........................................................................................................................ 3 1.2. APPLICATIONS ................................................................................................................................ 4 2. FUNCTIONAL FEATURES .................................................................................................................. 5 2.1. MODULE BLOCK DIAGRAM ............................................................................................................... 5 2.2. BLOCK FUNCTIONAL FEATURE ........................................................................................................... 6 Microcontroller ............................................................................................................................ 6 Ultra-Low Power Sensor Controller ............................................................................................ 6 Peripherals ................................................................................................................................... 6 RF Section .................................................................................................................................... 7 3. MODULE OUTLINE ........................................................................................................................... 8 3.1. SIGNAL LAYOUT (TOP VIEW) ............................................................................................................. 8 3.2. PIN DESCRIPTION ........................................................................................................................... 9 4. MODULE SPECIFICATIONS ............................................................................................................. 11 4.1. ABSOLUTE MAXIMUM RATINGS
(1)(2) ................................................................................................. 11 4.2. ESD RATINGS .............................................................................................................................. 11 4.3. RECOMMENDED OPERATING CONDITIONS ......................................................................................... 12 4.4. POWER CONSUMPTION SUMMARY .................................................................................................. 13 4.5. GENERAL CHARACTERISTICS ............................................................................................................ 14 4.6. 125-KBPS CODED (BLUETOOTH 5) RX .......................................................................................... 14 4.7. 125-KBPS CODED (BLUETOOTH 5) TX .......................................................................................... 15 4.8. 500-KBPS CODED (BLUETOOTH 5) RX .......................................................................................... 16 4.9. 500-KBPS CODED (BLUETOOTH 5) TX .......................................................................................... 17 4.10. 1-MBPS GFSK (BLUETOOTH LOW ENERGY) RX ............................................................................. 17 4.11. 1-MBPS GFSK (BLUETOOTH LOW ENERGY) TX ............................................................................. 19 4.12. 2-MBPS GFSK (BLUETOOTH 5) RX ............................................................................................. 19 4.13. 2-MBPS GFSK (BLUETOOTH 5) TX ............................................................................................. 20 4.14. INTERNAL 24-MHZ CRYSTAL OSCILLATOR (XOSC_HF)(1) .................................................................. 20 4.15. 32.768-KHZ CRYSTAL OSCILLATOR (XOSC_LF) ............................................................................... 21 4.16. 48-MHZ RC OSCILLATOR (RCOSC_HF) ........................................................................................ 21 4.17. 32-KHZ RC OSCILLATOR (RCOSC_LF) .......................................................................................... 21
(1) ............................................................................................................ 22 4.18. ADC CHARACTERISTICS 4.19. TEMPERATURE SENSOR ................................................................................................................ 23 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 1 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4.20. BATTERY MONITOR ..................................................................................................................... 24 4.21. CONTINUOUS TIME COMPARATOR ................................................................................................. 24 4.22. LOW-POWER CLOCKED COMPARATOR............................................................................................. 24 4.23. PROGRAMMABLE CURRENT SOURCE .............................................................................................. 25 4.24. DC CHARACTERISTICS .................................................................................................................. 25 4.25. TIMING REQUIREMENTS ............................................................................................................... 26 4.26. SWITCHING CHARACTERISTICS ....................................................................................................... 27 4.27. TYPICAL CHARACTERISTICS ............................................................................................................ 29 4.28. CHIP ANTENNA CHARACTERISTICS .................................................................................................. 30 5. DESIGN RECOMMENDATIONS ....................................................................................................... 32 5.1. MODULE LAYOUT RECOMMENDATIONS ............................................................................................ 32 5.2. REFERENCE SCHEMATIC ................................................................................................................. 34 6. PACKAGE INFORMATION ............................................................................................................... 35 6.1. MODULE MECHANICAL OUTLINE ..................................................................................................... 35 6.2. ORDERING INFORMATION............................................................................................................... 36 6.3. PACKAGE MARKING ...................................................................................................................... 37 7. SMT AND BAKING RECOMMENDATION ....................................................................................... 39 7.1. BAKING RECOMMENDATION ........................................................................................................... 39 7.2. SMT RECOMMENDATION .............................................................................................................. 39 8. TAPE REEL INFROMATION ............................................................................................................. 41 8.1. COVER / CARRIER TAPE DIMENSION ................................................................................................. 41 9. REGULATORY INFORMATION ........................................................................................................ 42 9.1. UNITED STATES ............................................................................................................................ 42 9.2. CANADA ..................................................................................................................................... 43 9.3. EUROPE ...................................................................................................................................... 44 9.4. JAPAN ........................................................................................................................................ 44 9.5. TAIWAN ...................................................................................................................................... 45 9.6. AUSTRALIA/NEW ZEALAND ............................................................................................................ 46 10. HISTORY CHANGE ........................................................................................................................ 47 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 2 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 1. OVERVIEW The certified ZB7412-00 module from JORJIN is a wireless MCU module targeting Bluetooth 4.2 and Bluetooth 5 low energy applications. This module is based on TI CC2640R2F wireless MCU QFN-32 package chip. The module is a cost-effective, ultralow power, 2.4-GHz RF devices. Very low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin cell batteries and in energy-harvesting applications. 1.1. General Features TI CC2640R2F, 24MHz & 32.768KHz crystals, DC2DC, and chip antenna on a single module. Built-in TI CC2640R2F 5x5mm RHB VQFN32 (15 GPIOs) LGA 25pins package. Dimension 16.9mm(L) x 11mm(W) x 2.45mm(H) Powerful ARM Cortex-M3 Microcontroller Ultra-Low Power Sensor Controller Efficient Code Size Architecture, Placing Drivers, TI-RTOS, and Bluetooth Software in ROM to Make More Flash Available for the Application No external component required. Low Power and Wide Supply Voltage Range: 1.8 to 3.8V
-
Internal DC-DC converter built-in 2.4-GHz RF Transceiver and Integrated Antenna. Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations
- ETSI EN 300 328 (Europe)
- EN 300 440 Class 2 (Europe)
- FCC CFR47 Part 15 (US)
- ARIB STD-T66 (Japan) Tools and Development Environment from TI
- Full-Feature and Low-Cost Development Kits
- Packet Sniffer PC Software
- Sensor Controller Studio
- SmartRF Studio
- SmartRF Flash Programmer 2
-
IAR Embedded Workbench for ARM ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 3 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03
- Code Composer Studio 1.2. Applications Home and Building Automation
- Connected Appliances
-
-
Lighting Locks
- Gateways
- Security Systems Industrial
-
Logistics
- Production and Manufacturing Automation
- Asset Tracking and Management
- HMI and Remote Display
- Access Control Retail
- Beacons
- Advertising
- ESL and Price Tags
- Point of Sales and Payment Systems Health and Medical
- Thermometers
- Blood Glucose and Pressure Meters
- Weight Scales
- Hearing Aids Sports and Fitness
- Activity Monitors and Fitness Trackers
- Heart Rate Monitors
- Running and Biking Sensors
- Sports Watches
- Gym Equipment
- Team Sports Equipment
- Voice Remote Controls
- Gaming
- Keyboards and Mice HID ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 4 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 2. FUNCTIONAL FEATURES 2.1. Module Block Diagram VDD GPIOs ZB7412-00 module ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 5 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 2.2. Block Functional Feature Microcontroller Powerful ARM Cortex-M3 EEMBC CoreMark score: 142 Up to 48-MHz Clock Speed 275KB of Nonvolatile Memory Including 128KB of In-System Programmable Flash Up to 28KB of System SRAM, of Which 20KB is Ultra-Low Leakage SRAM 8-KB SRAM for Cache or System RAM Use 2-Pin cJTAG and JTAG Debugging Supports Over-The-Air Upgrade (OTA) Ultra-Low Power Sensor Controller Can run autonomous from the rest of the system 16-Bit Architecture 2-KB Ultra-Low Leakage SRAM for Code and Data Peripherals All Digital Peripheral Pins can be routed to any GPIO. 15 GPIOs 4 General-Purpose Timer Modules (Eight 16-Bit or Four 32-Bit Timer, PWM Each) 12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX Continuous Time Comparator Ultra-Low Power Analog Comparator Programmable Current Source UART 2x SSI (SPI, MICROWIRE, TI) I2C I2S Real-Time Clock (RTC) ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 6 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 AES-128 Security Module True Random Number Generator (TRNG) Support for 8 Capacitive Sensing Buttons Integrated Temperature Sensor RF Section 2.4 GHz RF Transceiver Compatible With Bluetooth Low Energy (BLE) 4.2 and 5 specifications Excellent Receiver Sensitivity (96 dBm for BLE), Selectivity, and Blocking Performance Link budget of 101 dB for BLE. Programmable Output Power up to +5 dBm Integrated Antenna Pre-certified for Compliance With Worldwide Radio Frequency Regulations
- ETSI (Europe)
-
IC (Canada)
- FCC (USA)
- ARIB STD-T66 (Japan)
- NCC (Taiwan)
- RCM (Australia and New Zealand) ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 7 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 3. MODULE OUTLINE 3.1. Signal Layout (Top View) ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 8 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 3.2. Pin Description Table 3-1. Pin Description Pin Name Type Description GND NC GND DIO_0 DIO_1 DIO_2 DIO_3 DIO_4 GND NC GND GND No connection. For internal test only. GND Digital I/O GPIO, Sensor Controller Digital I/O GPIO, Sensor Controller Digital I/O GPIO, Sensor Controller, High drive capability Digital I/O GPIO, Sensor Controller, High drive capability Digital I/O GPIO, Sensor Controller, High drive capability JTAG_TMSC Digital I/O JTAG_TMSC, High drive capability JTAG_TCKC Digital I/O JTAG_TCKC DIO_5 DIO_6 Digital I/O GPIO, High drive capability, JTAG_TDO Digital I/O GPIO, High drive capability, JTAG_TDI RESET_N Digital Input Reset, active-low. No internal pullup. Built-in 0.1uF capacitor to GND. DIO_7 DIO_8 Digital/Analog I/O GPIO, Sensor Controller, Analog Digital/Analog I/O GPIO, Sensor Controller, Analog Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DIO_9 Digital/Analog I/O DIO_9 pin is connected to CS# pin of internal serial GPIO, Sensor Controller, Analog. In -04 module, SPI Flash. GPIO, Sensor Controller, Analog. In -04 module, 17 DIO_10 Digital/Analog I/O DIO_10 pin is connected to SCLK pin of internal serial SPI Flash. GPIO, Sensor Controller, Analog. In -04 module, 18 DIO_11 Digital/Analog I/O DIO_11 pin is connected to SI pin of internal serial SPI Flash. GPIO, Sensor Controller, Analog. In -04 module, 19 DIO_12 Digital/Analog I/O DIO_12 pin is connected to SO pin of internal Serial 20 DIO_13 Digital/Analog I/O GPIO, Sensor Controller, Analog SPI Flash. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 9 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 Digital/Analog I/O GPIO, Sensor Controller, Analog Power Power NC GND GND 1.8 V to 3.8 V main chip and DC/DC supply 1.8 V to 3.8 V GPIO supply No connection. Ground Ground 21 22 23 24 25 G1~G4 DIO_14 VDDS VDDS2 NC GND GND ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 10 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4. MODULE SPECIFICATIONS 4.1. Absolute Maximum Ratings(1)(2) over operating free-air temperature range (unless otherwise noted) Parameter Conditions MIN MAX Unit Supply voltage, VDDS(3) Voltage on any digital pin(4) Voltage on ADC input (Vin) Voltage scaling enabled Internal reference, voltage scaling disabled VDDS as reference, voltage scaling disabled Input RF level Storage temperature range
-0.3
-0.3
-0.3
-0.3
-0.3
-40 4.1 VDDS+0.3 Max 4.1 VDDS 1.49 VDDS/2.9 V V V V V
+5
+85 dBm C
(1) All voltage values are with respect to ground, unless otherwise noted.
