Data Sheet of WJ-M101 Bluetooth Module 1. Description WJ-M101 Bluetooth low energy single mode module is a single mode device targeted for low power sensors and accessories. WJ-M101 offers all Bluetooth low energy features: radio, stack, profiles and application space for customer applications. The module also provides flexible hardware interfaces to connect sensors. WJ-M101 can be powered directly with a standard 3V coin cell batteries or pair of AAA batteries. In lowest power shutdown mode it consumes only 0.5 uA and will wake up in few microseconds. WJ-M101 transmission distance of 30 meter. (At face to face, free space, 1.2 Meter high from Ground for testing). Bluetooth ICTTC2541 6*6*0.9mm 40pin IC / use TI CC2541 IC chip 1-1.APPLICATIONS:
Heart rate sensors Pedometers Watches Blood pressure and glucose meters Weight scales Key fobs Households sensors and collector devices Security tags Wireless keys (keyless go) Proximity sensors HID keyboards and mice Indoor GPS broadcasting devices 1-2.KEY FEATURES:
Bluetooth BLE v.4.0 single mode compliant Supports master,slaveand master/slave modes Integrated Bluetooth low energy stack GAP, GATT, L2CAP, SMP Bluetooth low energy profiles Compliance: BQB BLE4.0, FCC, IC(Canada), CE ETSI REDetc. worldwide RF Regulations. Transmit power :+0dBm typical Receiver sensitivity: -94dBm typical In-System-Programmable Flash 256KB SRAM 8KB Low current consumption :Shutdown. No clocks running, no retention: 0.5uA(Typical) 2. WMD410A01SR6A0 (HY-254101) PCBA dimension size and picture
(PCBA dimension size : 15.2*25.3*2.0 mm). 3. Application Note:
3-1.Attention to the electrostatic protection, prevent the soldering iron and the equipment grounding bad;
And the workbench, working environment, packaging materials and from the human body Touch with static electricity, etc., destroy IC and software be fly; Manual welding module solder iron temperature, should pay attention to avoid the PCB copper stripping off;Soldering iron strictly Grounding requirements, eliminating iron power failure module;
3-2.Attention to avoid the overall motherboard power supply circuit of bad welding connected to short circuit or open circuit, causing the Bluetooth chip, abnormal voltage, The soft ware will fly and problems of IC was damaged. 3-3.When programming firm ware, the VDDS supply voltage must in DC 2.4~3.3V, To avoid programming has not completely, and abnormal status occur.. 3-4. Use the module in the production and the transport process, please insure modules component protection, prevent the precision parts on the module Damaged (welding furnace exit and assembly, testing, delivery process, suggest using collision buffer material, not collide with each other) 3-5. The module for the humidity sensitive components, if used in SMT reflow soldering operations, please strictly follow the IPC/JEDECJ - STD 020 regulation, completes the drying dehumidifying , and for this module has second processing work after placed in the functional test environment, the humidity of the chip is no guarantee that in a certain ratio, the honored guest please understand;(The attention note show in below Fig.) 3-6. The diagram (show in below Fig.) of the module application on external filter parts, when need, please design in the mainboard, the parts parameter can depend on the actual need to changes. 3-7.Assembly recommendation 1:Underneath the module antenna and RF circuit on the main board PCB copper need to clearance, and place close to the main board edge, as show in below Fig. The antenna can't be near around metal parts and prevent material existence of electromagnetic radiation, Can affect the manipulation of the distance. 3-8. Assembly recommendation 2:Signal trace and power supply trace, don't cross layout, as show in below Fig.To avoid crosstalk, affect the receiving sensitivity. 4. Module pin definition and description of input and output ports 4-1HY-254101PCB Antennapin map 4-2Pin function table (Not shown in the I/O pin functions ,Please see Table(4-3) input and output ports description) Pin Function Description (The module following collectively "BLE"):
a. UART: serial bus, the default baud rate 9600bps, a single packet transmission is less than 17 bytes, package transmission intervals greater than 20ms. b. SPI: SPI bus interface, support for less than 2M / S data transmission rate, a single packet transmission is less than 17 bytes, package transmission intervals greater than 20ms. c. IIC: IIC bus interface, support more than 22K / S, less than 400K / S data transmission rate, a single packet transmission is less than 8 bytes, package transmission intervals greater than 20ms. d. MOSI: Master output, Slave input. e. MISO: Master input, Slave output. f. SCK: SPI bus clock signal. g. SDA: IIC data. h. SCL: IIC clock. i. WAKEUP: BLE wake up pin, Low _wake up, High/ BLE module automatically sleep. j. SEL0 & SEL1: MCU and BLE communication mode selection pin. Specific details, see "(4-3) communication protocol mode selection, I/O setting table ". k. RESET: BLE hardware reset pin, Low level reset. l. VCC: BLE module power supply pin voltage range DC 2.0~3.6V. m. GND: BLE module ground pin. 4-3.Communication protocol mode selection, I/O setting Table UART modeSEL1=0,SEL0=0 or SEL1=0, SEL0=1 or SEL0,SEL1 floating. SPI mode SEL1=1,SEL0=0 IIC mode SEL1=1,SEL0=1 Table4-4: Input and output ports Description Input / output Register pin No. I/O Port register IO_0 IO_1 IO_2 7 16 4 6 17 5 5 18 7 4 19 8 3 20 9 NC NC NC NC IO_3 NoteBITx=0Low level out ; BITx=1 High level out NC NC NC NC NC NC NC 2 21 10 1 1 22 14 2 6 0 23 15 3 11 Direction Register pin No. Direction Register DIR0 DIR1 7 16 4 6 17 5 5 18 7 4 19 8 3 20 9 2 21 10 1 22 14 0 23 15 DIR2 DIR3 Note: BITx = 0 is corresponds port input , BITx = 1 is corresponds port output . NC NC NC NC NC NC NC NC NC NC NC 1 2 6 3 11 PWM port pin No. PWM5 PWM4 PWM3 PWM2 PWM1 PWM0 16 8 9 10 14 15 ADC port pin No. ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0 16 17 18 19 20 21 22 23 Note: The Blue Numbers of the corresponding port pin No. applications of all kinds, For example:IO0/bit0 or ADC0 pin is corresponding module pin No.23 5. Electrical Characteristics 5-1: General Characteristics
(With Ta = 25 , VDD = 3.0V, standard measure:1Mbps , 250KHz GFSK modulation, Bluetooth Low energy mode.) 1. Modulation Mode: GFSK;
2. Frequency range: 2402~2480MHZ (2.4G ISM band);
3.Transmit power setting Range: -20 ~ +0 dBm typical ( differential mode o/p point characteristics;
programmable by software) 4. Operating ambient temperature range: -20 ~ + 50 ;
5. The storage temperature range: -40 ~ + 85 ;
6. The power supply voltage: 2.0 ~ 3.6VDC;
7. Receiver sensitivity: - 94dBm typical( direct test from IC RF out differential mode o/p point characteristics) 8. Receiving mode current (high gain setting): 20.02 mA (typical);
9. Transmit mode current ( at 0dBm output setting ): 18.2 mA (typical);
10. MCU law active current (only 32MHz operation of X-tal OSC): 6.7 mA (typ);
11. Power mode 1: The current consumption: (under MCU standby mode, the wake-up time = 4uS); I= 270uA (Typical);
12. Power mode 2: THE current consumption in sleep mode. timer activate / enable, wake-up time can by the programming software setting): I = 1uA (typ);
13. Power mode 3: The current consumption :( Low power deep sleep mode, via the hardware initiative wake ): I = 0.5uA(Typical);
5-2. Absolute Maximum Ratings Note: These are absolute maximum ratings beyond which the module can be permanently damaged, these are not Maximum operating conditions, the maximum recommended operating conditions are in the table 6 5-3. ESD Ratings 5-4. Recommended Operating Conditions Supply voltage noise should be less than 10mVpp. Excessive noise at the supply voltage will reduce the RF performance. Note: (1).VDD power supply recommended voltage : 2.7~3.3V
(2).When programming firm ware , the VDD supply voltage must in DC 2.4~3.3V, To avoid programming has not completely, or abnormal status occur..
(3).For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-F VDDS input capacitor must be used to ensure compliance with this slew rate(6-6 timing req.). 6. Block Diagram 7. Functional Block Diagram 8. Working mode schematic:
9. Recommend Reflow Profile( Leadless solder cream: Sn 96.5%, Ag 3%, Cu 0.5%) Reflow Curve Classification FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:LIV-BLEMOD1 Or Contains FCC ID:LIV-BLEMOD1 When the module is installed inside another device, the user manual of the host must contain below warning statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product.