Data Sheet IO-Link Wireless Master Module KE2640MODA2 DO0401R01 4/22/2021 KUNBUS GmbH Table of Contents Table of Contents 1 Disclaimer .................................................................................................................................................... 2 Overview....................................................................................................................................................... 2.1 Features................................................................................................................................................ 2.2 Application ............................................................................................................................................ 3 Certification.................................................................................................................................................. 3.1 North America Statements (FCC and IC) ............................................................................................. 3.2 FCC and IC Modular Transmitter Instructions ...................................................................................... 4 Key Specification......................................................................................................................................... 5 Block Diagram ............................................................................................................................................. 6 Typical Application Circuit ......................................................................................................................... 10 7 Pin Assignment ........................................................................................................................................... 11 8 Firmware....................................................................................................................................................... 12 9 Host Interface............................................................................................................................................... 13 10 Antenna Gain Setting .................................................................................................................................. 15 11 Layout Guidelines ....................................................................................................................................... 16 11.1 PCB Specification ................................................................................................................................. 16 11.2 Layout ................................................................................................................................................... 17 12 Footprint Indications................................................................................................................................... 20 12.1 Top View............................................................................................................................................... 20 12.2 Dimensions ........................................................................................................................................... 21 13 Contact Details ............................................................................................................................................ 22 3 4 4 4 5 5 5 8 9 ii IO-Link Wireless Master Module i r e m a c s D i l 1 Disclaimer 2021 KUNBUS GmbH, Denkendorf (Germany) The contents of this document have been prepared by KUNBUS GmbH with the utmost care. Due to technical developments, KUNBUS GmbH reserves the right to change or replace the contents of this document without prior notice. You can always obtain the latest version of the user manual at our homepage: www.kunbus.de KUNBUS GmbH shall be liable exclusively to the extent specified in the General Terms and Conditions (www.kunbus.de/agb.html). The contents published in this document are protected by copyright. Any reproduction or use for the users in-house requirements is permitted. Reproduction or use for other purposes is not permitted without the express, written consent of KUNBUS GmbH. Contraventions shall result in compensation for damages. Trademark Protection KUNBUS is a registered trademark of KUNBUS GmbH. IO-Link Wireless Master Module 3 2 Overview KE2640MODA2 is an IO-Link Wireless transceiver module that supports physical layer and data link layer services of the IO-Link Wireless Master as specified in the IO-Link Wireless System Extensions v1.1. The module is capable to serve up to 8 IO-Link Wireless-Devices as one track with a cycle time of 1.664ms. i w e v r e v O Integrates two TI Low Energy Wireless MCU CC2640R2F to support all physical layer services of IO-Link Wireless Master With power amplifier (PA)/low noise amplifier (LNA) to support TX Power range and RX sensi-
tivity required for IO-Link Wireless system SPI interface for the communication with a superior CPU system, in which the higher layers of the IO-Link Wireless specification are implemented Single-ended RF interface for external antenna Small form factor (20 mm x 24 mm ) Pre-certified for compliance with the following radio frequency regulations 2.1 Features Supply voltage: 2.5 - 3.3 V Frequency band: 2401 2480MHz Maximum transmission power: 10dBm FCC (USA) IC (Canada) ETSI EN (Europe) 2.2 Application Single or multi track IO-Link Wireless Master IO-Link Wireless Master Module 4 n o i t a c i f i t r e C 3 Certification The KE2640MODA2 module is certified to the standards listed in the following table (with IDs where applicable). Certification Body FCC (USA) IC (Canada) EN (Europe) Specification Title 47 CFR Part 15 + MPE RSS - 247 Issue 2 + RSS-102 Issue 5 (MPE) ETSI EN 300 328 V2.2.2 ID 2AYYK-2640M2 26994-2640M2 n/a 3.1 North America Statements (FCC and IC) Compliance with Federal Communications Commission (FCC) Rules NOTICE:
This device complies with Part 15 of the FCC Rules and with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. NOTICE:
Changes or modifications made to this equipment not expressly approved by KUNBUS GmbH may void the FCC authorization to operate this equipment. Radiofrequency Radiation Exposure Information:
This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body. Digital Device Classification NOTE: This module has been found to comply with the limits for both, a Class A digital device as well as for a Class B digital device, pursuant to Part 15 of the FCC Rules. It is the responsibility of the integrator of this module to define the environmental device classification for the final product. 3.2 FCC and IC Modular Transmitter Instructions Specific Operational Use Conditions This module has been granted Limited Modular Approval for mobile applications. It has been certified for integration into products - by OEM integrators - without additional FCC certifications under the following conditions only:
IO-Link Wireless Master Module 5 n o i t a c i f i t r e C The module integrator should not provide information to the user of the host product regarding how to install or remove this RF module. The user manual for the host product must clearly in-
dicate the operating conditions for the product to ensure compliance with the FCC RF exposure guidelines. If this module is integrated in host products with several transmitters, the host product must be evaluated to comply with FCC and Industry Canada multi-transmitter product procedures. The module integrator must follow the antenna and RF exposure considerations mentioned in the chapters below. The module integrator must also ensure that RF related parameters are not configurable in a way that violates the RF exposure considerations by the customers. The host product must have a label which clearly indicates that this module is contained in the product. The FCC-ID and IC must be referenced. The following or similar labels must be used:
Contains FCC ID: 2AYYK-2640M2 Contains IC:26994-2640M2 . To be authorized as an FCC Part 15 device, the host product may also need to be evaluated against the FCC Part 15B criterias for unintentional radiators. Limited Module Procedures As the module is not equipped with an antenna, the module integrator is responsible to meet the necessary requirements. This document gives the design guidelines for host integration of the reference antennas, which were used for certification. Trace Antenna Designs Not applicable. RF Exposure Considerations The host product manufacturer must ensure that a separation distance of 20 cm or more is maintained between the host products antenna and persons during operation. This should be clearly indicated in the user manual of the host product. If more than one module of this type, or other wireless modules, are integrated in the host product, additional FCC and Industry Canada multi-transmitter product procedures apply and the product must be evaluated according to these requirements. Antennas ries/
antenna/
The module is not equipped with an antenna. The host products maximum RF output power and exposure limits must comply with the FCC regulations. The module complies to the regulations when used with one of the following antennas:
U.FL connector dipole antenna (gain 2.8dBi): https://linxtechnologies.com/wp/product/lpw-se-
OnBoard SMD 2400 Antenna (gain 4.9dBi): https://proantantennas.com/onboard-smd-2400-
Host integrators may use these antennas for their product designs. Other antennas of the same type are also acceptable if the maximum gain including cable loss is not exceeding these limits. This document gives the necessary guidelines for host PCB designs using the referenced antennas. To support different antennas, the module must be configured with the correct antenna gain setting via the host controller software library, that is required for module operation. The antenna gain setting is described in this document. The module integrator must choose the adequate antenna gain setting for his antenna to meet the requirements. It is also the responsibility of the module integrator to ensure that the gain setting is not configurable by the user of the host product. IO-Link Wireless Master Module 6 n o i t a c i f i t r e C Label and Compliance Information The host product using this module must be labeled clearly indicating the contained FCC-ID and IC. These or similar labels must be used:
Contains FCC ID: 2AYYK-2640M2 Contains IC: 26994-2640M2. Test Modes The module supports different test modes on specified test channels. These test modes can be activated via the host controller software library, which is required for the module operation. The following test mode configurations are considered most suitable for compliance testing:
Continuous transmit test mode with random payload (PN9 sequence), IO-Link Wireless power level 31 (max. 10 dBm), transmit frequency 2401 MHz (lowest IO-Link Wireless configuration channel) Continuous transmit test mode with random payload (PN9 sequence), IO-Link Wireless power level 31 (max. 10 dBm), transmit frequency 2480 MHz (highest IO-Link Wireless configuration channel) Single frequency packet mode (normal IO-Link Wireless operational payload), IO-Link Wire-
less power level 31 (max. 10 dBm), transmit frequency 2403 MHz (lowest IO-Link Wireless data channel) or 2478 MHz (highest IO-Link Wireless data channel) Additional Testing, Part 15 Subpart B Disclaimer The module itself is not required to be evaluated for FCC Part 15B unintentional radiator requirements. The host product must be evaluated for FCC Part 15B. IO-Link Wireless Master Module 7 n o i t a c i f i c e p S y e K 4 Key Specification The absolute maximum ratings are as follows:
Parameter Supply voltage Input RF level Operating temperature range VESD - Human Body Model (HBM), per ANSI/
ESDA/JEDEC/JS0011 VESD - Charged Device Model (CDM), per JESd22-C1012 Note Nominal Data Min 0V
-30C
-2000V Nominal Data Max 3.7V 10 dBm
+85C 2000V
-750V
-750V 750V 750V All pins RF pins Non-RF pins 1JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process 2JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process The following table shows an overview of the recommended operating conditions. Parameter Supply voltage Nominal Data Min 2.5V Nominal Data Typ 3.0V Nominal Data Max 3.3V Note Operating temperature range -30C
-40C Storage temperature range 2400MHz Frequency band
Power con-
sumption Transmit Receive Idle
66mA@10dBm 60mA@0dBm 58mA@-10dBm 25mA 8mA Transmit power Receive sensitivity Communication protocol Modulation type Communication distance (in-
door) 1
-18dBm
-91dBm (@ 0.3 PEP typ.) IO-Link Wireless 1-Mbps GFSK
20m Power ripple should not ex-
ceed 20mV peak to peak
+85C
+150C
2480MHz -
PA on, @3.3V 10dBm
LNA on, @3.3V PA/LNA Standby,
@3.3V Programmable
@10dBm
@3.3V 1"Communication distance" is generally influenced by factors such as surrounding environment. This value is just for reference. Safety Note This product may only be assembled, installed and put into operation by personnel qualified for working in electrostatic protected areas. It is subject to damage by ESD and may only be handled in ESD-protected environments. IO-Link Wireless Master Module 8 5 Block Diagram The block diagram outlines the main functional blocks, their interconnections as well as the external connections. i m a r g a D k c o B l Two RF transceivers of the type CC2640 from Texas Instruments are integrated in this module. It is specified here that only one of the transceivers is used for transmit mode. The second transceiver is only used to support the receive mode of the module. The symmetric RF path design in combination with an RF switch ensures that both transceivers show the same behavior in receive mode. It also ensures that only one RF path can be active at a time. IO-Link Wireless Master Module 9 6 Typical Application Circuit t i u c r i C n o i t a c i l p p A i l a c p y T IO-Link Wireless Master Module 10 i t n e m n g s s A n P i 7 Pin Assignment The following table gives an overview of all pin functions:
Pin Name GND 1 GND 2 MS_DIO_4 3 MS_JTAG_TMSC 4 MS_JTAG_TCKC 5 MS_DIO_5 6 MS_DIO_6 7 SYNC 8 Function Ground Ground Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Note
Debug MS 0 cJTAG TMSC MS1 cJTAG TCKC MS1 Debug MS 1 Debug MS 2 Sync: SubCycle clk (T=1664s) GND 9 10 MS_nRESET Ground Digital Input 11 MM_nRESET Digital Input 12 GND nCS 13 14 MISO 15 MOSI 16 CLK 17 VDD 18 GND 19 MM_JTAG_TCKC 20 MM_JTAG_TMSC 21 REQ 22 READY 23 FREQ_READY 24 GND 25 MM_DIO_1 26 MM_DIO_0 27 GND 28 GND 29 ANT 30 GND Ground Digital I/O Digital I/O Digital I/O Digital I/O Power Ground Digital I/O Digital I/O Digital IN Digital OUT Digital I/O Ground Digital I/O Digital I/O Ground Ground RF I/O Ground 1Reduced pin count JTAG (IEEE 1149.7) Output if module configured as Sync Master Input with pull-down if module is slave Master
Reset MS, active low, connected internally to VDD via pull-up resistor Reset MM, active low, connected internally to VDD via pull-up resistor
SPI CS, active low SPI MISO SPI MOSI SPI CLK 2.5V to 3.3V supply
cJTAG TCKC MM1 cJTAG TMSC MM1 MM shall start SPI com for new request MM is ready to receive new request over SPI Sync signal for freq. hopping-table
- as Input with pull-up during freq sync phase
- as output with open-drain after freq sync
Debug MM 1 Debug MM 0
External antenna Interface, 50
IO-Link Wireless Master Module 11 e r a w m r i F 8 Firmware The module is delivered with a pre-installed firmware containing parts of a low-layer IOLink Wireless protocol stack for the IO-Link Wireless-Master. A detailed description of the protocol stack can be found in the IO-Link Wireless System Extensions v1.1 which can be downloaded from the IO-Link Homepage: https://io-link.com. The firmware includes the implementation of the physical layer (PL) and data link layer (DL). The other parts of the protocol stack like application layer (AL) and system management (SM) shall be located on the host controller. All services of DL and PL are accessible via SPI using the KUNBUS Wireless-Master-Stack-Library on the host controller. IO-Link Wireless Master Module 12 9 Host Interface For the connection to the host controller the KE2640MODA2 uses a 4-wire serial peripheral interface (SPI) with two additional handshake signals (REQ and READY). The KE2640MODA2 operates as SPI master with a maximum data rate of 12Mbps in this configuration. If more than one KE2640MODA2 is connected to one host controller, two additional signals are required for synchronization of the KE2640MODA2 (SYNC and FREQ_READY). These signals interconnect the KE2640MODA2 modules but are not required to be connected to the host controller. e c a f r e t n I t s o H READY REQ nCS, CLK, MISO, MOSI SYNC FREQ_READY Indication from the KE2640MODA2 to the host controller that it may initi-
ate a transfer request (REQ). Indication from the host controller to the KE2640MODA2 that it shall start a SPI communication to receive a new request. Standard 4-wire SPI interface with KE2640MODA2 as master and a maximum data rate of 12Mbps. This pin is used for synchronization of multiple KE2640MODA2. One module generates a rectangular output signal with a period of 1.664ms according to the IO-Link Wireless Wsubcycle duration. This signal is used as input by the other KE2640MODA2. This pin is used for synchronization of multiple KE2640MODA2. One module generates a short output pulse each time the frequency hopping algorithm is restarted. This signal is used as input by the other KE2640-
MODA2 The typical behavior of the SPI interface and the additional handshake signals are shown in the following figure. IO-Link Wireless Master Module 13 e c a f r e t n I t s o H In this configuration, the following occurs during idle periods:
CLK is forced high nCS is forced high pad The transmit data line MOSI is arbitrarily forced low As the KE2640MODA2 is configured as a SPI master, the KE2640MODA2 enables the CLK If valid data has to be transmitted, the start of transmission is triggered by the nCS master signal going low. The master MOSI output pad is enabled. After the next half CLK period, both master and slave data are enabled onto their respective transmission lines. At the same time, CLK is enabled with a falling-edge transition. Data is then captured on the rising edges and propagated on the falling edges of the CLK signal. See example in the next figure. The nCS pin remains in its active low state until the final bit of the last word is captured and then returns to its IDLE state. This means nCS remains low between words of a continuous transmission until this transmission ends. IO-Link Wireless Master Module 14 i g n i t t e S n a G a n n e t n A 10 Antenna Gain Setting This module supports the setting of the gain of the connected antenna. The setting mechanism is accessible via the host controller software library, that is required for module operation. The gain setting mechanism reduces the maximum module output power of 10dBm by the amount of the selected antenna gain in 1dB steps. For the certification of the module with its reference antennas, the following antenna gain settings were used:
Antenna U.FL connector dipole antenna https://linxtechnologies.com/wp/product/lpw-series/
OnBoard SMD 2400 Antenna https://proantantennas.com/onboard-smd-2400-antenna/
Maximum Antenna Gain 2.8 dBi Module Gain Setting Parameter 3 dBi 4.9 dBi 5 dBi Note: The host integrator must use the correct gain setting for the applied antenna design to ensure compliance with the prescribed emission limits. The host integrator must also ensure that this antenna gain cannot be configured by the user of the host product. IO-Link Wireless Master Module 15 11 Layout Guidelines s e n i l i e d u G t u o y a L 11.1 PCB Specification PCB Stack-Up The following figure shows an example stack-up for a KE2640MODA2 design. The user can adapt the layer stack-up according to his own requirements. In this case the correct impedance of 50 has to be ensured. Ideally this is done in cooperation with the selected PCB manufacturer. With this example stack-up, the width of a 50 track is about 448m. For 100 differential-pair lines the width is 200m with 150m spacing. IO-Link Wireless Master Module 16 KE2640MODA2 Module 11.2 Layout Layer 1 - Top Layer An example layout is shown in the following by means of a KUNBUS breakout board. s e n i l i e d u G t u o y a L On this layer the module is connected to its periphery. The unused areas are filled with copper that is connected to GND potential. The GND pins of the module are connected directly to this GND plane to receive best possible GND connection with low impedance. A keep-out area is not required due to an isolation layer on the bottom side of the module. The trace to the antenna connector has a width of 448m to achieve the required impedance of 50. Layer 2 - GND This layer is completely used as GND signal plane for all high frequency signals. IO-Link Wireless Master Module 17 GND plane (whole grey area)448m s e n i l i e d u G t u o y a L Layer 3 - Signal This layer is used for supply planes (3.3V and GND). IO-Link Wireless Master Module 18 GND plane3.3 V plane Layer 4 - Bottom Layer s e n i l i e d u G t u o y a L This layer is used for routing signals. Unused areas are filled with GND plane. IO-Link Wireless Master Module 19 GND plane 12 Footprint Indications 12.1 Top View The following figures show the view on the top side of the module:
i s n o i t a c d n I t n i r p t o o F IO-Link Wireless Master Module 20 12.2 Dimensions The outline dimensions of the module are as shown below. Top View i s n o i t a c d n I t n i r p t o o F Side View Suggested Land Pattern, all dimensions in mm. IO-Link Wireless Master Module 21 s l i a t e D t c a t n o C 13 Contact Details Your points of contact for all questions related to development, delivery, support and quotations are:
Address Technical Support Sales KUNBUS GmbH Heerweg 15C 73770 Denkendorf Germany E-Mail: support@kunbus.com Tel.: +49 (0)711 300 20 678 E-Mail: info@kunbus.com For any request, please use the following reference:
Article Name: IOLW Master Module Order No.: 100332 IO-Link Wireless Master Module 22 KUNBUS GmbH IO-Link Wireless Master Module 23