(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) VDDS2 must be at the same potential as VDDS.
(4) Including analog capable DIO. 4.2. ESD Ratings Parameter Value Unit Electrostatic discharge Human Body Model (HBM), per ANSI/ESDA/JEDEC JS001(1) All pins 2500 performance (VESD) Charged Device Model (CDM), per JESD22-C101(2) RF pins Non-RF pins 750 750 V V V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 11 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4.3. Recommended Operating Conditions Parameter Conditions MIN MAX Unit Ambient temperature range Operating supply voltage (VDDS) For operation in battery-powered and
-40 1.8 85 3.8 C V 3.3 V systems ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 12 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4.4. Power Consumption Summary Tc = 25C, VDDS = 3.0 V with internal DC-DC converter, unless otherwise noted. Parameter Test Conditions Min Reset. RESET_N pin asserted or VDDS below Power-on-Reset threshold Shutdown. No clocks running, no retention Standby. With RTC, CPU, RAM and (partial) register retention. RCOSC_LF Standby. With RTC, CPU, RAM and (partial) register retention. XOSC_LF Icore Core current Standby. With Cache, RTC, CPU, RAM and consumption
(partial) register retention. RCOSC_LF Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. XOSC_LF Idle. Supply Systems and RAM powered. Active. Core running CoreMark Radio RX Radio TX, 0 dBm output power Radio TX, 5 dBm output power Typ 100 150 1.1 1.3 2.8 3.0 550 1.45mA +
31uA/MHz 6.2 6.8 9.4 Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)(1) Peripheral Delta current with domain enabled power domain Serial power Delta current with domain enabled domain RF Core DMA Timers I2C I2S SSI Delta current with power domain enabled, clock enabled, RF Core Idle Delta current with clock enabled, module idle Delta current with clock enabled, module idle Delta current with clock enabled, module idle Delta current with clock enabled, module idle Delta current with clock enabled, module idle UART Delta current with clock enabled, module idle
(1) Iperi is not supported in standby or shutdown modes. 20 13 237 130 113 12 36 93 164 Iperi Max Units nA nA A A A A A mA mA A A A A A A A A A ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 13 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4.5. General Characteristics Tc = 25C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units FLASH MEMORY Supported flash erase cycles 100 before failure Flash page/sector erase current Flash page/sector erase time(1) Flash page/sector size Flash write current Flash write time(1) Flash page/sector erase time(1) Average delta current Average delta current, 4 bytes at a time 4 bytes at a time 12.6 8 4 8.15 8 8
(1) This number is dependent on Flash aging and will increase over time and erase cycles K Cycles mA ms KB mA s ms 4.6. 125-kbps Coded (Bluetooth 5) RX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25C, VDDS
= 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Receiver sensitivity Receiver saturation BER = 103 BER = 103
-102
>5 Frequency error Difference between the incoming carrier frequency
-260 tolerance and the internally generated carrier frequency Data rate error Difference between incoming data rate and the
-260 tolerance internally generated data rate (37-byte packets) Data rate error Difference between incoming data rate and the
-140 dBm dBm 310 kHz 260 ppm 150 ppm tolerance Co-channel rejection(1) Wanted signal at 79 dBm, modulated interferer in internally generated data rate (255-byte packets) Selectivity, 1 MHz(1) Selectivity, 2 MHz(1) Selectivity, 3 MHz(1) channel, BER = 103 Wanted signal at 79 dBm, modulated interferer at 1 MHz, BER = 103 Wanted signal at 79 dBm, modulated interferer at 2 MHz, BER = 103 Wanted signal at 79 dBm, modulated interferer at 3 MHz, BER = 103
-3 9 / 5(2) 43/32(2) 47/42(2) dB dB dB dB ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 14 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 46/47(2) 49/46(2) 50/47(2) 32 5/32(2)
>46
-40
-19
-22
-42 dB dB dB dB dB dBm dBm dBm dBm Selectivity, 4 MHz(1) Selectivity, 6 MHz(1) Wanted signal at 79 dBm, modulated interferer at 4 MHz, BER = 103 Wanted signal at 79 dBm, modulated interferer at 6 MHz, BER = 103 Alternate channel rejection, 7 MHz(1) Wanted signal at 79 dBm, modulated interferer at 7 MHz, BER = 103 Selectivity, Image frequency(1) Wanted signal at -79 dBm, modulated interferer at image frequency, BER = 103 Selectivity, Image frequency 1 MHz (1) Note that Image frequency +1 MHz is the Co-channel -1 MHz. Wanted signal at 79 dBm, modulated interferer at 1 MHz from image frequency, BER = 103 Blocker rejection, 8 MHz and above(1) Out-of-band blocking(3) 30 MHz to 2000 MHz Wanted signal at -79 dBm, modulated interferer at 8 MHz and above, BER = 103 Out-of-band blocking 2003 MHz to 2399 MHz Out-of-band blocking 2484 MHz to 2997 MHz Intermodulation Wanted signal at 2402 MHz, -76 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level
(1) Numbers given as I/C dB
(2) X / Y, where X is +N MHz and Y is N MHz
(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification 4.7. 125-kbps Coded (Bluetooth 5) TX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25C, VDDS
= 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Output power, highest setting Delivered to a single-ended 50- load Output power, lowest setting Delivered to a single-ended 50- load Spurious emission conducted measurement(1) f < 1 GHz, outside restricted bands f < 1 GHz, restricted bands ETSI f < 1 GHz, restricted bands FCC f > 1 GHz, including harmonics Min 3.2 Typ Max Units 4.8
-21
-43
-65
-76
-46 5.6 dBm dBm dBm dBm dBm dBm
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 15 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 4.8. 500-kbps Coded (Bluetooth 5) RX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25C, VDDS
= 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Receiver sensitivity Receiver saturation BER = 103 BER = 103
-101
>5 Frequency error Difference between the incoming carrier frequency
-240 tolerance and the internally generated carrier frequency Data rate error Difference between incoming data rate and the
-500 tolerance internally generated data rate (37-byte packets) Data rate error Difference between incoming data rate and the
-310 dBm dBm 240 kHz 500 ppm 330 ppm tolerance internally generated data rate (255-byte packets) Co-channel rejection(1) Wanted signal at -72 dBm, modulated interferer in Selectivity, 1 MHz(1) Selectivity, 2 MHz(1) Selectivity, 3 MHz(1) Selectivity, 4 MHz(1) Selectivity, 6 MHz(1) channel, BER = 103 Wanted signal at -72 dBm, modulated interferer at 1 MHz, BER = 103 Wanted signal at -72 dBm, modulated interferer at 2 MHz, BER = 103 Wanted signal at -72 dBm, modulated interferer at 3 MHz, BER = 103 Wanted signal at -72 dBm, modulated interferer at 4 MHz, BER = 103 Wanted signal at -72 dBm, modulated interferer at 6 MHz, BER = 103 Alternate channel rejection, 7 MHz(1) Wanted signal at -72 dBm, modulated interferer at 7 MHz, BER = 103 Selectivity, Image frequency(1) Wanted signal at -72 dBm, modulated interferer at image frequency, BER = 103 Selectivity, Image frequency 1 MHz (1) Note that Image frequency +1 MHz is the Co-channel -1 MHz. Wanted signal at -72 dBm, modulated interferer at 1 MHz from image frequency, BER = 103 Blocker rejection, 8 Wanted signal at -72 dBm, modulated interferer at
-5 9 / 5(2) 41/31(2) 44/41(2) 44/44(2) 44/44(2) 44/44(2) 31 5/41(2) 44 dB dB dB dB dB dB dB dB dB ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 16 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03
--35
-19
-19
-37 dBm dBm dBm dBm MHz and above(1) 8 MHz and above, BER = 103 Out-of-band blocking(3) 30 MHz to 2000 MHz Out-of-band blocking 2003 MHz to 2399 MHz Out-of-band blocking 2484 MHz to 2997 MHz Intermodulation Wanted signal at 2402 MHz, -69 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level
(1) Numbers given as I/C dB
(2) X / Y, where X is +N MHz and Y is N MHz
(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification 4.9. 500-kbps Coded (Bluetooth 5) TX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25C, VDDS
= 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Output power, highest setting Delivered to a single-ended 50- load Output power, lowest setting Delivered to a single-ended 50- load Spurious emission conducted measurement(1) f < 1 GHz, outside restricted bands f < 1 GHz, restricted bands ETSI f < 1 GHz, restricted bands FCC f > 1 GHz, including harmonics Min 3.2 Typ Max Units 4.8
-21
-43
-65
-76
-46 5.6 dBm dBm dBm dBm dBm dBm
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 4.10. 1-Mbps GFSK (Bluetooth Low Energy) RX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25C, VDDS
= 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Receiver sensitivity Receiver saturation BER = 103 BER = 103 Min Frequency error Difference between the incoming carrier frequency
-350 tolerance and the internally generated carrier frequency Data rate error Difference between incoming data rate and the
-750 tolerance internally generated data rate Typ
-96 4 Max Units dBm dBm 350 kHz 750 ppm ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 17 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 Co-channel rejection(1) Wanted signal at 67 dBm, modulated interferer in Selectivity, 1 MHz(1) Selectivity, 2 MHz(1) Selectivity, 3 MHz(1) Selectivity, 4 MHz(1) channel, BER = 103 Wanted signal at 67 dBm, modulated interferer at 1 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at 2 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at 3 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at 4 MHz, BER = 103 Selectivity, 5 MHz or more(1) Wanted signal at 67 dBm, modulated interferer at 5 MHz, BER = 103 Selectivity, Image frequency(1) Wanted signal at 67 dBm, modulated interferer at image frequency, BER = 103 Selectivity, Image frequency 1 MHz (1) Wanted signal at 67 dBm, modulated interferer at 1 MHz from image frequency, BER = 103 Out-of-band blocking(3) 30 MHz to 2000 MHz Out-of-band blocking 2003 MHz to 2399 MHz Out-of-band blocking 2484 MHz to 2997 MHz Out-of-band blocking 3000 MHz to 12.75 GHz Intermodulation Wanted signal at 2402 MHz, 64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level Spurious emissions, Conducted measurement in a 50- single-ended 30 to 1000 MHz load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 Spurious emissions, Conducted measurement in a 50- single-ended 1 to 12.75 GHz load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 RSSI dynamic range RSSI accuracy
(1) Numbers given as I/C dB
(2) X / Y, where X is +N MHz and Y is N MHz
(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification
-6 7 / 3(2) 34/25(2) 38/26(2) 42/29(2) 32 25 3/26(2)
-20
-5
-8
-8
-34
-71
-62 70 4 dB dB dB dB dB dB dB dB dBm dBm dBm dBm dBm dBm dBm dB dB ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 18 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4.11. 1-Mbps GFSK (Bluetooth Low Energy) TX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25C, VDDS
= 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Output power, highest setting Delivered to a single-ended 50- load Output power, lowest setting Delivered to a single-ended 50- load Spurious emission conducted measurement(1) f < 1 GHz, outside restricted bands f < 1 GHz, restricted bands ETSI f < 1 GHz, restricted bands FCC f > 1 GHz, including harmonics Min 3.2 Typ Max Units 4.8
-21
-43
-65
-76
-46 5.6 dBm dBm dBm dBm dBm dBm
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 4.12. 2-Mbps GFSK (Bluetooth 5) RX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25C, VDDS
= 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Receiver sensitivity Receiver saturation BER = 103 BER = 103 Min Frequency error Difference between the incoming carrier frequency
-300 tolerance and the internally generated carrier frequency Data rate error Difference between incoming data rate and the
