ASM0115 Operating Instructions The ASM0115 module is for use in LED Roadway Lighting Ltd. end product designs only. It is not intended for resale or use as an independent product. Please refer to the following instructions when designing with the ASM0115. 1) The attached document SPZB32W1x1.4.pdf is an ST Microelectronics datasheet describing the module including the operating characteristics of the module. The ASM0115 is identical to the SPZB32W1C1.4. This datasheet should be referenced when designing the host interface for use with this module. 2) The end device must use the model 47950-0001 antenna from Molex or an antenna of the same design with equivalent or lower gain. 3) Canada (IC) Contains IC: 12047A-0115 You must include Industry Canada Regulatory Information on the end product label as well as in the product manual. Label Information Equipment is subject to certification under the applicable RSS(s), shall be permanently labelled on each item, or as an inseparable combination. The label must contain the following information for full compliance:
The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the Industry Canada certification number of the module, preceded by the words Contains transmitter module, or the word Contains, or similar wording expressing the same meaning, as follows:
The applicant for equipment certification of the module shall provide with each unit of the module either a label such as described above, or an explanation and instructions to the user as to the host device labelling requirements. IMPORTANT: This equipment for which a certificate has been issued is not considered certified if it is not properly labelled. The information on the Canadian label can be combined with the manufacturers other labelling requirements. Manual Information The End User Product Manual must contain the following information for full compliance:
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. IMPORTANT: To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. The antenna used with this module must be installed to provide a separation distance of at least 20cm from all persons, and must not transmit simultaneously with any other antenna or transmitter. Conformment la rglementation d'Industrie Canada, le prsent emetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. IMPORTANT: The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canadas website www.hc-sc.gc.ca/rpb. 4) United States (FCC) You must include FCC Regulatory Information on the end product label as well as in the product manual. Label Information This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, and OEM manufacturer must comply with the following regulations: (1) The modular transmitter must be labelled with its own FCC ID number, and, if the FCC ID number is not visible when the module is installed inside another advice, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
Example of label required for OEM product: Contains FCC ID:2ACR30115 WARNING: The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labelled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the content shown below. If the FCC ID is not visible then the outside of the device into which the module is installed must also display a label referring to the enclosed equipment. Manual Information The End User Product Manual must contain the following information for full compliance:
IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation (FCC 15.19). The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. IMPORTANT: The module is limited to LED Roadway installations only. OEM integrators are responsible for ensuring that the end-user has no manual instructions to remove or install module. The module is limited to installations in fixed applications, according to Part 2.1091(b). Separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations. IMPORTANT: OEM integrators must include the following instructions and statements in the user manual (i.e. end product):
(1) statements and labeling as required per Part 15.19 and 15.21, and
(2) end-users must be provided with transmitter/antenna installation requirements and operating conditions for satisfying RF exposure compliance:
(i) a separate section should clearly state FCC RF Exposure requirements,
(ii) Required operating conditions for end users,
(iii) antenna or transmitter installation requirements where relevant (i.e. The internal / external antenna(s) used for this transmitter must provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.) RF Exposure Evaluation FCC 1.1310 states the criteria listed in the table below shall be used to evaluate the environmental impact of human exposure to radiofrequency (RF) radiation as specified in Section 1.1307(b), except in the case of portable devices which shall be evaluated according to the provisions of Section 2.1093. Further information on evaluating compliance with these limits can be found in the FCC's OST/OET Bulletin Number 65, Evaluating Compliance with FCC-Specified Guidelines for Human Exposure to Radiofrequency Radiation. Frequency Range(MHz) ElectricField Strength(V/m) MagneticField Strength(A/m) Power Density
(mW/cm2) Average Time(s) 3001500 1500100,000 3001500 1500100,000
(A) Limits forOccupational/Control Exposures F/300 5
(B) Limitsfor GeneralPopulation/UncontrolledExposures F/1500 1 6 6 6 30 1.1 EUT OPERATING CONDITION The antenna used for this product is a Flexilbe PCB trace antenna connected to a UFL Connector TABLE1POWERDENSITYLIMITS and is designed for a Peak antenna gain of 3.5 dBi (peak) Highest measured conducted output level = 19.6dBm From Table 1, the Maximum Power Density safe exposure level for General Population Uncontrolled Exposure of 30 Seconds for the frequency range of 2.4 to 2.4835GHz is 1mW/cm2. Conducted Output Power Max Antenna
(dBm) 19.6 Gain 3.5
4 Max EIRP
(mW) 204 Power Density Limit Allowed
(mW/cm2) 1 Safe distance
(cm) 4.1 1.2 RF EXPOSURE EVALUATION DISTANCE CALCULATION where: d S EIRP = Equivalent isotropically radiated power (mW) = 10 [TX Power (dBm) + Ant Gain (dBi)/10]
= Distance to the center of radiation of the antenna (cm) for the allowable Power Density
= Allowable Power density Limit (mW/cm2) As shown above, the minimum distance where the MPE limit is reached is 4.1 cm from the EUT with the 3.5dBi antenna. It is recommended that the unit is positioned so that the typical distance from the antenna to the end user is 20cm or greater. 802.15.4 ZigBee modules based on the STM32W chipset SPZB32Wxy1.z Features 2.4 GHz IEEE 802.15.4-compliant SMD modules based on the ST STM32W chipset solution featuring:
Integrated 2.4 GHz transceiver PHY and MAC IEEE 802.15.4 features Integrated ARM Cortex-M3 core Integrated embedded Flash and RAM Integrated encryption (AES-128) accelerator T F A R D Power amplified RF performances:
Up to 20 dBm nominal TX output power Up to 105 dBm RX sensitivity Robust Wi-Fi and Bluetooth coexistence 16 channels (IEEE 802.15.4 channel 11 to 26) Multiple configurable interfaces available
(UART, SPI, I2C, ADC, GPIOs) Industry standard JTAG programming Onboard 24 MHz and 32.768 kHz stable Xtal Less than 2 uA typ power consumption in deep sleep mode (32.768 Xtal) Multiple antenna options: integrated antenna or integrated UFL connector Multiple Protocol Stack Options Single voltage supply (2.1 to 3.6 V) FCC and CE compliant qualified Small Form Factor : 16.4 x 26.5 mm Operating temperature range: -40 C to +85 C 28 July 2011 Doc ID xxxxx Rev 1 1/19 www.st.com 19 Contents Contents SPZB32Wxy1.z 1 2 3 4 5 6 7 8 9 Description . 3 RoHS compliance . 4 Application . 4 Block diagram . 5 Pin settings . 6 Pin connections . 6 5.1 5.2 Pin description . 7 Electrical characteristics . 11 Absolute maximum ratings . 11 6.1 6.2 Recommended operating conditions . 11 DC electrical characteristics . 11 6.3 Digital I/O specifications . 12 6.4 6.5 RF electrical characteristics . 12 T F A R D Product approvals . 15 FCC approvals . 15 9.1 9.1.1 FCC labeling requirements . 16 European certification . 16 9.2 Mechanical dimensions . 13 Soldering . 14 10 11 Ordering information scheme . 17 Revision history . 18 2/19 Doc ID xxxxx Rev 1 SPZB32Wxy1.z 1 Description Description SPZB32Wxy1.z is a series of ready-to-use IEEE 802.15.4/ZigBee compliant and power amplified RF modules optimized for embedded applications that require low data rate communications and high transmission range capabilities based on the STM32W single chip that integrates a 2.4 GHz, IEEE 802.15.4-compliant transceiver together with an ARM Cortex embedded processor . The modules are very compact and enable OEMs to easily add wireless capabilities to electronics devices by optimizing time-to-market, cost, size, and consumption of their target applications. No RF experience or expertise is required to add this powerful networking capability to the final product. 24 MHz high stability Xtal is available aboard the modules to perform the timing requirements as per IEEE 802.15.4/ZigBee specifications; additionally a 32.768kHz Xtal is also provided onboard for low power operation. A single supply voltage is requested to power the modules. The supply is in the range of 2.1 to 3.6 V. The voltage supply also determines the I/O ports level allowing an easy interface with additional peripherals. An advanced solution integrating PA and LNA in a single package is aboard to ensure excellent power transmission and receiver sensitivity performances. To support user defined applications, a number of peripherals such as GPIO, UART, I2C, ADC and general purpose timers are available and user selectable. The size and footprint of this series of modules is equivalent to that of the series SPZB32Wxy2.z to facilitate the evaluation of the different range options on the target application. The series groups multiple versions that differ in terms of memory size , antenna (ceramic antenna or integrated u.fl connector for the connection of an external antenna) and stacks options (ZigBee, RF4CE, SimpleMAC). The SPZB32W1y1.z versions are based on the STM32W108CB chipset integrating 128 kB of embedded flash memory and 8 kB of RAM available for data and program storage. For technical details on the STM32W108CB chipset refer to the related datasheet. For technical details on the supported stacks refer to the related user guide and application notes. T F A R D Doc ID xxxxx Rev 1 3/19 RoHS compliance SPZB32Wxy1.z 2 RoHS compliance ST modules are RoHS compliant and comply with ECOPACK norms. 3 Application Smart energy applications Machine2Machine industrial control Wireless sensor networks Home/building automation Smart appliances Wireless alarms and security systems Lighting control Remote monitoring T F A R D 4/19 Doc ID xxxxx Rev 1 SPZB32Wxy1.z Block diagram 4 Block diagram Figure 1. SPZB32WxA1.z block diagram
Figure 2. SPZB32WxC1.z block diagram
T F A R D
Doc ID xxxxx Rev 1 5/19 Pin settings 5 Pin settings 5.1 Pin connections Figure 3. Pin connection diagram SPZB32Wxy1.z Antenna T F A R D TOP VIEW AM09235V1 6/19 Doc ID xxxxx Rev 1 5.2 Pin description Table 1. Pin description Module pin n Pin name Direction STM32W pin Description 1 2 3 4 5 6 PB5 ADC0 TIM2CLK TIM1MSK PA5 ADC5 PTI_DATA nBOOTMODE TRACEDATA3 PA4 ADC4 PTI_EN TRACEDATA2 PA3 SC2nSSEL TIM2_CH2 TRACECLK nRESET PB3 UART_CTS SC1SCLK TIM2_CH3 D o c I D x x x x x R e v 1 7
1 9 I/O Analog I I I/O 43 43 43 43 27 27 27 Digital I/O ADC Input 0 Timer 2 external clock input Timer 1 external clock mask input Digital I/O ADC Input 1 Frame signal of PTI (Packet Trace Interface) Analog D O I 0 I/O 27 R 27 26 Embedded serial bootloader activation out of reset Synchrounus CPU trace data bit 3 Digital I/O A ADC Input 0 Frame signal of PTI (Packet Trace Interface) Synchrounus CPU trace data bit 2 F Digital I/O SPI SLAVE SELECT of Serial Controller 2 T Analog O O I/O I I/O O I I/O I I/O I/O 26 26 26 25 25 25 25 12 19 19 19 19 Timer 2 channel 2 output (or input - Disable remap with TIM2_OR[5]) Synchrounus CPU trace clock Active low reset ( an internal pull-up of 30 kohm typ. is provided) Digital I/O UART CTS handshake of Serial Controller 1 SPI slaver clock of Serial Controller SC1 / SPI master clock of Serial Controller SC1 Timer 2 channel 3 input / Timer 2 channel 3 output S P Z B 3 2 W x y 1
. z i P n s e t t i n g s
8 1 9 D o c I D x x x x x R e v 1 Table 1. Pin description (continued) Module pin n Pin name Direction STM32W pin Description 7 8 9 10 11 12 13 PB4 UART_RTS TIM2_CH4 SC1nSSEL PA0 SC2MOSI SC2MOSI TIM2_CH1 PA1 SC2MISO SC2MISO SC2SDA TIM2_CH3 PA2 SC2SCLK SC2SCLK SC2SCL TIM2_CH4 GND VDD PC1 ADC3 SWO TRACEDATA0 D I/O I/O I/O O I/O I I/O O I I O I/O I/O I/O O I I/O I/O
20 20 20 20 21 21 21 21 22 Digital I/O UART RTS handshake of Serial Controller 1 Timer 2 channel 4 input / Timer 2 channel 4 output SPI slave select of Serial Controller 1 Digital I/O SPI Master data out of Serial Controller 2 SPI Slave data in of Serial Controller 2 Timer 2 channel 1 input / Timer 2 channel 1 output Digital I/O 22 R 22 SPI Master data in of Serial Controller 2 SPI Slave data out of Serial Controller 2 TWI (I2C) data of Serial Controller 2 A Digital I/O F SPI Master clock of Serial Controller 2 SPI Slave clock of Serial Controller 2 TWI (I2C) clock of Serial Controller 2 T Timer 2 channel 3 input / Timer 2 channel 3 output Timer 2 channel 4 input / Timer 2 channel 4 output Ground 22 22 24 24 24 24 24 49 Power 16,23,28,37 Input power supply I/O Analog O O 38 38 38 38 Digital I/O ADC Input 3 Serial Wire Output ayncronous trace output to debugger Syncronous CPU trace data bit 0 i P n s e t t i n g s S P Z B 3 2 W x y 1
. z Table 1. Pin description (continued) Module pin n Pin name Direction STM32W pin Description PB0 VREF (O/I) TIM1CLK TIM2MSK IRQA TRACECLK PB1 SC1TXD I/O Analog I I I O I/O SC1MOSI / SC1MISO D O O 36 36 36 36 36 36 30 30 30 Digital I/O ADC reference output / ADC reference input Timer 1 external clock input Timer 2 external clock mask input External interrupt source A Syncronous CPU trace clock Digital I/O UART transmit data of Serial Controller 1 SPI master data out of Serial Controller 1 / SPI slave data out of Serial Controller 1 14 15 30 R 30 TWI (I2C) data of Serial Controller 1 Timer 2 channel 1 input / Timer 2 channel 1 output Digital I/O A SPI master data in of Serial Controller SC1 / SPI slave data in of Serial Controller 1 D o c I D x x x x x R e v 1 9
1 9 SC1SDA TIM2_CH1 PB2 SC1RXD 16 SC1MISO / SC1MOSI SC1SCL TIM2_CH2 JTCK SWCLK PC2 JTDO SWO PC3 JTDI PC4 JTMS SWDIO 17 18 19 20 I/O I/O I/O I I I/O I/O I I/O I/O O O I/O I I/O I I/O 31 31 31 31 31 32 32 33 33 33 34 34 35 35 35 UART receive data of Serial Controller 1 F TWI (I2C) clock of Serial Controller 1 T JTAG clock input from debugger Timer 2 channel 2 input / Timer 2 channel 2 output Serial Wire clock input/output with debugger Digital I/O JTAG data out to debugger Serial Wire Output asyncronous trace output to debugger Digital I/O JTAG data in from debugger Digital I/O JTAG mode select from debugger Serial Wire bidirectional data to/from debugger S P Z B 3 2 W x y 1
. z i P n s e t t i n g s 1 0 1 9
D o c I D x x x x x R e v 1 Table 1. Pin description (continued) Module pin n Pin name Direction STM32W pin Description 21 22 23 24 25 40 40 40 40 41 41 41 41 41 Digital I/O (high current) JTAG reset input from debugger Syncronous CPU trace data bit 1 External interrupt source D Digital I/O Timer 1 channel 2 output Timer 1 channel 2 input External interrupt source C ADC input 2 42 R 42 Digital I/O Timer 1 channel 1 output Timer 1 channel 1 input A External interrupt source B ADC input 1 F D I I PC0 JRST TRACEDATA1 IRQD PB7 TIM1_CH2 TIM1 _CH2 IRQC ADC2 PB6 TIM1_CH1 TIM1_CH1 IRQB ADC1 LNA/ENABLE PA6/LNA_ENABLE RF_STANDBY PA7/RF_STANDBY I/O I O I I/O O I I/O O I I Analog I O I O 42 42 42 29 29 18 18 Digital input, module firmware dependent, externally forced by the user dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L internal LNA.
(HIGH= internal LNA enabled, LOW= internal LNA disabled). T Digital output, module firmware dependent, internally forced by application dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L internal LNA. (HIGH=
internal LNA enabled, LOW= internal LNA disabled). Digital input, module firmware dependent, externally forced by the user dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L front-end STANDBY state.
(HIGH= Front-end enabled, LOW= Front-end forced in the STANDBY state). Digital output, module firmware dependent, internally forced by application dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L front-end STANDBY state.
(HIGH= Front-end enabled, LOW= Front-end forced into STANDBY state). i P n s e t t i n g s S P Z B 3 2 W x y 1
. z SPZB32Wxy1.z Electrical characteristics 6 Electrical characteristics 6.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol Parameter VDD Vin Tstg Tsold Module supply voltage Input voltage on any digital pin Storage temperature Soldering temperature < 10s Min.
- 0.3
- 0.3
-40 Max. 3.6 Vdd + 0.3
+85 250 Unit V V C C DC electrical characteristics Recommended operating conditions Table 3. Symbol VDD Tstg Table 4. Symbol IRX ITX IDS Recommended operating conditions Module supply voltage
-40 C < T < +85 C Operating ambient temperature Conditions Parameter T F A R D Conditions Parameter Vdd = 3.3 V, T= 25 C Po = 18 dBm, Vdd = 3.3 V, T = 25 C, F = 2450MHz Vdd = 3.3 V, T = 25 C RX current TX current Deep sleep current
(32.768 kHz oscillator) DC electrical characteristics Min. Typ. Max. Unit 2.1
-40 3.3 3.6
+85 V C Min. Typ. Max. Unit
20 120 1.3
mA mA mA 6.2 6.3 Doc ID xxxxx Rev 1 11/19 Electrical characteristics SPZB32Wxy1.z 6.4 Digital I/O specifications Table 5. Digital I/O specifications Symbol Parameter Conditions Min. 0 2.1 < Vdd < 3.6 V 2.1 < Vdd < 3.6 V 0.62 x Vdd 2.1 < Vdd < 3.6 V 2.1 < Vdd < 3.6 V 30 30 0 0.82 x Vdd Input pull-up resistor Low level input voltage Input current for logic 1 Input current for logic 0 High level input voltage Input pull-down resistor VIL VIH Iil Iih Ripu Ripd VOL VOH IOHS IOLS IOHH Output source current (high current) IOLH IOTot Output sink current (high current) Output source current (standard) Output sink current (standard) Total output current for I/O High level output voltage Low level output voltage T F A R D Vdd = 3.3 V, 1 % PER Vdd = 3.3 V, T= 25 C Vdd = 3.3 V, T= 25 C 5 MHz 10 MHZ Conditions Min. 2405 RF electrical characteristics 6.5 Table 6. Symbol Electrical characteristics Parameter Frequency range TX RX Output power Sensitivity Adjacent channel rejection Typ. Max. Unit 0.5 x Vdd Vdd
-0.5 0.5 0.18 x Vdd Vdd 4 4 8 8 40 V V mA mA k k V V mA mA mA mA mA Typ. 35 40 Max. 2480 20
-105 Unit MHz dBm dBm dBm 12/19 Doc ID xxxxx Rev 1 SPZB32Wxy1.z Mechanical dimensions 7 Mechanical dimensions Figure 4. Mechanical dimensions
T F A R D
Figure 5. Pin land pattern (dimensions in mm)
Doc ID xxxxx Rev 1
13/19 Soldering 8 Soldering SPZB32Wxy1.z The soldering phase must be carefully executed; in order to avoid undesired melting phenomenon, particular attention must be paid to the set-up of the peak temperature. Below are some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations PB free assembly 3 C / sec max. 150 C 200 C 60 100 sec 217 C 40 70 sec 240 + 0 C 10 20 sec 6 C / sec 8 minutes max. Table 7. Soldering Profile feature Average ramp up rate (TSMAX to TP) Preheat Temperature min. (TS MIN) Temperature max. (TS MAX) Time (TS MIN to TS MAX) (tS) Time maintained above:
Temperature TL Time tL Peak temperature (Tp) Time within 5 C of actual peak temperature (tP) Ramp down rate Time from 25 C to peak temperature T F A R D 14/19 Doc ID xxxxx Rev 1 SPZB32Wxy1.z Product approvals 9 Product approvals This series of modules has been designed to meet national regulations for world wide use. Different versions of modules belonging to the same series are orderable as it is specified in the Section 10. They differ in terms of integrated memory size and protocol stack enabled to run while sharing the same manufacturing , design and radios capabilities. As representative of the series from the RF design and radios capabilities, the versions using 128 kB Flash/8kB RAM and Zigbee PRO Protocol stack (i.e. SPZB32W1A1.1 and SPZB32W1C1.1) have been used during the certification tests. The following certifications have been obtained. 9.1 FCC approvals The SPZB32W1A1.1 device, with integrated antenna, as well as the SPZB32W1C1.1, with the antenna specified in Table 8, have been tested and found to comply with the limits for a Class B digital device , pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected T F A R D Consult the dealer or an experienced radio/TV technician for help Module type: ZigBee module SPZB32W1A1.1 / SPZB32W1C1.1 FCC-ID: S9NZB32C1 Modular type: single modular Antenna used for FCC approvals Part N 2010B4844-01 (Titanis Antenna) Manufacturer Antenova Table 8. ITEM 1 Any changes or modifications not expressed approved by the part responsible for compliance could cause the module to cease to comply with FCC rules part 15, and thus void the users authority to operate the equipment. While the applicant for a device into which the SPZB32W1A1.1 or the SPZB32W1C2.1 with the antenna specified in Table 8 installed is not required to obtain new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the end product. Doc ID xxxxx Rev 1 15/19 Product approvals SPZB32Wxy1.z 9.1.1 FCC labeling requirements When integrating the SPZB32W1A1.1 / SPZB32W1C1.1 into the final product, il must be ensured that the FCC labelling requirements, as specified below, are satisfied. Based on the Public Notice from FCC, the product into which our transmitter module is installed must display a label referring to the enclosed module. The label should use wording such as Contains Transmitter module FCC ID: S9NZB32C1 or Contains FCC ID: S9NZB32C1 , any similar wording that expressed the same meaning may be used. An example is:
Contains FCC ID: S9NZB32C1 Expert opinion N. xxx-xxxxxx released by IMQ refers to the following normative:
European certification SPZB32W1A1.1 and SPZB32W1C2.1 devices are CE certified:
0051 Radio: EN300 328: V1.7.1:2006-10 EMC: EN301 489 17 V2.1.1:2009 Safety: EN60950-1:2006 + A11:2009 T F A R D 9.2 16/19 Doc ID xxxxx Rev 1 SPZB32Wxy1.z Ordering information scheme 10 Ordering information scheme Table 9. Ordering information scheme SPZB 32Wx y 1
.z 802.15.4 / ZigBee modules Memory options:
x --> 1: 128 kB Flash; 8 kB RAM x --> 2: 256 kB Flash; 16 kB RAM Antenna options:
y --> A: Integrated ceramic antenna y --> C: Integrated UFL connector 1: Long TX range Firmware options:
z --> 1: ZigBee PRO (EmberZnet) z --> 2: STM ZigBee z --> 3: RF4CE z --> 4: SimpleMAC z --> 5: Zigbee IP T F A R D Check availability of the different versions with your ST sales representative. Note:
Doc ID xxxxx Rev 1 17/19 Revision history SPZB32Wxy1.z 11 Revision history Table 10. Document revision history Date Revision Changes 28-Jul-2011 1 Initial release T F A R D 18/19 Doc ID xxxxx Rev 1 SPZB32Wxy1.z Please Read Carefully:
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Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID xxxxx Rev 1 19/19