FCC ID: 2AMPF-MX1731 MatchX Core

MatchX MX1731 Core BLE and LoRa enabled System on Module

(Preliminary) User Guide V1.0 Copyright c 2017 MatchX GmbH WWW.MATCHX.IO No part of the specications may be reproduced in any form or by any means or used to make any derivative such as translation, transformation, or adaptation without permission from MatchX GmbH All rights reserved. First release, Nov 2017 Contents 1 Introduction . 5 Product overview . 5 1.1 Lora . 5 1.1.1 BLE . 6 1.1.2 1.2 Main Features . 6 1.2.1 Hardware . 6 Software . 6 1.2.2 2 Hardware Architecture - SoM module . 7 Pin-out and pin description of the SoM module . 7 2.1 Operating frequency bands . 9 2.2 EU 863-870MHz ISM Band . 9 2.2.1 2.2.2 US 902-928MHz ISM Band . 9 2.2.3 Australia 915-928MHz ISM Band . 11 2.3 Connection . 11 Power . 11 2.3.1 2.3.2 Bluetooth connection . 12 3 3.1 4 4.1 Connecting to MatchX server . 13 Registering a node on MarchX server . 13 Software Development Guide . 15 References . 15 4 4.2 4.3 4.3.1 4.4 4.5 5 5.1 5.2 5.3 5.4 6 6.1 6.2 6.3 6.4 6.5 6.6 Prerequisites . 15 Software development under Windows OS . 16 Using SmartSnippet Studio . 18 Software development under Linux . 20 Setting DevEUI, AppEUI and DevKey . 21 Typical Hardware Connection . 24 Digital Interfaces . 25 Analog Interfaces . 25 Programming Interface . 25 Antenna connection . 25 Product specication . 28 Hardware environment

. 28 Software environment

. 28 RF performance . 29 Electrical characteristics . 29 Antenna characteristics . 29 Dimensions . 30 7 Certication . 32 7.1 FCC . 32 7.1.1 Antenna information . 34 CE . 34 7.2 8 Important Notice . 35 1. Introduction 1.1 Product overview The LPWAN Core module by MatchX is a high performance, ready to use system on module allowing you to kick-start your IoT project. It is an incredibly exible solution that can be deployed in a various number of applications which require long distance communication and long battery life. The unique combination of both LoRa and Bluetooth Low Energy makes non-contact rmware updates easy, especially when the device is mounted in a difcult or unaccessible place. This guide covers both the US and EU version of the Core module. The main differences between these two versions are listed in Table 1.1. Parameter Operating Frequency Band Maximum Output Power Lora BW SF Certication EU US 863-870MHz 902-928MHz

+14dBm

+17dBm 125kHz 500k/125kHz 7-12 7-10 EN 300200 IEC 60950-1 FCC PART 15.247 EN 301489 Table 1.1: Comparison of different regions 1.1.1 Lora The MatchX Module uses LoRa communication to send messages over long distances (up to 20km in open spaces). This unique modulation scheme guarantees robust wireless communication even in difcult from RF point of view environments such as high-rise city landscapes or within the inside of buildings. The module can output up to 18dBm of power and is fully LoraWAN compatible. Its uniquely designed to work with the MatchX Box gateway and can also be used with a LoraWAN compatible Gateway of your choice. 6 1.1.2 BLE Chapter 1. Introduction The module offers a novel rmware solution upgrade by augmenting LoRa, together with Bluetooth Low Energy (BLE). As LoRa protocol is not suitable for transmitting large amounts of data, MatchX has combated this with BLE, offering a quick, robust and remote way of updating your software. It is a perfect method in cases where a sensor may be mounted in an unaccessible place like in a basement, sealed container box or behind a wall. Moreover BLE together with provided mobile app enables you to congure your module and read its status and additional data. 1.2 Main Features Long range, long battery life, exible sensor conguration and wireless rmware update are the key features that are offered by the Core module. 1.2.1 Hardware

+18dBm output power in 868MHz

-146dBm sensitivity of LoraWAN packets integrated LoRa and BLE antennas connectors 0 Hz up to 96 MHz 32-bit ARM Cortex-M0 microcontroller Dialog DA14680 Semtech SX1276 Li-ION battery charger ultra low power design 1.2.2 Software Runs LoRa and Bluetooth stack simultaneously Bluetooth low energy (Bluetooth 4.2 specication) Low power consumption modes Easy to use software package Eclipse-based IDE Firmware upgrade over the air Mobile application R Currently there is no Class B support in server yet, but the hardware and rmware are fully prepared for Class B specication, it is expected to support Class B in future rmware upgrade. 2. Hardware Architecture - SoM module 2.1 Pin-out and pin description of the SoM module The pin-out of the MatchX Core SoM module can be seen on Figure 2.1 and the description of the pins in Table 2.1. On top of the module there are two UF.L RF connectors, the one on the left is the LoRa antenna connector, a suitable 868MHz in EU and 915MHz in US, 50 Ohm antenna is expected to be connected on these port. The other connector is for connecting the 2.4GHz, 50 Ohm BLE antenna. Please contact MatchX for antenna recommendation. Figure 2.1: Pin-out of the SoM module. 8 Chapter 2. Hardware Architecture - SoM module Pin num-

ber 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Name Description Ground Supply voltage of the radio front-end Open drain output type, LED driver Open drain output type, LED driver Open drain output type, LED driver Reset signal, active high General Purpose I/O P1_6 / NTC resistor for battery temperature sensing General Purpose I/O P1_4 / ADC1 / battery temperature sensing General Purpose I/O P4_2 General Purpose I/O P4_3 General Purpose I/O P2_3 General Purpose I/O P1_3 / ADC2 General Purpose I/O P0_7 / ADC3 Serial Wire Debug interface I/O signal / GPIO P0_6 / ADC4 V3P3_LDO 3.3V output of the internal LDO GND VDD_RFS LED1 LED2 LED3 RESET P1_6 P1_4 P4_2 P4_3 P2_3 P1_3 P0_7 SWD_DIO SWD_CLK Serial Wire Debug interface clock signal / GPIO P2_4 / ADC7 P3_3 P3_4 P3_2 VBATT GND VBUS General Purpose I/O P3_3 General Purpose I/O P3_4 General Purpose I/O P3_2 Battery voltage input Ground 5V supply, charging voltage Table 2.1: USB-C connector pins description. The module can be powered in two ways:

1. By connecting the VBATT to a battery voltage (2.7V to 4.2V). 2. By supplying +5V on the VBUS pin. If both power sources are present, the battery will be charged form +5V power supply. The charging current and charging characteristics for different battery types is software congurable. The module provides V3P3_LDO voltage, it is a output of internal LDO of the DA14680 MCU, and it can be used to supply external devices, but the maximum current drawn cant be grater than 100mA. By default VDD_RFS is connected to V3P3_LDO with an external 0R resistor. The current draw of VDD_RFS is around 35mA during transmission with +14dBm power output and around 90mA with +17dBm power. This has to be taken in consideration when planning the power budget of V3P3_LDO. When even higher RF transmission power is required it is advisable to use different power source for VDD_RFS. On the Evaluation Board it can be done by using 3.3V output of the low power converter. The source of V3P3_LDO is VBUS when present or VBATT otherwise. As it is a output of a LDO, when VBUS is not present, and VBATT drops below 3.3V the V3P3_LDO will follow the battery voltage. By default all GPIO are referenced to V3P3_LDO (it is also possible to congure 1.8V as the GPIO level, each GPIO can be congured individually) so care must be taken to ensure 2.2 Operating frequency bands 9 that no voltage higher than V3P3_LDO is presented to any GPIO. This may happen when powering external devices, that connect to SoM module, from a boost converter. Figure 2.2: Block diagram of the Core module. 2.2 Operating frequency bands 2.2.1 EU 863-870MHz ISM Band In the European region the EN300220-2 V3.1.1 (2017-02) regulation denes the allowed frequency allocation and spectrum access. Every device working in this band must comply with these rules as shown in the Table 2.3. EU regulations restrict the maximum radiated power as well as the duty cycle of the transmission in different frequency bands.To comply with the duty cycle requirement the transmitting device must wait after every transmitted packet. The time device has to wait depends on the time on air of transmitted packet and this in turn depends on the length of the packet and spreading factor SF. This relation and required wait time can be seed in Table 2.2 According to LoRaWAN specication every device has to implement at least 3 channels as follows:

868.10 MHz 868.30 MHz 868.50 MHz The SoM is precongured to work with the MatchX Box gateway and additionally to the 3 mandatory channels 5 additional channels are dened. The list of all precongured channels can be found in Table 2.4. 2.2.2 US 902-928MHz ISM Band These frequencies band can be used in USA, Canada and all other countries that adopt the entire FCC-Part15 regulations in 902-928 ISM band. For these region MatchX uses predened frequencies 10 Chapter 2. Hardware Architecture - SoM module Spreading Factor Bit rate Range (depends

(125kHz Lora) on conditions) SF7 SF8 SF9 SF10 SF11 SF12

(bps) 5470 3125 1760 980 440 290 2 km 4 km 6 km 8 km 14 km 20 km Time on air (ms)

(10 bytes payload) 0.1% duty cycle waiting time 1% duty cycle waiting time 56 ms 100 ms 200 ms 370 ms 740 ms 1400 ms 1 min 1 min 40s 3 min 20s 6 min 10s 12 min 20s 23 min 20s 6s 10s 20s 37s 1 min 14s 2min 20s Table 2.2: Modules operating frequencies. Operational Fre-

quency band Maximum e.r.p K L M N O P Q R 863,000 MHz to 865,000 MHz 25 mW e.r.p. 865,000 MHz to 868,000 MHz 868,000 MHz to 868,600 MHz 868,700 MHz to 869,200 MHz 869,400 MHz to 869,650 MHz 869,400 MHz to 869,650 MHz 869,700 MHz to 870,000 MHz 869,700 MHz to 870,000 MHz 25 mW e.r.p. Power density:

-4,5 dBm/100 kHz 25 mW e.r.p. 25 mW e.r.p. 25 mW e.r.p. 500 mW e.r.p. 5 mW e.r.p. 25 mW e.r.p. Channel access and occupation rules

(e.g. Duty cycle or LBT + AFA) 0,1% duty cycle or polite spectrum access 1 % duty cycle or polite spectrum ac-

cess 1% duty cycle or polite spectrum ac-

cess 0,1% duty cycle or polite spectrum access 0,1% duty cycle or polite spectrum access 10 % duty cycle or polite spectrum access No requirement 1% duty cycle or polite spectrum ac-

cess num-

Band ber from EC Decision 2013/752/EU

[i.3]

Class 1 sub-

class number according Commission Decision 2000/299/EU

[i.7]

46a 47 48 50 54a 54b 56a 56c 66 67 28 29 130 30 31 69 Table 2.3: EU wide harmonized national radio interfaces. 2.3 Connection 11 Frequency Bandwidth Maximum e.r.p 864.7 MHz 864.9 MHz 865.1 MHz 865.3 MHz 868.1 MHz 868.3 MHz 868.5 MHz 868.8 MHz 14 dBm 14 dBm

-4.5 dBm

-4.5 dBm 14 dBm 14 dBm 14 dBm 14 dBm 125 kHz 125 kHz 125 kHz 125 kHz 125 kHz 125 kHz 125 kHz 125 kHz Channel access 0,1% duty cycle 0,1% duty cycle 1% duty cycle 1% duty cycle 1% duty cycle 1% duty cycle 1% duty cycle 0,1% duty cycle Table 2.4: Core Module operating frequencies in EU 863-870MHz ISM Band. listed in Table 2.5. The FCC regulation puts restriction on the maximum dwell time of 400ms in uplink, thats why the maximum allowed spreading factor is SF10. Channel number 1 2 3 4 Frequency 903.90 MHz 904.10 MHz 904.30 MHz 904.50 MHz Channel number 5 6 7 8 Frequency 904.70 MHz 904.90 MHz 905.10 MHz 905.30 MHz Table 2.5: Modules operating frequencies (uplink) in US 902-928MHz ISM Band. 2.2.3 Australia 915-928MHz ISM Band These frequencies band can be used in Australia region. For these region MatchX uses predened frequencies listed in Table 2.6. All channels use 125kHz bandwidth and maximum of +20dBm output power can be reached. Channel number 1 2 3 4 Frequency 915.20 MHz 915.40 MHz 915.60 MHz 915.80 MHz Channel number 5 6 7 8 Frequency 916.00 MHz 916.20 MHz 916.40 MHz 916.60 MHz Table 2.6: Modules operating frequencies (uplink) in Australia 915-928MHz ISM Band. 2.3 Connection 2.3.1 Power The Core module can be supplied directly from rechargeable lithium battery. As long as the battery is charged there is no other power connection required for the module to work.Alternatively the module 12 Chapter 2. Hardware Architecture - SoM module can be powered by +5V supply connected to VBus pin. Core SoM integrates internal Lithium battery charger which will charge the battery connected to its VBatt pin from VBus voltage.Charger can be disabled in software if the application doesnt require it.

! Important!

MatchX strongly recommends to charge the battery within specied temperature range of 0 to

+45C. Charging outside of these recommended conditions may lead to either reduced battery life or permanent damage. 2.3.2 Bluetooth connection The Core module implements Bluetooth Low Energy (Bluetooth 4.2 specication) with SUOTA

(Software Update Over The Air) feature. The only hardware requirement is a connection of 2,4GHz, 50 Ohm antenna to BLE antenna port. 3. Connecting to MatchX server Every Core module comes with preprogrammed unique MAC address, AppEUI and LoraWAN DevKey (also referred as AppKey by different sources). The DevKey is used to ensure a secure communication and data encryption between the module and application server. AppEUI is used to communicate with the application that registered on the Lora server. Care must be taken with storing the DevKey in a safe place and ensuring it is not compromised. The products will come with a QR code sticker, which gives the Serial Number of the device. By typing in the S/N at the registration of the MatchX LPWAN Cloud, the preprogrammed APP EUI, MAC address and DevKey will be associated automatically. 3.1 Registering a node on MarchX server Registering a node on MatchX server is a straight forward process. The user needs to know nodes DevKey, DevEUI and AppEUI. For more information about these keys refer to section 4.5. Go to matchx.io and under Cloud nd an appropriate server according to region the node should be deployed. In this example we are using https://eux.matchx.io for Europa region. Register an account using valid email address. Go to your dashboard and click on Application tab and than press Create application button (see Figure 3.1). Figure 3.1: Creating new Application. 14 Chapter 3. Connecting to MatchX server Fill out the Application name and Application description elds and click Submit. Click on your newly created application and under Nodes tab click on the Create node button. Figure 3.2: Creating new node. Fill out information about DevKey, DevEUI and AppEUI. Device EUI should be in 64bit format

(with fffe in the middle) like on Figure 3.2. Click on Submit button. The node is now created, you can click on View under Frame Logs to see all messages belonging to the node like it is shown on Figure 3.3. Figure 3.3: Nodes messages. 4. Software Development Guide The purpose of this chapter is to help user to quickly install all necessary software components and establish hardware connections needed to start software development using MarchX Core SoM and Development Kit. MatchX is providing the Dev Kit Firmware (DKF) to be a starting point for further software development according to individual needs. 4.1 References SoM module is based on Dialog DA14680 microcontroller so it is advisable to get familiar with the following documents available on Dialog Semiconductors website:

DA14680-01 DS, Datasheet, Dialog Semiconductor UM-B-057-SmartSnippets Studio user guide, User manual, Dialog Semiconductor UM-B-047 DA1468x Getting Started, User manual, Dialog Semiconductor UM-B-044 DA1468x Software Platform Reference, User manual, Dialog Semiconductor UM-B-056 DA1468x Software Developers Guide, Dialog Semiconductor 4.2 Prerequisites MatchX Development Kit USB-C cable and 5V charger UART-USB converter JLink programmer Dialogs Semiconductor SmartSnippets DA1468x SDK SmartSnippets Studio package MatchX Dev Kit Firmware Operating System (Windows or Linux) 16 Chapter 4. Software Development Guide 4.3 Software development under Windows OS The easiest way to install and congure all required tools is to install Dialogs SmartSnippets Studio package (it can be downloaded from the company website after registration). Experienced users can try to install all cross-compilation tools and congure they favorite SDE manually, but using Dialogs software the whole process is straight forward. Please follow UM-B-057 User Manual from Dialog for details about the installation. After successful installation of SmartSnippets Studio and J-Link programmer, you should have gcc cross-compilation tools installed and proper PATH entry should exist, to check it you can open command line window and type arm-none-eabi-gcc -v The result should be similar to what is shown on Figure 4.1. In these example we are using gcc version 4.9.3 20150529. Figure 4.1: Checking ARM tools installation. Download the Dialogs Semiconductor SmartSnippets DA1468x SDK (in the example the SDK version 1.0.8.1050.1 has been used) and MatchX Dev Kit Frmware. Both SDK and Dev Kit Firmware should be put in one folder (for example SmartSnippet workspace folder). DKF folder contains a make le which can be executed by navigating to the rmware folder and typing make in the command line window. This command will compile the rmware. If everything has been setup correctly the compilation process should return no errors and a binary le should be generated as a result, see Fugure 4.2. After the software has been successfully compiled it can be programmed through J-Link pro-

grammer using a script provided by Dialog Semi. In command line window navigate to the DKF folder. The programming script initial_flash.bat should be located in SDK folder:

DA1468x_SDK_BTLE_v_1.0.8.1050.1\utilities\scripts\suota\v11\

It takes two parameter - path to the .bin le with rmware and path to the J-Link tools. The syntax is as follows:

{Path}\initial_flash.bat "{Path to firmware}" "{Path to J-Link}"

The example of the command can be seen on Figure 4.3. Before executing it the Dev Kit board has to be powered on and J-Link programmer has to be connected to SWD port on J101. Only GND, SWDCK and SWDIO are necessary to program the board. After successful programming process the screen should look similar as on Figure 4.4. On default DKF congures pins 5 and 6 on the 4.3 Software development under Windows OS 17 Figure 4.2: Compilation process of DKF. J102 connector to be UART TX and RX respectively. By connecting a UART-to-USB converter to these pins the rmware will output the console messages. The output information sent after reset and UART conguration can be seen on Figure 4.5. Figure 4.3: Example of programming command. Figure 4.4: Programming completed successfully. 18 Chapter 4. Software Development Guide Figure 4.5: Console output of the Dev Kit after reset. 4.3.1 Using SmartSnippet Studio As MatchX DKF is a makele based project it is possible to port it quite easily to different IDE and use different operating systems. SmartSnippet Studio is a Dialog Semiconductors IDE based on Eclipse. It offers makele project import capabilities. In order to import the project, open the SmartSnippet IDE.The folder structure should be the same as in previous section, both SDK and DKF should be in SmartSnippet workspace folder. Go to File->Import and choose Existing Code as Makele Project like on Figure 4.6. Figure 4.6: Import makele project window. 4.3 Software development under Windows OS 19 Click Next. On the next window navigate to the DKF folder. Choose Cross ARM GCC and press Finish. The software should be correctly imported and you should be able to compile it by going to Project->Build All or pressing the build icon. To program the just compiled rmware into DK you need to import "scripts" project to your workspace. To do that go to File->Import and choose Existing Projects into Workspace like on Figure 4.7. Figure 4.7: Import existing project window. Click Next. On the next window navigate to the script folder that should be located in

<sdk_root>\utilities\scripts. See Figure 4.8 and Figure 4.9 Now all the scripts should be available, but in order to use them they must be slightly modied to point to a correct .bin le. Click on External Tools Conguration as shown on Figure 4.10. It is best to copy the suota_initial_ash_jtag_win script by right clicking on it and pressing Duplicate then renaming it. The Argument section has to be modied to contain correct path to compiled rmware. The variables values can be modied by clicking Variables button. The compiled .bin le is stored in obj folder in the project directory. 20 Chapter 4. Software Development Guide Figure 4.8: Importing eXisting project browse window. Figure 4.9: Browse window. 4.4 Software development under Linux Software developing under Linux operating system is straight forward. The easiest way to setup the environment is to install the the SmartSnippet Studio from Dialog and following the installation guide in UM-B-057 User guide from Dialog. Download the Dialogs Semiconductor SmartSnippets DA1468x SDK (in the example the SDK version 1.0.8.1050.1 has been used) and MatchX Dev Kit Frmware. Both SDK and Dev Kit Firmware should be put in one folder (for example SmartSnippet workspace folder). Open the terminal and navigate to DKF folder. The project contains make le 4.5 Setting DevEUI, AppEUI and DevKey 21 Figure 4.10: Scripts. Figure 4.11: Scripts editing. that takes over the compilation process. The rmware will be compiled by invoking make command. Programming the DK board is done by invoking make command with firstflash parameter. 4.5 Setting DevEUI, AppEUI and DevKey To ensure the highest level of security in LoRaWAN network and Over the Air Activation (OTTA) 3 different keys have to be programmed into every end node. DevEUI - 6 bytes global end-device ID in IEEE EUI48 address space that uniquely identies the end-device, also used by Bluetooth. It is converted to IEEE EUI64 by inserting 0xFFFE in the bytes 4 and 5. e.g. 78af58fffe040000 AppEUI - 8 bytes global application ID in IEEE EUI64 address space that uniquely identies DevKey - 16 bytes unique AES-128 key These keys are programmed by MatchX and stored in a special region of the nonvolatile memory the application provider (i.e., owner) of the end-device 22 Chapter 4. Software Development Guide Figure 4.12: Programming DK board. of the Dialog microcontroller. They will be preserved during ashing of the new rmware, however they will be lost by performing full ash erase. The default values are dened in lora\param.c. In Dev Kit Firmware the values of these keys are printed on UART console on power up, see Figure 4.13 Figure 4.13: Displaying the keys on UART console. The values of DevEUI, AppEUI and DevKey can also be changed from UART console by using param command. The syntax is as follow:

param x value where x = 0 for DevEUI, 1 for AppEUI and 2 for DevKey, value is a hexadecimal value to be set. When value eld is not specied the command will output current value of the parameter

(except DevKey, which will not be shown). DevKey is a AES-128 encryption key used for secure communication. It should be kept secret and only known to the sensor owner, this is why it is recommended to not display it on the UART 4.5 Setting DevEUI, AppEUI and DevKey 23 in a nal version of the rmware by removing #define DEBUG line in param.c le. It is also recommended to change its value before registering the node on the server. 5. Typical Hardware Connection Figure 5.1 shows the typical hardware connection. Figure 5.1: MatchX Core reference circuit. 5.1 Digital Interfaces 5.1 Digital Interfaces 25 Interfaces such as SPI, UART, I2C etc. can be multiplexed to any GPIO pin which gives exibility with sensor connection. By default P1_4 and P1_6 are used as UART console interface by MarchX rmware. 5.2 Analog Interfaces Pins P1_3, P1_4, P0_7, SWD_IO and SWD_CLK can be used as analog inputs to internal ADC converter. In order to use SWD pins as analog inputs the programming and debug function of these pins has to be disabled rst in the software. It is advisable to implement some delay between reset and disabling SWD function so the debug function can be entered after hardware reset. Pins P1_6 and P1_4 can be also used as temperature sensing pins for battery charging and protection. Please refer to Dialog Semiconductor DA14680 datasheet for more details. 5.3 Programming Interface The main programming interface is Serial Wire Debug (SWD) interface comprising of SWD_IO, SWD_CLK and optionally Reset. Additionally it is possible to use pins P1_3 and P2_3 to commu-

nicate with internal bootloader as described in UM-B-041 Production Line Tool User Manual by Dialog Semiconductors. This interface can be used with Dialog software and Production Line Tool to perform rmware ashing and production testing. 5.4 Antenna connection The MX1721 Core module has been tested and certied with MatchX MX1733 Development board

(Dev Kit). The Dev Kit is using two SMA connectors to connect external dipole antennas and two U.FL connectors to connect RF signal from Core module. The connection is shown on Figure 5.2. To connect the Core module to the antenna port two coaxial U.FL to U.FL pigtail cables of the length of 43mm are used (shown on Figure 5.3). Between U.LF and SMA connectors on the Dev kit there are few passive components for matching and ESD protection. The detailed schematic can be seen on Figure 5.4 and layout on Figure 5.5 (the details about the Dev Kit boards, together with schematics and gerber les can be found on the company websites www.matchx.io). All inductors, capacitors, resistors and ESD components have 0402 size. The matching circuit has been designed in the way to match the antenna to 50Ohm impedance. 26 Chapter 5. Typical Hardware Connection Figure 5.2: MatchX Core reference connec-

tion. Figure 5.3: RF cable size. Figure 5.4: MatchX Core antenna connection circuit. 5.4 Antenna connection 27 Figure 5.5: MatchX Core reference circuit. 6. Product specication The MatchX Core SoM is designed for enhanced LPWAN performance and manageability. In this chapter we briey introduce the specications for both hardware and software. 6.1 Hardware environment The Core Module is designed to make design process of smart connected LPWAN devices as easy as possible. It can be easily incorporated into existing solution or be a core controlling unit for new design. Together with MatchX Dev Kit hey help to kickstart your project by providing test and evaluation hardware for proof of concept and enable programmers to develop software before custom hardware is ready. Item MCU Memory Interfaces Wireless Battery Size Description DA14680, 0 Hz up to 96 MHz 32-bit ARM Cortex-M0 8Mb Flash, 64kB OTP, 128kB ROM, 144kB SRAM I2C, I2S, PCM, SPI, UART, GPIOs Bluetooth 4.1 and LoRa Li-poly battery charging and managing system 23 x 17.4 x 3mm Table 6.1: Key hardware specications

. 6.2 Software environment To facilitate an easy network deployment, we have included many software features, which include but are not limited to:

Open source SDK and software support 6.3 RF performance 29 Over The Air software update Mobile App for Android and iPhone smartphones Free cloud service for managing and visualizing sensors data 6.3 RF performance There are two RF systems in the module, which include Lora, and Bluetooth. In this section we briey introduce the performance of these systems. For Lora, both the "transmission" and "receive"

performance are listed in Table 6.2 and "Bluetooth" can be found in Table 6.3. Item TX Max RX Value

+18dBm down to -148dBm Table 6.2: Lora RF performance For Bluetooth is listed in Table 6.3. Item Output Power Sensitivity Value 0dBm

-94dBm Table 6.3: Bluetooth performance. 6.4 Electrical characteristics Min 2.7 Description Battery voltage Symbol VBAT T V3P3LDO Voltage output on the internal LDO VBAT T IV 3P3LDO VGPIO VBUS IBUS Top Current output of 3V3_SNR Voltage on any GPIO pin USB charging voltage USB charging current supply Operating Temperature 0 0 4.2

-40 Unit V V mA Max 4.2 3.3 100mA V3P3LDO V V 5.75 300 mA C

+85 Table 6.4: Operating Range. 6.5 Antenna characteristics The SoM module is equipped with two U.FL connectors: 2.4GHz for Bluetooth and one for 868MHz

(915MHz in US version) LoRa antenna. The parameters of the recommended antennas can be found in Table 6.6. It is recommended to use dipole antennas as they are less susceptible to ground plane size and are less prone to detuning by surrounding objects. 30 Chapter 6. Product specication Symbol Description IIDLE ISEND ISLEEP Current consumption, MCU awake, no RF activity Current consumption,sending LoRa packet Current consumption in sleep mode Min Max Unit mA mA A 10 75

<10 Table 6.5: Current consumption. Parameter Center Frequency Bandwidth Gain Type 2.4GHz antenna 2.44GHz 101MHz 3dBi Dipole 868MHz (EU version) 868MHz 40MHz 2.5dBi Dipole 915MHz (US version) 915MHz 40MHz 2.5dBi Dipole Table 6.6: Parameters of recommended antennas. 6.6 Dimensions Figure 6.1: Dimension of the SoM module, all dimensions in mm. 6.6 Dimensions 31 Figure 6.2: Recommended footprint (top view), all dimensions in mm. 7. Certication This section outlines the regulatory information for the MX1731 module for the following coun-

tries/regions:

United States EU 7.1 FCC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference.

(2) This device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unautho-

rized modications to this equipment. Such modications could void the users authority to operate 7.1 FCC the equipment. 33 This equipment complies with FCC radiation exposure limits set forth for an uncontrolled envi-

ronment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES The OEM must certify the nal end product to comply with unintentional radiators before declaring compliance of the nal product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. The OEM must comply with the FCC labeling requirements. If the modules label is not visible when installed, then an additional permanent label must be applied on the outside of the nished product which states:

Contains transmitter module FCC ID: 2AMPF-MX1731". Additionally, the following statement should be included on the label and in the nal products user manual:

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. The module is limited to installation in mobile or xed applications. Separate approval is required for all other operating congurations, including portable conguration with respect to Part 2.1093 and different antenna congurations. Professional installation:

When they have not been tested and granted in this manner, additional testing and/or FCC application ling may be required. The most straightforward approach to address additional testing conditions is to have the grantee responsible for the certication of at least one of the modules submit a permissive change application. When having a module grantee le a permissive change is not practical or feasible, the following guidance provides some additional options for host manufacturers. Integrations using modules where additional testing and/or FCC application ling(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR testing);

(B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together. This Module is limited modular approval, it is limited to OEM installation ONLY. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure compliance of the entire end product include the integrated Module. Additional measurements (15B) and/or equipment authorizations (e.g Verication) may need to be addressed depending on co-location or simultaneous transmission issues if applicable. (OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user of the nal host device. 34 7.1.1 Antenna information Chapter 7. Certication To maintain modular approval in the United States, only the antenna types that have been tested shall be used.It is permissible to use different antenna manufacturer provided the same antenna type and antenna gain (equal to or less than) is used. Testing of the MX1731 module was performed with the antenna types listed in Table 6.6. 7.2 CE RF exposure information: The Maximum Permissible Exposure (MPE) level has been calculated based on a distance of 20 cm between the device and the human body. To maintain compliance with RF exposure requirement, use product that maintain a 20cm distance between the device and human body. Hereby, MatchX GmbH declares that the radio equipment type MX1731 is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: www.matchx.io. 8. Important Notice The information contained herein is believed to be reliable. MatchX makes no warranties regarding the information contained herein. MatchX assumes no responsibility or liability whatsoever for any of the information contained herein. MatchX assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for MatchX products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. MatchX products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.