FCC ID: RFD-CR50 CR50 Communications Controller

Leica CR50 User Manual Version 1.0 English Introduction Purchase Congratulations on the purchase of a Leica CR50 system. This manual contains important safety directions as well as instructions for setting up the product and operating it. Refer to 1 Safety Directions for fur-

ther information. Read carefully through the User Manual before you switch on the product. The content of this document is subject to change without prior notice. Ensure that the product is used in accordance with the latest version of this docu-

ment. Product identification The model and serial number of your product are indicated on the type label. Always refer to this information when contacting your agency or Leica Geo-

systems authorised service centre. Trademarks Bluetooth is a registered trademark of Bluetooth SIG, Inc. All other trademarks are the property of their respective owners. Validity of this manual Available documenta-

tion This manual applies to the Leica CR50. Name Description/Format Leica CR50 Quick Guide Leica CR50 User Manual Provides an overview of the product together with technical data and safety directions. Inten-

ded as a quick reference field guide. All instructions required in order to operate the product to a basic level are contained in the User Manual. Provides an overview of the product together with technical data and safety directions. Refer to the following resources for all Leica CR50 documentation/soft-

ware:

the Leica USB documentation card. https://myworld.leica-geosystems.com https://myworld.leica-geosystems.com offers a wide range of services, inform-

ation and training material. With direct access to myWorld, you are able to access all relevant services whenever it is convenient for you. The availability of services depends on the instrument model. Service myProducts Description Add all products that you and your company own and explore your world of Leica Geosystems: View detailed information on your products and update your products with the latest software and keep up-

to-date with the latest documentation. 2 Service myService mySupport myLearning myTrustedServices mySmartNet Description View the current service status and full service his-

tory of your products in Leica Geosystems service centres. Access detailed information on the services performed and download your latest calibration cer-

tificates and service reports. Create new support requests for your products that will be answered by your local Leica Geosystems Support Team. View the complete history of your support requests and view detailed information on each request in case you want to refer to previous support requests. Welcome to the home of Leica Geosystems online learning! There are numerous online courses avail-

able to all customers with products that have valid CCPs (Customer Care Packages). Add your subscriptions and manage users for Leica Geosystems Trusted Services, the secure software services, that assist you to optimise your workflow and increase your efficiency. Add and view your HxGNSmartNet subscriptions and user information. HxGNSmartNet delivers high-preci-

sion and high-availability GNSS network correction services in real time. The HxGNSmartNet Global family offers Network RTK with RTK bridging and Precise Point Positioning (PPP) services. These ser-

vices work exclusively with Leica Geosystems GS sensors, providing the highest accuracy. Combined, they ensure HxGNSmartNet coverage everywhere. myDownloads Downloads of software, manuals, tools, training material and news for Leica Geosystems products. 3 Table of Contents 1 2 3 4 5 6 7 Safety Directions 1.1 1.2 1.3 1.4 1.5 1.6 General Introduction Definition of Use Limits of Use Responsibilities Hazards of Use Electromagnetic Compatibility (EMC) Description of the System 2.1 General Information Power Concept System Components 2.1.1 2.1.2 Unpacking the Container 2.2.1 Instrument Components CR50 Dual GNSS Container 2.2 2.3 Using CR50 3.1 3.2 3.3 3.4 Power Supply Installing a SIM Card Using USB Memory Devices Installation on a Machine Setups with Accessories Setup with UHF Radio 4.1 Setup with 4G Modem 4.2 CR50 Web Interface Care and Transport 6.1 6.2 6.3 Transport Storage Cleaning and Drying Technical Data 7.1 7.2 7.3 Technical Data CR50 7.1.1 Pin Assignments and Sockets Conformity Declarations 7.3.1 CR50 General Technical Data of the Product 8 Software Licence Agreement/Warranty Appendix A Glossary N A.1 5 5 6 6 7 7 11 14 14 14 15 16 16 17 19 19 19 20 20 23 23 24 25 33 33 33 33 34 34 34 35 36 36 42 43 43 4 Table of Contents 1 1.1 Description About warning messages Safety Directions General Introduction The following directions enable the person responsible for the product, and the person who actually uses the equipment, to anticipate and avoid opera-

tional hazards. The person responsible for the product must ensure that all users understand these directions and adhere to them. Warning messages are an essential part of the safety concept of the instru-

ment. They appear wherever hazards or hazardous situations can occur. Warning messages... make the user alert about direct and indirect hazards concerning the use of the product. contain general rules of behaviour. For the users safety, all safety instructions and safety messages shall be strictly observed and followed! Therefore, the manual must always be available to all persons performing any tasks described here. DANGER, WARNING, CAUTION and NOTICE are standardised signal words for identifying levels of hazards and risks related to personal injury and property damage. For your safety, it is important to read and fully understand the following table with the different signal words and their definitions! Supple-

mentary safety information symbols may be placed within a warning message as well as supplementary text. Type Description DANGER WARNING CAUTION NOTICE Indicates an imminently hazardous situation which, if not avoided, will result in death or serious injury. Indicates a potentially hazardous situation or an unintended use which, if not avoided, could result in death or serious injury. Indicates a potentially hazardous situation or an unintended use which, if not avoided, may result in minor or moderate injury. Indicates a potentially hazardous situation or an unintended use which, if not avoided, may result in appreciable material, financial and environmental damage. Important paragraphs which must be adhered to in practice as they enable the product to be used in a technically correct and efficient manner. Safety Directions 5 1.2 Intended use Reasonably foreseeable misuse Definition of Use Computing with software. Carrying out measurement tasks using various GNSS measuring tech-

niques. Recording GNSS and point related data. Remote control of product. Data communication with external appliances. Measuring raw data and computing coordinates using carrier phase and code signal from GNSS satellites. Use of the product without instructions Use outside of the intended use and limits Disabling of safety systems Removal of hazard notices Opening the product using tools, for example a screwdriver, unless this is permitted for certain functions Modification or conversion of the product Use after misappropriation Use of products with recognisable damage or defects Use with accessories from other manufacturers without the prior explicit approval of Leica Geosystems Inadequate safeguards at the working site Controlling of machines, moving objects or similar monitoring applications without additional control and safety installations WARNING Altered function and safety of the machine Unauthorised modification of building and constructions machines by mount-

ing or installing the product may alter the function and safety of the machine. Precautions:

Follow the instructions of the machine manufacturer. If no appropriate instruction is available, ask machine manufacturer for instructions before mounting or installing the product. 1.3 Environment Limits of Use Suitable for use in an atmosphere appropriate for permanent human habita-

tion. Not suitable for use in aggressive or explosive environments. WARNING Working in hazardous areas or close to electrical installations or similar situations Life Risk. Precautions:

Local safety authorities and safety experts must be contacted by the person responsible for the product before working in such conditions. 6 Safety Directions 1.4 Responsibilities Manufacturer of the product Leica Geosystems AG, CH-9435 Heerbrugg, hereinafter referred to as Leica Geosystems, is responsible for supplying the product, including the User Manual and original accessories, in a safe condition. Person responsible for the product The person responsible for the product has the following duties:

To understand the safety instructions on the product and the instructions in the User Manual To ensure that the product is used in accordance with the instructions To be familiar with local regulations relating to safety and accident pre-

vention To stop operating the system and inform Leica Geosystems immediately if the product and the application become unsafe To ensure that the national laws, regulations and conditions for the oper-

ation of the product are respected To ensure that radio modems are not operated without the permission of the local authorities on frequencies and/or output power levels other than those specifically reserved and intended for use without a specific permit. The internal and external radio modems have been designed to operate on frequency ranges and output power ranges, the exact use of which differs from one region and/or country to another. WARNING Unqualified installation on building or construction machinery This may result in personal and material damage. Precautions:

Only an appropriately trained and qualified specialist may install this product on building or construction machinery. 1.5 Hazards of Use CAUTION Unsuitable installation location Installing near mechanically moving machine components may damage the product. Precautions:

Deflect the mechanically moving machine components as far as possible and define a safe installation zone. NOTICE Dropping, misusing, modifying, storing the product for long periods or transporting the product Watch out for erroneous measurement results. Precautions:

Periodically carry out test measurements and perform the field adjust-

ments indicated in the User Manual, particularly after the product has been subjected to abnormal use as well as before and after important measurements. Safety Directions 7 DANGER Risk of electrocution Because of the risk of electrocution, it is dangerous to use poles, levelling staffs and extensions in the vicinity of electrical installations such as power cables or electrical railways. Precautions:

Keep at a safe distance from electrical installations. If it is essential to work in this environment, first contact the safety authorities responsible for the electrical installations and follow their instructions. WARNING Distraction/loss of attention During dynamic applications, for example stakeout procedures, there is a danger of accidents occurring if the user does not pay attention to the envir-

onmental conditions around, for example obstacles, excavations or traffic. Precautions:

The person responsible for the product must make all users fully aware of the existing dangers. WARNING Inadequate securing of the working site This can lead to dangerous situations, for example in traffic, on building sites and at industrial installations. Precautions:

Always ensure that the working site is adequately secured. Adhere to the regulations governing safety, accident prevention and road traffic. CAUTION Not properly secured accessories If the accessories used with the product are not properly secured and the product is subjected to mechanical shock, for example blows or falling, the product may be damaged or people can sustain injury. Precautions:

When setting up the product, make sure that the accessories are correctly adapted, fitted, secured, and locked in position. Avoid subjecting the product to mechanical stress. 8 Safety Directions WARNING Lightning strike If the product is used with accessories, for example masts, staffs, poles, you may increase the risk of being struck by lightning. Precautions:

Do not use the product in a thunderstorm. DANGER Risk of being struck by lightning If the product is used with accessories, for example on masts, staffs, poles, you may increase the risk of being struck by lightning. Danger from high voltages also exists near power lines. Lightning, voltage peaks, or the touching of power lines can cause damage, injury and death. Precautions:

Do not use the product in a thunderstorm as you can increase the risk of being struck by lightning. Be sure to remain at a safe distance from electrical installations. Do not use the product directly under or close to power lines. If it is essential to work in such an environment contact the safety authorities responsible for electrical installations and follow their instructions. If the product has to be permanently mounted in an exposed location, it is advisable to provide a lightning conductor system. A suggestion on how to design a lightning conductor for the product is given below. Always follow the regulations in force in your country regarding grounding antennas and masts. These installations must be carried out by an authorised specialist. To prevent damages due to indirect lightning strikes (voltage spikes) cables, for example for antenna, power source or modem should be protected with appropriate protection elements, like a lightning arrester. These installations must be carried out by an authorised specialist. If there is a risk of a thunderstorm, or if the equipment is to remain unused and unattended for a long period, protect your product addition-

ally by unplugging all systems components and disconnecting all connect-

ing cables and supply cables, for example, instrument - antenna. Lightning conductors Suggestion for design of a lightning conductor for a GNSS system:

1. On non-metallic structures Protection by air terminals is recommended. An air terminal is a pointed solid or tubular rod of conducting material with proper mounting and con-

nection to a conductor. The position of four air terminals can be uniformly distributed around the antenna at a distance equal to the height of the air terminal. The air terminal diameter should be 12 mm for copper or 15 mm for aluminium. The height of the air terminals should be 25 cm to 50 cm. All air terminals should be connected to the down conductors. The diameter of the air terminal should be kept to a minimum to reduce GNSS signal shading. 2. On metallic structures Protection is as described for non-metallic structures, but the air terminals can be connected directly to the conducting structure without the need for down conductors. Safety Directions 9 Air terminal arrangement, plan view Grounding the instrument/antenna a b c Antenna Support structure Air terminal a b c Antenna Lightning conductor array Antenna/instrument connec-

tion d Metallic mast e Connection to earth WARNING Incorrect fastening of the external antenna Incorrect fastening of the external antenna to vehicles or transporters poses the risk of the equipment being broken by mechanical influence, vibration or airstream. This may result in accident and physical injury. Precautions:

Attach the external antenna professionally. The external antenna must be secured additionally, for example by use of a safety cord. Ensure that the mounting device is correctly mounted and able to carry the weight of the external antenna (>1 kg) safely. CAUTION Inadequate steering if machine is defective Beware of inadequate steering if machine is defective like after a crash or other damaging events or alterations to the machine. Precautions:

Periodically perform control measurements and field adjustments on the machine as specified in the User Manual. While working, construction and grading should be checked by appropriate means, for example spirit level, tachymeter, before and after important measuring tasks. 10 Safety Directions GS_039abcGS_040edcab WARNING Precautions:

Missing attention of operators or malfunctions While steering or navigating the machine accidents may occur due to:

The operator not paying attention to the surroundings (persons, ditches, traffic, etc.), or Malfunctions (of a system component, interference, etc). The operator assures that the machine is operated, guided and monitored by a qualified user (e.g. driver). The user has to be able to take emergency measures, for example an emergency stop. WARNING Improper disposal If the product is improperly disposed of, the following can happen:

If polymer parts are burnt, poisonous gases are produced which may impair health. If batteries are damaged or are heated strongly, they can explode and cause poisoning, burning, corrosion or environmental contamination. By disposing of the product irresponsibly you may enable unauthorised persons to use it in contravention of the regulations, exposing themselves and third parties to the risk of severe injury and rendering the environ-

ment liable to contamination. Precautions:

The product must not be disposed with household waste. Dispose of the product appropriately in accordance with the national regulations in force in your country. Always prevent access to the product by unauthorised personnel. Product-specific treatment and waste management information can be received from your Leica Geosystems distributor. WARNING Improperly repaired equipment Risk of injuries to users and equipment destruction due to lack of repair knowledge. Precautions:

Only authorised Leica Geosystems Service Centres are entitled to repair these products. 1.6 Description Electromagnetic Compatibility (EMC) The term Electromagnetic Compatibility is taken to mean the capability of the product to function smoothly in an environment where electromagnetic radiation and electrostatic discharges are present, and without causing elec-

tromagnetic disturbances to other equipment. Safety Directions 11 CAUTION Electromagnetic radiation Electromagnetic radiation can cause disturbances in other equipment. Precautions:

Although the product meets the strict regulations and standards which are in force in this respect, Leica Geosystems cannot completely exclude the possibility that other equipment may be disturbed. CAUTION Use of the product with accessories from other manufacturers. For example, field computers, personal computers or other electronic equipment, non-standard cables or external batteries This may cause disturbances in other equipment. Precautions:

Use only the equipment and accessories recommended by Leica Geosys-

tems. When combined with the product, other accessories must meet the strict requirements stipulated by the guidelines and standards. When using computers, two-way radios or other electronic equipment, pay attention to the information about electromagnetic compatibility provided by the manufacturer. CAUTION Intense electromagnetic radiation. For example, near radio transmit-

ters, transponders, two-way radios or diesel generators Although the product meets the strict regulations and standards which are in force in this respect, Leica Geosystems cannot completely exclude the possib-

ility that the function of the product may be disturbed in such an electromag-

netic environment. Precautions:

Check the plausibility of results obtained under these conditions. CAUTION Electromagnetic radiation due to improper connection of cables If the product is operated with connecting cables, attached at only one of their two ends, the permitted level of electromagnetic radiation may be exceeded and the correct functioning of other products may be impaired. For example, external supply cables or interface cables. Precautions:

While the product is in use, connecting cables, for example product to external battery or product to computer, must be connected at both ends. 12 Safety Directions WARNING Use of product with radio or digital cellular phone devices Electromagnetic fields can cause disturbances in other equipment, installa-

tions, medical devices, for example pacemakers or hearing aids, and aircrafts. Electromagnetic fields can also affect humans and animals. Precautions:

Although the product meets the strict regulations and standards which are in force in this respect, Leica Geosystems cannot completely exclude the possibility that other equipment can be disturbed or that humans or animals can be affected. Do not operate the product with radio or digital cellular phone devices in the vicinity of filling stations or chemical installations, or in other areas where an explosion hazard exists. Do not operate the product with radio or digital cellular phone devices near medical equipment. Do not operate the product with radio or digital cellular phone devices in aircrafts. Do not operate the product with radio or digital cellular phone devices for long periods with the product immediately next to your body. Safety Directions 13 Description of the System System Components General Information The Leica CR50 instrument, paired with a GNSS instrument, offers you highest productivity and flexibility, allowing you to choose the right communication device for your use case. An example configuration is shown in the following paragraph. 2 2.1 2.1.1 Description Main components, Radio Configuration with Dual GNSS CGA100 Robust multi-frequency GNSS antenna, 2 x CA16 Antenna cable, 10 m, 2 x iCG100 Instrument CA49/CA53 Bluetooth antenna Automotive Ethernet cable Junction box a b c d e f g Machine PC CC70/CC80 CR50 Instrument h CA46/CA52 4G diversity modem antenna i Radio antenna CA12/CA13/CA43 and CA22 magnetic radio antenna j mount Component iCG100 Instrument Description To calculate two positions from the com-

puted ranges to all visible GNSS (Global Navigation Satellite System) satellites. 14 Description of the System g24171_001ijabhdfec Special features CR50 Component Description CGA100 GNSS Antenna To receive the signals from the GNSS satel-

lites. This Antenna is specified to the high environmental requirements on mining and construction machines. CR50 Instrument For correction data link. Machine PC Junction box To determine the position of the machine using measurement information from the instrument and GNSS antenna and for an automatic adjustment of the machines hydraulic system. The components are connected through machine junction box. CR50 instruments are equipped with several special features:

Wide supply voltage range of 9V to 36V Voltage peak protection and reverse polarity protection Can be mounted on a machine in both the vertical and horizontal orienta-

tions Can be used near the sea Magnets for simple mountings Protection caps on connectors LEDs for status information Versatile connectivity with Automotive Ethernet USB host port for data transfer and firmware upgrade Integrated high speed LTE (4G) / HSPA+ (3.5G) modem Integrated radio options Robust, compact aluminium housing Commands for Remote Config 2.1.2 General Power options The CR50 instrument can be communicated:

via the Leica Machine Control Net Protocol on the Automotive Ethernet port. Documentation for these communication protocols is available on request from the Leica Geosystems representative. Power Concept Use the accessories recommended by Leica Geosystems to ensure the correct functionality of the instrument. Power for the instrument is to be supplied externally. External power is sup-

plied coming from the Junction box via the Automotive Ethernet cable. CR50 can only be powered using the Automotive Ethernet port. Description of the System 15 2.2 Description Unpacking the Container Available delivery packages:

Delivery box: when a single CR50 instrument was ordered. Includes the instrument, the printed CR50 Quick Guide and the USB documentation card. A hard-top container comprising all items for a Dual GNSS configuration. 2.2.1 CR50 Dual GNSS Container MTC1408 Container upper shell The large-size MTC1408 container comprises all items for configuration of a CR50. a CA46/CA52 4G diversity modem antenna 16 Description of the System 025009_001a MTC1408 container lower shell Large-size MTC1408 container configuration. a b c CR50 Instrument Radio antenna CA12/CA13/

CA43 and CA22 magnetic radio antenna mount USB adapter 2.3 Instrument Components CR50 components Hex key 2.5 mm d e Quick Guide & USB docu-

mentation card CR50 Industrial 1 GB USB flash drive f a b c d e Power and status LED Internet status LED UHF radio status LED SIM card compart-

ment Grounding screw Description of the System 17 25011_001fedcba024359_001aebcd f g h i j k USB port Automotive Ethernet Port, Power in Automotive Ethernet Port, Power out UHF radio antenna port 4G modem antenna port 1 4G modem antenna port 2 Port USB 2.0 Description USB A data port via M8 to USB A adapter, for data exchange, software updates. UHF Radio For connection of a radio external antenna. Automotive Ethernet 1 Power input and data input/output. Automotive Ethernet 2 Power output and data input/output. Modem 1, Modem 2 For connection of an external diversity antenna for the internal 4G modem. 18 Description of the System 024360_001jihgfe 3 3.1 Using CR50 Power Supply External power supply only From the Junction box via Automotive Ethernet cable. In general, all installation works must be done by a dedicated installation spe-

cialist. Please contact the local selling unit or dealer for further information. 3.2 Installing a SIM Card Insert and remove the SIM card step-by-step Ensure the instrument is placed in its fixed position or place it onto a stable surface. 1. 2. 3. 4. 5. 6. Loosen the screws of the Sim card compartment cover with the supplied Hex key. Remove the cover. The indents on the cover allow to grip and pull for removal. Orientate the SIM card as illustrated. Insert the SIM card into the card slot and push it all the way in. Place the cover back into position. Tighten the screws of the cover, with maximum 60 Ncm. Secure the screws with Loctite 243 or a similar product to ensure that the instrument is waterproof. To remove the SIM card pull the card out. Using CR50 19 024395_0011a1b23445b5a 3.3 Using USB Memory Devices Insert and remove a USB Memory device step-by-step Ensure the instrument is placed in its fixed position or place it onto a stable surface. 1. 2. 3. Unscrew the cap from the USB port. Plug in the USB adapter cable. Slide the USB data storage device firmly into the USB host port until it clicks into position. Take care not to damage the USB data storage device when moving the CR50 or when handling around the device. Remove the adapter cable and close the USB port cover when no USB data storage device is used. USB Memory devices must be formatted in the FAT, FAT32 or exFAT format. To import data from a USB Memory device to the CR50, appropriate folders must be created on the USB device and the files placed in the correct folder. Copy coordinate system files to the folder 'CoordinateSystems'. All other files should be copied to the 'System' folder. Installation on a Machine In general, all installation works must be done by a dedicated installation spe-

cialist. Please contact the local selling unit or dealer for further information. The installation information within this User Manual is indicated to increase the operators understanding of the system and its maintaining. Before installation:

Please observe the maximum vibration and ambient temperature values indicated in chapter 7 Technical Data. Check that all parts needed are delivered. Refer to 2.2 Unpacking the Container for further information. It is strongly recommended that you bench test all components before commencing installation on the actual machine to make sure that all com-

ponents are fully operational. Preconditions for using USB Memory devices 3.4 Installation location The CR50 instrument should preferably be installed either inside a compart-

ment just behind the cabin or in the machine cabin itself. If the machine has no space inside a weather proof compartment or cabin, the instrument 20 Using CR50 1224358_001 is to be installed only on components that have no direct connection to the machine tool and/or are positioned separately from the tool or at locations that lie in the safe area of the mechanically moving components. Further, the instrument is to be installed so that it is protected from mechanical influences, for example stoning. Example of a correctly placed instrument. Installation direction The product must not be installed on the tool of the machine and/or on mechanical components that move the tool. Tools include for example bucket of excavator, blade of dozer, screed of paver. Mech-

anical parts include for example boom and stick of an excavator, hydraulic cylinder of a dozer or tow arm of an asphalt paver. Further, the instrument must not be installed near chassis, chain gear, wheels or on engine components connected to the engine itself. The cases stated are intended simply as examples. For inside assembly, the CR50 instrument must be installed either vertic-

ally with the connectors pointing upwards/downwards or horizontally on a flat plane. Easy access to the connectors should be guaranteed. For outside assembly, it is strongly recommended to install the instrument vertically with the connectors pointing downwards. In case this is not pos-

sible, horizontally on a flat plane, but never with the connectors pointing upwards. Fastening The CR50 instrument must be sup-

ported by two magnets on opposite sides. Using CR50 21 24361_00124690_001 Electrical grounding The electrical grounds of a Machine may be at different potentials either due to other large current electronic devices on the machine or when different grounds of the machine are isolated in service or welding operations. Different DC and RF noise may exist at different points in the machine which is out of the control of Leica Geosystems. Such noise may have a negative effect on the performance of the CR50. For this reason, it is best that all external antennas connected to the CR50, including the radio antenna and modem antenna, are isolated from the machine. This avoids additional ground paths being introduced. In an ideal installation, with isolated antennas, the connection of the grounding pin on the rear panel of the CR50 to the machine should not be required. It is extremely important to disconnect all cables from the CR50 before starting any welding operations on the machine. Otherwise the instrument may be damaged beyond repair. Installation of anten-

nas for internal/

external radios and modems External antennas with a magnetic mount can be used and installed on the roof of the cabin. This will increase the radio signal and therefore the reception of correc-

tion signals from a base station or when using an Ntrip solution. Cable installation Ensure that the cables are installed such that they are not bent or stretched. It is recommended to use strain relief brackets. Route the cable as directly as possible and avoid crossing cables. Be sure not to tie the cables into hot hydraulic hoses. 22 Using CR50 24362_001 4 4.1 Setup with UHF radio Setups with Accessories In the following chapters example configurations are shown, covering the most common use cases. Further configurations are possible. Please contact the local selling unit or dealer for information regarding special use cases. Setup with UHF Radio CGA100 Robust multi-frequency GNSS antenna, 2 x iCG100 Instrument CA49/CA53 Bluetooth antenna Automotive Ethernet cable Junction box a b c d e f MTC1408 Carry Case g Machine PC CC70/CC80 h i j k CA16 Antenna cable, 10 m, 2 x CR50 Instrument Automotive Ethernet cable Radio antenna CA12/CA13/CA43 and CA22 magnetic mount All necessary installation works must be carried out by a dedicated installation specialist. Please contact the local selling unit or dealer for further informa-

tion. Setups with Accessories 23 024355_001jabhfidegkc 4.2 Setup with 4G Modem Setup with 4G modem CGA100 Robust multi-frequency GNSS antenna, 2 x iCG100 Instrument CA49/CA53 Bluetooth antenna Automotive Ethernet cable Junction box a b c d e f MTC1408 Carry Case g Machine PC CC70/CC80 CR50 Instrument h Automotive Ethernet cable i CA46 4G diversity modem antenna j All necessary installation works must be carried out by a dedicated installation specialist. Please contact the local selling unit or dealer for further informa-

tion. 24 Setups with Accessories c024356_001jabhfideg 5 CR50 Web Interface Getting connected to the Web Interface Connection between the sensor and your device is established via Bluetooth. The following instructions are based on using Windows10. 1. Power on the CR50. If you intend to use the Web Interface with CR50 make sure the external Bluetooth antenna is attached. On your computer go to Start Menu > Settings > Devices. Activate Bluetooth if not yet switched on. Click "Add Bluetooth or other devices". Make sure that computer and sensor are in reach for a Bluetooth connection. Click Bluetooth and select the sensor from the list. Wait for the connection to be established. The sensor can be identified by its serial number. Go to Start Menu > Settings > Network & Internet. Under Advanced Network Settings click "Change Adapter Options". In the Network Connections page double-click on "Bluetooth Net-

work Connection". Finally, right-click on the sensor that you have just added and select Connect using > Access Point from the context menu. 2. 3. 4. 5. 6. Open a browser on your computer and enter the URL:

http://www.crsetup.leica-geosystems.com User name is "leica", as password enter the serial number of the sensor. Alternatively you can enter the IP address: 172.16.0.1 Start configuring the CR50 using the Web Interface. 7. For mobile devices it is only required to pair the sensor via Bluetooth. Web Interface -