-1000 tolerance Co-channel rejection(1) Wanted signal at 67 dBm, modulated interferer in internally generated data rate Selectivity, 2 MHz(1) Selectivity, 4 MHz(1) Selectivity, 6 MHz(1) channel, BER = 103 Wanted signal at 67 dBm, modulated interferer at 2 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at 4 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at 6 MHz, BER = 103 Alternate channel rejection, 7 MHz (1) Wanted signal at 67 dBm, modulated interferer at 7 MHz, BER = 103 Selectivity, Image Wanted signal at 67 dBm, modulated interferer at Typ
-92 4
-7 8/4(2) 31/26(2) 37/38(2) 37/36(2) 4 Max Units dBm dBm 500 kHz 1000 ppm dB dB dB dB dB dB ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 19 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 3/26(2)
-33 15
-12
-10
-34 dB dBm dBm dBm dBm dBm frequency(1) image frequency, BER = 103 Selectivity, Image frequency 2 MHz (1) Note that Image frequency +2 MHz is the Co-channel. Wanted signal at -67 dBm, modulated interferer at 2 MHz from image frequency, BER =
103 Out-of-band blocking(3) 30 MHz to 2000 MHz Out-of-band blocking 2003 MHz to 2399 MHz Out-of-band blocking 2484 MHz to 2997 MHz Out-of-band blocking 3000 MHz to 12.75 GHz Intermodulation Wanted signal at 2402 MHz, 64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level
(1) Numbers given as I/C dB
(2) X / Y, where X is +N MHz and Y is N MHz
(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification 4.13. 2-Mbps GFSK (Bluetooth 5) TX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25C, VDDS
= 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Output power, highest setting Delivered to a single-ended 50- load 3.2 Output power, lowest setting Delivered to a single-ended 50- load Error vector magnitude At maximum output power Spurious emission conducted measurement (1) f < 1 GHz, outside restricted bands f < 1 GHz, restricted bands ETSI f < 1 GHz, restricted bands FCC f > 1 GHz, including harmonics 4.8
-21 2
-43
-65
-76
-46 5.6 dBm dBm
%
dBm dBm dBm dBm
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 4.14. Internal 24-MHz Crystal Oscillator (XOSC_HF)(1) over operating free-air temperature range (unless otherwise noted) Parameter Test Conditions Min Typ Max Units Crystal frequency 24 MHz ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 20 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 Crystal frequency tolerance(2) Start-up time(3)
-40
+40 ppm 150 s
(1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device.
(2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per Bluetooth specification
(3) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection 4.15. 32.768-kHz Crystal Oscillator (XOSC_LF) over operating free-air temperature range (unless otherwise noted) Parameter Test Conditions Min Typ Max Units Crystal frequency 32.768 Initial crystal frequency tolerance, Bluetooth Tc = 25C low energy applications Crystal aging 4.16. 48-MHz RC Oscillator (RCOSC_HF) Tc = 25C, VDDS = 3.0 V, unless otherwise noted.
-20
-3 20 KHz ppm 3 ppm/year Parameter Test Conditions Min Typ Max Units Frequency Uncalibrated frequency accuracy Calibrated frequency accuracy(1) Start-up time
(1) Accuracy relatively to the calibration source (XOSC_HF). 4.17. 32-kHz RC Oscillator (RCOSC_LF) Tc = 25C, VDDS = 3.0 V, unless otherwise noted. 48 1 0.25 5 MHz
%
%
s Parameter Test Conditions Min Typ Max Units Calibrated frequency Temperature coefficient 32.8 50 KHz ppm/C ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 21 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4.18. ADC Characteristics(1) Tc = 25C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted. Test Conditions Min Typ Max Units Parameter Input voltage range Resolution Sample rate Offset Gain error DNL(3) -
Differential nonlinearity INL -
Integral nonlinearity Internal 4.3-V equivalent reference(2) Internal 4.3-V equivalent reference(2) ENOB -
Internal 4.3-V equivalent reference(2), 200 ksps, Effective number of bits 9.6-kHz input tone VDDS as reference, 200 ksps, 9.6-kHz input tone Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Internal 4.3-V equivalent reference(2), 200 ksps, THD -
Total harmonic 9.6-kHz input tone distortion VDDS as reference, 200 ksps, 9.6-kHz input tone SINAD / SNDR -
Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Internal 4.3-V equivalent reference(2), 200 ksps, Signal-to-noise and 9.6-kHz input tone distortion ratio VDDS as reference, 200 ksps, 9.6-kHz input tone SFDR Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Internal 4.3-V equivalent reference(2), 200 ksps, Spurious-free dynamic 9.6-kHz input tone range VDDS as reference, 200 ksps, 9.6-kHz input tone Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Conversion time Serial conversion, time-to-output, 24-MHz clock Current consumption Internal 4.3-V equivalent reference(2) 0 12 2 2.4
>-1 3 9.8 10 11.1
-65
-69
-71 60 63 69 67 72 73 50 0.66 VDDS V Bits 200 ksps LSB LSB LSB LSB Bits Bits Bits dB dB dB dB dB dB dB dB dB Clock cycles mA ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 22 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 Current consumption VDDS as reference Reference voltage Equivalent fixed internal reference (input voltage scaling enabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API to include the gain or offset compensation factors stored in FCFG1. Reference voltage Fixed internal reference (input voltage scaling disabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API to include the gain or offset compensation factors stored in FCFG1. This value is derived from the scaled value (4.3 V) as follows: Vref = 4.3 V 1408
/ 4095 Reference voltage VDDS as reference (Also known as RELATIVE) (input voltage scaling enabled) Reference voltage VDDS as reference (Also known as RELATIVE) (input voltage scaling disabled) Input Impedance 200 ksps, voltage scaling enabled. Capacitive input, Input impedance depends on sampling frequency and sampling time 0.75 4.3
(2)(4) 1.48 VDDS VDDS/
2.82(4)
>1 mA V V V V M
(1) Using IEEE Std 1241-2010 for terminology and test methods.
(2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V.
(3) No missing codes. Positive DNL typically varies from +0.3 to +3.5, depending on device
(4) Applied voltage must be within absolute maximum ratings (Section 4.1) at all times. 4.19. Temperature Sensor Tc = 25C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Resolution Range Accuracy Supply voltage coefficient(1)
(1) Automatically compensated when using supplied driver libraries.
-40 4 5 3.2
+85 C C C C/V ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 23 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4.20. Battery Monitor Tc = 25C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units 1.8 50 13 3.8 mV V mV Resolution Range Accuracy 4.21. Continuous Time Comparator Tc = 25C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Input voltage range External reference voltage Internal reference voltage DCOUPL as reference Offset Hysteresis Decision time Current consumption when enabled(1) Step from 10 mV to +10 mV 0 0 1.27 3
<2 0.72 8.6 VDDS VDDS V V V mV mV s A
(1) Additionally the bias module needs to be enabled when running in standby mode. 4.22. Low-Power Clocked Comparator Tc = 25C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Input voltage range Clock frequency Internal reference voltage, VDDS / 2 Internal reference voltage, VDDS / 3 Internal reference voltage, VDDS / 4 Internal reference voltage, DCOUPL / 1 Internal reference voltage, DCOUPL / 2 Internal reference voltage, DCOUPL / 3 Internal reference voltage, DCOUPL / 4 Offset 0 32 1.49-1.51 1.01-1.03 0.78-0.79 1.25-1.28 0.63-0.65 0.42-0.44 0.33-0.34
<2 VDDS V kHz V V V V V V V mV ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 24 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 Hysteresis Decision time Step from 50 mV to +50 mV Current consumption when enabled 4.23. Programmable Current Source Tc = 25C, VDDS = 3.0 V, unless otherwise noted.
<5
<1 362 mV clock cycle nA Parameter Test Conditions Min Typ Max Units Current source programmable output range Resolution Current consumption(1) Including current source at maximum programmable output 0.25-20 0.25 23 A A A
(1) Additionally, the bias module must be enabled when running in standby mode. 4.24. DC Characteristics Parameter Test Conditions Min Typ Max Units GPIO VOH at 8-mA load IOCURR = 2, high drive GPIOs only 1.32 1.54 GPIO VOL at 8-mA load IOCURR = 2, high drive GPIOs only 0.26 0.32 TA = 25C, VDDS = 1.8 V GPIO VOH at 4-mA load IOCURR = 1 GPIO VOL at 4-mA load IOCURR = 1 GPIO pullup current Input mode, pullup enabled, Vpad=0V GPIO pulldown current Input mode, pulldown enabled, Vpad=VDDS GPIO high/low input IH = 0, transition between reading 0 and reading 1 transition, no hysteresis GPIO low-to-high input IH = 1, transition voltage for input read as 01 transition, with hysteresis GPIO high-to-low input IH = 1, transition voltage for input read as 10 transition, with hysteresis GPIO input hysteresis IH = 1, difference between 01 and 10 points TA = 25C, VDDS = 3.0 V GPIO VOH at 8-mA load IOCURR = 2, high drive GPIOs only GPIO VOL at 8-mA load IOCURR = 2, high drive GPIOs only GPIO VOH at 4-mA load IOCURR = 1 GPIO VOL at 4-mA load IOCURR = 1 1.32 1.58 0.21 71.7 21.1 0.88 1.07 0.74 0.33 2.68 0.33 2.72 0.28 0.32 V V V V A A V V V V V V V V ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 25 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 TA = 25C, VDDS = 3.8 V GPIO pullup current Input mode, pullup enabled, Vpad = 0 V GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS GPIO high/low input IH = 0, transition between reading 0 and reading 1 transition, no hysteresis GPIO low-to-high input IH = 1, transition voltage for input read as 01 transition, with hysteresis GPIO high-to-low input IH = 1, transition voltage for input read as 10 transition, with hysteresis GPIO input hysteresis IH = 1, difference between 01 and 10 points VIH VIL TA = 25C Lowest GPIO input voltage reliably interpreted as a High Highest GPIO input voltage reliably interpreted as 0.2 a Low 4.25. Timing Requirements Rising supply-voltage slew rate Falling supply-voltage slew rate Falling supply-voltage slew rate, with low-power flash settings(1) Positive temperature gradient in standby(2) CONTROL INPUT AC CHARACTERISTICS(3) No limitation for negative temperature gradient, or outside standby mode RESET_N low duration SYNCHRONOUS SERIAL INTERFACE (SSI) (4) S1 (SLAVE) (5) S2 (5) S3(5) Tclk_per tclk_high tclk_low SSIClk period SSIClk high time SSIClk low time 0 0 1 12 277 113 1.67 1.94 1.54 0.4 A A V V V V 0.8 VDDS VDDS Units mV/s mV/s mV/s C/s s 100 20 3 5 65024 system clock 0.5 0.5 Tclk_per Tclk_per Min Typ Max
(1) For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-F VDD input capacitor must be used to ensure compliance with this slew rate.
(2) Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature. TA = 40C to 85C, VDDS = 1.8 V to 3.8 V, unless otherwise noted. Tc = 25C, VDDS = 3.0 V, unless otherwise noted. Device operating as SLAVE. For SSI MASTER operation, see Section
(3)
(4) ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 26 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4.22.
(5) Refer to SSI timing diagrams Figure 4-1, Figure 4-2, and Figure 4-3. 4.26. Switching Characteristics Tc = 25C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units WAKEUP AND TIMING Idle Active Standby Active Shutdown Active SYNCHRONOUS SERIAL INTERFACE (SSI) (1) S1 (TX only)(2) tclk_per (SSIClk period) S1(TX and RX)(2) tclk_per (SSIClk period) Normal duplex operation S2 (2) tclk_high (SSIClk high time) S3 (2) tclk_low(SSIClk low time) One-way communication to SLAVE 4 8 14 151 1015 0.5 0.5 s s s 65024 system 65024 clocks tclk_per tclk_per
(1) Device operating as MASTER. For SSI SLAVE operation, see Section 4.21.
(2) Refer to SSI timing diagrams Figure 4-1, Figure 4-2, and Figure 4-3. Figure 4-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 27 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 Figure 4-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer Figure 4-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 28 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4.27. Typical Characteristics There are some typical performance plots measured on the CC2640R2FRHB device in the CC2640R2F data sheet, and the plots relevant for the ZB7412-00 module. Please visit TI web site http://www.ti.com/lit/gpn/cc2640r2f , and see Section 5.29 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 29 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 4.28. Chip Antenna Characteristics Measured on the Jorjin ZB7412E00 EM board with TA = 25C Parameter Efficiency%
Peak Gain 2400MHz 2442MHz 2484MHz 57.6 %
2.0 dBi 59.1 %
2.2 dBi 58.9 %
2.3 dBi Figure 4-4. Efficiency vs. Frequency Z ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 30 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 Z Y X Y Z Figure 4-5. DUT 3D Pattern ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 31 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 5. DESIGN RECOMMENDATIONS 5.1. Module Layout Recommendations Follow these module layout recommendations:
Antenna For a module with on board chip antenna, to eliminate the influence from other components or ground, recommended that the module is placed in the corner of main PCB, and define a clearance area around the antenna, where no grounding or signal trace are contained. The clearance area applies to all layers of the main PCB. The recommended dimensions of the main PCB keep out area are shown in bellow. 11 mm 5.5 mm ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 32 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 RF test point There are RF test points in the bottom side of this module. It is only for module production used. Do not connect any signal to these test points (leave no connection) in the module. And do not design test point in the main board. Please reserve a clearance in the top-side copper plane underneath the RF test pads. Do not route any signal or place via in this keep out area. RF test points keep out area Device and Documentation Support For a complete device and tool documents for the CC2640R2F platform, visit the Texas Instruments website at http://www.ti.com. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 33 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 5.2. Reference Schematic No external decoupling is required. The reset line should have an external pullup resistor unless the line is actively driven. Placement of this component is not critical. All Digital Peripheral Pins can be routed to any GPIO. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 34 http://WWW.JORJIN.COM.TW J1HEADER 5x2/SM24681013579nRESETJTAG_TCKJTAG_TMSVDDSDIO_2DIO_1DIO_0JTAG_TCKJTAG_TMSDIO_4DIO_3DIO_6/DIO_5DIO_7nRESETDIO_9DIO_8DIO_13DIO_12DIO_11DIO_10DIO_14cJTAG InterfaceVDDSR6100KRES0402VDDSG1G2G3G4U1ZB7DIO_04DIO_15JTAG_TMSC9JTAG_TCKC10DIO_511DIO_612RESET_N13DIO_714DIO_815DIO_916DIO_1017DIO_1118DIO_1219DIO_1320DIO_1421VDDS22GND1G1GND2G2GND3G3GND4G4DIO_48DIO_37DIO_26GND3GND51NC2VDDS223NC24GND625 DOC No: ZB7412-00A-DTS-R03 6. PACKAGE INFORMATION 6.1. Module Mechanical Outline Note:
1> Pad tolerance as 30um 2> Unit: mm Top View ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 35 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 Top and Side View Shielding case Opening Note:
A: Typical: 2.45mm, Maximum: 2.69mm B: Typical: 2.00mm, Maximum: 2.20mm Unit: mm 6.2. Ordering Information Order Number ZB7412-00 Package LGA-25 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 36 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 6.3. Package Marking JORJIN Model:ZB7412-00 LTC:YYWWSSFX FCC ID:WS2-ZB7412 IC:10462A-ZB7412 R 201-170780 XXXXXXXXXXXXXX Marking JORJIN Brand name Description ZB7412-00 Model name YYWWSSFX Lot Trace Code: YYWWSSFX YY= Digit of the year, ex: 2016=16 WW= Week (01~52) SS= Serial number from 01~98 match to MFGs lot number, or 99 to repair control code F= Reverse for internal use X = A for Module version WS2-ZB7412 FCC ID 10462A-ZB7412 Canada IC ID ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 37 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 TELEC compliance mark, and ID CE compliance mark NCC compliance mark, and ID ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 38 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 7. SMT AND BAKING RECOMMENDATION 7.1. Baking Recommendation Baking condition
- Follow MSL Level 4 to do baking process.
- After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30C/60% RH, or b) Stored at <10% RH.
- Devices require bake, before mounting, if Humidity Indicator Card reads >10%
- If baking is required, Devices may be baked for 8 hrs. at 125 C. 7.2. SMT Recommendation Recommended Reflow profile H ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 39 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 No. Item Temperature (C) 1 2 3 Pre-heat Soldering D1: 140 ~ D2: 200 D2: = 220 Peak-Temp. D3: 250 C max Time (sec) T1: 80 ~ 120 T2: 60 +/- 10 Note: (1) Reflow soldering is recommended two times maximum.
(2) Add Nitrogen while Reflow process SMT solder ability will be better. Soldering paste (without Pb) Recommended SENJU N705-GRN3360-K2-V can get better Stencil thickness 0.1~ 0.13 mm (Recommended) soldering effects. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 40 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 8. TAPE REEL INFROMATION 8.1. Cover / Carrier Tape Dimension Packing Qty 1200 EA / Reel Dry Bag 1 Reel
(1200 EA) Inner Box 1 Dry Bag
(1200 EA) Outer Box 4 Inner Box
(4800 EA) Inner Box Size : 352mm x 352mm x 56mm Outer Box Size : 354mm x 362mm x 250mm ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 41 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 9. REGULATORY INFORMATION This section outlines the regulatory information for the following countries:
United States Canada Europe Japan Taiwan Australia/New Zealand 9.1. United States Federal Communications Commission Statement 15.21. You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the users authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference and
(2) This device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. End Product Labeling:
This module is designed to comply with the FCC statement, FCC ID: WS2-ZB7412. The host system using this module must display a visible label indicating the following text:
"Contains FCC ID: WS2-ZB7412"
Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 42 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 module. The end user manual shall include all required regulatory information/warning as shown in this manual. 9.2. Canada This device complies with Industry Canadas licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. RF Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 10mm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Dclaration d'exposition aux radiations:
Cet quipement est conforme aux limites d'exposition aux rayonnements IC tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 10mm de distance entre la source de rayonnement et votre corps. End Product Labeling:
This module is designed to comply with the IC statement, IC: 10462A-ZB7. The host system using this module must display a visible label indicating the following text:
"Contains IC: 10462A-ZB7412"
____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 43 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in this manual. 9.3. Europe Hereby, Jorjin Technologies Inc. declares that the radio equipment type RF module is in compliance with Directive 2014/53/EU The full text of the EU declaration of conformity is available at the following internet address:
http://www.jorjin.com/upload/14XXXXXXXX.pdf The compliance has been verified in the operating frequency band of 2400 MHz to 2483.5 MHz. Developers and integrators that incorporate the ZB7412-00 RF Module in any end products are responsible for obtaining applicable regulatory approvals for such end product. The ZB7412-00 has been tested in the 2400-GHz to 2483.5-GHz ISM frequency band at 3.3 V with a maximum peak power of 7.1 dBm EIRP across the temperature range 40C to +85C and tolerance. Labeling and User Information Requirements As a result of the conformity assessment procedure described in Annex III of the Directive 2014/53/EC, the end-customer equipment should be labeled as follows:
9.4. Japan The ZB7412-00 is certified as a module with type certification number XXX-XXXXXX. End products that integrate this module do not need additional MIC Japan certification for the end product. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 44 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 End product can display the certification label of the embedded module. 9.5. Taiwan The ZB7412-00 is certified as a module with type certification number CCAXXXXXXXXXXX. End products that integrate this module do not need additional NCC Taiwan certification for the end product. End product can display the certification label of the embedded module. The user's manual should contain following warning (for RF device) in traditional Chinese:
:
CCAXXXXXXXXXXX ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 45 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 9.6. Australia/New Zealand This module is conformity with the following standards AS/NZS 4268: 2012 Amdt 1-2013 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 46 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R03 10. HISTORY CHANGE Date 2017/03/16 2017/03/22 Description 1. Official Released. 1. Specification for Bluetooth 5 is to be added in near future 2017/07/31 1. Add Bluetooth 5 2. Modify model number in this document. 3. Update marking information 4. Update regulatory information Revision R 0.1 R 0.2 R 0.3 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2017 47 http://WWW.JORJIN.COM.TW
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2017-08-01 | 2402 ~ 2480 | DTS - Digital Transmission System | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2017-08-01
|
||||
1 | Applicant's complete, legal business name |
Jorjin Technologies Inc.
|
||||
1 | FCC Registration Number (FRN) |
0018187252
|
||||
1 | Physical Address |
17F.-1, NO.239, SEC. 1, DATONG RD., XIZHI DIST.
|
||||
1 |
New Taipei City, N/A
|
|||||
1 |
Taiwan
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
t******@sgs.com
|
||||
1 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
WS2
|
||||
1 | Equipment Product Code |
ZB7412
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
A******** L******
|
||||
1 | Title |
Engineering Vice President
|
||||
1 | Telephone Number |
+886-******** Extension:
|
||||
1 | Fax Number |
+886-********
|
||||
1 |
a******@jorjin.com.tw
|
|||||
app s | Technical Contact | |||||
1 | Firm Name |
SGS Taiwan LTd
|
||||
1 | Name |
W******** C********
|
||||
1 | Physical Address |
No.134,Wu Kung Rd
|
||||
1 |
New Taipei City, 24803
|
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1 |
Taiwan
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1 | Telephone Number |
886 2******** Extension:
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1 | Fax Number |
886 2********
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1 |
w******@sgs.com
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app s | Non Technical Contact | |||||
1 | Firm Name |
SGS Taiwan Ltd
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1 | Name |
W****** C********
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1 | Physical Address |
No.134,Wu Kung Rd
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1 |
New Taipei City
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1 |
Taiwan
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1 | Telephone Number |
886 2******** Extension:
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||||
1 | Fax Number |
886 2********
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1 |
W******@sgs.com
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app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | DTS - Digital Transmission System | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | BLE wireless module | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Single Modular Approval. Power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antenna(s) used for this transmitter must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
SGS Taiwan Ltd.
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||||
1 | Name |
R******** W********
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1 | Telephone Number |
+886-******** Extension:
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||||
1 | Fax Number |
+886-********
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||||
1 |
R******@sgs.com
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Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 2402.00000000 | 2480.00000000 | 0.0030000 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC