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1 | Users Manual | Users Manual | 2.87 MiB | April 26 2021 / October 24 2021 | delayed release |
a module solution provider WB2072-00 Bluetooth Low Energy Wireless MCU Module ST BlueNRG-355AC Solution Datasheet Revision 0.3 Prepared By Reviewed By Approved By
Copyright JORJIN TECHNOLOGIES INC. 2020 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 Index 1. OVERVIEW ....................................................................................................................................... 3 1.1. GENERAL FEATURES ........................................................................................................................ 3 1.2. APPLICATIONS ................................................................................................................................ 4 2. FUNCTIONAL FEATURES .................................................................................................................. 5 2.1. MODULE BLOCK DIAGRAM ............................................................................................................... 5 3. MODULE OUTLINE ........................................................................................................................... 6 3.1. SIGNAL LAYOUT (TOP VIEW) ............................................................................................................. 6 3.2. PIN DESCRIPTION ........................................................................................................................... 7 4. MODULE SPECIFICATIONS ............................................................................................................... 8 4.3.1 4.3.4 4.3.2 4.3.5 4.3.3 4.1. PARAMETER CONDITIONS ................................................................................................................. 8 4.1.1 Minimum and maximum values ................................................................................. 8 Typical values ............................................................................................................... 8 4.1.2 4.2. ABSOLUTE MAXIMUM RATINGS AND THERMAL DATA .............................................................................. 8 4.3. OPERATING CONDITIONS .................................................................................................................. 9 Supply current characteristics ..................................................................................... 9 General operating conditions ................................................................................... 11 RF general characteristics ......................................................................................... 12 RF transmitter characteristics ................................................................................... 12 RF receiver characteristics ......................................................................................... 15 Embedded reset and power control block characteristics ....................................... 19 4.3.6 4.3.7 Wakeup time from low power modes ...................................................................... 19 High speed crystal requirements .............................................................................. 19 4.3.8 Low speed crystal requirements ............................................................................... 20 4.3.9 4.3.10 High speed ring oscillator characteristics ................................................................. 20 Low speed ring oscillator characteristics .................................................................. 21 4.3.11 PLL characteristics ..................................................................................................... 21 Flash memory characteristics.................................................................................... 21 Electrostatic discharge (ESD) ..................................................................................... 22 I/O port characteristics ............................................................................................. 22 RSTN pin characteristics ............................................................................................ 23 ADC characteristics .................................................................................................... 24 Temperature sensor characteristics .......................................................................... 25 Timer characteristics ................................................................................................. 26 4.3.17 4.3.18 4.3.19 4.3.13 4.3.12 4.3.16 4.3.14 4.3.15 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 1 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 4.3.20 4.3.21 I2C interface characteristics ....................................................................................... 26 SPI characteristics ...................................................................................................... 27 Typical characteristics ............................................................................................... 29 4.4. CHIP ANTENNA CHARACTERISTICS .................................................................................................... 30 4.3.22 5. DESIGN RECOMMENDATIONS ....................................................................................................... 31 5.1. MODULE LAYOUT RECOMMENDATIONS ............................................................................................ 31 5.2. REFERENCE SCHEMATIC ................................................................................................................. 33 6. PACKAGE INFORMATION ............................................................................................................... 34 6.1. MODULE MECHANICAL OUTLINE ..................................................................................................... 34 6.2. ORDERING INFORMATION............................................................................................................... 35 6.3. PACKAGE MARKING ...................................................................................................................... 36 7. SMT AND BAKING RECOMMENDATION ....................................................................................... 37 7.1. BAKING RECOMMENDATION ........................................................................................................... 37 7.2. SMT RECOMMENDATION .............................................................................................................. 37 8. TAPE REEL INFROMATION ............................................................................................................. 39 8.1. COVER / CARRIER TAPE DIMENSION ................................................................................................. 39 9. REGULATORY INFORMATION ........................................................................................................ 40 9.1. UNITED STATES ............................................................................................................................ 40 9.2. CANADA ..................................................................................................................................... 41 9.3. EUROPE ...................................................................................................................................... 42 9.4. JAPAN ........................................................................................................................................ 42 9.5. TAIWAN ...................................................................................................................................... 43 10. HISTORY CHANGE ........................................................................................................................ 44 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 2 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 1. OVERVIEW The certified WB2072-00 module from JORJIN is a wireless MCU module targeting Bluetooth 5.2 low energy applications. This module is based on ST BlueNRG-355AC wireless MCU QFN-32 package chip. The module is a cost-effective, ultralow power, 2.4-GHz RF devices. Very low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin cell batteries and in energy-harvesting applications. 1.1. General Features STMicroelectronics BlueNRG-LP, 32MHz & 32.768KHz crystals, DC2DC, and chip antenna on a single module. Built-in STMicroelectronics BlueNRG-LP, 5x5mm QFN32 (20 GPIOs) 2.4-GHz RF Transceiver and Integrated Antenna. Bluetooth Low Energy system-on-chip supporting Bluetooth 5.2 specifications:
2 Mbps data rate Long Range (Coded PHY) Advertising Extensions Channel Selection Algorithm #2 GATT caching Data rate supported: 2 Mbps, 1 Mbps, 500 kbps and 125 kbps Operating supply voltage: from 1.7 to 3.6 V High performance and ultra-low power Cortex-M0+ 32-bit, 64 MHz 256KB Flash, 64KB SRAM, 1KB OTP, 7KB ROM, MPU Dynamic current consumption: 18 A/MHz Extensive peripheral set: 2 x SPI / I2S, 1x SPI, 2 x IC, 1 x USART, 1 x UART, 6 x PWM, 1 x PDM, 1 x 12-bit ADC Supply and reset management
High efficiency embedded SMPS step-down converter Ultra-low-power Power-On-Reset (POR) and Power-Down-Reset (PDR) Programmable Voltage Detector (PVD) Embedded UART bootloader Enhanced security mechanisms such as:
Flash read/write protection SWD access can be disabled Secure bootloader LGA-42pins package. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 3 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 Dimension 15mm(L) x 11mm(W) x 2.6mm(H) Temperature range: -40 to +85 temperature range RoHS Compliance Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations
ETSI EN 300 328 (Europe) FCC CFR47 Part 15 (US) IC RSS-247 (Canada) ARIB STD-T66 (Japan)
- NCC LP0002 (Taiwan)
AS/NZS 4268 (Australia/New Zealand) KN 301 489 (South Korea) Development support
Serial wire debug (SWD) 4 breakpoints and 2 watchpoints All packages are ECOPACK2 compliant. 1.2. Applications Industrial Home and Industrial automation Smart Lighting Fitness, wellness and sports Healthcare, consumer medical Security/proximity Remote Control Assisted Living Mobile Phone peripherals PC peripherals ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 4 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 2. FUNCTIONAL FEATURES 2.1. Module Block Diagram Figure 1 Module block diagram ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 5 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 3. MODULE OUTLINE 3.1. Signal Layout (Top View) Figure 2 Pinout top view ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 6 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 3.2. Pin Description Pin No. Pin Name Type Description Table1 Pin Description GND S Ground BLE_SWCLK I/O BLE_SWCLK to CMSIS-DAP for programming BLE_SWDIO I/O BLE_SWDIO to CMSIS-DAP for programming PA1 PA0 PB15 PB14 VDD_MOD VDD_MOD GND PB5 GND I/O I2C1_SDA, SPI2_MISO, USART_TX, TIM1_CH4 I/O I2C1_SCL, USART_CTS, SPI2_MCK, TIM1_CH3 I/O I2C1_SMBA, TX_SEQUENCE, MCO, TIM1_CH4N, TIM1_CH6, USART_TX I/O SPI1_MOSI, I2C2_SDA, TIM1_ETR, TIM1_CH3N, TIM1_CH5, USART_RX S S S 1.7-3.6 battery voltage input 1.7-3.6 battery voltage input Ground I/O LPUART_RX, SPI2_MOSI, PDM_CLK S Ground BLE_RSTN I/O Reset, active-low. No internal pull-up. Built-in 0.1uF capacitor to GND. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 PB7 PB6 GND PB4 PB3 PB2 GND PB1 PB0 PA11 PA10 PA9 PA8 GND TP1 29~38 GND 39~42 GND I/O I2C2_SDA, SPI2_SCK, LPUART_RX, TIM1_CH2 I/O I2C2_SCL, SPI2_NSS, LPUART_TX, TIM1_CH1 S Ground I/O LPUART_TX, SPI2_MISO, PDM_DATA I/O USART_CTS, LPUART_TX, TIM1_CH4 I/O USART_RTS_DE, PDM_DATA, TIM1_CH3 S Ground I/O I/O SPI1_NSS, PDM_CLK, TIM1_ETR USART_RX, LPUART_RTS_DE, TIM1_CH2N I/O MCO, SPI1_NSS, SPI3_MOSI, TIM1_CH6 I/O LCO, SPI1_MISO, SPI3_MCK, TIM1_CH5 I/O I/O USART_TX, SPI1_SCK,RTC_OUT, SPI3_NSS,TIM1_CH4 USART_RX, SPI1_MOSI, SPI3_MISO, TIM1_CH3 S Ground I/O NC S S Ground Ground ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 7 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 4. MODULE SPECIFICATIONS 4.1. Parameter conditions Unless otherwise specified, all voltages are referenced to ground (GND). 4.1.1 Minimum and maximum values Unless otherwise specified, the minimum and maximum values are guaranteed in the following standard conditions:
Ambient temperature is TA = 25 C Supply voltage is VDD: 3.3 V System clock frequency is 32 MHz (clock source HSI) SMPS clock frequency is 4 MHz Data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. Based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean 3). 4.1.2 Typical values Unless otherwise specified, typical data are based on TA = 25 C, VDD = 3.3 V. They are given only as design guidelines and are not tested. Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range, where 95% of the devices have an error less than or equal to the value indicated (mean 2). 4.2. Absolute maximum ratings and thermal data Stresses above the absolute maximum ratings listed in the tables below, may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Symbol Ratings MIN MAX Unit Table 2 - Voltage characteristics ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 8 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 VDD_MOD DC-DC converter supply voltage input PA0 to PA15, PB0 to PB15 DC voltage on digital input/output pins
-0.3
-0.3
+3.9
+3.9 V V Note: All the main power and ground pins must always be connected to the external power supply, in the permitted range. Symbol IVDD IVGND IVDD(PIN) IIO(PIN) IIO(PIN) Symbol TSTG TJ Table 3 - Current characteristics Ratings MAX Unit Total current into sum of all VDD power lines (source) Total current out of sum of all ground lines (sink) Maximum current into each VDD power pin (source) IVGND(PIN) Maximum current out of each ground pin (sink) Output current sunk by any I/O and control pin Output current sourced by any I/O and control pin Total output current sunk by sum of all I/Os and control pins Total output current sourced by sum of all I/Os and control pins 130 130 100 100 20 20 100 100 mA Table 4 - Thermal characteristics Ratings Storage temperature range Maximum junction temperature Value Unit
-40 to +125 125 4.3. Operating conditions 4.3.1 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code. The MCU is put under the following conditions:
All I/O pins are in analog input mode All peripherals are disabled except when explicitly mentioned The Flash memory access time is adjusted with the minimum wait states number When the peripherals are enabled fPCLK = fHCLK ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 9 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 Table 5- Current consumption Symbol Parameter IDD(RUN) Supply current in RUN mode Conditions fHCLK = 64 MHz All peripherals disabled fHCLK = 32 MHz All peripherals disabled fHCLK = 16 MHz All peripherals disabled Timer OFF Timer source LSI Timer source LSI RTC ON Timer source LSI IWDG ON Timer source LSI IDD(DEEPSTOP) Supply current in DEEPSTOP (1) RTC and IWDG ON Timer source LSE Timer source LSE RTC ON Timer source LSE IWDG ON Timer source LSE RTC and IWDG ON IDD(SHUTDOWN) Supply current in SHUTDOWN IDD(RST) Current under reset condition
(1) The current consumption in DEEPSTOP is measured considering the entire SRAM retained. Typ. Unit 2.40 1.98 mA 1.62 0.65 1.25 1.30 1.27 1.33 1.00 1.06 1.02 1.07 0.12 1.34 A A mA Table 6- Peripheral current consumption at VDD = 3.3 V, sysclk at 32 MHz, SMPS on Parameter Test conditions Typ. Unit ADC DMA GPIOA GPIOB I2C1 I2C2 80 39 2 2 40 39 A ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 10 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 I2S2 I2S3 IWDG LPUART PKA RNG RTC SPI1 SPI2 SPI3 Systick TIM1 USART SYSCFG THSENS CRC Peripheral clock at 32 MHz Peripheral clock at 32 MHz Peripheral clock at 16 MHz Peripheral clock at 16 MHz 46 47 11 52 50 64 14 35 40 42 8 248 81 33 301 9 A 4.3.2 General operating conditions Symbol Parameter Conditions MIN MAX Unit Table 7- General operating conditions fHCLK fPCLK0 fPCLK1 fPCLK2 VDD Internal AHB clock frequency Internal APB0 clock Internal APB1 clock Internal APB2 clock frequency Standard operating voltage VFBSMPS SMPS feedback voltage VDDRF Minimum RF voltage VIN PD TA TJ I/O input voltage Power dissipation at TA =85 C(1) Ambient temperature Maximum power dissipation Junction temperature range 1 1 1 16 1.7 1.4 1.7 64 64 64 32 3.6 3.6 3.6
-0.3 VDD+0.3 30 85 85
-40
-40 MHz V mW
(1) TA cannot exceed the TJ max. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 11 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 4.3.3 RF general characteristics All performance data are referred to a 50 antenna connector, via reference design. Symbol Parameter Test conditions Min. Typ. Max. Unit Table 8- Bluetooth Low energy RF general characteristics FRANGE Frequency range(1) RFCH RF channel center frequency(1) PLLRES RF channel spacing(1) F f1 Frequency deviation(1) Frequency deviation average(1) CFdev Center frequency deviation(1) fa Rgfsk STacc MOD Frequency deviation f2
(average) /f1 (average) (1) On air data rate(1) Symbol time accuracy(1) Modulation scheme BT Bandwidth-bit period product Mindex Modulation index(1) During the packet and including both initial frequency offset and drift 2400 2402 2483.5 MHz 2480 MHz 2 250 450 550 KHz KHz KHz 150 KHz 0.80 1 0.45 2 Mbps 50 ppm GFSK 0.5 0.5 0.55 PMAX Maximum Output 6.3 7 7.7 dBm At antenna connector, VSMPS = 1.9 V, LDO code PMIN Minimum Output At antenna connector PRFC RF power accuracy
@ 27C All temperatures
-20 1.5 2.5 dBm dB
(1) Tested according to Bluetooth SIG radio frequency physical layer (RF PHY) test suite. 4.3.4 RF transmitter characteristics All performance data are referred to a 50 antenna connector, via reference design. Table 9- Bluetooth Low Energy RF Transmitter characteristics at 1 Mbps not coded Symbol Parameter Test conditions Min. Typ. Max. Unit ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 12 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 6 dB Bandwidth for modulated carrier Using resolution bandwidth of 100kHz 550 KHz In-band emission at Using resolution bandwidth of 100 kHz 2MHz(1) and average detector PBW1M PRF1, 1 Ms/s In-band emission at PRF2, 1 Ms/s
[3+n]MHz, where n=0,1,2.. (1) PSPUR Spurious emission Freqdrift Frequency drift Using resolution bandwidth of 100 kHz and average detector Harmonics included. Using resolution bandwidth of 1 MHz and average detector Integration interval #n integration interval #0, where n=2,3,4..k IFreqdrift IntFreqdrift Initial carrier frequency Integration interval #1 integration drift(1) interval #0 Intermediate carrier Integration interval #n integration frequency drift(1) interval #(n-5), where n=6,7,8..k DriftRatemax Maximum drift rate(1) Between any two 10-bit groups separated by 50s
-50
-23
-20
-20 ZRF1 Optimum RF load
(Impedance at RF1 pin)
@ 2440 MHz 40
(1) Tested according to Bluetooth SIG radio frequency physical layer (RF PHY) test suite. Table 10- Bluetooth Low Energy RF Transmitter characteristics at 2 Mbps not coded Symbol Parameter Test conditions Min. Typ. Max. Unit 6 dB Bandwidth for modulated carrier Using resolution bandwidth of 100kHz 670 KHz PBW1M PRF1, 2Ms/s PRF2, 2Ms/s In-band emission at Using resolution bandwidth of 100kHz and 4MHz(1) average detector In-band emission at Using resolution bandwidth of 100kHz and 5MHz(1) average detector In-band emission at PRF3, 2Ms/s
[6+n]MHz, where n=0,1,2.. (1) Using resolution bandwidth of 100kHz and average detector PSPUR Spurious emission Harmonics included. Using resolution bandwidth of 1 MHz and average detector ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 13 http://WWW.JORJIN.COM.TW
-20 dBm
-30 dBm
-41 dBm
+50 KHz
+23 KHz
+20 KHz KHz/50
+20 s
-20 dBm
-20 dBm
-30 dBm
-41 dBm DOC No: WB2072-00-DTS-R03 Freqdrift Frequency drift(1) Integration interval #n integration interval #0, where n=2,3,4..k IFreqdrift IntFreqdrift Initial carrier frequency Integration interval #1 integration drift(1) interval #0 Intermediate carrier Integration interval #n integration frequency drift(1) interval #(n-5), where n=6,7,8..k DriftRatemax Maximum drift rate(1) Between any two 10-bit groups separated by 50s
-50
-23
-20
-20 ZRF1 Optimum RF load
(Impedance at RF1 pin)
@ 2440 MHz 40
(1) Tested according to Bluetooth SIG radio frequency physical layer (RF PHY) test suite.
+50 KHz
+23 KHz
+20 KHz KHz/50
+20 s Table 11- Bluetooth Low Energy RF Transmitter characteristics at 1 Mbps LE coded (S=8) Symbol Parameter Test conditions Min. Typ. Max. Unit PBW PRF1, LE coded 6 dB Bandwidth for modulated carrier Using resolution bandwidth of 100kHz 500 KHz In-band emission at Using resolution bandwidth of 100kHz and 2MHz(1) average detector In-band emission at PRF2, LE coded
[3+n]MHz, where n=0,1,2.. (1) PSPUR Spurious emission Freqdrift Frequency drift(1) Using resolution bandwidth of 100kHz and average detector Harmonics included. Using resolution bandwidth of 1 MHz and average detector Integration interval #n integration interval #0, where n=1,2,3..k
-20 dBm
-30 dBm
-41 dBm
-50
+50 KHz IFreqdrift IntFreqdrift Initial carrier frequency Integration interval #3 integration drift(1) interval #0
-19.2
+19.2 KHz Intermediate carrier Integration interval #n integration frequency drift(1) interval #(n-3), where n=7,8,9..k
-19.2
+19.2 KHz DriftRatemax Maximum drift rate(1) Between any two 16-bit groups separated by 48s
-19.2
+19.2 KHz/48s ZRF1 Optimum RF load
(Impedance at RF1 pin)
@ 2440 MHz 40
(1) Tested according to Bluetooth SIG radio frequency physical layer (RF PHY) test suite. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 14 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 4.3.5 RF receiver characteristics All performance data are referred to a 50 antenna connector, via reference design. Table 12- Bluetooth Low Energy RF receiver characteristics at 1 Msym/s uncoded Test conditions Min. Typ. Max. Unit Symbol RXSENS PSAT ZRF1 C/ICO-channel C/I1 MHz C/I2 MHz Parameter Sensitivity Saturation Optimum RF source
(Impedance at RF1 pin) finterference Adjacent Interference finterference = fRX 1MHz Adjacent Interference finterference = fRX 2MHz Adjacent Interference RF selectivity with BLE equal modulation on interfering signal Co-channel interference fRX =
Wanted signal=-67dBm, PER < 30.8%
PER < 30.8%
PER < 30.8%
@ 2440 MHz
-94 8 40 8
-1 Wanted signal=-67dBm, PER < 30.8%
Wanted signal=-67dBm, PER < 30.8%
-35 C/I3 MHz finterference = fRX (3+n) MHz [n =
Wanted signal=-67dBm, PER < 30.8%
0,1,2]
C/IImage Image frequency Interference finterference = fimage Adjacent channel to image Wanted signal=-67dBm, PER < 30.8%
C/IImage1 MHz frequency finterference = fimage Wanted signal=-67dBm, PER < 30.8%
1MHz Out of Band Blocking (Interfering signal CW) C/IBlock C/IBlock C/IBlock Interfering signal frequency Wanted signal=-67dBm, PER < 30.8%, 30MHz 2000 MHz Measurement resolution 10 MHz Interfering signal frequency Wanted signal=-67dBm, PER < 30.8%, 2003 MHz 2399 MHz Measurement resolution 3MHz Interfering signal frequency Wanted signal=-67dBm, PER < 30.8%, 2484 MHz 2997 MHz measurement resolution 3MHz C/IBlock Interfering signal frequency Wanted signal=-67dBm, PER < 30.8%,
-47
-25
-25 5
-5
-5 10 dBm dBm dBc dBc dBc dBc dBc dBc dBm dBm dBm dBm ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 15 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 3000 MHz 12.75 GHz measurement resolution 25MHz Intermodulation characteristics (CW signal at f1, BLE interfering signal at f2) Input power of IM interferer at P_IM(3) 3 and 6 MHz distance from Wanted signal=-64dBm, PER < 30.8%
-27 dBm wanted signal Input power of IM interferer at P_IM(-3)
-3 and -6 MHz distance from Wanted signal=-64dBm, PER < 30.8%
-40 dBm wanted signal Input power of IM interferer at P_IM(4) 4 and 8 MHz distance from Wanted signal=-64dBm, PER < 30.8%
-32 dBm wanted signal Input power of IM interferer at P_IM(5) 5 and 10 MHz distance from Wanted signal=-64dBm, PER < 30.8%
-32 dBm wanted signal Table 13- Bluetooth Low Energy RF receiver characteristics at 2 Msym/s uncoded Test conditions Min. Typ. Max. Unit Symbol RXSENS PSAT ZRF1 C/ICO-channel C/I2 MHz C/I4MHz Parameter Sensitivity Saturation Optimum RF source
(Impedance at RF1 pin)
PER < 30.8%
PER < 30.8%
@ 2440 MHz RF selectivity with BLE equal modulation on interfering signal Co-channel interference Wanted signal=-67dBm, PER <
fRX = finterference 30.8%
Adjacent Interference Wanted signal=-67dBm, PER <
finterference = fRX 2MHz 30.8%
Adjacent Interference Wanted signal=-67dBm, PER <
finterference = fRX 4MHz 30.8%
Adjacent Interference C/I6 MHz f interference = f RX (6+2n) MHz [n = 0,1,2]
Wanted signal=-67dBm, PER <
30.8%
Image frequency Interference Wanted signal=-67dBm, PER <
C/IImage finterference = fimage-2M 30.8%
C/IImage1 MHz Adjacent channel to image Wanted signal=-67dBm, PER <
-91 8 40 8
-14
-41
-45
-25
-14 dBm dBm dBc dBc dBc dBc dBc dBc ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 16 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 frequency 30.8%
finterference = fimage-2M 2MHz Out of Band Blocking (Interfering signal CW) Interfering signal frequency Wanted signal=-67dBm, PER < 30.8%, 30MHz 2000 MHz Measurement resolution 10 MHz Interfering signal frequency Wanted signal=-67dBm, PER < 30.8%, 2003 MHz 2399 MHz Measurement resolution 3MHz Interfering signal frequency Wanted signal=-67dBm, PER < 30.8%, 2484 MHz 2997 MHz measurement resolution 3MHz Interfering signal frequency Wanted signal=-67dBm, PER < 30.8%, 3000 MHz 12.75 GHz measurement resolution 25MHz C/IBlock C/IBlock C/IBlock C/IBlock 5
-5
-5 10 dBm dBm dBm dBm Intermodulation characteristics (CW signal at f1, BLE interfering signal at f2) Input power of IM interferer at P_IM(6) 6 and 12 MHz distance from Wanted signal=-64dBm, PER < 30.8%
-27 dBm wanted signal Input power of IM interferer at P_IM(-6)
-6 and -12 MHz distance from Wanted signal=-64dBm, PER < 30.8%
-30 dBm wanted signal Input power of IM interferer at P_IM(8) 8 and 16 MHz distance from Wanted signal=-64dBm, PER < 30.8%
-30 dBm wanted signal Input power of IM interferer at P_IM(10) 10 and 20 MHz distance from Wanted signal=-64dBm, PER < 30.8%
-28 dBm wanted signal Table 14- Bluetooth Low Energy RF receiver characteristics at 1 Msym/s LE coded (S=2) Symbol RXSENS PSAT ZRF1 Parameter Sensitivity Saturation Optimum RF source
(Impedance at RF1 pin) Test conditions Min. Typ. Max. Unit PER < 30.8%
PER < 30.8%
@ 2440 MHz
-97 8 40 dBm dBm RF selectivity with BLE equal modulation on interfering signal C/ICO-channel Co-channel interference fRX = finterference Wanted signal=-79dBm, PER < 30.8%
2 dBc ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 17 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 C/I1 MHz C/I2 MHz Adjacent Interference finterference = fRX 1MHz Adjacent Interference finterference = fRX 2MHz Adjacent Interference Wanted signal=-79dBm, PER < 30.8%
Wanted signal=-79dBm, PER < 30.8%
C/I3 MHz finterference = fRX (3+n) MHz [n =
Wanted signal=-79dBm, PER < 30.8%
0,1,2]
C/IImage Image frequency Interference finterference = fimage Adjacent channel to image Wanted signal=-79dBm, PER < 30.8%
C/IImage1 MHz frequency finterference = fimage 1 Wanted signal=-79dBm, PER < 30.8%
MHz
-5
-38
-50
-30
-34 dBc dBc dBc dBc dBc Table 15- Bluetooth Low Energy RF receiver characteristics at 1 Msym/s LE coded (S=8) Test conditions Min. Typ. Max. Unit RF selectivity with BLE equal modulation on interfering signal C/ICO-channel Wanted signal=-79dBm, PER < 30.8%
Co-channel interference Symbol RXSENS PSAT ZRF1 Parameter Sensitivity Saturation Optimum RF source
(Impedance at RF1 pin) C/I1 MHz C/I2 MHz fRX = finterference Adjacent Interference finterference = fRX 1MHz Adjacent Interference finterference = fRX 2MHz Adjacent Interference PER < 30.8%
PER < 30.8%
@ 2440 MHz
-100 8 40 1
-4 Wanted signal=-79dBm, PER < 30.8%
Wanted signal=-79dBm, PER < 30.8%
-39 C/I3 MHz finterference = fRX (3+n) MHz [n =
Wanted signal=-79dBm, PER < 30.8%
0,1,2]
C/IImage Image frequency Interference finterference = fimage Adjacent channel to image Wanted signal=-79dBm, PER < 30.8%
C/IImage1 MHz frequency finterference = fimage 1 Wanted signal=-79dBm, PER < 30.8%
MHz
-53
-33
-32 dBm dBm dBc dBc dBc dBc dBc dBc ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 18 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 4.3.6 Embedded reset and power control block characteristics Table 16- Embedded reset and power control block characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit TRSTTEMPO Reset temporization after PDR is detected VDD rising 500 VPDR VPVD0 VPVD1 VPVD2 VPVD3 VPVD4 VPVD5 VPVD6 Power-down reset threshold PVD threshold 0 PVD threshold 1 PVD threshold 2 PVD threshold 3 PVD threshold 4 PVD threshold 5 PVD threshold 6 4.3.7 Wakeup time from low power modes Falling edge Falling edge Falling edge Falling edge Falling edge Falling edge Falling edge 1.63 2.02 2.17 2.33 2.49 2.61 2.78 2.87 us V V The wakeup times reported are the latency between the event and the execution of the instruction. The device goes in Low-power mode after the WFI (Wait For Interrupt) instruction. Table 17- Low power mode wakeup timing Symbol Parameter Conditions Typ. Unit TWUDEEPSTOP Wakeup time from DEEPSTOP Wakeup from GPIO. Boot in Flash mode to RUN mode memory 110 s 4.3.8 High speed crystal requirements High speed external oscillator must be supplied with an external 32 MHz crystals that are specified for a 6 to 8pF loading capacitor. The BlueNRG-LP include internal programmable capacitances that can be used to tune the crystal frequency in order to compensate the PCB parasitic one. These internal load capacitors, are made by a fixed one, in parallel with a 6-bit binary weighted capacitor bank. Thanks to low CL step size (LSB is typically 0.07pF), very fine Crystal tuning is possible. With typical XTAL sensitivity of
-14ppm/pF, it is possible to trim a 32MHz crystal, with a resolution of 1ppm The requirements for the external 32 MHz crystal are reported in the table below. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 19 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 Table 18- HSE crystal requirements Symbol Parameter Conditions Min. Typ. Max. Unit fNOM Oscillator frequency 32 MHz fTOL Frequency tolerance temperature, aging and frequency pulling 50 ppm Includes initial accuracy, stability over due to incorrect load capacitance. ESR PD Equivalent series resistance Drive level 100 100 W CL HSE Crystal load capacitance 5(1) 7(2) 9.2(3) pF 27 C, typical corner GMCONF = 3 27 C, GMCONF = 3 XOTUNE code between 32 and 33 0.07 pF HSE crystal load capacitance CLstep LSB value