Frame The header section contains a status information bar. The footer includes information on the connected receiver, its serial number and firmware version. The frame will always be visible independent of which tab you open for further configuration. Status information bar The status bar shows the internet connection, antenna configuration and receiver status information. CR50 Web Interface 25 Item Internet Description Indicates whether a connection is established on the sensor or not. WiFi/Cell/Radio Indicates the signal strength for each configured communication link. Indicates receiver operational status. Green: normal operation Yellow: warning Red: error When you tap the icon, you will be re-directed to the status information page. See also: System Info Home The Home page is a pure status information page.You will find detailed information on:

Status of the RTK link Status of the communication devices ConX and Analytics services SIM data usage Category Description Currently configured interface for real-time kinematic correction data status Data corrections Automatically detec-

ted reference antenna/

receiver Base details Status of communication devices Status of ConX and Analytics services 26 CR50 Web Interface Category Description Status and configuration of SIM data usage:

from the Rollover Mode drop-down list you can select whether data count shall be reset daily, weekly or monthly, or never (off). Sensor Configuration The Configuration page allows for configuring device settings such as:

Rover antennae settings Bluetooth Network settings for the Internet connection via WiFi, Ethernet or Cellular modem Internal radio System language Category Description Bluetooth is always active. This ensures seamless com-

munication with the web interface. CR50 Web Interface 27 Category Description Internet connection can be established via Cell Modem, Ethernet or WiFi depending on the chosen device. Each of the devices can be configured. Make sure that a connection is possible and the respective antenna is connected to the receiver. It is possible to configure WiFi as Hotspot where the internet con-

nection is shared with external devices (provided an internet con-

nection is estab-

lished on the sensor). Cell Modem requires a SIM card. PIN, PUK and APN have to be entered and set. Click Apply to take over any changes. The internal radio can be configured by selecting a Frequency Band from the drop-down list. A Protocol can be selected from the drop-down list. Click FEC to enable Forward Error Correction. The current status of the radio is shown. Enable Frequency Mode in order to define Frequency and Band-

width instead of selecting a Channel. 28 CR50 Web Interface Category Description Services The Services page allows for active services to be configured. In order to make use of the available services, an internet connection must be established on the sensor. See also: Sensor Configuration Category Description The iCON Analytics service is enabled by default and active once an internet con-

nection is established on the sensor. If you wish to disable this service or send data anon-

imously, you can select the respective options from the drop-down list. Click the About button to get detailed information on the scope and implications of using iCON Analytics. You can set up and configure a connection to Leica ConX here. Click Pair to establish the connection and use the given Pair Code to proceed with the setup on the ConX server. Select Share screen in order to see the CR50 screen on ConX and be able to control it from remote. Available Projects can be selected from the drop-down list. Select a project from the list if you wish to use a differ-

ent project. Select which data shall be synchronised to or from ConX:

You can upload System Config files, Coordinate Sytems, Log Files for Support or User Files. Select and click the Upload button. You can download System Config files, Coordinate Sytems, Antenna Lists, Licenses or User Files. Select and click the Download button. CR50 Web Interface 29 Category Description You can also download Firmware from ConX. If Firmware files are available for download, the Status turns to "Active"

and you can select files from the list of Available Images. Select and click the Download button. Utilities The Utilities page allows for firmware updates, adding license keys and uploading antenna lists from the connected device or from a USB flash drive on the sensor. No internet connection required on the sensor. Category Description The Current firmware ver-

sion is shown. Click on Choose File to select an upgrade file stored locally on the connected device. Then click the Upload button to upload the file to the sensor (via Bluetooth). From the drop-down list select the uploaded file and click Upgrade to start the firmware upgrade process. If a USB flash drive containing firmware files is connected to the sensor, you can directly select the upgrade file from the drop-

down list. Individual licenses can be added to the sensor. The current status of all licenses is displayed below. You can as well import or export files via USB flash drive. Attach the USB flash drive to the sensor. See also: Using USB Memory Devices From the drop-down lists select the files you want to upload to or download from the sensor and click Import/

Export. Click Delete All to delete all User Files or all SSH Public Keys stored in the internal memory on the sensor. System Info The System Info page shows read-only information on the sensor hardware and system status. 30 CR50 Web Interface Category Description Under Hardware you can visualise additional informa-

tion about the hardware components inside the sensor. Under Status you can find detailed information on errors and warnings. In case there is an issue the light bulb icon in the Status information bar turns yellow or red. See also: Web Inter-

face - Frame Support The Support page allows for log files handling service ports and resetting single components. Category Description Click the Export Logs To USB button to export log files inlcuding information on all modules running on the sensor. It is also possible to Down-

load Logs directly to the connected device. A USB flash drive must be connected. See also: Using USB Memory Devices CR50 Web Interface 31 Category Description Allows for configuring the Service Ports and resetting the SecureShell (SSH) pass-

word. Select MC Mode Override to pause CAN communication with the machine temporarily for troubleshooting. MC Mode Override is always disabled while booting the instrument. Allows for resetting single system components. Shows the elapsed time since the last system boot as well as the total uptime of the sensor. Tap Restart Instrument to reboot the system. Software Licence agree-

ment for copyright-protected Open Source Software. 32 CR50 Web Interface 6 6.1 Care and Transport Transport Transport in the field When transporting the equipment in the field, always make sure that you either carry the product in its original container, or carry the tripod with its legs splayed across your shoulder, keeping the attached product upright. Transport in a road vehicle Never carry the product loose in a road vehicle, as it can be affected by shock and vibration. Always carry the product in its container and secure it. For products for which no container is available use the original packaging or its equivalent. Shipping 6.2 Product 6.3 Product and accessories Damp products When transporting the product by rail, air or sea, always use the complete original Leica Geosystems packaging, container and cardboard box, or its equi-

valent, to protect against shock and vibration. Storage Respect the temperature limits when storing the equipment, particularly in summer if the equipment is inside a vehicle. Refer to Environmental specifica-

tions for information about temperature limits. Cleaning and Drying Use only a clean, soft, lint-free cloth for cleaning. If necessary, moisten the cloth with water or pure alcohol. Do not use other liquids; these may attack the polymer components. Dry the product, the transport container, the foam inserts and the accessories at a temperature not greater than 40 C/104 F and clean them. Do not repack until everything is dry. Always close the transport container when using in the field. Cables and plugs Keep plugs clean and dry. Blow away any dirt lodged in the plugs of the connecting cables. Connectors with dust caps Wet connectors must be dry before attaching the dust cap. Care and Transport 33 24440_001 7 7.1 7.1.1 Technical Data Technical Data CR50 General Technical Data of the Product Dimensions The overall dimensions are given for the housing including the sockets. Weight Length [mm]

Width [mm]

Thickness [mm]

150.0 Type CR50 150.0 40.0 Weight [kg]/[lbs]

0.84/1.86 (including internal LTE modem and UHF radio) The modem is integrated. Power Power consumption:

External supply voltage:

CR50 NTRIP Rover, radio excluded: 7.2 W typically, 24 V @ 300 mA Nominal 24 V DC (

36 V DC, supplied by the Junction Box via Automotive Ethernet cable.

), voltage range 9 V to Electrical data Type Voltage Current CR50 Nominal 24 V NTRIP Rover, radio excluded: 7.2 W typically, 24 V @

300 mA Gain (internal antenna) Typically -12 dBi Noise Figure Typically < 2 dBi Environmental spe-

cifications Temperature Type Operating temperature

[C]

Storage temperature [C]

Instrument

-40 to +65

-40 to +85 34 Technical Data 24363_00140 mm150 mm150mm150 mm123 mm Protection against water, dust and sand Type Protection Instrument IP6K8/6K9K (ISO 20653) Dust tight Blow rain tight Waterproof to 1 m temporary immersion Humidity Type Protection Instrument Up to 95 %

The effects of condensation are to be effectively counterac-

ted by periodically drying out the instrument. Vibration/Shock Type Vibration CR50 5 - 500 Hz, 15 mm, 5 g IEC60068-2-6 MIL-STD 810G - 514.6E-1-Cat24 Shock 60 g, 6 ms, IEC60068-2-27 7.2 Pin Assignments and Sockets Expert knowledge required Modification or adaption on base of the pin assignments and socket descrip-

tions need expert knowledge. Connectors Overview USB M8 connector Pin Function 1 2 3 4

+5 V USB P GND USB N -

Type: M12 4 Pin Automotive Ethernet, power in a b c d e USB port Automotive Ethernet Port, Power in Automotive Ethernet Port, Power out Radio antenna port 4G modem antenna antenna ports Direction USB power Out Bi-directional USB power return Bi-directional Pin Name Function 1 2 3 TRD+

TRD-

100Base T1-P 100Base T1-N Vinpositive

+VE Direction Bi-directional Bi-directional Power Technical Data 35 024364_001abcde024246_00134120024247_0014312 Pin 4 Name Function Vinnegative

-VE Direction Power Direction Bi-directional Bi-directional Power Power Automotive Ethernet, power out Type: M12 4 Pin Pin Name Function UHF Radio 1 2 3 4 TRD+

TRD-

100Base T1-P 100Base T1-N Voutpositive +VE Voutnegat-

ive

-VE Type: TNC Female Pin Description 1 2 Shield/Ground Signal and antenna power Modem Antenna Type: TNC Female Pin Description 1 2 3 4 Shield/Ground Antenna signal and antenna power Shield/Ground Antenna signal and antenna power Conformity Declarations CR50 7.3 7.3.1 Labelling CR50 Antenna Type Antenna type Connector Bluetooth Integrated antenna

Frequency band

[MHz]

2402 - 2480 36 Technical Data This device complies with part 15 of the FCC Rules.Operation is subject to the following two conditions:(1) This device may not cause harmful interference, and(2) this device must accept any interference received, including interference that may cause undesired operation.Art.No.: 123456N7NMC75 / 2417C-MC75MRBSATEL-TA43 / 2422A-SATELTA43Contains transmitter module FCC ID/ IC:Model: CR50S.No.: 1234567FCC ID: RFD-CR50 xxxIC: 3177A-CR50 xxxPower: 9V-32V/ 1A max.Leica Geosystems AGCH-9435 HeerbruggManufactured: 20XXMade in SwitzerlandEquip. No.: 1234567IP6K8/6K9KHHHHH-AA-FFFFF24388_0010024248_00112430024280_00121024357_0012143 Type Antenna type Connector CA46/CA52 External diversity antenna SMA Frequency band

[MHz]

698 - 960 1710 - 2170 2300 - 2700 Frequency band Type Frequency band [MHz]

Bluetooth 2402 - 2480 EM7565 Type WCDMA Frequency band [MHz]

Band 1 Tx: 1920 - 1980 Rx: 2110 - 2170 Band 2 Tx: 1850 - 1910 Rx: 1930 - 1990 Band 4 Tx: 1710 - 1755 Rx: 2110 - 2155 Band 5 Tx: 824 - 849 Rx: 869 - 894 Band 6 Tx: 830 - 840 Rx: 875 - 885 Band 8 Tx: 880 - 915 Rx: 925 - 960 Band 9 Tx: 1749.9 - 1784.9 Rx: 1844.9 - 1879.9 Band 19 Tx: 830 - 845 Rx: 875 - 890 LTE Band 1 Tx: 1920 - 1980 Rx: 2110 - 2170 Band 2 Tx: 1850 - 1910 Rx: 1930 - 1990 Band 3 Tx: 1710 - 1785 Rx: 1805 - 1880 Band 4 Tx: 1710 - 1755 Rx: 2110 - 2155 Technical Data 37 Type Frequency band [MHz]

Band 5 Tx: 824 - 849 Rx: 869 - 894 Band 7 Tx: 2500 - 2570 Rx: 2620 - 2690 Band 8 Tx: 880 - 915 Rx: 925 - 960 Band 9 Tx: 1749.9 - 1784.9 Rx: 1844.9 - 1879.9 Band 12 Tx: 699 - 716 Rx: 729 - 746 Band 13 Tx: 777 - 787 Rx: 746 - 756 Band 18 Tx: 815 - 830 Rx: 860 - 875 Band 19 Tx: 830 - 845 Rx: 875 - 890 Band 20 Tx: 832 - 862 Rx: 791 - 821 Band 26 Tx: 814 - 849 Rx: 859 - 894 Band 28 Tx: 703 - 748 Rx: 758 - 803 Band 29 Tx: n/a Rx: 717 - 728 Band 30 Tx: n/a Rx: 2350 - 2360 Band 41 2496 - 2690 (TDD) Output power Type Output power [mW]

Bluetooth 2.5 UMTS Band 1, 2, 4, 5, 6, 8, 9, 19: 200 38 Technical Data Type LTE Output power [mW]

Band 1, 2, 3, 4, 5, 8, 9, 12, 13, 18, 19, 20, 26, 28, 29, 30:

200 Band 7, 41: 160 Radiation Exposure Statement Specific Absorption Rate (SAR) The radiated output power of the instrument is below the radio frequency exposure limits. Nevertheless, the instrument should be used in such a manner that the potential for human contact during normal operation is minimised. To avoid the possibility of exceeding the radio frequency exposure limits, keep a distance of at least 30 cm between you (or any other person in the vicinity) and the instrument. The product meets the limits for the maximum permissible exposure of the guide-lines and standards which are force in this respect. The product must be used with the recommended antenna. A separation distance of at least 30 centimetres should be kept between the antenna and the body of the user or nearby person within the intended application. SAR limits Country Head Body Limb EU USA EU 0.5 W/Kg, 10-gram 0.5 W/Kg, 10-gram n/a France 0.5 W/Kg, 10-gram 0.5 W/Kg, 10-gram 0.5 W/Kg, 10-gram USA &

Canada 1.492 W/Kg, 1-gram 1.6 W/Kg, 1-gram n/a Hereby, Leica Geosystems AG declares that the radio equipment type CR50 is in compliance with Directive 2014/53/EU and other applicable European Directives. The full text of the EU declaration of conformity is avail-

able at the following Internet address: http://www.leica-geosys-

tems.com/ce. FCC ID: RFD-CR50 FCC Part 15, 22, 24, 27 and 90 This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. 2. This device may not cause harmful interference, and This device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, it may cause harmful interference to radio communications. However, there is no guarantee that interference does not occur in a particu-

lar installation. If this equipment does cause harmful interference to radio or television recep-

Technical Data 39 tion, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Changes or modifications not expressly approved by Leica Geosystems for compliance could void the user's authority to operate the equipment. Canada CAN ICES-003 Class B/NMB-003 Class B IC: 3177A-CR50 Canada Compliance Statement This device contains licence-exempt transmitter(s)/receiver(s) that com-

ply with Innovation, Science and Economic Development Canadas licence-

exempt RSS(s). Operation is subject to the following two conditions:

1. 2. This device may not cause interference This device must accept any interference, including interference that may cause undesired operation of the device Canada Dclaration de Conformit Lmetteur/rcepteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes:

1. 2. Lappareil ne doit pas produire de brouillage Lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement Radio Frequency (RF) Exposure Compliance Statement The radiated RF output power of the instrument is below the Health Canadas Safety Code 6 exclusion limit for portable devices (radiated element separation distance between the radiating element and user and/or bystander is below 20 cm). WARNING This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

1. 2. This device may not cause interference; and This device must accept any interference, including interference that may cause undesired operation of the device. China CCC CCC acceptance must be able to determine the product category based on the content of the Chinese manual. If the application category does not match the description of the manual, the CCC application will be returned. This was submitted at the application stage CCC. 40 Technical Data Product small class Product name According to the standard number Corresponding international standard number 1606 Mobile user terminal GB19484.1-2013 GB4943.1-2011 IEC 60950-1:2005 GB22450.1-2008 YD/T1592.1-2012 YD/T1595.1-2012 YD/T2583.14-2013 Japan South Korea This device is granted pursuant to the Japanese Radio Law (

). Japanese Telecommunications Business Law (

This device should not be modified (otherwise the granted designation number will become invalid).

) and the Applicant name: Leica Geosystems AG Product name: Specific small output wireless device Model name: 2020-07-09 KC number: R-R-rks-CR50 Manufacture date: Marked separately Manufacturer: LEICA GEOSYSTEMS AG/SWITZERLAND Others The conformity for countries with other national regulations has to be approved prior to use and operation. Technical Data 41 8 Software Licence Agreement/Warranty Software Licence Agreement Open source informa-

tion This product contains software that is preinstalled on the product, or that is supplied to you on a data carrier medium, or that can be downloaded by you online according to prior authorisation from Leica Geosystems. Such software is protected by copyright and other laws and its use is defined and regulated by the Leica Geosystems Software Licence Agreement, which covers aspects such as, but not limited to, Scope of the Licence, Warranty, Intellectual Property Rights, Limitation of Liability, Exclusion of other Assurances, Govern-

ing Law and Place of Jurisdiction. Please make sure, that at any time you fully comply with the terms and conditions of the Leica Geosystems Software Licence Agreement. Such agreement is provided together with all products and can also be referred to and downloaded at the Leica Geosystems home page at Hexagon Legal Documents or collected from your Leica Geosystems distrib-

utor. You must not install or use the software unless you have read and accepted the terms and conditions of the Leica Geosystems Software Licence Agree-

ment. Installation or use of the software or any part thereof, is deemed to be an acceptance of all the terms and conditions of such Licence Agreement. If you do not agree to all or some of the terms of such Licence Agreement, you must not download, install or use the software and you must return the unused software together with its accompanying documentation and the purchase receipt to the distributor from whom you purchased the product within ten (10) days of purchase to obtain a full refund of the purchase price. The software on the product may contain copyright-protected software that is licensed under various open source licences. Copies of the corresponding licences are provided together with the product (for example in the About panel of the software) can be downloaded on http://opensource.leica-geosystems.com/icon If foreseen in the corresponding open source licence, you may obtain the corresponding source code and other related data on http://opensource.leica-

geosystems.com/icon. Contact opensource@leica-geosystems.com in case you need additional information. 42 Software Licence Agreement/Warranty Appendix A Glossary A.1 Ntrip Ntrip Caster Ntrip Client N Networked Transport of RTCM via Internet Protocol is a protocol streaming real-time corrections over the Internet. is a generic protocol based on the Hypertext Transfer Protocol HTTP/1.1. is used to send differential correction data or other kinds of stream-

ing data to stationary or mobile users over the Internet. This process allows simultaneous computer, laptop, PDA, or instrument connections to a broadcasting host. supports wireless Internet access through mobile IP networks like digital cellular phones or modems. The Ntrip Server could be the GPS instrument itself. This setup means the GPS instrument is both the Ntrip Source generating the real-time data and also the NTRIP Server transferring this data to the Ntrip Caster. Ntrip and its role in the Internet The Ntrip Caster is an Internet server handling various data streams to and from the Ntrip Servers and Ntrip Clients. checks the requests from Ntrip Clients and Ntrip Servers to see if they are registered to receive or provide real-time corrections. decides whether there is streaming data to be sent or to be received. The Ntrip Client receives data streams. This setup could be, for example a real-time rover receiving real-time corrections. In order to receive real-time corrections, the Ntrip Client must first send a user ID a password an identification name, the so-called Mountpoint, from which real-time corrections are to be received to the Ntrip Caster. Ntrip Server The Ntrip Server transfers data streams. In order to send real-time corrections, the Ntrip Server must first send a password an identification name, the so-called Mountpoint, where the real-time cor-

rections come from to the Ntrip Caster. Glossary 43 NTRiPCasterInternetServerGS_044NTRiPClientNTRiPServer Before sending real-time corrections to the Ntrip Caster for the first time, a registration form must be completed. This form is available from the Ntrip Caster administration centre. Refer to the website of the Ntrip Caster adminis-

tration centre. Ntrip Source The Ntrip Source generates data streams. This setup could be base sending out real-time corrections. Ntrip system compon-

ents Ntrip consists of three system components:

Ntrip Clients Ntrip Servers Ntrip Caster 44 Glossary Original text Published in Switzerland, 2022 Leica Geosystems AG 960429-1.0.0en Leica Geosystems AG Heinrich-Wild-Strasse 9435 Heerbrugg Switzerland www.leica-geosystems.com

Label Position and Layout Label from column A Contains transmitter module FCC ID /IC:

NINMCTS/ 2417CAMCTS WRBSATEL-TA4S / 2420A-SATELTAGS Model: CR50 Equip No.: 1294567 Arto. 123456 S.No.: 1234567 Power: 9-32V / == 1A max. Leica Geosystems AG Ft RFD-CRS CH-9435 Heerbugg oon i Oo Manufactured MMIYY Watch Sozee IPS6IIPGAIPESK

* SOOOOO000KK aware UK @, C nuniieaaererr CA)

Zenon 2.4GHz Antenna Part No. SR4W030 REFLECTOR Product Specification 1. Features REFLECTOR Technology Antenna for 2.4GHz applications Bluetooth, Wi-Fi, ZigBee, ISM. Maintains high performance within device: DFI (Designed For Integration) 1.13mm diameter RF cable with IPEX MHF connector Self-Adhesive mounted Quick integration minimizes design cycle High performance Available in 2 standard cable lengths 2. Description Zenon is intended for use with all Wi-Fi/BT/ISM applications. A rigid antenna with cable enables direct connection to the host device (Plastic/Metal/PCB). The antenna can be placed against any material and will not detune. Simple integration with plug and play simplicity. This product specification shows the performance of the antenna to cover the frequency range: 2.4-2.5 GHz. 3. Applications Smart lighting Portable Devices Set-Top-Box Network Devices Wearable devices MIMO Systems Patent pending Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 1 4. Part Number Zenon: SR4W030-xxx Zenon Part No. SR4W030 Note. -xxx refers to cable length option:

Part Number Cable Length SR4W030-100 SR4W030-150 100mm 150mm 5. General Data Product name Part Number Frequency Polarization Operating temperature Impedance with matching Weight Antenna Assembly type Dimensions (Antenna) Cable length Connection Zenon SR4W030 2.4-2.5 GHz Linear

-40C to +85C 50

< 0.5 g FR4 Self-adhesive (3M 468MP) 23.0 x 16.0 x 1.6 (mm) 100 / 150 (mm) MHF IPEX Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 2 6. RF Characteristics Zenon Part No. SR4W030 The RF characteristics are shown with the antenna placed in three scenarios:

1) Placed on Metal surface (RF GND Plane) 2) Free space 3) Placed on metal surface (Floating unconnected copper) Metal (RF GND) 2.4 2.5 GHz Free space Metal (Floating) Peak gain Average gain Average efficiency Maximum return loss Maximum VSWR 5.20dBi

-3.00dBi

>50%

<-8.0dB 2.30:1 2.60dBi

-2.50dBi

>60%

<-9.3dB 2.00:1 3.30dBi

-3.00dBi

>50%

<-8.0dB 2.30:1 Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 3 7. RF Performance 7.1 Return Loss Zenon Part No. SR4W030 7.2 VSWR Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 4 7.3 Antenna Pattern Free Space 7.3.1 2400 MHz 2500 MHz Zenon Part No. SR4W030 3D pattern at 2450MHz Drag to rotate pattern and PCB by using Adobe Reader

(Click to Activate) Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 5 8. Antenna Dimensions 8.1 Dimensions Antenna section Zenon Part No. SR4W030 2 Holes = 1mm (diameter) L Length W Width T Thickness 23.0 0.2 (mm) 16.0 0.2 (mm) 1.6 (mm) nominal All dimensions in mm 8.2 Dimensions assembled SR4W030-100 SR4W030-150 L L 111 2.0 (mm) 161 2.0 (mm) Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 6 Zenon Part No. SR4W030 8.3 IPEX Connector I-PEX Material Plating Copper Alloy Ag 8.4 O-Ring Spacer d1 d2 1.02 0.1 1.78 0.08 All dimensions in mm Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 7 Zenon Part No. SR4W030 Antenna Section 8.4 Assembly 1.13mm Cable I-PEX Connector O-ring Cable Spacers Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 8 Zenon Part No. SR4W030 9. Electrical Interface 9.1 Host Interface The host PCB requires the mating connector which is the IPEX MHF (UFL) receptacle. The location should be close to the chip/modules pin for the RF. Any feed from this receptacle should be maintained at 50 impedance. 9.2 Transmission Line All transmission lines should be designed to have a characteristic impedance of 50. The length of the transmission lines should be kept to a minimum Any other parts of the RF system like transceivers, power amplifiers, etc, should also be designed to have an impedance of 50 . Once the material for the PCB has been chosen (PCB thickness and dielectric constant), a coplanar transmission line can easily be designed using any of the commercial software packages for transmission line design. For the chosen PCB thickness, copper thickness and substrate dielectric constant, the program will calculate the appropriate transmission line width and gaps on either side of the feed. A DC blocking capacitor should be placed in line to protect the RF front end. 10. Mechanical Adhesion The antenna uses 3M 468MP adhesive on the reverse side of the antenna section. It is designed for a one time fix to a clean smooth surface. Antenna section reverse side Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 9 Zenon Part No. SR4W030 11.0 Antenna Integration Guide 11.1 Applied Surface Material The antenna can be placed on any material and will radiate effectively in the direction away from the material. The performance will vary depending on the type of material or surface applied. This antenna is intended for use internal to a device and this simply illustrates the versatility of the antenna. The material behind the antenna is not critical and can enable proximity for devices that are thin and placed on a variety of surfaces. Examples:

Wall mounted devices. Mounting onto metal chassis (e.g. Light switch chassis) Direct to host PCB Devices installed in places where the material is not defined or could be any of the above. Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 10 Zenon Part No. SR4W030 11.2 Placement For placing the antenna within a device, the host PCB size is not a factor as it is with PCB mounted antennas. Placement still needs to follow some basic rules, as any antenna is sensitive to its environment. The top side of the antenna must be clear of all obstructions that are electrically conductive. The location within a device will should ideally be along any outer edge. The height to any surface can be direct contact. If placed on to a PCB, the proximity to any other board mounted component should be kept a minimum distance away. This distance can be defined from projecting a 5 angle from the bottom of the antenna as shown below. Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 11 11.3 Cable Routing The cable has 3 spacers to keep the clearance from any surface being in direct contact. Where d is defined by the O-ring (d=1.78mm). Zenon Part No. SR4W030 Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 12 Zenon Part No. SR4W030 11.3 Evaluation Kit The Reflector antenna EVK is available. This contains antenna samples and an evaluation PCB with 3 sections that can demonstrate the various placement options. REFLECTOR-EVB-1 Evaluation Board Dimensions: 110 x 50 (mm) To order a reference board contact sales@antenova-m2m.com. Please state if a single antenna or two antenna EVB is required. Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 13 Zenon Part No. SR4W030 12. Hazardous Material Regulation Conformance The antenna has been tested to conform to RoHS requirements. A certificate of conformance is available from Antenova M2Ms website. 13. Packaging The antennas are stored in individual plastic (PE) bags. Then stored within a second bag of 100pcs. Single antenna per bag 100 units per second bag (Labelled) 13.1 Optimal Storage Conditions Temperature

-10C to 40C Humidity Shelf life Storage place Packaging Less than 75% RH 18 Months Away from corrosive gas and direct sunlight Antennas should be stored in unopened sealed manufacturers plastic packaging. Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 Page 14 13.2 Label Information Zenon Part No. SR4W030 Antenova Limited 60.00mm Antenova Asia Ltd 4F, No 324, Sec 1, Nei-Hu Road Nei-Hu District, Taipei 11493, Taiwan, ROC info@antenova-m2m.com / www.antenova-m2m.com Description: Zenon Part number: SR4W030-xxx Quantity: 200 Date Code: YYWW Manufacturers code number: REFLECTOR 90.00m m Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 released June 2017 Page 15 Zenon Part No. SR4W030 www.antenova-m2m.com Corporate Headquarters North America Headquarters Asia Headquarters Antenova Limited 2nd Floor Titan Court 3 Bishop Square Hatfield AL10 9NA UK Antenova Limited 100 Brush Creek Road Suite 103 Santa Rosa California 95404 USA Antenova Asia Limited 4F, No. 324, Sec. 1, Nei-Hu Road Nei-Hu District Taipei 11493 Taiwan, ROC Tel: +44 1223 810600 Email: sales@antenova-m2m.com Tel: +1 707 890 5202 Email: sales@antenova-m2m.com Tel: +886 (0) 2 8797 8630 Fax: +886 (0) 2 8797 6890 Email: sales@antenova-m2m.com Copyright Antenova Ltd. All Rights Reserved. Antenova , Antenova M2M , gigaNOVA the Antenova product family names and the Antenova and Antenova M2M logos are trademarks and/or registered trademarks of Antenova Ltd. Any other names and/or trademarks belong to their respective companies. The materials provided herein are believed to be reliable and correct at the time of printing. Antenova does not warrant the accuracy or completeness of the information, text, graphics or other items contained within this information. Antenova further assumes no responsibility for the use of this information, and all such information shall be entirely at the users risk. Antennas for Wireless M2M Applications Product Specification SR4W030-PS-1.0 released June 2017 Page 16 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Antenova:

REFLECTOR-EVB-1 SR4W030-100 SR4W030-150

Agent letter Date: 30/09/2022 Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Rd. Columbia MD 21046 FCC ID: RFD-CR50 To whom it may concern:

We, Leica Geosystems AG Heinrich-Wild-Strasse CH-9435 Heerbrugg Switzerland hereby authorize, DEKRA Testing and Certification S.A.U. Parque Tecnoldgico de Andalucia C/Severo Ochoa, 2 & 6 | 29590 | Malaga | Spain Agent: Alvaro Corrales sedefio e-mail: alvaro.corrales@dekra.com Phone: +34 952 619 198 to act as our agent in the preparation of this application for equipment certification, including the signing of all documents relating to these matters. We also hereby certify that neither we nor any party to this application are subject to a denial o U.S. Federal benefits, which include FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, U.S.C. 862 because of conviction for possession or distribution of controlled substance. For instances where our authorized agent signs the application for certification on our behalf, |

acknowledge that all responsibility for complying with the terms and conditions for Certification, as specified by DEKRA Testing and Certification, S.A.U., still resides with us. This agreement expires one year from ecurrent ate. Sincerely, Hanne Juen

: Director Global Quality Engin ering Telephone: +41 79 866 50 18 e-mail: hannes.juen@hexagon.com Geosystems

Confidentiality request Date: 30/09/2022 Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Rd. Columbia MD 21046 FCC ID: RFD-CRSO To whom it may concern:

We, Leica Geosystems AG Heinrich-Wild-Strasse CH-9435 Heerbrugg Switzerland hereby request requests that a part of the subject FCC application be held confidential to avoid release of sensitive information of the product to the public pursuant to 0.457(d)(1}{ii) and 0.459 of the Commissions Rules (47 C.F.R.) and 552 (b)(4) of the Freedom of Information Act, For the product stated above, we request that the following information be withheld from public disclose:

Type of Confidentiality Requested

[_] Short Term

[_] Short Term

[_] Short Term

[_] Short Term

[_] Short Term Short Term

[X] Short Term

[X] Short Term Short Term

[X] Permanent Permanent

[X] Permanent L] Permanent L] Permanent Permanent Confidentiality:

Exhibit Block Diagrams Operation Description Schematics Parts List & Placement/BOM Tune-Up Procedure Test Setup Photos Users Manual External Photos Internal Photos The above materials contain trade secrets and proprietary information not customaril released to the public. The public disclosure of these matters might be harmful to us and provide unjustified benefits to our competitors. Geosystems Short-Term Confidentiality:

We hereby request short-term confidentiality for the product stated above to avoid premature release of sensitive information prior to marketing or release of the product to the public. Release date of short term confidentiality is:

45 days from grant date marked CL]

90 days from grant date marked C]

135 days from grant date marked = [_]

4 180 days from grant date marked [xX]

Specific date:

We are also aware that we are responsible to notify DEKRA Testing and Certification S.A.U. in the event information regarding the product or the product is made available to the public. DEKRA Testing and Certification S.A.U. will then release the documents listed above for public disclosure pursua t to FCC ublic Notice DA 04-1705. Sincerely, Hann s Juen

: Director Global Quality Engi ering Telephone: +41 79 866 50 18 e-mail: hannes.juen@hexagon.com Geosystems

- when Suppliers Declaration of Conformity (SDoC) Date: 30/09/2022 Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Rd. Columbia MD 21046 FCC iD: RFD-CRSO To whom it may concern:

We, Leica Geosystems AG Heinrich-Wild-Strasse CH-9435 Heerbrugg Switzerland pursuant to 15.101 of the Commissions Rules (47 C.F.R.), hereby dec are that the device above mentioned is classified under the following equipment class/classes:

x] Part 15 Class B Digital Device Part 15 Class A Digital Device Other Non-Digital SDoC Devices Part 15 Class B Computing Device Peripheral Part 15 Class B Computing Device/Personal Computer Communications Revr for use w/ licensed Tx and CBs Superregenerative Receiver Communications Receiver used w/Pt 15 Transmitter Part 15 TV Interface Device and we will follow the Suppliers Declaration of Conformity authorization procedure prio to the initiation of marketing.

: Director oa ual Telephone: +4179 email: hannes.juen@hexagon.co Geosystems Hannes J en Gl b1Q Ity Enginee ng

Qualcomm Technologies, Inc. QCA9377-7 Dual-band 1x1 802.11ac +

Bluetooth 5.0 Device Specification (Non-NDA/QDN) 80-YK433-1 Rev. A November 20, 2018 All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners. This technical data may be subject to U.S. and international export, re-export, or transfer (export) laws. Diversion contrary to U.S. and international law is strictly prohibited. Qualcomm Technologies, Inc. 5775 Morehouse Drive San Diego, CA 92121 U.S.A. 2018 Qualcomm Technologies, Inc. and/or its subsidiaries. All rights reserved. Revision history Revision Date Description A November 2018 Initial release 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 2 Contents 1 Introduction .............................................................................................................................. 5 1.1 Documentation overview ............................................................................................................................ 5 1.2 QCA9377 device description ..................................................................................................................... 5 1.3 Product features......................................................................................................................................... 6 1.4 Terms and acronyms ................................................................................................................................. 7 1.5 Special marks............................................................................................................................................. 8 2 Pin definitions .......................................................................................................................... 9 2.1 I/O parameter definitions .......................................................................................................................... 13 3 Electrical characteristics ....................................................................................................... 18 3.1 Absolute maximum ratings ....................................................................................................................... 18 3.2 Recommended operating conditions ........................................................................................................ 18 3.3 Power sequencing .................................................................................................................................... 19 3.4 Digital logic characteristics ....................................................................................................................... 19 4 Mechanical information ......................................................................................................... 21 4.1 Device physical dimensions ..................................................................................................................... 21 4.2 WLNSP part marking ............................................................................................................................... 22 4.3 Device ordering information ...................................................................................................................... 23 4.4 Device moisture-sensitivity level .............................................................................................................. 23 4.5 Thermal characteristics ............................................................................................................................ 24 5 Carrier, storage, and handling information ......................................................................... 25 5.1 Tape and reel information ......................................................................................................................... 25 5.2 Storage .................................................................................................................................................... 26 5.2.1 Bagged storage conditions ..................................................................................................... 26 5.2.2 Out-of-bag duration ................................................................................................................. 26 5.3 Handling ................................................................................................................................................... 26 5.3.1 Baking..................................................................................................................................... 26 5.3.2 Electrostatic discharge............................................................................................................ 26 5.4 Barcode label and packing for shipment ................................................................................................... 26 6 PCB mounting guidelines ..................................................................................................... 27 6.1 RoHS compliance..................................................................................................................................... 27 6.2 SMT parameters ...................................................................................................................................... 27 6.3 Daisy-chain components .......................................................................................................................... 27 7 Part reliability ......................................................................................................................... 28 7.1 Reliability qualifications summary ............................................................................................................. 28 7.2 Qualification sample description .............................................................................................................. 29 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 3 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Contents Figures Figure 1-1 QCA9377-7 functional block diagram ........................................................................................................... 6 Figure 2-1 QCA9377 pin assignments (top view) ........................................................................................................... 9 Figure 4-1 QCA9377 mechanical dimensions, top and bottom views .......................................................................... 21 Figure 4-2 QCA9377 package mechanical dimensions height and seating plane ....................................................... 21 Figure 4-3 Package marking layout (QCA9377-7) ....................................................................................................... 22 Figure 4-4 Device identification code ........................................................................................................................... 23 Figure 5-1 Carrier tape drawing with part orientation ................................................................................................... 25 Figure 5-2 Tape handling ............................................................................................................................................. 25 Tables Table 1-1 Terms and acronyms ..................................................................................................................................... 7 Table 1-2 Special marks ................................................................................................................................................ 8 Table 2-1 QCA9377-7 IC pin assignments in numeric order and corresponding location............................................... 9 Table 2-2 Signal name/type abbreviations ................................................................................................................... 13 Table 2-3 Pin descriptions (QCA9377-7) ...................................................................................................................... 13 Table 3-1 Absolute maximum ratings ........................................................................................................................... 18 Table 3-2 Recommended operating conditions ............................................................................................................ 18 Table 3-3 General DC electrical characteristics (for VDDIO=3.3 V I/O operation) ........................................................ 19 Table 4-1 Package marking identifiers ......................................................................................................................... 22 Table 4-2 Device types and configuration codes .......................................................................................................... 23 Table 4-3 Device ordering code by chip variant ........................................................................................................... 23 Table 4-4 MSL rating summary .................................................................................................................................... 24 Table 4-5 Device thermal resistance ............................................................................................................................ 24 Table 7-1 Silicon reliability results ................................................................................................................................ 28 Table 7-2 Package reliability results ............................................................................................................................. 28 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 4 1 Introduction 1.1 Documentation overview This document contains the technical information for QCA9377-3 and is organized as follows:

Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter 6 Chapter 7 Gives a high-level, functional description of the device; lists the device features; and defines marking conventions, terms, and acronyms used throughout this document. Defines the device pin assignments. Defines the device electrical characteristics, including absolute maximum ratings and recommended operating conditions. Provides integrated circuit (IC) mechanical information, including dimensions, markings, ordering information, moisture sensitivity, and thermal characteristics. Describes carrier, storage and handling information. Presents procedures and specifications for mounting. Presents reliability data, including a definition of the qualification samples and a summary of qualification test results. 1.2 QCA9377 device description The QCA9377-7 is a single-die wireless local area network (WLAN) and Bluetooth combination solution to support 1 1 IEEE 802.11a/b/g/n/ac WLAN standards and Bluetooth 5.0 + HS, enabling seamless integration of WLAN/Bluetooth and low-energy technology. 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 5 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Introduction Figure 1-1 QCA9377-7 functional block diagram 1.3 Product features QCA9377-7: Supports low-power USB 2.0 interfaces for WLAN and a USB 1.1 interface for Bluetooth Provides a highly integrated WLAN system-on-chip (SoC) for 5 GHz 802.11ac, or 2.4 GHz/5 GHz 802.11n WLAN applications Supports Bluetooth 5.0, Qualcomm Bluetooth Low Energy, and ANT+ and backward compatibility with Bluetooth 1.x and Bluetooth 2.x + Enhanced Data Rate Supports a single-ended radio frequency (RF) port for cleaner and lower cost design Supports 20 MHz/40 MHz at 2.4 GHz and supports 20 MHz, 40 MHz, or 80 MHz at 5 GHz Supports multiuser multiple-input multiple-output (MIMO) Supports Bluetooth-WLAN coexistence and internal stacked module-LTE (ISM-LTE) coexistence Operates on one 3.3 V power supply and an I/O supply of 1.8 V or 3.3 V. Both WLAN and Bluetooth power management use advanced power-saving techniques, such as:

Gating clocks to idle or inactive blocks Voltage scaling to specific blocks in certain states Fast start and settling circuits to reduce Tx 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 6 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Introduction Active duty cycles Processor frequency scaling Other techniques to optimize power consumption across all operating states Includes additional features, such as:

Low-density parity check (LDPC) 1.5 kB of on-chip, one-time programmable (OTP) memory to eliminate the need for an external flash and to further reduce the external component count and bill of materials (BOM) cost Provides a 48 MHz reference clock Supports Bluetooth for class 1 and class 2 power-level transmissions without requiring an external PA Available in a low-profile 4.34 mm 5.48 mm WLNSP package with 0.4 mm pitch Uses an internal power amplifier (PA) and an internal low-noise amplifier (LNA) to support the datasheet specifications. Can support an external PA and an external LNA with central logic. 1.4 Terms and acronyms Table 1-1 Terms and acronyms Term Definition Analog-to-digital converter Average failure rate Qualcomm Bluetooth Low Energy Bill of materials Bluetooth Charged device model Complementary metal-oxide semiconductor Clear to send Digital-to-analog converter Electrostatic discharge General-purpose input/output Human body movement Integrated circuit Inter-integrated circuit Input/output Internal stacked module Low-density parity check Low-noise amplifier Local oscillator Long-term evolution Multiple-input multiple-output Moisture resistance test ADC AFR BLE BOM BT CDM CMOS CTS DAC ESD GPIO HBM IC I2C I/O ISM LDPC LNA LO LTE MIMO MRT 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 7 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Introduction Term Definition MSL MTTF OTP PA PCIe PLL PMU QTI RF RH RoHS RTS RxD SDIO SMT SoC SPI TPC Tx TxD UART USB VCO Vdd WLAN WLNSP Moisture-sensitivity level (for PCBs) Mean time to failure One-time programmable Power amplifier Personal computer interface express Phase locked loop Performance monitoring unit Qualcomm Technologies, Inc. Radio frequency Relative humidity Restriction of Hazardous Substances Request to send Receive diversity Secure digital input/output Surface mount technology System-on-chip Serial peripheral interface Temperature compensation circuit Transmit Transmit diversity Universal asynchronous receiver/transmitter Universal serial bus Voltage-controlled oscillator Handset supply voltage Wireless local area network Wafer-level nanoscale package 1.5 Special marks Table 1-2 Special marks Mark

Definition Brackets ([ ]) sometimes follow a pin, register, or bit name. These brackets enclose a range of numbers. For example, SDC1_DATA[7:4] indicates a range that is 4 bits in length. DATA[7:0]

refers to all eight DATA pins. _L A suffix of _L indicates an active low signal. For example, RESIN_L. 0x00000 Hexadecimal numbers are identified with an x in the number (for example, 0x0000). All numbers are decimal (base 10), unless otherwise specified. Nonobvious binary numbers have the term binary enclosed in parentheses at the end of the number. For example, 0011 (binary). 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 8 2 Pin definitions The QCA9377 device is available in the 115-pin wafer-level nanoscale package (WLNSP) that includes several ground pins for electrical grounding, mechanical strength, and thermal continuity. See Chapter 4 package details. Figure 2-1 shows a high-level view of the pin assignments. Figure 2-1 QCA9377 pin assignments (top view) Table 2-1 QCA9377-7 IC pin assignments in numeric order and corresponding location Ball pad number Ball pad name QCA9377-7 Ball pad center

(x-coordinate)

(mm) Ball pad center

(y-coordinate)

(mm) Pad size diameter

(mm) 1 2 3 VBUCK_GND_PM VDD33_PM GND_USB2 1.981 1.981 1.981

-2.264

-1.698

-1.132 0.25 0.25 0.25 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 9 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Pin definitions Ball pad number Ball pad name QCA9377-7 Ball pad center

(x-coordinate)

(mm) Ball pad center

(y-coordinate)

(mm) Pad size diameter

(mm) 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 DM0 VDDIO_USB2 GPIO(25) VDDIO_GPIO1 GND_XTAL XTALO VBUCK33_PM VDDIO_AO_PM WL_EN DP0 VDD11A_USB2 GPIO(27) GPIO(28) CLK_OUT VDDIO_XTAL XTALI PWM_PM VDD11D DM_USB_BT DP_USB_BT LTE_UART_RXD VDD11D VDD11_WL_SYNTH GND_WL_SYNTH VDD11_PM VSS_PM GPIO(29) GND_IO_GPIO1 GPIO(31) GPIO(32) VDD33_WL_SYNTH VDD11A_PM VDD11AO_PM VDD11D GNDD VDD11_WL_VCO GPIO(5) BT_EN GPIO(30) GPIO(26) 1.981 1.981 1.981 1.981 1.981 1.981 1.698 1.698 1.698 1.698 1.698 1.698 1.698 1.698 1.698 1.698 1.415 1.415 1.415 1.415 1.415 1.415 1.415 1.415 1.132 1.132 1.132 1.132 1.132 1.132 1.132 0.849 0.849 0.849 0.849 0.849 0.566 0.566 0.566 0.566

-0.566 0 0.566 1.132 1.698 2.264

-2.547

-1.981

-1.415

-0.849

-0.283 0.283 0.849 1.415 1.981 2.547

-2.264

-1.132

-0.566 0 0.566 1.132 1.698 2.264

-2.547

-1.981

-0.283 0.283 0.849 1.415 2.547

-2.264

-1.698

-1.132 0 1.698

-2.547

-1.981

-1.415

-0.283 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 10 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Pin definitions Ball pad number Ball pad name QCA9377-7 Ball pad center

(x-coordinate)

(mm) Ball pad center

(y-coordinate)

(mm) Pad size diameter

(mm) 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 XPABIAS_2 XPABIAS_3 VDD33_BB GPIO(6) GPIO(11) GNDD GND_TPC VDD33_WL_5GPADRV VDD33_WL_5GPA GPIO(7) GPIO(9) 3D_FRAME_SYNC XPABIAS_1 VDD11_WL_BB GND_WL_5GPA2 WL_RFIO_5G GPIO(8) GPIO(19) GNDD GNDD LTE_UART_TXD VDD11_WL_ADDAC GND_WL_BB GND_WL_5GPA1 WL_xPA_5G GPIO(0) VDDIO_SDIO VDD11D XPABIAS_0 VDD11_WL_LO VDD11_WL_LNA GND_WL_5GLNA VDD11_PCIE CLK_REQ_IN GND_WL_ADDAC WL_RFIN_2G_AUX NC GND_SDIO GPIO(10) VDD11D 0.566 0.566 0.566 0.283 0.283 0.283 0.283 0.283 0.283 0 0 0 0 0 0 0

-0.283

-0.283

-0.283

-0.283

-0.283

-0.283

-0.283

-0.283

-0.283

-0.566

-0.566

-0.566

-0.566

-0.566

-0.566

-0.566

-0.849

-0.849

-0.849

-0.849

-1.132

-1.132

-1.132

-1.132 0.283 0.849 1.415

-2.264

-1.132

-0.566 1.132 1.698 2.264

-2.547

-1.981

-0.283 0.283 0.849 1.981 2.547

-2.264

-1.698

-1.132

-0.566 0 0.566 1.132 1.698 2.264

-2.547

-1.981

-0.849 0.283 1.415 1.981 2.547

-2.264

-1.698 0.566 2.264

-2.547

-1.981

-1.415

-0.849 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 11 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Pin definitions Ball pad number Ball pad name QCA9377-7 Ball pad center

(x-coordinate)

(mm) Ball pad center

(y-coordinate)

(mm) Pad size diameter

(mm) 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 WLAN_RFKILL_L FEM_CTRL0 GND_ISO WL_RF_PDET_IN GND_WL_2GPA2 GND_WL_BT_2GLNA NC GND_PCIE GPIO(35) GPIO(24) GND_BT_RFPLL VDD11_BT_PLL VDD11_WL_2GPA NC NC PCIE_RESET_L_PAD VDDIO_GPIO2 GPIO(18) VDD11_BT_SYNTH GND_BT_BB FEM_CTRL1 VDD33_WL_2GPA WL_BT_RFIO_2G NC NC LF_CLK_IN GND_IO_GPIO2 GND_BT_LO VDD11_BT_ADDAC VDD11_BT_BB VDD33_BT_PA GND_BT_PA

-1.132

-1.132

-1.132

-1.132

-1.132

-1.132

-1.415

-1.415

-1.415

-1.415

-1.415

-1.415

-1.415

-1.698

-1.698

-1.698

-1.698

-1.698

-1.698

-1.698

-1.698

-1.698

-1.698

-1.981

-1.981

-1.981

-1.981

-1.981

-1.981

-1.981

-1.981

-1.981

-0.283 0.283 0.849 1.415 1.981 2.547

-2.264

-1.698

-1.132

-0.566 0 0.566 1.698

-2.547

-1.981

-1.415

-0.849

-0.283 0.283 0.849 1.415 1.981 2.547

-2.264

-1.698

-1.132

-0.566 0 0.566 1.132 1.698 2.264 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 12 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Pin definitions 2.1 I/O parameter definitions This section contains a package pinout and a listing of the signal descriptions. Table 2-2 Signal name/type abbreviations Symbol Pad attribute AI AO B DI DO OD GND NC P Description Analog input (does not include pad circuitry) Analog output (does not include pad circuitry) Bidirectional digital with complementary metal-oxide semiconductor (CMOS) input Digital input (CMOS) Digital output signal A digital output signal with open drain Ground No connection should be made to this pin Voltage supply Pad pull details for digital I/Os PU PD Input signals with weak internal pull-up, to prevent signals from floating when left open Input signals with weak internal pull-down, to prevent signals from floating when left open Table 2-3 Pin descriptions (QCA9377-7) Pin QCA9377-7 VDDIO or pad voltage I/O Description BT USB 1.1 interface 22 23 DM_USB_BT DP_USB_BT GPIO and NC VDDIO_USB2 AI,AO QCA9377-5/-7: Bluetooth USB 1.1 VDDIO_USB2 AI,AO differential pair 32 GPIO[31]

VDDIO_GPIO1 DI 33 GPIO[32]

VDDIO_GPIO1 DO 42 GPIO[30]

VDDIO_GPIO1 DI 30 GPIO[29]

VDDIO_GPIO1 DO 93 6 15 16 43 GPIO[24]

GPIO[25]

GPIO[27]

GPIO[28]

GPIO[26]

Clock signals 109 LF_CLK_IN 48 GPIO[11]

VDDIO_GPIO2 VDDIO_GPIO1 VDDIO_GPIO1 VDDIO_GPIO1 VDDIO_GPIO1 VDDIO_GPIO2 VDDIO_GPIO1 OD OD B PD DO PD DO QCA9377-3: UART clear to send (CTS) signal QCA9377-3: UART request to send (RTS) signal QCA9377-3: UART receive diversity (RxD) signal QCA9377-3: UART transmit diversity (TXD) signal Bluetooth wakeup host. Active high Bluetooth PCM_IN signal Bluetooth PCM_SYNC signal Bluetooth PCM_CLK signal Bluetooth PCM_OUT signal External low-power 32.768 kHz clock input Clock request output 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 13 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Pin definitions Pin QCA9377-7 VDDIO or pad voltage 77 CLK_REQ_IN VDDIO_AO I/O PD Description Clock request input:

If chip is powered up, and CLK_REQ_IN is asserted (high), the chip can supply the crystal clock to the external chip. If only CLK_REQ_IN is asserted, and WLAN_EN or BT_EN is not enabled, the chip remains in a HOST_OFF state, to expect low power 18 9 19 8 VDDIO_XTAL 1.8 V or 3.3 V XTALO XTALI GND_XTAL 1.1 V 1.1 V P Voltage supply for crystal External crystal output External crystal input GND Ground to VDDIO_XTAL GPIO and NC 54 GPIO[9]

VDDIO_SDIO OD 69 GPIO[0]

VDDIO_SDIO DI 60 GPIO[8]

VDDIO_SDIO 53 GPIO[7]

VDDIO_SDIO 47 GPIO[6]

VDDIO_SDIO B B B 40 GPIO[5]

VDDIO_SDIO B 82 GPIO[10]

VDDIO_SDIO DO GPIO[9]

This pin can be configured to serial peripheral interface/inter-integrated circuit

(SPI/I2C) bus interface:

SPI_SI/I2C_SDA, open drain QCA9377-3: SDIO clock signal GPIO[0]

QCA9377-3: SDIO CMD line signal GPIO[8]

QCA9377-3: SDIO data bus D0 GPIO[7]

QCA9377-3: SDIO data bus D1 GPIO[6]

This pin is a bootstrap signal. It must keep high for normal operation during power-on reset. QCA9377-3: SDIO data bus D2 GPIO[5]

QCA9377-3: SDIO data bus D3 GPIO[10]

This pin can be configured for I2C bus interface. I2C_SO QCA9377-3: SDIO interrupt signal 70 81 99 VDDIO_SDIO GND_SDIO 1.8 V or 3.3 V P Voltage supply for SDIO GND Ground for VDDIO_SDIO PCIE_RESET_L_PAD VDDIO_GPIO2 PD 101 GPIO[18]

VDDIO_GPIO2 OD 61 GPIO[19]

VDDIO_AO OD QCA9377-5: PCIe reset with weak pull-down QCA9377-5: Request to service a function-initiated wake event. An external pull-up resistor to VDDIO_GPIO2 is required QCA9377-5: Reference to clock request. An external pull-up resistor to VDDIO_AO is required 98 108 NC NC 1.1 V 1.1 V AI AI QCA9377-5: Differential reference clock

(100 MHz) 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 14 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Pin definitions Pin 97 107 80 90 76 91 QCA9377-7 VDDIO or pad voltage NC NC NC NC GND GND_PCIE 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V I/O AI AI AO AO P Description QCA9377-5: Differential receive QCA9377-5: Differential transmit Voltage supply for PCIe GND QCA9377-5: Ground for VDD11_PCIE WLAN USB 2.0 interface 4 13 DM0 DP0 VDDIO_USB2 AI,AO QCA9377-7: WLAN USB 2.0 Differential VDDIO_USB2 AI,AO pair Coexistence and control signals 84 WLAN_RFKILL_L VDDIO_GPIO2 PU 92 GPIO(35) VDDIO_GPIO2 OD 24 LTE_UART_RXD VDDIO_GPIO1 PU 55 3D_FRAME_SYNC VDDIO_GPIO1 PD 64 LTE_UART_TXD VDDIO_GPIO1 DO Turn off WLAN RF analog and front end. Active low This signal can be used to enable external wireless charging of a universal asynchronous receiver/transmitter (UART) circuit LTE coexistence signal. LTE_UART_RXD or LTE_FS Frame sync signal from TV to sync with 3D glass through Bluetooth LTE coexistence signal. LTE_UART_TXD or LTE_PRI 12 WL_EN 41 BT_EN RF chain 59 WL_RFIO_5G 68 WL_xPA_5G 79 WL_RFIN_2G_AUX 87 WL_RF_PDET_IN 106 WL_BT_RFIO_2G RF front-end control 85 FEM_CTRL0 104 FEM_CTRL1 72 XPABIAS_0 56 XPABIAS_1 VDDIO_AO VDDIO_AO PD PD WLAN enable. Active high Bluetooth enable. Active high RF RF RF RF RF 3.3 V 3.3 V 3.3 V 3.3 V AI,AO WLAN 5 GHz RF I/O port. Note: If an external PA is used, this pin can be configured for RF input only. AO 5 GHz PA output, if external PA is used AI AI WLAN 2.4 GHz Rx port for 2G-only option WLAN Tx power detector input (2.4 GHz and 5 GHz) AI,AO WLAN 2.4 GHz and Bluetooth RF I/O port DO DO AO AO Programmable by switch table, normally, if external LNA is used Programmable by switch table, normally, if external LNA is used XPABIAS_0: PA enable for optional external PA XPABIAS_1: PA enable for optional external PA 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 15 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Pin definitions Pin QCA9377-7 VDDIO or pad voltage 44 XPABIAS_2 45 XPABIAS_3 SWREG: 3.3 V to 1.1 V 28 35 VDD11_PM VDD11A_PM 3.3 V 3.3 V 1.1 V 1.1 V I/O AO AO P P Description XPABIAS_2: PA enable for optional 2 external PA XPABIAS_3: PA enable for optional external PA 1.1 V voltage feedback to SWREG PMU Analog 1.1 V power supply output. This pin is connected from the SWREG_FB and gated from internal sleep control logic. The analog 1.1 V can be turned off during the sleep mode for lowest power consumption 10 1 29 20 VBUCK33_PM 3.3 V P SWREG voltage input VBUCK_GND_PM VSS_PM PWM_PM GND Ground for internal 1.1 V regulator GND Ground for internal 1.1 V regulator SWREG performance monitoring unit (PMU) output PMU: VDDIO PMU 11 VDDIO_AO_PM 1.8 V or 3.3 V P 36 VDD11AO_PM 1.1 V P Always-on I/O supply for power management and real-time clock. This supply must be present if any other supply is present 1.1 V power output from AOREG PMU to supply internal always-on logics. Individual power supply PMU: OTPREG25 2 VDD33_PM 3.3 V P 3.3 V input voltage for 2.5 V OTP regulator Individual power supply 46 VDD33_BB 114 105 52 51 34 5 VDD33_BT_PA VDD33_WL_2GPA VDD33_WL_5GPA VDD33_WL_5GPADRV VDD33_WL_SYNTH VDDIO_USB2 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 7 VDDIO_GPIO1 100 112 113 VDDIO_GPIO2 VDD11_BT_ADDAC VDD11_BT_BB 95 VDD11_BT_PLL 102 VDD11_BT_SYNTH 96 65 VDD11_WL_2GPA VDD11_WL_ADDAC 1.8 V or 3.3 V 1.8 V or 3.3 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V P P P P P P P P P P P P P P P 3.3 V supply for internal analog baseband 3.3 V supply for Bluetooth PA 3.3 V supply for internal 2 GHz PA 3.3 V supply for internal 5 GHz PA 3.3 V supply for internal 5 GHz PA drive 3.3 V supply for internal synthesizer 3.3 V supply for USB, shared by Bluetooth/WLAN USB Voltage supply Voltage supply 1.1 V supply for Bluetooth ADC and DAC 1.1 V supply for Bluetooth baseband 1.1 V supply for Bluetooth phase locked loop (PLL) 1.1 V supply for Bluetooth synthesizer 1.1 V supply for 2 GHz PA 1.1 V supply for WLAN analog-to-digital converter (ADC) and digital-to-analog (DAC) 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 16 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Pin definitions Pin QCA9377-7 VDDIO or pad voltage I/O Description 57 74 73 26 39 14 21 25 37 71 83 VDD11_WL_BB VDD11_WL_LNA VDD11_WL_LO VDD11_WL_SYNTH VDD11_WL_VCO VDD11A_USB2 VDD11D VDD11D VDD11D VDD11D VDD11D 103 GND_BT_BB 111 GND_BT_LO 115 GND_BT_PA 94 31 GND_BT_RFPLL GND_IO_GPIO1 110 GND_IO_GPIO2 86 50 3 88 75 67 58 78 66 89 27 38 49 62 63 GND_ISO GND_TPC GND_USB2 GND_WL_2GPA2 GND_WL_5GLNA GND_WL_5GPA1 GND_WL_5GPA2 GND_WL_ADDAC GND_WL_BB GND_WL_BT_2GLNA GND_WL_SYNTH GNDD GNDD GNDD GNDD 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V P P P P P P P P P P P 1.1 V supply for WLAN baseband 1.1 V supply for LNA 1.1 V supply for local oscillator (LO) 1.1 V supply for WLAN synthesizer 1.1 V supply for WLAN voltage-controlled oscillator (VCO) 1.1 V supply for analog USB 1.1 V supply for digital 1.1 V supply for digital 1.1 V supply for digital 1.1 V supply for digital 1.1 V supply for digital GND Ground for VDD11_BT_BB GND Ground for VDD11_BT_SYNTH GND Ground for VDD33_BT_PA GND Ground for WLAN PLL GND Ground for VDDIO_GPIO1 GND Ground for VDDIO_GPIO2 GND Ground. Requires a GND via on this pin GND Ground for temperature compensation circuit (TPC) GND Ground for VDD11A_USB2 GND Ground for VDD33_WL_2GPA GND Ground for VDD33_WL_LNA GND Ground for VDD33_WL_5GPA GND Ground for VDD33_WL_5GPA GND Ground for VDD11_WL_ADDAC GND Ground for VDD11_WL_BB GND Ground for VDD11_WL_LNA GND Ground for VDD11_WL_SYNTH GND Ground for 1.1 V digital logic GND Ground for 1.1 V digital logic GND Ground for 1.1 V digital logic GND Ground for 1.1 V digital logic 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 17 3 Electrical characteristics 3.1 Absolute maximum ratings Table 3-1 summarizes the absolute maximum ratings, and Table 3-2 lists the recommended operating conditions for the QCA9377. Absolute maximum ratings are those values beyond which damage to the device can occur. Functional operation under these conditions, or at any other condition beyond those indicated in the operational sections of this document, is not recommended. NOTE: The maximum rating for signals follows the supply domain of the signals. Table 3-1 Absolute maximum ratings Symbol Parameter VBUCK33_PM SWREG supply input VDD11_PM 1.1 V voltage VDDIO_ VDD33_ VDD11_ VDD11D RFIN TSTORE ESD Voltage supply 3.3 V supply 1.1 V supply 1.1 V supply for digital Maximum RF input (reference to 50 input) Storage temperature Min.

-0.3

-0.3

-0.3

-0.3

-0.3

-0.3

-45 Max. 3.65 1.32 4.0 4.0 1.32 1.32

+10

-45 to 135 Electrostatic discharge tolerance 2000 3.3 V I/O VIH MAX Maximum digital I/O input voltage for 3.3 V I/O supply 1.8 V I/O VIH MAX Maximum digital I/O input voltage for 1.8 V I/O VDD + 0.3 VDD + 0.2 supply VIH MIN Minimum digital I/O input voltage for 1.8 V or 3.3 V I/O supply

-0.3 Unit V V V V V V dBm C V V V V 3.2 Recommended operating conditions Table 3-2 Recommended operating conditions Symbol Parameter Min. Typ. Max. Unit VDD33_ 3.3 V supply VBUCK33_PM 1.1 V switcher supply from internal 1.1 V PMU 3.135 3.135 3.3 3.3 3.465 3.465 VDD11_PM 1.1 V voltage from internal 1.1 V PMU 1.045 1.1 1.155 V V V 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 18 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Electrical characteristics Symbol Parameter VDDIO_ Voltage supply VDD11_ VDD11D TOP TCASE PsiJT 1.1 V supply from internal 1.1 V PMU 1.1 V supply for digital from internal 1.1 V PMU For QCA9377-7 device variant Case temperature Junction to the top center of the package thermal resistance Min. 1.71 1.045 1.045

-40 0 Typ. 1.8 or 3.3 1.1 1.1 Max. Unit 3.46 1.155 1.155 85 115 0.5 V V V C C C/W 3.3 Power sequencing The QCA9377 device requires the following powerup sequence:

1. VDDIO_AO_PM and VDDIO_XTAL are tied to first I/O rail available. 2. VDDIO_SDIO/GPIO1/GPIO2 (1.8 V or 3.3 V). 3. All 3.3. 4. V rails. To power down the device, the following sequence is required:

1. All 3.3 V rails. 2. VDDIO_SDIO/GPIO1/GPIO2 (1.8 V or 3.3 V). 3. VDDIO_AO_. 4. PM and VDDIO_XTAL. NOTE: The following can be tied together:

VDDIO_SDIO, VDDIO_GPIO1, and VDDIO_GPIO2 VDDIO_AO_PM VDDIO_XTAL, and VDDIO_SDIO, VDDIO_GPIO1, and VDDIO_GPIO2 NOTE: For a timing diagram, see QCA9377 Design Guidelines/Training Slides. 3.4 Digital logic characteristics Table 3-3 General DC electrical characteristics (for VDDIO=3.3 V I/O operation) Symbol Parameter Comments Min. Typ. Max. Unit VIH High-level input voltage VIL Low-level input voltage VSHYS Schmitt hysteresis 0.7x VDDIO

-0.3 1.8 V IO: 375 3.3 V IO: 645 VDDIO +

0.3 0.3 x VDDIO V V mV 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 19 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Electrical characteristics Symbol Parameter Comments IIL Input low leakage current VIN = 0 V Supply = VIO max Min.

-5.0 Typ. Max. 5.0 Unit A RPULL Input pull resistor Up or down 1.8 V IO: 120 3.3 V IO: 70 k VOH High-level output voltage VOL Low-level output voltage IOH IOL CIN High-level output current Low-level output current Input capacitance 0.9 x VDDIO 0 3 VDDIO 0.1 x VDDIO

-11 3 V V mA mA pF 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 20 4 Mechanical information 4.1 Device physical dimensions The QCA9377 device is available in the 4.34 mm 5.48 mm 0.57 mm, 115-pin package that includes dedicated ground pins for improved grounding, mechanical strength, and thermal continuity. Pin A1 is located by an indicator mark on the top of the package and by the ball pattern when viewed from below. Figure 4-1 shows the QCA9377 device mechanical dimensions, top and bottom views. Figure 4-1 QCA9377 mechanical dimensions, top and bottom views Figure 4-2 QCA9377 package mechanical dimensions height and seating plane 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 21 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Mechanical information 4.2 WLNSP part marking This device can be ordered using the identification code shown in Section 4.3. Figure 4-3 Package marking layout (QCA9377-7) Table 4-1 Package marking identifiers Line Marking Description 1 2 3 Q Qualcomm name or logo QCA9377 Qualcomm Technologies, Inc., product name 7VV Configuration code + feature code Additional line Blank 4 5 XXXXXXXX XXXXXXXX = Wafer lot number FAYWWRR F = Source of supply code for wafer fab locations F = N: Fabrication = UMC A = Source of supply code for assembly site code A = Y: Fabrication = Amkor, Taiwan A = K: Fabrication = SPIL, Taiwan Y = single/last-digit of year WW = Two-digit work week of current year RR = product revision 6

Two-digit wafer number 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 22 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Mechanical information 4.3 Device ordering information Figure 4-4 Device identification code Table 4-2 Device types and configuration codes Device type Sample type Product configuration code (P) QCA9377-7 ES1 7 ES2 CS Product revision (RR) Hardware version Comments 00 02 03 v1.0.0 v1.0.2 v1.1 Wi-Fi, USB, Bluetooth, USB Table 4-3 lists the device identification codes by hardware version and chip variant. Table 4-3 Device ordering code by chip variant Chip variant Hardware version Device identification code QCA9377-7 V1.1 QCA-9377-7-115WLNSP-TR-03-0 QCA-9377-7-115WLNSP-SR-03-0 QCA-9377-7-115WLNSP-HR-03-0 The P and RR values are more completely defined in Section 4.2. 4.4 Device moisture-sensitivity level Plastic-encapsulated surface mount packages are susceptible to damage induced by absorbed moisture and high temperature. The moisture-sensitivity level (MSL) of a package indicates its ability to withstand exposure after the package is removed from its shipment bag, while it is on the factory floor awaiting PCB installation. A low MSL rating is better than a high rating. A low MSL device can be exposed on the factory floor longer than a high MSL device. 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 23 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Mechanical information Table 4-4 MSL rating summary MSL Out-of-bag floor life Comments 1 Unlimited 30C/85% relative humidity (RH);

QCA9377 rating 2 2a 3 4 5 5a 6 1 year 4 weeks 168 hours 72 hours 48 hours 24 hours Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label. 30C/60% RH 30C/60% RH 30C/60% RH 30C/60% RH 30C/60% RH 30C/60% RH 30C/60% RH Qualcomm Technologies, Inc. (QTI) follows the latest IPC/JEDEC J-STD-020 standard revision for moisture-sensitivity qualification. The QCA9377 devices are classified as MSL1. The qualification temperature is 250C. This qualification temperature (250C) should not be confused with the peak temperature within the recommended solder reflow profile. During device qualification, QTI follows the latest revision IPC/JEDEC J-STD-020 standard to determine the MSL of the IC. Devices that qualify as MSL1 are deemed not moisture sensitive. All other devices MSL2 through MSL6 are deemed to be moisture sensitive. Moisture sensitive devices are dry-baked and dry-packed in accordance with IPC/JEDEC JSTD-033. To ensure proper surface mount technology (SMT) assembly, procedures must follow the MSL and maximum reflow temperature specified on the shipping bag labels or barcode labels accompanying all QCA9377 IC shipments. 4.5 Thermal characteristics Table 4-5 Device thermal resistance Parameter Parameter description Comments Typ. Unit JA

* Junction-to-ambient thermal resistance (JAa) is calculated with ambient temperature = 70. Junction-to-ambient (still air)*

Thermal resistance, J-to-A 26.0 CW 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 24 5 Carrier, storage, and handling information 5.1 Tape and reel information All QTI carrier tape systems conform to EIA-481 standards. A simplified sketch of the QCA9377-7 tape carrier is shown in Figure 5-1, including the proper part orientation, maximum number of devices per reel, and key dimensions. Figure 5-1 Carrier tape drawing with part orientation Figure 5-2 Tape handling 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 25 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Carrier, storage, and handling information 5.2 Storage 5.2.1 Bagged storage conditions QCA9377 devices delivered in tape and reel carriers must be stored in sealed, moisture barrier, antistatic bags. See IC Products Packing Method (80-VK055-1) for the expected shelf life. 5.2.2 Out-of-bag duration The out-of-bag duration is the time a device can be on the factory floor before being installed onto a PCB. It is defined by the device MSL rating, as described in Section 4.4. 5.3 Handling Tape handling is described in Section 5.1. Other (IC-specific) handling guidelines are presented in the following subsections. 5.3.1 Baking Wafer-level packages, including this device, should not be baked. 5.3.2 Electrostatic discharge Electrostatic discharge (ESD) occurs naturally in laboratory and factory environments. An established high-voltage potential is always at risk of discharging to a lower potential. CAUTION: If this discharge path is through a semiconductor device, destructive damage could result. ESD countermeasures and handling methods must be developed and used to control the factory environment at each manufacturing site. QTI products must be handled according to the ESD Association standard: ANSI/ESD S20.20-1999, Protection of Electrical and Electronic Parts, Assemblies, and Equipment. See Chapter 7 for the QCA 9377-7 ESD ratings. 5.4 Barcode label and packing for shipment See IC Products Packing Method (80-VK055-1) for all packing-related information, including barcode label details. 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 26 6 PCB mounting guidelines 6.1 RoHS compliance The device is lead-free and Restriction of Hazardous Substances (RoHS)-compliant. Its SnAgCu solder balls use SAC405 composition. 6.2 SMT parameters For recommendations on SMT process development, see SMT Assembly Guidelines

(SM80-P0982-1). NOTE: Click the following link to download SMT Assembly Guidelines (SM80-P0982-1) from the CreatePoint website. https://createpoint.qti.qualcomm.com/search/contentdocument/stream/dcn/SM80-P0982-1 After successfully logging in, the document is downloaded. NOTE: Make this document a favorite to be notified of any changes. For more details on using CreatePoint, see Qualcomm CreatePoint User Guide (80-NC193-2). 6.3 Daisy-chain components Daisy-chain packages use the same processes and materials as actual products. The daisy-chain interconnect drawing shows how packages should be attached to a characterization PCB. All SMT development described in Section 6.2 can be performed using daisy-chain packages. A bias can be applied, and solder-joint resistance can be monitored. NOTE: Click the following link to download Daisy Chain Interconnect, 115 WLNSP, 4.345.48mm, Superset (DS90-Y8108-1) from the Qualcomm CreatePoint support website. https://createpoint.qti.qualcomm.com/search/contentdocument/stream/0901003981cc8934 After successfully logging on, the document is downloaded. NOTE: Make this document a favorite to be notified of any changes. 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 27 7 Part reliability 7.1 Reliability qualifications summary Table 7-1 Silicon reliability results Tests, standards, and conditions Sample size Result Average failure rate (AFR) in FIT () failure in billion device-hours HTOL: JESD22-A108-A Use condition: Temperature: 65C, core voltage: 1.2 V Total samples from three different wafer lots Mean time to failure (MTTF) t = 1/ in million hours Total samples from three different wafer lots ESD Human-body movement (HBM) rating JESD22-A114-F Total samples from one wafer lot ESD Charged device model (CDM) rating JESD22-C101-D Total samples from one wafer lot Latch-up (I-test): EIA/JESD78A Trigger current: 100 mA; temperature: 85C Total samples from one wafer lot Latch-up (Vsupply overvoltage): EIA/JESD78A Trigger voltage: Each VDD pin, stress at 1.5 Vdd max per device specification; temperature: 85C Total samples from one wafer lot Table 7-2 Package reliability results 3x77 0F/231 AFR=25 FITs 3x77 1x3 1x3 1x6 1x6 40.4 Pass 2000 V, all pins Pass 400 V, all pins Pass Pass Tests, standards, and conditions SPIL ATT Result Moisture resistance test (MRT): MSL1;

J-STD-020/JESD22-A113-F Reflow at 260C +0/-5C, Total samples from three different assembly lots Temperature cycle: JESD22-A104-D Temperature: -55C to 125C; number of cycles: 1000 Soak time at minimum/maximum temperature: 8 to 10 minutes Cycle rate: 2 cycles per hour Preconditioning: JESD22-A113-F MSL1, reflow temperature: 260C +0/-5C Total samples from three different assembly lots 3x231 3x231 Both pass 3x77 3x77 Both pass 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 28 QCA9377-7 Dual-band 1x1 802.11ac + Bluetooth 5.0 Device Specification (Non-NDA/QDN) Part reliability Tests, standards, and conditions SPIL ATT Result Unbiased highly accelerated stress test: JESD22-A118 130C/85% RH and 96 hours duration Preconditioning: JESD22-A113-F MSL1, reflow temperature: 260C +0/-5C Total samples from three different assembly lots Biased highly accelerated stress test: JESD22-A110 110C/85% RH and 264 hours duration Preconditioning: JESD22-A113-F MSL1, reflow temperature: 260C +0/-5C Total samples from three different assembly lots High-temperature storage life: JESD22-A103-C Temperature 150C, 500, 1000 hours Total samples from three different assembly lots Physical dimensions: JESD22-B100-A Case outline drawing: Qualcomm internal document Total samples from one assembly lot at each SAT Solder ball shear JESD22-B117 After 10X reflow cycles; 260C +0/-5C 3x77 3x77 Both pass 3x77 3x77 Both pass 3x77 3x77 Both pass 1x15 1x15 Both pass 1x15 1x15 Both pass 7.2 Qualification sample description Device number: QCA9377 Package type: WLP 115B Package body size: 4.32 mm 5.46 mm 0.566 mm Fab process: 40 nm LP CMOS Fab location: UMC Taiwan Assembly location: SPIL & ATT 80-YK433-1 Rev. A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 29