SiFLEX01 TRANSCEIVER MODULE DATASHEET Development Kit Available Integrated Transceiver Modules (900 MHz) FEATURES DESCRIPTION 250mW output power Long range Up to 500 kBaud RF data rate 128 bit AES encryption available Miniature footprint: 0.9 x 1.63 Multiple antenna options Certifiable for FCC and IC acceptance MSP430 based CPU Low power operation RoHS compliant Streamlined development with LSR design services. License options available to purchase design or integrate design. APPLICATIONS Security Lighting Control HVAC Control Sensor Networks Medical Industrial Automation The SiFLEX01 module is a high performance 900MHz radio based on the Texas Instruments CC430 combined with the CC1190 front-end in a cost effective footprint. Need to get to market quickly? Not an expert in frequency hopping? Need a custom antenna?
Would you like to own the design? Would you like a custom design? Not quite sure what you need? Do you need help with your host board?
LS Research Design Services will be happy to develop custom hardware or software, integrate the design, or license the design so you can manufacture yourself. Contact us at sales@lsr.com or call us at 262-375-4400. The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 1 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET MODULE ACCESSORIES Order Number Description 001-0002 900 MHz Dipole Antenna with Reverse Polarity SMA Connector 080-0001 U.FL to Reverse Polarity SMA Bulkhead Cable 105mm The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 2 of 23 BLOCK DIAGRAM SiFLEX01 TRANSCEIVER MODULE DATASHEET Figure 1 SiFLEX01 Module Block Diagram High-Level The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 3 of 23 CC430 SOCMSP430 MicrocontrollerAnd900 MHz Radio TransceiverCC1190(PA/LNA)AnalogJTAGTMR/PWM32,768 Hz26 MHzLPFGPIOSerial I/O SiFLEX01 TRANSCEIVER MODULE DATASHEET TABLE OF CONTENTS FEATURES .......................................................................................................................... 1 APPLICATIONS ................................................................................................................... 1 DESCRIPTION ..................................................................................................................... 1 MODULE ACCESSORIES ................................................................................................... 2 BLOCK DIAGRAM ............................................................................................................... 3 MODULE PINOUT AND PIN DESCRIPTIONS .................................................................... 5 MODULE OVERVIEW .......................................................................................................... 9 Microcontroller .......................................................................................................................................... 10 Radio .......................................................................................................................................................... 11 RF Power Amplifier ................................................................................................................................... 11 Antenna Options ....................................................................................................................................... 12 DEVELOPMENT TOOLS ................................................................................................... 13 TI MSP-FET430UIF .................................................................................................................................... 13 IAR Embedded Workbench for MSP430 ................................................................................................. 13 ELECTRICAL SPECIFICATIONS ...................................................................................... 14 Absolute Maximum Ratings ..................................................................................................................... 14 Recommended Operating Conditions .................................................................................................... 14 General Characteristics ............................................................................................................................ 14 AGENCY CERTIFICATIONS ............................................................................................. 16 AGENCY STATEMENTS ................................................................................................... 16 MECHANICAL DATA......................................................................................................... 21 PCB Footprint ............................................................................................................................................ 21 General Module Dimensions .................................................................................................................... 22 CONTACTING LS RESEARCH ......................................................................................... 23 The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 4 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET MODULE PINOUT AND PIN DESCRIPTIONS MCU#
48 47 49 46 50 51 59 60 58 57 24 64 63 62 61 60 59 GND 1 GND 2 GND 3 NC 4 NC 5 NC 6 NC 7 NC 8 JTAG TMS 9 JTAG TDI 10 JTAG TCK 11 JTAG TDO 12 TEST 13 nRESET 14 P2.5 15 P2.4 16 P2.6 17 P2.7 18 P3.0 19 P2.0 20 P2.1 21 P2.2 22 P2.3 23 P2.4 24 P2.5 25
- VCC - 3V3DC 26 Texas Instruments CC430F6137 69 GND 68 GND 67 GND 66 NC 65 NC 64 NC 63 NC 62 NC 61 P1.3 60 P1.2 59 P1.4 58 P5.4 57 P1.3 56 P1.2 55 PJ.3 54 PJ.2 53 PJ.1 52 PJ.0 51 P5.3 50 P5.7 49 P5.6 48 P4.7 47 P4.6 46 P4.5 45 P4.4 44 GND MCU#
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 1
. 3 P 2
. 3 P 3
. 3 P 4
. 3 P 5
. 3 P 6
. 3 P 7
. 3 P 0
. 3 P 6
. 1 P 5
. 1 P 2
. 5 P 3
. 5 P 7
. 1 P 0
. 4 P 1
. 4 P 2
. 4 P 3
. 4 P 23 22 21 20 19 18 17 24 2 3 35 34 1 33 32 31 30 Figure 2 Module Pinout MCU#
13 14 12 9 13 14 49 48 47 46 34 6 7 26 27 28 29
MCU#
The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 5 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET MCU Pin Type Description N/A GND Ground N/A GND Ground N/A GND Ground N/A NC No Connect N/A NC No Connect N/A NC No Connect N/A NC No Connect N/A NC No Connect 48 47 49 46 50 51 59 60 58 57 24 64 63 62 61 60 59 23 22 21 20 19 18 17 I/O General-purpose digital I/O (PJ.2), JTAG TMS I/O General-purpose digital I/O (PJ.1), JTAG TDI I/O General-purpose digital I/O (PJ.3), JTAG TCK I/O General-purpose digital I/O (PJ.0), JTAG TDO I/O TEST / SBWTCK Input
/RESET / NMI / SBWTDIO I/O General-purpose digital I/O (P2.5), ADC5, Analog VREF+
I/O General-purpose digital I/O (P2.4), ADC4, Analog VREF-
I/O General-purpose digital I/O (P2.6), CB6, ADC6 I/O General-purpose digital I/O (P2.7), CB7, ADC7 I/O General-purpose digital I/O (P3.0), CBOUT I/O General-purpose digital I/O (P2.0), CB0, ADC0 I/O General-purpose digital I/O (P2.1), CB1, ADC1 I/O General-purpose digital I/O (P2.2), CB2, ADC2 I/O General-purpose digital I/O (P2.3), CB3, ADC3 I/O General-purpose digital I/O (P2.4), CB4, ADC4 I/O General-purpose digital I/O (P2.5), CB5, ADC5 VCC Supply Voltage I/O General-purpose digital I/O (P3.1), TA0CCR0A I/O General-purpose digital I/O (P3.2), TA0CCR1A I/O General-purpose digital I/O (P3.3), TA0CCR2A I/O General-purpose digital I/O (P3.4), TA0CCR3A I/O General-purpose digital I/O (P3.5), TA0CCR4A I/O General-purpose digital I/O (P3.6) I/O General-purpose digital I/O (P3.7) Module Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Name GND GND GND NC NC NC NC NC JTAG TMS JTAG TDI JTAG TCK JTAG TDO TEST/SBWTCK nRESET VREF+
VREF-
CMP+
CMP-
CMPOUT ADC1 ADC2 ADC3 ADC4 ADC5 ADC6 VCC - 3V3DC TMR/PWM1 TMR/PWM2 TMR/PWM3 TMR/PWM4 TMR/PWM5 TMR/PWM6 TMR/PWM7 The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 6 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET Module Pin Name MCU Pin Type Description 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 TMR/PWM8 24 I/O General-purpose digital I/O (P3.0), TA0CLK UART TX UART RX UART CTS UART RTS GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GND GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 I2C-SCL I2C-SDA SPI-SS SPI-SCK SPI-MISO SPI-MOSI NC NC NC NC NC 2 3 35 34 1 33 32 31 30 29 28 27 26 7 6 34 46 47 48 49 14 13 9 12 14 13 I/O General-purpose digital I/O (P1.6), UCA0TXD I/O General-purpose digital I/O (P1.5), UCA0RXD I/O General-purpose digital I/O (P5.2) I/O General-purpose digital I/O (P5.3) I/O General-purpose digital I/O (P1.7) I/O General-purpose digital I/O (P4.0) I/O General-purpose digital I/O (P4.1) I/O General-purpose digital I/O (P4.2) I/O General-purpose digital I/O (P4.3) GND Ground I/O General-purpose digital I/O (P4.4) I/O General-purpose digital I/O (P4.5) I/O General-purpose digital I/O (P4.6) I/O General-purpose digital I/O (P4.7) I/O General-purpose digital I/O (P5.6) I/O General-purpose digital I/O (P5.7) I/O General-purpose digital I/O (P5.3) I/O General-purpose digital I/O (PJ.0/TDO) I/O General-purpose digital I/O (PJ.1/TDI) I/O General-purpose digital I/O (PJ.2/TMS) I/O General-purpose digital I/O (PJ.3/TCK) I/O General-purpose digital I/O (P1.2), UCB0SCL I/O General-purpose digital I/O (P1.3), UCB0SDA I/O General-purpose digital I/O (P5.4) I/O General-purpose digital I/O (P1.4), UCB0CLK I/O General-purpose digital I/O (P1.2), UCB0SOMI I/O General-purpose digital I/O (P1.3), UCB0SIMO N/A NC No Connect N/A NC No Connect N/A NC No Connect N/A NC No Connect N/A NC No Connect The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 7 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET Description Module Pin 67 68 69 Name GND GND GND MCU Pin Type N/A GND Ground N/A GND Ground N/A GND Ground Table 1 SiFLEX01 Module Pin Descriptions The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 8 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET MODULE OVERVIEW Figure 3 shows the internal interconnects of the ICs on the SiFLEX01 module. Consult the respective IC datasheets for details, or contact LSR sales to purchase the SiFLEX01 module schematics as part of LSRs ModFLEX design program. For a high-level block diagram of the SiFLEX01 module, see Figure 1. Figure 3 SiFLEX01 Module Block Diagram Internal Interconnects The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 9 of 23 TICC430TICC1190HGMLNA_ENPA_EN78616158 SiFLEX01 TRANSCEIVER MODULE DATASHEET Microcontroller The CC430 contains an MSP430 16 bit RISC core with 16 registers. The radio registers allow access to radio functions without the bottleneck of an intermediate interface. There are 5 modes of operation including Active Mode and 4 low power modes with progressively lower power achieved through disabling peripherals and clocks. RAM is organized into 2k sectors which can be powered down to save current when not in use. Data is not retained during power-down. A DMA controller is included to allow direct memory to memory transfers without CPU intervention. DMA can remain active in some sleep modes for increased power savings. A hardware AES encryption engine is included to allow 128 bit Advanced Encryption Standard (AES)
(FIPS PUB 197) to be implemented without excessive firmware burden. Figure 4 shows a block diagram of the CC430. Figure 4 CC430F613x Block Diagram The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 10 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET Radio The internal radio is based on the TI CC1101. It is a low-IF type with all digital AGC and filtering. Memory mapped registers are used for data access and controlling radio characteristics. Figure 5 CC430 Sub 1 GHz Radio Block Diagram RF Power Amplifier The SiFLEX01 module contains a TI CC1190 front-end chip. It is capable of 250mW output power. When transmitting the PA_EN signal will be high and LNA_EN will be low, which is controlled by the firmware using GPIO pins P1.0 and P1.1. When receiving PA_EN is low and LNA_EN is high. LNA gang is be adjusted to a high or low setting with the HGM signal controlled by P5.5. PA_EN LNA_EN P1.0 P1.1 HGM P5.5 0 1 1 0 0 X 0 1 0 1 0 0 0 1 1 Table 2 Front-end control functions Operation Shutdown RX low gain RX high gain TX low gain TX high gain The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 11 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET Antenna Options The SiFLEX01 module includes multiple antenna options. The module regulatory certification can be completed with the following options:
Certified Antenna Options LSR 001-0002 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and LSR 080-
0001 U.FL to Reverse Polarity SMA Bulkhead Cable 105mm. Antenna Factor ANT-916-CW-HWR-RPS 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and PanguTech JQ-0036-L4 MMCX to Reverse Polarity SMA Cable. Non-certified Antenna Options Integrated 3.2-inch wire monopole soldered to the board. Off-board antenna using the castellated edge connection to a 50 trace on the host board An adequate ground plane is necessary to provide good efficiency. The ground plane of the host board on which the module is mounted increases the effective antenna ground plane size and improves the antenna performance. The environment the module is placed in will dictate the range performance The non-ideal characteristics of the environment will result in the transmitted signal being reflected, diffracted, and scattered. All of these factors randomly combine to create extremely complex scenarios that will affect the link range in various ways. It is also best to keep some clearance between the antenna and nearby objects. This includes how the module is mounted in the product enclosure. Unless the items on the following list of recommendations are met, the radiation pattern can be heavily distorted. Whichever antenna is used, it is best to keep a few things in mind when determining its location. Never place ground plane or copper trace routing underneath the antenna. LSR recommends keeping metal objects as far away from the antenna as possible. At a very minimum keep the antenna at least 5 cm from any metallic objects, components, or wiring. The farther the antenna is placed from these interferers, the less the radiation pattern and gain will be perturbed. Do not embed the antenna in a metallic or metalized plastic enclosure. If located within a plastic enclosure, keep the enclosure at least 1 cm from the antenna. The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 12 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET DEVELOPMENT TOOLS TI MSP-FET430UIF IAR Embedded Workbench for MSP430 Custom firmware development can be done on the SiFLEX module using development tools available thought TI. Shown in Figure 6, a MSP-FETUIF USB interface is required. It plugs directly into the SiFLEX Development Board, and can easily be adapted to other hardware. See the Texas Instruments website for more information. Also required is Embedded Workbench for TI MSP430 from IAR Systems. IAR Embedded Workbench for MSP430 is an integrated development environment for building and debugging embedded applications. Visit the IAR Systems website for additional information. Figure 6 MSP-FET430UIF The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 13 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET ELECTRICAL SPECIFICATIONS The majority of these characteristics are based on the use of developmental test firmware written by LSR. Custom firmware may require these values to be re-characterized by the customer. Absolute Maximum Ratings Rating Power supply voltage Voltage on any pin with respect to ground RF input power Operating temperature range Storage temperature Min 0
-0.3
-40
-50 Max Unit 3.6 Vcc + 0.3
+10
+85
+150 V V dBm C C Table 3 Absolute Maximum Ratings1 Recommended Operating Conditions Characteristic Power supply voltage (Vdd) Ambient temperature range Min 2.2
-40 Typ 3.3 25 Max 3.45 85 Unit Vdc C Table 4 Recommended Operating Conditions Module will NOT transmit, if VCC > 3.5V. General Characteristics Parameter RF frequency range RF data rate Flash program memory RAM Flash data memory Min 906 0.8 Typ 32 4 512 Max 924 500 Unit MHz kbps kB kB B Table 5 General Characteristics 1 Under no circumstances should exceeding the maximum ratings specified in the Absolute Maximum Ratings section be allowed. Stressing the module beyond these limits may result permanent damage to the module that is not covered by the warranty. The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 14 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET Power Consumption
(Ta = 25C, Vcc = 3.3V, fc = 906-924MHz, Rload = 50) Parameter Test Conditions Min Transmit mode Receive mode Sleep mode Typ 275 24 3 Max Unit mA mA A Table 6 Power Consumption DC Characteristics General Purpose I/O Parameter Test Conditions Min Typ Max Unit Vit+ Positive-going input threshold voltage Vit- Negative-going input threshold voltage VCC = 3.0V VCC = 3.0V Vhys Input voltage hysteresis
(Vit+ - Vit-) VCC = 3.0V VOL Low-Level output voltage, full drive strength Iout = 15mA Vcc = 3.0V 1.50 0.75 0.4 VSS VOH High-Level output voltage, full drive strength Iout = -15mA Vcc = 3.0V VCC 0.60 2.10 1.65 1.0 VSS + 0.60 VCC V V V V V Table 7 DC Characteristics General Purpose I/O The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 15 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET AGENCY CERTIFICATIONS FCC ID: TFB-SISEN1, 15.247 IC ID: 5969A-SISEN1, RSS 210 AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 16 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET Industry Canada Statements Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. This device has been designed to operate with the antennas listed below, and having a maximum gain of 2 dBi (LS Research dipole) and 2 dBi (Antenna Factor dipole). Antennas not included in this list or having a gain greater than 2 dBi and 2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. List of all Antennas Acceptable for use with the Transmitter 1) LS Research 001-0002 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and LS Research 080-0001 U.FL to Reverse Polarity SMA Cable. 2) Antenna Factor ANT-916-CW-HWR-RPS 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and PanguTech JQ-0036-L4 MMCX to Reverse Polarity SMA Cable. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interfrences et (2) cet appareil doit accepter toute interfrence, y compris les interfrences qui peuvent causer un mauvais fonctionnement du dispositif. Pour rduire le risque d'interfrence aux autres utilisateurs, le type d'antenne et son gain doivent tre choisies de faon que la puissance isotrope rayonne quivalente (e.i.r.p) ne dpasse pas celle admise pour une communication russie. Cet appareil a t conu pour fonctionner avec les antennes numres ci-dessous, et d'avoir un gain maximum de 2 dBi (LS Research diple) et 2 dBi (Antenna Factor diple). Antennes pas inclus dans cette liste ou d'avoir un gain plus grand que 2 et 2 dBi dBi sont strictement interdites pour l'utilisation avec cet appareil. L'impdance d'antenne requise est de 50 ohms. Liste de toutes les antennes acceptables pour une utilisation avec l'metteur 1) LS Research 900 001-0002 antenne diple MHz avec connecteur SMA invers la polarit et de la LS Research LS 080-0001 U. FL Reverse SMA polarit du cble. 2) Antenna Factor ANT-916-CW-HWR-RPS 900 MHz Antenne dipleavec connecteur SMA invers la polarit et la PanguTech JQ-0036-L4 MMCX pour cble SMA invers la polarit. The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 17 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET OEM Responsibilities to comply with FCC and Industry Canada Regulations The SiFLEX01 Module has been certified for integration into products only by OEM integrators under the following conditions:
This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-
transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. Le module SiFLEX01 a t certifie pour l'intgration dans les produits que par les intgrateurs OEM dans les conditions suivantes:
Ce dispositif est accord pour une utilisation dans des configurations mobiles seule dans laquelle les antennes utilises pour cet metteur doit tre install pour fournir une distance de sparation d'au moins 20cm de toute personne et ne pas tre co-localiss avec les autres metteurs, sauf en conformit avec FCC et Industrie Canada, multi-metteur procdures produit. Tant que les deux conditions prcites sont runies, les tests de transmetteurs supplmentaires ne seront pas tenus. Toutefois, l'intgrateur OEM est toujours responsable de tester leur produit final pour toutes les exigences de conformit supplmentaires requis avec ce module install (par exemple, les missions appareil numrique, les exigences de priphriques PC, etc.) NOTE IMPORTANTE: Dans le cas o ces conditions ne peuvent tre satisfaites (pour certaines configurations ou de co-implantation avec un autre metteur), puis la FCC et Industrie autorisations Canada ne sont plus considrs comme valides et l'ID de la FCC et IC numro de certification ne peut pas tre utilis sur la produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation. The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 18 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET End Product Labelling The SiFLEX01 Module is labeled with its own FCC ID and IC Certification Number. If the FCC ID and IC Certification Number are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:
Contains Transmitter Module FCC ID: TFB-SISEN1 Contains Transmitter Module IC: 5969A-SISEN1 or Contains FCC ID: TFB-SISEN1 Contains IC: 5969A-SISEN1 The OEM of the SiFLEX01 Module must only use the approved antenna(s) listed above, which have been certified with this module. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. The user manual for the end product must include the following information in a prominent location:
This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures. The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 19 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET Le SiFLEX01 Module est tiquet avec sa propre ID de la FCC et IC numro de certification. Si l'ID de la FCC et IC numro de certification ne sont pas visibles lorsque le module est install l'intrieur d'un autre appareil, puis l'extrieur de l'appareil dans lequel le module est install doit galement afficher une tiquette mentionnant le module ci-joint. Dans ce cas, le produit final doivent tre tiquets dans un endroit visible de ce qui suit:
Module metteur Contient FCC ID: TFB-SISEN1 Module metteur Contient IC: 5969A-SISEN1 ou Contient FCC ID: TFB-SISEN1 Contient IC: 5969A-SISEN1 Le constructeur d'quipements de l SiFLEX01 module ne doit utiliser l'antenne approuve (s) ci-
dessus, qui ont t certifis avec ce module. L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF ou RF changer les paramtres lis au mode d'emploi du produit final. Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans un endroit bien en vue:
Ce dispositif est accord pour une utilisation dans des configurations mobiles seule dans laquelle les antennes utilises pour cet metteur doit tre install pour fournir une distance de sparation d'au moins 20cm de toute personne et ne pas tre co-localiss avec les autres metteurs, sauf en conformit avec FCC et Industrie Canada, multi-metteur procedures produit. The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 20 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET MECHANICAL DATA PCB Footprint Figure 7 PCB Footprint The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 21 of 23 General Module Dimensions SiFLEX01 TRANSCEIVER MODULE DATASHEET Figure 8 Basic dimensions The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 22 of 23 SiFLEX01 TRANSCEIVER MODULE DATASHEET CONTACTING LS RESEARCH Headquarters Website LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: 1(262) 375-4400 Fax: 1(262) 375-4248 www.lsr.com Technical Support forum.lsr.com Sales Contact sales@lsr.com The information in this document is provided in connection with LS Research (hereafter referred to as LSR) products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSRS TERMS AND CONDITIONS OF SALE LOCATED ON LSRS WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. LSR does not make any commitment to update the information contained herein. Unless specifically provided otherwise, LSR products are not suitable for, and shall not be used in, automotive applications. LSRs products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. The information in this document is subject to change without notice. 330-0026-R0.4 Copyright 2010-2012 LS Research, LLC Page 23 of 23