Data Sheet IO-Link Wireless Device Module KE2640MODA1 DO0402R01 4/20/2021 KUNBUS GmbH Table of Contents Table of Contents 1 Disclaimer .................................................................................................................................................... 2 Overview....................................................................................................................................................... 2.1 Features................................................................................................................................................ 2.2 Application ............................................................................................................................................ 3 Certification.................................................................................................................................................. 3.1 North America Statements (FCC and IC) ............................................................................................. 3.2 FCC and IC Modular Transmitter Instructions ...................................................................................... 4 Key Specification......................................................................................................................................... 5 Block Diagram ............................................................................................................................................. 10 6 Typical Application Circuit ......................................................................................................................... 11 7 Pin Assignment ........................................................................................................................................... 12 8 Firmware....................................................................................................................................................... 13 8.1 Pre-installed Firmware.......................................................................................................................... 13 8.2 Host Interface ....................................................................................................................................... 13 9 Antenna Gain Setting .................................................................................................................................. 16 10 Layout Guidelines ....................................................................................................................................... 17 10.1 PCB Specification ................................................................................................................................. 17 10.2 Layout ................................................................................................................................................... 18 11 Footprint Indications................................................................................................................................... 21 11.1 Top View............................................................................................................................................... 21 11.2 Dimensions ........................................................................................................................................... 22 12 Contact Details ............................................................................................................................................ 23 3 4 4 4 5 5 5 8 ii IO-Link Wireless Device Module i r e m a c s D i l 1 Disclaimer 2021 KUNBUS GmbH, Denkendorf (Germany) The contents of this document have been prepared by KUNBUS GmbH with the utmost care. Due to technical developments, KUNBUS GmbH reserves the right to change or replace the contents of this document without prior notice. You can always obtain the latest version of the user manual at our homepage: www.kunbus.de KUNBUS GmbH shall be liable exclusively to the extent specified in the General Terms and Conditions (www.kunbus.de/agb.html). The contents published in this document are protected by copyright. Any reproduction or use for the users in-house requirements is permitted. Reproduction or use for other purposes is not permitted without the express, written consent of KUNBUS GmbH. Contraventions shall result in compensation for damages. Trademark Protection KUNBUS is a registered trademark of KUNBUS GmbH. IO-Link Wireless Device Module 3 2 Overview KE2640MODA1 is an IO-Link Wireless system on module (SOM) that supports physical layer, data link layer and all upper layer services of the IO-Link Wireless Device as specified in the IO-Link Wireless System Extensions v1.1. The module can either be used as SOM providing the entire IO-
Link Wireless Device solution on module or as communication controller for a host processor. i w e v r e v O Integrates TI Low Energy Wireless MCU CC2640R2F to support all physical and upper layer services of an IO-Link Wireless Device With power amplifier (PA)/low noise amplifier (LNA) to support TX Power range and RX sensi-
tivity required for IO-Link Wireless system Single-ended RF interface for external antenna Small form factor (10 mm x 19 mm ) Pre-certified for compliance with the following radio frequency regulations 2.1 Features Supply voltage: 2.0 - 3.6 V Frequency band: 2401 2480MHz Maximum transmission power: 10dBm FCC (USA) IC (Canada) ETSI EN (Europe) 2.2 Application 2.4 GHz low-power IO-Link Wireless systems IO-Link Wireless Device with or without host controller Device products (e.g. sensors or actuators) IO-Link Wireless Device Module 4 n o i t a c i f i t r e C 3 Certification The KE2640MODA1 module is certified to the standards listed in the following table (with IDs where applicable). Certification Body FCC (USA) IC (Canada) EN (Europe) ID Specification Title 47 CFR Part 15 + MPE 2AYYK-2640M1 RSS - 247 Issue 2 + RSS-102 Issue 5 (MPE) 26994-2640M1 ETSI EN 300 328 V2.2.2 n/a 3.1 North America Statements (FCC and IC) Compliance with Federal Communications Commission (FCC) Rules NOTICE:
This device complies with Part 15 of the FCC Rules and with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. NOTICE:
Changes or modifications made to this equipment not expressly approved by KUNBUS GmbH may void the FCC authorization to operate this equipment. Radiofrequency Radiation Exposure Information:
This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body. Digital Device Classification NOTE: This module has been found to comply with the limits for both, a Class A digital device as well as for a Class B digital device, pursuant to Part 15 of the FCC Rules. It is the responsibility of the integrator of this module to define the environmental device classification for the final product. 3.2 FCC and IC Modular Transmitter Instructions Specific Operational Use Conditions This module has been granted Limited Modular Approval for mobile applications. It has been certified for integration into products - by OEM integrators - without additional FCC certifications under the following conditions only:
IO-Link Wireless Device Module 5 n o i t a c i f i t r e C The module integrator should not provide information to the user of the host product regarding how to install or remove this RF module. The user manual for the host product must clearly in-
dicate the operating conditions for the product to ensure compliance with the FCC RF exposure guidelines. If this module is integrated in host products with several transmitters, the host product must be evaluated to comply with FCC and Industry Canada multi-transmitter product procedures. The module integrator must follow the antenna and RF exposure considerations mentioned in the chapters below. The module integrator must also ensure that RF related parameters are not configurable in a way that violates the RF exposure considerations by the customers. The host product must have a label which clearly indicates that this module is contained in the product. The FCC-ID and IC must be referenced. The following or similar labels must be used:
Contains FCC ID: 2AYYK-2640M1 Contains IC:26994-2640M1 . To be authorized as an FCC Part 15 device, the host product may also need to be evaluated against the FCC Part 15B criterias for unintentional radiators. Limited Module Procedures As the module is not equipped with an antenna, the module integrator is responsible to meet the necessary requirements. This document gives the design guidelines for host integration of the reference antennas, which were used for certification. Trace Antenna Designs Not applicable. RF Exposure Considerations The host product manufacturer must ensure that a separation distance of 20 cm or more is maintained between the host products antenna and persons during operation. This should be clearly indicated in the user manual of the host product. If more than one module of this type, or other wireless modules, are integrated in the host product, additional FCC and Industry Canada multi-transmitter product procedures apply and the product must be evaluated according to these requirements. Antennas ries/
antenna/
The module is not equipped with an antenna. The host products maximum RF output power and exposure limits must comply with the FCC regulations. The module complies to the regulations when used with one of the following antennas:
U.FL connector dipole antenna (gain 2.8dBi): https://linxtechnologies.com/wp/product/lpw-se-
OnBoard SMD 2400 Antenna (gain 4.9dBi): https://proantantennas.com/onboard-smd-2400-
Host integrators may use these antennas for their product designs. Other antennas of the same type are also acceptable if the maximum gain including cable loss is not exceeding these limits. This document gives the necessary guidelines for host PCB designs using the referenced antennas. To support different antennas, the module must be configured with the correct antenna gain setting via the host controller software library, that is required for module operation. The antenna gain setting is described in this document. The module integrator must choose the adequate antenna gain setting for his antenna to meet the requirements. It is also the responsibility of the module integrator to ensure that the gain setting is not configurable by the user of the host product. IO-Link Wireless Device Module 6 n o i t a c i f i t r e C Label and Compliance Information The host product using this module must be labeled clearly indicating the contained FCC-ID and IC. These or similar labels must be used:
Contains FCC ID: 2AYYK-2640M1 Contains IC: 26994-2640M1. Test Modes The module supports different test modes on specified test channels. These test modes can be activated via the host controller software library, which is required for the module operation. The following test mode configurations are considered most suitable for compliance testing:
Continuous transmit test mode with random payload (PN9 sequence), IO-Link Wireless power level 31 (max. 10 dBm), transmit frequency 2401 MHz (lowest IO-Link Wireless configuration channel) Continuous transmit test mode with random payload (PN9 sequence), IO-Link Wireless power level 31 (max. 10 dBm), transmit frequency 2480 MHz (highest IO-Link Wireless configuration channel) Additional Testing, Part 15 Subpart B Disclaimer The module itself is not required to be evaluated for FCC Part 15B unintentional radiator requirements. The host product must be evaluated for FCC Part 15B. IO-Link Wireless Device Module 7 n o i t a c i f i c e p S y e K 4 Key Specification The absolute maximum ratings are as follows:
Parameter Supply voltage Input RF level Operating temperature range VESD - Human Body Model (HBM), per ANSI/
ESDA/JEDEC/JS0011 VESD - Charged Device Model (CDM), per JESd22-C1012 Note Nominal Data Min 0V
-40C
-2500V Nominal Data Max 4V 4dBm
+85C 2500V
-750V
-750V 750V 750V All pins RF pins Non-RF pins 1JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process 2JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process The following table gives an overview of the recommended operating conditions. Parameter Supply voltage Nominal Data Min 2.0V Nominal Data Typ 3.3V Nominal Data Max 3.6V Note Operating temperature range -40C
-40C Storage temperature range 2401MHz Frequency band 0 %
Operating Humidity
Power con-
sumption Transmit
Receive Idle Sleep 90mA@10dBm 46mA@0dBm 40mA@-10dBm 37mA@-20dBm 18mA 8mA TBD Transmit power Receive sensitivity Communication protocol Modulation type Communication distance (in-
door) 1
-20dBm
-91dBm (@ 0.3 PEP typ.) IO-Link Wireless GFSK
20m Power ripple should not ex-
ceed 30mV peak to peak
+85C
+85C
2480MHz -
90 % (non-
condens-
ing)
PA on, @3.3V
10dBm LNA on, @3.3V PA/LNA Standby,
@3.3V MCU standby,
@3.3V Programmable
@10dBm
@3.3V 1"Communication distance" is generally influenced by factors such as surrounding environment. This value is just for reference. IO-Link Wireless Device Module 8 Safety Note This product may only be assembled, installed and put into operation by personnel qualified for working in electrostatic protected areas. It is subject to damage by ESD and may only be handled in ESD-protected environments. n o i t a c i f i c e p S y e K IO-Link Wireless Device Module 9 5 Block Diagram If the KE2640MODA1 module is used with the pre-installed firmware, the following block diagram applies. It outlines the rules for the connection of the KE2640MODA1 module to the host controller. i m a r g a D k c o B l IO-Link Wireless Device Module 10 t i u c r i C n o i t a c i l p p A i l a c p y T 6 Typical Application Circuit Set-up including Host CPU Stand-alone Set-up IO-Link Wireless Device Module 11 i t n e m n g s s A n P i 7 Pin Assignment The following table gives an overview of all pin functions:
Pin Name Function Function JTAG_TMS GND JTAG_TCK DIO_3/JTAG_TDO1 Debugging port Ground Debugging port Debugging port DIO_4/JTAG_TDI1 Debugging port 14 DIO_5 SPI_CLK (Input) using pre-installed firmware DEVICE_REQ (Input) DEVICE_RDY (Output) SPI_CS (Input) Voltage supply Ground nRESET (Input active LOW) SPI_MOSI (Input) SPI_MISO (Output) Not connected Not connected Ground External antenna interface if used as SOM Digital I/O2, high drive capability
(8mA) Digital I/O2, high drive capability
(8mA) Digital I/O2, high drive capability
(8mA) Debugging port Ground Debugging port Digital I/O2, high drive capability / De-
bugging port Digital I/O2, high drive capability / De-
bugging port Voltage supply Ground nRESET (Input active LOW) Digital I/O2 / Analog I/O Digital I/O2, high drive capability
(8mA) Digital I/O2, high drive capability
(8mA) Not connected Not connected Ground External antenna interface DIO_0 DIO_1 DIO_2 1 2 3 4 5 6 7 8 9 VCC 10 GND 11 12 13 RESET DIO_7 DIO_6 NC NC 15 16 17 GND ANT 18 1During Debug-Mode this pin is reserved for the programming and is not applicable. 2The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals (e.g. serial interfaces, timers) to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable and have a programmable pullup and pulldown function. If configured as an output, pins can function as either push-pull or open-drain. IO-Link Wireless Device Module 12 e r a w m r i F 8 Firmware The pre-installed firmware is designed for using the KE2640MODA1 module in combination with an external host controller for the user's application. Although the KE2640MODA1 module can also be used as system on module (SOM) where the user implements the application directly on the KE2640MODA1 module, the following subchapters describe only the function of the pre-
installed firmware. 8.1 Pre-installed Firmware The module is delivered with a pre-installed firmware containing the IO Link Wireless protocol stack for the IO-Link Wireless-Device. A detailed description of the protocol stack can be found in the IO-Link Wireless System Extensions v1.1 which can be downloaded from the IO-Link Homepage: https://io-link.com. The firmware includes the implementation of the physical layer (PL), data link layer (DL), System Management (SM), indexed service data unit transfer layer (ISDU), event generation and transfer layer (EVENT) and process data transfer layer (PD). The other parts of the protocol stack like application layer containing the Data Storage (DS), Process Data (PD) and ISDU Handling shall be located on the host controller. All services are accessible via serial peripheral interface (SPI) or internally using the provided KUNBUS Wireless-Device-SPI-Library on the host controller. 8.2 Host Interface For the connection to the host controller the KE2640MODA1 module uses a 4-wire SPI with two additional handshake signals (DEVICE REQ and DEVICE_RDY). The KE2640MODA1 module operates as SPI Slave with a maximum data rate of 4Mbps in this configuration. Before running a communication protocol, all pins at the host should be initialized according to the configuration listed in the following table. Pin Name nRESET DEVICE_RDY DEVICE_REQ SPI_CS Configuration Output Input Output (handled as interrupt on rising edge at KE2640MODA1 module side) Output IO-Link Wireless Device Module 13 After the pins are configured, the IO-Link Wireless Module nRESET pin should be set to LOW to perform a reset of the KE2640MODA1 module. This is an important step as it is required for the synchronization of the state machines of both controllers. After the KE2640MODA1 module is set to the reset state, the SPI periphery should be initialized with the following parameters at the host controller. e r a w m r i F SPI Parameter SPI Mode SPI Duplex Data Size Clock Polarity Clock Phase Bit Order Chip Select Value SPI Master Full 8 Bit Low First Edge MSB First Manual The SPI signals MOSI and MISO shall update on falling edges of the CLK signal and remain stable on rising edges. They are captured on rising edges of the CLK signal. After initialization, the nRESET shall be set to HIGH by the host controller. This step leads to the initialization of the communication between the host and the KE2640MODA1 module. After the host is ready, the DEVICE_REQ pin is set HIGH by the host to trigger the KE2640MODA1 module. The DEVICE_RDY pin is set to HIGH by the KE2640MODA1 module after the initialization is finished. The purpose of this procedure is to prepare the SPI Slave for the transaction. The KE2640MODA1 module performs the initialization steps in parallel to the host. It should be considered that the initialization time of the KE2640MODA1 module and the host are not equal. In a normal case, a single SPI transaction proceeds as shown in the following figure. After each SPI transfer, incoming messages should be processed by the host and the KE2640MODA1 module. If the host has to send data to the KE2640MODA1 module it shall set the DEVICE_REQ pin to HIGH (T1) and wait until the DEVICE_RDY pin is set to HIGH (T2) by the KE2640MODA1 module. Afterwards the host can start to transmit the data. After the transmission has started the DEVICE_REQ pin shall be set to LOW (T3). IO-Link Wireless Device Module 14 The DEVICE_RDY pin will be set to LOW by the KE2640MODA1 when it starts to process the message (T4). Then the host may set the next DEVICE_REQ and wait again for the DEVICE_RDY signal. In the case data has to be transmitted by the KE2640MODA1 module and no DEVICE_REQ is coming from the host, the KE2640MODA1 module will set the DEVICE_RDY pin to HIGH. Then the host shall initiate SPI communication as soon as possible even if no DEVICE_REQ is pending. If multiple transactions are caused by the host a signaling as shown in the following figure occurs. If the same is caused by the KE2640MODA1 module the only difference is an absence of the activation of the DEVICE_REQ pin. e r a w m r i F IO-Link Wireless Device Module 15 i g n i t t e S n a G a n n e t n A 9 Antenna Gain Setting This module supports the setting of the gain of the connected antenna. The setting mechanism is accessible via the host controller software library, that is required for module operation. The gain setting mechanism reduces the maximum module output power of 10 dBm by the amount of the selected antenna gain in 1dB steps. For the certification of the module with its reference antennas, the following antenna gain settings were used:
Antenna U.FL connector dipole antenna https://linxtechnologies.com/wp/product/lpw-series/
OnBoard SMD 2400 Antenna https://proantantennas.com/onboard-smd-2400-antenna/
Maximum Antenna Gain 2.8 dBi Module Gain Setting Parameter 3 dBi 4.9 dBi 5 dBi Note: The host integrator must use the correct gain setting for the applied antenna design to ensure compliance with the prescribed emission limits. The host integrator must also ensure that this antenna gain cannot be configured by the user of the host product. IO-Link Wireless Device Module 16 10 Layout Guidelines s e n i l i e d u G t u o y a L 10.1 PCB Specification PCB Stack-Up The following figure shows an example stack-up for a KE2640MODA1 design. The user can adapt the layer stack-up according to his own requirements. In this case the correct impedance of 50 has to be ensured. Ideally this is done in cooperation with the selected PCB manufacturer. With this example stack-up, the width of a 50 track is about 448m. For 100 differential-pair lines the width is 200m with 150m spacing. IO-Link Wireless Device Module 17 KE2640MODA1 Module 10.2 Layout Layer 1 - Top Layer An example layout is shown in the following by means of a KUNBUS breakout board. s e n i l i e d u G t u o y a L On this layer the module is connected to its periphery. The unused areas are filled with copper that is connected to GND potential. The GND pins of the module are connected directly to this GND plane to receive best possible GND connection with low impedance. There is a copper-free area below the module to avoid short-circuits with non-isolated parts on the bottom side of the module. Note: The non-isolated parts on the bottom side must not be connected in order to avoid short circuits. We recommend to protect the main board by solder resist over the whole surface except at the here defined contacts. The trace to the antenna connector has a width of 448m to achieve the required impedance of 50. Layer 2 - GND This layer is completely used as GND signal plane for all high frequency signals. IO-Link Wireless Device Module 18 no copper in this areaGND plane (whole grey area)448m Layer 3 Signal s e n i l i e d u G t u o y a L This layer is used for supply planes (3.3V and GND). IO-Link Wireless Device Module 19 GND plane3.3 V plane Layer 4 - Bottom Layer s e n i l i e d u G t u o y a L This layer is used for routing signals. Unused areas are filled with GND plane. IO-Link Wireless Device Module 20 GND plane 11 Footprint Indications 11.1 Top View The following figures show the view on the top side of the module:
i s n o i t a c d n I t n i r p t o o F IO-Link Wireless Device Module 21 11.2 Dimensions The outline dimensions of the module are as shown below. Top View i s n o i t a c d n I t n i r p t o o F Side View Suggested Land Pattern, all dimensions in mm. IO-Link Wireless Device Module 22 s l i a t e D t c a t n o C 12 Contact Details Your points of contact for all questions related to development, delivery, support and quotations are:
Address Technical Support Sales KUNBUS GmbH Heerweg 15C 73770 Denkendorf Germany E-Mail: support@kunbus.com Tel.: +49 (0)711 300 20 678 E-Mail: info@kunbus.com For any request, please use the following reference:
Article Name: IOLW Device Module Order No.: 100335 IO-Link Wireless Device Module 23