Part Number: WG7837-V1
a module solution provider
WLAN/BT Module
TI WiLink8 IEEE 802.11a/b/g/n MIMO
Bluetooth / Bluetooth LE Solution
Datasheet
Revision 2.0
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Part number:WG7837-V1
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Index
1. HISTORY CHANGE ............................................................................................................................ 3
2. OVERVIEW ....................................................................................................................................... 4
MODELS FUNCTIONAL BLOCKS .......................................................................................................... 4
GENERAL FEATURES ........................................................................................................................ 4
APPLICATIONS ................................................................................................................................ 4
3. FUNCTIONAL FEATURES .................................................................................................................. 5
MODULE BLOCK DIAGRAM ............................................................................................................... 5
BLOCK FUNCTIONAL FEATURE ........................................................................................................... 6
4. MODULE OUTLINE ........................................................................................................................... 7
SIGNAL LAYOUT (BOTTOM VIEW) ...................................................................................................... 7
PIN DESCRIPTION ........................................................................................................................... 8
5. MODULE SPECIFICATION ............................................................................................................... 11
GENERAL MODULE REQUIREMENTS AND OPERATION .......................................................................... 11
WLAN RF PERFORMANCE ............................................................................................................. 14
BLUETOOTH RF PERFORMANCE ....................................................................................................... 19
BLUETOOTH LE RF PERFORMANCE .................................................................................................. 22
POWER CONSUMPTION .......................................................................................................... 24
6. HOST INTERFACE TIMING CHARACTERISTICS ............................................................................... 26
WLAN SDIO TRANSPORT LAYER .................................................................................................... 26
SDIO TIMING SPECIFICATIONS ........................................................................................................ 27
HCI UART SHARED TRANSPORT LAYERS FOR ALL FUNCTIONAL BLOCKS (EXCEPT WLAN)........................... 30
UART TIMING SPECIFICATIONS ....................................................................................................... 31
BLUETOOTH CODEC-PCM(AUDIO) TIMING SPECIFICATIONS .................................................................. 32
7. CLOCK AND POWER MANAGEMENT ............................................................................................ 33
RESET-POWER-UP SYSTEM ............................................................................................................ 33
WLAN POWER-UP SEQUENCE ....................................................................................................... 33
BLUETOOTH/BLE POWER-UP SEQUENCE .......................................................................................... 34
8. REFERENCE SCHEMATICS ............................................................................................................... 35
9. DESIGN RECOMMENDATIONS ....................................................................................................... 36
MODULE LAYOUT RECOMMENDATIONS ............................................................................................. 36
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LAYOUT PATTERN AND STENCIL RECOMMENDATIONS ............................................................................ 39
10. PACKAGE INFORMATION ............................................................................................................. 40
MODULE MECHANICAL OUTLINE ................................................................................................... 40
MODULE MARKING .................................................................................................................... 41
TAPE / REEL / SHIPPING BOX SPECIFICATION .................................................................................... 42
11. SMT AND BAKING RECOMMENDATION ..................................................................................... 44
BAKING RECOMMENDATION ......................................................................................................... 44
SMT RECOMMENDATION ............................................................................................................ 44
12. REGULATORY INFORMATION ...................................................................................................... 45
UNITED STATES .......................................................................................................................... 45
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1. HISTORY CHANGE
Revision
Date
Rev. 1.0
Rev. 2.0
2021-04-07
2021-06-23
Description
Initial Released
Updated Module marking
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2. OVERVIEW
The WG7837-V1 series SiP (System in Package) module, is the most demanded design for
all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth,
Bluetooth LE solutions to provide the best WiFi and BT coexistence interoperability and power
saving technologies from TI.
Models Functional Blocks
Module
P/N
WG7837-
V1
WLAN
2.4GHz SISO
V
WLAN 2.4GHz
MIMO (1)
V
WLAN 2.4GHz
MRC (2)
V
WLAN 5GHz
SISO (1)
V
Bluetooth /
Bluetooth LE
V
(1) SISO: single input, single output; MIMO: multiple input, multiple output.
(2) MRC: maximum ratio combining.
General Features
Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives and Power
Management.
LGA-100 pin package
Small Form Factor: 13.3 x 13.4 x 2.0 mm.
FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
Operating temperature: -40°C to 85°C
Applications
Internet of Things (IoT)
Multimedia
Home Electronics
Home Appliances and White Goods
Industrial and Home Automation
Smart Gateway and Metering
Video Conferencing
Video Camera and Security
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3. FUNCTIONAL FEATURES
Module Block Diagram
Figure 3-1. WG7837-V1 Block Diagram
NOTE:
1. Dashed lines indicate optional configurations and are not applied by default.
2. The Part Number WG7837-V1 only support WLAN 2.4G/5G and Bluetooth / Bluetooth LE.
3. The Part Number WG7837-V1 can use GPIO control external ZigBee module.
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Block Functional Feature
WLAN Features
WLAN Baseband Processor and RF transceiver supporting IEEE 802.11a/b/g/n.
20 and 40MHz SISO and 20MHz 2x2 MIMO at 2.4 GHz for High Throughput:
80 Mbps (TCP), 100 Mbps (UDP)
Fully Calibrated: Production Calibration Not Required
2.4-GHz MRC Support for Extended Range and 5GHz Diversity Capable
4-Bit SDIO Host Interface Support
Wi-Fi Direct Concurrent Operation. (Multichannel, Multirole)
Bluetooth and Bluetooth LE Features
Supports Bluetooth Core Specification Version 4.2.
Host Controller Interface (HCI) Transport for Bluetooth over UART.
Dedicated Audio Processor Support of SBC encoding + A2DP
Dual-Mode Bluetooth and Bluetooth LE
Key Benefits
Reduces design overhead
Best-in-Class Wi-Fi with high-performance audio and video streaming reference
applications with up to 1.4X the range versus one antenna
Different provisioning methods for In-Home devices connectivity to Wi-Fi in one step
Lowest Wi-Fi power consumption in connected Idle (< 800 μA)
Configurable wake on WLAN filters to only wake up the system
Wi-Fi-Bluetooth single Antenna coexistence
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4. MODULE OUTLINE
Signal Layout (Bottom View)
Figure 4-1. Module pins
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Pin No.
Signal Name
Type
Description
Table 4-1. Pin Description
Shut
Down
State
After
Power
Up(1)
Voltage
Level
Pin Description
1
2
3
4
5
6
7
8
9
10
11
12
GND
GPIO11
GPIO9
GPIO10
GPIO12
GND
WL_SDIO_D0
WL_SDIO_D1
WL_SDIO_D2
15
16
17
18
19
GND
GND
GND
RF_ANT2
GND
WL_SDIO_CMD
GND
GND
WL_SDIO_CLK
IN
HiZ
HiZ
1.8V
WLAN SDIO Clock. Must be driven by
GND
IO
IO
IO
IO
IO
GND
IO
IO
IO
GND
GND
GND
ANA
GND
PD
PD
PU
PU
HiZ
HiZ
HiZ
HiZ
PD
PD
PU
PU
HiZ
HiZ
HiZ
HiZ
-
Ground
1.8V
1.8V
1.8V
1.8V
Reserved for future use. NC if not used.
Reserved for future use. NC if not used.
Reserved for future use. NC if not used.
Reserved for future use. NC if not used.
1.8V WLAN SDIO Command (2)
Ground
the host.
Ground
1.8V WLAN SDIO Data bit 0 (2)
1.8V WLAN SDIO Data bit 1 (2)
1.8V WLAN SDIO Data bit 2 (2)
WLAN SDIO Data bit 3. Changes state to
PU at WL_EN or BT_EN assertion for
card detects. Later disabled by software
during initialization. (2)
SDIO available, interrupt out. Active
high. (For WL_RS232_TX/RX pull up is at
power up.) Set to rising edge (active
line can be configured by the driver
according to the IRQ configuration
(Polarity / Level / Edge).
Ground
Ground
Ground
Ground
5G ANT diversity TX/RX , 2.4G
Secondary antenna MRC/MIMO only
-
-
-
-
-
-
-
14
WLAN_IRQ
OUT
PD
0
1.8V
high) on power up. The Wi-Fi interrupt
13
WL_SDIO_D3
IO
HiZ
PU
1.8V
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1.8V
1.8V
Reserved for future use. NC if not used.
Reserved for future use. NC if not used.
PD
PD
PD
PD
PD
PD
PD
PD
1.8V
Reserved for future use. NC if not used.
WL_RS232_RX (when WLAN_IRQ = 1 at
1.8V
power up)
WL_RS232_TX (when WLAN_IRQ = 1 at
PD
PD
1.8V
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Ground
Ground
Ground
power up)v
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
5G main ANT TX/RX, 2.4G WLAN main
antenna SISO, Bluetooth
Input sleep clock: 32.768 kHz
PD
PD
1.8V
Connect to 1.8V external VIO
1.8V Mode setting: high = enable
PD
PD
PU
PU
PD
PD
PU
PU
1.8V
1.8V
1.8V
Mode setting: high =enable. If Bluetooth
is not used, connect to ground.
Option: WLAN logger
Option: Bluetooth logger
VBAT
Power supply input, 2.9 to 4.8 V
VBAT
Power supply input, 2.9 to 4.8 V
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
GND
RESERVED1
RESERVED2
GND
GND
GPIO4
GPIO2
GPIO1
GND
GND
GND
GND
RF_ANT1
EXT_32K
GND
GND
GND
GND
VIO
GND
WLAN_EN
BT_EN
WL_UART_DBG
BT_UART_DEBUG
GND
GND
VBAT_IN
VBAT_IN
GND
GND
BT_HCI_RTS
BT_HCI_CTS
GND
I
I
GND
GND
IO
IO
IO
GND
GND
GND
GND
ANA
GND
GND
GND
ANA
GND
POW
GND
I
I
OUT
OUT
GND
GND
POW
POW
GND
GND
O
I
PU
PU
PU
PU
1.8V
1.8V
UART RTS to host. NC if not used.
UART CTS to host. NC if not used.
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UART TX to host. NC if not used.
1.8V
PU
PU
O
PU
PU
1.8V
UART RX to host. NC if not used.
BT_AUD_IN
PD
PD
1.8V
Bluetooth PCM/I2S bus. Data in. NC if
57
BT_AUD_OUT
O
PD
PD
1.8V
Bluetooth PCM/I2S bus. Data in. NC if
BT_AUD_FSYNC
IO
PD
PD
1.8V
Bluetooth PCM/I2S bus. Data in. NC if
BT_AUD_CLK
IO
PD
PD
1.8V
Bluetooth PCM/I2S bus. Data in. NC if
BT_HCI_TX
BT_HCI_RX
GND
GND
GND
GND
I
I
GND
GND
GND
GND
52
53
54
55
56
58
59
60
61
62
63
64
Ground
Ground
not used.
not used.
not used.
Ground
not used.
Ground
-
-
-
-
-
-
-
RESERVED3
O
PD
PD
1.8V
GND
RESERVED
G1~G36 GND
GND
GND
GND
(1) PU=Pull Up ; PD=Pull Down.
(2) Host must provide PU using a 10-K resistor for all non-CLK SDIO signals.
Reserved for future use. NC if not used.
Option: External TCXO.
Ground
Reserved for future use. Connect to
ground if not used.
Ground
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5. MODULE SPECIFICATION
General Module Requirements and Operation
Absolute Maximum Ratings (1)
Parameter
Value
Units
VBAT
VIO
Input voltage to Analog pins
Input voltage limits (CLK_IN)
Input voltage to all other pins
Operating ambient temperature range
Storage temperature range
ESD Stress Voltage (3)
Human Body Model (4)
Charged Device Model (5)
4.8 (2)
-0.5 to 2.1
-0.5 to 2.1
-0.5 to VIO
-40 to +85
-40 to +85
±1000
±250
-0.5 to (VIO + 0.5V)
V
V
V
V
V
°C
°C
V
V
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under
“operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect
device reliability.
(2) 4.8 V cumulative to 2.33 years, including charging dips and peaks
(3) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into
device.
(4) Level listed is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe
manufacturing with a standard ESD control process, and manufacturing with less than 500V HBM is possible if necessary
precautions are taken. Pins listed as 1000V may actually have higher performance.
(5) Level listed is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250V CDM allows safe
manufacturing with a standard ESD control process, and manufacturing with less than 250V CDM is possible if necessary
precautions are taken. Pins listed as 250V may actually have higher performance.
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Recommended Operating Conditions
Parameter
Condition
SYM
MIN
TYP
MAX
Units
DC supply range for
all modes
1.8 V IO ring power
supply voltage
2.9
3.7
4.8
1.62
1.8
1.95
0.65 x VIO
VIO
0.35 x VIO
V
VIH_EN
1.365
VIH
VIL
Tr
Tf
VIL_EN
VOH
VOL
Tr,Tf
VIO -0.45
0
0
0
1
VIO
0.4
VIO
0.45
5.3
4.9
85
2.8
0.2
10
ns
ns
ºC
W
VBAT (1)
VIO
IO high-level input voltage
IO low-level input voltage
Enable inputs high-level input
voltage
voltage
Enable inputs low-level input
High-level output voltage
Low-level output voltage
@ 4 mA
@ 4 mA
Input transitions time Tr,Tf from
10% to 90% (Digital IO) (2)
Output rise time from 10% to 90%
CL < 25 pF
(Digital pins) (2)
(Digital pins) (2)
Output fall time from 10% to 90%
CL < 25 pF
Ambient operating temperature
-40
Maximum power dissipation
WLAN operation
BT operation
(1) 4.8V is applicable only for 2.3 years (30% of the time). Otherwise, the maximum VBAT should not exceed 4.3V.
(2) Applies to all Digital lines except SDIO, UART, I2C, PCM and slow clock lines
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External Slow Clock Input (SLOW_CLK)
The supported digital slow clock is 32.768 kHz digital (square wave).
Parameter
Condition
SYM
MIN.
WLAN, BT
±250
ppm
Tr,Tf
VIH
VIL
0
1
TYP
32.768
MAX.
Units
KHz
200
85
VIO
5
0.35 x VIO
ns
%
Vpeak
MΩ
pF
Square Wave,
DC-coupled
15
50
0.65 x VIO
Input slow clock Frequency
Input slow clock accuracy (Initial +
temp + aging)
Input Transition time Tr,Tf (10% to
90%)
Frequency input duty Cycle
Input Voltage Limits
Input Impedance
Input Capacitance
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WLAN RF Performance
WLAN 2.4-GHz Receiver
Sensitivity
- 20MHz Bandwidth
- At < 10% PER limit
Parameter
Condition
MIN
TYP
MAX
Units
RF_ANT1 pin 2.4GHz SISO
Operation frequency range
2412
2484
MHz
1 Mbps DSSS
2 Mbps DSSS
5.5 Mbps CCK
11 Mbps CCK
6 Mbps OFDM
9 Mbps OFDM
12 Mbps OFDM
18 Mbps OFDM
24 Mbps OFDM
36 Mbps OFDM
48 Mbps OFDM
54 Mbps OFDM
MCS0 MM 4K
MCS1 MM 4K
MCS2 MM 4K
MCS3 MM 4K
MCS4 MM 4K
MCS5 MM 4K
MCS6 MM 4K
MCS7 MM 4K
MCS0 MM 4K 40MHz
MCS7 MM 4K 40MHz
MCS0 MM 4K MRC
MCS7 MM 4K MRC
MCS13 MM 4K
MCS14 MM 4K
MCS15 MM 4K
OFDM
DSSS
-95.0
-92.0
-89.2
-86.3
-91.0
-89.0
-88.0
-85.5
-82.5
-79.0
-74.0
-72.5
-89.3
-86.5
-84.5
-81.5
-78.0
-73.5
-71.5
-70.0
-86.0
-66.3
-91.0
-73.0
-70.0
-69.0
-68.3
-10
-1
dBm
dBm
dBm
dB
Max Input Level
At < 10% PER limit
Adjacent channel rejection:
2Mbps DSSS
-20
-4
42.0
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Sensitivity level +3 dB for OFDM;
11Mbps CCK
Sensitivity level +6 dB for 11b
54Mbps OFDM
38.0
2.0
dB
dB
WLAN 2.4-GHz Transmitter
Output Power.
- Maximum RMS output power
measured at 1 dB from IEEE
spectral mask or EVM. (1)
Parameter
Condition
MIN
TYP
MAX
Units
RF_ANT1 Pin 2.4GHz SISO
1 Mbps DSSS
2 Mbps DSSS
5.5 Mbps CCK
11 Mbps CCK
6 Mbps OFDM
9 Mbps OFDM
12 Mbps OFDM
18 Mbps OFDM
24 Mbps OFDM
36 Mbps OFDM
48 Mbps OFDM
54 Mbps OFDM
MCS0 MM
MCS1 MM
MCS2 MM
MCS3 MM
MCS4 MM
MCS5 MM
MCS6 MM
MCS7 MM(2)
MCS0 MM 40MHz
MCS7 MM 40MHz
MCS12
MCS13
MCS14
MCS15
17.3
17.3
17.3
17.3
17.1
17.1
17.1
17.1
16.2
15.3
14.6
13.8
16.1
16.1
16.1
16.1
15.3
14.6
13.8
12.6
14.8
11.3
18.5
17.4
14.5
13.4
RF_ANT2 + RF_ANT1 Pin 2.4GHz MIMO
dBm
dBm
RF_ANT2 + RF_ANT1 Pins
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Operation frequency range
2412
2484
MHz
-10.0
50.0
dB
Ω
Return loss
Reference input impedance
(1) Regulatory constraints limit the module output power to the following:
-
-
-
-
-
-
-
-
Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm.
Channels 1, 11 @ OFDM legacy and HT 20-MHz rates: 12 dBm
Channels 3, 9 @ HT 40-MHz rates: 10 dBm
Channel 7 @ HT 40-MHz lower rates: 10 dBm
Channel 5 @ HT 40-MHz upper rates: 10 dBm
All 11B rates are limited to 16 dBm to comply with the ETSI PSD 10 dBm/MHz limit.
All OFDM rates are limited to 16.5 dBm to comply with the ETSI EIRP 20 dBm limit.
For clarification regarding power limitation, see the WL18xx .INI File Application Report.
(2) To ensure compliance with the EVM conditions specified in the PHY chapter of IEEE Std 802.11™ – 2012:
- MCS7 20 MHz channel 12 output power is 2 dB lower than the typical value.
- MCS7 20 MHz channel 8 output power is 1 dB lower than the typical value.
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WLAN 5-GHz Receiver
Parameter
Condition
MIN
TYP MAX
Units
RF_ANT1 or RF_ANT2
Operation frequency range
4910
5825
MHz
Sensitivity
- 20MHz Bandwidth
- At < 10% PER limit
6 Mbps OFDM
9 Mbps OFDM
12 Mbps OFDM
18 Mbps OFDM
24 Mbps OFDM
36 Mbps OFDM
48 Mbps OFDM
54 Mbps OFDM
MCS0 MM 4K
MCS1 MM 4K
MCS2 MM 4K
MCS3 MM 4K
MCS4 MM 4K
MCS5 MM 4K
MCS6 MM 4K
MCS7 MM 4K
MCS0 MM 4K 40MHz
MCS7 MM 4K 40MHz
-92.5
-90.5
-90.0
-87.5
-84.5
-81.0
-76.5
-74.6
-91.4
-88.0
-86.0
-83.0
-79.8
-75.5
-74.0
-72.4
-88.5
-69.3
dBm
Max Input Level
OFDM
-30.0
-15.0
Adjacent channel rejection sensitivity +3 dB
54Mbps OFDM
2.0
dBm
dB
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Part number:WG7837-V1
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WLAN 5-GHz Transmitter
Parameter
Condition (1)
MIN
TYP
MAX
Units
RF_ANT1 or RF_ANT2
Operation frequency range
4910
5825
MHz
RMS output power complies with
6 Mbps OFDM
IEEE mask and EVM
requirements. (2)
9 Mbps OFDM
12 Mbps OFDM
18 Mbps OFDM
24 Mbps OFDM
36 Mbps OFDM
48 Mbps OFDM
54 Mbps OFDM
MCS0 MM
MCS1 MM 4K
MCS2 MM 4K
MCS3 MM 4K
MCS4 MM 4K
MCS5 MM 4K
MCS6 MM 4K
MCS7 MM 4K
MCS0 MM 40MHz
MCS7 MM 40MHz
18.0
18.0
18.0
18.0
17.4
16.5
15.8
14.5
18.0
18.0
18.0
18.0
16.5
15.8
14.5
13.0
16.5
12.0
-10.0
50.0
dBm
dB
Ω
Return loss
Reference input impedance
(1) Maximum TP degradation of up to 30% is expected, starting from 80°C ambient temperature on 5-GHz TX operation.
(2) For further clarification regarding power limitation, see the WL18xx INI File Guide.
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Bluetooth RF Performance
Bluetooth BR, EDR Receiver Characteristics—In-Band Signals
Parameter
Condition
TYP MAX Units
MIN
2402
2480
BT BR intermodulation
Level of interferers For n = 3, 4, and 5
-36.0
-30.0
BT BR, EDR C/I performance
BR, Co-channel
BT BR, EDR operation frequency range
BT BR, EDR channel spacing
BT BR, EDR input impedance
BT BR, EDR sensitivity (1)
Dirty TX on
BT EDR BER floor at sensitivity + 10 dB,
dirty TX off (for 1,600,000 bits)
EDR2
EDR3
BT BR, EDR maximum useable input
BR, BER = 0.1%
EDR2, BER = 0.01%
EDR3, BER = 0.01%
BR, BER = 0.1%
EDR2, BER = 0.1%
EDR3, BER = 0.1%
Numbers show wanted-signal to
interfering-signal ratio.
Smaller numbers indicate better C/I
performances
(Image frequency = -1MHz)
EDR, Co-channel
BR, adjacent ±1 MHz
EDR, adjacent ±1 MHz,
(image)
BR, adjacent +2 MHz
EDR, adjacent +2 MHz
BR, adjacent -2 MHz
EDR, adjacent -2 MHz
BR, adjacent ≥Ι±3Ι MHz
EDR, adjacent ≥Ι±3Ι MHz
EDR2
EDR3
EDR2
EDR3
EDR2
EDR3
EDR2
EDR3
EDR2
EDR3
power
MHz
MHz
Ω
dBm
dBm
dBm
dB
1
50
-92.2
-91.7
-84.7
10
12
20
-3.0
-3.0
2.0
-33.0
-33.0
-28.0
-20.0
-20.0
-13.0
-42.0
-42.0
-36.0
1e-6
1e-6
-5.0
-15.0
-15.0
BT BR, EDR RF return loss
-10.0
dB
(1) Sensitivity degradation up to -3dB may occur due to fast clock harmonics with dirty TX on.
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(1) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.
Part number:WG7837-V1
Model name :WG7837-V0
MIN
TYP MAX
11.7
VBAT ≥ 3V
VBAT < 3V
Bluetooth Transmitter, BR
Parameter
BR RF output power (1)
BR Gain Control Range
BR Power Control Step
BR Adjacent Channel Power |M-N| = 2
BR Adjacent Channel Power |M-N| > 2
Bluetooth Transmitter, EDR
VBAT ≥ 3V
VBAT < 3V
EDR output power (1)
EDR Gain Control Range
EDR Power Control Step
EDR Adjacent Channel Power |M-N| = 1
EDR Adjacent Channel Power |M-N| = 2
EDR Adjacent Channel Power |M-N| > 2
7.2
30.0
5.0
-43.0
-48.0
7.2
5.2
30
5
-36
-30
-42
Units
dBm
dB
dBm
dBm
dB
dB
dBc
dBm
Parameter
MIN
TYP MAX
Units
(1) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.
Bluetooth Modulation, BR
Parameter
Condition(1)
BR -20dB Bandwidth
∆f1avg
Mod data = 4-ones, 4-
zeros: 111100001111...
BR modulation
∆f2max ≥ limit for
characteristics
at least 99.9% of all
Mod data = 1010101...
120
130
Δf2max
∆f2avg / ∆f1avg
BR carrier frequency
One slot packet
drift
Three and five slot packet
Performances
MIN
TYP MAX
995
925
145
160
170
25
35
85
-25
-35
88
Units
kHz
kHz
kHz
%
kHz
kHz
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kHz/ 50μs
15
-75
75
kHz
BR drift rate
lfk+5 – fkl , k = 0 …. max
BR initial carrier
frequency tolerance (2)
f0 – fTX
(1) Performance figures at maximum power
(2) This number is added on top of the reference clock frequency accuracy
Parameter (1)
Condition MIN
TYP. MAX
Units
Bluetooth Modulation, EDR
EDR Carrier frequency stability
EDR initial carrier frequency tolerance (2)
EDR RMS DEVM
EDR 99% DEVM
EDR Peak DEVM
EDR2
EDR3
EDR2
EDR3
EDR2
EDR3
-5
-75
4
4
9
9
5
75
15
10
30
20
25
18
kHz
kHz
%
%
%
%
%
%
(1) Performance figures at maximum power
(2) This number is added on top of the reference clock frequency accuracy
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Part number:WG7837-V1
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Bluetooth LE RF Performance
Bluetooth LE Receiver Characteristics—In-Band Signals
Parameter
Condition (1)
MIN
TYP MAX
Units
BT LE Operation frequency range
2402
2480
BT LE Channel spacing
BT LE Input impedance
BT LE Sensitivity (2), Dirty Tx on
BT LE Maximum useable input power
BT LE Intermodulation characteristics Level of interferers. For n = 3, 4, 5
BT LE C/I performance Note:
LE, co-channel
Numbers show wanted signal-to-
LE, adjacent ±1MHz
interfering signal ratio. Smaller
numbers indicate better C/I
performance. Image = -1MHz
LE, adjacent +2MHz
LE, adjacent –2MHz
LE, adjacent ≥ |±3|MHz
(1) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to Bluetooth LE test
specification.
(2) Sensitivity degradation up to -3dB may occur due to fast clock harmonics.
Bluetooth LE Transmitter
Parameter
MIN
TYP
MAX
Unit
BT LE RF output power (1)
Vbat ≥ 3V (2)
Vbat < 3V
BT LE Adjacent Channel Power |M-N| = 2
BT LE Adjacent Channel Power |M-N| > 2
7.0
7.0
-51.0
-54.0
(1) Bluetooth low energy power is restricted to comply with the ETSI 10-dBm EIRP limit requirement.
(2) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.
MHz
MHz
Ω
dBm
dBm
dBm
dB
-5
-36
2
50
-92.2
-30
12
0
-38
-15
-40
dBm
dBm
dBm
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Part number:WG7837-V1
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Bluetooth LE Modulation
Parameter
Condition (1)
BT LE modulation
characteristics
BT LE carrier frequency
drift
∆f1avg
∆f2max ≥ limit for at least
99.9% of all Δf2max
∆f2avg / ∆f1avg
lf0 – fnl , n = 2,3 …. K
BT LE drift rate
lf1 – f0l and lfn – fn-5l ,n = 6,7…. K
LE initial carrier frequency
tolerance (2)
fn – fTX
(1) Performance figures at maximum power.
(2) Numbers include XTAL frequency drift over temperature and aging.
Mod data = 4-ones, 4-
zeros: 111100001111...
240
250
260
Mod data = 1010101...
195
215
Performances
MIN
TYP MAX
Units
kHz
%
kHz
kHz/ 50μs
kHz
25
15
75
85
-25
-75
90
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Part number:WG7837-V1
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POWER CONSUMPTION
Shutdown and Sleep Currents
Parameter
Shutdown mode
All functions shut down.
WLAN sleep mode
BT sleep mode
WLAN Power Currents
Power Supply
TYP
Unit
uA
VBAT
VIO
VBAT
VBAT
Parameter
Conditions
TYP (AVG) at 25°C Units
Low-power mode (LPM)
2.4GHz RX SISO20 single chain
Receiver
2.4GHz RX 20M MRC 1DSSS
mA
10
2
160
110
49
58
74
63
60
61
69
74
81
85
81
68
77
85
285
283
247
238
510
243
366
329
324
332
2.4GHz RX search SISO20
2.4GHz RX search MIMO20
2.4GHz RX search SISO40
2.4GHz RX 20M SISO 11CCK
2.4GHz RX 20M SISO 6OFDM
2.4GHz RX 20M SISO MCS7
2.4GHz RX 20M MRC 6OFDM
2.4GHz RX 20M MRC 54OFDM
2.4GHz RX 40M MCS7
5GHz RX 20M 6OFDM
5GHz RX 20M MCS7
5GHz RX 40M MCS7
2.4GHz TX 20M SISO 6OFDM
2.4GHz TX 20M SISO 11CCK
2.4GHz TX 20M SISO 54OFDM
2.4GHz TX 20M SISO MCS7
2.4GHz TX 20 M MIMO MCS15
2.4GHz TX 40M SISO MCS7
5GHz TX 20M SISO 6OFDM
5GHz TX 20M SISO 54OFDM
5GHz TX 20M SISO MCS7
5GHz TX 40M SISO MCS7
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Transmitter (1)
mA
(1) Numbers reflect the typical current consumption at maximum output power per rate.
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Part number:WG7837-V1
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Current measurements are done at the following output power:
Bluetooth Currents
-
-
BR at 11.7dBm
EDR at 7.2dBm.
Use Case (1) (2)
BR Voice HV3 + sniff
EDR voice 2-EV3 no retransmission + sniff
Sniff 1 attempt 1.28s
EDR A2DP EDR2 (master). SBC high quality – 345Kbs
EDR A2DP EDR2 (master). MP3 high quality – 192Kbs
Full throughput ACL RX: RX-2DH5 (3) 4)
Full throughput BR ACL TX: TX-DH5 (4)
Full throughput EDR ACL TX: TX-2DH5 (4)
Page scan or inquiry scan (scan interval is 1.28 s or 11.25 ms, respectively)
Page scan and inquiry scan (scan interval is 1.28 s and 2.56 s, respectively)
(1) The role of Bluetooth in all scenarios except A2DP is slave.
(2) CL1P5 PA is connected to VBAT, 3.7V.
(3) ACL RX has same current in all modulations.
(4) Full throughput assumes data transfer in one direction.
Bluetooth LE Currents
TYP
11.6
5.9
178.0
10.4
7.5
18.0
50.0
33.0
253.0
332.0
Units
mA
uA
mA
uA
All current measurements are done at output power of 7.0dBm.
Use Case (1)
TYP
Units
Advertising, non-connectable (2)
Advertising, discoverable (2)
Scanning (3)
Connected, master role, 1.28sec connect interval 4)
Connected, slave role, 1.28sec connect interval (4)
131
143
266
124
132
uA
(1) CL1p% PA is connected to VBAT, 3.7 V.
(2) Advertising in all 3 channels, 1.28sec advertising interval, 15 Bytes advertise data.
(3) Listening to a single frequency per window, 1.28sec scan interval, 11.25msec scan window.
(4) Zero Slave connection latency Empty Tx/Rx LL packets.
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Part number:WG7837-V1
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6. HOST INTERFACE TIMING CHARACTERISTICS
The following table summarizes the Host Controller interface options. All interfaces operate
independently.
WLAN
Shared HCI for all functional
blocks except WLAN
BT Voice/Audio
WLAN HS SDIO
Over UART
BT PCM
The device incorporates UART module dedicated to the BT shared-transport Host Controller
Interface (HCI) transport layer. The HCI interface is used to transport commands, events and ACL
between the Bluetooth device and its host using HCI data packets. This acts as a shared transport
for all functional blocks except WLAN.
WLAN SDIO Transport Layer
The SDIO is the host interface for WLAN. The interface between the host and the module uses
an SDIO interface and supports a maximum clock rate of 50MHz.
The Device SDIO also supports the following features of the SDIO V3 specification:
4 bit data bus
Default and High-Speed (HS, 50MHz) timing
Synchronous and Asynchronous In-Band-Interrupt
Sleep/wake commands
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SDIO Timing Specifications
SDIO Switching Characteristics – Default Rate
Figure 6-1. SDIO default input timing
Figure 6-2. SDIO default output timing
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Table 6-1. SDIO Default Timing Characteristics (1)
PARAMETER(2)
fclock
Clock frequency, CLK
Low/high duty cycle
Rise time, CLK
Fall time, CLK
DC
tTLH
tTHL
tISU
tIH
tODLY
CI
Setup time, input valid before CLK↑
Hold (cid:415)me, input valid a(cid:332)er CLK↑
Delay (cid:415)me, CLK↓ to output valid
Capacitive load on outputs
MIN
MAX
UNIT
MHz
0.0
40.0
3.0
2.0
7.0
26.0
60.0
10.0
10.0
10.0
15.0
%
ns
ns
ns
ns
ns
pF
(1) To change the data out clock edge from the falling edge (default) to the rising edge, set the configuration bit.
(2) Parameter values reflect maximum clock frequency.
SDIO Switching Characteristics – High Rate
Figure 6-3. SDIO HS input timing
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Figure 6-4. SDIO HS output timing
Table 6-2. SDIO HS Timing Characteristics
PARAMETER
fclock
Clock frequency, CLK
Low/high duty cycle
Rise time, CLK
Fall time, CLK
DC
tTLH
tTHL
tISU
tIH
tODLY
CI
Setup (cid:415)me, input valid before CLK↑
Hold (cid:415)me, input valid a(cid:332)er CLK↑
Delay (cid:415)me, CLK↓ to output valid
Capacitive load on outputs
MIN
MAX
UNIT
MHz
0.0
40.0
3.0
2.0
7.0
52.0
60.0
3.0
3.0
10.0
10.0
%
ns
ns
ns
ns
ns
pF
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Part number:WG7837-V1
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HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN)
The HCI UART supports most baud rates (including all PC rates) for all fast clock frequencies -
up to a maximum of 4 Mbps. After power up the baud rate is set for 115.2 kbps, regardless of fast
clock frequency. The baud rate can then be changed by using a VS command. The Device
responds with a Command Complete Event (still at 115.2 kbps), after which the baud rate change
occurs.
HCI hardware includes the following features:
Receiver detection of break, idle, framing, FIFO overflow and parity error conditions.
Receiver Transmitter underflow detection.
CTS, RTS hardware flow control.
4 wires (H4)
The below table lists the UART default settings
Table 6-3. UART Default Setting
Parameter
Bit Rate
Data Length
Stop Bit
Parity
UART 4-Wires Interface – H4
Value
115.2 kbps
8 bits
1
None
The interface includes four signals: TXD, RXD, CTS and RTS. Flow control between the host and
the Device is byte-wise by hardware. ( See Figure 6-5 )
Figure 6-5. HCI UART Connection
When the UART RX buffer of the device passes the flow-control threshold, the buffer sets
the UART_RTS signal high to stop transmission from the host. When the UART_CTS signal is set
high, the device stops transmitting on the interface. If HCI_CTS is set high in the middle of
transmitting a byte, the device finishes transmitting the byte and stops the transmission.
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UART Timing Specifications
Figure 6-6. UART Timing Diagram
Table 6-4. UART Timing Characteristics
Condition
Symbol MIN
TYP
MAX Unit
Characteristic
Baud rate
CTS low to TX_DATA on
CTS High Pulse Width
RTS low to RX_DATA on
Baud rate accuracy per byte
Receive-transmit
Baud rate accuracy per bit
Receive-transmit
t3
t4
t6
t1
t2
37.5
-2.5
-12.5
0.0
1.0
0.0
2.0
2.0
CTS low to TX_DATA off
Hardware flow control
1.0
Byte
RTS high to RX_DATA off
Interrupt set to 1/4 FIFO
16.0
Bytes
%
%
us
bit
us
4364
Kbps
+1.5
+12.5
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Figure 6-7. UART Data Frame
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Part number:WG7837-V1
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Bluetooth Codec-PCM(Audio) Timing Specifications
Figure 6-8 shows the Bluetooth codec-PCM (audio) timing diagram.
Table 6-5 lists the Bluetooth codec-PCM master timing characteristics.
Table 6-6 lists the Bluetooth codec-PCM slave timing characteristics.
Figure 6-8. Bluetooth Codec-PCM (Audio) Master Timing Diagram
Table 5-5. Bluetooth Codec-PCM Master Timing Characteristics
Symbol
MIN
MAX
Unit
166.67 (6.144MHz)
15625 (64 kHz)
Parameter
Cycle time
High or low pulse width
AUD_IN setup time
AUD_IN hold time
AUD_OUT propagation time
AUD_FSYNC_OUT propagation time
Capacitive loading on outputs
Parameter
Cycle time
High or low pulse width
AUD_IN setup time
AUD_IN hold time
AUD_FSYNC setup time
AUD_OUT propagation time
AUD_FSYNC_OUT propagation time
Capacitive loading on outputs
Tclk
Tw
tis
tih
top
top
Cl
Tclk
Tw
tis
tih
tis
top
top
Cl
35% of Tclk min
10.6
81 (12.288MHz)
35% of Tclk min
0
0
0
5
0
5
0
0
Table 5-6. Bluetooth Codec-PCM Slave Timing Characteristics
Symbol
MIN
MAX
Unit
15
15
40
19
40
ns
pF
ns
pF
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Part number:WG7837-V1
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7. CLOCK AND POWER MANAGEMENT
The slow clock is a free-running, 32.768 kHz clock supplied from an external clock source. The
clock is connected to the SLOW_CLK pin and is a digital square-wave signal in the range of 0 to 1.8V
nominal
Reset-Power-Up System
After VBAT and VIO are fed to the device and while BT_EN and WL_EN are deasserted (low), the
device is in SHUTDOWN state, during which functional blocks, internal DC-DCs, and LDOs are
disabled. The power supplied to the functional blocks is cut off. When one of the signals (BT_EN or
WL_EN) are asserted (high), a power-on reset (POR) is performed. Stable slow clock, VIO, and VBAT
are prerequisites for a successful POR.
WLAN Power-Up Sequence
Figure 7-1 shows the WLAN power-up sequence.
Figure 7-1. WLAN Power-Up Sequence
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Part number:WG7837-V1
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Bluetooth/BLE Power-Up Sequence
Figure 7-2 shows the Bluetooth/BLE power-up sequence.
Figure 7-2 Bluetooth/Bluetooth LE Power-Up sequence
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Part number:WG7837-V1
Model name :WG7837-V0
8. REFERENCE SCHEMATICS
BT_EN
WLAN_EN
WLAN/BT Enable Control.
Connect to Host GPIO.
For Debug only
VBAT_IN
TP1
TP2
VIO_IN
C1
1uF
0402
EXT_32K
C2
10uF
0603
C3
0.1uF
0402
8
4
7
4
6
4
5
4
4
4
3
4
2
4
1
4
0
4
9
3
8
3
7
3
6
3
5
3
4
3
3
3
D
N
G
T
A
B
V
T
A
B
V
D
N
G
D
N
G
D
N
G
O
V
I
D
N
G
D
N
G
D
N
G
D
N
G
K
2
3
_
T
X
E
G
B
D
_
T
R
A
U
_
T
B
G
B
D
_
T
R
A
U
_
L
W
C
O
S
_
N
E
_
T
B
C
O
S
_
N
E
_
N
A
L
W
U1
WG7837-V1A
E-13.4X13.3-N100_0.75-TOP
WL_RS232_TX_1V8
WL_RS232_RX_1V8
TP3
TP4
TP5
For Debug only
TP6
TP7
For Debug only
ANT1 - WL_2.4_IO2/BT/WL_5GHz
C13
1pF
0402
ANT1
W3006
ANT-10.0X3.2MM_B
1
FEED
2
NC
R2
NU_0R
0402
J5
U.FL-R-SMT(10)
U.FL
L2
NU
0402
L1
1.3nH
0402
ANT2 - WL_2.4_IO1/WL_5GHz
C14
2.4pF
0402
ANT2
W3006
ANT-10.0X3.2MM_A
1
FEED
2
NC
R4
NU_0R
0402
J6
U.FL-R-SMT(10)
U.FL
L4
2.2nH
0402
L3
1.8nH
0402
R1
0R
0402
R3
0R
0402
2
1
3
2
1
3
For Debug only
RF_ANT1
GND
GND
GND
GND
GPIO_1
GPIO_2
GPIO_4
GND
GND
RESERVED2
RESERVED1
RF_ANT2
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
G11
G12
G13
G14
G15
G16
G17
G18
Connect to Host HCI Interface.
BT_HCI_RTS_1V8
BT_HCI_CTS_1V8
BT_HCI_TX_1V8
BT_HCI_RX_1V8
BT_AUD_IN
BT_AUD_OUT
BT_AUD_FSY NC
BT_AUD_CLK
Connect to Host BT PCM Bus.
TP8
R14
0R
0402
External TCXO option.
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
G19
G20
G21
G22
G23
G24
G25
G26
G27
G28
G29
G30
G31
G32
G33
G34
G35
G36
GND
BT_HCI_RTS
BT_HCI_CTS
BT_HCI_TX
BT_HCI_RX
BT_AUD_IN
BT_AUD_OUT
BT_AUD_FSY NC
BT_AUD_CLK
RESERVED3
RESERVED
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Connect to Host SDIO Interface.
D
M
C
_
O
D
S
_
L
W
I
I
K
L
C
_
O
D
S
_
L
W
D
N
G
D
N
G
I
0
D
_
O
D
S
_
L
W
I
1
D
_
O
D
S
_
L
W
I
2
D
_
O
D
S
_
L
W
I
3
D
_
O
D
S
_
L
W
I
Q
R
_
N
A
L
W
D
N
G
D
N
G
1
1
O
P
G
I
9
O
P
G
I
0
1
O
P
G
I
2
1
O
P
G
I
D
N
G
1
2
3
4
5
6
7
8
9
0
1
1
1
2
1
3
1
4
1
5
1
6
1
TP10TP11TP12TP13
VIO_IN
For Debug only
R13
NU
RES1005
WL_IRQ_1V8
WL_SDIO_D3_1V8
WL_SDIO_D2_1V8
WL_SDIO_D1_1V8
WL_SDIO_D0_1V8
WL_SDIO_CLK_1V8
WL_SDIO_CMD_1V8
Figure 8-2 Module Reference Schematic
Table 8-1. Bill of Materials
DESCRIPTION
PART NO.
PACKAGE
REFERENCE
QTY
MFR
XOSC 3225/32.768 kHz/1.8 V/±50 ppm
7XZ3200005
3.2 × 2.5 × 1.0 mm
OSC1
ANT/Chip/2.4 GHz and 5 GHz(1)
W3006
10.0 × 3.2 × 1.5 mm
ANT1, ANT2
Mini-RF header receptacle
U.FL-R-SMT-1 (10)
3.0 × 2.6 × 1.25 mm
J5, J6
Inductor 0402/1.3 nH/±0.1 nH/SMD
LQP15MN1N3B02
Inductor 0402/1.8 nH/±0.1 nH/SMD
LQP15MN1N8B02
Inductor 0402/2.2 nH/±0.1 nH/SMD
LQP15MN2N2B02
Capacitor 0402/1 pF/50 V/C0G/±0.1 pF
GJM1555C1H1R0BB01
Capacitor 0402/2.4 pF/50 V/C0G/±0.1 pF
GJM1555C1H2R4BB01
Capacitor 0402/0.1 µF/10 V/X7R/±10%
0402B104K100CT
Capacitor 0402/1 µF/6.3 V/X5R/±10%/HF
GRM155R60J105KE19D
Capacitor 0603/10 µF/6.3 V/X5R/±20%
C1608X5R0J106M
0402
0402
0402
0402
0402
0402
0402
0603
0402
Resistor 0402/0R/±5%
WR04X000 PTL
R1, R3
1
2
2
1
1
1
1
1
1
1
1
2
TXC
Pulse
Hirose
Murata
Murata
Murata
Murata
Murata
Walsin
Murata
TDK
Walsin
L1
L3
L4
C13
C14
C3
C1
C2
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Part number:WG7837-V1
Model name :WG7837-V0
9. DESIGN RECOMMENDATIONS
Module Layout Recommendations
Follow these module layout recommendations:
Supply and Interface
The power trace for VBAT must be at least 40-mil wide.
The 1.8-V trace must be at least 18-mil wide.
Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance.
If possible, shield VBAT traces with ground above, below, and beside the traces.
SDIO signals traces (CLK, CMD, D0, D1, D2, and D3) must be routed in parallel to each other
and as short as possible. (Less than 12cm) Besides, every trace length must be the same
as the others. In addition, every trace length must be the same as the others. There should
be enough space between traces – greater than 1.5 times the trace width or ground – to
ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these traces
away from the other digital or analog signal traces. TI recommends adding ground shielding
around these buses.
SDIO and digital clock signals are a source of noise. Keep the traces of these signals as short
as possible. If possible, maintain a clearance around them
RF Trace & Antenna
The RF trace antenna feed must be as short as possible beyond the ground reference. At
this point, the trace starts to radiate.
The RF trace bends must be gradual with an approximate maximum bend of 45 degrees
with trace mitered. RF traces must not have sharp corners.
RF traces must have via stitching on the ground plane beside the RF trace on both sides.
RF traces must have constant impedance (microstrip transmission line).
For best results, the RF trace ground layer must be the ground layer immediately below
the RF trace. The ground layer must be solid.
There must be no traces or ground under the antenna section.
RF traces must be as short as possible. The antenna, RF traces, and modules must be on
the edge of the PCB product. The proximity of the antenna to the enclosure and the
enclosure material must also be considered.
Thermal
mounted.
The proximity of ground vias must be close to the pad. (See Figure 9-1)
Signal traces must not be run underneath the module on the layer where the module is
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Part number:WG7837-V1
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Have a complete ground pour in layer 2 for thermal dissipation. (See Figure 9-2)
Have a solid ground plane and ground vias under the module for stable system and
thermal dissipation. (See Figure 9-2)
Increase the ground pour in the first layer and have all of the traces from the first layer on
Signal traces can be run on a third layer under the solid ground layer, which is below the
the inner layers, if possible.
module mounting layer.
The module uses μvias for layers 1 through 6 with full copper filling, providing heat flow all
the way to the module ground pads. We recommends using one big ground pad under the
module with vias all the way to connect the pad to all ground layers (see Figure 9-3).
Figure 9-1 Module Layout : Layer-1
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Part number:WG7837-V1
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Figure 9-2 Module Layout : Layer-2 (Solid GND)
Figure 9-3 Block of Ground Pads on Bottom Side of Package
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Part number:WG7837-V1
Model name :WG7837-V0
Layout Pattern and stencil Recommendations
Figure 9-4. Recommended PCB Pattern
Figure 9-5. Recommended Stencil Outline
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Part number:WG7837-V1
Model name :WG7837-V0
10. PACKAGE INFORMATION
Module Mechanical Outline
MARKING
MIN (mm)
NOM (mm)
MAX (mm)
MARKING
MIN (mm)
NOM (mm)
MAX (mm)
Figure 10-1. Module mechanical outline
L (body size)
13.20
W (body size)
13.30
T (thickness)
13.30
13.40
0.40
0.70
0.75
0.30
0.75
1.30
0.30
1.90
0.30
0.60
0.65
0.20
0.65
1.20
0.20
a1
a2
a3
b1
b2
b3
c1
13.40
13.50
2.00
0.50
0.80
0.85
0.40
0.85
1.40
0.40
c2
c3
d1
d2
e1
e2
e3
e4
e5
e6
0.65
1.15
0.90
0.90
1.30
1.30
1.15
1.20
1.00
1.00
0.75
1.25
1.00
1.00
1.40
1.40
1.25
1.30
1.10
1.10
Table 10-1. Dimensions for Module Mechanical Outline
0.85
1.35
1.10
1.10
1.50
1.50
1.35
1.40
1.20
1.20
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Part number:WG7837-V1
Model name :WG7837-V0
Module Marking
Module P/N : WG7837-V1
Model : WG7837V0
FCC ID : WS2-WG78DBV0, single modular FCC grant ID
LTC : YYWWSSF
YY = year (for example, 21 = 2021)
WW = Week
SS = Serial number matching manufacturer lot number
= Reserve for internal use
F
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Part number:WG7837-V1
Model name :WG7837-V0
Tape / Reel / Shipping Box Specification
Figure 10-2. Tape Specification
Table 10-2. Dimensions for Tape Specification
Figure 10-3. Reel Specification
Table 10-3. Dimensions for Reel Specification
The reel is packed in a moisture barrier bag fastened by heat-sealing. Each moisture-barrier bag is
packed into a reel box.
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Part number:WG7837-V1
Model name :WG7837-V0
Figure 10-4. Reel Box
Figure 10-5. Shipping Box
____________________________________________________________________________________
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Part number:WG7837-V1
Model name :WG7837-V0
11. SMT AND BAKING RECOMMENDATION
Baking Recommendation
Baking condition：
Follow MSL Level 4 to do baking process.
After bag is opened, devices that will be subjected to reflow solder or other high temperature
process must be
a) Mounted within 72 hours of factory conditions <30°C/60% RH, or
b) Stored at <10% RH.
Devices require bake, before mounting, if Humidity Indicator Card reads >10%
If baking is required, Devices may be baked for 8 hrs at 125 °C.
SMT Recommendation
Recommended Reflow profile：
Item
Pre-heat
Soldering
Peak-Temp.
Temperature (°C)
Time (sec)
D1 to approximately D2: 140 to 200
T1: 80 to approximately 120
D2: 220
D3: 250 maximum
T2: 60 ± 10
T3: 10
Stencil thickness： 0.1~ 0.15 mm (Recommended)
Soldering paste (without Pb)： Recommended SENJU N705-GRN3360-K2-V can get better
soldering effects.
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Part number:WG7837-V1
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12. REGULATORY INFORMATION
United State
FCC WARING STATEMENT
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur
in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
-Consult the dealer or an experienced radio/TV technician for help.
You are cautioned that changes or modifications not expressly approved by the party responsible for
compliance could void your authority to operate the equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference and (2) this device must accept any interference
received, including interference that may cause undesired operation.
FCC RF Radiation Exposure Statement:
1. This Transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
2. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with a minimum distance of 20
centimeters between the radiator and your body.
According to FCC 15.407(e), the device is intended to operate in the frequency band of 5.15GHz to
5.25GHz under all conditions of normal operation. Normal operation of this device is restricted to
indoor used only to reduce any potential for harmful interference to co-channel MSS operations
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Part number:WG7837-V1
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Notice to OEM integrator
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user manual of the end product. The user manual which is provided by
OEM integrators for end users must include the following information in a prominent location.
1. In the users manual of the end of product, the end user has to be informed to keep at least 20cm
separation with the antenna while this end product is installed and operated.
2. The antenna(s) used for this transmitter must not be collocated or operating in conjunction with any
other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter
3. Only those antennas with same type and lesser gain filed under this FCC ID number can be used with
product procedures.
this device.
Antenna Type
Brand
Antenna Gain
2400MHz-2500MHz
5150MHz-5850MHz
Ethertronics
4.5 dBi (Worst)
PCB
Dipole
PCB
Chip
PIFA
Chip
LSR
Laird
Pulse
LSR
TDK
-0.6 dBi
2 dBi
2 dBi
2 dBi
2.4 dBi
3.2 dBi (Worst)
2 dBi
4 dBi
4.2 dBi
3 dBi
3.96 dBi
4. The regulatory label on the final system must include the statement:
“Contains FCC ID: WS2-WG78DBV0“.
5. The final system integrator must ensure there is no instruction provided in the user manual or
customer documentation indicating how to install or remove the transmitter module except such device
has implemented two-ways authentication between module and the host system.
6. If the end product integrating this module is going to be operated in 5.15~5.25GHz frequency range,
the warning statement in the user manual of the end product should include the restriction of operating
this device in indoor could void the user’s authority to operate the equipment.
7. The final system integrator must ensure there is no instruction provided in the user manual or
customer documentation indicating how to install or remove the transmitter module except such device
has implemented two-ways authentication between module and the host system.
8. The final host manual shall include the following regulatory statement: This equipment has been
tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses, and can radiate radio frequency energy. If not installed and
used in accordance with the instructions, it may cause harmful interference to radio communications.
____________________________________________________________________________________
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Part number:WG7837-V1
Model name :WG7837-V0
However, there is no guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which can be determined
by tuning the equipment off and on, the user is encouraged to try and correct the interference by one or
more of the following measures:
-Reorient or relocate the receiving antenna
-Increase the distance between the equipment and the receiver.
-Connect the equipment to outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
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CONFIDENTIAL