LoRa Concentrator Card GL5712 Datasheet Version: LoRa Concentrator_GL5712_Datasheet_V1.0.0 Date: 2018-07-12 Maxiiot Ltd. LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 Document Revision Record Version V1.0.0 Date Description 2018-07-12 Preliminary version Ming Copyright Notice All contents in the files are protected by copyright law, and all copyrights are reserved by Maxiiot Ltd. Without written permission, all commercial use of the files from Maxiiot are forbidden, such as copy, distribute,reproduce the files, etc., but non-commercial purpose, downloaded or printed by individual are welcome. Disclaimer Maxiiot Ltd reserves the right to change, modify or improve the document and product described herein . Its contents are subject to change without notice. These instructions are intended for you use at your own risk . Maxiiot Ltd www.maxiiot.com LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 Table of Contents 1. Description..............................................................................................................................................................1 1.1 Overview............................................................................................................................................................... 1 1.2 Product features....................................................................................................................................................1 1.3 Function block diagram.........................................................................................................................................2 2. Pin definition.......................................................................................................................................................... 3 2.1 Pin assignment...................................................................................................................................................... 3 2.2 Pin description.......................................................................................................................................................3 3. Specifications..........................................................................................................................................................5 3.1 General specifications...........................................................................................................................................5 3.2 Electric specifications............................................................................................................................................5 3.3 Absolute maximum rating.....................................................................................................................................6 3.4 Operating conditions.............................................................................................................................................6 4. Typical hardware connections............................................................................................................................... 8 4.1 Physical dimensions.............................................................................................................................................. 8 4.2 Reference Circuit...................................................................................................................................................8 4.3 Interfaces...............................................................................................................................................................9 4.3.1 Interface to host MCU........................................................................................................................................9 4.3.2 Power pins..........................................................................................................................................................9 4.3.3 RF connection.....................................................................................................................................................9 4.3.4 RESET pin............................................................................................................................................................9 4.3.5 GPS_PPS............................................................................................................................................................. 9 4.3.6 RF enable............................................................................................................................................................9 5. Reliability test and approves............................................................................................................................... 10 6. Package.................................................................................................................................................................10 7. Contact Us.............................................................................................................................................................10 Maxiiot Ltd www.maxiiot.com LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 1. Description 1.1 Overview GL5712 is a LoRa concentrator card with industrial standard mini PCI express form factor based on SX1301 chipset and 2*SX1257 RF end-front . This mPCIe module can be used in any embedded platform offering a free mPCIe slot with USB/SPI connectivity and capable of providing enough power for the module, enables low-power wide area communication capabilities to your new gateway design or existing industrial routers/computer. Each module support eight(8) programmable Lora parallel demodulation channels, allowing it to receive up to eight LoRa modulated packets simultaneously. -142.5dBm high sensitivity combine with 17.5dBm power amplifer yields industry leading link budget making it optimal for applications requiring extended range and robustness. Typical applications Automated Meter Reading Home and Building Automation Wireless Alarm and Security Systems Industrial Monitoring and Control Machine to Machine (M2M) Internet of Things (IoT) GL5712 LoRa concentrator cards are available in four product variants NO. Model 1 2 3 4 GL5712-EX GL5712-UX GL5712-EA GL5712-UA Description 863~870MHz IPEX connector,is mainly designde for operation in Europe and other countries. 902~928MHz IPEX connector,is mainly designed for operation in America south-east Asia. 863~870MHz SMA connector,is mainly designde for operation in Europe and other countries. 902~928MHz SMA connector,is mainly designed for operation in America south-east Asia. Remark Table1.1 Product variants 1.2 Product features Multichannel: Eight(8) programmable Lora parallel demodulation channels. SPI Interface:The SPI interface gives access to the configuration register of SX1301 via a synchronous full-duplex protocol. USB2.0 Interface: Build in FT232H chip convert SPI interface of SX1301 to USB2.0 . Compact mini PCI express form factor TYP. 50.8*30.3*4.7mm (W*L*H) Environmentally friendly RoHS compliant Compliance:
- US Version (GL5712-U): Certified to FCC Modular Transmitter Standards
- EU Version (GL5712-E): Certified to CE Modular Transmitter Standards Maxiiot Ltd 1 www.maxiiot.com 1.3 Function block diagram LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 Maxiiot Ltd 2 www.maxiiot.com 2. Pin Definition 2.1 Pin assignment LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 2.2 Pin description Symbol No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 NC
+3.3V NC GND NC NC NC NC GND NC NC NC NC NC GND NC NC GND Type N/A Supply input N/A GND N/A N/A N/A N/A GND N/A N/A N/A N/A N/A GND N/A N/A GND Description Not connected (Default) Supply voltage to the engine board. Not connected (Default) Ground Not connected (Default) Not connected (Default) Not connected (Default) Not connected (Default) Ground Not connected (Default) Not connected (Default) Not connected (Default) Not connected (Default) Not connected (Default) Ground Not connected (Default) Not connected (Default) Ground Maxiiot Ltd 3 www.maxiiot.com LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 NC NC GND
/Reset NC
+3.3V NC GND GND NC GND NC NC NC NC GND GND N/A N/A GND Reset input N/A Suupply input N/A GND GND N/A GND N/A N/A N/A N/A GND GND USB_DM USB Data Line D-
GND USB_DP
+3.3V GND
+3.3V NC GND NC SCK GPS_IN MISO NC MOSI GND CSN
+3.3V GND USB Data Line D+
Supply inout GND Supply inout N/A GND N/A Host SPI interface GPS_IN Host SPI interface N/A Host SPI interface N/A Host SPI interface Supply inout Not connected (Default) Not connected (Default) Ground Reset Module, Active-low device Reset input Not connected (Default) Main power supply to the engine board. Not connected (Default) Ground Ground Not connected (Default) Ground Not connected (Default) Not connected (Default) Not connected (Default) Not connected (Default) Ground Ground USB Data Signal Minus Ground USB Data Signal Plus Main power supply to the engine board. Ground Main power supply to the engine board. Not connected (Default) Ground Not connected (Default) SPI interface GPS pps in SPI interface Not connected SPI interface Ground SPI interface Main power supply to the engine board. Table 2.1 Pin definition Maxiiot Ltd 4 www.maxiiot.com LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 3. Specifications 3.1 General specifications Parameters Modulation type LoRa chipset Multi-channel Package Host interface Frequency Receiving sensitivity Tx power Communication range Supply voltage Power consumption Description ISM Band LoRa SX1301 Eight (8) uplink , one (1) down link Mini PCI express USB/SPI 863~870MHZ, 902~928MHZ(Opt.)
-142.5dBm dBm 17.5 3~5KM in urban area , >15KM line-of-sight
+3.3V Tx(Max)<700mA Rx <200mA
-40+85 (industrial grade) 10%90%, no-condensing TYP. 50.8*30.3*4.5mm (W*L*H) JEDEC JS-001 Standard 1kV, Class 2 Operating temperature Operating humidity Dimensions ESD (Human Body Model) Table3.1 General specification 3.2 Electric specifications ESD Notice: GL5712 is a high performance radio frequency device. It satisfies:
Class 2 of the JEDEC standard JESD22-A114 (Human Body Model) on all pins. Class III of the JEDEC standard JESD22-C101 (Charged Device Model) on all pins It should thus be handled with all the necessary ESD precautions to avoid any permanent damage. The limiting values given are in accordance with the Absolute Maximum Rating System . Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only, and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to these limits for extended periods may affect device reliability. Maxiiot Ltd 5 www.maxiiot.com 3.3 Absolute maximum rating Symbol 3.3Vaux USB SPDT_SEL RESET SPI GPS_PPS Description Module supply voltage USB D+/D- pins Port select MPCI reset input SPI interface GPS 1 pps input Rho_ANT Antenna ruggedness Tstg Storage Temperature Table3.2 absolute maximum rating LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 Condition Input DC voltage at 3.3Vaux pins Input DC voltage at USB interface pins Input DC voltage at SPDT_SEL input pins Input DC voltage at RESET input pin Input DC voltage at SPI interface pin Input DC voltage at GPS_PPS input pin Output RF load mismatch ruggedness at ANT1 Min 0.3 0.3 0.3 0.3 0.3 40 Max. Unit 3.6 3.6 3.6 3.6 3.6 3.6 10:1 85 V V V V V V VSWR C Stressing the device beyond the Absolute Maximum Ratings may cause permanent damage. The product is not protected against over-voltage or reversed voltages. If necessary, voltage spikes exceeding the power supply voltage specification, given in table above, must be limited to values within the specified boundaries by using appropriate protection diodes. 3.4 Operating conditions All specifications are at an ambient temperature of 25 C. Extreme operating temperatures can significantly impact specification values. Applications operating near the temperature limits should be tested to ensure the specification. Parameter Min. Typ Max. Unit Remarks Normal operating temperature Extended operating temperature Storage Temperature Table3.3 operating temperature range
-20
-40
-40
+25
+65
+85
+125 C C C fully functional and meet 3GPP specifications RFperformancemaybeaffected byoutside normal operating range Operating beyond the specified operating conditions can affect device reliability. Symbol 3.3Vaux Parameter operating supply voltage Min. 3.00 Typical 3.30 Max. 3.60 Unit V Table3.4 Operating power supply range Operating beyond the specified operating conditions can affect device reliability. Maxiiot Ltd 6 www.maxiiot.com Item Parameter Transmit Frequency Transmit Frequency Transmit Power Frequency Deviation Receiving Sensitivity TX RX Table3.5 RF receiver characteristics LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 MIN 863 902 SPEC TYP
+27 12.5
-142.5 MAX 870 928
+30 Unit MHz MHz dBm KHz dBm Condition ISM Band(GL5712-E) ISM Band(GL5712-U) Including ANT Gain 25 GL5712 series LoRa RF characteristics are specified in the SX1257series Data Sheet . Mode Condition Min RF Idle Rx active Tx active Table3.6 Current consumption All of the chip on the board enter idle mode or shutdown. TX disabled and shutdown PA. The power of TX channel is 17.5dBm and 3.3V supply. Typ 70 120 520 Max Unit uA 185 mA 700 mA Maxiiot Ltd 7 www.maxiiot.com 4. Typical Hardware Connections 4.1 Physical dimensions LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 Length 50.8 Width 30.3 Thickness 4.7 Unit mm Remark Item Dimensions Table4.1 dimensions 4.2 Reference Circuit Maxiiot Ltd 8 www.maxiiot.com LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 4.3 Interfaces Reference circuit design shows the typical hardware connections for the module. Interfacing to the module requires connecting to the signals provided on the GL5712 mPCIe connector as listed in pin description. Specific interface connections are discussed in this chapter. 4.3.1 Interface to host MCU SPI interface A SPI interface is provided on the PCIe_SCK, PCIe_MISO, PCIe_MOSI, PCIe_CSN pins of the system connector. The SPI interface gives access to the configuration register of SX1301 via a synchronous full-duplex protocol. Only the slave side is implemented. USB interface GL5712 series modules support high speed USB interface with a built in TF232H chip convert SPI to USB, can be connected to any USB host equipment with compatible drivers. The module can uses the USB signals through the mPCIe interface. 4.3.2 Power pins GL5712 series modules has multiple power and ground pins available on the mPCIe connector. It is recommended that all power and ground pins be used when connecting to the module. 4.3.3 RF connection GL5712 series modules have a U.FL connector for interfacing with an external antenna. For proper operation, antenna selection must consider frequency band and impedance. 4.3.4 RESET pin GL5712 series modules have an active-low reset input. Pulling this signal low during normal operation will cause the module to execute a reset cycle. 4.3.5 GPS_PPS GL5712 series modules include a GPS_PPS input used to receive time-stamped packets. 4.3.6 RF enable GL5712 series modules have an input signal used to enable the RF radio on the module. A low level on the RF_ENABLE pin will disable all RF transmission and reception. Maxiiot Ltd 9 www.maxiiot.com 5. Reliability Test and Approves Tests for product family qualifications are according to ISO 16750 "Road vehicles Environmental conditions and testing for electrical and electronic equipment, and appropriate standards. LoRa Concentrator Card_GL5712_Datasheet_V1.0.0 Products marked with this lead-free symbol on the product label comply with the "Directive 2002/95/EC and Directive 2011/65/EU of the European Parliament and the Council on the Restriction of Use of certain Hazardous Substances in Electrical and Electronic Equipment" (RoHS). All Maxiiot GL5712 modules are RoHS compliant. Compliance(Pending):
- US Version (GL5712-U): Certified to FCC Modular Transmitter Standards
- EU Version (GL5712-E): Certified to CE Modular Transmitter Standards 6. Package Module GL5712 Form Trays Package QTY Size Article number As required As required Undetermined Table6.1 package 7. Contact Us Maxiiot Ltd Web: www.maxiiot.com Tel:+86-755-2645-9429 Fax: +86-755-2947-6513 Office address : Room 302,3F, No. 16, Lane 1,Liuxian No.2 Road,Baoan District. 518100 Shenzhen, China Maxiiot Ltd 10 www.maxiiot.com Antenna Type:Cylindrical Antenna Antenna Gain(Peak):5 dBi Federal Communication Commission Statement (FCC, U.S.) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. IMPORTANT NOTES Co-location warning:
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. OEM integration instructions:
This device is intended only for OEM integrators under the following conditions:
The transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the external antenna(s) that has been originally tested and certified with this module. As long as the conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Validity of using the module certification:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End product labeling:
The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ARPP-GL5712UX Information that must be placed in the end user manual:
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. FCC Radiation Exposure Statement:
FCC Radiation Exposure Statement:
FCC Radiation Exposure Statement:
FCC Radiation Exposure Statement:
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an This equipment complies with FCC radiation exposure limits set forth for an This equipment complies with FCC radiation exposure limits set forth for an This equipment complies with FCC radiation exposure limits set forth for an This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated uncontrolled environment. This equipment should be installed and operated uncontrolled environment. This equipment should be installed and operated uncontrolled environment. This equipment should be installed and operated uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. with minimum distance 20cm between the radiator & your body. with minimum distance 20cm between the radiator & your body. with minimum distance 20cm between the radiator & your body. with minimum distance 20cm between the radiator & your body. Antenna Type:Cylindrical Antenna Antenna Gain(Peak):5 dBi