LSD4BT-S98B Product Specification Product NameS98 BLE Standard Module (External Antenna With PA) Part NumberLSD4BT-S98BSTD001 Version: Rev03 Document Revision History Number Revision description Version Revision date 1 2 3 Initial version Rev01 2020-5-28 Update power consumption and tansmission distance data Supplement the power consumption in different broadcast and connection interval states, supplement the PA control pin logic, update the size chart Rev02 2020-6-11 Rev03 2020-7-28 Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 2 /18 Table Of Contents 1 OVERVIEW ................................................................................................................................... 4 1.1 FEATURES ............................................................................................................................................ 4 1.2 APPLICATIONS ...................................................................................................................................... 4 2 SPECIFICATIONS ........................................................................................................................... 5 3 LAYOUT AND INTERFACE ............................................................................................................... 9 3.1 DIMENSIONS ........................................................................................................................................ 9 3.2 HARDWARE INTERFACE ......................................................................................................................... 10 3.3 INTERNAL PA CONTROL LOGIC................................................................................................................ 11 4 APPLICATION NOTE .................................................................................................................... 12 4.1 NOTES FOR TYPICAL APPLICATIONS .......................................................................................................... 12 5 PRODUCTION GUIDANCE ............................................................................................................ 15 5.1 PRODUCTION GUIDE ............................................................................................................................ 15 5.2 LOCATION REQUIREMENTS .................................................................................................................... 15 5.3 STENCILS ........................................................................................................................................... 15 5.4 REFLOW SOLDERING GUIDANCE ............................................................................................................. 16 6 PACKAGING ................................................................................................................................ 17 6.1 PACKING ............................................................................................................................................ 17 6.2 REEL SIZE ........................................................................................................................................... 17 6.3 PLACEMENT DIRECTION ........................................................................................................................ 17 WARN USERS ................................................................................................................................ 18 Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 3 /18 1 Overview Lierda S98B Bluetooth module is a low-power and high-performance Bluetooth module based on the Nordic platform. Its hardware interface is designed as stamp holes. The size is small and all ports are drawn out for easy use. The antenna interface of the module also reserves pads, which is convenient for customers to customize different external antennas according to different needs, and can help you reduce software and hardware investment, and easily complete the development of Bluetooth applications. Part Number Description Table1-1 Part Number Description LSD4BT-S98BSTD001 This type of product use external antenna and does not include software. For products with software, please communicate with the sales about the specific part number and MPQ information. 1.1 Features Operating voltage: 1.8-3.6 V Working frequency: 2402 MHz~2480 MHz Transmit power: 21.5dBm max(@3.3V) Sensitivity: -100dBm (@3.3V) 1.2 Applications Peripheral products for smartphones and tablets Wireless sensor networks such as smart meters and data collection Wireless wearable bluetooth device Smart lights, smart homes, smart cities Intelligent cloud platform and ecological access Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 4 /18 2 Specifications Symbol Voltage input(V) Working temperature() ESD(KV) ESD(KV) Table2-1 Absolute maximum ratings Value Min 0
-40
Max 3.9 85 4 0.5 Remarks All PINS, HBM MODE All PINS, CDM MODE Table2-2 Operating parameters@25, 3.3V Symbol Value Min Typ Max Remarks Voltage input(V) 1.8 3.3 3.6 The ripple of the power supply must be within 30mV peak-to-peak Working temperature() Working frequency
(MHz) Number of channels Pow er cons ump tion Emission current (mA) Receive current
(mA) Sleep current
(uA)
-40 2402
85 Normal communication 2480 ISM frequency band
40
BLE standard channels I=130@Pout=17.5dBm, MCU 64MHZ, Continuous TX I=180@Pout=20.5dBm, MCU 64MHZ, Continuous TX MCU 64MHZ, Continuous RX 130 15 3
Transmit power
(dBm)
-18 17.5 21.5 17.5dBm@ Configure to -4dBm in the software 20.5dBm@ Configure to 0dBm in the software Sensitivity (dBm)
-100
BLE 1Mbps Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 5 /18 Protocol BLE 5.1 Hardware interface 1.27 mm spacing, 3 sides are all stamp holes Communication distance 1 120m 120m@ Configure to -4dBm in the software, with FPC antenna 160m@ Configure to 0dBm in the software, with FPC antenna 1. The "communication distance" is affected by the surrounding environment, air humidity and other factors. The distance is measured through the communication between the mobile phone and the module, and is for reference only. Table2-3 Output power table @25 Software Module output power Module output Module output power configuration(dBm) dBm(3.3V) power dBm(3V) dBm(2.7V) 2 0
-4
-8
-12
-16
-20
-40 21.7 20.5 17.5 14.4 10.5 6.3 1.9
-18 21 19.9 17.4 14.5 10.6 6.4 1.9
-18.1 Pic2-1 Output power graph @25 19.7 19 16.9 14.4 10.6 6.4 1.9
-18.2 Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 6 /18 Table2-4 Power consumption under different broadcast intervals (7Byte data by default) Mode Average power consumption(A) Broadcast interval(ms) Broadcast mode
(-4dBm configura tion, 3.3V) 806 590 175 122 87 46 32 21 17 13 100 200 500 700 1000 2000 3000 5000 7000 10000 Table2-5 Power consumption under different connection intervals (empty packets) Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 7 /18 Mode Average power consumption(A) Connecting interval(ms) Connecti ng mode
(-4dBm configura tion, 3.3V) 172 94 40 30 22 14 12 10 100 200 500 700 1000 2000 3000 4000 Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 8 /18 3 Layout and interface 3.1 Dimensions The outline diagram of LSD4BT-S98B is shown in Figure 3-1:
Pic3-1 LSD4BT-S98B Physical picture The R,C,L materials and PCB of this product have optional materials. Under the premise of meeting the performance, the appearance and color of the materials may be different. The actual product shall prevail. The main materials (main chip, crystal oscillator, etc.) have no replacement models, changes will be notified in advance The overall dimensions of the LSD4BT-S98B module are shown in Figure 3-2:
Pic3-2 LSD4BT-S98B Outline drawing Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 9 /18 The dimensional tolerances not marked in the figure are in accordance with the GB/T1804-m standard. 3.2 Hardware interface The following figure shows the pin number of the module and the corresponding pin description:
Pic3-3 Pin number diagram Pin Name Function Remark Table3-1 LSD4BT-S98B Pin function 1 2 3 4 5 6 7 8 9 P0.03/AIN1 P0.02/AIN0 P0.28/AIN4 SWDIO GND SWDCLK P0.29/AIN5 P0.30/AIN6 Normal IO/ADC Normal IO/ADC Normal IO/ADC Programming port Ground Programming clock Normal IO/ADC Normal IO/ADC VCC Power supply Ripple <30mV, Current >250mA Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 10 /18 10 11 12 13 14 15 16 17 18 GND RSTN P0.01 P0.04/AIN2 P0.05/AIN3 P1.09 P0.11 GND ANT Ground Reset Normal IO Normal IO/ADC Normal IO/ADC Normal IO Normal IO Ground RF out Connect to external antenna 3.3 Internal PA control logic The module contains MCU and PA. P0.17 of MCU is connected to TX_EN of PA, and P0.15 is connected to RX_EN of PA. The logical relationship between the state of PA and TX_EN and RX_EN is shown in the following table:
Table3-2 Internal PA control logic TX_EN RX_EN 1 0 0 X 1 0 PA Mode Transmit Receive Shutdown Note:
1 represents a high level >1.2V;
0 represents a low level <0.3V;
X represents any state. Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 11 /18 4 Application note 4.1 Notes for typical applications 1. Module power supply The ripple of the power supply has a significant impact on the performance of the module. Excessive ripple may affect the success rate of communication. We recommend that the peak-to-peak value of the power supply ripple is less than 30mV, and try to use LDO power supply. If you must use DCDC power supply, you must control the ripple at the output end of the DCDC power supply. An external PA is used inside the module, and the peak current of the module is 200mA. Therefore, the driving current of the power supply of the module should be above 250mA. 2. External antenna The antenna interface of the S98 module provides customers with two options for external antennas: one is to DIP an external FPC antenna directly at the antenna pad of the module; the other is to place an SMA adapter or IPEX seat on the customers PCB, then install the external antenna on it. 2.1 FPC antenna welding As shown in Figure 4-1, customers can directly DIP external FPC antennas at the antenna pads and ground pads. Please pay attention to the paste position of the FPC antenna. Try to stay away from metal, relays, large capacitors and other devices. A certain radiation clearance area should be reserved for the antenna in the customer's product structure. Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 12 /18 2.2 SMA or IPEX interface Pic4-1 FPC antenna welding You can also use the antenna interface (stamp hole) of the module. Reserve a matching network on the PCB, lead the RF signal to the SMA or IPEX interface, and then connect the external antenna. As shown in Figure 4-2 below, the RF trace impedance needs to be controlled to 50, and the relationship between the width of the impedance line and the copper spacing and board thickness is shown in Figure 4-3. 4-2 SMA IPEX Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 13 /18 Pic4-3 50 ohm impedance line routing recommendations 3Pads on the back of the module Due to the large amount of heat generated when the PA is working, we have opened a window on the thermal pad of the PA on the back of the module. You need to avoid this area on your PCB, and do not expose copper or place power vias to avoid short circuits. Pic4-4 Window on the back of the module 4ESD protection You need to pay attention to the electrostatic protection of the module when designing the product (see Table 2-1). Add an electrostatic protection circuit to a place that is easily accessible to the human body, and take protective measures in the manufacturing process of the product. Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 14 /18 5 Production guidance 5.1 Production guide It is recommended to use SMT machine for patching, and the patching is completed within 24 hours after unpacking, otherwise the vacuum packaging must be re-evacuated to avoid dampness leading to poor patching. If the package contains a humidity indicator card, it is recommended to determine whether the module needs to be baked according to the humidity card indicator. The conditions for baking are as follows:
Baking temperature: 1255;
Alarm temperature: 130;
After cooling <36 under natural conditions, SMT patch can be carried out;
If it is more than 3 months after unpacking, you need to pay special attention to whether the product is damp, because the PCB uses an immersion gold process, unpacking for more than 3 months may cause the pad to oxidize, and may cause problems such as false soldering and missing soldering during patching. In order to ensure the qualified rate of reflow soldering, it is recommended to sample 10% of the products for visual inspection and AOI inspection for the first time to ensure the reasonableness of furnace temperature control, device adsorption method, and placement method;
In the whole production process, all operators must wear electrostatic gloves;
5.2 Location requirements It is recommended that the thickness of the green oil at the module position of the backplane be less than 0.02mm, to avoid the excessive thickness that causes the module to be unable to effectively contact the solder paste, which will affect the soldering quality. In addition, it is necessary to consider that no other devices can be placed within 2mm of the interface board module position to ensure the maintenance of the module. 5.3 Stencils The thickness of the stencil on the bottom plate is in principle selected according to the package type of the components on the board, and the following requirements should be paid attention to:
The position of the module pad can be locally thickened to 0.15~0.20mm to avoid Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 15 /18 empty soldering;
5.4 Reflow soldering guidance Note: This work instruction is only suitable for lead-free work and is for reference only. Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 16 /18 6 Packaging 6.1 Packing Reel Foam Electrostatic bag 6.2 Reel size 6.3 Placement direction Schematic diagram of the module orientation in the reel package Document Type: LSD4WN-2L817M90 User Manual Version: Rev03 Technical Support: www.lierda.com Page: 17 /18 Warn users You are welcome to use the products of Lierda Technology Group Co., Ltd. Before using our products, please read this warning first. If you have started to use it, you have read and accepted this warning. Lierda Technology Group Co., Ltd. reserves the right of final interpretation and modification of all the materials provided, and subject to change without notice. Document Type: LSD4WN-2L817M90 User Manual Technical Support: www.lierda.com Version: Rev03 Page: 18 /18 FCC Statement This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This device complies with part 15 of the FCC rules . Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modifications could void the users authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help
- This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter Document Type: LSD4WN-2L817M90 User Manual Technical Support: www.lierda.com Version: Rev03 Page: 16 /18 ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. The OEM must comply with the FCC labeling requirements. If the modules label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: Contains transmitter module FCC ID: N8NLSD4BT-S98. Additionally, the following statement should be included on the label and in the final products user manual: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interferences, and
(2) this device must accept any interference received, including interference that may cause undesired operation. The module is allowed to be installed in mobile and portable applications A module or modules can only be used without additional authorizations if they have been tested and granted under the same intended enduse operational conditions, including simultaneous transmission operations. When they have not been tested and granted in this manner, additional testing and/or FCC application filing may be required. The most straightforward approach to address additional testing conditions is to have the grantee responsible for the certification of at least one of the modules submit a permissive change application. When having a module grantee file a permissive change is not practical or feasible, the following guidance provides some additional options for host manufacturers. Integrations using modules where additional testing and/or FCC application filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together. This Module is full modular approval, it is limited to OEM installation ONLY. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure compliance of the entire end product include the integrated Module. Additional measurements (15B) and/or equipment authorizations (e.g. Verification) may need to be addressed depending on co-location or simultaneous transmission issues if applicable. (OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user. Document Type: LSD4WN-2L817M90 User Manual Technical Support: www.lierda.com Version: Rev03 Page: 16 /18 This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. The product comply with the Canada portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available. Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le Canada tablies pour un environnement non contrl. Le produit est sr pour un fonctionnement tel que dcrit dans ce manuel. La rduction aux expositions RF peut tre augmente si l'appareil peut tre conserv aussi loin que possible du corps de l'utilisateur ou que le dispositif est rgl sur la puissance de sortie la plus faible si une telle fonction est disponible. Document Type: LSD4WN-2L817M90 User Manual Technical Support: www.lierda.com Version: Rev03 Page: 16 /18