MK71351 Bluetooth Low Enegy wireless module Overview PJDK71351-03 Issue DateFeb,8,2019 MK71351 is a wireless module which is integrating Bluetooth Specification v4.2 compliant LSI(TC3567CFSG),26MHz/
32.768kHz crystal oscillator, 2.4GHz PCB pattern antenna and passive components. MK71351 is suitable for applications such as Healthcare, fitness device, Remote Controller or PC peripherals. Features Wireless module wich is integrated 2.4GHz PCB pattern antenna and passive components Bluetooth Specification v4.2 low energy compliant Radio certification MIC JAPANcertification no: 006-000680 FCC(FCC ID: 2ACIJ71351) ISED(IC: 20971-71351) CE (RED) EN300 328 V2.1.1 SPI Inteeface (1 ch assigned to a General Purpose IO) I2C Interface (1 ch assigned to a General Purpose IO) Bluetooth QualificationEnd Product, QDID:xxxxx Integrated Bluetooth Specification v4.2 low enegy compliant LSI (TC3567CFSG) Integrated 26MHz /32.768kHz crystal oscillator Integrated NOR Flash Memory128 KB105 times of erase and program Integrated bypass capacitor and external component of switching regulator RSSI accuracy: 1 dBTyp, -85-10dBm @input,25 General Purpose Input/Output(13ports) General Purpose Serial Interfaces Host Interface PWM Interface (3chassigned to General Purpose IOs) AD Converter Single power supply Operating Temperature -40 deg.C to 85 deg.C Current Consumptions 10bit resolution External analog inputs assigned to GPIOs3ch Internal VDD monitoring (1 ch - connected inside) UART Interface9600bps921.6kbps1ch - shared with GPIOs) SPI Interface 2.0V to 3.6V (Typ.3.0V) Deep Sleep State Sleep State Back up State Idle State Active RX Active TX Flash Writing Product name PKG Dimension Pb Free, RoHS compliant 0.05 uA (Typ.) 2.5 uA (Typ.) 2.4 uA (Typ.) 0.8 mA (Typ.) 3.0 mA (Typ.) 2.9 mA(Typ.) 15.6mA (Typ.)
:MK71351-NNNYEZ05B
:M-FLGA33-9.7X11.95-0.75-9Y
: 9.7mm (W) x 11.95mm (L) x 2.1mm (H) Bluetooth is a registered trademark of Bluetooth SIG, Inc. All other company and product names are the trademarks or registered trademarks of the respective companies. 1/24 PJDK71351-03 MK71351 VDDCORE SWDCLK SWDIO GPIO
[UART/SPI/I2C/PWM/ADC]
RESETX TMODE VPGM Block Diagram OUT_ANT ANTENNA DCDC LC Filter Bluetooth v4.2 LSI TC3567C 13 Xtal 26MHz Xtal 32.768kHz RFIO VBAT VDDIO GND MK71351 2/24 Pin Layout PJDK71351-03 MK71351 NC 1 29 NC OUT_ANT 2 RFIO GND VPGM TMODE VDDCORE GND RESETX 3 4 5 6 7 8 9 SWDIO 10 30 31 33 32 28 27 26 25 24 23 22 21 GPIO1
/mode1 GPIO8 GPIO7 GPIO6 GPIO5 GPIO11 GPIO12 GPIO15 GND 11 12 13 14 15 16 17 18 19 20 GND V D D O I I G P O 1 3 I G P O 1 0 I G P O 4 I G P O 3 I G P O 0 S W D C L K TOP VIEW V B A T 3/24 List of Pins Symbols Pin IRF ISHPUD Ish IOSHPUD IOASHPUD Symbol PJDK71351-03 MK71351 RF I/O pin. Schmitt Trigger input pin with Pull-up, and Pull-down. Schmitt Trigger input pin Schmitt Trigger Digital I/O pin with Pull-up, and Pull-down. Schmitt Trigger Digital I/O with Pull-up, and Pull-down. and analog input pin Attribute/value I/O NC OUT_ANT RFIO GND VPGM TMODE at reset
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Input VDDCORE 1.35 V output 1 2 3 4 5 6 7 8 9 GND RESETX 10 SWDIO 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 GND VBAT VDDIO GPIO13 GPIO10 GPIO4 GPIO3 SWDCLK GPIO0 GND GPIO15 GPIO12 GPIO11 GPIO5 GPIO6 GPIO7 GPIO8 GPIO1 NC GND GND GND GND
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Input Input
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Pull-up Hi-Z Hi-Z Hi-Z Input Hi-Z
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Hi-Z Pull-up Pull-up Pull-up Pull-up Pull-up Pull-up Pull-up
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Note: Pull-up/Pull-down registers range is 20k~100k.
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IRF IRF
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Ish
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Ish IOSHPUD
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IOSHPUD IOASHPUD IOASHPUD IOASHPUD ISHPUD IOSHPUD
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IOSHPUD IOSHPUD IOSHPUD IOSHPUD IOSHPUD IOSHPUD IOSHPUD IOSHPUD
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Active level
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Description NC Pin PCB antenna input
(to be connected to RFIO by user's PCB) RF Input/Output from Module
(to be connected to OUT_ANT by user's PCB) GND Test pin TEST MODE input (Low = Normal operation) CORE voltage monitor pin GND Low Reset input (Low = Reset) Serial wire debugger data pin and operation mode switching pin GND Power supply 2.0 to 3.6 V Power supply 2.0 to 3.6 V General-purpose IO pin ADC input, general-purpose IO pin ADC input, general-purpose IO pin ADC input, general-purpose IO pin Serial wire debugger clock pin General-purpose IO pin and WakeUp0 input pin GND General-purpose IO pin and WakeUp1 input pin General-purpose IO pin General-purpose IO pin General-purpose IO pin General-purpose IO pin General-purpose IO pin General-purpose IO pin General-purpose IO pin NC pin GND GND GND GND
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4/24 PJDK71351-03 MK71351 Pin Description Symbols IRF ISHPUD Ish IOSHPUD IOASHPUD RF, Analog Related Pins RF I/O pin. Schmitt Trigger input pin with Pull-up, and Pull-down. Schmitt Trigger input pin Schmitt Trigger Digital I/O pin with Pull-up, and Pull-down.. Schmitt Trigger Digital I/O with Pull-up, and Pull-down. and analog input pin. Pin Symbol 2 3 OUT_ANT RFIO Attribute/value at reset
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I/O IRF IRF Active level
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Description PCB antenna input
(to be connected to RFIO by user's PCB) RF Input/Output from Module
(to be connected to OUT_ANT by user's PCB) General-Purpose IO Pins Pin Symbol Attribute/value at reset I/O Active level Description 19 GPIO0 Hi-Z IOSHPUD
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21 GPIO15 Hi-Z IOSHPUD 28 24 25 26 27 23 GPIO1 GPIO5 GPIO6 GPIO7 GPIO8 GPIO11 Pull-up Pull-up Pull-up Pull-up Pull-up Pull-up IOSHPUD IOSHPUD IOSHPUD IOSHPUD IOSHPUD IOSHPUD 22 GPIO12 Pull-up IOSHPUD 17 16 GPIO3 GPIO4 Hi-Z Hi-Z IOASHPUD IOASHPUD
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15 GPIO10 Hi-Z IOASHPUD
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14 GPIO13 Pull-up IOSHPUD
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General-purpose I/O pin During reset, internal Pull-up/Pull-down resistor turns OFF and is put into the Disable state. After software processing, this pin can function as a function pin or a GPIO pin of I/O. See Table 2-2. configuration by the pin the pin configuration by General-purpose I/O pin During reset, internal Pull-up resistor turns ON and is put into the Disable state. After software processing, this pin can function as a function pin or a GPIO pin of I/O. GPIO1 is used as a condition for switching the operation mode. See List of GPIO Pin Functions section. the pin configuration by ADC input, general-purpose I/O pin During reset, internal Pull-up/Pull-down resistor turns OFF and is put into the Disable state. After software processing, this pin can function as a function pin, a general-purpose ADC channel pin, or a GPIO pin of I/O, by selecting either of these. See List of GPIO Pin Functions section. General-purpose I/O pin During reset, internal Pull-up resistor turns ON and is put into the input Disable state. After software the pin configuration by processing, this pin can function as a function pin or a GPIO pin of I/O. See List of GPIO Pin Functions section. 5/24 PJDK71351-03 MK71351 Other Pins Pin Symbol Attribute/value I/O 6 9 TMODE RESETX at reset Input Input Ish Ish Active level Description
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TEST MODE input (Low = Normal operation) Low Reset input (Low = Reset) CORE Voltage Related Pins Pin Symbol Attribute/value I/O at reset Active level Description 7 VDDCORE 1.35 V output
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CORE voltage monitor pin Normally, use this pin in the OPEN. Debugger Related Pins Pin Symbol Attribute/value I/O at reset Input Pull-up 10 SWDIO IOSHPUD
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18 SWDCLK Input Pull-Down ISHPUD
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Active level Description Serial wire debugger data pin and operation mode switching pin. During reset, internal Pull-down resistor turns ON and is put into the input state. After the reset is released, this pin turns into the I/O of the serial wire debugger data. If this function is not used, the pin should be OPEN. Serial wire debugger clock pin During reset, internal Pull-down resistor turns ON and is put into the input state. After the reset is released, this pin turns into the input of the serial wire debugger clock. If this function is not used, the pin should be OPEN. Power Supply Pin Pin Symbol Attribute/value I/O at reset Active level Description 5 12 13 4 8 11 20 30 31 32 33 VPGM VBAT VDDIO GND GND GND GND GND GND GND GND
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N.C. Pins Pin Symbol Attribute/value I/O 1 29 NC NC at reset
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Power supply pin for test Connect this pin to GND. Power supply 2.0 to 3.6 V Power supply 2.0 to 3.6 V GND GND GND GND GND GND GND GND Description NC pin, always use in the OPEN. NC pin, always use in the OPEN. 6/24 List of GPIO Pin Functions The functions of GPIO pins are allocated to the UART interface and serial memory interface, among others, depending on the firmware implemented to ROM and commands from the external host. This list indicates the hardware state during reset, the software control setting immediately after the reset is released, and the functions which can be set for each GPIO pin. When the same function name is allocated to several pins, it is not possible to select several pins to allocate the function at the same time. MK71351 PJDK71351-03 Pin name State during reset GPIO0 Disable/
GPIO1 Hi-Z Disable/
Pull-up GPIO3 Disable/
Hi-Z GPIO4 Disable/
GPIO5 GPIO6 GPIO7 GPIO8 Hi-Z Disable/
Pull-up Disable/
Pull-up Disable/
Pull-up Disable/
Pull-up GPIO10 Disable/
GPIO11 GPIO12 GPIO13 Hi-Z Disable/
Pull-up Disable/
Pull-up Disable/
Pull-up GPIO15 Disable/
Hi-Z State Function 1 Function 2 Function 3 Function 4 immediately after the reset is released Disable/
Pull-up, Pull-down: off Input/Pull-up
(*1) Disable/
Pull-up, Pull-down: off Disable/
Pull-up, Pull-down: off WakeUp0 input PWM0 output PWM2 output PWM3 output
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SPI-DOUT output SPI-DIN input Input/Pull-up UART1-TX SPI-DOUT
(*2) output output Input/Pull-up UART1-RX SPI-DIN
(*2) Input/Pull-up Input/Pull-up Disable/
Pull-up, Pull-down: off Input/Pull-up Input/Pull-up Input/Pull-up Disable/
Pull-up, Pull-down: off input I2C-SCL output I2C-SDA I/O
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input
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I2C-SCL SPI-DOUT output I2C-SDA I/O WakeUp1 input output SPI-DIN input
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SPI-SCS UART1-RTSX output output SPI-SCLK UART1-CTSX output input
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Analog input
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ADC1 input ADC2 input
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ADC4 input
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(*1) In any mode expect for the User-App mode, this will be Pull-down.
(*2) In the HCI mode, the Pull-up/Pull-down resistance will be OFF.
(*) The state of GPIO pin indicates the state when it is used in the User App mode. When the module is started in the HCI mode, some pins may have a different state. As to the detailed state of each pin and how to set it, refer to the Software Application Notes. 7/24 Termination of Unused Pins See below for the handling of unused pins. Pin termination which can impair the basic operation of the MK71351 is not included. PJDK71351-03 MK71351 Description Pin 1,29 7 10 14 15 16 17 18 19 21 22 23 24 25 26 27 28 Symbol NC VDDCORE SWDIO GPIO13 GPIO10 GPIO4 GPIO3 SWDCLK GPIO0 GPIO15 GPIO12 GPIO11 GPIO5 GPIO6 GPIO7 GPIO8 GPIO1 Open Open Open Open Open Open Open Open Open Open Open Open Open Open Open Open Open (*1)
(*1) Care should be taken because this pin is used as the operation mode switching pin. 8/24 Electrical Characteristics PJDK71351-03 MK71351 The values listed in the section indicated as typical. below represent typical median values. They are not guaranteed values, as no consideration is given to a variety. Absolute Maximum Ratings Item Symbol Condition Rating Unit Power supply voltage Input voltage Output voltage Input current Input power Storage temperature VBAT, VDDIO (*1) VIN VOUT IIN RFIO Tstg
-0.3 to +3.9 0.3 to VDDIO+0.3 (*2) Ta = 40 to +85 C 0.3 to VDDIO+0.3 (*2)
-10 to +10
+6
-40 to +85 V V V mA dBm C
(*1) When voltage is applied to the VDDIO power supply, do not connect VBAT to GND. Otherwise, current flows from VDDIO to VBAT through the circuit inside IC and may cause breaking, damage, or deterioration.
(*2) VDDIO+0.3 V should not exceed 3.9 V when using. Recommended Operating Conditions Item Power supply voltage VBAT operating voltage
(*) VDDIO operating voltage RF channel frequency Symbol VBAT VDDIO FC ADC Analog reference voltage VREFH Analog input voltage Operating temperature VAIN Ta Min. 2.00 2.00 2400 2.00 GND
-40 Standard 3.00 3.00 3.00
+25 Max. 3.60 3.60 2483.5 3.60 VREFH
+85 Unit V V MHz V V 9/24 Current consumption Item Current consumption of digital section Current consumption of power supply Symbol IDDDIG
(Active1) IDDRD
(FlashRead) IDDWR
(FlashWrite) IDDRX
(Active2) IDDTX
(Active3) PJDK71351-03 MK71351
(Ta=25) Condition Min. Standard Max. Unit Operating state Flash read Flash write RF receiving state RF transmitting state (0 dBm)
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0.8 2.4 15.6 3.0 2.9
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2.5 IDDS1
(Sleep) IDDS2
(Backup) Current consumption at low power With connection Current consumption at low power Without connection Current consumption at low power Without connection 26 MHz crystal oscillation has stopped 32 kHz crystal oscillation 26 MHz crystal oscillation has stopped 32 kHz crystal oscillation 26 MHz crystal oscillation has stopped 32 kHz crystal oscillation has stopped
(*) Condition: VBAT=VDDIO=3.0V, GND=0V
(*) The operating current of I/O section during active operation varies depending on the buffer setting. DC Characteristics IDDS
(Deep Sleep) 0.05 2.4
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Item Symbol High-level input voltage I/F voltage condition Other conditions VIH 3.0 V LVCMOS VBAT X0.8 Low-level input voltage VIL 3.0 V LVCMOS
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High-level output voltage Low-level output voltage VOH 3.0 V IOH=1 mA VBAT
- 0.6 VOL 3.0 V IOL=1 mA
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(*) Condition: VBAT=VDDIO=3.0V, GND=0V
(*)The target pin is a digital input / digital output pin. Condition Min. Standard Max. Unit
(Ta=-4085)
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mA mA mA mA mA uA uA uA
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VBAT X0.2
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V V V 0.4 V 10/24 RF Characteristics PJDK71351-03 MK71351
(Ta=25) Item Symbol Condition Min. Standard Max. Unit Transmitter Maximum transmitter power Center frequency tolerance POUT FCERR Modulation data rate DRATE Modulation index Bandwidth Time Receiver FIDX BT 0 dBm setting value Master Clock tolerance <
40 ppm GFSK Receiver sensitivity PSENS PER = 30.8 % (*1) Maximum receiving Power PRXMAX PER = 30.8 % (*1)
-40 0.45 0 0 1 0.50 0.5
-93.5 40 0.55
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dBm ppm Mbps dBm
-10 dBm
(*) Condition: VBAT=VDDIO=3.0V, GND=0V
(*1) PER=30.8 % corresponds to BER=0.1 %. Power Supply Sequence VBAT VDDIO RESET Internal LDO DC/DC Converter Master Clock
(26MHz) Sleep Clock
(32.768kHz) When starting up ,Requires 2.0 V or more Should not be VBAT<VDDIO Reset release after stabilization of VDDIO is required LDO On DC/DC On After sleep clock detection, internal power supply is Switched.(Temporarily switch to sleep mode) Boot Started BOOT done Operation start Oscillation Oscillation 11/24 PJDK71351-03 MK71351 Operation Mode MK71351 has the following operation modes. Operation mode General description HCI mode User-App mode The standard operation mode of Bluetooth. HCI mode conducts communication between MK71351 and the host MCU through the UART interface. This is the Application mode which downloads the program code to the built-in SRAM. It is possible to operate this mode alone without the external host MCU. MK71351 chooses the operation mode during the Boot process at the start. Refer to the state of pins indicated below when choosing the operation mode. Operation mode HCI mode User-App mode Pin status GPIO1 Low input OPEN Note 12/24 HCI Mode The following figure shows the protocol stack configuration when MK71351 is set to the HCI mode. It can transmit/receive HCI commands/events compliant with Bluetooth v4.2 to/from HOST-CPU through the UART interface. MK71351 PJDK71351-03 Application Bluetooth Profile HOST MCU Bluetooth Host Stack
(UART) Bluetooth Controller MK71351 User-App Mode In this mode, the firmware which is stored in the Flash ROM is downloaded and executed after the Boot operation. In the User-App mode, the operation is possible without host MCU. This operation assumes a Use Case, in which the data collected from the sensor device is transferred to another device by using Bluetooth wireless technology. The following figure shows the protocol stack configuration when MK71351 is set to the User-App mode. User Application LBLE framework Bluetooth Manager API Bluetooth Host Stack Bluetooth Controller MK71351 13/24 Module Dimension PJDK71351-03 MK71351 Remarks for Mounting the Surface Mount Type Package Surface mount type package is very sensitive affected by heating from reflow process, humidity during storage. Therefore, before you perform reflow mounting, contact sales office for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times) and storage environment. 14/24 Examples of Application Circuit PJDK71351-03 MK71351 RESETX 7 6 5 3 2 13 12 NC 0 1,29 VDD RFIO VBAT VPGM VDDIO TMODE MK71351 OUT_ANT VDDCORE Power supply Connection Example in HCI mode In this example, GPIO pins except for HOST I/F(UART) are unused.
- Application data is written from HCI interface or SWD interface.
- Over the Air (OTA) function can be used to rewrite the application data. 30,31,32,33 4,8,11,20 GND GND GPIO0 GPIO15 GPIO5 GPIO6 GPIO7 GPIO8 GPIO1 SWDIO SWDCLK GPIO3 GPIO4 GPIO10 GPIO11 GPIO12 GPIO13 9 RESETX WAKEUP0 WAKEUP1 UART_RXD UART_TXD UART_RTS UART_CTS 1k Operation Mode Setting GPIO1 HCI mode L User-App mode OPEN 19 21 24 25 26 27 28 10 18 17 16 15 23 22 14 15/24 PJDK71351-03 MK71351 6 5 7 3 2 9 L 13 12 21 19 NC SW 0 1,29 VDD 28 RFIO VBAT VPGM GPIO1 GPIO1 GPIO0 VDDIO TMODE GPIO15 RESETX User-App MK71351 OUT_ANT VDDCORE HCI mode Power supply mode OPEN Operation mode setting Connection Example in User-App mode In this example, GPIO pins and SWD pins are unused.
- Application data is written from HCI interface or SWD interface.
- Over the Air (OTA) function can be used to rewrite the application data.
- Please refer to the related manual (MK71351 AT Command Application Users Manual),when using the AT Command Application. HCI I/F for Programming User-application UART_RXD UART_TXD 30,31,32,33 SWDCLK 4,8,11,20 SWD I/F GPIO10 GPIO13 GPIO11 GPIO12 SWDIO GPIO3 GPIO5 GPIO6 GPIO7 GPIO4 GPIO8 1k GND GND 18 17 16 26 10 24 25 27 15 23 22 14 16/24 Appendix Reference Land Pattern PJDK71351-03 MK71351 17/24 Metal Keep-Out Area (Recommended Layout) PJDK71351-03 MK71351 18/24 29.7mm min10mmTOP VIEWMain BoardMetal exclusion zone to edge of board(no metal on any layer except mechanical LGA pads and RF trace line.)10mm3.45mm0NoteMain Board: Substrate material is FR4 and substrate thickness is 1.0-1.6 mm.Do not place a signal pattern or the GND/VDD area on the lower side of the antenna or the above metal placement prohibited area Radio Certification MIC JAPAN(certification no 006-000680) PJDK71351-03 MK71351 MK71351 complies with MIC JAPAN radio certification.(certification no:006-000680) FCCFCC ID: 2ACIJ71351 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1)this device may not cause harmful interference, and (2)this device must accept any interference received, including interference that may cause undesired operation. The regulatory label on the final system must include the statement: Contains FCC ID: 2ACIJ71351" or using electronic labeling method as documented in KDB 784748. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna used for this transmitter must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two-ways authentication between module and the host system. OEM Responsibilities to comply with FCC Regulations This module has been certified for integration into products only by OEM integrators under the following condition:
- The transmitter module must not be colocated or operating in conjunction with any other antenna or transmitter. As long as the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE:
In the event that any of these conditions can not be met (for example the reference trace specified in this manual, or use of a different antenna), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. Changes or modification not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. ICIC: 20971-71351 This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
(1) lappareil ne doit pas produire de brouillage;
(2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. The regulatory label on the final system must include the statement: Contains IC: 20971-71351". Due to the model size the IC identifier is displayed in this manual only and can not be displayed on the modules label due to the limited size. CERED MK71351 complies with the radio test requirements (EN 300 328 V2.1.1) ,which is based on the RE Directive. EMC and Safety test that is required for the CE marking should be done in the final end-product. 19/24 Bluetooth SIG Qualification(End Product) MK71351 is listed on the Bluetooth SIG website as qualified End Products.QDID:XXXXX PJDK71351-03 MK71351 Note
- When mounting this product on the double-sided board, do not mount it on the initial mounting side.
(Reflow on the other side from the module mounting side is prohibited.)
- Due to its material characteristic, the sealed case may change color. However, this does not affect the product performance and its quality. Related Documents The following related documents are available and should be referenced as needed.
-MK71351 SDK related documents:
Download "MK71351 SDK" and related documents from the location related to Bluetooth Low Energy at the LAPIS Support Site below. https://www.lapis-semi.com/cgi-bin/MyLAPIS/regi/login.cgi (English)
-TC3567CFSG-002 related documents Download the below documents from the location related to the technical documentation download website of Bluetooth ICs at the below site. https://toshiba.semicon-storage.com/ap-en/product/wireless-communication/bluetooth/documents.html Hardware datasheet Software application manual Software refarence manual Sample software manual 20/24 Revision History Document No. Page Date Previous Edition Current Edition Description PEDK71351-03 Feb 8,2019 Preliminary edition PJDK71351-03 MK71351 21/24 Notes Precautions for the Specification PJDK71351-03 MK71351 1) Contents of the Specification are the information at the time of their issuance. The information contained herein is subject to change without notice. 2) LAPIS Semiconductor has used reasonable care in preparing the information included in the Specification, but LAPIS Semiconductor does not warrant that such information is error free. LAPIS Semiconductor assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 3) The technical information specified herein is intended only to show the typical functions of the Products and examples of application circuits for the Products. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Semiconductor or any third party with respect to the information contained in this document; therefore LAPIS Semiconductor shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information. 4) The Specification contains information related to the LAPIS Semiconductors copyright and technical know-how. Any use of them other than pertaining to the usage of appropriate products is not permitted. Further, the Specification, in part or in whole, may not be reprinted or reproduced and disclosed to third parties without prior consent of LAPIS Semiconductor. Precautions for the Products Precautions for Safety 1) The Products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). 2) For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a LAPIS Semiconductor representative: transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. 3) Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. 4) The Products are designed for use in a standard environment and not in any special environments. Application of the Products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions:
[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents
[b] Use outdoors where the Products are exposed to direct sunlight, or in dusty places
[c] Use in places where the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[d] Use in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use in environment subject to strong vibration and impact.
[f] Use in proximity to heat-producing components, plastic cords, or other flammable items
[g] Use involving sealing or coating the Products with resin or other coating materials
[h] Use of the Products in places subject to dew condensation
[i ] Use in an environment where the temperature is always low, such as in a freezer 5) The Products might receive the radio wave interference from electronic devices such as Wireless LAN devices, Bluetooth devices, digital cordless telephone, and microwave oven and so on that radiate electromagnetic wave. 6) The Products are not radiation resistant. 7) Verification and confirmation of performance characteristics of Products, after on-board mounting, is advised. 8) Confirm that operation temperature is within the specified range described in the Specification. 22/24 PJDK71351-03 MK71351 9) Although LAPIS Semiconductor is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, if product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits in the case of single-circuit failure 10) Failure induced under deviant condition from what defined in the Specification cannot be guaranteed. 11) This product is a specification to radiate the radio wave. It is necessary to acquire the attestation of decided Radio Law of each region used to use the equipment that radiates the radio wave. Please inquire about the attestation of Radio Law that this product acquires. 12) When product safety related problems arises, please immediately inform to LAPIS Semiconductor, and consider technical counter measure. Precautions for Reference Circuits 1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) The reference circuit examples, their constants, and other types of information contained herein are applicable only when the Products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made. Precaution for Electrostatic This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to the Products. Please take special care under dry condition (Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control etc.) Precautions for Storage / Transportation 1) Product performance and connector mating may deteriorate if the Products are stored in the following places:
[a] Where the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2 and NO2
[b] Where the temperature or humidity exceeds those recommended by LAPIS Semiconductor Temperature: 5C to 40C, Humidity 40% to 60%
[c] Storage in direct sunshine or condensation.
[d] Storage in high Electrostatic. 2) Even under LAPIS Semiconductor recommended storage condition, connector mating, mountability, and heat resistance of products over 1 year old may be degraded. 3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol, otherwise bent leads may occur due to excessive stress applied when dropping of a carton. Precaution for Product Label QR code printed on LAPIS Semiconductor product label is only for internal use, and please do not use at customer site. It might contain internal products information that is inconsistent with product information. Precaution for Disposition When disposing products , please dispose them properly with an industry waste company. Prohibition Regarding Intellectual Property LAPIS Semiconductor prohibits the purchaser of the Products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by LAPIS Semiconductor, other than the right to use, sell, or dispose of the Products. 23/24 The other precautions PJDK71351-03 MK71351 1) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. LAPIS Semiconductor shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. 2) When providing our Products and technologies contained in the Specification to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act. Copyright 2019 LAPIS Semiconductor Co., Ltd. 2-4-8 Shinyokohama, Kouhoku-ku, Yokohama 222-8575, Japan http://www.lapis-semi.com/en/
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