User Guide for the LTD-BK1110 Product: LTE_WCDMA Wireless Modem Model name: LTD-BK1110 Table of Contents 1. Overview 2. Major features 3. Interface 4. Electrical specifications 5. RF specifications 6. Mechanical specifications 7. General specifications 8. Connectors 9. RFx information 10. Approbation FCC Copyright . 2017. All Rights Reserved. 1. Overview The LTD-BK1110 is a personal mobile communication device that incorporates the latest compact radio technology, including smaller and lighter components and support for WCDMA(850/1900MHz) bands and LTE(700/850/1700/1900/2700 MHz). This device acts as the vehicles telematics system and connects to WCDMA (HSPA+) and LTE wireless networks and wireless modules to allow voice and data communication. Furthermore, this device can operate on land and water as well as other similar areas. In LTE mode, the device provides uplink speeds of up to 50 Mbps and downlink speeds of up to 150 Mbps for seamless transfer of data such as movies and video calls. The device also supports the transfer of large amounts of data. The device communicates with the host system via a standard RS-232 or USB port, and AT commands and control commands can be used to send data. Voice calls are also possible. Copyright . 2017. All Rights Reserved. 2. Major features Dimensions 34 x 40 x 3.5 mm (L x W x T)
(Tolerance width, length : TBD) Weight TBD g (max) Mechanical Interface USB, general purpose I/O pins Temperature*
Operation: -20 - +70 Storage: -40 - +85 Main chipset MDM9628 Memory 4Gb(NAND) / 1Gb(SDRAM) WCDMA (HSPA+) Technology Standard LTE
- DL Speed : 14.4 Mbps
- UL Speed : 5.76 Mbps
- DL Speed : 150 Mbps
- UL Speed : 50 Mbps Band Power WCDMA B2, B5 LTE B2, B4, B5, B12(17), B7 WCDMA : Typ. 24dBm (Power Class 3) LTE : Typ. 23dBm (Power Class 3) DC power 4 V ETC Functions Voice, data, SMS Copyright . 2017. All Rights Reserved. 3. Interface 3.1 LGA Pad Layout (Top View) Figure 1. LGA Pin map Copyright . 2017. All Rights Reserved. 3. Interface 3.2 Pin description PAD. NAME DIRECTION DESCRIPTION Antenna Interface Pads MAIN_ANT DIV_ANT GNSS_ANT C21 AC21 AE17 User Interface Pads H6 I5 H4 G3 F20 Z20 I7 AD4 F6 E5 L6 N6 ACC_PWR_ON BOOT_OK MSG**
168H_END**
MAIN_ANT_DTC_EN*,**
DIV_ANT_DTC_EN**
SPI_LEVEL_SHIFT_EN*
ETHERNET_DCDC_ENABLE**
GPIO1*
GPIO2*
GPIO3**
GPIO4**
ADC Interface Pads ADC1 E19 AA19 ADC2 PCM Interface Pads W3 X2 W1 Y3 Y1 PCM_EN**
PCM_CLK*,**
PCM_SYNC PCM_DIN PCM_DOUT**
JTAG Pin Description AC7 AD8 AD6 AE7 AB6 AB8 AE9 MDM_JTAG_TMS MDM_JTAG_PS_HOLD MDM_JTAG_TDI MDM_JTAG_TRST_N MDM_JTAG_TDO MDM_JTAG_TCK MDM_JTAG_SRST_N USB Interface Pads N2 M1 K1 L2 USB_HS_DM USB_HS_DP USB_VBUS USB_ID SDIO Interface Pads Input/Output Input Input RF Main Antenna RF Diversity Antenna GNSS Antenna Input Output Output Output Output Output Output Output Output Input/Output ACC_PWR_ON BOOT_OK MSG Remote standby mode end Main ANT Detect Enable Diversity ANT Detect Enable SPI LEVEL SHIFT Enable Ethernet power enable General purpose I/O General purpose I/O General purpose I/O General purpose I/O Input Input Output Input Input Input Output Input input Input Input Output Input Input ADC Convertor input for main antenna detect ADC Convertor input for diversity antenna detect PCM 3.3 Level Shifter Enable PCM Clock PCM Frame Sync PCM Data In PCM Data Out JTAG mode select input JTAG PS HOLD detect JTAG data input JTAG reset for debug JTAG debugging JTAG clock input JTAG reset Input/Output Input/Output Input Input USB high speed data (minus) USB high speed data (plus) USB power USB ID Table 1. Pin descriptions Copyright . 2017. All Rights Reserved. 3. Interface S1 Q1 T2 R2 S3 Q3 SDC_CLK SDC_CMD SDC_DATA0**
SDC_DATA1**
SDC_DATA2 SDC_DATA3 SGMMI Interface Pads AA11 AE11 AB10 AD10 X10 W11 Z10 Y11 AC11 EPHY_RST_N or UIM2_RESET EPHY_INT_N or UIM2_DETECT SGMII_DATA or UIM2_CLK GND SGMII_RX_P SGMII_RX_M SGMII_TX_M SGMII_TX_P SGMII_CLK or UIM2_DATA**
SPI Interface Pads S5 T6 R6 U5 Q5 SPI_MOSI SPI_CLK**
SPI_CS_N SPI_MISO SPI_INTERRUPT UART Interface Pads M5 N4 K5 L4 O5 P4 UART2_TX UART2_RX UART1_TX**
UART1_RX UART3_TX**
UART3_RX USIM Interface Pads I3 H2 E1 G1 F2 E3 D2 A1 C1 B2 UIM1_PRESENT UIM1_CLK**
UIM1_RESET**
UIM1_DATA**
VREG_L6_UIM1 GND GND GND GND GND HSIC Pin Description AB2 AC1 AD2 AE1 HSIC_DATA HSIC_STB NC NC DSRC Pin Description Output Output Input/Output Input/Output Input/Output Input/Output Output Input Input/Output Input Input Output Output Input/Output Output Output Output Input Input Output Input Output Input Output Input Input Output Output Input/Output Output Input/Output Input/Output Secure digital controller clock Secure digital controller command Secure digital controller data bit 0 Secure digital controller data bit 1 Secure digital controller data bit 2 Secure digital controller data bit 3 Ethernet PHY reset or UIM2 reset Ethernet PHY interrupt or UIM2 DETECT SGMII input Output data or UIM2_CLK Ground SGMII receive - plus SGMII receive -minus SGMII transmit - plus SGMII transmit -minus SGMII clock or UIM2_DATA SPI Serial Output SPI Serial Clock SPI Chip Select SPI Serial input MICOM LGA SPI interrupt UART2 Transmit data UART2 Receive data Debug UART5 Transmit Data Debug UART5 Receive Data UART6 Transmit data UART6 Receive data Detection of an external UIM card Clock Output to an external UIM card Reset Output to an external UIM card Data connection with an external UIM card Supply Output for an external UIM card Ground Ground Ground Ground Ground HSIC data HSIC Strobe signal No Connect No Connect Table 1. Pin descriptions Copyright . 2017. All Rights Reserved. 3. Interface COEX_UART_RX*
COEX_UART_TX**
RFCLK2_QCA Y7 Z6 X4 AA3 WLAN_EN_DSRC X6 Y5 Z4 X8 Z8 DSRC_SLP_CLK WLAN_3V_EN_DSRC DSRC_PPS**
MDM2AP_INT_N**
AP2MDM_INT_N Input Output Output Output Output Output Input/Output Output Input LTE receiver sync for coexistence with UART LTE transmitter sync for coexistence with UART Low noise RF clock Output WLAN DSRC Enable DSRC sleep clock Used for WLAN enable Pulse Per Second MDM to AP interrupt AP to MDM interrupt Control Pin Description A3 B4 C3 LGA_PHONE_ON_N MDM_RESOUT_N LGA_RESIN_N Power Supply Pin Description A17 B16 A15 B14 A9 B8 A7 C7 VPH_PWR for PAM VPH_PWR for PAM VPH_PWR for PAM VPH_PWR for PAM VPH_PWR for PMIC VPH_PWR for PMIC VPH_PWR for PMIC VPH_PWR for PMIC Voltage Reference Pin Description Input Output Input Input Input Input Input Input Input Input Input ON/OFF Control Reset Output External Reset Input power supply (4.0V) power supply (4.0V) power supply (4.0V) power supply (4.0V) power supply (4.0V) power supply (4.0V) power supply (4.0V) power supply (4.0V) C9 D8 AE3 NC Pads G9 B12 I9 G7 C5 D4 GND Pads A21 E21 G21 I21 K21 M21 O21 Q21 S21 U21 VREG_L11_1P8 VREG_L11_1P8 Output Output LDO out for 1.8V pull up LDO out for 1.8V pull up Voltage Reference for SGMII
(VREG_L5_UIM2) Ethernet IO level Output Ethernet I/O voltage NC NC NC NC NC NC GND GND GND GND GND GND GND GND GND GND No Connect No Connect No Connect No Connect No Connect No Connect Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions Copyright . 2017. All Rights Reserved. 3. Interface W21 Y21 AA21 AE21 B20 D20 H20 J20 L20 N20 P20 R20 T20 V20 X20 AB20 AD20 A19 C19 G19 I19 K19 M19 O19 Q19 S19 U19 W19 Y19 AC19 AE19 B18 D18 F18 H18 J18 L18 N18 P18 R18 T18 V18 X18 Z18 AB18 AD18 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions Copyright . 2017. All Rights Reserved. 3. Interface C17 E17 G17 I17 K17 M17 O17 Q17 S17 U17 W17 Y17 AA17 AC17 D16 F16 H16 J16 L16 N16 P16 R16 T16 V16 X16 Z16 AB16 AD16 C15 E15 G15 I15 W15 Y15 AA15 AC15 AE15 D14 F14 H14 X14 Z14 AB14 AD14 A13 C13 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions Copyright . 2017. All Rights Reserved. 3. Interface E13 G13 I13 W13 Y13 AA13 AC13 AE13 D12 F12 H12 X12 Z12 AB12 AD12 A11 C11 E11 G11 I11 B10 D10 F10 H10 E9 W9 Y9 AA9 AC9 F8 H8 E7 W7 AA7 B6 D6 J6 P6 V6 A5 W5 AA5 AC5 AE5 F4 J4 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions Copyright . 2017. All Rights Reserved. 3. Interface GND R4 GND T4 GND V4 GND AB4 GND K3 GND M3 GND O3 GND U3 GND AC3 GND J2 GND P2 GND V2 GND Z2 GND I1 GND O1 GND U1 GND AA1 GND GND1 GND GND2 GND GND3 GND GND4 GND GND5 GND GND6 GND GND7 GND GND8 GND9 GND GND10 GND GND11 GND GND12 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND N14 P14 R14 M13 O13 Q13 S13 N12 P12 R12 M11 O11 Q11 S11 N10 P10 R10 M9 O9 Q9 S9 N8 P8 R8 G5 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions Copyright . 2017. All Rights Reserved. 3. Interface 3.3 USB This device supports universal serial bus (USB) connections for high-speed data communication. The relevant hardware satisfies the USB 2.0 specifications and supports maximum communications speeds of 480 Mbps Pin NO. Signal Name Pin I/O
(Modem host) Function Description M1 N2 K1 USB_D+
USB_D-
USB_VBUS IO IO I USB Differential data line (+) USB Differential data line (-) USB Power Supply Table 2. USB Pin descriptions Copyright . 2017. All Rights Reserved. 3. Interface 3.4 Audio This module includes a PCM interface. The pull-up and pull-down resistors attached to these pin must provide more than 50 Kohm of resistance. Pin NO. Signal Name Pin I/O
(Modem host) Function Description W1 X2 Y1 Y3 PCM_SYNC PCM_CLK PCM_TXD PCM_RXD 3.5 User interface I I O I PCM Interface sync PCM Interface clock PCM Interface digital audio data out PCM Interface digital audio data in Table 3. PCM Pin descriptions Pin No. Signal Name Direction Function I5 BOOT_OK O Indicates that the Modem boot is complete. C3 RESET_IN H4 MSG G3 168H_END H6 ACC_ON_SLEEP A3 Phone_ON I O O I I Control line to unconditionally restart the module. Indicates that the Modem receive Urgent message. Indicates that the 168hr sleep mode is end. Control line to power on or 168hr sleep mode. Control line to power on / off Table 4. User interface Pin descriptions Copyright . 2017. All Rights Reserved. 4. Electrical specifications 4.1 Power supply specifications The host system provides the power supply (V_BATT)DC 4 V, 2.5 A to the device. The internal power supply module manages the power supplied to the integral circuits and maintains constant voltages. This module also controls each power block to minimize power consumption. In particular, the PAM (power amplifier module) consumes a lot of power, so it receives a direct power supply of 4 V from the V_BATT. Therefore the V_BATT signal inputs only the supply power of the PAM, even when the absolute rating is higher. In addition, the entire power input module blocks and protects against high surges and ESD in the NAD module. Pin No. Signal Name Direction MIN TYP MAX A7,C7,B8,A9, B14,A15,B16, VPH_PWR
(for PAM / for A17 PMIC I 3.9 V 4 V 4.1 V Table 5. Power supply specifications Copyright . 2017. All Rights Reserved. 4. Electrical specifications 4.2 Logic level specifications 4.2.1 Digital logic level specifications Signal Name Type BOOT_OK RESET_IN MSG 168H_END ACC_ON_SLEEP O I O O I Low High Min 0
-0.3 0 0 0 Max 0.45 0.63 0.45 0.45 0.63 Min 1.35 1.17 1.35 1.35 1.17 Max 1.8 1.8 1.8 1.8 1.8 Unit V Table 6. Digital logic level specifications Copyright . 2017. All Rights Reserved. 5. RF specifications 5.1 WCDMA 5.1.1 Receiver
.- Bandwidth : 5MHz
.- Frequency : 869MHz 894MHz (B5), 1930MHz 1990MHz (B2)
.- RF to Baseband Direct conversion (Zero IF)
.- Modulation method : QPSK, 16QAM
.- Sensitivity : -104dBm (BER = Under 0.1%) 5.1.2 Transmitter
.- Frequency: 824MHz 849MHz (B5), 1850MHz 1910MHz (B2)
.- Maximum RF Output : Power class3 , 20.3dBm ~ 25.7dBm
.- Modulation method : QPSK
.- Baseband to RF Direct conversion (Zero IF) 5.2 LTE 5.2.1 Receiver
.- Bandwidth :
B2/B4/B7 (5 MHz, 10 MHz, 15 MHz, 20 MHz), B5/B12&B17 (5 MHz, 10 MHz).
- Frequency :
B2 (1930 MHz 1990 MHz), B4 (2110 MHz 2155 MHz), B5 (869 MHz 894 MHz), B7(2620 MHz 2690 MHz) B12&B17 (729 MHz 746 MHz)
.- RF to Baseband Direct conversion (Zero IF)
.- Modulation method : QPSK, 16QAM and 64QAM
.- Sensitivity :
B2 (-94.3dBm @QPSK, BW:10 MHz), B4 (-96.3dBm @QPSK, BW:10 MHz), B5 (-94.3dBm @QPSK, BW:10 MHz), B7 (-94.3dBm @QPSK, BW:10 MHz), B12&B17 (-93.3dBm @QPSK, BW:10 MHz) Copyright . 2017. All Rights Reserved. 5. RF specifications 5.2.2 Transmitter
.- Frequency:
B2 (1850 MHz 1910 MHz), B4 (1710 MHz 1755 MHz), B5 (824 MHz 849 MHz), B7 (2500 MHz 2570 MHz), B12&B17(699 MHz 716 MHz)
.- Maximum RF Output : Power class3 , 20.3dBm ~ 25.7dBm
.- Modulation method : QPSK and 16QAM
.- Baseband to RF Direct conversion (Zero IF) Copyright . 2017. All Rights Reserved. 6. Mechanical specifications 6.1 Environment specifications
.- Storage temp.: -40 - +85
.- Operating temp.: -20 - +70
(-20 - +70 : 3GPP specifications are satisfied
-30 - -20 , +70 - +80 : May cause performance degradation)
.- Operating humidity: 80% (60) relative humidity Copyright . 2017. All Rights Reserved. 6. Mechanical specifications 6.1 Mechanical dimensions Dimensions 34 x 40.0 x 3.5 mm (L x W x T)
(Tolerance width, length : TBD) Weight TBD grams(max.) Table 7. Mechanical specification Figure 2. Mechanical dimension Copyright . 2017. All Rights Reserved. 7. General specifications 7.1 WCDMA B5 electrical specifications TEST ITEM Spec. Test Temperature Test Freq uency CHANNEL 4357 4400 4458 1 2 3 4 5 6 7 8 9 10 11 12 Maximum Output Power 20.3~25.7dBm Frequency Error
-195 ~ +195Hz Inner Loop Power Control in the Uplin k PASS Minimum Output Power
-49dBm Occupied Bandwidth (OBW) 5MHz Normal, Temp L, Te Low, Mid, mp H High Normal, Temp L, Te Low, Mid, mp H Normal High Mid Normal, Temp L, Te Low, Mid, mp H Normal High Low, Mid, High PASS PASS PASS PASS PASS PASS
-
PASS
-
PASS PASS PASS PASS PASS PASS SEM Band1 Offset2. 5-3.5MHz (at Freq+3. 5MHz) SEM Band1 Offset3. 5-7.5MHz (at Freq+7. 5MHz) SEM Band1 Offset7. 5-8.5MHz (at Freq+8. 5MHz)
-48.5dBc PASS PASS PASS
-37.5dBc PASS PASS PASS Normal Low, Mid, High
-47.5dBc PASS PASS PASS SEM Band1 Offset8. 5-12.5MHz
-47.5dBc PASS PASS PASS ACLR Offset +5/-5M Hz Rel
-32.2dBc Normal, Temp L, Te Low, Mid, mp H High PASS PASS PASS ACLR Offset +10/-10 MHz Rel
-42.2dBc Normal, Temp L, Te Low, Mid, mp H High PASS PASS PASS Spectrum emis sion mask Adjacent Chan nel Leakage Po wer Ratio (ACL R) Error Vector M agnitude(EVM) EVM at Tx output po wer 24dBm /-18dBm 17.5%
Normal Peak code do main error PCDE at Tx output p ower 24dBm/-18dBm
-14dB Normal Low, Mid, High Low, Mid, High PASS PASS PASS PASS PASS PASS Phase Discontinuity max EVM 17.5%
Phase Disconti nuity Phase Discontinuity max Frequency Error
-195~195Hz Normal Mid Phase Discontinuity max 1500Hz 36 degrees
-
PASS
-
-
PASS PASS
-
-
-
Reference Sen sitivity Level Maximum Inpu t Level Ref Sense Go/No Go I^or=-104dBm/3.84M Hz Max Input Go/No Go I^or=-25.7dBm/3.84M Hz BER 0.1%
Normal, Temp L, Te Low, Mid, mp H High PASS PASS PASS BER 0.1%
Normal Mid
-
PASS
-
Table 8. WCDMA B5 RF specification Copyright . 2017. All Rights Reserved. 7. General specifications 7.2 WCDMA B2 electrical specifications TEST ITEM Spec. Test Temperature Test Freq uency CHANNEL 9662 9800 9938 1 2 3 4 5 6 7 8 9 10 11 12 Maximum Output Power 20.3~25.7dBm Frequency Error
-195 ~ +195Hz Inner Loop Power Control in the Uplin k PASS Minimum Output Power
-49dBm Occupied Bandwidth (OBW) 5MHz Normal, Temp L, Te Low, Mid, mp H High Normal, Temp L, Te Low, Mid, mp H Normal High Mid Normal, Temp L, Te Low, Mid, mp H Normal High Low, Mid, High PASS PASS PASS PASS PASS PASS
-
PASS
-
PASS PASS PASS PASS PASS PASS SEM Band1 Offset2. 5-3.5MHz (at Freq+3. 5MHz) SEM Band1 Offset3. 5-7.5MHz (at Freq+7. 5MHz) SEM Band1 Offset7. 5-8.5MHz (at Freq+8. 5MHz)
-48.5dBc PASS PASS PASS
-37.5dBc PASS PASS PASS Normal Low, Mid, High
-47.5dBc PASS PASS PASS SEM Band1 Offset8. 5-12.5MHz
-47.5dBc PASS PASS PASS ACLR Offset +5/-5M Hz Rel
-32.2dBc Normal, Temp L, Te Low, Mid, mp H High PASS PASS PASS ACLR Offset +10/-10 MHz Rel
-42.2dBc Normal, Temp L, Te Low, Mid, mp H High PASS PASS PASS Spectrum emis sion mask Adjacent Chan nel Leakage Po wer Ratio (ACL R) Error Vector M agnitude(EVM) EVM at Tx output po wer 24dBm /-18dBm 17.5%
Normal Peak code do main error PCDE at Tx output p ower 24dBm/-18dBm
-14dB Normal Low, Mid, High Low, Mid, High PASS PASS PASS PASS PASS PASS Phase Discontinuity max EVM 17.5%
Phase Disconti nuity Phase Discontinuity max Frequency Error
-195~195Hz Normal Mid Phase Discontinuity max 1500Hz 36 degrees
-
PASS
-
-
PASS PASS
-
-
-
Reference Sen sitivity Level Maximum Inpu t Level Ref Sense Go/No Go I^or=-104dBm/3.84M Hz Max Input Go/No Go I^or=-25.7dBm/3.84M Hz BER 0.1%
Normal, Temp L, Te Low, Mid, mp H High PASS PASS PASS BER 0.1%
Normal Mid
-
PASS
-
Table 9. WCDMA B2 RF specification Copyright . 2017. All Rights Reserved. 7. General specifications 7.3 LTE B2 electrical specifications Spec. Test Temperature Frequency TX Channel 18650 18900 19150 1 2 3 4 5 6 7 8 9 10 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Minimum Output Power
-39dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Frequency Error 0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Error Vector Magnitude(EVM) 12.5%(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS Relative Carrier Leakage Power Carrier Leakage
(3.2dBm 3.2dB) In-band emission In-band emission
(3.2dBm 3.2dB)
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Spectrum emission mask Spectrum Emission Mask upper/lower Area 1
-16.5 dBm Spectrum Emission Mask upper/lower Area 2
-8.5 dBm Spectrum Emission Mask upper/lower Area 3
-11.5 dBm Spectrum Emission Mask upper/lower Area 4
-23.5 dBm Normal Low, Mid, High PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS ACLR E-UTRA
-29.2dB PASS PASS PASS Adjacent Channel Leakage Power Ratio ACLR UTRA Offset 1
-32.2dB Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 2
-35.2dB PASS PASS PASS Reference Sensitivity Ref Sense throughput Level @ 10MHz shall be 95%
-94.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 10. LTE B2 RF specification Copyright . 2017. All Rights Reserved. 7. General specifications 7.4 LTE B4 electrical specifications Spec. Test Temperature Frequency TX Channel 20000 20175 20350 1 2 3 4 5 6 7 8 9 10 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Minimum Output Power
-39dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Frequency Error 0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Error Vector Magnitude(EVM) 12.5%(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS Relative Carrier Leakage Power Carrier Leakage
(3.2dBm 3.2dB) In-band emission In-band emission
(3.2dBm 3.2dB)
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Spectrum emission mask Spectrum Emission Mask upper/lower Area 1
-16.5 dBm Spectrum Emission Mask upper/lower Area 2
-8.5 dBm Spectrum Emission Mask upper/lower Area 3
-11.5 dBm Spectrum Emission Mask upper/lower Area 4
-23.5 dBm Normal Low, Mid, High PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS ACLR E-UTRA
-29.2dB PASS PASS PASS Adjacent Channel Leakage Power Ratio ACLR UTRA Offset 1
-32.2dB Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 2
-35.2dB PASS PASS PASS Reference Sensitivity Ref Sense throughput Level @ 10MHz shall be 95%
-96.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 11. LTE B4 RF specification Copyright . 2017. All Rights Reserved. 7. General specifications 7.5 LTE B5 electrical specifications Spec. Test Temperature Frequency TX Channel 20450 20525 20600 1 2 3 4 5 6 7 8 9 10 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Minimum Output Power
-39dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Frequency Error 0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Error Vector Magnitude(EVM) 12.5%(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS Relative Carrier Leakage Power Carrier Leakage
(3.2dBm 3.2dB) In-band emission In-band emission
(3.2dBm 3.2dB)
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Spectrum emission mask Spectrum Emission Mask upper/lower Area 1
-16.5 dBm Spectrum Emission Mask upper/lower Area 2
-8.5 dBm Spectrum Emission Mask upper/lower Area 3
-11.5 dBm Spectrum Emission Mask upper/lower Area 4
-23.5 dBm Normal Low, Mid, High PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS ACLR E-UTRA
-29.2dB PASS PASS PASS Adjacent Channel Leakage Power Ratio ACLR UTRA Offset 1
-32.2dB Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 2
-35.2dB PASS PASS PASS Reference Sensitivity Ref Sense throughput Level @ 10MHz shall be 95%
-94.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 12. LTE B5 RF specification Copyright . 2017. All Rights Reserved. 7. General specifications 7.6 LTE B7 electrical specifications Spec. Test Temperature Frequency TX Channel 23780 23790 23800 1 2 3 4 5 6 7 8 9 10 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Minimum Output Power
-39dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Frequency Error 0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Error Vector Magnitude(EVM) 12.5%(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS Relative Carrier Leakage Power Carrier Leakage
(3.2dBm 3.2dB) In-band emission In-band emission
(3.2dBm 3.2dB)
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Spectrum emission mask Spectrum Emission Mask upper/lower Area 1
-16.5 dBm Spectrum Emission Mask upper/lower Area 2
-8.5 dBm Spectrum Emission Mask upper/lower Area 3
-11.5 dBm Spectrum Emission Mask upper/lower Area 4
-23.5 dBm Normal Low, Mid, High PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS ACLR E-UTRA
-29.2dB PASS PASS PASS Adjacent Channel Leakage Power Ratio ACLR UTRA Offset 1
-32.2dB Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 2
-35.2dB PASS PASS PASS Reference Sensitivity Ref Sense throughput Level @ 10MHz shall be 95%
-93.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 13. LTE B7 RF specification Copyright . 2017. All Rights Reserved. 7. General specifications 7.7 LTE B12/17 electrical specifications Spec. Test Temperature Frequency TX Channel 23780 23790 23800 1 2 3 4 5 6 7 8 9 10 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Minimum Output Power
-39dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Frequency Error 0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Error Vector Magnitude(EVM) 12.5%(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS Relative Carrier Leakage Power Carrier Leakage
(3.2dBm 3.2dB) In-band emission In-band emission
(3.2dBm 3.2dB)
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Spectrum emission mask Spectrum Emission Mask upper/lower Area 1
-16.5 dBm Spectrum Emission Mask upper/lower Area 2
-8.5 dBm Spectrum Emission Mask upper/lower Area 3
-11.5 dBm Spectrum Emission Mask upper/lower Area 4
-23.5 dBm Normal Low, Mid, High PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS ACLR E-UTRA
-29.2dB PASS PASS PASS Adjacent Channel Leakage Power Ratio ACLR UTRA Offset 1
-32.2dB Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 2
-35.2dB PASS PASS PASS Reference Sensitivity Ref Sense throughput Level @ 10MHz shall be 95%
-93.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 13. LTE B12/B17 RF specification Copyright . 2017. All Rights Reserved. 8. RFx information The strength of the RF field produced by the wireless module or modules embedded in the TCU is well within all international RF exposure limits known at this time. Because the wireless modules embedded in the TCU emit less than the maximum amount of energy permitted in radio frequency safety standards and recommendations, the manufacturer believes these modules are safe for use. Regardless of the power levels, care should be taken to minimize human contact during normal operation. This module should be remain more than 20 cm (8 inches) from the body when wireless devices are on and transmitting. This transmitter must not be collocated or operated in conjunction with any other antenna or transmitter. Operation is subject to the following two conditions:
(1) this module does not cause interference , (2) this module accepts any interference that may cause undesired operation. 8.1 Information for the integrator The integrator must not provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual that is provided by the integrator for end users must include the following information in a prominent location. To comply with FCC RF exposure requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operated in conjunction with any other antenna or transmitter. The label for the end product must include FCC ID: YZP-BK1110 or A RF transmitter inside, IC ID: 7414C-BK1110 Copyright . 2017. All Rights Reserved. 9. Approbation FCC This module complies with FCC/IC rules. FCC : Part 22, Part 24, Part 27 ISED : RSS-130, RSS-132, RSS-133, RSS-139, RSS-199 Furthermore, this device complies with FCC radiation exposure limits set forth for uncontrolled environments. This module must be installed and operated with minimum distance of 20 cm between the radiating element and the user. This module must not be co-located with any other transmitters or antennas. To comply with FCC regulations limiting both the maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed the values listed in the following table. Band Frequency Range Maximum Antenna
[MHz]
Gain[dBi]
WCDMA(B5) 826.40~846.6 WCDMA(B2) 1852.4~1907.6 LTE(B2) LTE(B4) LTE(B5) LTE(B7) 1850~1910 1710~1755 824~849 2500~2690 LTE(B12/17) 704~716 4.5 2.0 2.0 2.0 4.5 2.0 4.5 To satisfy the FCCs exterior labeling requirements, the following text must appear on the exterior of the end product. Contains transmitter module FCC ID: YZP-BK1110 Contains transmitter module IC: 7414C-BK1110 Changes or modifications to this equipment may cause harmful interference unless the modifications are expressly approved in the instruction manual. Users may lose the authority to operate this equipment if an unauthorized change or codification is made. Note: If this module is intended for use in a portable device, additional testing will be required to satisfy the RF exposure and SAR requirements of FCC Part 2.1093 and RSS-102. Copyright . 2017. All Rights Reserved.