(1) XOTUNE programed at minimum code = 0
(2) XOTUNE programed at center code = 32
(3) XOTUNE programed at maximum code = 63 4.3.9 Low speed crystal requirements The low speed clock can be supplied with an external 32.768 kHz crystal oscillator. The requirements for the external 32.768 kHz crystal are reported in the table below. Symbol Parameter Conditions Min. Typ. Max. Unit Table 19- LSE crystal requirements fNOM ESR PD Nominal Frequency Equivalent series resistance Drive level 4.3.10 High speed ring oscillator characteristics 32.768 KHz K W 90 0.1 Table 20- HSI oscillator characteristics Symbol Parameter Conditions Min. Typ. Max. Unit fNOM Nominal Frequency 64 MHz ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 20 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 4.3.11 Low speed ring oscillator characteristics Table 21- LSI oscillator characteristics Parameter Test conditions Min. Typ. Max. Unit Symbol fNOM Nominal Frequency Trimmed by software FRO_T/FRO Frequency spread vs. temperature Standard deviation 4.3.12 PLL characteristics 33 140 KHz ppm/
Characteristics measured over recommended operating conditions unless otherwise specified. Symbol Parameter Conditions Min. Typ. Max. Unit Table 22- PLL characteristics At 1MHz offset from carrier
(measured at 2.4GHz) At 2.4GHz 3MHz offset from carrier
-110 dBc/Hz
-114 dBc/Hz PNSYNTH RF carrier phase noise
(measured at 2.4GHz) At 2.4GHz 6MHz offset from carrier
(measured at 2.4GHz) At 25MHz offset from carrier LOCKTIMETX PLL lock time to TX With calibration @2.5 ppm LOCKTIMERX PLL lock time to RX With calibration @2.5 ppm LOCKTIMERXTX PLL lock time RX to TX Without calibration @2.5 ppm LOCKTIMETXRX PLL lock time TX to RX Without calibration @2.5 ppm
-128
-135 150 110 47 32 dBc/Hz dBc/Hz s s s s 4.3.13 Flash memory characteristics The characteristics below are guaranteed by design. Table 23- Flash memory characteristics Symbol Parameter Test conditions Typ. Max. Unit tprog 32-bit programming time tprog_burst 4x32-bit burst programming time 20 20 40 40 s ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 21 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 tERASE tME Page (2 Kbyte) erase time Mass erase time IDD Average consumption from VDD 40 40 ms mA 20 20 3 3 5 Write mode Erase mode Mass erase Table 24- Flash memory endurance and data retention Symbol NEND tRET Parameter Endurance Data retention Test conditions Min. Unit TA = -40 to +85 TA = 85 10 10 kcycles Years 4.3.14 Electrostatic discharge (ESD) Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts x (n + 1) supply pins). This test conforms to the ANSI/JEDEC standard. Symbol Parameter Conditions Class Max.(1) Unit Table 25- ESD absolute maximum ratings VESD(HBM) VESD(CBM) Electrostatic discharge voltage
(human body model) Electrostatic discharge voltage
(charge device model)
(1) Guaranteed by characterization results. 4.3.15 I/O port characteristics Conforming to ANSI/ESDA/JEDEC JS-001 2 2000 Conforming to ANSI/ESDA/STM5.3.1 JS-002 C2a 500 V Unless otherwise specified, the parameters given in the tables below are derived from tests performed under the conditions summarized in General operating conditions. All I/Os are designed as CMOS-compliant. Table 26- I/O static characteristics Symbol Parameter Conditions Min. Typ Max. Unit VIL VIH I/O input low level voltage I/O input low level voltage 1.62 V < VDD < 3.6 V 0.7xVDD 0.3xVDD V ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 22 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 0 <= VIN <= Max(VDDx) (1) 100 Ilkg Input leakage current Max(VDDx) (1) <= VIN <= Max(VDDx) (1)
+1V Max(VDDx) (1) + 1V < VIN <= 5.5 V RPU RPD CIO Pull up resistor Pull down resistor I/O pin capacitance VIN=GND VIN=GND 25 25 40 40 5
(1) Max(VDDx) is the maximum value among all the I/O supplies. 650 nA 200 55 55 K pF All I/Os are CMOS-compliant (no software configuration required). The GPIOs (general purpose input/outputs) can sink or source up to 8 mA, and sink or source up to 20 mA (with a relaxed VOL / VOH). In the user application, the number of I/O pins that can drive current must be limited to respect the absolute maximum rating specified. The sum of the currents sourced by all the I/Os on VDD, plus the maximum consumption of the MCU sourced on VDD, cannot exceed the absolute maximum rating IVDD. The sum of the currents sunk by all the I/Os on VSS, plus the maximum consumption of the MCU sunk on GND, cannot exceed the absolute maximum rating IVGND. The characteristics below are guaranteed by characterization. Table 27- Output voltage characteristics Symbol Parameter Conditions Min. Max. Unit VOL VOH VOL VOH VOL VOH Output low level voltage for an I/O pin CMOS port (1) |IIO| = 8 mA VDD Output high level voltage for an I/O pin 2.7 V VDD-0.4 Output low level voltage for an I/O pin Output high level voltage for an I/O pin Output low level voltage for an I/O pin Output high level voltage for an I/O pin
|IIO| = 20 mA VDD 2.7 V
|IIO| = 4 mA VDD 1.62 V VDD-1.3 VDD-0.45 0.4 1.3 0.4 V
(1) CMOS outputs are compatible with JEDEC standards JESD36 and JESD52. 4.3.16 RSTN pin characteristics The RSTN pin input driver uses CMOS technology. It is connected to a permanent pull-up resistor, RPU. Unless otherwise specified, the parameters given in the table below are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Section 4.3.2 General operating conditions. The characteristics ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 23 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 below are guaranteed by design. Symbol VIL(RSTN) VIH(RSTN) Table 28- RSTN pin characteristics Parameter Conditions Min. Typ. Max. Unit RSTN input low level voltage 0.3 x VDD RSTN input high level voltage 0.7 x VDD Vhys(RSTN) RSTN Schmitt trigger voltage hysteresis RPU Weak pull up equivalent resistor VIN=GND 25 V mV K 200 40 55 Figure 3 - Recommended RSTN pin protection Note:
The external reset circuit protects the device against parasitic resets. The user must ensure that the level on the RSTN pin can go below the VIL(RSTN) max. level specified in the table, otherwise the reset is not taken into account by the device. The external capacitor on RSTN must be placed as close as possible to the device. 4.3.17 ADC characteristics Table 29- ADC characteristics (HSI must be set to PLL mode) Symbol Parameter Conditions Min. Typ. Max. Unit Ch_diff_num Ch_se_num Number of channels for differential mode Number of channels for single ended mode ADC biasing consumption at 4 8 IBATADCBIAS Biasing blocks turned on 145 mA battery ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 24 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 IBATADCACTIVE ADC activated in differential mode 185 ADC active consumption at VDDA RAIN Rin Cin Ts Tsw DR battery Analog supply voltage Input impedance In DC Internal access resistance VBOOST is enabled for VDD < 2.7 V Input sampling capacitor Sampling period Sampling time Output data rate FRMToutput Output data format TL Latency time 200 kSps 1.2 1.32 550 250 4 1 125 200 16 5 TSTARTUP Start-up time From ADC enable to conversion start 1 DNL INL Differential non-linearity Integral non-linearity SNR Diff Signal to noise ratio Differential input @1 kHz, -1 dBFs STHD Diff Signal to THD ratio (10 harmonics) Differential input @1 kHz, -1 dBFs 0.7 1 72 80 ENOB Diff Effective number of bits Differential input @1 kHz, -1 dBFs 11.5 SNR SE Signal to noise ratio Single ended @1 kHz, -1 dBFs STHD SE Signal to THD ratio (10 harmonics) Single ended @1 kHz, -1 dBFs ENOB SE Effective number of bits Single ended @1 kHz, -1 dBFs ADC_ERR_1V7 ADC_ERR_2V4 ADC_ERR_3V0 ADC_ERR_3V6 Absolute error when used for battery measurement at 1.7V, 2.4V, 3.0V,3.6V 70 75 11 13 0
-9
-22 mA V K pF s ns k samples/s bits s s LSB LSB dB dB bits dB dB bits mV 4.3.18 Temperature sensor characteristics Symbol TrERR TSLOPE Table 30- Temperature sensor characteristics Parameter Min. Typ. Max. Error in temperature Average temperature coefficient 4 8 Unit LSB/
____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 25 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 TICC TTS-OUT Current consumption Output voltage level at 30C (+-5C) 415 2533 A V 4.3.19 Timer characteristics The characteristics below are guaranteed by design. Table 31- TIM1 characteristics Parameter Test conditions Min. Typ. Max. Unit Symbol tres(TIM) ResTIM Timer resolution time fTIMxCLK = 64 MHz Timer resolution tCOUNTER 16-bit counter clock period fTIMxCLK = 64 MHz 0.015625 tMAX_COUNT Maximum possible count time fTIMxCLK= 64 15.625 16 ns bit s s 1024 67.10 Table 32- IWDG min./max. timeout period at 32 kHz (LSE) Prescaler divider PR[2:0] bits Min timeout RL[11:0] = 0x000 Max timeout RL[11:0] = 0xFFF Unit
/4
/8
/16
/32
/64
/128
/256 0 1 2 3 4 5 6 or 7 0.125 0.250 0.500 1.0 2.0 4.0 8.0 512 1024 2048 4096 8192 16384 32768 ms 4.3.20 I2C interface characteristics The I2C interface meets the timings requirements of the I2C-bus specification and user manual rev.03 for:
Standard-mode (Sm): bit rate up to 100 kbit/s Fast-mode (Fm): bit rate up to 400 kbit/s Fast-mode Plus (Fm+): bit rate up to 1 Mbit/s. The SDA and SCL I/O requirements are met with the following restriction: the SDA and SCL I/O pins are not true open-drain. When configured as open-drain, the PMOS connected between the I/O pin and VDD is disabled, but is still present. The 20 mA output drive requirement in Fast-mode Plus is supported partially. This limits the maximum load Cload supported in Fast-mode Plus, given by these formulas:
____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 26 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 tr (SDA/SCL) = 0.8473 x Rp x Cload Rp (min) = [VDD - VOL (max)] / IOL (max) where Rp is the I2C lines pull-up. All I2C SDA and SCL I/Os embed an analog filter. The characteristics below are guaranteed by design. Table 33- I2C analog filter characteristics Symbol Parameter Min. Max. Unit tAF Maximum pulse width of spikes that are suppressed by the analog filter 50 110 ns 4.3.21 SPI characteristics The parameters for SPI are derived from tests performed according to fPCLKx frequency and supply voltage conditions. Output speed is set to OSPEEDRy[1:0] = 11 Capacitive load C = 30 pF Measurement points are done at CMOS levels: 0.5 x VDD The characteristics below are guaranteed by design. Symbol Parameter Conditions Min. Typ. Max. Unit Table 34- SPI characteristics fSCK SPI clock frequency Master mode Slave mode tsu(NSS) th(NSS) tw(SCKH) tw(SCKL) NSS setup time NSS hold time SCK high and low time Master mode
32 32(1)
4 / fPCLK 2 / fPCLK 1 / fPCLK - 1.5 1 / fPCLK 1 / fPCLK+1 1 / fPCLK - 1.5 1 / fPCLK 1 / fPCLK+1 tsu(MI) Data input setup time Master mode tsu(SI) th(MI) th(SI) Data input setup time Slave mode Data input hold time Master mode Data input hold time Slave mode ta(SO) Data output access time Slave mode tdis(SO) Data output disable time Slave mode tv(SO) Data output valid time Master mode 1 1 3 1 5 5
2
40 38 8 MHz
ns ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 27 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 th(SO) Data output valid time Slave mode Master mode Slave mode
2 4 12 39
ns
(1) The maximum frequency in slave transmitter mode is determined by the sum of tv(SO) and tsu(MI), which has to fit SCK low or high phase preceding the SCK sampling edge. This value can be achieved when the SPI communicates with a master having tsu(MI) = 0 while duty(SCK) = 50 %. Figure 4 - SPI timing diagram - slave mode and CPHA = 0 Figure 5 - SPI timing diagram - slave mode and CPHA = 1 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 28 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 Figure 6 - SPI timing diagram - master mode 4.3.22 Typical characteristics There are some typical performance plots measured on the BlueNRG-355AC device in the BlueNRG-LP data sheet, and the plots relevant for the WB2072-00 module. Please visit STMicroelectronics web site https://www.st.com/resource/en/datasheet/bluenrg-lp.pdf ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 29 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 4.4. Chip Antenna Characteristics Measured on the Jorjin WB2072E00A EM board with TA = 25C Figure 7 Efficiency vs. Frequency Figure 8 3D Pattern ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 30 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 5. DESIGN RECOMMENDATIONS 5.1. Module Layout Recommendations Follow these module layout recommendations:
Antenna For a module with on board chip antenna, to eliminate the influence from other components or ground, recommended that the module is placed in the corner of main PCB, and define a clearance area around the antenna, where no grounding or signal trace are contained. The clearance area applies to all layers of the main PCB. The recommended dimensions of the main PCB keep out area are shown in bellow. Figure 9 PCB keep out area ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 31 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 RF test point There are RF test points in the bottom side of this module. It is only for module production used. Do not connect any signal to these test points (leave no connection) in the module. And do not design test point in the main board. Please reserve a clearance in the top-side copper plane underneath the RF test pads. Do not route any signal or place via in this keep out area. RF test points keep out area Figure 10 RF Point ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 32 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 5.2. Reference Schematic Figure 11 Reference Schematic ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 33 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 6. PACKAGE INFORMATION 6.1. Module Mechanical Outline Figure 12 Module Mechanical Outline (BOTTOM View) Note:
1> Pad tolerance as 30m 2> Unit: mm ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 34 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 Figure 13 Module Mechanical Outline (TOP and Side View) Note:
Unit: mm 6.2. Ordering Information Order Number WB2072-00 Package LGA-42 ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 35 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 6.3. Package Marking 2 7 0 2 B W
2 S W D
I C C F N I J R O J 0 0
2 7 0 2 B W
l e d o M X F S S W W Y Y C T L
2 7 0 2 B W A 2 6 4 0 1
C 2 0 7 8 0 7 2 0 B 7 W 1
1 2 0 S 2 W D R
2 7 0 2 B W
2 S W D
7 T 0 0 2 0 B 1 1 W P
L 2 7 S 1 W M A D C C I
I I I 2 7 0 2 B W
2 S W D
I 2 9 Figure 14 shielding case information Marking JORJIN Brand name Description WB2072-00 Model name YYWWSSFX Lot Trace Code: YYWWSSFX YY= Digit of the year, ex: 2017=17 WW= Week (01~52) SS= Serial number from 01~98 match to MFGs lot number, or 99 to repair control code F= Reverse for internal use X = A for Module version WS2-WB2072 FCC ID 10462A-WB2072 Canada IC ID TELEC compliance mark, and ID CE compliance mark NCC compliance mark, and ID ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 36 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 7. SMT AND BAKING RECOMMENDATION 7.1. Baking Recommendation Baking condition
- Follow MSL Level 4 to do baking process.
- After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30C/60% RH, or b) Stored at <10% RH.
- Devices require bake, before mounting, if Humidity Indicator Card reads >10%
- If baking is required, Devices may be baked for 8 hrs. at 125 C. 7.2. SMT Recommendation Recommended Reflow profile H Figure 15 Reflow profile ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 37 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 No. Item Temperature (C) 1 2 3 Pre-heat Soldering D1: 140 ~ D2: 200 D2: = 220 Peak-Temp. D3: 250 C max Time (sec) T1: 80 ~ 120 T2: 60 +/- 10 Note: (1) Reflow soldering is recommended two times maximum.
(2) Add Nitrogen while Reflow process SMT solder ability will be better. Stencil thickness 0.1~ 0.13 mm (Recommended) Soldering paste (without Pb) Recommended SENJU N705-GRN3360-K2-V can get better soldering effects. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 38 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 8. TAPE REEL INFROMATION 8.1. Cover / Carrier Tape Dimension Packing Qty 1200 EA / Reel Dry Bag 1 Reel
(1200 EA) Inner Box 1 Dry Bag
(1200 EA) Outer Box 4 Inner Box
(4800 EA) Inner Box Size : 352mm x 352mm x 56mm Outer Box Size : 354mm x 362mm x 250mm ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 39 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 9. REGULATORY INFORMATION This section outlines the regulatory information for the following countries:
United States Canada Japan Europe Taiwan 9.1. United States Federal Communications Commission Statement 15.21. You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the users authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference and
(2) This device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. End Product Labeling:
This module is designed to comply with the FCC statement, FCC ID: WS2-WB2072-00. The host system using this module must display a visible label indicating the following text:
"Contains FCC ID: WS2-WB2072-00"
Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in this manual. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 40 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 9.2. Canada This device complies with Industry Canadas licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. RF Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 10mm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Dclaration d'exposition aux radiations:
Cet quipement est conforme aux limites d'exposition aux rayonnements IC tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 10mm de distance entre la source de rayonnement et votre corps. End Product Labeling:
This module is designed to comply with the IC statement, IC: 10462A-WB2072-00. The host system using this module must display a visible label indicating the following text:
"Contains IC: 10462A-WB2072-00"
Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 41 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 module. The end user manual shall include all required regulatory information/warning as shown in this manual. 9.3. Europe Hereby, Jorjin Technologies Inc. declares that the radio equipment type RF module is in compliance with Directive 2014/53/EU The full text of the EU declaration of conformity is available at the following internet address:
https://www.jorjin.com/downloads/#474-wb2072-00 The compliance has been verified in the operating frequency band of 2400 MHz to 2483.5 MHz. Developers and integrators that incorporate the WB2072-00 RF Module in any end products are responsible for obtaining applicable regulatory approvals for such end product. The WB2072-00 has been tested in the 2400-GHz to 2483.5-GHz ISM frequency band at 3.3 V with a maximum peak power of 6.46 dBm EIRP across the temperature range 40C to +85C and tolerance. Labeling and User Information Requirements As a result of the conformity assessment procedure described in Annex III of the Directive 2014/53/EC, the end-customer equipment should be labeled as follows:
9.4. Japan The WB2072-00 is certified as a module with type certification number xxx-xxxxxx. End products that integrate this module do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 42 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 9.5. Taiwan The WB2072-00 is certified as a module with type certification number XXXXXXXXXXXXXX. End products that integrate this module do not need additional NCC Taiwan certification for the end product. End product can display the certification label of the embedded module. The user's manual should contain following warning (for RF device) in traditional Chinese:
LP0002 _ 3.8.2
XXXXXXXXXXXXXX ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 43 http://WWW.JORJIN.COM.TW DOC No: WB2072-00-DTS-R03 10. HISTORY CHANGE Revision Draft 1.0 Draft 1.1 Draft 2.0 Draft 2.0 R01 R02 R03 Date 2020.07.08 2020.08.11 2020.11.12 2020.11.13 2020.12.16 2021.02.22 2021.03.29 Description Draft version released. Update parameter values Re-edit Update Figure 1 Module block diagram Official version released Add 9. REGULATORY INFORMATION Update warning of NCC ____________________________________________________________________________________ Copyright JORJIN TECHNOLOGIES INC. 2020 44 http://WWW.JORJIN.COM.TW
1 | Internal Photos | Internal Photos | 994.95 KiB | April 26 2021 / October 24 2021 | delayed release |
1 | ID Label/Location Info | ID Label/Location Info | 4.40 MiB | April 26 2021 / May 03 2021 |
a module solution provider WB2072-00 RD Label Specification R02 History Change Revision Date Description Prepared By Approved By D01 R01 R02 2020/11/02 Draft version Release Dennis Chiu Hsinwei Wang 2020/12/16 Modify certification marking Dennis Chiu Hsinwei Wang 2020/12/24 Modify date code Dennis Chiu Hsinwei Wang Jorjin Confidential a module solution provider Laser Marking Pin-1 marking Product number: WB2072-00 Date Code:
YYWWSSFX YY = Digit of the year, ex: 2012=12 WW= Week (01~52) SS = Serial number from 01 ~98 match to MFGs lot number or 99 to repair control code F = 0~9 for ML control code A= Module version Laser marking rule draft, the area in the middle of shielding case FCC ID: WS2-WB2072 IC: 10462A-WB2072 NCC ID:
MIC ID:
Jorjin Confidential a module solution provider WB2072-00 Marking Example Jorjin Confidential
1 | Declaration of authorization | Cover Letter(s) | 194.71 KiB | April 26 2021 / May 03 2021 |
RF_160, Issue 04 On JOR asi Jorjin Technologies Inc. Declaration of Authorization We Name: Jorjin Technologies Inc. Address: 17F, No.239, Sec.1, Datong Rd., Xizhi Dist., New Taipei City 22161, Taiwan City: New Taipei City Country: Taiwan Declare that:
Name Representative of agent: Kevin Tsai Agent Company name: SGS Compliance Certification Services Inc. Address: No. 11. Wugong 6th Road City: New Taipei City Country Taiwan is authorized to apply for Certification of the following product(s):
Product description: Bluetooth Module Type designation: | WB2072-00 Trademark: JORJIN Validity/ expiry date: April 13, 2022 on our behalf. Dates tee creo April 13, 2021........... City, eee New Taipei City...................08 Name: eee Alan Lin .........cceeeeeeee eens Function: = essences Engineering Vice President...................... Signature: _Jllhin Notes:
(1): Required for FCC application
(2): For FCC it must be the Grantee Code owner or the authorized agent.
1 | FCC Modular Approval Request | Cover Letter(s) | 356.74 KiB | April 26 2021 / May 03 2021 |
telefication RF_734_03 26 March 2020 Modular Approval Request FCC (KDB 996369 DO1 & Part 15.212) Applicant / Grantee: Jorjin Technologies Inc. FCC ID: WS2-WB2072-00 Model: WB2072-00 Items to be covered by Single modular transmitters. Answer from applicant 1. The radio elements must have the radio frequency circuitry shielded. | yes, please refer as below. Physical components and tuning capacitor(s) may be located external | F to the shield, but must be on the module assembly. 2. The module must have buffered modulation/data inputs to ensure that | Yes, the module has ifs the device will comply with Part 15 requirements with any type of input | own buffered in Main chip. signal. 3. The module must contain power supply regulation on the module Yes, the module has its own power supply regulation in Main chip. 4. The module must contain a permanently attached antenna, or contain | Yes, module contain a a unique antenna connector, and be marketed and operated only with | permanently attached specific antenna(s), per 15.203, 15.204(b), 15.204(c), 15.212(a), | antenna. 2.929(b). 5. The module must demonstrate compliance in a stand-alone Yes, the module is tested In configuration. a stand-alone configuration. 6. The module must be labeled with its permanently affixed FCC ID label, | Yes, module FCC or use an electronic display (see KDB Publication 784748). identification number noted in shielding and user manual. 7. The module must comply with all specific rules applicable to the | Yes, please refer to the user transmitter, including all the conditions provided in the integration | manual. instructions by the grantee. 8. The module must comply with RF exposure requirements. Yes, RF exposure statement is attached in the user manual. Note: A limited modular approval (LMA) may be granted for sing/e or split modular transmitters that comply partially with the requirements above. Name and surname of applicant (or authorized representative):
Alan Lin / Engineering Vice President Date: 4/13/2021 Signature: flee
1 | Request for LT or STC confidentiality | Cover Letter(s) | 544.00 KiB | April 26 2021 / May 03 2021 |
FCC, Request for non-disclosure Date: 21-Nov-2018 RF_501, Issue 8 Page 1 of 1 Company Name: Jorjin Technologies Inc. Address: 17F, No.239, Sec.1, Datong Rd., Xizhi Dist., New Taipei City 22161,Taiwan City: New Taipei Country: Taiwan To: Telefication B.V., Dept. FCC TCB Edisonstraat 12A 6902 PK ZEVENAAR The Netherlands Subject: Request for confidentiality FCC ID: WS2-WB2072-00 Reference number: ###H####
Dear FCC TCB, 1. Long-Term Confidentiality Pursuant to 47 CFR Section 0.459(a) & (b), we hereby requests non-disclosure and confidential treatment of the following materials submitted in support of FCC certification application:
LC] Bill(s) of Material Block Diagrams XX] Operational Description [Xx] Schematic Diagrams (7 Tune-up Procedure Above materials contain secrets, proprietary and technical information, which would customarily be guarded from competitors under 47 CFR, section 0.457(d)(2). Disclosure or publication or any portion of this company confidential material to other parties could cause substantial competitive harm and provide unjustified benefits for competitors. 2. Short-Term Confidentiality (STC) Pursuant to Public Notice DA 04-1705 of the Commissions policy, in order to comply with the marketing regulations in 47 CFR 2.803 and the importation rules in 47 CFR 2.1204, applicant hereby requests Short-Term Confidential treatment of the following materials (See notes below):
KX Internal Photos [X] Users Manual Test Set-up Photos External Photos Justification: Ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices. Date: 4/13/2021 Name and signature of applicant: Alan Lin / Engineering Vice President fe 1) A document or type of document can only have ONE type of confidentiality!
2) Short-Term confidentiality is in principle for 45 days from date of grant; it can be extended max 3 times (total time 180 days max.)!
The planned date should stated in the RF731 application form. 3) FCC must be informed when marketing begins earlier. 4) Release takes place automatically thus extension must be requested in time. Telefication does not remind you of this!
5) Request for extension or for release must be received by Telefication at least 7 days before date of actual marketing or before expiration of the STC period
1 | Test Setup Photos | Test Setup Photos | 757.94 KiB | April 26 2021 / October 24 2021 | delayed release |
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2021-05-03 | 2402 ~ 2480 | DTS - Digital Transmission System | Original Equipment |
app s | Applicant Information | |||||
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1 | Effective |
2021-05-03
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1 | Applicant's complete, legal business name |
Jorjin Technologies Inc.
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1 | FCC Registration Number (FRN) |
0018187252
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1 | Physical Address |
17F.-1, NO.239, SEC. 1, DATONG RD., XIZHI DIST.
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1 |
New Taipei City, N/A
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1 |
Taiwan
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app s | TCB Information | |||||
1 | TCB Application Email Address |
c******@telefication.com
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1 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
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app s | FCC ID | |||||
1 | Grantee Code |
WS2
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1 | Equipment Product Code |
WB2072-00
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app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
A******** L********
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1 | Title |
Engineering Vice President
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1 | Telephone Number |
+886-******** Extension:
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1 | Fax Number |
+886-********
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1 |
a******@jorjin.com.tw
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app s | Technical Contact | |||||
1 | Firm Name |
Compliance Certification Services Inc. Wugu Lab.
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1 | Name |
A**** C********
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1 | Physical Address |
No.11, Wugong 6th Rd., Wugu Dist.
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1 |
Taiwan
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1 | Telephone Number |
886-2********
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1 | Fax Number |
886-2********
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1 |
A******@sgs.com
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app s | Non Technical Contact | |||||
1 | Firm Name |
Compliance Certification Services Inc. Wugu Lab.
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1 | Name |
A**** C********
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1 | Physical Address |
No.11, Wugong 6th Rd., Wugu Dist.
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1 |
Taiwan
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1 | Telephone Number |
886-2********
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1 | Fax Number |
886-2********
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1 |
A******@sgs.com
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app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 10/24/2021 | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | DTS - Digital Transmission System | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Bluetooth Module | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Modular Approval. Power output listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antennas used for this transmitter as shown in this filing must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users may not be provided with the module installation instructions.OEM integrators and end-users must be provided with transmitter operating conditions for satisfying RF exposure compliance. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
Compliance Certification Services Inc. Wugu Lab.
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1 | Name |
H****** L******
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1 | Telephone Number |
886-2******** Extension:
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1 | Fax Number |
+886-********
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1 |
h******@sgs.com
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Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
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Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 2402.00000000 | 2480.00000000 | 0.0059000 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC