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Non-Contact Integral Wafer User Manual 5451 Patrick Henry Dr. Santa Clara, CA 95054 408-986-5600 Fax 408-986-5601 info@sensarray.com www.sensarray.com Copyright 2006 by SensArray Corporation. All rights reserved. UM-INT- 2007.04 SensArray reserves the right to modify, change, or improve any or all specifications published in this document without notice. Important Notices Warranty Integral Wafer System Hardware SensArray Corporation warrants that the contact style or non-contact style Integral Wafer Systems (Products) sold will be free from defects in material and workmanship, and perform to SensArrays applicable published specifications for a period of 12 months after shipment for the Docking Station. The Integral Wafer is warranted for 6 months or a specified number of operating hours, whichever occurs first. Refer to the specification provided with your wafer for the exact warranty terms. The Products that comprise the System shall include the Docking Station. The liability of SensArray hereunder shall be limited to replacing or repairing, at its option, any defective Products that are returned F.O.B. to SensArrays plant in Santa Clara, CA. In no case are Products to be returned without the purchaser first obtaining SensArrays permission and Returned Materials Authorization [RMA] number. In no event shall SensArray be liable for any consequential or incidental damages. Products that have been subject to abuse, misuse, accident, alteration, neglect, or unauthorized repair or installation are not covered by this warranty. SensArray will make the final determination as to the existence and cause of any alleged defect. SensArray is not responsible for maintaining or supplying any consumable materials used in conjunction with this hardware. No warranty is made with respect to any customized equipment or Products supplied with Integral Wafer systems where produced to Purchasers specifications except as specifically stated in writing by SensArray in the contract for such Products. The purchaser will pay the shipping costs of returned materials to SensArray; SensArray will pay the cost of shipping repaired/replaced material to Purchaser. This Warranty is the only warranty made by SensArray with respect to the Product delivered hereunder and may be modified only by a written instrument that is signed by a duly authorized officer of SensArray and accepted by Purchaser. Except as provided above, SensArray makes no warrantees, expressed or implied, including any warranty of merchantability for a particular purpose. Integral Wafer Software SensArray Corporation warrants that (a) Integral Wafer software (Software) will perform substantially in accordance with the accompanying written materials for a period of 12 months after shipment, and (b) the medium on which the Software is recorded will be free from defects in materials and workmanship under normal use and service for a period of 12 months after shipment. Faults caused by unauthorized modification, misuse or abuse of products, or problems due to software not supplied by SensArray, are not covered by this Warranty. During the Warranty Period, the purchaser may return failed Software to SensArray for repair or replacement, at SensArrays option. SensArray does not warrant that the operation of the Software shall be uninterrupted or error free. The purchaser will first notify SensArray of the nature of the problem and obtain a Returned Materials Authorization [RMA] number. The purchaser will pay the costs of shipping returned Software to SensArray; SensArray will pay the cost of shipping repaired/replaced Software to the purchaser. No other warranty is expressed or implied. SensArray specifically disclaims the implied warranty of merchantability and fitness for a specific application. The Integral Wafer Software Documentation Materials (Documentation) are subject to revision and change without notice. SensArray agrees to make a best effort attempt to keep the purchaser advised of changes to the Documentation. Software License Agreement The Software is owned by SensArray Corporation and is protected by United States copyright laws and international treaty provisions. Therefore, you must treat the Software like any other copyrighted material. Under the Copyright Laws, the Integral Wafer Software, or accompanying written materials, may not be copied, photo-copied, reproduced, translated, in whole or in part, without the prior written permission of SensArray. You may make one copy of the Software solely for backup or archival purposes. You may make 10 copies of the written materials accompanying the SensArray Corporation-produced Software provided that such copies are solely for use by personnel using the Integral Wafer System. All rights not expressly granted to you in this Agreement are reserved to SensArray Corporation. Third-Party Software Licenses for any software which was provided but not produced by SensArray Corporation are granted solely and only by the original supplier or manufacturer and solely and only with the suppliers limitations and rights. Copying restrictions for such software are governed solely and only by the original supplier or manufacturers license or any other supplier-approved agreements, as applicable. Trademarks SensArray, Thermal MAP, Integral Wafer, and Process Probe are trademarks of SensArray Corporation. Windows and Excel are trademarks or trade names of Microsoft Corporation. Any other terms mentioned in this document that are known to be trademarks or service marks have been appropriately capitalized. Use of a term in this document should not be regarded as affecting the validity of any trademark or service mark. Some of the technology used in this product is acquired under license from the management and operating contractor of the Oak Ridge National Laboratory on behalf of the U.S. Department of Energy. Radio Frequency Interference Compliance Applies to the Storage Cases and RF Carrier Station NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. For the RF Carrier Station, only the USB cable supplied with the equipment is authorized for use with this device; any other cable is not authorized and may cause undesired interference, etc. Refer to Chapter 3 for product installation. RF Carrier Station USB Cable Product Modifications Applies to the Storage Cases and RF Carrier Station Changes or modifications to this equipment not expressly approved by KLA-Tencor may void the users authority to operate the equipment. English French This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Table of Contents i Chapter 2 Using This Manual ..................................................................................................................iii Overview.......................................................................................................................................... iii What You Need to Know................................................................................................................. iii Conventions Used in this Manual .....................................................................................................iv Chapter 1 Overview ..............................................................................................................1-1 The Integral Wafer System ............................................................................................................ 1-1 Acquiring Data............................................................................................................................... 1-1 Analyzing Data .............................................................................................................................. 1-2 System Setup .................................................................................................2-1 Before You Begin .......................................................................................................................... 2-1 Proper Wafer Handling Procedures........................................................................................... 2-1 Unpacking Your System ................................................................................................................ 2-2 Removing the Wafer from the Storage Case............................................................................. 2-2 Charging the Equipment Before Use ........................................................................................ 2-4 Setting Up the Software ................................................................................................................. 2-4 Preparing Equipment for the Cleanroom ....................................................................................... 2-5 Cleaning the Equipment............................................................................................................ 2-5 Cleaning the Integral Wafer. .................................................................................................... 2-5 Cleaning the Carrier Station...................................................................................................... 2-6 Chapter 3 Using the Charge and Communication Carrier Station .................................3-1 Using the Carrier Station................................................................................................................ 3-1 Removing the Wafer from the Carrier Station............................................................................... 3-6 Using the Wafer with the Carrier Station....................................................................................... 3-7 Chapter 4 Using the Integral Wafer System Controller Software ...................................4-1 Starting the Program ...................................................................................................................... 4-1 Wafer Time Limit Feature ............................................................................................................. 4-7 Defining a Survey .......................................................................................................................... 4-9 Transferring Wafer Data .............................................................................................................. 4-13 Appendix A Reference Information ................................................................................A-1 Sensor Bank Reference ................................................................................................................. A-1 Correlating Sensor Coordinates .................................................................................................... A-2 Non-contact Integral Wafer User Manual iii UUssiinngg TThhiiss MMaannuuaall Overview This manual consists of the following sections. Chapter 1, OverviewDiscusses features, components, and configurations of the Non-contact Integral Wafer System. Chapter 2, System SetupDiscusses unpacking the system components, preparing the equipment for the cleanroom, and connecting the system cables. Chapter 3, Using the Charge and Communication Carrier Station provides an easy means to prepare the wafer for data acquisition and to perform data retrieval. Chapter 4, Using the Integral Wafer Controller Software Discusses acquisition setup, acquisition features, and how to retrieve the measurement data using the Carrier Stations. Appendix A, Reference Information- Wafer sensor location information. What You Need to Know This user manual assumes that you are familiar with the version of the Windows operating system installed on your computer and can performas a minimumthe following tasks. Start (boot) the computer Log on to Windows Select from menus Select and open files Use a mouse or pointer, including how to point and click to select objects and operate controls such as buttons Use standard window controls such as scroll bars Non-contact Integral Wafer User Manual iv Using This Manual Conventions Used in this Manual Several standard conventions are used in the text of this manual to make the information presented a little clearer and easier to understand. Every attempt is made to be consistent in the application of these conventions. Note:
Bold italic Courier Typeface Highlights important information. Bold text indicates button names, icon names, and menu items. Italic text indicates the section and/or chapter name in a cross-reference. For example:
See the Using the Acquisition Setup Window section of Chapter 3, Acquiring Data, for more information. Italic text can also be used to emphasize a word or phrase. Courier typeface indicates file names, directories, and text that you enter. For example:
The file is located in the C:\Sensarray\Configs directory.
<Key> A word offset by angle brackets indicates a key on the computer keyboard. For example:
After you specify the parameters, press the <Enter> key. The twin arrow symbol indicates menu navigation. For example: Select AcquisitionAcquire on the Thermal MAP Analysis window to open the Acquisition Setup window. This tells you to click on Acquisition on the menu bar and then click on the Acquire option from the drop-down menu. Indicates important safety information. The icon is usually associated with a Warning or Caution in the document describing potential for product damage or personal injury. Other international standard icons specific to a particular hazard or action may be used in place of the exclamation mark. Non-contact Integral Wafer User Manual 1-1 Chapter 1 Overview The Integral Wafer User Manual is designed to document the setup and use of the Integral Wafer system in conjunction with the Integral Wafer Controller software. This manual will discuss only the non-contact version of the Integral Wafer. The results of the measurement run may be analyzed using the Thermal MAP Analysis Software included with the system. The Thermal MAP Analysis software program is documented in the Thermal MAP Analysis Software User Manual. A PDF version of this manual may be found in the C:\Sensarray\
Documents folder on your computers hard drive. This chapter discusses the features of the non-contact Integral Wafer system. The Integral Wafer System The Integral Wafer has a complete measurement system embedded in the wafer to record thermal surveys in semiconductor processing equipment without the need for wired connections. Embedding the components within the wafer allows it to be treated like a production wafer in most equipment, as long as it is within the operating temperature range of the wafer. The Integral Wafer system consists of an Integral Wafer, a carrier station for communicating with and recharging the wafer, a USB cable, a laptop computer, and a CD containing the software and drivers needed by the system. The Integral Wafer system is delivered with a SensArray-provided laptop computer pre-
loaded with all software. As an option, existing Thermal MAP laptop computer systems may be upgraded to run the Integral Wafer software as long as you are running Windows 2000 or higher, and have an available USB port. Integral Wafer systems are available in 200 mm and 300 mm versions, with different carrier station options. The systems can acquire data from 1 to 64 analog channels, depending on the model. The analog channels are divided into banks. Each bank is made up of up to 8 wafer sensors. Measurements taken by the sensors are converted from analog to digital signals within the onboard electronics. Acquiring Data Utilizing the Integral Wafer to acquire temperature data in your equipment is a simple process. Measurement parameters, such as sensors to be used, scan rate, time delay, etc., are set up using the Controller software. The wafer is then transferred to the measurement chamber from a FOUP or cassette via robotic arms, and the thermal measurement survey data is acquired. After the survey is complete, the wafer is returned to the Carrier station and the data can be retrieved from the onboard memory. The data may then be analyzed using Thermal MAP Analysis Software. Non-contact Integral Wafer User Manual 1-2 Analyzing Data Overview The data files acquired by the Integral Wafer may be analyzed using Thermal MAP Analysis Software to view XY graphs, contour maps, surface maps, animations, and data tables. For more information on the use of the Analysis portion of the Thermal MAP 3 software, please refer to the Thermal MAP 3 Analysis Software User Manual included on the CD. The data can be viewed and evaluated in table form if desired. A row in the table is called a sample or a single-timed sampling of all of the sensors on the wafer. You use the sample number to identify the table row of measurements collected at the sample time. The first column in the table is the sample number. The second column is the time point at which the sample was acquired. For example, as shown in Figure 1-1, sample 93 has a time of 93 seconds. The remaining columns in the table are the temperatures of the sensors within the wafer. Additional columns of data can be present if calculated values have been logged. Figure 1-1. Sample Data Table from an Integral Wafer During acquisition, Integral Wafer performs computations on acquired data, such as determining the minimum, maximum, mean, range (max-min), and standard deviation of all wafer sensor values for the sample, and logs the results in columns. These computed values are referred to as calculated values. After acquiring, linearizing, and storing the sensor data, you can display or print the data as a line plot graph, as shown in Figure 1-2. In addition, you can display data in a table or as a wafer map. Non-contact Integral Wafer User Manual Overview 1-3 Figure 1-2. Displaying Data on a Line Plot Graph You can also create a two-dimensional color contour map as shown in Figure 1-3 or a three-
dimensional surface map as shown in Figure 1-4 of a single sample point. Figure 1-3. 2-Dimensional Color Contour Map Figure 1-4. 3-Dimensional Surface Map Non-contact Integral Wafer User Manual 1-4 Overview With the Animation feature, an animation of the survey data can be created. The animation can be set for a particular range of the acquired samples, saved to a standard AVI file, and replayed at any time. The AVI file can be sent to other computers not running the Thermal MAP software and played using the Windows Media Player or other compatible video players. Data may also be exported to a spreadsheet program, edited in the spreadsheet, and loaded back to Thermal MAP for further analysis. Non-contact Integral Wafer User Manual 2-1 CChhaapptteerr 22 SSyysstteemm SSeettuupp Before you can begin working with the non-contact Integral Wafer system, you need to unpack the system components, prepare the equipment for transfer to the cleanroom, and charge the wafer batteries. Before You Begin Before using the Integral Wafer, there are several safety and handling precautions that should be noted. Please read the information provided in this manual and become familiar with the Integral Wafer before attempting your first thermal survey. Operation of Integral Wafer outside of its specified temperature range could result in unreliable readings and/or damaged wafers. Please review the recommended operating range for your particular model of Integral Wafer. Rotational speeds up to 5000 rpm have been tested and found to be safe. While it is possible that even higher rotational speed might be reached without damage to the wafer or spin plate, SensArray cannot provide any guarantees above 5000 rpm. Proper Wafer Handling Procedures. While the Integral Wafer is designed to survive in a semiconductor fabrication environment, reasonable care must be taken to prevent damage to the components on the wafer, or breaking the wafer. Always wear gloves whenever you handle the wafer. Hold the wafer by the edges only or support from the backside of the wafer with your hand or with a vacuum wand. In some situations, you may have to grasp the edge of the wafer with your gloved fingers to prevent dropping the wafer, as when you try to insert the wafer into your equipment or a carrier station. Never place the wafer on an uneven surface. A small downward pressure on the wafer applied at the right point could cause the wafer to break or cause cracks within the silicon. Non-contact Integral Wafer User Manual 2-2 System Setup Unpacking Your System Inventory all items and compare to the packing list included with the shipment. Retain all packaging materials for the system. This is required for the return of the Integral Wafer for repairs or recalibration. If any parts are missing or damaged, contact SensArray immediately. Be prepared to provide a list of the missing and/or damaged components, the Purchase Order Number, and the SensArray Sales Order Number. NOTE: Do not return components without contacting SensArray first and obtaining a Return Material Authorization. When returning components to SensArray, you must repack the equipment in the original packing material. Failure to properly pack the components may result in additional damage to the equipment. Removing the Wafer from the Storage Case The non contact Integral Wafer storage case is designed to keep the Integral Wafer batteries charged to the optimum level for an extended period of 1 to 2 years. This is done by periodically checking the status of the batteries and recharging the batteries when their voltage drops below a threshold. CAUTION: The storage case is not designed to be used to recharge wafers after acquiring data. The storage case may not be used as a carrier station. It is used only to store a wafer when the wafer is not in use. The wafer will be maintained in the storage case until it is needed. To use the wafer, place the horizontal wafer shipper case right side up on a clean work surface and open the latches on the case, as shown in Figure 2-1. Remove the lid. Locate the Charge and Communication (C/C) Carrier Station near the storage case. Figure 2-1. Opening the 300mm storage case Non-contact Integral Wafer User Manual System Setup 2-3 The maintenance module is placed on top of the wafer to allow for wireless maintenance. The module is enclosed and sealed in a clean room compatible plastic bag. Do not remove the maintenance module from its bag. It is there to ensure that the surface the wafer comes into contact with is clean. There is an LCD screen that indicates the wafer serial number and battery voltage. A blinking blue LED also indicates that the wafer is good. If the wafer is not viable, the screen will indicate no wafer present. The maintenance module must be reset to force it to search for a wafer by pressing the reset button. The module will then spend approximately 15 seconds looking for a wafer in its presence. If a wafer is present (centered and against the coil) and the module is unable to detect the wafer, try to place the wafer in the carrier station to check the wafer state. If wafer looks healthy in the carrier, the storage case may be problematic. Contact SensArray technical support for help. To remove the wafer from the storage case, remove the aluminum liner from the case to expose the maintenance module. Lift the maintenance module out of the case and place it in a clear area on the work surface. Carefully remove the wafer from the case and place it in the C/C carrier station. Figure 2-2. Lifting maintenance module Figure 2-3. Remove wafer from case Non-contact Integral Wafer User Manual 2-4 System Setup Place maintenance module back into case, flip RF shield back over module and replace lid. Save case for future use. Charging the Equipment Before Use Place the Integral Wafer into the carrier station shipped with the unit to maintain the charge on the internal batteries. Please see Using the Charge and Communication Carrier Station for more information on inserting and removing the wafer to and from the carrier stations. Plug the laptop into the AC power supply and fully charge the laptop battery. Setting Up the Software The Integral Wafer system normally includes a SensArray qualified laptop computer that has been prepared with all needed software to setup, run, and retrieve data from the Integral Wafer. However, if you are upgrading an existing Thermal MAP 3 system, please follow these directions. Before using the Integral Wafer, the USB driver for the carrier stations and wafer, the Integral Wafer Controller Software, and the wafer calibration files must be loaded onto the host computer. The software has been tested under Windows 2000 and Windows XP. 1. Place the Integral Wafer CD in the host computer CD drive. 2. Using Windows Explorer or My Computer, navigate to the
\INTEGRATEDWAFER.INSTALL folder and run INtegratedWaferController v2.x.x.exe. Follow the onscreen directions of the installer program. Do not change any default directories; this could cause problems when the program is run. 3. Connect the USB cable between the host computer and the carrier station. Wait until the Found New Hardware dialog begins. 4. Follow the Windows directions on screen to complete the new hardware setup. When requested to locate the driver for the new hardware, select the CD-ROM drives option and click Next. The wizard will automatically locate the correct driver. There are two drivers that will load, just follow the onscreen directions. If you are using Windows XP, ignore the this is not a Windows certified driver warning. If you are installing Thermal MAP on your computer for the first time, follow the directions in step 5. If you are installing the Integral Wafer on a system that already has the full Thermal MAP program, do not install the Analysis only version found on the Integral Wafer CD. This will cause your existing version to lose the Acquisition feature. Skip step 5 and use the provided upgrade Thermal MAP CD to install the full version. Insert the CD and follow the onscreen directions. Then continue with Step 6. Non-contact Integral Wafer User Manual System Setup 2-5 5. Using Windows Explorer or My Computer, navigate to the \THERMAL MAP.INSTALL folder and run the installer program. Follow the onscreen directions of the installer program. Do not change any default directories; this could cause problems when the program is run. 6. Remove the Integral Wafer CD from the CD drive. 7. Insert the Wafer Configuration CD and run the setup.exe program on the CD. This will install the calibration file for your wafer into the proper directory on the computer. When completed, remove the Wafer Configuration CD from the drive. NOTE: If you are upgrading the calibration files later, they will be installed in the same folder as the existing calibration/configuration files. Preparing Equipment for the Cleanroom Cleaning the Equipment When installing a computer and an Integral Wafer system in the cleanroom, follow industry standards, including wiping down the computer and the exterior of the carrier station with cleanroom wipes dampened with deionized (DI) water and/or isopropyl alcohol. Wipe down the Integral Wafer itself. Cleaning the Integral Wafer. Significant efforts are made to keep wafers clean during the manufacturing process. Due to the nature of some processes and demands by customers for cleaner wafers, the Integral wafer is now offered as a cleaned product. It has gone through a SC1 and SC2 cleaning process to remove metals and organics. The cleaned wafer is packaged in a clean room compatible zip lock bag to prevent contamination until it is ready to be used. Despite our best efforts, the Integral Wafer may pick up contaminants from repeated handling. The ideal method of cleaning surface contaminants from the wafer is to blow a gentle stream of CDA or inert nitrogen across the surface. However, some forms of surface contamination cannot be removed this easily. The wafer can be cleaned with IPA or DI water and a cleanroom cloth. Due to the design nature of the Integral Wafer, scratches in the coating on the backside of the wafer may exist. This has not been shown to cause degradation in the performance of the wafer. A gentle stream of DI water or IPA may be used to loosen surface contamination, then use CDA or inert nitrogen to blow the surface dry. Never place the wafer in an ultrasonic cleaning bath. The vibration set up by the ultrasonics may damage the electronics inside and render the wafer inoperable. Non-contact Integral Wafer User Manual 2-6 System Setup Cleaning the Carrier Station. The carrier station is easily cleaned by wiping the surfaces with a cleanroom cloth dampened with IPA. Nothing harsher is needed to remove contamination from the surface. Be sure to clean the interior of the carrier station. Debris on the surface may cause stress points on the Integral Wafer when the lid is closed. To avoid damage to the Integral Wafer, only clean the interior of the carrier when the wafer is not present. Recharging and Storing Integral Wafer The carrier station contains removable, rechargeable lithium-ion batteries. The carrier station batteries should maintain a charge on the wafer batteries for up to three years. The carrier station batteries can be charged via USB or with the provided power adapter. Very Important! Keep the wafer stored in a carrier station when not making thermal surveys. This will help ensure the maximum lifetime for the onboard wafer batteries. When storing the wafer in the carrier for extended periods of time, confirm that the LCD display reads Wafer Ready. This indicates that the carrier station has established proper contact with the wafer and ensures that the wafer battery charge is being maintained. Non-contact Integral Wafer User Manual 3-1 CChhaapptteerr 33 UUssiinngg tthhee CChhaarrggee aanndd CCoommmmuunniiccaattiioonn CCaarrrriieerr SSttaattiioonn The Carrier Station is available in both 200 and 300mm versions and provides a method of charging and communicating with the wafer through an RF signal rather than a set of contact pins. Using the Carrier Station The carrier station protects the Wafer and maintains the battery charge during storage. It also provides the communication link between the Wafer and the host computer. The carrier station provides an easy, non-contact means of preparing the wafer for data acquisition and to perform data retrieval. It is important to follow proper procedures in removing and inserting the wafer in the carrier station to avoid damaging the wafer. LCD Display Coil printed circuit board for RF communication and charging between wafer and carrier Wafer positioners SC1/SC2 cleaned Cleanable white white polypropylene polypropylene insert insert plate plate Figure 3-1. C/C Carrier Station Components Figure 3-2 shows the C/C carrier station with USB port plug in. There are four LEDs on the left side of the carrier base, as referenced in Table 3-1. The green LED comes on when the USB cable is connected and there is communication between the host computer and the carrier station. The yellow LED will flicker when transferring data to and from the wafer. The red LED is on when the batteries are charging. When the red LED is flashing rapidly and solid, the unit is actively charging the batteries on the Wafer. It should typically take less than 10 minutes to fully charge the batteries. If it is flashing slowly, the battery charge is being maintained. Though the carrier will continue to maintain the batteries on the wafer, the red LED will flicker every 10 to 20 seconds when the USB cable is not connected to a power source. The blue LED blinks when a wafer is detected and communicating with the carrier. Non-contact Integral Wafer User Manual 3-2 Using the Carrier Station Table 3-1: LED status indicators LED color Indicates Green Yellow Red Blue Successful USB connection to computer USB communications activity Wafer Charging Communication received from wafer Red/Blue alternating Wafer measurement has been initiated Green LED Yellow LED Carrier reset switch USB port Red LED Blue LED Figure 3-2. Connections and LED Indicators Non-contact Integral Wafer User Manual Using the Carrier Station 3-3 Removable rechargeable battery Figure 3-3. Backside of C/C Carrier Figure 3-4. LCD Display Non-contact Integral Wafer User Manual 3-4 Using the Carrier Station Figure 3-5. C/C Carrier Station Closed To open the carrier station and gain access to the wafer, push in the white Delrin cover latch button as shown in Figure 3-6 and lift the handle attached to the lid. Latch Button Figure 3-6. Unlatching the Carrier Station Non-contact Integral Wafer User Manual Using the Carrier Station 3-5 Once the lid is raised completely, spring tension will keep it open. Figure 3-7. Carrier Station Open CAUTION: Only handle the Wafer on the edges with gloves on. The wafer is locked to the surface of the white plastic insert on the carrier station by a spring-loaded clamp mounted to the side of the carrier station. To unclamp the wafer, pull the wafer clamp straight out until it clears the side of the wafer carrier. Then press down until it aligns with the recess in the side of the carrier station. Allow the clamp to slide forward into the recess. Non-contact Integral Wafer User Manual 3-6 Using the Carrier Station Wafer Clamp Figure 3-8. Wafer Clamp Removing the Wafer from the Carrier Station While the Lid is opened, you can slide the wafer off the carrier plastic insert surface. A groove is provided on the right-hand side of the carrier station surface to allow you to get your finger below the side of the wafer as shown in Figure 3-9. Slide the wafer to the left until there is enough of the wafer free of the carrier plastic insert surface to put your other hand or a vacuum wand under the wafer. Remove the wafer completely. Do not pull the wafer too quickly off the plastic insert surface. Static attraction between the bottom of the wafer and the plastic insert surface may place undue stress on the Wafer and result in breakage. Remove in this direction only Finger groove Vacuum wand or finger groove Non-contact Integral Wafer User Manual Using the Carrier Station 3-7 Figure 3-9. Wafer Removal Points Remove wafer in this direction only Figure 3-10. Removing the Wafer from the Carrier Station You can now place the wafer in a wafer cassette or other loading mechanism to perform the thermal survey. CAUTION: Only handle the wafer from the bottom or by the edges as much as possible. Always ensure the backside of wafer is cleaned of any particle or any other materials. Using the Wafer with the Carrier Station To place the wafer on the carrier station, first open the lid of the carrier station. Slide the wafer onto the plastic insert surface and slightly push the wafer against the wafer positioners. Make sure the edge of the wafer slides under the top surface of the positioners. Once the wafer is positioned correctly, pull the wafer clamp out from the recess, lift it up, and slowly slide the clamp forward until it presses against the wafer. Release the clamp. Lower the lid until the latch contacts the locking pin. Press the locking pin in and lower the lid until the locking pin pops out as shown in Figure 3-11. The lid is now secure. Non-contact Integral Wafer User Manual 3-8 Using the Carrier Station Unlatched Latched Figure 3-11. Lid Locking Pin The C/C carrier has an LCD on top left corner. When lid is opened, the message System Idle should be displayed. LCD Display White insert Figure 3-12. Idle Message Displayed When wafer is present and lid is closed, the LCD will display Loading Wafer. Once the wafer is detected, the message Wafer Ready will display and the blue LED will blink. Non-contact Integral Wafer User Manual Using the Carrier Station 3-9 Figure 3-13. Wafer Ready Displayed If you close the LID and no wafer is inside the carrier, you will see the message No Wafer detected. There may be a delay between the carrier LCD display messages and the system controller application message on your laptop. Do not use the wafer until you actually see the message display on the system controller application. Figure 3-14. System Controller Software Screen Non-contact Integral Wafer User Manual 4-1 CChhaapptteerr 44 UUssiinngg tthhee IInntteeggrraall WWaaffeerr SSyysstteemm CCoonnttrroolllleerr SSooffttwwaarree The Integral Wafer System Controller is a software program that communicates with the Integral Wafer through the 200 mm and 300 mm carrier station. It monitors the status of the system, retrieves data from completed thermal surveys, and sets up the parameters for the next set of surveys. Before using the controller software, please read instructions on using the Carrier Station. See the Using the Carrier Station section of Chapter 2 for more information. Starting the Program Connect the carrier station to the computer with the USB cable. Start the IW System Controller program by double-clicking the desktop icon. The program starts. The program automatically locates the connected station and establishes communication. If no carrier station is connected, the software will still start but displays the message Looking For iWafer System. Once you have connected the system, the software will then establish communication and display the Measurement tab. Figure 4-1 shows an example of the startup screen with the default Measurement tab selected. The screen shows the system connected to a 300mm carrier station. Figure 4-1. Measurement Tab Screen Verify that the wafer and carrier station type listed below the Sensor Maintenance button is the correct wafer type and carrier station. Non-contact Integral Wafer User Manual 4-2 Using the Carrier Station Controller NOTE: If the program cannot locate the Integral Wafer or the carrier station, verify that the carrier station is connected to the computer, the wafer is correctly aligned inside the carrier station with lid closed and that the appropriate calibration file for the wafer is loaded onto the computer. If the carrier station is connected but no wafer is present, you will see the screen in Figure 4-
2. Figure 4-2. No Wafer Present The Measurement tab screen displays by default when the program is first started. Most of the operations performed will be done from this screen. The wafer voltage is displayed directly below the Sensor Maintenance buttons. The actual voltage of the two batteries imbedded between wafers is displayed along with the charging condition. When the battery voltage is above 4.15 volts, the wafer battery is fully charged. Always wait until the wafer is fully charged before sending the wafer out on survey. A partially charged battery may cause the wafer to stop collecting data before the end of the run. If the voltage reading drops below 4 volts, the batteries are considered to have insufficient charge to complete a survey and the software will not allow the measurement with the wafer to start. The Start Survey button is disabled until battery voltage exceeds 4 volts. If the voltage drops below 3.00 volts, the batteries are no longer able to hold a charge. Figure 4-3 shows an example of a wafer with insufficient voltage to perform a survey. Non-contact Integral Wafer User Manual Using the Carrier Station Controller 4-3 Figure 4-3. Wafer Voltage Too Low At the very bottom of the screen, a small box displays status messages for actions performed by the software. Clicking the Exit button at any time will cause the program to end and return you to Windows. The System Info tab screen shows the vital information for the carrier station, and the wafer. When the carrier station is attached, it also displays the voltages of the Carrier CPU and Main Battery. Non-contact Integral Wafer User Manual 4-4 Using the Carrier Station Controller Figure 4-4. System Info Tab Program Screen The Wafer Type section shows the model and serial number of the wafer currently connected, as well as the firmware version. It also shows the current wafer voltage and status of the wafer battery monitor (enabled or disabled). The Station Type section shows the model and serial number of the docking station currently connected, as well as the firmware version. It also displays the controller software version. The About tab screen shows the vital information for the base station or carrier software versions and the licensing status of the program. Non-contact Integral Wafer User Manual Using the Carrier Station Controller 4-5 Figure 4-5. The About Tab Screen If the program is not properly licensed, the about screen will show the message No Valid License Found in the Product Registration Status area. The program will not make a measurement unless it is properly registered. Improper registration can occur if a fresh installation was performed on the computer after a system crash or other similar occurrence or if the license key file was accidentally deleted. Figure 4-6. Software License Not Valid Non-contact Integral Wafer User Manual 4-6 Using the Carrier Station Controller Click on the Software Licensing Information button at the bottom of the screen to open an information box. The box will display a unique registration key that is specific to your computer. Figure 4-7. Registration Key Dialog Copy the text displayed in the Registration Key box exactly as it appears. Send an email to SensArray or the Sales representative you purchased the software from and include the text from the registration key. You will receive a file from SensArray that contains the unlock key for your software. When you receive the file, copy it into the C:\SensArray\LICENSES folder on your hard drive. When you restart the program, the licensing information should now be valid. Figure 4-8. Incompatible Firmware If the program is not up to date, the Measurement tab screen will display the message shown in Figure 4-8. If you have recently replaced your wafer and/or carrier it may contain updated firmware that is not recognized by older releases of the Controller program. Use the Integral Wafer CD that was provided with your new wafer to ensure that the latest version of the Controller program is installed. See the Setting Up the Software section of Chapter 2 for more information. Non-contact Integral Wafer User Manual Using the Carrier Station Controller 4-7 Wafer Time Limit Feature To ensure optimum performance, as well as to help prevent possible structural or mechanical wafer failures, Integral Wafers that are intended for use in certain processes or applications are equipped with a built-in time limit feature. When the maximum recommended operating time has been reached, the wafer will automatically cease to operate. Refer to your wafers specifications for environmental operational limits and allotted usage hours. The Measurement tab portion of the Controller program displays the remaining usage time available to your wafer as shown in Figure 4-9. Figure 4-9. Usage Time Remaining When a wafer is approaching its final deployment, an alert box will appear indicating that the maximum recommended operating time has almost elapsed. As long as there is available usage time left, the Controller program will allow you to start a survey and deploy the wafer for a normal measurement activity. Figure 4-10. Usage Time Expiring Non-contact Integral Wafer User Manual 4-8 Using the Carrier Station Controller When the available usage time has elapsed, the Measurement tab will no longer display any wafer deployment options. Figure 4-11. Usage Time Elapsed Non-contact Integral Wafer User Manual Using the Carrier Station Controller Defining a Survey 4-9 1. From the Measurement tab, click on the Configure Sensor Banks button to setup the measurement parameters. The number of banks and sensors displayed on the configuration screens depends on the size of the wafer. If you note sensor locations on the sensor display that are marked with an X, these are sensors that are disabled. You cannot enable or disable individual sensors using this program, only banks of sensors. 2. Figure 4-12. Measurement Options- 300mm Wafer 3. Select the bank or banks with which you wish to measure by clicking on the bank label or check box, or by clicking on an individual sensor on the sensor map. As you place your mouse cursor over a bank number in the Banks column or an individual sensor on the sensor map, the sensors that make up that bank are highlighted. When a sensor bank is disabled, it will be displayed in red. 4. Clicking the Enable All Sensors button cancels any previous changes and re-enables all 5. available sensors. If you need to disable or enable individual sensors within a bank, click on the Sensor Maintenance button on the main controller window. A new window appears that allows individual sensor selection. 6. Click on the sensor that you wish to enable or disable. When enabled, the sensor number is displayed. When disabled, the sensor number is displayed in a light gray color. Non-contact Integral Wafer User Manual 4-10 Using the Carrier Station Controller Figure 4-13. Select Enabled Sensors Window 7. Click the Save button when finished to save the new configuration to the Integral Wafer. The window closes and returns you to the Measurement Options window NOTE: The disabled sensors will be noted in the Integral Wafer memory. Data will still be taken during the measurement, but the data will not be written to the output file when the data is transferred from the wafer. Disabling an individual sensor does not increase the run time. 8. Select the scan period for your measurement by clicking on the drop down list in the Measure Temperature Every section. The minimum and nominal runtime settings will update with changes in the settings. You should note that the faster the scan period, the greater the noise introduced into the measurement. For best result, consider a scan period of 1 second or longer. NOTE: The runtime is based on a calculation of the available memory on the Integral Wafer, the number of banks selected, and number of scans per second. The longer the period between scans and the fewer sensor banks enabled, the longer you can take data. 9. Clicking the Temperature Trigger Type button allows you to set an absolute or transient temperature point as a trigger to start the measurement. No measurements will be taken until the trigger point is reached. This allows you to put the carrier station in place and transfer the wafer into the test chamber without having to set a precise delay time to start the measurement. This condition allows more useful available measurement time. Non-contact Integral Wafer User Manual Using the Carrier Station Controller 4-11 Figure 4-14. Selecting Temperature Trigger Type 10. Select Absolute from the drop down list next to Temperature Trigger Type. Enter the desired trigger temperature into the box in degree Celsius. Your Trigger is now set. If the trigger temperature is unknown or varies from run to run, selecting Transient from the drop down list may be a preferred option. With the temperature trigger set to transient, a 0.35C per second gradient will activate the wafer. To cancel either function, select Disable from the option list. 11. Clicking the Enable Run Time Limit check box allows you to set a maximum time that the survey will run. Enter the desired run time into the box in second intervals. Figure 4-15. Set Survey Time Limits Dialog Non-contact Integral Wafer User Manual 4-12 Using the Carrier Station Controller 12. Click on the Enable Measure Delay check box to allow setting a measurement delay. Click on the down arrow on the drop-down box and select the amount of delay desired before the measurement starts. You can only select the fixed values (from 1 minute to 1 hour) in the drop-down list, typing a custom time value will not work. Figure 4-16. Setting Measurement Delay NOTE: Using the "Measurement Delay" prevents data recording until you have time to physically place the Integral Wafer into the system to be measured. No data is recorded during the
"Measurement Delay" period. However, the battery is still running. 13. Click the Start Survey button. 14. The Start Survey button will change to read Abort Survey. Pressing this button before the wafer has left the dock will cancel the survey and reset to the Start Survey. The parameters for the survey may then be changed and the survey started once again. Once the wafer has left the carrier station, the button will dim and no longer function. If the carrier station is unplugged from computer, the program screen reverts to the message Looking for iWafer System. 15. Move the carrier station into position for transferring the wafer into the test chamber. Non-contact Integral Wafer User Manual Using the Carrier Station Controller 4-13 Transferring Wafer Data 1. Connect the carrier station to the computer with the USB cable. The program will automatically recognize the wafer. Figure 4-17. Getting Wafer Data NOTE: If you are connected to the wafer through a carrier station, and there is data on the wafer, a message appears for you to download the data. Figure 4-18. Download Data Click Yes to download the data or No to ignore it. Clicking Yes has the same effect as pressing the Retrieve Last Survey button. 2. Once the button is active, click the Retrieve Last Survey button to transfer the latest survey file to your computer. 3. A Name File and Enter Comment dialog box opens. Enter any comments you wish to make about the file in the Comment box. 4. Click the OK button. Non-contact Integral Wafer User Manual 4-14 Using the Carrier Station Controller Figure 4-19. File Transfer Dialog Box 5. The Save As dialog box appears. This is a standard Windows dialog box. 6. Type the new name for the file in the File name: box or select an existing file name from the list. Figure 4-20. Selecting the Folder 7. Select the directory to place the file into in the Save in: dropdown and click the Save button to start the download. You may create a new folder, if needed, by clicking the new folder icon. 8. The main program window appears and starts transferring the wafer data to the host computer. 9. The program displays a progress bar showing the percentage of the measurement data transferred. 10. Once the data is transferred to memory, the program applies the calibration coefficients to the wafer data. 11. Once the calibration is applied, the screen displays a message showing the file(s) was decoded successfully. 12. As soon as the data is transferred, the Thermal MAP Analysis program (if installed) opens and displays the data in an Analysis window. For information on using the Non-contact Integral Wafer User Manual Using the Carrier Station Controller 4-15 program, please read the Analysis Software User Manual located in the C:\SensArray\Documentation folder on the host computer or use the Help file in the Thermal MAP Program. NOTE: If the Thermal MAP Analysis does not start automatically, this normally means that the program was not upgraded on your computer. You can start Thermal MAP from the desktop icon or click StartProgramsSensArrayThermal MAP from the start menu. Verify that the version is 3.0.6 or higher. If not, install the upgrade provided with your Integral Wafer system. Figure 4-21. Thermal MAP Analysis Window Example 13. When you are finished, you may exit Thermal MAP and the Integral Wafer Controller software. Non-contact Integral Wafer User Manual A-1 AAppppeennddiixx AA RReeffeerreennccee IInnffoorrmmaattiioonn Sensor Bank Reference Tables 1 and 2 detail the sensors that make up each bank for 200mm and 300mm wafers. Table 1. 200mm Bank Definitions for 53 Sensors C11 C13 C12 C10 H41 D17 B03 F30 F31 D16 D14 H43 D19 B04 Sensors G34 G35 E24 E22 H47 E23 A01 F32 F33 D20 D18 H45 D21 B05 G36 G37 E28 E26 H49 E25 Table 2. 300mm Bank Definitions for 65 Sensors Sensors E26 E38 E40 E28 F64 F61 F43 F46 D18 D14 D16 D20 E33 E31 E35 E37 E34 E30 E32 E36 F52 F49 F55 F58 D10 D22 D24 D12 E41 E39 E27 E29 C08 C07 B03 B04 D17 D15 D19 D21 H40 H44 H42 H38 H51 E27 F42 F60 F63 F45 F65 F62 F44 F47 H48 H52 H50 H46 H53 E29 F54 F48 F48 F57 F53 F50 F56 F59 Bank 1 2 3 4 5 6 7 Bank 1 2 3 4 5 6 7 8 9 C07 C09 C08 C06 H39 D15 B02 C06 C09 B05 B02 D25 D23 D11 D13 A01 Non-contact Integral Wafer User Manual A-2 Reference Information Correlating Sensor Coordinates Use the R, theta coordinates listed in tables 3 and 4 along with the layout drawings in figures 1 and 2 to match the sensor position on the wafer to the matching position on your hotplate or surface. For reference only. Drawing not to scale. Figure 1. 200mm Sensor Layout Non-contact Integral Wafer User Manual A-3 Table 3. 200mm Integral Wafer Sensor Positions Sensor Radius
(mm) 77 77 77 90 90 90 90 94 94 94 94 97 97 97 97 97 97 97 97 97 97 97 97 97 97 97 97 E27 E28 E29 F30 F31 F32 F33 G34 G35 G36 G37 H38 H39 H40 H41 H42 H43 H44 H45 H46 H47 H48 H49 H50 H51 H52 H53 Theta 315 0 45 135 225 315 45 135 225 315 45 90 112.5 135 157.5 180 202.5 225 247.5 270 292.5 315 337.5 O 22.5 45 67.5 Reference Information Sensor Radius
(mm) Theta 0 90 180 270 0 90 135 180 225 270 315 0 45 90 135 180 225 270 315 0 45 90 135 180 225 270 0 14 14 14 14 35 35 35 35 35 35 35 35 56 56 56 56 56 56 56 56 77 77 77 77 77 A01 B02 B03 B04 B05 C06 C07 C08 C09 C10 C11 C12 C13 D14 D15 D16 D17 D18 D19 D20 D21 E22 E23 E24 E25 E26 Non-contact Integral Wafer User Manual A-4 Reference Information For reference only. Drawing not to scale. Figure 2. 300mm Sensor Layout Non-contact Integral Wafer User Manual Reference Information Sensor Radius
(mm) Theta 0 9 9 9 9 37 37 37 37 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 74 110 110 110 110 110 110 110 110 0 135 225 315 45 90 180 270 0 90 112.5 135 157.5 180 202.5 225 247.5 270 292.5 315 337.5 0 22.5 45 67.5 90 112.5 135 157.5 180 202.5 225 247.5 A01 B02 B03 B04 B05 C06 C07 C08 C09 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 E26 E27 E28 E29 E30 E31 E32 E33 A-5 Table 4. 300mm Integral Wafer Sensor Positions Sensor Radius
(mm) 110 110 110 110 110 110 110 110 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 E34 E35 E36 E37 E38 E39 E40 E41 F42 F43 F44 F45 F46 F47 F48 F49 F50 F51 F52 F53 F54 F55 F56 F57 F58 F59 F60 F61 F62 F63 F64 F65 Theta 270 292.5 315 337.5 0 22.5 45 67.5 90 105 120 135 150 165 180 195 210 225 240 255 270 285 300 315 330 345 0 15 30 45 60 75 Non-contact Integral Wafer User Manual
1 | Users manual | Users Manual | 2.90 MiB |
EtchTemp Wafer User Manual KLA-Tencor SensArray 5451 Patrick Henry Dr. Santa Clara, CA 95054 408-986-5600 Fax 408-986-5601 info@sensarray.com www.sensarray.com 86-3820 Version-1.0 KLA-Tencor Confidential 2009 by KLA-Tencor. All rights reserved worldwide. No parts of this Copyright publication may be reproduced, modified, transmitted, transcribed, stored in retrieval systems, or translated into any human or computer language, in any form or by any means, electronic, mechanical, magnetic, chemical, manual, or otherwise, without the express written permission of KLA-TENCOR, One Technology Drive, Milpitas, California 95035. KLA-TENCOR may revise this document at any time without notice. UM-INT- 2007.04 This manual applies to EtchTemp Wafer EtchTemp Wafers are trademarks of KLA Tencor SensArray. KLA-Tencor reserves the right to modify, change, or improve any or all specifications published in this document without notice. 86-3820 Version-1.0 KLA-Tencor Confidential II Important Notices Warranty EtchTemp Wafer System Hardware KLA-Tencor warrants that the EtchTemp Wafer Systems (Products) sold will be free from defects in material and workmanship, and perform to KLA-Tencors applicable published specifications for a period of 12 months after shipment for the Docking Station. The EtchTemp is warranted for a specified number of operating hours. Refer to the specification provided with your wafer for the exact warranty terms. The Products that comprise the System shall include the Docking Station. The liability of KLA-Tencor hereunder shall be limited to replacing or repairing, at its option, any defective Products that are returned F.O.B. to KLA-Tencor SensArray division plant in Santa Clara, CA. In no case are Products to be returned without the purchaser first obtaining SensArrays permission and Returned Materials Authorization [RMA] number. In no event shall SensArray be liable for any consequential or incidental damages. Products that have been subject to abuse, misuse, accident, alteration, neglect, or unauthorized repair or installation are not covered by this warranty. SensArray will make the final determination as to the existence and cause of any alleged defect. SensArray is not responsible for maintaining or supplying any consumable materials used in conjunction with this hardware. No warranty is made with respect to any customized equipment or Products supplied with EtchTemp Wafer systems where produced to Purchasers specifications except as specifically stated in writing by SensArray in the contract for such Products. The purchaser will pay the shipping costs of returned materials to SensArray; SensArray will pay the cost of shipping repaired/replaced material to Purchaser. This Warranty is the only warranty made by SensArray with respect to the Product delivered hereunder and may be modified only by a written instrument that is signed by a duly authorized officer of SensArray and accepted by Purchaser. Except as provided above, SensArray makes no warrantees, expressed or implied, including any warranty of merchantability for a particular purpose. SensArray Tool Software KLA-Tencor (SensArray division) warrants that (a) SensArray Tools software (Software) will perform substantially in accordance with the accompanying written materials for a period of 12 months after shipment, and (b) the medium on which the Software is recorded will be free from defects in materials and workmanship under normal use and service for a period of 12 months after shipment. Faults caused by unauthorized modification, misuse or abuse of products, or problems due to software not supplied by SensArray, are not covered by this Warranty. During the Warranty Period, the purchaser may return failed Software to SensArray for repair or replacement, at SensArrays option. SensArray does not warrant that the operation of the Software shall be uninterrupted or error free. The purchaser will first notify SensArray of the nature of the problem and obtain a Returned Materials Authorization [RMA] number. The purchaser will pay the costs of shipping returned Software to SensArray; SensArray will pay the cost of shipping repaired/replaced Software to the purchaser. No other warranty is expressed or implied. SensArray specifically disclaims the implied warranty of merchantability and fitness for a specific application. The SensArray Tool Software Documentation Materials (Documentation) are subject to revision and change without notice. SensArray agrees to make a best effort attempt to keep the purchaser advised of changes to the Documentation. 86-3820 Version-1.0 KLA-Tencor Confidential III Software License Agreement The Software is owned by KLA-Tencor (SensArray division) and is protected by United States copyright laws and international treaty provisions. Therefore, you must treat the Software like any other copyrighted material. Under the Copyright Laws, the Integral Wafer Software, or accompanying written materials, may not be copied, photo-copied, reproduced, translated, in whole or in part, without the prior written permission of SensArray. You may make one copy of the Software solely for backup or archival purposes. Third-Party Software Licenses for any software which was provided but not produced by SensArray are granted solely and only by the original supplier or manufacturer and solely and only with the suppliers limitations and rights. Copying restrictions for such software are governed solely and only by the original supplier or manufacturers license or any other supplier-
approved agreements, as applicable. Trademarks EtchTemp wafer, Integral Wafer, SensArray Tools are trademarks of KLA-Tencor
(SensArray division). Windows and Excel are trademarks or trade names of Microsoft Corporation. Any other terms mentioned in this document that are known to be trademarks or service marks have been appropriately capitalized. Use of a term in this document should not be regarded as affecting the validity of any trademark or service mark. Some of the technology used in this product is acquired under license from the management and operating contractor of the Oak Ridge National Laboratory on behalf of the U.S. Department of Energy. 86-3820 Version-1.0 KLA-Tencor Confidential IV Radio Frequency Interference Compliance Applies to the Storage Cases, RF Carrier Station and RF FOUP NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. For the RF Carrier Station and the RF FOUP, only the USB cable supplied with the equipment is authorized for use with this device; any other cable is not authorized and may cause undesired interference, etc. Refer to Chapter 3 for product installation. RF Carrier Station USB Cable Product Modifications Applies to the Storage Cases and Carrier Station RF FOUP USB Cable Changes or modifications to this equipment not expressly approved by KLA-Tencor may void the users authority to operate the equipment. English French This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. 86-3820 Version-1.0 KLA-Tencor Confidential V Table of Contents i Using This Manual ...................................................................................................................ii Overview........................................................................................................................................... ii What You Need to Know.................................................................................................................. ii Conventions Used in this Manual .................................................................................................... iii Chapter 1 Overview ..............................................................................................................1-1 The EtchTemp Wafer System ........................................................................................................ 1-1 Acquiring Data............................................................................................................................... 1-1 Analyzing Data .............................................................................................................................. 1-1 Chapter 2 System Setup........................................................................................................2-1 Before You Begin .......................................................................................................................... 2-1 Proper Wafer Handling Procedures........................................................................................... 2-1 Unpacking Your System ................................................................................................................ 2-2 Removing the Wafer from the Storage Case............................................................................. 2-2 Charging the Equipment Before Use ........................................................................................ 2-3 Setting Up the Software ................................................................................................................. 2-3 Preparing Equipment for the Cleanroom ....................................................................................... 2-4 Cleaning the Equipment............................................................................................................ 2-4 Cleaning the EtchTemp Wafer.................................................................................................. 2-4 Cleaning the Carrier Station...................................................................................................... 2-5 Chapter 3 Using the Charge and Communication Carrier Station .................................3-1 Using the Carrier Station................................................................................................................ 3-1 Removing the Wafer from the Carrier Station............................................................................... 3-7 Using the Wafer with the Carrier Station....................................................................................... 3-9 Chapter 4 Using the SensArray Tool Software with EtchTemp Wafer...........................4-1 Starting the Program ............................................................................................................................ Acquiring data using mission controller .............................................................................................. Download and tag mission Data .......................................................................................................... Check Tagged Data.. View mission Data... Appendix A Reference Information ................................................................................A-1 Sensor Bank Reference ................................................................................................................. A-1 Correlating Sensor Coordinates .................................................................................................... A-3 86-3820 Version-1.0 EtchTemp Wafer User Manual KLA-Tencor Confidential ii UUssiinngg TThhiiss MMaannuuaall Overview This manual consists of the following sections. Chapter 1, Overview - Discusses features, components, and configurations of the EtchTemp Wafer System. Chapter 2, System Setup - Discusses unpacking the system components, preparing the equipment for the cleanroom, and connecting the system cables. Chapter 3, Using the Charge and Communication Carrier Station - provides an easy means to prepare the wafer for data acquisition and to perform data retrieval. Chapter 4, Using the SensArray tool Software - Discusses acquisition setup, acquisition features, and how to retrieve the measurement data using the Carrier Stations. Appendix A, Reference Information - Wafer sensor location information. What You Need to Know This user manual assumes that you are familiar with the version of the Windows operating system installed on your computer and can perform- as a minimum - the following tasks. Start (boot) the computer Log on to Windows Select from menus Select and open files Use a mouse or pointer, including how to point and click to select objects and operate controls such as buttons Use standard window controls such as scroll bars 86-3820 Version-1.0 EtchTemp Wafer User Manual iii KLA-Tencor Confidential Using This Manual Conventions Used in this Manual Several standard conventions are used in the text of this manual to make the information presented a little clearer and easier to understand. Every attempt is made to be consistent in the application of these conventions. Note:
Bold italic Courier Typeface Highlights important information. Bold text indicates button names, icon names, and menu items. Italic text indicates the section and/or chapter name in a cross-reference. For example:
See the Using the Acquisition Setup Window section of Chapter 3, Acquiring Data, for more information. Italic text can also be used to emphasize a word or phrase. Courier typeface indicates file names, directories, and text that you enter. For example:
The file is located in the C:\Sensarray\Configs directory.
<Key> A word offset by angle brackets indicates a key on the computer keyboard. For example:
After you specify the parameters, press the <Enter> key. Indicates important safety information. The icon is usually associated with a Warning or Caution in the document describing potential for product damage or personal injury. Other international standard icons specific to a particular hazard or action may be used in place of the exclamation mark. 86-3820 Version-1.0 EtchTemp Wafer User Manual KLA-Tencor Confidential 1-1 CChhaapptteerr--11 OOvveerrvviieeww The EtchTemp Wafer User Manual is designed to document the setup and use of the ET Wafer system in conjunction with the SensArray Tool. This manual is applicable for ET wafer only. This ET wafer will only work with SensArray Tool (Plasma Suites) This chapter discusses the features of the EtchTemp Wafer System. The EtchTemp Wafer System The ET Wafer has a complete measurement system embedded in the wafer to record thermal surveys in semiconductor processing equipment without the need for wired connections. Embedding the components within the wafer allows it to be treated like a production wafer in most equipment, as long as it is within the operating temperature range of the wafer. The ET wafer system consists of an EtchTemp Wafer, a carrier station/FOUP for communicating with and recharging the wafer, a USB cable, a laptop computer, and a CD containing the software and drivers needed by the system. The systems can acquire data from 1 to 64 analog channels, depending on the model. The analog channels are divided into banks. Each bank is made up of up to 8 wafer sensors. Measurements taken by the sensors are converted from analog to digital signals within the onboard electronics. Acquiring Data Utilizing the EtchTemp Wafer to acquire temperature data in your equipment is a simple process. Measurement parameters, such as sensors to be used, scan rate, time delay, etc., are set up using the Controller software. The wafer is then transferred to the measurement chamber from a FOUP or cassette via robotic arms, and the thermal measurement survey data is acquired. After the survey is complete, the data can be retrieved from the onboard memory through the RF FOUP or carrier station. The data may then be analyzed using SensArray Tool (Plasma Suites) Analyzing Data The data files acquired by the EtchTemp Wafer may be analyzed using SensArray tool. The SensArray Tools software enables users to maximize their fabs wafer yield, by capturing real-time tool or track conditions, and identifying the performance characteristics of chambers or plates with the highest yields. Users can then modify other chambers or plates to match those characteristics, as well as monitor tools or tracks over time, to fine-tune performance. For more information on the use of the Analysis portion of the SensArray Tools, please refer to the SensArray Tools (Plasma Suites) Manual. 86-3820 Version-1.0 EtchTemp Wafer User Manual 1-2 KLA-Tencor Confidential Overview Figure 1-1 SensArray Tools Main Screen 86-3820 Version-1.0 EtchTemp Wafer User Manual Figure 1-2 Mission Controller Screen Overview KLA-Tencor Confidential 1-3 During acquisition, EtchTemp wafer performs computations on acquired data, such as During acquisition, EtchTemp wafer performs computations on acquired data, such as determining the minimum, maximum, mean, range (max-min), and standard deviation of all determining the minimum, maximum, mean, range (max-min), and standard deviation of all wafer sensor values for the sample, and logs the results in columns. These computed wafer sensor values for the sample, and logs the results in columns. These computed values are referred to as calculated values. values are referred to as calculated values. After acquiring, linearizing, and storing the sensor data, you can display or print the data as After acquiring, linearizing, and storing the sensor data, you can display or print the data as a line plot graph, as shown in Figure 1-3. In addition, you can display data in a table or as a a line plot graph, as shown in Figure 1-3. In addition, you can display data in a table or as a wafer map. wafer map. Figure 1-3 Displaying Data on a Line Plot Graph 86-3820 Version-1.0 EtchTemp Wafer User Manual Wafer User Manual KLA-Tencor Confidential 2-1 CChhaapptteerr--22 SSyysstteemm SSeettuupp Before you can begin working with the EtchTemp Wafer system, you need to unpack the system components, prepare the equipment for transfer to the Cleanroom, and charge the wafer batteries. Before You Begin Before using the EtchTemp Wafer, there are several safety and handling precautions that should be noted. Please read the information provided in this manual and become familiar with the EtchTemp Wafer before attempting your first thermal survey. Operation of EtchTemp outside of its specified temperature range could result in unreliable readings and/or damaged wafers. Please review the recommended operating range for your particular model of EtchTemp Wafer. Rotational speeds up to 5000 rpm have been tested and found to be safe. While it is possible that even higher rotational speed might be reached without damage to the wafer or spin plate, SensArray cannot provide any guarantees above 5000 rpm. Proper Wafer Handling Procedures:
While the EtchTemp Wafer is designed to survive in a semiconductor fabrication environment, reasonable care must be taken to prevent damage to the components on the wafer, or breaking the wafer. Always wear gloves whenever you handle the wafer. Hold the wafer by the edges only or support from the backside of the wafer with your hand or with a vacuum wand. In some situations, you may have to grasp the edge of the wafer with your gloved fingers to prevent dropping the wafer, as when you try to insert the wafer into your equipment or a carrier station. Never place the wafer on an uneven surface. A small downward pressure on the wafer applied at the right point could cause the wafer to break or cause cracks within the silicon. Unpacking Your System Inventory all items and compare to the packing list included with the shipment. Retain all packaging materials for the system. This is required for the return of the EtchTemp Wafer for repairs or recalibration. If any parts are missing or damaged, contact SensArray immediately. Be prepared to provide a list of the missing and/or damaged components, the Purchase Order Number, and the SensArray Sales Order Number. NOTE: Do not return components without contacting SensArray first and obtaining a Return Material Authorization. When returning components to SensArray, you must repack the equipment in the original packing material. Failure to properly pack the components may result in additional damage to the equipment. 86-3820 Version-1.0 EtchTemp Wafer User Manual 2-2 KLA-Tencor Confidential System Setup Removing the Wafer from the Storage Case:
The wafer storage case is designed to keep the EtchTemp Wafer batteries charged to the optimum level for an extended period of 1 to 2 years. This is done by periodically checking the status of the batteries and recharging the batteries when their voltage drops below a threshold. CAUTION: The storage case is not designed to be used to recharge wafers after acquiring data. The storage case may not be used as a carrier station. It is used only to store a wafer when the wafer is not in use. The wafer will be maintained in the storage case until it is needed. To use the wafer, place the horizontal wafer Storage case right side up (electronic is at the bottom) on a clean work surface, as shown in Figure 2-1. To open the lid, place both thumbs on the rings on the lid as shown, lift both of your pointer fingers and open the lid completely. Locate the Charge and Communication (C/C) Carrier Station or RF FOUP near the storage case. Snap rings Storage case top side Figure 2-1 Opening the Storage Case For checking the wafer health using the storage case, make sure the storage case is completely closed. Flip the storage with the bottom side facing up as shown below. At the bottom of the storage case, there is an LCD screen that indicates the wafer serial number and battery voltage. If the wafer is not viable, the screen will indicate no wafer present. The storage case must be reset to force it to search for a wafer by pressing the reset button. The module will then spend approximately 15 seconds looking for a wafer in its presence. If a wafer is present and the module is unable to detect the wafer, try to place the wafer in the carrier station to check the wafer state. If wafer looks healthy in the carrier, the storage case may be problematic. Contact SensArray technical support for help. Storage case bottom side Figure 2-2 Storage case bottom side 86-3820 Version-1.0 EtchTemp Wafer User Manual System Setup KLA-Tencor Confidential 2-3 Charging the Equipment Before Use:
Place the EtchTemp Wafer into the carrier station shipped with the unit to maintain the charge on the internal batteries. Please see Using the Charge and Communication Carrier Station for more information on inserting and removing the wafer to and from the carrier stations. Plug the laptop into the AC power supply and fully charge the laptop battery. Setting up the Software The EtchTemp Wafer system normally includes a SensArray qualified laptop computer that has been prepared with all needed software to setup, run, and retrieve data from the EtchTemp Wafer. Note that, EtchTemp wafer will only work with SensArray Tool 2.1 and above Preparing Equipment for the Cleanroom Cleaning the Equipment:
When installing a computer and an EtchTemp Wafer system in the Cleanroom, follow industry standards, including wiping down the computer and the exterior of the carrier station with Cleanroom wipes dampened with de-ionized (DI) water and/or isopropyl alcohol. Wipe down the EtchTemp Wafer itself. Cleaning the EtchTemp Wafer:
Significant efforts are made to keep wafers clean during the manufacturing process. Due to the nature of some processes and demands by customers for cleaner wafers, the EtchTemp wafer is now offered as a cleaned product. It has gone through a SC1 and SC2 cleaning process to remove metals and organics. The cleaned wafer is packaged in the clean single polycarbonate storage case until it can be used. Despite our best efforts, the EtchTemp Wafer may pick up contaminants from repeated handling. The ideal method of cleaning surface contaminants from the wafer is to blow a gentle stream of CDA or inert nitrogen across the surface. However, some forms of surface contamination cannot be removed this easily. The wafer can be cleaned with IPA or DI water and a cleanroom cloth. Due to the design nature of the EtchTemp Wafer, scratches in the coating on the backside of the wafer may exist. This has not been shown to cause degradation in the performance of the wafer. A gentle stream of DI water or IPA may be used to loosen surface contamination, and then use CDA or inert nitrogen to blow the surface dry. Never place the wafer in an ultrasonic cleaning bath. The vibration set up by the ultrasonics may damage the electronics inside and render the wafer inoperable. NOTE: After a period of usage under etch environment, there will be a deposited polymer ring at the bottom surface of the wafer, this may cause the chucking problem or temperature range is not in specification. Please refer to application note for the cleaning details for this polymer ring. 86-3820 Version-1.0 EtchTemp Wafer User Manual 2-4 KLA-Tencor Confidential System Setup Cleaning the Carrier Station:
The carrier station is easily cleaned by wiping the surfaces with a cleanroom cloth dampened with IPA. Nothing harsher is needed to remove contamination from the surface. Be sure to clean the interior of the carrier station. Debris on the surface may cause stress points on the EtchTemp Wafer when the lid is closed. To avoid damage to the EtchTemp Wafer, only clean the interior of the carrier when the wafer is not present. Recharging and Storing EtchTemp Wafer:
The carrier station contains removable, rechargeable lithium-ion batteries. The carrier station batteries should maintain a charge on the wafer batteries for up to three years. The carrier station batteries can be charged via USB or with the provided power adapter. VERY IMPORTANT! Keep the wafer stored in a carrier station when not making thermal surveys. This will help ensure the maximum lifetime for the onboard wafer batteries. When storing the wafer in the carrier for extended periods of time, confirm that the LCD display reads Wafer Ready. This indicates that the carrier station has established proper contact with the wafer and ensures that the wafer battery charge is being maintained. 86-3820 Version-1.0 EtchTemp Wafer User Manual KLA-Tencor Confidential 3-1 CChhaapptteerr--33 UUssiinngg tthhee CChhaarrggee && CCoommmmuunniiccaattiioonn CCaarrrriieerr SSttaattiioonn//RRFF FFOOUUPP The Carrier Station/RF FOUP provides a method of charging and communicating with the wafer through an RF signal rather than a set of contact pins. EtchTemp wafer will only work with SensArray Tool 2.1 and above. Using the Carrier Station Before using the carrier station with EtchTemp Wafer, make sure the carrier firmware version is compatible. Carrier firmware version needs to be 2.1.90 or above. Please refer to the attached firmware upgrade document for further details. The carrier station protects the Wafer and maintains the battery charge during storage. It also provides the communication link between the Wafer and the host computer. The carrier station provides an easy, non-contact means of preparing the wafer for data acquisition and to perform data retrieval. It is important to follow proper procedures in removing and inserting the wafer in the carrier station to avoid damaging the wafer. LCD Display Coil printed circuit board for RF communication and charging between wafer and carrier Figure 3-1 C/C Carrier Station Components Wafer positioners Cleanable white SC1/SC2 cleaned polypropylene insert white polypropylene plate insert plate Figure 3-2 shows the C/C carrier station with USB port plug in. There are four LEDs on the left side of the carrier base, as referenced in Table 3-1. The green LED comes on when the USB cable is connected and there is communication between the host computer and the carrier station. The yellow LED will flicker when transferring data to and from the wafer. The red LED is on when the batteries are charging. When the red LED is flashing rapidly and solid, the unit is actively charging the batteries on the Wafer. It should typically take less than 10 minutes to fully charge the batteries. If it is flashing slowly, the battery charge is being maintained. Though the carrier will continue to maintain the batteries on the wafer, the red LED will flicker every 10 to 20 seconds when the USB cable is not connected to a power source. The blue LED blinks when a wafer is detected and communicating with the carrier. 86-3820 Version-1.0 EtchTemp Wafer User Manual 3-2 KLA-Tencor Confidential Using the Carrier Station Table 3-1: LED status indicators LED color Indicates Green Yellow Red Blue Successful USB connection to computer USB communications activity Wafer Charging Communication received from wafer Red/Blue alternating Wafer measurement has been initiated Carrier reset switch USB port Removable rechargeable battery Green LED Yellow LED Red LED Figure 3-2 Connections and LED Indicators Blue LED Figure 3-3 Backside of C/C Carrier 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the Carrier Station KLA-Tencor Confidential 3-3 Figure 3-4 LCD Display Figure 3-5 C/C Carrier Station Closed To open the carrier station and gain access to the wafer, push in the white Delrin cover latch button as shown in Figure 3-6 and lift the handle attached to the lid. Figure 3-6 Unlatching the Carrier Station Latch Button 86-3820 Version-1.0 EtchTemp Wafer User Manual 3-4 KLA-Tencor Confidential Using the Carrier Station Once the lid is raised completely, spring tension will keep it open. Figure 3-7 Carrier Station Open CAUTION: Only handle the Wafer on the edges with gloves on. The wafer is locked to the surface of the white plastic insert on the carrier station by a spring-loaded clamp mounted to the side of the carrier station. To unclamp the wafer, pull the wafer clamp straight out until it clears the side of the wafer carrier. Then press down until it aligns with the recess in the side of the carrier station. Allow the clamp to slide forward into the recess. Wafer Clamp Figure 3-8 Wafer Clamp 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the Carrier Station KLA-Tencor Confidential 3-5 Removing the Wafer from the Carrier Station While the Lid is opened, you can slide the wafer off the carrier plastic insert surface. A groove is provided on the right-hand side of the carrier station surface to allow you to get your finger below the side of the wafer as shown in Figure 3-9. Slide the wafer to the left until there is enough of the wafer free of the carrier plastic insert surface to put your other hand or a vacuum wand under the wafer. Remove the wafer completely. Do not pull the wafer too quickly off the plastic insert surface. Static attraction between the bottom of the wafer and the plastic insert surface may place undue stress on the Wafer and result in breakage. Finger groove Vacuum wand or finger groove Remove in this direction only Figure 3-9 Wafer Removal Points Remove wafer in this direction only Figure 3-10 Removing the Wafer from the Carrier Station You can now place the wafer in a wafer cassette or other loading mechanism to perform the thermal survey. CAUTION: Only handle the wafer from the bottom or by the edges as much as possible. Always ensure the backside of wafer is cleaned of any particle or any other materials. 86-3820 Version-1.0 EtchTemp Wafer User Manual 3-6 KLA-Tencor Confidential Using the Carrier Station Using the Wafer with the Carrier Station To place the wafer on the carrier station, first open the lid of the carrier station. Slide the wafer onto the plastic insert surface and slightly push the wafer against the wafer positioners. Make sure the edge of the wafer slides under the top surface of the positioners. Once the wafer is positioned correctly, pull the wafer clamp out from the recess, lift it up, and slowly slide the clamp forward until it presses against the wafer. Release the clamp. Lower the lid until the latch contacts the locking pin. Press the locking pin in and lower the lid until the locking pin pops out as shown in Figure 3-11. The lid is now secure. Unlatched Figure 3-11 Lid Locking Pin Latched The C/C carrier has an LCD on top left corner. When lid is opened, the message System Idle should be displayed. LCD Display White insert Figure 3-12 Idle Message Displayed When wafer is present and lid is closed, the LCD will display Loading Wafer. Once the wafer is detected, the message Wafer Ready will display and the blue LED will blink. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the Carrier Station KLA-Tencor Confidential 3-7 Figure 3-13 Wafer Ready Displayed If you close the LID and no wafer is inside the carrier, you will see the message No Wafer detected. There may be a delay between the carrier LCD display messages and the SensArray Tool mission controller application message on your laptop. Do not use the wafer until you actually see the message display on the mission controller screen. Also, only perform the survey when the wafer voltage is >4.10V. This would help to improve the lifetime of the EtchTemp wafer. Figure 3-14 Mission Controller Screen (SensArray Tool) 86-3820 Version-1.0 EtchTemp Wafer User Manual 3-8 KLA-Tencor Confidential Using the Carrier Station Using the RF FOUP The RF FOUP protects the Wafer and maintains the battery charge during storage. It also provides the communication link between the Wafer and the host computer through the USB port. When wafer is present, the LCD will display Loading Wafer. Once the wafer is detected, the message Wafer Ready will display. There may be a delay between the RF FOUP LCD display messages and the SensArray Tool mission controller application message on your laptop. Do not use the wafer until you actually see the message display on the mission controller screen. Figure 3-15 Mission Controller Screen (Settings) Communicating between RF FOUP and EtchTemp wafer is the same as between Carrier Station and EtchTemp wafer. Start the mission is identical for both RF FOUP and Carrier Station. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the Carrier Station KLA-Tencor Confidential 3-9 Figure 3-16 Retrieving the Data After the survey, when the wafer going back to the RF FOUP, the data from the wafer will be stored in the FOUP. Select the latest data file and click OK to retrieve the data file. NOTE: The RF can only stored up to 12 data files only. Figure 3-17 iWafer System File Transfer 86-3820 Version-1.0 EtchTemp Wafer User Manual KLA-Tencor Confidential 4-1 CChhaapptteerr--44 UUssiinngg tthhee SSeennssAArrrraayy TTooooll SSooffttwwaarree The SensArray Tool is a software program that communicates with the EtchTemp Wafer through the carrier station or RF FOUP. It monitors the status of the system, retrieves data from completed thermal surveys, and sets up the parameters for the next set of surveys. Before using the SensArray Tool, please read instructions on using the Carrier Station. See the Using the Carrier Station section of Chapter 3 for more information. For setup and using SensArray Tool, please see SensArray Tool manual. Starting the Program Connect the carrier station to the computer with the USB cable. Start the SensArray Tool program by double-clicking the desktop icon. The PlasmaSuite window opens Figure 4-1 SensArray Tool 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-2 Product License at Startup The computer should come with the correct license. However, if an Error dialog box appears similar to Figure 4-2 or Figure 4-3. Figure 4-2 Or Or if a license upgrade is needed, click the OK button, then use the License File Manager to resolve the issue. Figure 4-3 To use the License File Manager 1. Select Tools on the PlasmaSuite or LithoSuite window menu bar, then License File Manager. The License File Manager window opens. Figure 4-4 License File Manager Window 2. Send the computers hardware ID to Support Services at customer.support-
sensarray@kla-tencor.com. They will send an updated license. Download the new license. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-3 KLA-Tencor Confidential Using the SensArray Tools Software 3. To load the new license, return to the License File Manager window, then click the Change License button. The License Upgrade Wizard Choose License Manager Action window opens. Figure 4-5 Choose License Manager Action Window 4. Select the first option, then click the Next > button. The License Upgrade Wizard Add License Form File window opens. Figure 4-6 License Form File Window 5. Click the Load New File button. The Choose the license to load window opens. 6. Select the new license, then click the Open button -or- double-click the new license. The license contents are listed in the License Description panel of the License Upgrade Wizard - Add License From File window. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-4 7. Click the Next > button. The License Upgrade Wizard - Confirm License File Change window opens. 8. Click the Finish button, then close the License File Manager window. The new license is in effect. SensArray Tools Process Flow For the configuration setup, please refer to SensArray Tool user manual. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-5 KLA-Tencor Confidential Using the SensArray Tools Software Acquiring Data Using the Mission Controller The process of acquiring data, using the Mission Controller to run a mission, is comprised of the following steps:
Step 1 - Start the Application
Step 2 - Run a Mission
Step 3 - Download and Tag Mission Data
Step 4 - Check Tagged Data
Step 5 - View Mission Data Step 1 - Start the Application To start the application:
1. From the PlasmaSuite window, select Mission Controller. The Communication window opens. Figure 4-7 Communication Window Proceed to Step 2 - Run a Mission. Step 2 - Run a Mission To run a mission:
1. In the Run Mission panel, enter the Mission Name, Sample Period (sample the entire wafer every X seconds; one second is the standard); Acquisition Time (total mission time in seconds; maximum value depends on the particular wafer being used); and Start Condition. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-6 Start Condition options are:
Start Immediately - Mission starts when the wafer is taken from its bay station.
Start After Delay* Mission starts after the specified time expires.
Start at Temperature
*When a delay is combined with a temperature trigger, the delay will not start counting down until after the temperature trigger condition is met. Use a direct connection to the wafer:
2. Connect a cable from the computer USB port to the port on the FOUP or carrier station. Select the Wafer ID from the drop-down list, and then click the Connect to a device button in the Toolbox panel. The wafer information is read from the wafer and added to the Device Information panel. To check the wafer battery:
Figure 4-8 1. Click the Get Battery Voltage button in the Toolbox panel. If the wafer voltage is displayed in red, wafer can not be started. If the wafer voltage is displayed in green, the wafer is ready to run another mission. 2. Place the wafer into the processing equipment, then click the Run Mission button to run the mission. The Waiting for data window opens. This window is merely a rough status indicator for the wafer, and is present for convenience only. It can be closed at any time without affecting the wafer. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-7 KLA-Tencor Confidential Using the SensArray Tools Software To place the wafer into the process chamber, process it, then bring the wafer back Figure 4-9 Waiting for data Window a. If the wafer is in a wafer carrier:
b. Transfer the wafer to a standard FOUP. c. Place the FOUP onto the equipments load port and instruct the equipment to process the wafer. d. After the run is complete, instruct the equipment to unload the wafer, back to the FOUP. e. Transfer wafer from FOUP to wafer carrier. 3. If the wafer is in a RF FOUP:
a. Place the RF FOUP onto the equipments load port;, then instruct the equipment to process the wafer. b. After the run, instruct the equipment to unload the wafer back to the FOUP. Running the mission is now complete. Proceed to Step 3 - Download and Tag Mission Data, to view the collected data. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-8 Step 3 - Download and Tag Mission Data To download mission data 1. After the mission run is complete, return the wafer to its base station (RF FOUP or Carrier Station). Figure 4-10 Slecting the Wafer ID 2. Select the Wafer ID from the drop-down list, and then click the Connect to a device button in the Toolbox panel. The wafer information is read from the wafer. At bottom left corner, the message We are expecting data from this wafer appears. 3. Click the Download button in the Toolbox panel. The Please provide some information about this data window opens, to allow tagging information about the run to be entered. Figure 4-11 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-9 KLA-Tencor Confidential Using the SensArray Tools Software 4. Tag each mission by specifying by whom the data was collected, and the chamber and recipe associated with the mission. All missions must be tagged before proceeding. TIP: To tag more than one mission with the same information, select multiple files by pressing and holding the <CTRL> key while selecting additional missions. If multiple missions are selected, anything selected on the right is applied to every mission currently selected. Figure 4-12 To tag selected data (for PlasmaSuite) 1. Select a fully qualified path name from the Incoming Data panel. 2. Select a name from the Data collected by drop-down list to associate with the selected data. 3. Open the fab to the chamber level in the Select Chamber list, then select the chamber of interest. 4. Select a recipe from the Select Recipe list to associate with the selected chamber. 5. The selected chamber and recipe are listed in the Currently Selected field. Click those selections before clicking the Save All button. Proceed to Step 4 - Check Tagged Data. Step 4 - Check Tagged Data The Summary page table lists all data tags that were added or updated. To check tagged data:
1. If any information is incorrect, click the < Back button and correct it. 2. If the data is correct, click the Finish button. The PlasmaSuite window opens. NOTE: If there is a problem with the tagged data, a Warning dialog box opens, listing the problem parameters, and the Launch Go/No-Go window pinpoints the out-of-spec information. Correct the information before proceeding. To view the data collected, proceed to Step 5 - View Mission Data. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-10 Step 5 - View Mission Data 1. On the PlasmaSuite window, select Data Viewer, then select View Data from the File menu. The Mission Selection window opens. 2. Select the mission to be viewed, then drag it to the Selected Missions panel. Click the OK button. The Data Viewer window opens, with this mission displayed. The left panel plots the sensor data versus time. To display the data at that time point as a 2D or 3D graph, click the left panel. To display the data as a histogram, click the right panel. Figure 4-13 Data Viewer Window 3. Visually assess the resulting graphical comparison of missions. If the graphs look basically similar, the results are acceptable. If they are significantly dissimilar, investigate further with the Advanced Analysis tools. 4. Close the Data Viewer window when finished. The process of collecting data from the mission is now complete. The Data Viewer enables the following tasks:
Viewing Data from Previous Missions
Viewing Data from File
Identifying Data to Be Analyzed Using a Template From the PlasmaSuite window, select Data Viewer. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-11 KLA-Tencor Confidential Using the SensArray Tools Software Figure 4-14 Data Viewer Window Viewing Data from Previous Missions Select View Data to view data from previously run missions. To view data:
1. Select View Data in the File options on the Data Viewer menu bar. The Mission Selection window opens. 2. Apply various filters in the Mission Filters panel, to narrow the search. After a satisfactory selection of missions is viewed, drag one or more missions into the Selected Missions panel. 3. Information about the mission(s) is displayed in the Selected Missions panel, and graphed in the panel below. Click the OK button. A Data Viewer window for each selected mission opens. 4. The left panel plots the sensor data versus time. To display the data at that time point as a 2D or 3D graph, click the left panel. To display the data as a histogram, click the right panel. NOTE: The menu bar options for the mission-specific Data Viewer are more extensive than those of the general Data Viewer (before a mission is loaded). File options include:
View Data - Returns to a Mission Selection window
View Data From File - Opens the Select an ODF to load window (ODF = OnWafer data file)
Save Data To File - Opens a Save As window
Mission Controller - Opens the Mission Controller window
Export Data To Excel - Opens the Export to Excel window
Export Statistics/Graphs To Excel - Opens the Select Information to Include window
Export Graph to Image File - Opens the Save graph to file window 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-12
Close Window
Exit Edit option allows copying of a selected graph to the Windows Clipboard. Graph options include:
Synch All Graph Scales To:
Synch All Graph Intervals To:
Line Graph options
Set Scale
Auto Scale
Zoom
Zoom Settings
Set Background Color View option is Lifetime Information. Window option allows tiling windows horizontally and vertically, and window cascading. Help option provides Data Viewer version information. 5. Review data to ensure the results are as expected. If so, close the window. Viewing Data from File 1. Opens a Select an ODF to load window. (ODF = OnWafer data file.) Figure 4-15 Select an ODF to load window 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-13 KLA-Tencor Confidential Using the SensArray Tools Software Identifying Data to Be Analyzed Using a Template A template defines the regions of interest within a mission run using a specific recipe. It also defines the important statistics for each region (such as mean, range, and standard deviation).Templates are an important part of SensArray Tools analysis modules, because they are used to extract key information from the raw data. This section is a guide to the template creation process. The process of identifying data to be analyzed using a template, is comprised of the following steps:
Step 1 - Create a Template
Step 2 - Define the Intervals of Interest for this Recipe
Step 3 - Define the Parameters Step 1 - Create a Template To create a template 1. Start the Create a Template module from the PlasmaSuite window. The Templates -
Available Templates window opens. NOTE: If this is the first time the utility is started, the Available Templates list is empty, and no graph data is displayed. Figure 4-16 Templates - Available Templates window 2. Click the Add New Template button to start the Template Wizard to create a template, -or- the Copy Selected Template button to copy an existing template. The Mission Selection window opens. This allows a choice of reference mission, which should be a good representative of mission data collected using the recipe of interest. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-14 Figure 4-17 Mission Selection Window 3. Filter the missions by Recipe, Fab, DataSet, Wafer ID, Date, Included Missions, Data Type, Notes, or Diameter, to limit the number of missions from which to select. NOTE: More than one mission can be selected for this step, to ensure that the program is able to properly analyze other missions from the same recipe. 4. Drag the selected missions to the Selected Missions list. TIP: When selecting a single mission using the Mission Selector window, it is not necessary to drag the mission to the Selected Missions list. Instead, select the mission to be analyzed, then click the OK button. 5. After all missions are selected, click the Next > button. The Templates Interval Definition window opens. Proceed to Step 2 - Define the Intervals of Interest for this Recipe. Step 2 - Define the Intervals of Interest for this Recipe Intervals of interest are periods of time within the data that contain interesting information. Typically, these are the steady state portions of the graph, where the data is not significantly rising nor falling. To define recipe template intervals of interest:
1. Select which mission to list as the reference mission in the Selected Missions box. If there are no missions in the list that represent the needed data, return to Step 1
- Create a Template. NOTE: When selecting the reference mission, start with a well-functioning chamber or track that has missions running the same recipe or flow. Identify, as the reference mission, the template that most or all the selected missions match. To do this, select each mission, in turn, as the reference mission, then compare the results by clicking the Preview button. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-15 KLA-Tencor Confidential Using the SensArray Tools Software Figure 4-18 Templates - Interval Definition Window 2. Click the Add button, to add an interval. An interval defines the mission subset to be analyzed. TIP: To edit the interval start and end time, change the values in the Intervals table or on the graph. To change the values on the graph, click an interval (bordered in orange) to select it. Then press and hold the <CTRL> key while dragging a portion of the interval. Drag the beginning part of the interval to alter the start time. Drag the end of an interval to change the end time. To move the entire interval, drag the middle of the interval. 3. Click the Preview button, to see whether the intervals created are correctly matched in other missions. The preview graphs in the lower-right sector updates with the matching intervals. 4. To remove an interval, select the interval to be removed, then click the Remove Selected button. 5. If the selected intervals are satisfactory, click the Next > button. The Templates -
Parameter Definition window opens. Proceed to Step 3 - Define the Parameters. Step 3 - Define the Parameters The final step in creating a template involves defining the values to be extracted from the data inside each defined interval. For example, during a plasma etch step, it may be important to measure the average wafer temperature and cross-wafer range. During this step, these extracted parameters are specified and the template is named. In addition, these statistics can be extracted from a subset of the sensors, to extract regional information. For example, it may be interesting to extract the mean temperature at the edge of the wafer only, in addition to the entire cross-wafer average. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-16 To define template parameters:
1. Click the Add New Parameter button to add a parameter. A new row appears in the Interval Parameters list, with a drop-down list for Interval, Statistic, and Sensor Pattern. Figure 4-19 Templates - Parameter Definition window 2. Select the interval to which the parameter applies. 3. Select the statistic to calculate for that interval. Available options are Mean, 3Sigma, Max, Min, Range, Median, MaxAverage, and MinAverage. 4. Select the sensor pattern, to select the sensors to use in the calculations. Available options are All, None, Outer Ring, Inner Disc, Mask Edge, and [new pattern]. By default, all sensors on the wafer are used. NOTE: When a sensor pattern is selected, a Sensor Pattern window opens. It is possible to edit the selected sensor pattern characteristics or load a different pattern to edit. To create a new pattern, associate a different pattern name with the result. The button options are Select All, Clear All, Save, Save New, and Cancel. 5. Name the template (on the lower-right of the window). 6. Click the Finish button to save the input. A dialog box opens, to confirm template creation. Click the Yes button to confirm. After the template is created, the first Template Wizard window re-opens, where another template can be added. If this task is complete, close the window and start the Create a Signature module from the PlasmaSuite window. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-17 KLA-Tencor Confidential Using the SensArray Tools Software Identifying Data to Be Analyzed Using a Signature A signature allows limits to be associated with a template, to indicate the expected values for the calculated statistics. For example, if a recipe template calculates the mean of a steady-state period, the signature for that template would specify the minimum, maximum, and average values expected for that mean. The process of identifying data to be analyzed using a signature, is comprised of the following steps:
Step 1 - Create a Signature
Step 2 - Create a DataSet
Step 3 - Associate the Signature with a Recipe
Step 4 - Verify and Complete the Signature Step 1 - Create a Signature To create a signature:
1. Start the Create a Signature module from the PlasmaSuite window. The Signature Creator Wizard - Create or Edit window opens. Figure 4-20 Signature Creator Wizard - Create or Edit window 2. Select Create a new Signature or Edit an existing Signature, then click the Next >
button. The Signature Creator Wizard - Select Template window opens. Figure 4-21 Signature Creator Wizard - Select Template Window 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-18 3. From the Available Templates list, select the template for which the signature is to be created. The defined interval parameters for that template are listed to the right. Click the Next > button. The Signature Creator Wizard - Define Acceptance Limits window opens. Figure 4-22 Signature Creator Wizard - Define Acceptance Limits window 4. Define a collection of missions for the program to generate a suggested set of limits. Click the Create New DataSet button. The Create DataSet window opens. Proceed to Step 2 - Create a DataSet. Step 2 - Create a DataSet To create a DataSet:
1. Select a set of missions that reflect standard running conditions for the recipe. Enter a dataset name, then click the Save button to return to the Signature Creator Wizard Define Acceptance Limits window. Select the created dataset from the drop-down list, to ensure it is selected. NOTE: Name the new dataset before proceeding. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-19 KLA-Tencor Confidential Using the SensArray Tools Software Figure 4-23 2. Examine each parameter and assign a maximum, nominal, and minimum value, to define the acceptance limits for this signature. To use the suggested values calculated from the dataset, click the Use Suggested button. Click the Next > button. The Signature Creator Wizard - Associate Recipes window opens. Proceed to Step 3 - Associate the Signature with a Recipe. Step 3 - Associate the Signature with a Recipe To associate the signature with a recipe 1. Select Yes, associate this signature with one or more recipes, then click the Next > button. Figure 4-24 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-20 2. A signature can be assigned as the default for a given recipe; in that case, it is automatically loaded by Go/No-Go for missions run using that recipe. To assign a signature as the default for a recipe, use the Signature Creator Wizard Assign Default Recipe window. Select a signature, then click the Next > button. The Signature Creator Wizard Summary window opens. Proceed to Step 4 - Verify and Complete the Signature. Step 4 - Verify and Complete the Signature To verify and complete the signature 3. Enter a signature name. A summary of the values and recipes are listed. If everything is correct, click the Finish button. Figure 4-25 4. The Save Signature or Save as New Signature window opens. Click Yes to confirm. The window closes and the PlasmaSuite window opens. The Signature creation process is complete. Select Go/No-Go from the PlasmaSuite window, to analyze the mission. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-21 KLA-Tencor Confidential Using the SensArray Tools Software Validating Process Readiness Go/No-Go This module allows users to quickly determine whether the process is within spec. To analyze missions with Go/No-Go, a template and signature must be defined for the mission to analyze. To validate mission readiness 1. Select Go/No-Go from the PlasmaSuite window. The Go/No-Go window opens. Figure 4-26 2. Select Open from the File menu, to select the mission to analyze. The Mission Selector window opens. Filter the missions by Recipe, Fab, DataSet, Wafer ID, Date, Included Missions, Data Type, Notes, or Diameter, to limit the number of missions from which to select. 3. Drag the mission that is to be analyzed, into the Selected Missions list. TIP: When selecting a single mission using the Mission Selector window, it is unnecessary to drag the mission to the Selected Missions list. Instead, select the mission to be analyzed, then click the OK button. 4. Click the OK button. The Go/No-Go window opens, defaulted to the Mission Data tab. The mission is loaded and the analysis results are presented. If the mission is within spec, the data and the Go/No-Go Status area are shaded green. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-22 5. If any parameters are out of spec, the data and/or the Go/No-Go Status area are shaded red, to alert that the mission did not pass. Figure 4-27 NOTES:
The Overlay tab presents a graph of the selected mission mean, compared to the template mission mean.
The Template tab presents, for reference, the original mission used for the template.
The 2D Comparison tab provides surface plots of the selected and template missions. The Difference graph presents the differences between the selected mission and template. 6. To select a different interval, click a different row of the data table at the top. Selecting a different interval updates the 2D surface plots. 7. If the mission is red, further analysis of the process can be performed, using PlasmaRX. To access the application, click the Start PlasmaRX button (located in the lower-right area of the window). PlasmaRX The PlasmaRx module allows the user to model fab chamber behavior. The generated model displays the effect that modifying different equipment parameters has on the measured wafer data. For example, PlasmaRx can be used to show the temperature rise (at all points on the wafer) of an increase in source power. Models can then be compared (tool-to-tool, or day-to-day) to determine whether tools are performing optimally, and to help pinpoint problem components. SPC Charting The SPC (Statistical Process Control) Charting module allows the user to view SPC charts, scatter plots, and histograms for multiple missions. This provides the ability for the users to 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-23 KLA-Tencor Confidential Using the SensArray Tools Software review trend information for a specific chamber, to ensure the chamber remains within spec over time. SPC Charting requires a template for the recipe to be analyzed. If an appropriate template is not available, refer to the Identifying Data to Be Analyzed Using a Template - Step 1
- Create a Template section. NOTE: If the Warning dialog box, Some missions could not be matched to template and were removed from analysis, opens when running SPC Charting, it means:
The mission does not resemble the reference template. Click the Show Mission button in the Warning dialog box, to verify that the excluded missions do not match the template.
Choose a better template as the reference.
Contact KLA Tencor SensArray, if neither of the above actions resolve the problem. Match Analyzer The Match Analyzer module allows the user to compare two or more chambers running the same recipe. The data provided from this module allows the user to easily identify chambers that have fallen out of spec. Match Analyzer requires a template for the recipe to be analyzed. If an appropriate template is not available, refer to the Identifying Data to Be Analyzed Using a Template - Step 1 - Create a Template section. Profile Comparison The Profile Comparison module simultaneously displays line graphs and 2-D surface plots for two or more missions. Profile comparison requires a template for the recipe to be analyzed. If an appropriate template is not available, refer to the Identifying Data to Be Analyzed Using a Template - Step 1 - Create a Template section. AutoCal - Temperature Optimization The AutoCal module accurately measures, monitors, and calibrates the thermal dose in the post-exposure bake (PEB) step of the lithography process. Ensuring uniform temperature control across the wafer results in significant improvement in critical dimension (CD) uniformity, thereby increasing wafer yield. AutoCal includes Create Track and Create Litho Flow Wizards, to aid in setting up the lithography fab. See OnWafer Technologies, AutoCal 2.0, user documentation for further details. AutoCD - Critical Dimension Optimization Critical dimension measures transistor gate sizes on the wafer. The more uniform the gate size, the higher the total wafer yield. The object is to counteract non-uniformity resulting from previous production steps. In this case, it may not be a uniform temperature across the wafer that maximizes the critical dimension, but a different temperature on different parts of the wafer in subsequent production steps. AutoCD automatically tunes the post-exposure bakeplate settings, to achieve the desired critical dimension results on the wafer. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-24 AutoCD includes Create Track and Create Litho Flow Wizards, to aid in setting up the lithography fab. This section provides instructions for the following data management tasks:
Backing Up and Restoring the SensArray Tools Database Importing Files and Data Importing Files and Data A data tag is a set of metadata for a mission. This metadata includes the name of the person who collected the data, the chamber and recipe upon which the mission was run, the date the mission was run, and notes. The information for the metadata tags was input during Fab Configuration. The Data Importing and Tagging module is used to import legacy data formats, and modify existing data tags. Legacy data is saved to the SensArray Tools database and a data tag is created for each file imported. Legacy formats currently include OnWafer data files (WFR), SensArray Excel files (XLS, TXT), and AE Pilot wafer data (CSV). NOTE: Use files with the proper file extension (such as, CSV, TXT, WFR, XLS), in a location accessible by SensArray Tools. The process of importing files and data, is comprised of the following steps:
Step 1 - Import Data
Step 2 - Select Data of Interest or
Step 2 - Select Missions (to import missions that were previously tagged and saved)
Step 3 - Tag Selected Data
Step 4 - Check the Tagged Data Step 1 - Import Data To import data 1. Start the Data Importing and Tagging module from the PlasmaSuite or LithoSuite window. The Data Import - Select Desired Action window opens. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-25 KLA-Tencor Confidential Using the SensArray Tools Software Figure 4-28 2. Select one of the following options:
Load Data From WFR Files
Modify Existing Tags in the Database
Import Pilot Wafer Data Import SensArray Data 3. Click the Next > button. The window for the second step in the process opens. If an option was not selected, a Warning dialog box opens, with a reminder to select one of the options. Proceed to Step 2 - Select Data of Interest -or- Step 2 - Select Missions (to import missions that were previously tagged and saved). Step 2 - Select Data of Interest The window for the second step looks basically the same for importing all data file formats legacy-format OnWafer data files (WFR), SensArray Excel files (XLS, TXT), and AE Pilot wafer data (CSV). NOTE: Use files with the proper file extension (such as, CSV, TXT, WFR, XLS), in a location accessible by SensArray Tools. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-26 Figure 4-29 To select data of interest:
1. Click the Select Files or Import Another File button, located under the first instruction. The Open window lists available files of the selected data type. 2. Select the file of interest, then click the Open button or double-click the file name. The file appears in the panel below the button. Repeat sub-steps 1 and 2, until all files of interest are selected. 3. To remove one or more files from the list, select the file to be deleted, then click the Remove Selected Files button. NOTES:
If the file is a Pilot Wafer file, select the wafer size that collected the data 200 mm or 300 mm.
Using the Remove Selected Files button deletes the file from the list only it does not delete the file from its original location. 4. After the file(s) are selected, click the Next > button to tag the data. Proceed to Step 3 - Tag Selected Data. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-27 Step 2 - Select Missions KLA-Tencor Confidential Using the SensArray Tools Software Use this version of Step 2 to import missions that were previously tagged and saved. To select missions Figure 4-30 1. To narrow the number of missions selected, apply filters in the Mission Filters panel. Missions can be filtered by Recipe, Fab, DataSet, Wafer ID, Date, Included Missions, Data Type, Notes, and Diameter. The Number of Missions field lists the number of missions available before filtering, and as each filter is applied. TIP: To limit processing time, limit the number of missions selected. 2. The filtered missions appear in the right panel. Headings include Date, Tool, Chamber, Recipe, Wafer ID, Wafer Diameter, and Notes. Drag missions that are to be re-tagged, to the Selected Missions panel. When a mission is dragged to this panel, the field at the lower part of the panel fills with the above information, in report format, and includes Operator and Graph Data Type (available options are Temperature, Module Temperature, and Supply Voltage). 3. After all (needed) missions are selected, click the Next > button, to tag the data. Proceed to Step 3 - Tag Selected Data. 86-3820 Version-1.0 EtchTemp Wafer User Manual Using the SensArray Tools Software KLA-Tencor Confidential 4-28 Step 3 - Tag Selected Data Tag each mission by specifying by whom the data was collected, and the chamber and recipe. ALL missions must be tagged before proceeding. TIP: To tag more than one mission with the same information, select multiple files by pressing and holding the <CTRL> key while selecting additional missions. If multiple missions are selected, anything selected on the right is applied to every mission currently selected. To tag selected data (for PlasmaSuite) 1. Select a fully qualified path name from the Incoming Data panel. Figure 4-31 2. Select a name from the Data collected by drop-down list to associate with the selected data. 3. Open the fab to the chamber level in the Select Chamber list, then select the chamber of interest. 4. Select a recipe from the Select Recipe list to associate with the selected chamber. 5. The selected chamber and recipe are listed in the Currently Selected field. Click those selections before clicking the Next > button. Proceed to Step 4 - Check the Tagged Data. Step 4 - Check the Tagged Data The Summary page table lists all data tags that were added or updated. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-29 To check tagged data:
KLA-Tencor Confidential Using the SensArray Tools Software 1. If any information is incorrect, click the < Back button and correct it. 2. If the data is correct, click the Finish button. The PlasmaSuite or LithoSuite window opens. NOTE: If there is a problem with the tagged data, a Warning dialog box opens, listing the problem parameters, and the Launch Go/No-Go window pinpoints the out-of-
spec information. Correct the information before proceeding. Backing Up and Restoring the SensArray Tools Database On the PlasmaSuite window, click Tools on the menu bar. Select the Database Manager option. See release notes for the latest troubleshooting information. Release notes were copied to C:\Program Files\KLA-Tencor SensArray\SensArray Tools\releasenotes.txt at the time of software installation. To report bugs or submit requests for additional functionality, send an email message to customer.support-sensarray@kla-tencor.com. Include the following information within the email message:
Description of the problem or request (be specific)
Exact wording of the error message(s) received and process steps that led to the error
If the error dialog box includes a Details button, include a text file of the text that appears when the Details button is clicked TIP: Copy the Details text to the Windows Clipboard, then save to a Microsoft Wordpad file.
Supporting files (for example, screen captures, mission data, and so forth) TIPS:
Screen Captures. Press <ALT>+<Print Screen> to copy the Error dialog box to the Windows Clipboard, then paste into Microsoft Paint and save as a GIF or JPG file, or into the same Microsoft Wordpad file that includes the message details.
Mission Data. To save mission data, use the File Save As File from the Data Viewer window to export an ODF file.
Your name, company, location, telephone number, and email address Support staff will respond to the request as soon as possible. Acquisition Time. Total mission time in seconds; the amount of time it takes a process (plasma recipe or litho flow) to run. AutoCal. Proprietary software program that automatically calibrates advanced bake plates. AutoCD. Proprietary software program that directly optimizes the critical dimension for lithograph and photomask applications. Bake Plate. Device upon which the wafer is heated. Bake process. Overall process of preheating hot plate surfaces to known temperatures, loading the wafer onto each hot plate for a specific length of time for baking, cooling between each hot plate on a chill plate or chill paddle, and promptly removing the wafer upon cycle completion. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-30 KLA-Tencor Confidential Boxplot. Method for showing different types of data populations; the spacing between the various parts of the box help indicate variance, skew, and identify out-
of-specification values. Critical Dimensions (CDs). Width of a patterned line or the distance between two lines, monitored to maintain device performance consistency; also, the dimension of a specified geometry that must be within design tolerances. Data Tag. Set of metadata for a mission, which includes the name of the person who collected the data, the chamber and recipe upon which the mission was run, the date the mission was run, and notes. Data Viewer. Allows viewing of data from the current mission run or from previously saved data, and to start the Mission Controller and SmartDevice Control Center to run new missions. Dataset. Collection of missions for the program to generate a suggested set of limits. Dongle. Infrared device used to communicate with a wafer contained in a wafer carrier. Etch. Process for removing material in a specified area through a wet or dry chemical reaction or by physical removal, such as by sputter etch. Fab Configurator. Part of the SensArray Tools software that allows the user to represent the fab so that PlasmaSuite or LithoSuite can monitor the fab. Fabrication. Integrated circuit manufacturing processes. Fabrication Yield. Percent of wafers arriving at wafer sort compared with the number started into the process. Flow. Computer program, rules, specifications, operations, and procedures, which are organized in steps and are performed each time to produce/process a wafer. Used in LithoSuite. Each plate in the fab must have a flow associated with it. FOUP. Front-Opening Unified Pod. Docking station used for storing, protecting, loading, and unloading wafers, as well as communicating with and recharging INtegrated Wafers. Go/No-Go. Determines whether a mission is within specification. Histogram. Graphical display of tabulated frequencies; a graphical version of a table that shows what proportion of cases fall into each of several or many specified categories. The histogram differs from a bar chart in that it is the area of the bar that denotes the value, not the height. Import. Process of loading data sets (files) into the SensArray Tools database. Available by selecting Data Importing and Tagging from the Configuration menu on the PlasmaSuite or LithoSuite window. Interval. Defines the portion of the recipe or flow template to be compared and analyzed. Litho Flows. Processes used to run LithoSuite sensor wafer products. Lithography. Process of pattern transfer; when light is utilized, it is termed photolithography; and when patterns are small enough to be measured in microns, it is referred to as microlithography. Lithography Fab Hierarchical Levels. These consist of customer, location, fab, bay, track, block, stack, and plate. LithoSuite. SensArray Tools software for analyzing litho fab performance. Match Analyzer. Compare relevant statistics between multiple chambers or multiple plates. Mean Temperature. Arithmetic mean/average of two or more channels over a specific time slice. Median Temperature. Middle value of two or more channels over a specific time slice. Mission. One set of data collected by a sensor wafer. The mission specifications are set by using the Mission Controller or SmartDevice Control Center. Mission Controller. Software that allows the user to set up and run missions to gather fab data for analysis. Mission Filters. Apply filters to narrow the number of missions selected for comparison. Missions can be filtered by Recipe, Fab, DataSet, Wafer ID, Date, Included Missions, Data Type, Notes, and Diameter. Parameters. Defines the statistics to be calculated for the selected template interval, and the pattern of sensors to use in the calculations. Plasma. High-energy gas made up of ionized particles. Plasma Etch. Dry-etch process using reactive gases energized by a plasma field. Plasma Fab Hierarchical Levels. These consist of customer, location, fab, bay, tool, and chamber. Plasma Recipes. Processes used to run PlasmaSuite sensor wafer products. PlasmaSuite. SensArray Tools software for analyzing plasma etch fab performance. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-31 KLA-Tencor Confidential Using the SensArray Tools Software Profile Comparison. View 2D profiles of multiple missions. Recipe. Computer program, rules, specifications, operations, and procedures, which are organized in steps and are performed each time to produce/process a wafer. Used in PlasmaSuite. Each chamber in the fab must have a recipe associated with it. Recipe Step. Single action within a recipe. Sample Rate. Speed of acquisition during data collection. For example, a sample rate of 2 means that data will be collected from all sensors on the wafer every 2 seconds. Scatter Plot. Chart that uses Cartesian coordinates to display values for two variables. Data is displayed as a collection of points, each having one coordinate on the horizontal axis and one on the vertical axis. Sensor. Device that responds to an environmental variable (such as temperature). Sensor Pattern. Select the sensors to be used in calculating template parameters during a mission run. Available options are All, None, Outer Ring, Inner Disc, Mask Edge, and [new pattern]. By default, all sensors on the wafer are used. Signature. Allows numbers to be associated with a template, to indicate the expected values for the calculated statistics. For example, if a template for a recipe calculated the mean of a steady-state period, the signature for that template would specify the minimum and maximum values expected for that mean. SmartDevice Control Center. Software that allows the user to set up and run missions to gather fab data for analysis. Used with 3rd generation SmartFOUP360ez and SmartBOXez devices. SPC (Statistical Process Control) Chart. Tool used to determine whether a manufacturing or business process is in a state of statistical control or not. If the chart indicates that the process being monitored is not in control, the pattern it reveals can help determine the source of variation to be eliminated to bring the process back into control. A control chart is a specific kind of run chart. Steady State. Stable condition that does not change over time, or in which change in one direction is continually balanced by change in another. Tag, Tagging. Set of metadata for a mission. This metadata includes the person who collected the data, the chamber and recipe (or track and flow) on which the mission was run, the date the mission was run, and notes. Template. Defines the regions of interest within a mission run using a specific process (recipe or flow). It also defines the important statistics for each region
(such as mean, range, and standard deviation). Identifies critical intervals for a production, monitoring, or diagnostic process (recipe or flow). Track. Enclosed system used to heat, process, and cure semiconductor wafers. USB (Universal Serial Bus). Replaces various kinds of serial and parallel port connectors with one standardized plug and port combination. Connect USB-compliant devices (for example, the provided portable computer), by way of a USB cable connected to the devices USB port(s), then power-on the devices. Wafer. Thin round slice of a semiconductor material from which chips are made. Wafer Carrier. Used to protect wafers during the wafer fabrication. Wafer Fabrication. Series of manufacturing operations that places the circuit or device in and on the wafer. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-32 Software License Terms Pre-Installed Software License Terms Standard (U.S.) Version 2005.1.1 These Pre-installed Software License Terms apply to any quote, order, and order acknowledgment, and any license or delivery of software pre-installed on hardware by KLA-Tencor Corporation, 160 Rio Robles, San Jose, California 95134 (K-T) to any acquirer (Customer). K-T does not accept, expressly or impliedly, and K-T hereby rejects, any additional or different terms or conditions that Customer presents, including, but not limited to, any terms or conditions contained or referenced in any order, acceptance, acknowledgment, or other document, or established by trade usage or prior course of dealing, unless K-T expressly and unambiguously agrees to such terms and conditions in a duly signed writing. 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(e.g., an accountant and/or computer expert) collectively, the Auditors shall have the right to inspect and audit Customers compliance with these Pre-installed Software License Terms at Customers facilities and other applicable locations, at any time, during normal business hours, but no more than twice per year. Customer shall fully cooperate with such audit, and grant all required assistance and access to all records, materials and equipment. If an audit reveals that Customer possesses or at any time possessed unlicensed copies of the Software, Documentation, or Work Product, or that Customer did not remove or delete all copies of Software and Work Product that Customer was obligated to remove or delete in accordance with Section 2.5 (Transfers and other Actions under Mandatory Law), Customer shall immediately pay for such copies the greater of the fees applicable per K-T standard rates and prices at the time of (a) the Delivery Date; (b) Customers unauthorized copying; or (c) the completion of the audit. If such fees amount to more than ten percent (10 %) of the amount previously paid or payable to K-T under these Pre-
installed Software License Terms for the audited time period then (y) Customer shall reimburse K-T for all expenses related to the audit; and (z) K-T shall have the right to immediately terminate at its sole discretion either all or only the affected licenses by giving written notice, effective immediately. The Auditors shall not disclose any of Customers information except as related to any non-compliance with these Pre-installed Software License Terms or infringements of K-Ts rights. K-Ts rights and remedies under this Section 2.8 shall be in addition to and not in lieu of any other rights or remedies that are available to K-T at law or in equity. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-34 Software License Terms Standalone Software License Terms Standard (U.S.) Version 2005.1.1 These Standalone Software License Terms apply to any quote, order, and order acknowledgment, and any license or delivery of standalone software provided by KLA-
Tencor Corporation, 160 Rio Robles, San Jose, California 95134 (K-T) to any acquirer (Customer). K-T does not accept, expressly or impliedly, and K-T hereby rejects, any additional or different terms or conditions that Customer presents, including, but not limited to, any terms or conditions contained or referenced in any order, acceptance, acknowledgment, or other document, or established by trade usage or prior course of dealing, unless K-T expressly and unambiguously agrees to such terms and conditions in a duly signed writing. By ordering, receiving, accepting, using or installing software or otherwise proceeding with any transaction after receipt of these Standalone Software License Terms or after otherwise being notified that such transactions are subject to these Standalone Software License Terms, Customer agrees to these Standalone Software License Terms and K-Ts General Terms, which are incorporated by reference herein and are attached hereto, or available at www.kla-tencor.com/terms, upon request in writing addressed to KLA-Tencor Corporation, 160 Rio Robles, San Jose, California 95134, or by calling 408-875-3000. 1. SCOPE AND DEFINITIONS 1.1 Scope. These Standalone Software License Terms apply only to Software that is to be installed on Third Party Products. Computer programs that are pre-
installed, or to be installed, on any K-T Hardware are governed by K-Ts Pre-installed Software License Terms, which are available at www.kla-tencor.com/terms or on request. 1.2 Definitions. The definitions in K-Ts General Terms shall apply in addition to the following definition: the term Authorized Users means officers, employees and independent contractors of Customer, who are bound by enforceable written obligations to (i) treat the Software, Documentation and Confidential Information of K-T as confidential (as set forth in K-Ts General Terms); and (ii) use such Software, Documentation and Confidential Information only on behalf of Customer and only in accordance with these Standalone Software License Terms. 2. DELIVERY AND ACCEPTANCE TESTING 2.1 Delivery. K-T will deliver the object code of the Software Ex Works (Incoterms 2000) on K-Ts premises. Customer acknowledges and agrees that K-T does not transfer title to, or ownership of, any Software, Documentation, or any Intellectual Property and only grants limited, non-exclusive licenses to Software and Documentation as specified in these Standalone Software License Terms. If K-T agrees to install Software, such services will be provided under a separate services agreement, or, if none is concluded, subject to K-Ts then-current Time & Materials Services Terms (available on request). Partial and installment shipments are authorized. 2.2 Acceptance Testing. If K-T expressly agrees to installation and acceptance testing in a duly signed document, Customer shall grant its express acceptance upon K-Ts demonstration that the installed Software meets the acceptance criteria provided in the Documentation. In the absence of an express acceptance, Customer shall be deemed to have accepted Software upon the earlier of (i) approval of the Software; (ii) payment, without reservation of any amounts with respect to the Software; (iii) ten (10) days after Customers receipt of K-Ts notice that the installation has been completed, unless K-T receives within such period a written notice from Customer that describes in reasonable detail a material failure of the installed Software to meet the acceptance criteria specified in the Documentation; or (iv) use of the Software for any purpose other than testing (whether or not such Software is used in live production and regardless of whether any revenue is generated). 3. LICENSE 3.1 License Grant. K-T grants Customer a personal, non-sublicensable, non-exclusive, non-transferable, limited license to have Authorized Users use copies of the Software in accordance with the applicable Documentation solely for Customers internal activities related to Customers manufacture, inspection, analysis or testing of semiconductor wafers within the scope of the License Parameters. K-Ts license grant is conditioned on Customers continuous compliance with all license limitations and restrictions described in these Standalone Software License Terms and if Customer violates any of these limitations or restrictions, the license grant will automatically and immediately expire. Customer acknowledges that the license descriptions in this Section 3.1 and in Section 3.2 (License Parameters) define the scope of rights that K-T grants to Customer and that any usage of the Software outside the scope of that license grant and the scope of any statutory rights constitutes an infringement of K-Ts Proprietary Rights, as well as a material breach of these Standalone Software License Terms. 3.2 License Parameters. Any license grant under these Standalone Software License Terms is subject to the limitations defined in this Section 3.2. Unless K-T expressly specifies or agrees otherwise in a duly signed writing, all Software shall be governed by a Basic License (refer to Subsection 3.2.1 Basic License). 3.2.1 Basic License. Unless K-T expressly specifies in writing additional or different License Parameters per Subsections 3.2.2 (Licensed Computer) through 3.2.5 (Copies) below, Customer may install and keep one (1) copy of the Software on one (1) stand-alone computer, which may not be connected to a network in a manner that allows more than one (1) user to upload, review or otherwise create or use a copy of the Software. Customer may not use the Software other than on one (1) computer. 3.2.2 may install, upload, copy, keep, view, and use the applicable Software only on such Licensed Computer. Customer may migrate the Software to a different computer or type of computer only if (i) Customer gives thirty (30) days prior written notice to K-T; (ii) Customer does not upload or use the Software on the Licensed Computer after installing it on the destination computer; and (iii) Customer removes all copies from the Licensed Computer within two (2) weeks after installing it on the destination computer, which will thereafter become the Licensed Computer for purposes of these Standalone Software License Terms. Licensed Computer. If K-T in writing identifies a certain computer (Licensed Computer) on which the Software may be used, then Customer 86-3820 Version-1.0 EtchTemp Wafer User Manual Software License Terms 4-35
(i) Server-Client Architecture. If K-T identifies Software in a duly signed writing as a server software product (Server Software) then Customer 3.2.3 may install, upload, copy, keep, view, and use one (1) copy of the server portion of such Software on a single server, which may not be relocated from the premises to which K-T ships the Software, at which K-T installs the Software or which K-T expressly designates in a duly signed writing (Licensed Site);
Customer may install and use copies of the client portion of such Software on computers located within a five (5) miles radius of the server (unless K-T designates the license as a WAN license in a duly signed license, in which case Customer may install and use copies of the client portion of the Software at any location worldwide) in accordance with one of the following options:
Floating Licenses. If K-T specifically describes a license for Server Software in writing as a floating license or concurrent use license, Customer may install, upload, copy, keep, view, and use the client portion of such Software on a reasonable number of individual workstations on the condition that no more than the maximum number of concurrent Authorized Users specified by K-T may use the client or server portion of the Software at any one time. If K-T does not specify in writing a different maximum number of Authorized-Users for a floating license, the maximum number of concurrent Authorized-Users shall be one (1).
(ii) Node-Locked Licenses. Unless K-T specifically describes in writing a license for Server Software as a floating license or concurrent use license, Customer may install, upload, copy, keep, view, and use the client portion of such Software only on one (1) workstation per authorized node. All activities related to the operation of the Software must be performed on the same workstation. The maximum number of authorized nodes shall be one (1), unless K-T specifies another number in writing. 3.2.4 specified, on the one (1) year anniversary of the applicable Delivery Date. 3.2.5 by (i) permanently installing one (1) copy on a computer (provided that Customer keeps the original copy that K-T delivered only as a back-up copy, separately from any actively used Software; keeps records of such original copies indicating the location of its storage; and provides such records to K-T upon request), and (ii) temporarily uploading such copy of the Software into the working memory of the computer on which it has been installed to the extent necessary for using the Software in accordance with the applicable Documentation and License Parameters. Customer may not create any other copies of the Software, unless K-T expressly permits additional copies in writing (for example, without limitation, by invoicing Customer for ten (10) Node-
Locked Licenses (refer to Subsection 3.2.3(ii) Node-Locked Licenses) with respect to an item of Software of which K-T delivers only one (1) copy on a disk). Time Limit. If K-T specifies that a license is limited in time or duration, such license automatically shall expire on the specified date or if no date is Copies. Except as expressly specified herein or agreed otherwise in writing, Customer may duplicate each item of Software that K-T delivers only 3.3 License Key Management. K-T may, at its sole discretion, use or combine license management programs with any Software, which automatically monitor and enforce license restrictions and limitations, provided that such precautions shall not relieve Customer of its primary responsibility to ensure compliance with these Standalone Software License Terms. Customer expressly agrees to be fully responsible for compliance by all Authorized Users with these Standalone Software License Terms, to take all actions reasonably requested by K-T to protect the rights of K-T in the Software and Documentation, and to indemnify and hold K-T harmless against any loss resulting from a breach of these Standalone Software License Terms by any Authorized User or any individual or entity that Customer caused, enabled or allowed to use the Software in any manner not authorized under these Standalone Software License Terms. 3.4 Documentation. K-T grants Customer a non-sublicensable, non-exclusive, non-transferable, limited license to use the printed versions of the Documentation that K-T provides for Customers internal business purposes solely in support of Customers use of the Software in accordance with these Standalone Software License Terms. 3.5 Proprietary Notices. Customer shall not remove any product identification, trademark, copyright or other notices from the Software and Documentation and shall display K-Ts and its licensors names and logos as well as the name of the Software on each copy of the Software and Documentation made by Customer. 3.6 License Restrictions. To the extent permitted by applicable law, Customer agrees not to (i) create any derivative works based on the Software or Documentation or modify or alter the Software or Documentation in any manner whatsoever; (ii) sell, sublicense, lease, rent, loan, assign, convey or otherwise transfer the Software or Documentation to any third parties; (iii) copy or use the Software or Documentation for any purpose or in any manner not expressly permitted in these Standalone Software License Terms; (iv) use the Software outside the permitted scope of the License Parameters; (v) use the Software or Documentation, in any format, through any timesharing service, service bureau, network or by any other means, for or in the interest of any third party other than by Authorized Users; or (vi) permit or encourage any third party to do any of the foregoing. Customer shall cooperate with K-T, and shall render all reasonable assistance requested by K-T, to assist K-T in preventing and identifying any use of, or access to, the Software and Documentation, by Authorized Users or otherwise, in violation of these Standalone Software License Terms. 3.7 Third Party Products. To the extent that Customer acquires from K-T any Third Party Products that are accompanied by end-user license terms and/or other terms (in shrink-wrap, click-through or other format) (Third Party Terms) (i) Customer shall agree to such terms vis--vis the licensor specified in the Third Party Terms; (ii) to the extent such Third Party Terms conflict with Section 3.1 (License Grant) through 3.6 (License Restrictions), the Third Party Terms shall take precedence with respect to such Third Party Products; and (iii) Customers right to use the Third Party Product will be defined and restricted in the accompanying Third Party Terms. 4. ALL RIGHTS RESERVED. KLA-Tencor Technologies Corporation owns, retains, and reserves ownership, title, and all rights and interest, including, but not limited to, all Proprietary Rights in and to the Software and Documentation, subject only to the limited rights that K-T expressly grants in these Standalone Software License Terms. Without limiting the foregoing, Customer acknowledges that nothing herein shall constitute a sale of any Software or Documentation (or any Intellectual Property in and to Software and Documentation), including any copies and portions thereof. 5. TRANSFERS AND OTHER ACTIONS UNDER MANDATORY LAW. If Customer sells or otherwise transfers to a third party any hardware or media in which any Software is embedded or otherwise contained, Customer shall remove or delete all such Software prior to the transfer, unless K-T confirms in writing that the transferee has entered into a license agreement with K-T for such Software and has paid the applicable license fees. To the extent that Customer is expressly permitted by applicable mandatory law to transfer the Software to a third party, or copy, or use the Software in any manner not expressly authorized under these Standalone Software License Terms, Customer agrees to refrain from exercising such rights unless and until Customer has given K-T three (3) weeks prior written notice of Customers intent to exercise any such rights and K-T has not offered reasonable alternatives to Customers exercise of the mandatory rights within such three (3) week period. 86-3820 Version-1.0 EtchTemp Wafer User Manual 4-36 Software License Terms 6. PAYMENT. Customer shall pay (i) ninety percent (90%) of the license fees thirty (30) days after receipt of K-Ts invoice; and (ii) ten percent (10%) of the license fees thirty (30) days after express acceptance or deemed acceptance in accordance with Section 2.2 (Acceptance Testing), whichever occurs earlier. Payment shall be made in accordance with the General Terms. 7. LIMITED WARRANTY AND DISCLAIMERS Excluded Causes. Customer has no warranty rights with respect to defects or non-conformities caused by (i) use of the Software with hardware No Warranties for Updates. K-T does not extend any warranties under these Standalone Software License Terms for any updates that K-T may 7.1 Limited Warranty. K-T warrants that on the Delivery Date, the Software substantially conforms to the specifications in the applicable Documentation, subject to the limitations and exclusions in Subsections 7.1.1 (Excluded Causes) through 7.1.5 (No Third Party Rights). 7.1.1 or software that was not expressly specified in writing by K-T as suited for use with the Software; (ii) Customers failure to follow K-Ts operating instructions; (iii) failure to implement all updates, upgrades, and other new releases of Software made available to Customer; (iv) changes to the Customer environment, in which Software was provided; (v) acts or omissions of persons other than K-T or its authorized representatives; (vi) installation or maintenance of Software by someone other than K-T or persons certified by K-T; (vii) abuse, use at an unsafe or not suitable site, unusual physical or electrical stress; (viii) any relocation of Software without, or not in accordance with, a prior written authorization by K-T, or (ix) Force Majeure conditions, as defined K-Ts General Terms. 7.1.2 Modifications. Customer has no warranty rights with regard to any Software (i) that has been modified by someone other than K-T, unless such modifications were directed or approved by K-T in writing and made in conformance with all specifications and instructions provided in such writing; or (ii) that K-T modified in accordance with Customers request, specifications, or instructions, unless K-T agrees in a duly signed writing that the modified Software shall be covered by the limited warranty specified in Section 7.1 (Limited Warranty). 7.1.3 provide under K-Ts Software Maintenance Terms. Any warranties for any updates are exclusively and finally provided for under K-Ts Software Maintenance Terms. 7.1.4 manufacturer or supplier of Third Party Products makes any documentation providing for an end-user warranty available to K-T, then K-T shall forward such documentation to Customer. 7.1.5 immediately if Customer transfers any Software to any third party. 7.2 Exclusive Remedies. If the Software materially fails to conform to the limited warranty set forth in Section 7.1 (Limited Warranty), K-T shall, at its sole discretion (i) repair or replace the non-conforming Software to remedy the non-conformity identified by Customer in accordance with Section 7.3
(Warranty Period); or (ii) refund to Customer the amounts paid for the Software in exchange for return of the non-conforming Software, in which case all licenses granted to Customer under these Standalone Software License Terms for such Software shall be automatically revoked. This Software warranty does not obligate K-T to provide any on-site repair or on-site replacement of Software. At K-Ts discretion, repair of the Software may be made in later releases of Software and may require the purchase of additional software or hardware at Customers expense. THE REMEDIES EXPRESSLY PROVIDED IN THIS SECTION 7.2 WILL BE CUSTOMERS SOLE AND EXCLUSIVE REMEDIES AND SHALL BE IN LIEU OF ANY OTHER RIGHTS OR REMEDIES CUSTOMER MAY HAVE AGAINST K-T WITH RESPECT TO ANY NON-CONFORMANCE OF SOFTWARE. 7.3 Warranty Period. Unless K-T expressly specifies or agrees on a different warranty period in a duly signed writing, the warranty period for Software shall be ninety (90) days. The warranty period shall begin on the Delivery Date. Customer shall have no warranty claims under Section 7.1 (Limited Warranty), unless K-T receives from Customer, during the warranty period (i) a written notice describing the warranty breach in reasonable detail
(Warranty Claim); and (ii) remote and physical access to the affected Software as well as information in sufficient detail to enable K-T to reproduce and analyze the failure. No Warranty for Third Party Products. K-T does not extend any warranties and K-T disclaims all responsibilities for Third Party Products. If a No Third Party Rights. Any warranties extended by K-T (i) are nontransferable and for Customers benefit only, and (ii) shall expire effective 7.4 Costs and Procedure. If K-T receives a Warranty Claim in accordance with Section 7.1 (Limited Warranty), Section 7.3 (Warranty Period), and any procedure guidelines that K-T may publish or make available to Customer (Warranty Guidelines), K-T will not charge for any repair, replacement, error identification, or correction of the non-conforming Software. If Customers Warranty Claim fails to meet any of the requirements of Sections 7.1 (Limited Warranty), Section 7.3
(Warranty Period), or the Warranty Guidelines, K-Ts then-current Time & Materials Services Terms (available on request) shall apply to any error identification or correction efforts, repair, replacement, and shipment costs by K-T and Customer shall compensate K-T accordingly on a time & materials basis at K-Ts then-current rates (available on request). 7.5 Disclaimer. EXCEPT AS SPECIFIED IN SECTION 7.1 (LIMITED WARRANTY), K-T MAKES NO EXPRESS REPRESENTATIONS OR WARRANTIES WITH REGARD TO ANY SOFTWARE. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, K-T DISCLAIMS ALL IMPLIED WARRANTIES AND REPRESENTATIONS, INCLUDING, BUT NOT LIMITED TO, ANY WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT AND, WITHOUT LIMITING THE FOREGOING, MAKES NO WARRANTY THAT THE SOFTWARE WILL BE ERROR-FREE, THAT ITS PERFORMANCE OR OPERATION WILL BE UNINTERRUPTED, OR THAT THE SOFTWARE WILL PERFORM ON ANY HARDWARE OR WITH ANY SOFTWARE, EXCEPT AS EXPRESSLY CERTIFIED AS INTEROPERABLE BY K-T IN THE APPLICABLE DOCUMENTATION. 8. TERMINATION 86-3820 Version-1.0 EtchTemp Wafer User Manual Software License Terms 4-37 8.1 Termination for Cause. Without limiting Section 3.1 (License Grant) with respect to the automatic termination of license rights for specific Software, K-T may terminate at K-Ts sole discretion either all or specific licenses to Software granted hereunder, by giving written notice, effective immediately, if within ten (10) days of Customers receipt of a reasonably detailed written request to cure, Customer has not cured all breaches of payment obligations, license limitations and restrictions, including, but not limited to, the License Parameters, or any other substantial obligations under these Standalone Software License Terms. Upon such termination, Customer shall immediately pay all outstanding fees, cease use of all Software and related Documentation, return or delete, at K-Ts request and sole discretion, all copies of the Software and Documentation in Customers possession, and certify compliance with all foregoing obligations to K-T in writing. These termination rights are in addition to any other rights and remedies that K-T may have at law or in equity. 8.2 Survival. K-Ts General Terms and these Standalone Software License Terms, except Sections 2.1 (Delivery) and 3.1 (License Grant), shall survive termination of any or all licenses granted hereunder. 9. AUDIT. CUSTOMER AGREES TO KEEP COMPLETE, CORRECT AND DETAILED RECORDS RELATING TO (I) THE REPRODUCTION AND USE OF THE SOFTWARE AND DOCUMENTATION, INCLUDING, AT A MINIMUM, THE LOCATION OF ALL SOFTWARE, LICENSED COMPUTERS, AND BACK-UP COPIES OF SOFTWARE AND DOCUMENTATION; AND (II) THE TRANSFER OF HARDWARE OR MEDIA ON WHICH ANY SOFTWARE IS EMBEDDED OR OTHERWISE CONTAINED AND CUSTOMERS COMPLIANCE WITH ITS OBLIGATIONS UNDER SECTION 5 (TRANSFERS AND OTHER ACTIONS UNDER MANDATORY LAW). AT K-TS REQUEST AND UPON TEN (10) DAYS PRIOR WRITTEN NOTICE, K-T AND/OR ITS AUTHORIZED REPRESENTATIVES (E.G., AN ACCOUNTANT AND/OR COMPUTER EXPERT) COLLECTIVELY, THE AUDITORS SHALL HAVE THE RIGHT TO INSPECT AND AUDIT CUSTOMERS COMPLIANCE WITH THESE STANDALONE SOFTWARE LICENSE TERMS AT CUSTOMERS FACILITIES AND OTHER APPLICABLE LOCATIONS, AT ANY TIME, DURING NORMAL BUSINESS HOURS, BUT NO MORE THAN TWICE PER YEAR. CUSTOMER SHALL FULLY COOPERATE WITH SUCH AUDIT, AND GRANT ALL REQUIRED ASSISTANCE AND ACCESS TO ALL RECORDS, MATERIALS AND EQUIPMENT. IF AN AUDIT REVEALS THAT CUSTOMER POSSESSES OR AT ANY TIME POSSESSED UNLICENSED COPIES OF THE SOFTWARE OR DOCUMENTATION, OR THAT CUSTOMER DID NOT REMOVE OR DELETE ALL COPIES OF SOFTWARE AND DOCUMENTATION THAT CUSTOMER WAS OBLIGATED TO REMOVE OR DELETE IN ACCORDANCE WITH SECTION 5 (TRANSFERS AND OTHER ACTIONS UNDER MANDATORY LAW), CUSTOMER SHALL IMMEDIATELY PAY FOR SUCH COPIES THE GREATER OF THE FEES APPLICABLE PER K-TS STANDARD RATES AND PRICES AT THE TIME OF (A) CONTRACT FORMATION; (B) CUSTOMERS UNAUTHORIZED COPYING; OR (C) THE COMPLETION OF THE AUDIT. IF SUCH FEES AMOUNT TO MORE THAN TEN PERCENT (10 %) OF THE AMOUNT PREVIOUSLY PAID OR PAYABLE TO K-T UNDER THESE STANDALONE SOFTWARE LICENSE TERMS FOR THE AUDITED TIME PERIOD THEN (Y) CUSTOMER SHALL REIMBURSE K-T FOR ALL EXPENSES RELATED TO THE AUDIT; AND (Z) K-T SHALL HAVE THE RIGHT TO IMMEDIATELY TERMINATE AT ITS SOLE DISCRETION EITHER ALL OR ONLY THE AFFECTED LICENSES BY GIVING WRITTEN NOTICE, EFFECTIVE IMMEDIATELY. THE AUDITORS SHALL NOT DISCLOSE ANY OF CUSTOMERS INFORMATION EXCEPT AS RELATED TO ANY NON-COMPLIANCE WITH THESE STANDALONE SOFTWARE LICENSE TERMS OR INFRINGEMENTS OF K-TS RIGHTS. K-TS RIGHTS AND REMEDIES UNDER THIS SECTION 9 SHALL BE IN ADDITION TO AND NOT IN LIEU OF ANY OTHER RIGHTS OR REMEDIES THAT ARE AVAILABLE TO K-T AT LAW OR IN EQUITY. 86-3820 Version-1.0 EtchTemp Wafer User Manual KLA-Tencor Confidential A-1 AAppppeennddiixx AA RReeffeerreennccee IInnffoorrmmaattiioonn Sensor Bank Reference Sensor S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 S11 S12 S13 S14 S15 S16 S17 S18 S19 S20 S21 S22 S23 S24 S25 S26 S27 S28 S29 S30 S31 S32 S33 S34 S35 S36 S37 S38 S39 Sensor Name A01 B02 B03 B04 B05 C06 C07 C08 C09 D10 D11 D12 D13 D14 D15 D16 D17 E18 E19 E20 E21 E22 E23 E24 E25 F26 F27 F28 F29 F30 F31 F32 F33 G34 G35 G36 G37 G38 G39 G40 Radius(mm) Angle 0 9 9 9 9 37 37 37 37 74 74 74 74 74 74 74 74 92.2 92.2 92.2 92.2 92.2 92.2 92.2 92.2 110 110 110 110 110 110 110 110 140 140 140 140 140 140 140 0 352.5 82.5 172.5 262.5 307.5 37.5 127.5 217.5 307.5 352.5 37.5 82.5 127.5 172.5 217.5 262.5 330 15 60 105 150 195 240 285 307.5 352.5 37.5 82.5 127.5 172.5 217.5 262.5 330 15 60 105 150 195 240 X(mm) 0 8.9 1.2
-8.9
-1.2 22.5 29.4
-22.5
-29.4 45 73.4 58.7 9.7
-45
-73.4
-58.7
-9.7 79.8 89.1 46.1
-23.9
-79.8
-89.1
-46.1 23.9 67 109.1 87.3 14.4
-67
-109.1
-87.3
-14.4 121.2 135.2 70
-36.2
-121.2
-135.2
-70 Y(mm) 0
-1.2 8.9 1.2
-8.9
-29.4 22.5 29.4
-22.5
-58.7
-9.7 45 73.4 58.7 9.7
-45
-73.4
-46.1 23.9 79.8 89.1 46.1
-23.9
-79.8
-89.1
-87.3
-14.4 67 109.1 87.3 14.4
-67
-109.1
-70 36.2 121.2 135.2 70
-36.2
-121.2 86-3820 Version-1.0 EtchTemp Wafer User Manual A-2 KLA-Tencor Confidential Reference Information 140 144 144 144 144 144 144 144 144 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 147 285 330 15 60 105 150 195 240 285 307.5 330 352.5 15 37.5 60 82.5 105 127.5 150 172.5 195 217.5 240 262.5 285 36.2 124.7 139.1 72
-37.3
-124.7
-139.1
-72 37.3 89.5 127.3 145.7 142 116.6 73.5 19.2
-38
-89.5
-127.3
-145.7
-142
-116.6
-73.5
-19.2 38
-135.2
-72 37.3 124.7 139.1 72
-37.3
-124.7
-139.1
-116.6
-73.5
-19.2 38 89.5 127.3 145.7 142 116.6 73.5 19.2
-38
-89.5
-127.3
-145.7
-142 G41 H42 H43 H44 H45 H46 H47 H48 H49 J50 J51 J52 J53 J54 J55 J56 J57 J58 J59 J60 J61 J62 J63 J64 J65 S40 S41 S42 S43 S44 S45 S46 S47 S48 S49 S50 S51 S52 S53 S54 S55 S56 S57 S58 S59 S60 S61 S62 S63 S64 86-3820 Version-1.0 EtchTemp Wafer User Manual Reference Information KLA-Tencor Confidential A-3 Correlating Sensor Coordinates 86-3820 Version-1.0 EtchTemp Wafer User Manual A-4 KLA-Tencor Confidential Reference Information 86-3820 Version-1.0 EtchTemp Wafer User Manual
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2014-10-17 | 1.54 ~ 1.54 | DXT - Part 15 Low Power Transceiver, Rx Verified | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2014-10-17
|
||||
1 | Applicant's complete, legal business name |
KLA-Tencor Corporation
|
||||
1 | FCC Registration Number (FRN) |
0016888653
|
||||
1 | Physical Address |
1 Technology Drive
|
||||
1 |
Milpitas, California 95035
|
|||||
1 |
United States
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
i******@ckccertification.com
|
||||
1 | TCB Scope |
A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
QTA
|
||||
1 | Equipment Product Code |
RFSC812A
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
J****** M******
|
||||
1 | Title |
General Manager
|
||||
1 | Telephone Number |
408-8********
|
||||
1 | Fax Number |
408-8********
|
||||
1 |
j******@kla-tencor.com
|
|||||
app s | Technical Contact | |||||
1 | Firm Name |
KLA-Tencor Corp, SensArray Division
|
||||
1 | Name |
D******** E******
|
||||
1 | Physical Address |
1 Technology Drive
|
||||
1 |
Milpitas, California 95035
|
|||||
1 |
United States
|
|||||
1 | Telephone Number |
408-8********
|
||||
1 | Fax Number |
408-8********
|
||||
1 |
D******@kla-tencor.com
|
|||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | DXT - Part 15 Low Power Transceiver, Rx Verified | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Integral Wafer Storage Case for 200 and 300mm Wafers | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Does not apply | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
CKC Laboratories, Inc.
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1 | Name |
S****** B********
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1 | Telephone Number |
209-9******** Extension:
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1 | Fax Number |
866 7********
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1 |
s******@ckc.com
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Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
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Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 20 | 1.54000000 | 1.54000000 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC