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Reference Antenna Info A | Users Manual | 427.60 KiB | March 11 2017 | |||
1 2 3 4 |
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Reference Antenna Info B | Users Manual | 224.75 KiB | March 11 2017 | |||
1 2 3 4 |
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Users Manual | Users Manual | 1.42 MiB | December 04 2019 | |||
1 2 3 4 |
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Users Manual Revised v0 4 | Users Manual | 1.94 MiB | June 05 2016 / August 05 2016 | |||
1 2 3 4 | Operational Description | December 04 2019 | ||||||
1 2 3 4 | External Photos | December 04 2019 | ||||||
1 2 3 4 | Cover Letter(s) | December 04 2019 | ||||||
1 2 3 4 | Cover Letter(s) | December 04 2019 | ||||||
1 2 3 4 | Cover Letter(s) | March 11 2017 | ||||||
1 2 3 4 | Test Setup Photos | March 11 2017 | ||||||
1 2 3 4 | Test Report | March 11 2017 | ||||||
1 2 3 4 | Cover Letter(s) | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | Cover Letter(s) | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | Internal Photos | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | ID Label/Location Info | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | Cover Letter(s) | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | Test Setup Photos | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | Test Report | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | Cover Letter(s) | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | RF Exposure Info | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | RF Exposure Info | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | Test Setup Photos | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | Test Report | June 05 2016 / August 05 2016 | ||||||
1 2 3 4 | Test Report | June 05 2016 / August 05 2016 |
1 2 3 4 | Reference Antenna Info A | Users Manual | 427.60 KiB | March 11 2017 |
915 MHz PCB Notch Antenna Datasheet 902 MHz - 928 MHz PCB Notch -1 dB Antenna SPECIFICATIONS Specification Peak Gain Average Gain Impedance Type Polarization VSWR Frequency Size Operating Temp Value
-1.5 dBi
> - 3.7 dBi 50 ohms, Nominal PCB Trace Notch Linear Vertical 3.01, Maximum 902 - 928MHz 60 16 mm
-40C to +85C Table 1 Specifications The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0016-R0.1 Copyright 2017 LSR Page 1 of 3 MATCHING CURCUIT 915 MHz PCB Notch Antenna Datasheet Components R13 = NP C16 = 13nH 2% MFG PN: LQW15AN13NG80D R19 = NP The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0248-R0.1 Copyright 2017 LSR Page 2 of 3 915 MHz PCB Notch Antenna Datasheet CONTACTING LS RESEARCH Headquarters Website Technical Support Sales Contact LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: 1(262) 375-4400 Fax: 1(262) 375-4248 www.lsr.com forum.lsr.com sales@lsr.com The information in this document is provided in connection with LS Research (hereafter referred to as LSR) products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSRS TERMS AND CONDITIONS OF SALE LOCATED ON LSRS WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. LSR does not make any commitment to update the information contained herein. Unless specifically provided otherwise, LSR products are not suitable for, and shall not be used in, automotive applications. LSRs products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0248-R0.1 Copyright 2017 LSR Page 3 of 3
1 2 3 4 | Users Manual | Users Manual | 1.42 MiB | December 04 2019 |
A Datasheet LoRa/Bluetooth Low Energy (BLE) Module Part Numbers: RM186 and RM191 Version 1.10 RM1xx LoRa/BLE Modules Datasheet REVISION HISTORY Version Date 19 May 2016 20 May 2016 11 Aug 2016 2 Nov 2016 01 Feb 2017 17 Oct 2017 3 Nov 2017 20 Mar 2018 29 Oct 2018 14 Feb 2019 28 Mar 2019 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 Notes Initial version Updated SIG section with URL to listing Changed Hardware Integration Guide to Datasheet Updated section numbers Updated to include BLE Peripheral Mode Added section RM1xx VSP Service and Modes. Notes to clarify that JTAG is required when flashing between central and peripheral firmware. Updated Mechanical Details to indicate pin 1. Fix Pin 7 in Pin Definitions Table to Pull Down Updated template; added Australia certification info; replaced BTv4.0 with BTv4.1 Updated logos and URLs Added new antenna to FCC regulatory section Contributor(s) Approver Jonathan Kaye Jonathan Kaye Sue White Sue White Jonathan Kaye Raj Khatri Sue White Raj Khatri Maggie Teng Jonathan Kaye Sue White Maggie Teng Jonathan Kaye https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions Copyright 2019 Laird. All Rights Reserved 2 Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet CONTENTS 1 2 3 4 Overview and Key Features ................................................................................................................................................ 5 1.1 Features and Benefits................................................................................................................................................. 5 Application Areas ....................................................................................................................................................... 5 1.2 Specifications ...................................................................................................................................................................... 6 Hardware Specifications ..................................................................................................................................................... 9 Block Diagram and Pin-out ......................................................................................................................................... 9 3.1 3.2 Pin Definitions .......................................................................................................................................................... 10 Electrical Specifications ............................................................................................................................................ 12 3.3 3.3.1 Absolute Maximum Ratings ............................................................................................................................. 12 3.3.2 Recommended Operating Parameters ............................................................................................................ 12 nAutoRUN Pin and Operating Modes .............................................................................................................. 14 3.3.3 3.3.4 LoRa Output Power and Current Consumption vs Vcc .................................................................................... 14 3.3.5 LoRa Receive Sensitivity vs Data Rate ............................................................................................................. 15 BLE Power Consumption ................................................................................................................................. 16 3.3.6 Functional Description ...................................................................................................................................................... 19 4.1 Power Management (includes brown-out and power on reset) .............................................................................. 19 Clocks and Timers ..................................................................................................................................................... 20 4.2 4.2.1 Clocks ............................................................................................................................................................... 20 4.2.2 Timers .............................................................................................................................................................. 20 4.3 RF .............................................................................................................................................................................. 20 4.4 UART Interface ......................................................................................................................................................... 20 SPI Bus ...................................................................................................................................................................... 21 4.5 4.6 I2C Interface ............................................................................................................................................................. 22 4.7 General Purpose I/O, ADC and PWM/FREQ ............................................................................................................. 22 4.7.1 GPIO ................................................................................................................................................................. 22 4.7.2 ADC .................................................................................................................................................................. 22 4.7.3 PWM and FREQ Signal Output on up to Two SIO Pins ..................................................................................... 22 nRESET Pin ................................................................................................................................................................ 23 4.8 4.9 nAutoRUN Pin........................................................................................................................................................... 23 RM1xx VSP Service and Modes ................................................................................................................................ 23 4.10 4.11 Two-Wire SWD Programming/Debug Interface ....................................................................................................... 24 4.12 RM1xx on-board chip antenna characteristics ......................................................................................................... 25 https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions Copyright 2019 Laird. All Rights Reserved 3 Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 5 Hardware Integration Suggestions .................................................................................................................................... 25 5.1 Circuit ....................................................................................................................................................................... 25 PCB Layout on Host PCB General .......................................................................................................................... 27 5.2 5.2.1 BLE Chip Antenna Keep-out on Host PCB ........................................................................................................ 27 5.2.2 Antenna Keep-out and Proximity to Metal or Plastic ...................................................................................... 28 5.3 LoRa External Antenna Integration with RM1xx ...................................................................................................... 29 6 Mechanical Details ............................................................................................................................................................ 29 RM1xx Mechanical Details ....................................................................................................................................... 29 6.1 6.2 Host PCB Land Pattern and Antenna Keep-out for RM1xx....................................................................................... 30 7 Application Note for Surface Mount Modules .................................................................................................................. 31 Introduction ............................................................................................................................................................. 31 7.1 Shipping ................................................................................................................................................................................. 31 7.2 Reflow Parameters ................................................................................................................................................... 32 FCC and IC Regulatory Statements .................................................................................................................................... 33 8 8.1 Power Exposure Information ................................................................................................................................... 34 OEM Responsibilities ............................................................................................................................................................. 34 9 CE Regulatory .................................................................................................................................................................... 38 9.1 Antenna Information ................................................................................................................................................ 38 EU Declarations of Conformity ..................................................................................................................................... 38 10 10.1 RM186-SM ................................................................................................................................................................ 38 11 Ordering Information.................................................................................................................................................... 40 General Comments .................................................................................................................................................. 40 11.1 12 Bluetooth SIG Qualification .......................................................................................................................................... 40 12.1 Overview .................................................................................................................................................................. 40 12.2 Additional Assistance ............................................................................................................................................... 41 https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions Copyright 2019 Laird. All Rights Reserved 4 Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 1 OVERVIEW AND KEY FEATURES This Datasheet describes both the RM186 (868 MHz band for EU) and RM191 (915 MHz band for US). The differences are outlined in the radio specifications. Every RM1xx Series module is designed to enable OEMs to add a long range LoRa radio link and either Central OR Peripheral mode Bluetooth Low Energy (BLE) to small, portable, power-conscious devices. The RM1xx modules are enabled with Lairds smart BASIC, an event-driven programming language that enables OEMs to make their product development quicker and simpler, significantly reducing time to market. smartBASIC enables customers to develop a complete embedded application inside the compact RM1xx hardware, connecting to a wide array of external sensors via its I2C, SPI, UART, ADC, or GPIO interfaces. Based on the world-leading Nordic Semiconductor nRF51822 (BLE) and Semtech Sx1272 (LoRa) chipsets, the RM1xx modules provide ultra-low power consumption with outstanding wireless range using the LoRa radio link and local BLE connections via three dBm of transmit power. This document should be read in conjunction with the smart BASIC user manual. Note:
This information in this document is subject to change. Please contact Laird to obtain the most recent version of this document https://connectivity.lairdtech.com/resources/support. 1.1 Features and Benefits smartBASIC programming language Bluetooth v4.1 Central OR Peripheral Mode On-board BLE chip antenna U.FL for external LoRa antenna Bluetooth SIG Listed BLE Programmable TX power +3 dBm to -20 dBm BLE TX whisper mode (-30 dBm, -55 dBm) BLE RX sensitivity: -91 dBm Ultra-low power consumption BLE TX: 12.7 mA peak (at +3 dBm @Vcc=3.3V) (See Note 4 in the Compact footprint Long range LoRa range up to 15 km Power Consumption section) BLE RX: 11.9 mA peak (@Vcc=3.3V See Note 4 in the Power Consumption section) Standby Doze: 4.2 uA (typical) Deep Sleep: 750 nA (See Note 4 in the Power Consumption section) UART, GPIO, ADC, PWM FREQ output, TIMERS, I2C, and SPI interfaces Fast time-to-market FCC/IC (RM191-SM), CE (RM186-SM) No external components required 1.2 Application Areas Public or private networks Irrigation/Agriculture Parking Lighting Asset tracking Tank monitoring Smart Home smoke alarms, heating, Access control security Any long range, battery Industrial automation factory powered sensor application https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions Copyright 2019 Laird. All Rights Reserved 5 Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Feature Implementation RM1xx LoRa/BLE Modules Datasheet 2 SPECIFICATIONS Table 1: Specifications Categories LoRa Wireless Specification LoRa Frequency Maximum Transmit Power Setting Minimum Transmit Power Setting Receive Sensitivity Range Raw Data Rates
(over the air) Bluetooth (BLE) Frequency Maximum Transmit Power Setting Minimum Transmit Power Setting TX Whisper Mode 1 Transmit Power TX Whisper Mode 2 Transmit Power Receive Sensitivity
(0.1% BER) Link Budget Range TX Whisper Modes Range
(TX Whisper Mode 2) Raw Data Rates Total UART GPIO BLE Wireless Specification Host Interface and Peripherals LoRaWAN 1.01 (End Device) RM191 902-928MHz 865-870 MHz RM186 RM191 15.5 dBm 13.5 dBm RM186 1.5 dBm RM191 (BW 500 kHz SF 12) RM186 (BW 125kHz SF 12)
-126 dBm
-134 dBm Up to 15 km in free space 250 bps 50 kbps 980 bps 21.9kbps V4.1 Central OR Peripheral Mode 2.402 - 2.480 GHz RM186 RM191 3 dBm (into -1.5 dBi chip antenna)
-20 dBm (in four dB steps) with smartBASIC command
-16 dBm
-12 dBm
-8 dBm
-4 dBm 0 dBm
-30 dBm (min.) with smartBASIC command
-55 dBm (min.) with smartBASIC command
-91 dBm typical 95 dB (@ 1 Mbps) Up to 100 m in free space Range reduction feature with TX Whisper modes with smartBASIC command.
<~30 cm 1 Mbps (over the air) 14 x Multifunction I/O lines TX, RX, CTS, RTS DCD, RI, DTR, DSR, CTS, RTS (Note 1) Default 115200, n, 8, 1 From 1,200 to 460800 bps Up to 14 With configurable I/O direction, O/P drive strength https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions Copyright 2019 Laird. All Rights Reserved 6 Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Categories Feature Implementation ADC PWM or FREQ output BLE Services FW Upgrade I2C SPI Services supported smartBASIC runtime engine FW upgrade Programmability smartBASIC smartBASIC application download Control Protocols Operating Modes Any Self-contained Run mode Supply Voltage Interactive / development mode Supply (VCC) BLE Power Consumption Active modes peak current
(for Max TX PWR 3 dBm) Active modes peak current
(for TX Whisper mode2 PWR
-55 dBm) Active modes average current Ultra-low power modes Antenna Options BLE (Internal) chip antenna
(standard 0.5 mA or high 5 mA), pull-up/pull-down Four 10-bit channels (including ADC reference) 10 bit resolution 1.2 V internal reference 1/1, 2/3, 1/3 pre-scaling PWM or FREQ output on up to two GPIO output pins:
PWM output duty cycle PWM output frequency Up to 500 kHz (Note 7) FREQ output frequency 0 MHz-4 MHz
(50% duty cycle) One I2C interface (up to 400 kbps) (Note 2) One SPI Master interface (up to 4 Mbps) (Note 3) GATT client and capabilities
(1) Via UART
(2) Via 2-Wire SWD Programming/Debug Interface 0%-100%
Note: JTAG required for upgrading between Central and Peripheral firmware. On-board programming language similar to BASIC.
(1) Via UART.
(2) Via Over the Air (If SIO_28 pin is pulled high externally). Only for Peripheral role. User defined via smartBASIC Selected by nAutoRun pin status:
nAutoRun = LOW (0V): Then runs $autorun$ (smartBASIC application script) if it exists. nAutoRun = HIGH (VCC): Then runs via at+run (and file name of smartBASIC application script). 2.1V 3.5V 1.8V 2.1V DCDC switched on if VCC >2.1V at power-up Connected mode
(Vcc=3.3V) Connected mode
(Vcc=3.3V) 12.7 mA peak TX 11.9 mA peak RX 5 mA peak TX 11.9 mA peak RX Internal DCDC converter (Note 5) Internal LDO Depends on many factors. See Power Consumption. Standby Doze Deep Sleep On-board ceramic chip monopole antenna
-1.5 dBi 4.2 uA typical (Note 6) 750 nA (Note 6) https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions Copyright 2019 Laird. All Rights Reserved 7 Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Categories Feature Implementation Physical Environmental Miscellaneous Development Tools Approvals LoRa (External) Dimensions Weight Operating Storage Lead Free Warranty Development Kit Bluetooth FCC / IC / CE Dipole antenna with U.FL (IPEX) connector up to 2 dBi 25.4 mm x 25.4 mm x 3.1 mm 3 grams
-40 C to +85 C (VCC 1.8V 3.5 V)
-40 C to +85 C Lead-free and RoHS compliant 1-Year Warranty Development Kit DVK-RM1xx and Free Software Tools SIG Listed Declaration ID RM191-SM: FCC/IC, RM186-SM: CE externally as per I2C standard. Note 1: DSR, DTR, RI, and DCD can be implemented in the smart BASIC application. Note 2: With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL MUST be connected Note 3: SPI interface (master) consists of SPI MOSI, SPI MISO and SPI CLK. SPI CS is created by Note 4: RM1xx module comes loaded with smart BASIC runtime engine FW, but does not come loaded with any smart BASIC application script (as that is dependent on customer end application or use). Laird provides many sample smart BASIC application scripts covering the services listed. Additional applications being added every quarter. customer using any spare SIO pin within their smartBASIC application script allowing multi-
dropping. WARNING: above 3.5V, the LoRa transmitter will be disabled to maintain regulatory compliance Note 5: Laird suggests using Vcc of 3.3V +/-5% (3.13V-3.46V) for maximum LoRa output power. Note 6: Deep Sleep current <750nA (typical). Note 7: PWM output signal has a frequency and duty cycle property. PWM output is generated using 32-bit hardware Standby Doze current 4.2uA (typical). timers. The timers are clocked by a 1MHz (1uS period) clock source. Trade-off PWM output frequency with resolution. For example:
PWM output frequency of 500kHz (2uS) results in resolution of 1:2 PWM output frequency of 100kHz (10uS) results in resolution of 1:10 PWM output frequency of 10kHz (100uS) results in resolution of 1:100 PWM output frequency of 1kHz(1000uS) results in resolution of 1:1000 Refer to the smartBASIC user guide for details. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions Copyright 2019 Laird. All Rights Reserved 8 Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 3 HARDWARE SPECIFICATIONS 3.1 Block Diagram and Pin-out Figure 1: Functional HW and SW block diagram for RM1xx series smartBASIC modules Figure 2: RM186/RM191 module pin-out (top view) https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 9 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 3.2 Pin Definitions Table 2: Pin definitions Pin #
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Pin Name GND SIO_21 SIO_22 SIO_23 SIO_24 Default Function Alt. Funct. Default Direction Note14 Pull-
up/
Pull-
down Note14
-
-
UART TX OUT UART RX IN UART RTS OUT
-
DIO DIO DIO DIO SIO_25 nAutoRUN/DIO SIO_28 GND SIO_29 SIO_30 GND VCC_BLE VCC_LORA GND SIO_00 SIO_17 vSP/DIO
-
DIO DIO
-
-
-
DIO DIO UART CTS DIO DIO
-
I2C SCL I2C SDA
-
-
-
SPI CLK SPI MISO SIO_03/AIN DIO/AIN SPI MOSI SIO_04/AIN SIO_05/AIN SIO_06/AIN GND nRESET NC GND DIO DIO DIO AIN AIN AIN IN IN IN
-
IN IN
-
-
-
IN IN IN IN IN IN IN 10
-
Set high in FW PULL-
UP Set low in FW PULL-
DOWN NONE PULL-
DOWN
-
PULL-
UP PULL-
UP
-
-
-
PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP Notes Comment
-
1,2,4,6,7 1,2,4,6,7 1,2,4,6,7 1,2,4,6,7 IN only
-
UARTCLOSE() selects DIO functionality and UARTOPEN() selects UART comms behaviour Laird Devkit, UART_DSR via J10, J12 1,2,6,12,13 Laird DevKit: J6 (vSP/OTA)
-
1,2,6,11 1,2,6,11
-
-
-
I2COPEN() in smartBASIC selects I2C function Vcc for BLE Radio Vcc for Lora Radio 1,2,6,11 1,2,6,11 1,2,3,4,5,6,11 SPIOPEN() in smartBASIC selects SPI function, MOSI and CLK will be outputs when in SPI master mode. See note 11 1,2,3,4,5,6,11 Laird Devkit: SPI Slave Select 1,2,3,4,5,6,11 1,2,3,4,5,6,11 9,10 9 Laird Devkit: Button2 or Ana Temp Sensor via J7 Laird Devkit: LED5 or Arduino A0 Via J8 System Reset (Active low) DO NOT CONNECT Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions Copyright 2019 Laird. All Rights Reserved RM1xx LoRa/BLE Modules Datasheet Note 1: Secondary function is selectable in smartBASIC application. Note 2: DIO = Digital Input or Output. I/O voltage level tracks VCC. Note 3: AIN = Analog Input Note 4: DIO or AIN functionality is selected using the GpioSetFunc() function in smartBASIC. Note 5: AIN configuration selected using GpioSetFunc() function. Note 6:
I2C, UART, SPI controlled by xxxOPEN() functions in smart BASIC. Note 7: SIO_21 to SIO_24 are DIO by default when $autorun$ app runs on power up. Note 8: N/A Note 9: Hidden 2-Wire SWD Programming/Debug Interface (JTAG), pin22 (SWDIO) and pin23 (SWDCLK). Used for upgrading smartBASIC runtime engine FW with J-link programmer. Using this hidden 2-Wire SWD Programming/Debug Interface on customers host PCB requires header connector Samtec FTSH-105-
01-L-DV, refer to section 2-Wire SWD Programming/Debug Interface for details. JTAG required for upgrading between Central and Peripheral firmware. Note 10: Pull the nRESET pin (pin 22) low for minimum 100 mS to reset the module. Note11: SPI CS is created by customer using any spare SIO pin within their smartBASIC application script allowing multi-dropping. Note12: SIO_28 pin must be pulled high externally to enable OTA (over the Air) smartBASIC application download. Refer to the latest FW release documentation for details. Note13: User must ensure that SIO_28 and AutoRUN (SIO_25) are NOT BOTH HIGH (externally), otherwise in that state the UART is bridged to Virtual Serial Port service and so the RM1xx module will not respond to AT commands and therefore cannot load smartBASIC application scripts (applies to all versions of the smart BASIC runtime engine firmware.) Note14: smart BASIC runtime engine has DIO (Default Function) INPUT pins, have by default PULL-UP enabled. This was done to avoid floating inputs (which can also cause current consumption in low power modes (e.g. Standby Doze) to drift with time. In any case customer can disable the PUL-UP through their smart BASIC application. All the SIO pins (with a default function of DIO are inputs apart from SIO_21 and SIO_23, which are outputs):
- SIO_21 (alternative function UART_TX) is an output, set high (in FW).
- SIO_23 (alternative function UART_RTS) is an output, set low (in FW).
- SIO_22 (alternative function UART_RX) is an input, set with internal pull-up (in FW).
- SIO_24 (alternative function UART_CTS) is an input, set with internal pull-down (in FW). https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 11 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet The RM1xx module is delivered with the integrated smartBASIC runtime engine FW loaded (but no onboard smartBASIC application script). Because of this, it starts up in AT command mode by default. At reset, all SIO lines are configured as the defaults shown above. SIO lines can be configured through the smartBASIC application script to be either inputs or outputs with pull-ups or pull-
downs. When an alternative SIO function is selected (such as I2C or SPI), the firmware does not allow the setup of internal pull-up/pull-down. Therefore, when I2C interface is selected, pull-up resistors on I2C SDA and I2C SCL MUST be connected externally as per I2C standard. UART_RX, UART_TX, UART_CTS are Vcc logic levels (if VCC is 3.3 V, i.e. SIO pin I/O levels track VCC). For example, when RX and TX are idle, they sit at 3.3 V (if VCC is 3.3 V). Conversely, handshaking pins CTS and RTS at 0 V are treated as assertions. Pin 6 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-RM1xx-SM) it is connected so that the state is driven by the hosts DTR output line. The nAutoRUN pin must be externally held high or low to select between the following two operating modes:
smartBASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low and if there is a smartBASIC application script named $autorun$, then the smartBASIC runtime engine FW executes the application script automatically; hence the name Self-contained Run Mode. Self-contained Run mode (nAutoRUN pin held at 0 V). Interactive/development mode (nAutoRUN pin held at VCC). 3.3 Electrical Specifications 3.3.1 Absolute Maximum Ratings Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below;
exceeding these values causes permanent damage (Table 3). Table 3: Maximum Current Ratings Parameter Minimum Voltage at VCC_BLE and VCC_LORA pin Voltage at GND pin Voltage at SIO pin Storage temperature
-0.3
-0.3
-40 Maximum
+3.6 (Note 1) 0 VCC+0.3
+85 Unit V V V C Note 1:
Absolute Max Rating for VCC pin (max) is 3.6V, however we recommend 3.3V +/-5% as the spec for maximum Vcc. The LoRa transmitter shuts down if the voltage exceeds 3.5V . 3.3.2 Recommended Operating Parameters Table 4: Power Supply Operating Parameters Parameter Minimum VCC1 VCC Maximum ripple or noise2 Operating Temperature Range 1.8
-40 Typical 3.3
-
Maximum 3.5 10
+85 Unit V mV C Note 1:
Internal DCDC is used if VCC >2.1 V on power-up; otherwise internal LDO is used. If supply voltage is greater than 3.5V, the LoRa transmitter will be disabled. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 12 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Note 2:
The maximum VCC ripple or noise (at any frequency) that does not disturb the radio. Table 5: Signal Levels for Interface, SIO Parameter VIH Input high voltage VIL Input low voltage VOH Output high voltage
(std. drive, 0.5mA)
(high-drive, 5mA) (Note 1) VOL Output low voltage
(std. drive, 0.5mA)
(high-drive, 5mA) (Note 1) Pull up resistance Pull down resistance Minimum 0.7VCC VSS VCC-0.3 VCC-0.3 VSS VSS 11 11 Note 1: Maximum number of pins with 5mA high drive is three. Table 6: SIO pin alternative function AIN (ADC) specification Typical Maximum 13 13 VCC 0.3 VCC VCC 0.3 0.3 16 16 Parameter ADC Internal reference voltage ADC pin input internal selectable scaling ADC input pin (AIN) voltage maximum without damaging ADC w.r.t VCC Prescaling 3.3 V 1/1 3.3 V 2/3 3.3 V 1/3 1.8 V 1/1 1.8 V 2/3 1.8 V 1/3 ADC input pin (AIN) voltage maximum without saturating ADC (with 1.2V internal reference)1 1/1 prescaling 2/3 prescaling 1/3 prescaling Time required to convert single sample in 10bit mode 9bit mode2 8 bit mode2 ADC input impedance (during operation)3 Minimum
-1.5%
Typical 1.2 V Maximum
+1.5%
1/1, 1/3, 2/3 68 36 20 2.4 3.6 3.6 2.1 2.1 2.1 1.2 1.8 3.6 Unit V V V V V V k k Unit
%
Scaling V V V V V V V V V uS uS uS https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 13 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Note 1:
Stay within internal 1.2 V reference voltage with given prescaling on AIN pin and do not violate ADC maximum input voltage (for damage) for a given VCC, e.g. If VCC is 1.8 V can only expose AIN pin to 2.1 V (VCC+0.3). Note 2: Currently, the smartBASIC runtime engine firmware only allows 10-bit mode. Note 3: ADC input impedance is estimated mean impedance of the ADC (AIN) pins. The tolerance is +/-20%. The ADC is highly sensitive to the impedance of the source. The ADC (AIN) input impedance is 200k-600k depending on your ADC gain (pre-scaling) setting. Normally, when not sampling, the ADC (AIN) impedance will have very high value and can consider it to be an open circuit. The moment ADC is sampling, ADC (AIN) impedance is 200k-600k. 3.3.3 nAutoRUN Pin and Operating Modes Operating modes (refer to the smartBASIC manual for details):
Table 7: nAutoRUN pin Self-contained mode Interactive/Development mode Signal Name Pin #
I/O Comments nAutoRUN (SIO_25) 6 I Input with active low logic. Operating mode selected by nAutoRun pin status:
If Low (0V), runs $autorun$ if it exists;
If High (VCC), runs via at+run (and file name of application). Pin 40 (nAutoRUN) is an input, with active low logic. In the development board (DVK-RM1xx) it is connected so that the state is driven by the hosts DTR output line. nAutoRUN pin needs to be externally held high or low to select between the two RM1xx operating modes:
smartBASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low and if there is a smartBASIC application named $autorun$ then the smartBASIC runtime engine executes the application automatically;
hence the name self-contained run mode. Self-contained Run mode (nAutoRUN pin held at 0V). Interactive/Development mode (nAutoRUN pin held at VCC) 3.3.4 LoRa Output Power and Current Consumption vs Vcc To maximize output power, the best choice for module Vcc is 3.3V +/- 5% (which results in a Vcc range of 3.14V to 3.47V). The data in Table 8 was taken at 25C with UART on and all other peripherals turned off. It shows how the output power and transmitter current consumption falls off as a function of Vcc. Table 8: Power consumption and output power vs Vcc Vcc
[V]
3.5 3.3 3.0 2.7 Tx Current
[mA]
31.4 30.9 29.5 27.9 RM186 Rx Current
[mA]
12.7 12.6 12.3 12.2 Pout
[dBm]
13.8 13.5 13.0 12.2 Tx Current
[mA]
45.7 43.3 39.8 36.3 RM191 Rx Current
[mA]
15.3 15.0 15.1 14.8 Pout
[dBm]
15.2 14.9 14.3 13.4 https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 14 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 1.8 RM186 RM191 6.5 11.8 24.5 19.4 14.4 3.3.4.1 Typical LoRa Current Waveforms for Tx/Rx Cycle The plots below (Figure 3 and Figure 4) depict a typical Transmit/Receive cycle when sending a LoRa packet to the gateway. The plots were made using a shunt current monitor and the voltage levels have been translated to currents. The current plots show a transmitted packet, the first receive window (one second later), followed by the second receive window (one second following the first receive window). The currents represented are the total module current (the sum of VCC_BLE and VCC_LORA pins). 8.5 Figure 3: Typical RM186 LoRa transmit/receive cycle (full Tx power, Vcc=3.3V, @25C Figure 4: Typical LoRa transmit/receive cycle (full Tx power, Vcc=3.3V, @25C) 3.3.5 LoRa Receive Sensitivity vs Data Rate Table 9 tabulates typical LoRa receive sensitivity as a function of the LoRa data rate. The data rate is determined by the combination of bandwidth and spreading factor of the incoming LoRa signal. The data rates in the table are the LoRaWAN data rates used by the gateway when transmitting to the end device. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 15 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Table 9: Receive sensitivity vs LoRa data rate DR RM191 RM186 8 9 10 11 12 13 0 1 2 3 4 5 6 Bit Rate
[Bits/s]
980 1760 3900 7000 12500 21900 250 440 980 1760 3125 5470 11000 BW
[kHz]
500 500 500 500 500 500 125 125 125 125 125 125 250 SF 12 11 10 9 8 7 12 11 10 9 8 7 7 Rx Sensitivity
[dBm]
-126
-125
-122
-119
-116
-113
-134
-132
-130
-127
-124
-121
-119 Note the following:
DR = LoRaWAN data rate Bit rate is the effective over the air bit rate BW is the bandwidth of the incoming LoRa transmission SF is the Spreading Factor of the incoming LoRa transmission 3.3.6 BLE Power Consumption Data taken at VCC 3.3V (see Note 1 following Table 10) and 25C. Table 10: Power consumption Min Parameter Active Mode peak current (Note 1)
(Connection) TX only run peak current @TXpwr= + 3 dBm TX only run peak current @T pwr= 0 dBm TX only run peak current @TXpwr= -4 dBm TX only run peak current @TXpwr= -8 dBm TX only run peak current @TXpwr= -12 dBm TX only run peak current @TXpwr= -16 dBm T X only run peak current @TXpwr= -20 dBm TX Whisper Mode 1 TX only run peak current @TXpwr= -30 dBm TX Whisper Mode 2 TX only run peak current @TXpwr= -55 dBm Active Mode https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 16 Copyright 2019 Laird. All Rights Reserved Typical 12.7 8.4 7.1 6.9 6.4 6.1 5.5 5.4 5.0 Max Unit mA mA mA mA mA mA mA mA mA Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Parameter Min RX only peak current Ultra Low Power Mode1 (Note 2) Standby Doze Ultra Low Power Mode2 (Note 3) Deep Sleep (no RAM retention) Active Mode Average current (Note 4) Connection Average Current draw Max with connection interval (min) 7.5 mS with connection interval 67.5 mS Min with connection interval (max) 4000 mS Typical 11.9 Max Unit mA 4.2 750
~400
~2.6-4.1 uA nA uA uA Note 1:
If VCC is below 2.1V (operating range of DCDC), the peak current consumption will increase because the DCDC converter is switched off and the internal LDO is enabled. Note 2:
Standby Doze is entered automatically (when waitevent statement is encountered within a smartBASIC application script). See individual peripherals current consumption in tables in section Peripheral block current consumption 4.3. Note 3:
In Deep Sleep, everything is disabled and the only wake-up sources are reset and changes on pins on which sense is enabled. A reset is required to exit Deep Sleep. Note 4: Data taken with TX power 3 dBm and all peripherals off (UART OFF after radio event). Average current consumption depends on a number of factors (including TX power, VCC and accuracy of 16 MHz and 32.768 kHz crystals). With these factors fixed, the largest variable is the connection interval. Connection Interval Range:
7.5 ms to 4000 ms in multiples of 1.25 ms. For a connection event:
The minimum average current consumption is when the connection interval is large 4000 mS The maximum average current consumption is with the shortest connection interval of 7.5 ms; no slave latency. Other factors that are also related to average current consumption include whether transmitting 6 packets per connection interval & each packet contains 20 bytes (which is the maximum for each packet) and an inaccurate 32 kHz master clock accuracy would increase the average current consumption. 3.3.6.1 BLE Measured Peak Current Waveforms during Connection Figure 5 illustrates BLE current waveforms observed as the RM1xx module performs a transmit/receive cycle with Vcc =
3.3V. The plot was made using a shunt current sensor and the voltage waveform has been manually converted to current. The current represented is the total module current which is the sum of the BLE_VCC and BLE_LORA pins. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 17 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet BLE Transmit/Receive currents at Vcc=3.3V @25C Figure 5: Typical peak current consumption profile with doze mode in effect before/after the Rx/Tx BLE Tx Current BLE Rx Current Table 11: BLE Peak Transmit/Receive currents vs Vcc @25C Vcc
[V]
3.5 3.3 3.0 2.7 1.8
[mA]
11.4 11.9 12.3 13.0 15.02
[mA]
12.0 12.7 13.3 14.4 16.6 Note:
This is the total module current (sum of pins VCC_BLE and VCC_LORA) 3.3.6.2 Peripheral Block Current Consumption The values below are calculated for a typical operating voltage of 3 V. Table 12: UART Power Consumption Parameter UART Run current @ Max Baud Rate UART Run current @ 115200 bps UART Run current @ 1200 bps UART Baud rate Table 13: SPI Power Consumption Parameter SPI Master Run current @ 125 kbps SPI Master Run current @ 4 Mbps SPI bit rate Min Typ Max Unit 1200 230 220 210 460800 uA uA uA bps Min 0.125 Typ 180 200 Max 4 Unit uA uA Mbps https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 18 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Table 14: I2C Power Consumption Parameter I2C Run current @ 100 kbps I2C Run current @ 400 kbps I2C Bit rate Table 15: ADC Power Consumption Parameter ADC current during conversion Min 100 Min Typ 380 400 Typ 260 Max 400 Max Unit uA uA kbps Unit uA FUNCTIONAL DESCRIPTION For asynchronous interface like the UART (asynchronous as the other end can communicate at any time), the UART (on RM1xx) must kept open (by a command in smartBASIC application script) resulting in the base current consumption penalty. For synchronous interface like the I2C or SPI (since RM1xx side is the master), the interface can be closed and opened only when needed (by a command in smart BASIC application script), resulting in current saving (no base current consumption penalty). Theres a similar argument for ADC (open ADC when needed). 4 The RM1xx module is a self-contained LoRa/Bluetooth Low Energy product and requires only power and a users smartBASIC application to implement full LoRa and BLE functionality. The LoRa radio in conjunction with an externaltwo dBi antenna implements a long range, low data rate connection to a LoRa gateway up to 15 kilometers. The integrated, high performance BLE antenna combined with the RF and base-band circuitry provides the Bluetooth Low Energy wireless link to connect to local BLE sensors. The RM1xx SIO lines provide the OEMs chosen interface connection to the wired serial/SPI/I2C/analog sensors. The users smartBASIC application binds the sensors to the LoRa and BLE wireless functionality. The variety of hardware interfaces and the smartBASIC programming language allow the RM1xx module to serve a wide range of wired/wireless applications, whilst reducing overall time to market and the learning curve for developing LoRa and BLE products. To provide the widest scope for integration, a variety of physical host interfaces/sensors are provided. The major RM1xx series module functional blocks are described below. 4.1 Power Management (includes brown-out and power on reset) Power management features:
Brownout Reset Open/Close peripherals (UART, SPI, I2C, SIOs and ADC). Peripherals consume current when open; each peripheral can System Standby Doze/Deep Sleep modes be individually closed to save power consumption (with a command in a smartBASIC application script). Two-region RAM retention (No RAM retention in Deep Sleep mode) smartBASIC command allows the VCC voltage to be read (through the internal ADC) Pin wake-up system from deep sleep Power supply features:
Supervisor hardware to manage power on reset, brownout (and power fail). 1.8V to 3.5V supply range. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 19 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 4.2 Clocks and Timers 4.2.1 Clocks The integrated high accuracy (+/-20 ppm) 32.768 kHz crystal oscillator provides protocol timing and helps with radio power consumption in the system Standby Doze/Deep sleep modes by reducing the time that the RX window needs to be open. Standard accuracy clocks tend to have lower accuracy +/-250 ppm. The integrated high accuracy 16 MHz (+/-10 ppm) crystal oscillator helps with radio operation and also helps reduce power consumption in the active modes. 4.2.2 Timers In keeping with the event-driven paradigm of smartBASIC, the timer subsystem enables smartBASIC applications to be written which allow future events to be generated based on timeouts. Regular Timer There are eight built-in timers (regular timers) derived from a single RTC clock which are controlled solely by smart BASIC functions. The resolution of the regular timer is 976 microseconds. Tick Timer A 31-bit free running counter that increments every one millisecond. The resolution of this counter is 488 microseconds. This counter can be accessed using the functions GetTickCount() and GetTickSince(). Refer to the smart BASIC user guide for more information. 4.3 RF RM186 LoRa radio: 865 870 MHz (250 11000 bps over the air data rate) RM186 protocol can optionally employs 50 kbps FSK when enabled by the gateway RM191 Lora radio: 902 928 MHz (980 21900 bps over the air data rate) Bluetooth Low Energy radio: 24022480MHz (1 Mbps over the air data rate). BLE TX output power of +3 dBm programmable (via smartBASIC command) to -20 dBm in steps of four dB. BLE TX Whisper mode1 -30 dBm (via smartBASIC command). BLE TX Whisper mode2 -55 dBm (via smartBASIC command). BLE Receiver (with integrated channel filters) to achieve maximum sensitivity -91 dBm @ 1 Mbps BLE. BLE Antenna: Integrated monopole chip antenna on RM1xx 4.4 UART Interface The Universal Asynchronous Receiver/Transmitter offers fast, full-duplex, asynchronous serial communication with built-in flow control support (UART_CTS, UART_RTS) in the hardware. Parity checking is supported. UART_TX, UART_RX, UART_RTS, and UART_CTS form a conventional asynchronous serial data port with handshaking. The interface is designed to operate correctly when connected to other UART devices such as the 16550A. The signaling levels are CMOS logic levels that track VCC, and are inverted with respect to the signaling on an RS232 cable. Two-way hardware flow control is implemented by UART_RTS and UART_CTS. UART_RTS is an output and UART_CTS is an input. Both are active low. These signals operate according to normal industry convention. UART_RX, UART_TX, UART_CTS, UART_RTS are all CMOS logic levels that track VCC. For example, when RX and TX are idle they sit at a high logic level (VCC). Conversely for handshaking pins CTS, RTS at 0 V is treated as an assertion. The module communicates with the customer application using the following signals (Figure 6):
Port /TXD of the application sends data to the modules UART_RX signal line Port /RXD of the application receives data from the modules UART_TX signal line https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 20 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Figure 6: UART Signals Note:
The RM1xx serial module output is at CMOS logic levels that track VCC. Level conversion must be added to interface to provide an RS-232 level compliant interface. Some serial implementations link CTS and RTS to remove the need for handshaking. Laird does not recommend linking CTS and RTS other than for testing and prototyping. If these pins are linked and the host sends data at the point that the RM1xx deasserts its RTS signal, then there is significant risk that internal receive buffers will overflow, which could lead to an internal processor crash. This will drop the connection and may require a power cycle to reset the module. Laird recommends that the correct CTS/RTS handshaking protocol be adhered to for proper operation. Table 16: UART Interface Signal Name SIO_21/UART_TX SIO_22/UART_RX SIO_23/UART_RTS SIO_24/UART_CTS Pin #
2 3 4 5 I/O O I O I Comments SIO_21 (alternative function UART_TX) is an output, set high (in FW). SIO_22 (alternative function UART_RX) is an input, set with internal pull-up (in FW). SIO_23 (alternative function UART_RTS) is an output, set low (in FW). SIO_24 (alternative function UART_CTS) is an input, set with internal pull-down
(in FW). The UART interface is also used to load customer developed smartBASIC application script. 4.5 SPI Bus The SPI interface is an alternate function on SIO pins, configurable by smartBASIC. The module is a master device that uses terminals SPI_MOSI, SPI_MISO, and SPI_CLK. SPI_CSB is implemented using any spare SIO digital output pins to allow for multi-dropping. The SPI interface enables full duplex synchronous communication between devices. It supports a three-wire (SPI_MOSI, SPI_MISO, SPI_SCK,) bidirectional bus with fast data transfers to and from multiple slaves. Individual chip select signals are necessary for each of the slave devices attached to a bus, but control of these is left to the application through use of SIO signals. I/O data is double buffered. The SPI peripheral supports SPI mode 0, 1, 2, and 3. Table 17: Peripheral supports Signal Name SPI_MOSI SPI_MISO SPI_CLK Pin #
17 16 15 I/O O I O Comments This interface is an alternate function configurable by smart BASIC. Default in the FW pin 15 and 17 are inputs. SPIOPEN() in smart BASIC selects SPI function and changes pin14 and 16 to outputs (when in SPI master mode). https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 21 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 4.6 I2C Interface The I2C interface is an alternate function on SIO pins, configurable by smart BASIC command. The two-wire interface can interface a bi-directional wired-OR bus with two lines (SCL, SDA) and has master /slave topology. The interface is capable of clock stretching. Data rates of 100 kbps and 400 kbps are supported. An I2C interface allows multiple masters and slaves to communicate over a shared wired-OR type bus consisting two lines which normally sit at VCC. The RM1xx module can only be configured as an I2C master with additional constraint that it be the only master on the bus. The SCL is the clock line which is always sourced by the master and SDA is a bi-directional data line which can be driven by any device on the bus. IMPORTANT:
It is essential to remember that pull-up resistors on both SCL and SDA lines are not provided in the module and MUST be provided external to the module. Table 18: I2C Interface Signal Name I2C_SDA I2C_SCL Pin #
10 9 I/O I/O I/O Comments This interface is an alternate function on each pin, configurable by smartBASIC. I2COPEN() in smartBASIC selects I2C function. Input/output direction 4.7 General Purpose I/O, ADC and PWM/FREQ 4.7.1 GPIO All SIO pins are configurable by smartBASIC. They can be accessed individually. Each has the following user configured features:
Output drive strength (standard drive 0.5 mA or high drive 5mA) Wake-up from high or low level triggers on all pins 4.7.2 ADC The ADC is an alternate function on four select SIO pins, configurable by smart BASIC. This enables sampling up to four external signals via an internal MUX to the 10 bit ADC. The ADC has configurable input pre-scaling and sample resolution. 4.7.2.1 Analog Interface (ADC) Table 19: Analog interface Internal pull up and pull down resistors (13 K typical) or no pull-up/down Signal Name Pin No AIN Analog Input AIN Analog Input AIN Analog Input AIN Analog Input 17 18 19 20 I/O I I I I Comments This interface is an alternate function on each pin, configurable by smartBASIC. AIN configuration selected using GpioSetFunc() function. 10 bit resolution. Voltage scaling 1/1, 2/3, 1/3. 4.7.3 PWM and FREQ Signal Output on up to Two SIO Pins The PWM and FREQ output is an alternate function on SIO pins, configurable by smart BASIC. The ability to output a PWM (Pulse Width Modulated) signal or FREQ output signal on up to two GPIO (SIO) output pins can be selected using GpioSetFunc() function. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 22 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet PWM output signal has a frequency and duty cycle property. PWM output is generated using 32-bit hardware timers. The timers are clocked by a one-MHz clock source. Frequency is adjustable (up to 1 MHz) and the Duty cycle can be set over range from 0% to 100% (both configurable by smart BASIC command). Note, the frequency driving each of the wo SIO pins is the same but the duty cycle can be independently set for each pin. FREQ output signal frequency can be set over a range of 0 Hz to 4 MHz (with 50% mark-space ratio). 4.8 nRESET Pin Table 20: nRESET pin Signal Name Pin No nRESET 22 I/O I Comments HW reset (active low). Pull the nRESET pin low for minimum 100mS in order for the RM1xx to reset. 4.9 nAutoRUN Pin Refer to section nAutoRUN pin and Operating Modes regarding operating modes and the nAutoRUN pin. Self-contained Run mode Interactive / Development mode 4.10 RM1xx VSP Service and Modes This section discusses VSP Command mode through pulling SIO_28 high and nAutoRUN low externally. Read this section in conjunction with the VSP Configuration chapter of the RM1xx BLE Peripheral smartBASIC Extensions Guide, available under the documentation tab of the Laird RM1xx product page, available at:
https://connectivity.lairdtech.com/wireless-modules/lorawan-solutions/sentrius-rm1xx-lora-ble-modules Note:
vSP modes are only available in peripheral firmware. Figure 7 shows the difference between VSP Bridge to UART mode and VSP Command mode and how SIO_28 and nAutoRUN need to be configured to select between these two modes. VSP Bridge to UART mode takes data sent from phone or tablet (over BLE) and sends to RM1XX to be sent out of the RM1XX UART (therefore data not stored on RM1XX). VSP Command mode takes data sent from phone of tablet and sends to RM1XX and stores that data in the RM1XX. The OTA Android or iOS application can be used to download any smartBASIC application script over the air to the RM1XX. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 23 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet VSP service VSP Bridge to UART mode SIOI_28 nAutoRUN Phone or Tablet VSP Command mode Out to UART Store in RM1XX Figure 7: Difference between VSP bridge to UART mode and VSP Command mode Table 21: vSP Modes Mode SIO_28 pin nAutoRUN pin Externally held HIGH Externally held HIGH VSP Bridge to UART Mode VSP Command Mode SIO_28 High (externally) selects the VSP service, and together when nAutoRUN is also Low (externally) selects VSP Command mode. If SIO_28 is High and whilst nAutoRUN is High (externally), this selects VSP Bridge to UART mode. When SIO_28 on module is set HIGH (externally), VSP is enabled and auto-bridged to UART when connected. However, for VSP Command mode, auto-bridge to UART is not required. With SIO_28 set to High and nAutoRUN set to Low, VSP Command mode is entered and you can then download the smartBASIC application onto the module over the air (OTA) from the phone (or tablet). Externally held HIGH Externally held LOW 4.11 Two-Wire SWD Programming/Debug Interface Note:
JTAG required for upgrading between Central and Peripheral firmware. Signal Name (hidden name) nRESET (SWDIO) NC (SWDCLK) Pin No 22 23 I/O I/O I Comments The connector for the (2-Wire SWD Programming/Debug Interface) MPN is as follows:
Reference JP1 Note1 Header, 1.27mm, SMD, 10-way, FTSH-105-01-L-DV Samtec Part FTSH-105 Description Note 1: Reference the RM1xx development board schematic. Figure 8 shows the wiring for the 2-Wire SWD Programming/Debug Interface connector and RM1xx module hidden 2-Wire SWD Programming/Debug Interface pins. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 24 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet VCC_IO JP1 1 3 5 7 9 2 4 6 8 10 FTSH-105 nRESET/SWDIO SWDCLK
(RM1xx Pin 22)
(RM1xx Pin 23) GND Figure 8: Wiring for 2-Wire SWD Programming/Debug Interface connector to SWD Programming/Debug interface on RM1xx module 4.12 RM1xx on-board chip antenna characteristics The RM1xx on-board chip monopole antenna radiated performance depends on the host PCB layout. RM1xx development board was used for RM1xx development and antenna performance evaluation. To obtain similar performance follow guidelines in section PCB Layout on Host PCB for RM1xx to allow the on-board antenna to radiate and reduce proximity effects due to nearby host PCB GND copper or metal covers. RM1xx on-board antenna part number: ACX: AT5020-E3R0HBANT/LF 5 HARDWARE INTEGRATION SUGGESTIONS 5.1 Circuit The RM1xx-series module is easy to integrate requiring no external components on the customers board apart from those required by customer for development and in customers end application. Checklist (for Schematic):
VCC The module Vcc should be chosen to optimize either range or power consumption and must be within the valid operating range and noise/ripple specification of RM1xx. Pins VCC_BLE and VCC_LORA should be tied together and decoupling capacitors for filtering should be added close to the module VCC pins. The supply must be able to deliver enough current for the sum of the BLE and LoRa transmitter currents for the chosen Vcc (plus reasonable headroom). Power-on reset circuitry within RM1xx series module incorporates brown-out detector, thus simplifying power supply design. Upon application of power, the internal power-on reset ensures module starts correctly. AIN (ADC) and SIO pin IO voltage levels RM1xx SIO operating voltage levels are from 0V to VCC. Ensure input voltage levels into SIO do not exceed VCC also (if VCC source is a battery whose voltage will drop). Ensure ADC pin maximum inpu voltage for damage is not violated. AIN (ADC) impedance and external voltage divider setup If one wanted to measure with ADC, a voltage higher than 3.6V then one can connect a high impedance voltage divider to lower the voltage to the ADC input pin. Other methods are to use a voltage buffer or FET transistor in conjunction with a low resistance voltage divider. High impedance values of a voltage divider connected to an AIN pin will introduce ADC inaccuracy. Laird recommends the following solution for setup of a voltage divider when used with the RM1xx ADC:
Connect a capacitor between AIN and ground (if the voltage divider presents high impedance). Normally, when ADC is not sampling, the ADC (AIN) impedance is a very high value and can be considered an open circuit. The moment ADC is sampling, ADC (AIN) impedance is 200k-600k and lowers the AIN voltage. However, when the capacitor is connected it should keep the AIN voltage at https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 25 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet previous level for an adequate time period while sampling, minimizing the effect of the high resistance value of the external voltage divider. The capacitor should be big enough to hold voltage up for the required time period, i.e. 20 us for 8 bit sampling or 68 us for 10 bit sampling. If you use a FET transistor to open the current flow through the circuit momentarily before sampling, allow enough time for the capacitor to fully charge before sampling. During the sampling period, multiple samples are made and the ADC output value is the mean value from the sample pool. The sample pool is created during 20 us period for 8 bit sampling, 36 us period for 9 bit sampling, and 68 bit period for 10 bit sampling. Two-Wire SWD Programming/Debug Interface (JTAG) Add 2-Wire SWD Programming/Debug Interface as detailed in section 2-Wire SWD Programming/Debug Interface. Note:
Required if upgrading between central and peripheral firmware capability will be necessary during production. UART The UART is required for loading customer smartBASIC application and firmware. Add connector to allow UART to be interfaced to PC (via UART RS232 or UART- USB). Note:
Not capable of upgrading between central and peripheral firmware via UART. UART_RX and UART_CTS SIO_22 (alternative function UART_RX) is an input, set with internal weak pull-up (in FW). The pull-up prevents the module from going into deep sleep when UART_RX line is idling. SIO_24 (alternative function UART_CTS) is an input, set with internal weak pull-down (in FW). This pull-down ensures the default state of the UART_CTS will be asserted which means can send data out of the UART_TX line. In the case when UART_CTS is not connected (which we do not recommend). nAutoRUN pin and operating mode selection nAutoRUN pin needs to be externally held high or low to select between the two RM1xx operating modes at power-up:
Self-contained Run mode (nAutoRUN pin held at 0V). Interactive/development mode (nAutoRUN pin held at VCC). Make provision to allow operation in the required mode. Add jumper to allow nAutoRUN pin to be held high or low
(via 10K resistor) OR driven by host GPIO. I2C It is essential to remember that pull-up resistors on both I2C_SCL and I2C_SDA lines are not provided in the RM1xx module and MUST be provided external to the module as per I2C standard. SPI Implement SPI chip select using any unused SIO pin within your smartBASIC application script then SPI_CS is controlled from smartBASIC application allowing multi-dropping. SIO pin direction RM1xx modules shipped from production with smart BASIC runtime engine FW, all SIO pins (with default function of DIO) are mostly digital inputs (see Pin Definitions Table 2). Use your smart BASIC application script to change the direction of any SIO pin that is required to be an output in your design. Also these SIO pins that are inputs have by default (in FW) an internal pull-up or pull-down resistor-enabled (see Pin Definitions Table 2). This was done to avoid floating inputs (which can also cause current consumption in low power modes (e.g. Standby Doze) to drift with time. In any case customer can disable the PULL-UP through their smart BASIC application. SIO_28 pin and Over the Air smartBASIC application download feature SIO_28 is an input, set with internal pull-down (in FW). Refer to latest FW release documentation on how SIO_28 is used for Over the Air smartBASIC application download feature. SIO_28 pin has to be pulled high externally to enable the feature. Decide if this feature is required in production. When SIO_28 is high, ensure SIO_25 (nAutoRun) is NOT high at same time, otherwise you cannot load the smartBASIC application script. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 26 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet nRESET pin (active low) Hardware reset. Wire out to push button or drive by host. By default module is out of reset when power applied to VCC pin. 5.2 PCB Layout on Host PCB General Checklist (for PCB):
MUST locate RM1xx module close to the edge of PCB (mandatory for RM1xx for on-board chip antenna to radiate properly). Use solid GND plane on inner layer (for best EMC and RF performance). All module GND pins MUST be connected to host PCB GND. Unused PCB area on the top layer can be flooded with copper but place GND vias regularly to connect copper flood to Place GND vias close to module GND pads as possible. inner GND plane. If GND flood copper exists on the top PCB layer (under of the RM1xx module), then connect with GND vias to inner GND plane and ensure that it is covered with solder mask. Route traces to avoid noise being picked up on VCC supply and AIN (analogue) and SIO (digital) traces. Ensure no exposed copper beneath the module (refer to land pattern of RM1xx development board). 5.2.1 BLE Chip Antenna Keep-out on Host PCB Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. Keep all mounting hardware and metal clear of the area to allow proper antenna radiation. For best antenna performance, place the RM1xx module on the edge of the host PCB, preferably in the corner with the antenna facing the corner. The RM1xx development board has the RM1xx module on the edge of the board (not in the corner). The antenna keep-out area is defined by the RM1xx development board which was used for module development (and antenna performance evaluation) is shown in Figure 9, where the antenna keep-out area is composed of PCB dielectric (no copper) sitting under the RM1xx antenna. A different host PCB thickness dielectric will have small effect on antenna. The antenna-keep-out defined in Host PCB Land Pattern and Antenna Keepout applies when the RM1xx is placed in the corner of the host PCB. When RM1xx-SM cannot be placed as such, it must be placed on the edge of the host PCB and the antenna keep out must be observed. An example is shown in Figure 9. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 27 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Figure 9: Antenna keepout on DVK-RM1xx PCB (shown in red) with RM1xx module placed near the corner. Note:
1. RM1xx module placed on edge of host PCB (close to the corner of the PCB). 2. Copper cut-away on all layers in antenna Keep-out for a host PCB. 5.2.2 Antenna Keep-out and Proximity to Metal or Plastic Checklist (for metal /plastic enclosure):
Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40mm top/bottom and 30mm left or right. Metal close to the RM1xx chip monopole antenna (bottom, top, left, right, any direction) will have degradation on the antenna performance. How much; that is entirely system dependent which means some testing by customer required
(in their host application). Anything metal closer than 20mm will start to significantly degrade performance (S11, gain, radiation efficiency). It is best that the customer tests the Range with mock-up (or actual prototype) of the product to assess effects of enclosure height (and material whether metal or plastic). https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 28 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 5.3 LoRa External Antenna Integration with RM1xx Please refer to the regulatory sections for FCC/IC, and CE, for details of use of RM1xx with external antennas. The RM1xx has been designed to operate with the below external antennas (with a maximum gain of 2dBi). The required antenna impedance is 50 ohms. See Table 22. Table 22: LoRa External antennas for the RM1xx Laird Part External Antenna Part Number Number RFDPA131015IMBB301 WPANTDP036-R5A
-
S152CL-L-PX-915S S152CL-L-PX-868S Mfg. 0600-00060 Walsin World Products Nearson Nearson
-
-
Type Dipole Dipole Gain
(dBi) 0.9 2.0 Connector Type U.FL U.FL RM1xx Part number RM191/RM186 RM191/RM186 Dipole Dipole 2.0 2.0 U.FL U.FL RM191 RM186 6 MECHANICAL DETAILS 6.1 RM1xx Mechanical Details Figure 10: RM1xx Mechanical drawings Development Kit Schematics can be found in the Documentation tab of the RM1xx product page:
https://connectivity.lairdtech.com/wireless-modules/lorawan-solutions/sentrius-rm1xx-lora-ble-modules https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 29 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 6.2 Host PCB Land Pattern and Antenna Keep-out for RM1xx Application Notes 1. 3. 4. 5. 6. Ensure there is no copper in the antenna keep out area on any layers of the host PCB. Also keep all mounting hardware or any metal clear (Refer to 5.2.2) on of the area to reduce effects of proximity detuning the antenna and to help antenna radiate properly. For best BLE chip antenna performance, the module MUST be placed on the edge of the host PCB (preferably in the corner) with the antenna facing the corner. If RM1xx is not placed in corner, but on edge of host PCB, the antenna Keep Out Area is extended (see Note 4). RM1xx development board has an RM1xx placed on the edge of the PCB board (and not in corner) the Antenna keep out area is extended out to the corner of the development board, see section PCB Layout on Host PCB -
General. This was used for module development and antenna performance evaluation. Ensure no exposed copper under module on host PCB. The user may modify the PCB land pattern dimensions based on their experience and / or process capability. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 30 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 7 APPLICATION NOTE FOR SURFACE MOUNT MODULES 7.1 Introduction Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the User Manual. This Application Note is considered a living document and will be updated as new information is presented. The modules are designed to meet the needs of a number of commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes. Shipping Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick and place machines. Layouts of the trays are provided in Figure 11. Figure 11: RM1xx Shipping Tray Details https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 31 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 7.2 Reflow Parameters Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to bake units on the card, see Table 23 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf Note:
The shipping tray cannot be heated above 65C. If baking is required at the higher temperatures displayed in in Table 23, the modules must be removed from the shipping tray. Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment 30C/60%RH. Table 23: Recommended baking times and temperatures 125C Baking Temp. 90C/ 5%RH Baking Temp. 40C/ 5%RH Baking Temp. Saturated
@ 30C/85%
Floor Life Limit
+ 72 hours
@ 30C/60%
9 hours 7 hours MSL 3 Saturated
@
30C/85%
33 hours Floor Life Limit
+ 72 hours
@ 30C/60%
Saturated
@ 30C/85%
Floor Life Limit
+ 72 hours @
30C/60%
23 hours 13 days 9 days Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform to J-STD-020D1 standards for reflow temperatures. Important: During reflow, modules should not be above 260 and not for more than 30 seconds. Figure 12: Recommended Reflow Temperature Temperatures should not exceed the minimums or maximums presented in Table 24. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 32 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Table 24: Recommended Maximum and minimum temperatures Specification Temperature Inc./Dec. Rate (max) Temperature Decrease rate (goal) Soak Temp Increase rate (goal) Flux Soak Period (Min) Flux Soak Period (Max) Flux Soak Temp (Min) Flux Soak Temp (max) Time Above Liquidous (max) Time Above Liquidous (min) Time In Target Reflow Range (goal) Time At Absolute Peak (max) Liquidous Temperature (SAC305) Lower Target Reflow Temperature Upper Target Reflow Temperature Absolute Peak Temperature Value 1~3 2-4
.5 - 1 70 120 150 190 70 50 30 5 218 240 250 260 Unit C / Sec C / Sec C / Sec Sec Sec C C Sec Sec Sec Sec C C C C 8 FCC AND IC REGULATORY STATEMENTS Model US/FCC RM191-SM SQG-RM191 CANADA/IC 3147A-RM191 The OEM must follow the regulatory guidelines and warnings listed below to inherit Laird modular approval. The RM191-SM holds full modular approvals and has been certified for integration to products only by OEM integrators under the following conditions:
1. The antenna(s) must be installed such that a minimum separation distance of 30mm is maintained between the radiator (antenna) and all persons at all times. 2. The transmitter module must not be operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. The RM191-SM LoRa transmitter has been designed and approved to operate with the antennas listed below with a maximum gain of 2 dBi. The required antenna impedance is 50 ohms. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 33 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet External Antenna Part Number RFDPA131015IMBB301 Laird Part Number 0600-00060 WPANTDP036-R5A S152CL-L-PX-915S WPANT10009
-
-
-
Mfg. Walsin World Products Nearson World Products Type Dipole Dipole Dipole Dipole Gain
(dBi) 0.9 2.0 2.0 2.0 Connector Type U.FL U.FL U.FL U.FL RM1xx Part Number RM191-SM RM191-SM RM191-SM RM191-SM Note:
For the LoRa (external) dipole antenna, the OEM is free to choose another vendors antenna of like type and equal or lesser gain (2dBi) and still maintain compliance. Reference FCC Part 15.204(c)(4) for further information on this topic. The RM191 BLE transmitter contains an on-board 2.4GHz chip antenna Item Part Number 1 AT5020-E3R0HBANT/LF Mfg. ACX Type Gain (dBi) Ceramic
-1.5 RM1xx Part Number RM191-SM 8.1 Power Exposure Information Federal Communication Commission (FCC) Radiation Exposure Statement:
To comply with FCC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 30mm from all persons and operating in conjunction with any other antenna or transmitter. OEM Responsibilities WARNING: The OEM must ensure that FCC and Industry Canada labelling requirements are met. This includes a clearly Contains FCC ID: SQG-RM191 Contains IC: 3147A-RM191 visible label on the outside of the OEM enclosure specifying the appropriate Laird FCC identifier for this product. The OEM of the RM191-SM module must only use the approved antenna(s) listed above, which have been certified with this module. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. The user manual for the end product must also include the following information in a prominent location:
To comply with FCC and Industry Canada RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 30mm from all persons and operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on visible on outside of device:
https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 34 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation Label and text information should be in a size of type large enough to be readily legible, consistent with the dimensions of the equipment and the label. However, the type size for the text is not required to be larger than eight point. CAUTION:
WARNING:
The OEM should have their device which incorporates the RM191-SM tested by a qualified test house to verify compliance with FCC Part 15 Subpart B limits for unintentional radiators. Changes or modifications not expressly approved by Laird could void the users authority to operate the equipment. FCC Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to correct the interference by one or more of the following measures:
Re-orient or relocate the receiving antenna Increase the separation between the equipment and the receiver Connect the equipment to an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Warning:
THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS:
(1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 35 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Integration instructions for host product manufacturers Applicable FCC rules to module FCC Part 15.247 / FCC Part 15.249 Summarize the specific operational use conditions The antenna must be installed such that 20 cm is maintained between the antenna and users, and The transmitter module may not be co-located with any other transmitter or antenna The module is must be installed in mobile device. This device is intended only for OEM integrators under the following conditions:
1) 2) As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Limited module procedures Not applicable Trace antenna designs Not applicable RF exposure considerations 30mm separation distance and co-located issue shall be met as mentioned in Summarize the specific operational use conditions. Product manufacturer shall provide below text in end-product manual This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Antennas Brand name Model name Antenna type Antenna gain Antenna connector WP WPANT10009-S3A Dipole 2 IPX MHF Label and Compliance Information Product manufacturers need to provide a physical or e-label stating Contains FCC ID: SQG-RM191 with finished product Information on Test Modes and Additional Testing Requirements Test tool: 2.4G : UW TerninalX v1.01 & LoRa : proprietary LoRa Hopping test demo script shall be used to set the module to https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 36 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet transmit continuously. Additional Testing, Part 15 Subpart B Disclaimer The module is only FCC authorized for the specific rule parts listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed Industry Canada (IC) Warning:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. French equivalent is:
Le prsent appareil est conforme aux CNR d'Industrie Canada applicable aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. IC Radiation Exposure Statement To comply with Industry Canada RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 30mm from all persons and must not be operating in conjunction with any other antenna or transmitter. REMARQUE IMPORTANTE Dclaration IC d'exposition aux radiations Pour se conformer Industrie Canada RF limites d'exposition pour la population gnrale / exposition non contrle, l'antenne utilise pour ce transmetteur doit tre installe pour fournir une distance d'au moins 30 mm de toutes les personnes et ne doit pas fonctionner en conjonction avec toute autre antenne ou transmetteur. Modular Approval OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Approbation modulaire OEM intgrateur est toujours responsable de tester leur produit final pour les exigences de conformit supplmentaires ncessaires ce module install (par exemple, les missions de priphriques numriques, les exigences de priphriques PC, etc.) IMPORTANT NOTE:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:
Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 37 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: " RM191-SM Contient des IC: 3147A-
RM191";
9 CE REGULATORY The RM186 has been tested for compliance with relevant standards for the EU market. The RM186 module has been tested with a 2.0dBi external dipole antenna for LoRa, and the -1.5dBi on-board chip antenna for the BLE transmitter. For the external LoRa dipole antenna, the OEM can operate any other type of antenna but must ensure that the gain does not exceed 2.0dBi to maintain the Laird Technologies approval. The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their complete device. Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to. Test reports are available upon request. 9.1 Antenna Information The external flying lead U.FL dipole antennas for the 868MHz LoRa radio listed below were tested for use with the RM186. For CE mark countries, the OEM is free to use any manufacturers antenna and type of antenna as long as the gain is less than or equal to the highest gain approved for use (2.0dBi) Contact a Laird Technologies representative for more information regarding adding antennas. LoRa Antenna Part#
Item RFDPA131015IMBB301 Laird Part Number Mfg. Walsin 0600-00060 Gain (dBi) World Products Nearson Type Dipole Dipole Dipole 0.9 2.0 2.0 1 2 3 WPANTDP036-R5A S152CL-L-PX-868S The BLE transmitter on board the RM186 has been approved with an on-board -1.5dBi chip antenna Item Part Number 1 AT5020-E3R0HBANT/LF Mfg. ACX Type Ceramic Gain (dBi) RM1xx Part Number
-1.5 RM191-SM Note: The RM186 module internal BLE chipset IC pins are rated 4 kV (ESD HBM). ESD can find its way through the external 2-Wire SWD Programming/Debug Interface connector (if used on the customers design), if discharge is applied directly. Customer should ensure adequate protection against ESD on their end product design (using the RM186 module) to meet relevant ESD standard (for CE, this is EN301-489). 10 EU DECLARATIONS OF CONFORMITY 10.1 RM186-SM Manufacturer:
Product:
EU Directive:
Laird RM186-SM RTTE 1995/5/EC https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 38 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Conformity Assessment:
Annex IV Reference standards used for presumption of conformity:
Article Number 3.1a Requirement Health and Safety 3.1b 3.2 Protection requirements with respect to electromagnetic compatibility Means of the efficient use of the radio frequency spectrum Reference standard(s) EN60950-1:2006+A2:2013 EN 301 489-1 V1.9.2 (2011-09) EN 301 489-3 V1.6.1 (2013-08) EN 301 489-17 V2.2.1 (2012-09) Emissions:
EN55022:2006/A1:2007 (Class B) Immunity:
EN61000-4-2:2009 EN61000-4-3:2006/A1:2008/A2:2010 EN 300 220-2 V2.4.1 (2012-05) EN 300 328 V1.9.1 (2015-02) Declaration:
We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose. Place of Issue:
Laird W66N220 Commerce Court, Cedarburg, WI 53012 USA tel: +1-262-375-4400 fax: +1-262-364-2649 Date of Issue:
April 2016 Name of Authorized Person:
Thomas T Smith, Director of EMC Compliance https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 39 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet 11 ORDERING INFORMATION Part Number RM186-SM RM191-SM DVK RM186-SM DVK RM191-SM Description Intelligent LoRa/BLE Module [868MHz LoRa for Europe] featuring smart BASIC Intelligent LoRa/BLE Module [915MHz LoRa for US] featuring smart BASIC Development board with RM186-SM module soldered in place Development board with RM191-SM module soldered in place 11.1 General Comments This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If in doubt, ask. 12 BLUETOOTH SIG QUALIFICATION 12.1 Overview The RM186 and RM191 modules are listed on the Bluetooth SIG website as qualified End Products. Design Name RM186-SM RM191-SM Owner Laird Laird Declaration ID D030952 D030952 Link to listing on the SIG website https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=30952 https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=30952 It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to register as a member of the Bluetooth SIG www.bluetooth.org The following is a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/
For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document,
(login is required to views this document):
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486 Qualification Steps When Referencing a Laird End Product Design To qualify your product when referencing a Laird end-product design, follow these steps:
1. To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm Note:
A user name and password are required to access this site. In step 1, select the option, New Listing and Reference a Qualified Design. 2. 3. Enter D030952 in the End Product table entry. 4. Select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 40 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 RM1xx LoRa/BLE Modules Datasheet Note:
Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot proceed until the SIG invoice is paid. 5. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document accessible from the site. Your new design will be listed on the SIG website and you can print your Certificate and SDoC. For further information please refer to the following training material:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates Note:
If using the RM1xx with Laird Firmware and smartBASIC script, you can skip Controller Subsystem, Host Subsystem, and Profile Subsystem. 12.2 Additional Assistance Please contact your local sales representative or our support team for further assistance:
Laird Technologies Connectivity Products Business Unit Support Centre: https://connectivity.lairdtech.com/resources/support Email: wireless.support@lairdtech.com Phone: Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Web: https://connectivity.lairdtech.com/wireless-modules/lorawan-solutions/sentrius-rm1xx-lora-ble-modules Copyright 2019 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a tradename herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC. Laird, Laird Technologies, corresponding logos, and other marks are trademarks or registered trademarks of Laird. Other marks may be the property of third parties. Nothing herein provides a license under any Laird or any third party intellectual property right. https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions 41 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
1 2 3 4 | Users Manual Revised v0 4 | Users Manual | 1.94 MiB | June 05 2016 / August 05 2016 |
A Hardware Integration Guide LoRa/Bluetooth Low Energy (BLE) Module Part Numbers: RM186 and RM191 Preliminary Version 0.04 LoRa/BLE Modules Hardware Integration Guide REVISION HISTORY Date Version 0.01 0.02 28 Mar 2016 31 Mar 2016 Notes Preliminary Release Deleted Note 3 for power supply rise time in section Recommended Operating Parameters Modified section FCC and IC Regulatory Statements Approver Jonathan Kaye John Talley 0.03 28 April 2016 Updated Max Transmit power, temperatures, and DVK descriptions. Jonathan Kaye 0.04 29 April 2016 Update to IC Radiation Exposure Statement, Operating temperatures. John Talley Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 2 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide CONTENTS Overview and Key Features ........................................................................................................................................5 Features and Benefits .............................................................................................................................................5 Application Areas ....................................................................................................................................................5 Specifications ..............................................................................................................................................................6 Hardware Specifications .............................................................................................................................................9 Block Diagram and Pin-out .....................................................................................................................................9 Pin Definitions ..................................................................................................................................................... 10 Electrical Specifications ....................................................................................................................................... 12 Absolute Maximum Ratings............................................................................................................................. 12 Recommended Operating Parameters ............................................................................................................ 12 nAutoRUN Pin and Operating Modes .............................................................................................................. 14 LoRa Power Consumption ....................................................................................................................................... 15 BLE Power Consumption ......................................................................................................................................... 15 BLE Measured Peak Current Waveforms during Connection ............................................................................. 17 Peripheral Block Current Consumption ............................................................................................................... 17 Functional Description ............................................................................................................................................. 18 Power Management (includes brown-out and power on reset) ........................................................................ 18 Clocks and Timers ................................................................................................................................................ 19 Clocks ............................................................................................................................................................... 19 Timers .............................................................................................................................................................. 19 Memory for smartBASIC Application Code ......................................................................................................... 19 RF ......................................................................................................................................................................... 19 UART Interface .................................................................................................................................................... 19 SPI Bus ................................................................................................................................................................. 20 I2C Interface ........................................................................................................................................................ 21 General Purpose I/O, ADC and PWM/FREQ ........................................................................................................ 21 GPIO ................................................................................................................................................................. 21 ADC .................................................................................................................................................................. 21 PWM and FREQ Signal Output on up to Two SIO Pins .................................................................................... 22 nRESET Pin ........................................................................................................................................................... 22 nAutoRUN Pin ...................................................................................................................................................... 22 Two-Wire SWD Programming/Debug Interface .................................................................................................. 22 RM1xx on-board chip antenna characteristics .................................................................................................... 23 Hardware Integration Suggestions .......................................................................................................................... 23 Circuit .................................................................................................................................................................. 23 PCB Layout on Host PCB - General ...................................................................................................................... 25 Antenna Keep-out on Host PCB ....................................................................................................................... 25 Antenna Keep-out and Proximity to Metal or Plastic ...................................................................................... 26 LoRa External Antenna Integration with RM1xx ................................................................................................. 27 Mechanical Details .................................................................................................................................................. 27 RM1xx Mechanical Details .................................................................................................................................. 27 Host PCB Land Pattern and Antenna Keep-out for RM1xx.................................................................................. 28 Application Note for Surface Mount Modules ........................................................................................................ 28 Introduction ......................................................................................................................................................... 28 Shipping ............................................................................................................................................................... 29 Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 3 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Reflow Parameters .............................................................................................................................................. 29 FCC and IC Regulatory Statements .......................................................................................................................... 31 Power Exposure Information............................................................................................................................... 32 OEM Responsibilities ........................................................................................................................................... 32 CE Regulatory .......................................................................................................................................................... 34 Antenna Information ........................................................................................................................................... 35 EU Declarations of Conformity ................................................................................................................................ 36 RM186-SM ........................................................................................................................................................... 36 Ordering Information .............................................................................................................................................. 37 General Comments .............................................................................................................................................. 37 Bluetooth SIG Qualification ..................................................................................................................................... 37 Overview .............................................................................................................................................................. 37 Qualification Steps When Deviating From a Laird End Product Design .............................................................. 38 Additional Assistance .......................................................................................................................................... 39 Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 4 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide OVERVIEW AND KEY FEATURES This Hardware Integration Guide describes both the RM186 (868MHz band for EU) and RM191 (915MHz band for US). The differences will be outlined in the Radio Specifications. Every RM1xx Series module is designed to enable OEMs to add a long range LoRa radio link as well as central role Bluetooth Low Energy (BLE) to small, portable, power-conscious devices. The RM1xx modules are enabled with Lairds smart BASIC, an event-driven programming language that enables OEMs to make their product development quicker and simpler, significantly reducing time to market. smartBASIC enables customers to develop a complete embedded application inside the compact RM1xx hardware, connecting to a wide array of external sensors via its I2C, SPI, UART, ADC or GPIO interfaces. Based on the world-leading Nordic Semiconductor nRF51822 (BLE) and Semtech Sx1272 (LoRa) chipsets, the RM1xx modules provide ultra-low power consumption with outstanding wireless range using the LoRa radio link and local BLE connections via 3 dBm of transmit power. This document should be read in conjunction with the smart BASIC user manual. Note:
This is a PRELIMINARY version of the RM1xx Hardware Integration Guide. Information in this document is subject to change. Please contact Laird to obtain the most recent version of this document http://ews-support.lairdtech.com. Features and Benefits Application Areas smartBASIC programming language Bluetooth v4.0 Central Mode On Board BLE Chip Antenna u.FL for external LoRa antenna Bluetooth SIG Listed Compact Footprint BLE Programmable TX power +3 dBm to -20 dBm BLE TX whisper mode (-30 dBm, -55 dBm) BLE RX sensitivity: -91 dBm Ultra-low power consumption BLE TX: 11.6 mA peak (at +3 dBm) (See Note 4 in the Power Long Range LoRa range up to 15km Consumption section) BLE RX: 8.8 mA peak (See Note 4 in the Power Consumption section) Standby Doze: TBD Deep Sleep: TBD (See Note 4 in the Power Consumption section) UART, GPIO, ADC, PWM FREQ output, TIMERS, I2C, and SPI interfaces Fast Time to Market FCC/IC (RM191-SM), CE (RM186-SM) No external components required Irrigation / Agriculture Public or Private Networks Parking Lighting Asset Tracking Tank Monitoring Smart Home smoke alarms, heating, Access Control security Industrial Automation Factory Any long range, battery powered sensor application!
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 5 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide SPECIFICATIONS Table 1: Specifications Categories LoRa Wireless Specification Feature LoRa Frequency Implementation LoRaWAN 1.01 (End Device) 902-928MHz RM191 865-870 MHz RM186 BLE Wireless Specification Maximum Transmit Power Setting Minimum Transmit Power Setting 15.5 dBm 13.5 dBm 1.5 dBm RM191 RM186 Receive Sensitivity Range Raw Data Rates
(over the air) Bluetooth (BLE) Frequency Maximum Transmit Power Setting Minimum Transmit Power Setting TX Whisper Mode 1 Transmit Power TX Whisper Mode 2 Transmit Power Receive Sensitivity
(0.1% BER) Link Budget Range TX Whisper Modes Range
(TX Whisper Mode 2) Up to -135 dBm
(Bandwidth 125 kHz Spreading Factor 12) Up to 15 km in free space 250 bps 50 kbps RM186 980 bps 21.9kbps RM191 V4.0 Central Mode 2.402 - 2.480 GHz 3 dBm (into -1.5 dBi chip antenna)
-20 dBm (in 4 dB steps) with smartBASIC command
-16 dBm
-12 dBm
-8 dBm
-4 dBm 0 dBm
-30 dBm (min.) with smartBASIC command
-55 dBm (min.) with smartBASIC command
-91 dBm typical 95 dB (@ 1 Mbps) Up to 100 m in free space Range reduction feature with TX Whisper modes with smartBASIC command.
<~30 cm Raw Data Rates 1 Mbps (over the air) Host Interface and Peripherals Total UART 14 x Multifunction I/O lines TX, RX, CTS, RTS DCD, RI, DTR, DSR, CTS, RTS (Note 1) Default 115200, n, 8, 1 Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 6 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Categories Feature GPIO ADC Implementation From 1,200 to 460800 bps Up to 14 With configurable I/O direction, O/P drive strength
(standard 0.5 mA or high 5 mA), pull-up/pull-down Four 10-bit channels (including ADC reference) 10 bit resolution 1.2 V internal reference 1/1, 2/3, 1/3 pre-scaling PWM or FREQ output PWM or FREQ output on up to two GPIO output pins:
PWM output duty cycle 0%-100%
PWM output frequency Up to 500 kHz (Note 7) FREQ output frequency 0 MHz-4 MHz
(50% duty cycle) One I2C interface (up to 400 kbps) (Note 2) One SPI Master interface (up to 4 Mbps) (Note 3) I2C SPI Services FW Upgrade Services supported GATT client and capabilities smartBASIC runtime engine FW upgrade
(1) Via UART
(2) Via 2-Wire SWD Programming/Debug Interface Programmability smartBASIC On-board programming language similar to BASIC. Control Protocols Operating Modes smartBASIC application download
(1) Via UART.
(2) Via 2-Wire SWD Programming/Debug Interface Any User defined via smartBASIC Self-contained Run mode Selected by nAutoRun pin status:
nAutoRun = LOW (0V): Then runs $autorun$
(smartBASIC application script) if it exists. Interactive / development mode nAutoRun = HIGH (VCC): Then runs via at+run (and file name of smartBASIC application script). Supply Voltage Supply (VCC) 2.1V 3.5V Internal DCDC converter (Note 5) Power Consumption Active modes peak current
(for Max TX PWR 3 dBm) Active modes peak current
(for TX Whisper mode2 PWR -
55 dBm) 1.8V 2.1V DCDC switched on if VCC >2.1V at power-up Internal LDO Connected mode 11.6 mA peak TX 8.9 mA peak RX Connected mode 5 mA peak TX 8.5 mA peak RX Antenna Options Active modes average current Depends on many factors. See Power Consumption. Ultra-low power modes Standby Doze Deep Sleep 2.6 uA typical (Note 6) 600 nA (Note 6) BLE (Internal) chip antenna On-board ceramic chip monopole antenna
-1.5 dBi LoRa (External) Dipole antenna with U.FL (IPEX) connector up to 2 dBi Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 7 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Categories Physical Environmental Miscellaneous Feature Dimensions Weight Operating Storage Lead Free Warranty Development Tools Development Kit Approvals Bluetooth FCC / IC / CE Implementation 25.4 mm x 25.4 mm x 3.1 mm 3 grams
-40 C to +85 C (VCC 1.8V 3.5 V)
-40 C to +85 C Lead-free and RoHS compliant 5-Year Limited Lifetime Development Kit DVK-RM1xx and Free Software Tools SIG Listed Declaration ID RM191-SM: FCC/IC, RM186-SM: CE externally as per I2C standard. customer using any spare SIO pin within their smartBASIC application script allowing multi-
dropping. loaded with any smart BASIC application script (as that is dependent on customer end application or use). Laird provides many sample smart BASIC application scripts covering the services listed. Additional applications being added every quarter. Note 1: DSR, DTR, RI, and DCD can be implemented in the smart BASIC application. Note 2: With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL MUST be connected Note 3: SPI interface (master) consists of SPI MOSI, SPI MISO and SPI CLK. SPI CS is created by Note 4: RM1xx module comes loaded with smart BASIC runtime engine FW, but does not come Note 5: Laird suggests using Vcc of 3.3V +/-5% (3.13V-3.46V) for maximum LoRa output power. Note 6: Deep Sleep current <1000nA (typical). Note 7: PWM output signal has a frequency and duty cycle property. PWM output is generated using 32-bit hardware timers. The timers are clocked by a 1MHz (1uS period) clock source. Trade-off PWM output frequency with resolution. For example:
PWM output frequency of 500kHz (2uS) results in resolution of 1:2 PWM output frequency of 100kHz (10uS) results in resolution of 1:10 PWM output frequency of 10kHz (100uS) results in resolution of 1:100 PWM output frequency of 1kHz(1000uS) results in resolution of 1:1000 Refer to the smartBASIC user guide for details. WARNING: above 3.5V, the LoRa transmitter will be disabled to maintain regulatory compliance Standby Doze current TBD (typical). Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 8 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide HARDWARE SPECIFICATIONS Block Diagram and Pin-out Figure 1: Functional HW and SW block diagram for RM1xx series smartBASIC modules Figure 2: RM186/RM191 module pin-out (top view) Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 9 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Default Function Alt. Funct. Default Direction Note14 Pull-up/
Pull-down Note14 Notes Comment
-
-
-
-
-
UART TX OUT Set high in FW 1,2,4,6,7 SIO_25 nAutoRUN/DIO DIO LoRa/BLE Modules Hardware Integration Guide Pin Definitions Table 2: Pin definitions Pin
#
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin Name GND SIO_21 SIO_22 SIO_23 SIO_24
-
DIO DIO DIO DIO SIO_28 GND SIO_29 SIO_30 GND VCC_BLE VCC_LORA GND SIO_00 SIO_17 DIO
-
DIO DIO
-
-
-
DIO DIO 17 SIO_03/AIN DIO/AIN 18 SIO_04/AIN 19 SIO_05/AIN 20 21 22 23 24 SIO_06/AIN GND nRESET NC GND DIO DIO DIO Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless UART RX UART RTS UART CTS
-
-
I2C SCL I2C SDA
-
-
-
SPI CLK SPI MISO SPI MOSI AIN AIN AIN IN PULL-UP 1,2,4,6,7 OUT IN IN IN
-
IN IN
-
-
-
IN IN Set low in FW PULL-
DOWN 1,2,4,6,7 1,2,4,6,7 NONE IN ONLY PULL-UP 13,1,2,6
-
-
PULL-UP 1,2,6,11 PULL-UP 1,2,6,11
-
-
-
-
-
-
PULL-UP 1,2,6,11 PULL-UP 1,2,6,11 IN PULL-UP 1,2,3,4,5,6,11 PULL-UP 1,2,3,4,5,6,11 PULL-UP 1,2,3,4,5,6,11 PULL-UP 1,2,3,4,5,6,11 9,10 9 IN IN IN IN 10 UARTCLOSE() selects DIO functionality and UARTOPEN() selects UART comms behaviour Laird Devkit, UART_DSR via J10, J12 Laird DevKit: J6 I2COPEN() in smartBASIC selects I2C function Vcc for BLE Radio Vcc for Lora Radio SPIOPEN() in smartBASIC selects SPI function, MOSI and CLK will be outputs when in SPI master mode. See note 11 Laird Devkit: SPI Slave Select Laird Devkit:
Button2 or Ana Temp Sensor via J7 Laird Devkit: LED5 or Arduino A0 Via J8 System Reset (Active low) DO NOT CONNECT Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Note 1: Secondary function is selectable in smartBASIC application. Note 2: DIO = Digital Input or Output. I/O voltage level tracks VCC. Note 3: AIN = Analog Input Note 4: DIO or AIN functionality is selected using the GpioSetFunc() function in smartBASIC. Note 5: AIN configuration selected using GpioSetFunc() function. Note 6: I2C, UART, SPI controlled by xxxOPEN() functions in smart BASIC. Note 7: SIO_21 to SIO_24 are DIO by default when $autorun$ app runs on power up. Note 8: N/A Note 9: Hidden 2-Wire SWD Programming/Debug Interface, pin22 (SWDIO) and pin23 (SWDCLK). Used for upgrading smartBASIC runtime engine FW with J-link programmer. Using this hidden 2-Wire SWD Programming/Debug Interface on customers host PCB requires header connector Samtec FTSH-105-
01-L-DV, refer to section 2-Wire SWD Programming/Debug Interface for details. Note 10: Pull the nRESET pin (pin 22) low for minimum 100 mS to reset the module. Note11: SPI CS is created by customer using any spare SIO pin within their smartBASIC application script allowing multi-dropping. Note12: N/A Note13: N/A Note14: smart BASIC runtime engine has DIO (Default Function) INPUT pins, have by default PULL-UP enabled. This was done to avoid floating inputs (which can also cause current consumption in low power modes (e.g. StandbyDoze) to drift with time. In any case customer can disable the PUL-UP through their smart BASIC application. All the SIO pins (with a default function of DIO are inputs apart from SIO_21 and SIO_23, which are outputs):
- SIO_21 (alternative function UART_TX) is an output, set high (in FW).
- SIO_23 (alternative function UART_RTS) is an output, set low (in FW).
- SIO_22 (alternative function UART_RX) is an input, set with internal pull-up (in FW).
- SIO_24 (alternative function UART_CTS) is an input, set with internal pull-down (in FW). The RM1xx module is delivered with the integrated smartBASIC runtime engine FW loaded (but no onboard smartBASIC application script). Because of this, it starts up in AT command mode by default. At reset, all SIO lines are configured as the defaults shown above. SIO lines can be configured through the smart BASIC application script to be either inputs or outputs with pull-
ups or pull-downs. When an alternative SIO function is selected (such as I2C or SPI), the firmware does not allow Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 11 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide the setup of internal pull-up/pull-down. Therefore, when I2C interface is selected, pull-up resistors on I2C SDA and I2C SCL MUST be connected externally as per I2C standard. UART_RX, UART_TX, UART_CTS are Vcc logic levels (if VCC is 3.3 V, i.e. SIO pin I/O levels track VCC). For example, when RX and TX are idle, they sit at 3.3 V (if VCC is 3.3 V). Conversely, handshaking pins CTS and RTS at 0 V are treated as assertions. Pin 6 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-RM1xx-SM) it is connected so that the state is driven by the hosts DTR output line. The nAutoRUN pin must be externally held high or low to select between the following two operating modes:
Self-contained Run mode (nAutoRUN pin held at 0 V). Interactive / development mode (nAutoRUN pin held at VCC). smartBASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low and if there is a smartBASIC application script named $autorun$, then the smartBASIC runtime engine FW executes the application script automatically; hence the name Self-contained Run Mode. Electrical Specifications Absolute Maximum Ratings Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below; exceeding these values causes permanent damage (Table 3). Table 3: Maximum Current Ratings Parameter Voltage at VCC_BLE &
VCC_LORA pin Voltage at GND pin Voltage at SIO pin Storage temperature Minimum
-0.3
-0.3
-40 Maximum
+3.6 (Note 1) 0 VCC+0.3
+85 Unit V V V C Note 1: Absolute Max Rating for VCC pin (max) is 3.6V, however we recommend 3.3V +/-5% as the spec for maximum Vcc. The LoRa transmitter shuts down if the voltage exceeds 3.5V . Recommended Operating Parameters Table 4: Power Supply Operating Parameters Parameter VCC1 VCC Maximum ripple or noise2 VCC rise time Operating Temperature Range Minimum Typical Maximum 1.8
-40 3
-
3.5 10 TBD
+85 Unit V mV mS C Note 1:
Internal DCDC is used if VCC >2.1 V on power-up; otherwise internal LDO is used. If supply voltage is greater than 3.5V, the LoRa transmitter will be disabled. Note 2: The maximum VCC ripple or noise (at any frequency) that does not disturb the radio. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 12 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Typical Maximum Unit LoRa/BLE Modules Hardware Integration Guide Table 5: Signal Levels for Interface, SIO Parameter VIH Input high voltage VIL Input low voltage VOH Output high voltage
(std. drive, 0.5mA)
(high-drive, 5mA) (Note 1) VOL Output low voltage
(std. drive, 0.5mA)
(high-drive, 5mA) (Note 1) Pull up resistance Pull down resistance Minimum 0.7VCC VSS VCC-0.3 VCC-0.3 VSS VSS 11 11 13 13 Note 1: Maximum number of pins with 5mA high drive is three. Table 6: SIO pin alternative function AIN (ADC) specification Parameter ADC Internal reference voltage ADC pin input internal selectable scaling Minimum
-1.5%
ADC input pin (AIN) voltage maximum without damaging ADC w.r.t VCC Prescaling 3.3 V 1/1 3.3 V 2/3 3.3 V 1/3 1.8 V 1/1 1.8 V 2/3 1.8 V 1/3 ADC input pin (AIN) voltage maximum without saturating ADC (with 1.2V internal reference)1 1/1 prescaling 2/3 prescaling 1/3 prescaling Time required to convert single sample in 10bit mode 9bit mode2 8 bit mode2 ADC input impedance (during operation)3 Typical 1.2 V 1/1, 1/3, 2/3 68 36 20 VCC 0.3 VCC VCC 0.3 0.3 16 16 Maximum
+1.5%
2.4 3.6 3.6 2.1 2.1 2.1 1.2 1.8 3.6 V V V V V V k k Unit
%
Scaling V V V V V V V V V uS uS uS Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 13 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Note 1: Stay within internal 1.2 V reference voltage with given prescaling on AIN pin and do not violate ADC maximum input voltage (for damage) for a given VCC, e.g. If VCC is 1.8 V can only expose AIN pin to 2.1 V (VCC+0.3). Note 2: Currently, the smartBASIC runtime engine firmware only allows 10-bit mode. Note 3: ADC input impedance is estimated mean impedance of the ADC (AIN) pins. The tolerance is +/-20%. The ADC is highly sensitive to the impedance of the source. The ADC (AIN) input impedance is 200k-
600k depending on your ADC gain (pre-scaling) setting. Normally, when not sampling, the ADC (AIN) impedance will have very high value and can consider it to be an open circuit. The moment ADC is sampling, ADC(AIN) impedance is 200k-600k. nAutoRUN Pin and Operating Modes Operating modes (refer to the smartBASIC manual for details):
Self-contained mode Interactive/Development mode Table 7: nAutoRUN pin Signal Name Pin #
I/O Comments nAutoRUN (SIO_25) 6 I Input with active low logic. Operating mode selected by nAutoRun pin status:
If Low (0V), runs $autorun$ if it exists;
If High (VCC), runs via at+run (and file name of application). Pin 40 (nAutoRUN) is an input, with active low logic. In the development board (DVK-RM1xx) it is connected so that the state is driven by the hosts DTR output line. nAutoRUN pin needs to be externally held high or low to select between the two RM1xx operating modes:
Self-contained Run mode (nAutoRUN pin held at 0V). Interactive/Development mode (nAutoRUN pin held at VCC) smartBASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low and if there is a smartBASIC application named $autorun$ then the smartBASIC runtime engine executes the application automatically; hence the name self-contained run mode. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 14 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide LORA POWER CONSUMPTION Data taken at VCC 3.3V with DCDC converter ON (see Note1) at 25C. All peripherals turned off except for UART. Table 8: Power consumption Parameter RM191 TX Currents TX current @TXpwr= +15 dBm TX current @TXpwr= 1 dBm RM186 TX Currents TX current @TXpwr= 13.5dBm TX current @TXpwr= 1 dBm RM1xx Receive Current RX current Min Typical Max 50 TBD 38 TBD 13 Note 1: At VCC = 3.3V, the DCDC converter will be active. Unit mA mA mA mA mA BLE POWER CONSUMPTION Data taken at VCC 3.3V (see Note1) and 25C. Table 9: Power consumption Parameter Active Mode peak current (Note 1)
(Connection) TX only run peak current @TXpwr= + 3 dBm TX only run peak current @T pwr= 0 dBm TX only run peak current @TXpwr= -4 dBm TX only run peak current @TXpwr= -8 dBm TX only run peak current @TXpwr= -12 dBm TX only run peak current @TXpwr= -16 dBm T X only run peak current @TXpwr= -20 dBm TX Whisper Mode 1 TX only run peak current @TXpwr= -30 dBm TX Whisper Mode 2 TX only run peak current @TXpwr= -55 dBm Active Mode RX only peak current Ultra Low Power Mode1 (Note 2) Standby Doze Ultra Low Power Mode2 (Note 3) Deep Sleep (no RAM retention) Min 15 Typical Max Unit 11.6 8.4 7.1 6.9 6.4 6.1 5.5 5.4 5.0 8.7 2.6 600 (Note 4) mA mA mA mA mA mA mA mA mA mA uA nA Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Parameter Active Mode Average current (Note 4) Connection Average Current draw Max with connection interval (min) 7.5 mS with connection interval 67.5 mS Min with connection interval (max) 4000 mS Min Typical Max Unit
~400
~2.6-4.1 uA uA Note 1:
If VCC reduces to 2.1V (operating range of DCDC), the peak current consumption would increase from 11.6mA to ~15.5mA for TX power setting of +3dBm. Note 2: RM1xx: Standby Doze current TBD typical. Standby Doze is entered automatically (when waitevent statement is encountered within a smartBASIC application script). See individual peripherals current consumption in tables in section Peripheral block current consumption 4.3. Note 3:
In Deep Sleep, everything is disabled and the only wake-up sources are reset and changes on pins on which sense is enabled. A reset is required to exit Deep Sleep. Note 4: Data taken with TX power 3 dBm and all peripherals off (UART OFF after radio event). Average current consumption depends on a number of factors (including TX power, VCC and accuracy of 16 MHz and 32.768 kHz crystals). With these factors fixed, the largest variable is the connection interval. Connection Interval Range:
7.5 ms to 4000 ms in multiples of 1.25 ms. For a connection event:
- The minimum average current consumption is when the connection interval is large 4000 mS The maximum average current consumption is with the shortest connection interval of 7.5 ms; no slave latency. Other factors that are also related to average current consumption include whether transmitting 6 packets per connection interval & each packet contains 20 bytes (which is the maximum for each packet) and an inaccurate 32 kHz master clock accuracy would increase the average current consumption. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 16 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide BLE Measured Peak Current Waveforms during Connection The following figures illustrate BLE current waveforms observed as the RM1xx module performs during connection functionality. TBD: Update plot Figure 3: Typical peak current consumption profile with TBD conditions Note: In the above picture, UART is ON. X-axis time (1 mS per square), Y-axis current (2 mA per square). Peripheral Block Current Consumption The values below are calculated for a typical operating voltage of 3 V. Table 10: UART Power Consumption Parameter UART Run current @ Max Baud Rate UART Run current @ 115200 bps UART Run current @ 1200 bps UART Baud rate Table 11: SPI Power Consumption Parameter SPI Master Run current @ 125 kbps SPI Master Run current @ 4 Mbps SPI bit rate Table 12: I2C Power Consumption Parameter I2C Run current @ 100 kbps I2C Run current @ 400 kbps I2C Bit rate Min Typ Max Unit 1200 230 220 210 uA uA uA 460800 bps Min 0.125 Min 100 Typ 180 200 Typ 380 400 Max 4 Max 400 Unit uA uA Mbps Unit uA uA kbps Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 17 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Table 13: ADC Power Consumption Parameter ADC current during conversion Min Typ 260 Max Unit uA For asynchronous interface like the UART (asynchronous as the other end can communicate at any time), the UART (on RM1xx) must kept open (by a command in smart BASIC application script) resulting in the base current consumption penalty. For synchronous interface like the I2C or SPI (since RM1xx side is the master), the interface can be closed and opened only (by a command in smart BASIC application script) when needed, resulting in current saving (no base current consumption penalty). Similar argument for ADC (open ADC when needed). FUNCTIONAL DESCRIPTION The RM1xx module is a self-contained LoRa/Bluetooth Low Energy product and requires only power and a users smartBASIC application to implement full LoRa and BLE functionality. The LoRa radio in conjunction with its external 2 dBi antenna implements a long range, low data rate connection to a LoRa gateway up to 15 km. The integrated, high performance BLE antenna combined with the RF and base-band circuitry provides the Bluetooth Low Energy wireless link to connect to local BLE sensors. The RM1xx SIO lines provide the OEMs chosen interface connection to the wired serial/SPI/I2C/analog sensors. The users smartBASIC application binds the sensors to the LoRa and BLE wireless functionality. The variety of hardware interfaces and the smartBASIC programming language allow the RM1xx module to serve a wide range of wired/wireless applications, whilst reducing overall time to market and the learning curve for developing LoRa and BLE products. To provide the widest scope for integration a variety of physical host interfaces/sensors are provided. The major RM1xx series module functional blocks described below. Power Management (includes brown-out and power on reset) Power management features:
System Standby Doze/Deep Sleep modes Brownout Reset Open/Close peripherals (UART, SPI, I2C, SIOs and ADC). Peripherals consume current when open; each peripheral can be individually closed to save power consumption (with a command in a smartBASIC application script). Two-region RAM retention (No RAM retention in Deep Sleep mode) Pin wake-up system from deep sleep smartBASIC command allows the VCC voltage to be read (through the internal ADC) Power supply features:
Supervisor hardware to manage power on reset, brownout (and power fail). 1.8V to 3.5V supply range. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 18 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Clocks and Timers Clocks The integrated high accuracy (+/-20 ppm) 32.768 kHz crystal oscillator provides protocol timing and helps with radio power consumption in the system Standby Doze/Deep sleep modes by reducing the time that the RX window needs to be open. Standard accuracy clocks tend to have lower accuracy +/-250 ppm. The integrated high accuracy 16 MHz (+/-10 ppm) crystal oscillator helps with radio operation and also helps reduce power consumption in the active modes. Timers In keeping with the event-driven paradigm of smartBASIC, the timer subsystem enables smartBASIC applications to be written which allow future events to be generated based on timeouts. Regular Timer There are eight built-in timers (regular timers) derived from a single RTC clock which are controlled solely by smart BASIC functions. The resolution of the regular timer is 976 microseconds. Tick Timer A 31-bit free running counter that increments every 1 millisecond. The resolution of this counter is 488 microseconds. This counter can be accessed using the functions GetTickCount() and GetTickSince(). Refer to the smart BASIC user guide for more information. Memory for smartBASIC Application Code User has up to TBD Kbytes of data memory available for smart BASIC application script. RF 865 870MHz (250 11000 bps over the air data rate) RM186 protocol can optionally employs 50kbps FSK when enabled by the gateway RM191 Lora radio: 902 928MHz (980 21900 bps over the air data rate) Bluetooth Low Energy radio: 24022480MHz (1Mbps over the air data rate). BLE TX output power of +3dBm programmable (via smartBASIC command) to -20dBm in steps of 4dB. BLE TX Whisper mode1 -30dBm (via smartBASIC command). BLE TX Whisper mode2 -55dBm (via smartBASIC command). BLE Receiver (with integrated channel filters) to achieve maximum sensitivity -91dBm @ 1Mbps BLE. BLE Antenna: Integrated monopole chip antenna on RM1xx UART Interface The Universal Asynchronous Receiver/Transmitter offers fast, full-duplex, asynchronous serial communication with built-in flow control support (UART_CTS, UART_RTS) in HW. Parity checking is supported. UART_TX, UART_RX, UART_RTS, and UART_CTS form a conventional asynchronous serial data port with handshaking. The interface is designed to operate correctly when connected to other UART devices such as the 16550A. The signaling levels are CMOS logic levels that track VCC, and are inverted with respect to the signaling on an RS232 cable. Two-way hardware flow control is implemented by UART_RTS and UART_CTS. UART_RTS is an output and UART_CTS is an input. Both are active low. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 19 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide These signals operate according to normal industry convention. UART_RX, UART_TX, UART_CTS, UART_RTS are all CMOS logic levels that track VCC. For example, when RX and TX are idle they sit at a high logic level (VCC). Conversely for handshaking pins CTS, RTS at 0 V is treated as an assertion. The module communicates with the customer application using the following signals (Figure 4):
Port /TXD of the application sends data to the modules UART_RX signal line Port /RXD of the application receives data from the modules UART_TX signal line Figure 4: UART Signals Note: The RM1xx serial module output is at CMOS logic levels that track VCC. Level conversion must be added to interface with an RS-232 level compliant interface. Some serial implementations link CTS and RTS to remove the need for handshaking. Laird does not recommend linking CTS and RTS other than for testing and prototyping. If these pins are linked and the host sends data at the point that the RM1xx deasserts its RTS signal, then there is significant risk that internal receive buffers will overflow, which could lead to an internal processor crash. This will drop the connection and may require a power cycle to reset the module. Laird recommends that the correct CTS/RTS handshaking protocol be adhered to for proper operation. Table 14: UART Interface Signal Name SIO_21/UART_TX SIO_22/UART_RX SIO_23/UART_RTS SIO_24/UART_CTS Pin #
2 3 4 5 I/O Comments O SIO_21 (alternative function UART_TX) is an output, set high (in FW). I O I SIO_22 (alternative function UART_RX) is an input, set with internal pull-
up (in FW). SIO_23 (alternative function UART_RTS) is an output, set low (in FW). SIO_24 (alternative function UART_CTS) is an input, set with internal pull-
down (in FW). The UART interface is also used to load customer developed smartBASIC application script. SPI Bus The SPI interface is an alternate function on SIO pins, configurable by smartBASIC. The module is a master device that uses terminals SPI_MOSI, SPI_MISO, and SPI_CLK. SPI_CSB is implemented using any spare SIO digital output pins to allow for multi-dropping. The SPI interface enables full duplex synchronous communication between devices. It supports a three-wire
(SPI_MOSI, SPI_MISO, SPI_SCK,) bidirectional bus with fast data transfers to and from multiple slaves. Individual chip select signals are necessary for each of the slave devices attached to a bus, but control of these is left to the application through use of SIO signals. I/O data is double buffered. The SPI peripheral supports SPI mode 0, 1, 2, and 3. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 20 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Table 15: Peripheral supports Signal Name Pin #
SPI_MOSI 17 SPI_MISO SPI_CLK 16 15 I2C Interface I/O O I O Comments This interface is an alternate function configurable by smart BASIC. Default in the FW pin 15 and 17 are inputs. SPIOPEN() in smart BASIC selects SPI function and changes pin14 and 16 to outputs
(when in SPI master mode). The I2C interface is an alternate function on SIO pins, configurable by smart BASIC command. The two-wire interface can interface a bi-directional wired-OR bus with two lines (SCL, SDA) and has master
/slave topology. The interface is capable of clock stretching. Data rates of 100 kbps and 400 kbps are supported. An I2C interface allows multiple masters and slaves to communicate over a shared wired-OR type bus consisting two lines which normally sit at VCC. The RM1xx module can only be configured as an I2C master with additional constraint that it be the only master on the bus. The SCL is the clock line which is always sourced by the master and SDA is a bi-directional data line which can be driven by any device on the bus. IMPORTANT:
It is essential to remember that pull-up resistors on both SCL and SDA lines are not provided in the module and MUST be provided external to the module. Table 16: I2C Interface Signal Name I2C_SDA I2C_SCL Pin #
10 9 I/O I/O I/O Comments This interface is an alternate function on each pin, configurable by smartBASIC. I2COPEN() in smartBASIC selects I2C function. General Purpose I/O, ADC and PWM/FREQ GPIO All SIO pins are configurable by smartBASIC. They can be accessed individually. Each has the following user configured features:
Input/output direction Output drive strength (standard drive 0.5mA or high drive 5mA) Wake-up from high or low level triggers on all pins Internal pull up and pull down resistors (13K typical) or no pull-up/down ADC The ADC is an alternate function on four select SIO pins, configurable by smart BASIC. This enables sampling up to four external signals via an internal MUX to the 10 bit ADC. The ADC has configurable input pre-scaling and sample resolution. Analog Interface (ADC) Table 17: Analog interface Signal Name AIN Analog Input AIN Analog Input AIN Analog Input AIN Analog Input Pin No I/O Comments 17 18 19 20 I I I I This interface is an alternate function on each pin, configurable by smartBASIC. AIN configuration selected using GpioSetFunc() function. 10 bit resolution. Voltage scaling 1/1, 2/3, 1/3. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 21 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide PWM and FREQ Signal Output on up to Two SIO Pins The PWM and FREQ output is an alternate function on SIO pins, configurable by smart BASIC. The ability to output a PWM (Pulse Width Modulated) signal or FREQ output signal on up to 2 GPIO (SIO) output pins can be selected using GpioSetFunc() function. PWM output signal has a frequency and duty cycle property. PWM output is generated using 32-bit hardware timers. The timers are clocked by a 1MHz clock source. Frequency is adjustable (up to 1 MHz) and the Duty cycle can be set over range from 0% to 100% (both configurable by smart BASIC command). Note, the frequency driving each of the 2 SIO pins is the same but the duty cycle can be independently set for each pin. FREQ output signal frequency can be set over a range of 0Hz to 4MHz (with 50% mark-space ratio). nRESET Pin Table 18: nRESET pin Signal Name nRESET nAutoRUN Pin Pin No I/O 22 I Comments HW reset (active low). Pull the nRESET pin low for minimum 100mS in order for the RM1xx to reset. Refer to section nAutoRUN pin and Operating Modes regarding operating modes and the nAutoRUN pin. Self-contained Run mode Interactive / Development mode Two-Wire SWD Programming/Debug Interface Customers have the option to use the 2-wire (SWD Programming/Debug) interface, during production, to clone the file system of a Golden preconfigured RM1xx to others using the Flash Cloning process described in the app note: TBD Signal Name (hidden name) Pin No nRESET (SWDIO) NC (SWDCLK) 22 23 I/O Comments I/O I The connector for the (2-Wire SWD Programming/Debug Interface) MPN is as follows:
Reference JP1 Note1 Part FTSH-105 Description Header, 1.27mm, SMD, 10-way, FTSH-105-01-L-DV Samtec Note 1: Reference the RM1xx development board schematic. Figure 5 shows the wiring for the 2-Wire SWD Programming/Debug Interface connector and RM1xx module hidden 2-Wire SWD Programming/Debug Interface pins. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 22 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide
(RM1xx Pin 22)
(RM1xx Pin 23) Figure 5: Wiring for 2-Wire SWD Programming/Debug Interface connector to SWD Programming/Debug interface on RM1xx module RM1xx on-board chip antenna characteristics The RM1xx on-board chip monopole antenna radiated performance depends on the host PCB layout. RM1xx development board was used for RM1xx development and antenna performance evaluation. To obtain similar performance follow guidelines in section PCB Layout on Host PCB for RM1xx to allow the on-board antenna to radiate and reduce proximity effects due to nearby host PCB GND copper or metal covers. RM1xx on-board antenna part number: ACX: AT5020-E3R0HBANT/LF HARDWARE INTEGRATION SUGGESTIONS Circuit The RM1xx-series module is easy to integrate requiring no external components on the customers board apart from those required by customer for development and in customers end application. Checklist (for Schematic):
VCC External power source within the operating range, rise time and noise/ripple specification of RM1xx. Add decoupling capacitors for filtering the external source. Power-on reset circuitry within RM1xx series module incorporates brown-out detector, thus simplifying power supply design. Upon application of power, the internal power-on reset ensures module starts correctly. AIN (ADC) and SIO pin IO voltage levels RM1xx SIO operating voltage levels are from 0V to VCC. Ensure input voltage levels into SIO do not exceed VCC also (if VCC source is a battery whose voltage will drop). Ensure ADC pin maximum inpu voltage for damage is not violated. AIN (ADC) impedance and external voltage divider setup If one wanted to measure with ADC, a voltage higher than 3.6V then one can connect a high impedance voltage divider to lower the voltage to the ADC input pin. Other methods are to use a voltage buffer or FET transistor in conjunction with a low resistance voltage divider. High impedance values of a voltage divider connected to an AIN pin will introduce ADC inaccuracy. Laird recommends the following solution for setup of a voltage divider when used with the RM1xx ADC:
Connect a capacitor between AIN and ground (if the voltage divider presents high impedance). Normally, when ADC is not sampling, the ADC (AIN) impedance is a very high value and can be considered an open circuit. The moment ADC is sampling, ADC (AIN) impedance is 200k-600k and Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 23 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 JP1FTSH-10512345678910SWDCLKVCC_IOnRESET/SWDIOGND LoRa/BLE Modules Hardware Integration Guide lowers the AIN voltage. However, when the capacitor is connected it should keep the AIN voltage at previous level for an adequate time period while sampling, minimizing the effect of the high resistance value of the external voltage divider. The capacitor should be big enough to hold voltage up for the required time period, i.e. 20 us for 8 bit sampling or 68 us for 10 bit sampling. If you use a FET transistor to open the current flow through the circuit momentarily before sampling, allow enough time for the capacitor to fully charge before sampling. During the sampling period, multiple samples are made and the ADC output value is the mean value from the sample pool. The sample pool is created during 20 us period for 8 bit sampling, 36 us period for 9 bit sampling, and 68 bit period for 10 bit sampling. Two-Wire SWD Programming/Debug Interface Required if Flash Cloning will be used during production to load RM1xx smartBASIC application and/or the firmware, add 2-Wire SWD Programming/Debug Interface as detailed in section 2-Wire SWD Programming/Debug Interface UART Required for loading customer smartBASIC application and firmware. Add connector to allow UART to be interfaced to PC (via UART RS232 or UART- USB). UART_RX and UART_CTS SIO_22 (alternative function UART_RX) is an input, set with internal weak pull-up (in FW). The pull-up prevents the module from going into deep sleep when UART_RX line is idling. SIO_24 (alternative function UART_CTS) is an input, set with internal weak pull-down (in FW). This pull-
down ensures the default state of the UART_CTS will be asserted which means can send data out of the UART_TX line. In the case when UART_CTS is not connected (which we do not recommend). nAutoRUN pin and operating mode selection nAutoRUN pin needs to be externally held high or low to select between the two RM1xx operating modes at power-up:
Self-contained Run mode (nAutoRUN pin held at 0V). Interactive/development mode (nAutoRUN pin held at VCC). Make provision to allow operation in the required mode. Add jumper to allow nAutoRUN pin to be held high or low (via 10K resistor) OR driven by host GPIO. I2C It is essential to remember that pull-up resistors on both I2C_SCL and I2C_SDA lines are not provided in the RM1xx module and MUST be provided external to the module as per I2C standard. SPI Implement SPI chip select using any unused SIO pin within your smartBASIC application script then SPI_CS is controlled from smartBASIC application allowing multi-dropping. SIO pin direction RM1xx modules shipped from production with smart BASIC runtime engine FW, all SIO pins (with default function of DIO) are mostly digital inputs (see Pin Definitions Table2). Use your smart BASIC application script to change the direction of any SIO pin that is required to be an output in your design. Also these SIO pins that are inputs have by default (in FW) an internal pull-up or pull-down resistor-
enabled (see Pin Definitions Table2). This was done to avoid floating inputs (which can also cause current consumption in low power modes (e.g. StandbyDoze) to drift with time. In any case customer can disable the PULL-UP through their smart BASIC application. nRESET pin (active low) Hardware reset. Wire out to push button or drive by host. By default module is out of reset when power applied to VCC pin. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 24 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide PCB Layout on Host PCB - General Checklist (for PCB):
MUST locate RM1xx module close to the edge of PCB (mandatory for RM1xx for on-board chip antenna to radiate properly). Use solid GND plane on inner layer (for best EMC and RF performance). All module GND pins MUST be connected to host PCB GND. Place GND vias close to module GND pads as possible. Unused PCB area on surface layer can be flooded with copper but place GND vias regularly to connect copper flood to inner GND plane. If GND flood copper exists on the top PCB layer (under of the RM1xx module), then connect with GND vias to inner GND plane and ensure that it is covered with solder mask. Route traces to avoid noise being picked up on VCC supply and AIN (analogue) and SIO (digital) traces. Ensure no exposed copper beneath the module (refer to land pattern of RM1xx development board). Antenna Keep-out on Host PCB Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. Keep all mounting hardware and metal clear of the area to allow proper antenna radiation. For best antenna performance, place the RM1xx module on the edge of the host PCB, preferably in the corner with the antenna facing the corner. The RM1xx development board has the RM1xx module on the edge of the board (not in the corner). The antenna keep-out area is defined by the RM1xx development board which was used for module development and antenna performance evaluation is shown in Figure 6, where the antenna keep-out area is composed of PCB dielectric (no copper) sitting under the RM1xx antenna. A different host PCB thickness dielectric will have small effect on antenna. The antenna-keep-out defined in Host PCB Land Pattern and Antenna Keepout applies when the RM1xx is placed in the corner of the host PCB. When RM1xx-SM cannot be placed as such, it must be placed on the edge of the host PCB and the antenna keep out must be observed. An example is shown in Figure 6. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 25 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Figure 6: Antenna keepout on DVK-RM1xx PCB (shown in red) with RM1xx module placed near the corner. Note:
1. RM1xx module placed on edge of host PCB (close to the corner of the PCB). 2. Copper cut-away on all layers in antenna Keep-out for a host PCB. Antenna Keep-out and Proximity to Metal or Plastic Checklist (for metal /plastic enclosure):
Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40mm top/bottom and 30mm left or right. Metal close to the RM1xx chip monopole antenna (bottom, top, left, right, any direction) will have degradation on the antenna performance. How much; that is entirely system dependent which means some testing by customer required (in their host application). Anything metal closer than 20mm will start to significantly degrade performance (S11, gain, radiation efficiency). It is best that the customer tests the Range with mock-up (or actual prototype) of the product to assess effects of enclosure height (and material whether metal or plastic). Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 26 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide LoRa External Antenna Integration with RM1xx Please refer to the regulatory sections for FCC/IC, and CE, for details of use of RM1xx with external antennas. The RM1xx has been designed to operate with the below external antennas (with a maximum gain of 2dBi). The required antenna impedance is 50 ohms. See Table 19. Table 19: LoRa External antennas for the RM1xx External Antenna Part Number RFDPA131015IMBB301 Laird Part Number TBD Mfg. Walsin Type Gain
(dBi) Dipole 0.9 Connector Type U.FL WPANTDP036-R5A S152CL-L-PX-915S S152CL-L-PX-868S
-
-
-
World Products Dipole 2.0 Nearson Nearson Dipole 2.0 Dipole 2.0 U.FL U.FL U.FL RM1xx Part number RM191/RM186 RM191/RM186 RM191 RM186 MECHANICAL DETAILS RM1xx Mechanical Details Figure 7: RM1xx Mechanical drawings Development Kit Schematics can be found in the Documentation tab of the RM1xx product page:
www.lairdtech.com/products/rm1xx-lora-modules Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 27 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Host PCB Land Pattern and Antenna Keep-out for RM1xx Application Notes 1. Ensure there is no copper in the antenna keep out area on any layers of the host PCB. Also keep all mounting hardware or any metal clear (Refer to 0) on of the area to reduce effects of proximity detuning the antenna and to help antenna radiate properly. 3. For best BLE chip antenna performance, the module MUST be placed on the edge of the host PCB
(preferably in the corner) with the antenna facing the corner. If RM1xx is not placed in corner, but on edge of host PCB, the antenna Keep Out Area is extended (see Note 4). 4. RM1xx development board has an RM1xx placed on the edge of the PCB board (and not in corner) the Antenna keep out area is extended out to the corner of the development board, see section PCB Layout on Host PCB - General. This was used for module development and antenna performance evaluation. 5. Ensure no exposed copper under module on host PCB. 6. The user may modify the PCB land pattern dimensions based on their experience and / or process capability. APPLICATION NOTE FOR SURFACE MOUNT MODULES Introduction Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the User Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 28 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Manual. This Application Note is considered a living document and will be updated as new information is presented. The modules are designed to meet the needs of a number of commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes. Shipping Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick and place machines. Layouts of the trays are provided in Figure 8. Figure 8: RM1xx Shipping Tray Details Reflow Parameters Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to bake units on the card, see Table 20 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website:
http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 29 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Note:
The shipping tray cannot be heated above 65C. If baking is required at the higher temperatures displayed in in Table 20, the modules must be removed from the shipping tray. Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment 30C/60%RH. Table 20: Recommended baking times and temperatures 125C Baking Temp. 90C/ 5%RH Baking Temp. 40C/ 5%RH Baking Temp. Saturated
@ 30C/85%
+ 72 hours
@ 30C/60%
Floor Life Limit Saturated Floor Life Limit
+ 72 hours
@ 30C/60%
Saturated
@ 30C/85%
Floor Life Limit
+ 72 hours @
30C/60%
9 hours 7 hours 23 hours 13 days 9 days
@
30C/85%
33 hours MSL 3 Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform to J-STD-020D1 standards for reflow temperatures. Important: During reflow, modules should not be above 260 and not for more than 30 seconds. Figure 9: Recommended Reflow Temperature Temperatures should not exceed the minimums or maximums presented in Table 21. Table 21: Recommended Maximum and minimum temperatures Specification Temperature Inc./Dec. Rate (max) Temperature Decrease rate (goal) Value 1~3 2-4 Unit C / Sec C / Sec Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 30 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Specification Soak Temp Increase rate (goal) Flux Soak Period (Min) Flux Soak Period (Max) Flux Soak Temp (Min) Flux Soak Temp (max) Time Above Liquidous (max) Time Above Liquidous (min) Time In Target Reflow Range (goal) Time At Absolute Peak (max) Liquidous Temperature (SAC305) Lower Target Reflow Temperature Upper Target Reflow Temperature Absolute Peak Temperature Value
.5 - 1 Unit C / Sec 70 120 150 190 70 50 30 5 218 240 250 260 Sec Sec C C Sec Sec Sec Sec C C C C FCC AND IC REGULATORY STATEMENTS Model US/FCC CANADA/IC RM191-SM SQG-RM191 3147A-RM191 The OEM must follow the regulatory guidelines and warnings listed below to inherit Laird modular approval. The RM191-SM holds full modular approvals and has been certified for integration to products only by OEM integrators under the following conditions:
1. The antenna(s) must be installed such that a minimum separation distance of 30mm is maintained between the radiator (antenna) and all persons at all times. 2. The transmitter module must not be operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. The RM191-SM LoRa transmitter has been designed and approved to operate with the antennas listed below with a maximum gain of 2 dBi. The required antenna impedance is 50 ohms. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 31 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide External Antenna Part Number RFDPA131015IMBB301 Laird Part Number TBD Mfg. Walsin Type Gain
(dBi) Dipole 0.9 Connector Type U.FL WPANTDP036-R5A S152CL-L-PX-915S
-
-
World Products Dipole 2.0 Nearson Dipole 2.0 U.FL U.FL RM1xx Part number RM191-SM RM191-SM RM191-SM Note: For the LoRa (external) dipole antenna, the OEM is free to choose another vendors antenna of like type and equal or lesser gain (2dBi) and still maintain compliance. Reference FCC Part 15.204(c)(4) for further information on this topic. The RM191 BLE transmitter contains an on-board 2.4GHz chip antenna Item Part Number 1 AT5020-E3R0HBANT/LF Mfg. ACX Type Gain (dBi) Ceramic
-1.5 RM1xx Part Number RM191-SM Power Exposure Information Federal Communication Commission (FCC) Radiation Exposure Statement:
To comply with FCC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 30mm from all persons and operating in conjunction with any other antenna or transmitter. OEM Responsibilities WARNING: The OEM must ensure that FCC and Industry Canada labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Laird FCC identifier for this product. Contains FCC ID: SQG-RM191 Contains IC: 3147A-RM191 The OEM of the RM191-SM module must only use the approved antenna(s) listed above, which have been certified with this module. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. The user manual for the end product must also include the following information in a prominent location:
To comply with FCC and Industry Canada RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 30mm from all persons and operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on visible on outside of device:
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 32 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Label and text information should be in a size of type large enough to be readily legible, consistent with the dimensions of the equipment and the label. However, the type size for the text is not required to be larger than eight point. CAUTION:
The OEM should have their device which incorporates the RM191-SM tested by a qualified test house to verify compliance with FCC Part 15 Subpart B limits for unintentional radiators. WARNING:
Changes or modifications not expressly approved by Laird could void the users authority to operate the equipment. FCC Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to correct the interference by one or more of the following measures:
Re-orient or relocate the receiving antenna Connect the equipment to an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and the receiver connected. Consult the dealer or an experienced radio/TV technician for help. FCC Warning:
THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION. Industry Canada (IC) Warning:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. French equivalent is:
Le prsent appareil est conforme aux CNR d'Industrie Canada applicable aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. IC Radiation Exposure Statement To comply with Industry Canada RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 30mm from all persons and must not be operating in conjunction with any other antenna or transmitter. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 33 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide REMARQUE IMPORTANTE Dclaration IC d'exposition aux radiations Pour se conformer Industrie Canada RF limites d'exposition pour la population gnrale / exposition non contrle, l'antenne utilise pour ce transmetteur doit tre installe pour fournir une distance d'au moins 30 mm de toutes les personnes et ne doit pas fonctionner en conjonction avec toute autre antenne ou transmetteur. Modular Approval OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Approbation modulaire OEM intgrateur est toujours responsable de tester leur produit final pour les exigences de conformit supplmentaires ncessaires ce module install (par exemple, les missions de priphriques numriques, les exigences de priphriques PC, etc.) IMPORTANT NOTE:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:
Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: " RM191-SM Contient des IC: 3147A-RM191";
CE REGULATORY The RM186 has been tested for compliance with relevant standards for the EU market. The RM186 module has been tested with a 2.0dBi external dipole antenna for LoRa, and the -1.5dBi on-board chip antenna for the BLE transmitter. For the external LoRa dipole antenna, the OEM can operate any other type of antenna but must ensure that the gain does not exceed 2.0dBi to maintain the Laird Technologies approval. The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their complete device. Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to. Test reports are available upon request. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 34 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Antenna Information The external flying lead U.FL dipole antennas for the 868MHz LoRa radio listed below were tested for use with the RM186. For CE mark countries, the OEM is free to use any manufacturers antenna and type of antenna as long as the gain is less than or equal to the highest gain approved for use (2.0dBi) Contact a Laird Technologies representative for more information regarding adding antennas. Item 1 2 3 LoRa Antenna Part#
artNumber RFDPA131015IMBB301 WPANTDP036-R5A S152CL-L-PX-868S Mfg. Walsin World Products Nearson Type Dipole Dipole Dipole Gain (dBi) 0.9 2.0 2.0 The BLE transmitter on board the RM186 has been approved with an on-board -1.5dBi chip antenna Item Part Number 1 AT5020-E3R0HBANT/LF Mfg. ACX Type Gain (dBi) Ceramic
-1.5 RM1xx Part Number RM191-SM Note: The RM186 module internal BLE chipset IC pins are rated 4 kV (ESD HBM). ESD can find its way through the external 2-Wire SWD Programming/Debug Interface connector (if used on the customers design), if discharge is applied directly. Customer should ensure adequate protection against ESD on their end product design (using the RM186 module) to meet relevant ESD standard (for CE, this is EN301-489). Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 35 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide EU DECLARATIONS OF CONFORMITY RM186-SM Manufacturer:
Product:
EU Directive:
Conformity Assessment:
Laird RM186-SM RTTE 1995/5/EC Annex IV Reference standards used for presumption of conformity:
Article Number Requirement 3.1a Health and Safety Reference standard(s) EN60950-1:2006+A11:2009+A1:2010+A12:2011 Protection requirements with respect to electromagnetic compatibility EN 301 489-1 V1.9.2 (2011-09) EN 301 489-17 V2.2.1 (2012-09) Emissions:
EN55022:2006/A1:2007 (Class B) Immunity:
EN61000-4-2:2009 EN61000-4-3:2006/A1:2008/A2:2010 Means of the efficient use of the radio frequency spectrum EN 300 328 V1.8.1 (2012-06) 3.1b 3.2 Declaration:
We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose. Place of Issue:
Laird W66N220 Commerce Court, Cedarburg, WI 53012 USA tel: +1-262-375-4400 fax: +1-262-364-2649 Date of Issue:
April 2016 Name of Authorized Person:
Thomas T Smith, Director of EMC Compliance Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 36 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide ORDERING INFORMATION Part Number RM186-SM Description Intelligent LoRa/BLE Module [868MHz LoRa for Europe] featuring smart BASIC RM191-SM DVK RM186-SM Development board with RM186-SM module soldered in place Intelligent LoRa/BLE Module [915MHz LoRa for US] featuring smart BASIC DVK RM191-SM Development board with RM191-SM module soldered in place General Comments This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If in doubt, ask. BLUETOOTH SIG QUALIFICATION Overview The RM186 & RM191 modules are listed on the Bluetooth SIG website as a qualified End Product. Design Name RM186-SM RM191-SM Owner Declaration ID QD ID Link to listing on the SIG website Laird Laird TBD TBD TBD TBD TBD TBD It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to register as a member of the Bluetooth SIG www.bluetooth.org The following is a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/
For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document:
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486 Qualification Steps When Referencing a Laird End Product Design To qualify your product when referencing a Laird end-product design, follow these steps:
1. To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm Note:
A user name and password are required to access this site. In step 1, select the option, New Listing and Reference a Qualified Design. 2. 3. Enter TBD or TBD in the End Product table entry. 4. Select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 37 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Note:
Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot proceed until the SIG invoice is paid. 5. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document accessible from the site. Your new design will be listed on the SIG website and you can print your Certificate and DoC. For further information please refer to the following training material:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates Note:
If using the RM1xx with Laird Firmware and smartBASIC script, you can skip Controller Subsystem, Host Subsystem, and Profile Subsystem. Qualification Steps When Deviating From a Laird End Product Design If you wish to deviate from the standard End Product designs listed under TBD or TBD, the qualification process follows the New Listing route (without referencing a Qualified Design). When creating a new design it is necessary to complete the full qualification listing process and also maintain a compliance folder for the design. If your design is based on un-modified RM1xx hardware, follow these steps:
1. Reference the existing RF-PHY test report from the RM1xx listing. Note: This report is available from Laird: ews-support@lairdtech.com 2. Combine the relevant Nordic Link Layer (LL). 3. Combine in a Host Component (covering L2CAP, GAP, ATT, GATT, SM). 4. Test any standard SIG profiles that are supported in the design, (customs End Product profiles are exempt). The first step is to generate a project on the TPG (Test Plan Generator) system, select Traditional Project. This determines which test cases apply to demonstrate compliance with the Bluetooth Test Specifications, from the TPG you generate a Test Declaration, (Excel format). If you are combining pre-tested and qualified components in your design, and they are within their 3 year listing period, you are not required to re-test those layers covered by those components. Laird RF-PHY Nordic LL Host Layers Profiles Figure 10: Scope of the qualification for an End Product Design. Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 38 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 LoRa/BLE Modules Hardware Integration Guide Examples of LL components that can be combined into a new design are:
Listing reference Design Name Core Spec Version TBD TBD TBD nRF51xxx stack: S110 link layer Sx20_nRF51xxx link layer S130_nRF51xxx link layer 4.0 4.1 4.2
*Note: Please check with Laird/Nordic for applicable LL components. Examples of Host Stack components that can be integrated into the new design are;
Listing reference Design Name Core Spec Version TBD TBD TBD nRF51xxx stack: S110 host layer Sx20_nRF51xxx host layer S130_nRF51xxx host layer 4.0 4.1 4.2
*Note: You may choose any Host Stack and optional profiles in you design. If the design incorporates any standard SIG LE profiles (such as Heart Rate Profile, refer to section, External to the Core - Current and Qualifiable GATT-based Profile and Service Test Requirements), it is necessary to test these profiles using PTS or other tools where permitted; the results are added to the compliance folder. You are required to upload your test declaration and test reports (where applicable) and complete the final listing steps on the SIG website. Remember to purchase your Declaration ID before you start the qualification process; you cannot complete the listing without it. To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm. In step 1, select the option, New Listing,
(without referencing a Qualified Design). Additional Assistance Please contact your local sales representative or our support team for further assistance:
Laird Technologies Connectivity Products Business Unit Support Centre: http://ews-support.lairdtech.com Email: wireless.support@lairdtech.com Phone: Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Web: http://www.lairdtech.com/bluetooth Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com www.lairdtech.com/wireless 39 Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2019-04-17 | 2402 ~ 2480 | DTS - Digital Transmission System | Class II permissive change or modification of presently authorized equipment |
2 | 2017-11-03 | 2402 ~ 2480 | DTS - Digital Transmission System | |
3 | 2016-05-08 | 2402 ~ 2480 | DXX - Part 15 Low Power Communication Device Transmitter | Original Equipment |
4 | 2402 ~ 2480 | DTS - Digital Transmission System |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 3 4 | Effective |
2019-04-17
|
||||
1 2 3 4 |
2017-11-03
|
|||||
1 2 3 4 |
2016-05-08
|
|||||
1 2 3 4 | Applicant's complete, legal business name |
Laird Connectivity
|
||||
1 2 3 4 | FCC Registration Number (FRN) |
0022590616
|
||||
1 2 3 4 | Physical Address |
W66N220 Commerce Court
|
||||
1 2 3 4 |
Cedarburg, Wisconsin 53012
|
|||||
1 2 3 4 |
United States
|
|||||
app s | TCB Information | |||||
1 2 3 4 | TCB Application Email Address |
c******@telefication.com
|
||||
1 2 3 4 |
h******@acbcert.com
|
|||||
1 2 3 4 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
1 2 3 4 |
A2: Low Power Transmitters (except Spread Spectrum) and radar detectors operating above 1 GHz
|
|||||
app s | FCC ID | |||||
1 2 3 4 | Grantee Code |
SQG
|
||||
1 2 3 4 | Equipment Product Code |
RM191
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 3 4 | Name |
B******** S****
|
||||
1 2 3 4 | Title |
VP Strategic Business Development
|
||||
1 2 3 4 | Telephone Number |
262-4********
|
||||
1 2 3 4 | Fax Number |
262-3********
|
||||
1 2 3 4 |
b******@lairdconnect.com
|
|||||
app s | Technical Contact | |||||
1 2 3 4 | Firm Name |
International Certification Corp.
|
||||
1 2 3 4 |
Laird Technologies
|
|||||
1 2 3 4 | Name |
G******** C****
|
||||
1 2 3 4 |
T******** T****** S******
|
|||||
1 2 3 4 | Physical Address |
No.3-1, Lane 6, Wen San 3rd St. Kwei Shan Dist.
|
||||
1 2 3 4 |
W66N220 Commerce Court
|
|||||
1 2 3 4 |
Cedarburg, 53012
|
|||||
1 2 3 4 |
Taiwan
|
|||||
1 2 3 4 |
United States
|
|||||
1 2 3 4 | Telephone Number |
886-3********
|
||||
1 2 3 4 |
26242********
|
|||||
1 2 3 4 |
262-4********
|
|||||
1 2 3 4 | Fax Number |
886-3********
|
||||
1 2 3 4 |
26236********
|
|||||
1 2 3 4 |
262-3********
|
|||||
1 2 3 4 |
G******@icertifi.com.tw
|
|||||
1 2 3 4 |
T******@lairdtech.com
|
|||||
1 2 3 4 |
t******@lsr.com
|
|||||
app s | Non Technical Contact | |||||
1 2 3 4 | Firm Name |
International Certification Corp.
|
||||
1 2 3 4 | Name |
W******** L******
|
||||
1 2 3 4 | Physical Address |
No.3-1, Lane 6, Wen San 3rd St. Kwei Shan Dist.
|
||||
1 2 3 4 |
Taiwan
|
|||||
1 2 3 4 | Telephone Number |
886-3********
|
||||
1 2 3 4 | Fax Number |
886-3********
|
||||
1 2 3 4 |
w******@icertifi.com.tw
|
|||||
app s | Confidentiality (long or short term) | |||||
1 2 3 4 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 3 4 | No | |||||
1 2 3 4 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 3 4 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 3 4 | Equipment Class | DTS - Digital Transmission System | ||||
1 2 3 4 | DXX - Part 15 Low Power Communication Device Transmitter | |||||
1 2 3 4 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | RM191-SM | ||||
1 2 3 4 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 3 4 | Modular Equipment Type | Single Modular Approval | ||||
1 2 3 4 | Purpose / Application is for | Class II permissive change or modification of presently authorized equipment | ||||
1 2 3 4 | Original Equipment | |||||
1 2 3 4 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 3 4 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 3 4 | Grant Comments | Class 2 Permissive Change : This change is to add a new antenna for 902.30 ~ 914.2 MHz. Power Output is Conducted. The antenna(s) used for this transmitter must not transmit simultaneously with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. This filing meets the SAR threshold exclusion set forth in KDB 447498 and therefore can be used in mobile/portable configurations at the distance specified in the filing. End-users and installers must be provided with transmitter operating conditions for satisfying RF exposure compliance. 900 MHz Band Operation includes DTS and Hybrid Modes of operation. | ||||
1 2 3 4 | Power Output is Conducted. The antenna(s) used for this transmitter must not transmit simultaneously with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. This filing meets the SAR threshold exclusion set forth in KDB 447498 and therefore can be used in mobile/portable configurations at the distance specified in the filing. End-users and installers must be provided with transmitter operating conditions for satisfying RF exposure compliance. 900 MHz Band Operation includes DTS and Hybrid Modes of operation. C2PC to add antenna port data and additional reference trace antenna to existing antennas for the 900 MHz modes of operation. For reference trace antenna applications, the module can only be used with the host antenna circuit trace layout design in strict compliance with the OEM design provided. | |||||
1 2 3 4 | This filing is for BTLE Whisper Mode Operation. | |||||
1 2 3 4 | Power Output is Conducted. The antenna(s) used for this transmitter must not transmit simultaneously with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. This filing meets the SAR threshold exclusion set forth in KDB 447498 and therefore can be used in mobile/portable configurations at the distance specified in the filing. End-users and installers must be provided with transmitter operating conditions for satisfying RF exposure compliance. 900 MHz Band Operation includes DTS and Hybrid Modes of operation. | |||||
1 2 3 4 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 3 4 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 3 4 | Firm Name |
Laird Technologies, Inc.
|
||||
1 2 3 4 |
LS Research, LLC
|
|||||
1 2 3 4 | Name |
A**** A********
|
||||
1 2 3 4 |
R****** U******
|
|||||
1 2 3 4 | Telephone Number |
26237********
|
||||
1 2 3 4 |
262-3********
|
|||||
1 2 3 4 | Fax Number |
262 3********
|
||||
1 2 3 4 |
262-3********
|
|||||
1 2 3 4 |
a******@lairdtech.com
|
|||||
1 2 3 4 |
r******@lsr.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 902.3 | 914.9 | 0.037 | ||||||||||||||||||||||||||||||||||||
1 | 2 | 15C | 903 | 914.2 | 0.033 | ||||||||||||||||||||||||||||||||||||
1 | 3 | 15C | 2402 | 2480 | 0.00198 | ||||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 15C | CC | 902.3 | 914.9 | 0.037 | |||||||||||||||||||||||||||||||||||
2 | 2 | 15C | CC | 903 | 914.2 | 0.033 | |||||||||||||||||||||||||||||||||||
2 | 3 | 15C | CC | 2402 | 2480 | 0.00198 | |||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
3 | 1 | 15C | CC | 2402.00000000 | 2480.00000000 | ||||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
4 | 1 | 15C | CC | 902.3 | 914.9 | 0.037 | |||||||||||||||||||||||||||||||||||
4 | 2 | 15C | CC | 903 | 914.2 | 0.033 | |||||||||||||||||||||||||||||||||||
4 | 3 | 15C | CC | 2402 | 2480 | 0.00198 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC