MEDS Technologies Bluetooth Module64 Datasheet V0.8 MEDs Bluetooth Module 64 Technical Specifications July 2012 Copyright 2012 by MEDs Technologies Pte Ltd. All Rights Reserved. CONFIDENTIAL 2nd-July-2012 1/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 Revision Note Version Number 0.8 Revised Date 2012-07-03 Descriptions Draft release Revised By Gerald Ling CONFIDENTIAL 2nd-July-2012 2/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 Contents 1. INTRODUCTION........................................................................................................................................................... 4 2. PACKAGE INFORMATION ........................................................................................................................................ 5 2.1 SIGNAL LAYOUT (TOP VIEW) ................................................................................................................. 5 2.2 PIN DESCRIPTIONS..................................................................................................................................... 6 3. FUNCTIONAL FEATURES.......................................................................................................................................... 7 3.1 APPLICATION BLOCK DIAGRAM........................................................................................................... 7 3.2 HARDWARE INTERFACE ......................................................................................................................... 8 3.2.1 UART Interface ................................................................................................................. 8 3.2.2 USB Interface ........................................................................................................................... 10 3.2.3 Codec Digital Interface............................................................................................................. 11 3.2.4 I2C/SPI Interface...................................................................................................................... 12 3.2.5 Wi-Fi Co-existence Interface13 3.2.6 JTAG Interface.....14 4. ELECTRICAL SPECIFICATION........................................................................................................................... 15 4.1 ABSOLUTE MAXIMUM RATINGS...........................................................................................................15 4.2 RF CHARACTERISTIC ............................................................................................................................. 15 5. PCB LAYOUT RECOMMENDATION...................................................................................................................... 16 6. SMT AND BAKING RECOMMENDATION............................................................................................................ 17 6.1 BAKING RECOMMENDATION .............................................................................................................. 17 6.2 SMT RECOMMENDATION.......................................................................................................................17 7. ORDERING INFORMATION.................................................................................................................................... 17 8. FCC STATEMENT18 CONFIDENTIAL 2nd-July-2012 3/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 1. INTRODUCTION OVERVIEW MEDs Bluetooth Module 64 integrates Toshiba Bluetooth V4.0+BLE LSI TC35661, RF antenna circuit, reset circuit and EEPROM to provide a fully functional Bluetooth compliant solution. There are various Bluetooth profiles can be supported by mounting different profile mask chip. The module can be standalone or controlled by an external microcontroller through UART or USB interface. Toshiba chip supports HCI commands and proprietary TCU command for Bluetooth connectivity control. GENERAL FEATURES Chipset : Toshiba Bluetooth version 4.0 + EDR + LE chip Firmware : SPP Profile ROM + Customer Application (EEPROM) Radio Frequency : 2402 MHz ~2480 MHz Data Rate : 2-3Mbps with EDR Hardware Interface :
USB conforms to Full-Speed 12Mbps of USB spec. 2.0 GPIOs Up to 19 pins (16 with Interrupt) I2C EEPROM Interface and external IC. UART Up to 2.7Mbps, RTS/CTS support. JTAG for debugging Transmitter Power : Class 2 (typical 2dBm) Transmission Range : Up to 10 meters Receiver Sensitivity : 90dBm WiFi co-existence Interface : 2-wire,3-wire and 4-wire Operating Temperature : -40C to 80C DC Supply Range : 2.7V ~ 3.6V (Single input) Max Power Consumption : ~73mA Dimension : 28.45 x 15 x 2 (mm) Weight : ~1.2g Module FCC ID : OIKMBTM64 Certifications : BQB (In Progress) CONFIDENTIAL 2nd-July-2012 4/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 2. PACKAGE INFORMATION 2.1 SIGNAL LAYOUT (TOP VIEW) CONFIDENTIAL 2nd-July-2012 5/18 Name A3V3 AGND GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 D3V3 DGND GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 DGND USBDM USBDP DGND TCK TDO TRTCK TRSTX TDI TMS Analog power supply, internally connected to digital power supply. Analog signal ground, internally connected to digital signal ground. General purpose IO with interrupt. General purpose IO with interrupt. PCMOUT General purpose IO with interrupt. PCMIN General purpose IO with interrupt. PCMCLK General purpose IO with interrupt. FSYNC for PCM General purpose IO with interrupt. TX for UART General purpose IO with interrupt. RX for UART Digital power supply, the only power supply needed Digital signal ground. General purpose IO with interrupt. RTS for UART General purpose IO with interrupt. CTS for UART Type/Application Description Power Ground IO/INT IO/INT/PCM IO/INT/PCM IO/INT/PCM IO/INT/PCM IO/INT/UART IO/INT/UART Power Ground IO/INT/UART IO/INT/UART IO/INT/WIFI-coex General purpose IO with interrupt. BT-Activity for Wifi-Coex IO/INT/WIFI-coex General purpose IO with interrupt. BT-State for Wifi-Coex IO/INT/WIFI-coex General purpose IO with interrupt. Wifi-Activity for Wifi-Coex IO/INT/WIFI-coex General purpose IO with interrupt. BT-Inband for Wifi-Coex IO/INT/I2C/SPI IO/INT/I2C/SPI IO/INT IO/INT IO/INT Ground USB USB Ground JTAG JTAG JTAG JTAG JTAG JTAG MEDS Technologies Bluetooth Module64 Datasheet V0.8 2.2 PINOUT DESCRIPTIONS No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 CONFIDENTIAL General purpose IO with interrupt. SCL or SCLK for SPI General purpose IO with interrupt. SDA or DOUT for SPI General purpose IO. DIN for SPI General purpose IO. CS0X chip select 0 for SPI General purpose IO. CS1X chip select 1 for SPI Digital signal ground. USB data line D-
USB data line D+
Digital signal ground. JTAG clock input signal JTAG data output JTAG return clock signal JTAG reset JTAG data input JTAG mode select 2nd-July-2012 6/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 3. FUNCTIONAL FEATURES 3.1 APPLICATION BLOCK DIAGRAM The Module 64 supports different profiles that can be used in each type of application from PC peripherals, car audio, medical, etc. Some examples of application are featured below. Figure 3.1.1: HID Profile PC Peripherals Figure 3.1.2: HID/HCI/SPP Profile Smart TV Accesorries Figure 3.1.3: HDP Profile Health Devices Monitoring CONFIDENTIAL 2nd-July-2012 7/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 3.2 HARDWARE INTERFACE 3.2.1 UART Interface The UART interface has the following features Operation Voltage : 1.8V or 3.3V Full-duplex 4 wire data transfer : Rx,Tx, RTS, CTS. Programmable baudrate : Up to 2.7Mbps Data Format (No parity bit) ; LSB first. o Start bit (1 bit) o Data bit (8-bit) o Stop bit (1 bit) Error Detection : Character timeout, Overrun error, Framing error The UART pins can be used as general purpose IOs. Software shall set the UART interface upon power up or after reset. Figure 3.2.1a: Connection of UART Figure 3.2.1b: UART Data Frame CONFIDENTIAL 2nd-July-2012 8/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 The UART interface has a programmable baud rate function. The baud rate can be set acoording to the following equation. The baud rate generating clock frequency is set to be either 39MHz or 52MHz. The over-sampling number is set to an integer that ranges from 12 to 17. The diving ratio is an integer that ranges from 1 to 65,535. Table 3.2.1 shows examples of UART baud rate setting. The maximum value of actual baud rate is 4.333333Mbps. If the other target baud rates are required, please connect our engineering for support. Target baud rate
[bps]
Over-sampling number Actual baud rate [bps]
Deviation [%]
Diving ratio 115,200 115,200 921,600 921,600 1,843,200 2,764,800 116,071 116,071 928,571 928,571 1,875,143 2,785,714 Baud rate generating clock frequency [MHz]
39 52 39 52 52 39 12 14 14 14 14 14
+0.7564
+0.7564
+0.7564
+0.7564
+0.7564
+0.7564 28 32 4 2 2 1 CONFIDENTIAL 2nd-July-2012 9/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 3.2.2 USB Interface The USB interface of Module 64 has the following features that compliant with USB 2.0 full speed. Operation Voltage : 3.3V Compliant with USB 2.0 Full speed specification Supports four types of transfer modes (Control, Interrupt, Bulk, Isochronous), Support also dual packet mode (Bulk transfer mode, Isochronous transfer mode0 Includes 6 end points (EP0 to EP5) o EP0: Control transfer mode (IN, OUT) o EPI: Interrupt transfer mode (IN) o EP2: Bulk transfer mode (IN) o EP3: Bulk transfer mode (OUT) o EP4: isochronous transfer mode (IN) o EP5: Isochtroous transfer mode (OUT) Support suspend and resume function Supports remote wakeup function. The IN, OUT indicates the USB transfer direction from USB host. USB Ready and data line resistors are on the BT Module 64, data lines can be directly connected to external USB host. CONFIDENTIAL Figure 3.2.2a: Connection of USB 2nd-July-2012 10/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 3.2.3 Digital Codec Interface The main features of the digital codec are as the following. Operation Voltage : 1.8V or 3.3V Data format : A-law, u-law, linear PCM Frame format : MSB left-justified, I2S, PCM digital Frame frequency : 8kHz, 16kHz Data length : 8bit, 16bit Bit clock function : Master, slave Data sampling edge : Rise and fall edges Fame syschronization signal polarity : High active and low active Built-in CODEC :
o CVSD (Continous variable slope delta modulation) o PCM (Pulse code modulation) o mSBC (Modified sub-band CODEC for wide-band speech) Figure 3.2.3a: Connection of Digital Codec IC when Module 64 as Master/Slave for bit clock Frame Sync Freq [kHz]
# of bit clock [FS]
8 16 50 52 100 130 250 8 16 32 64 128 50 130 250 32 64 128 Bit clock frequency switching No Yes No Yes CONFIDENTIAL Bit clock frequency for a short cycle time
[kHz]
400 416 800 1040 2000 64.20 128.71 257.3 520.00 1040 800 2080 4000 509.80 1040 208 Bit clock frequency for a long cycle time [kHz]
63.88 127.45 254.90 5000.00 1000.00
514.85 1000.00 2000.00 Usage 2nd-July-2012 11/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 Table 3.2.3: Example of bit clock frequency in a master mode 3.2.4 Serial Memory Interface The serial memory interface can be selected as I2C or SPI bus interface that has the following features Operation Voltage : 1.8V or 3.3V Interface mode ; I2C bus, SPI o SPI Interface Operation mode : SPI Master Chip select : 2 channels Chip select polarity : High active, low active Serial clock frequency : 76.47kHz 19.5MHz (CPU 39Hz) 101.96kHz 26MHz (CPU 52MHz) Serial data transfer mode : MSB first, LSB first. Interface mode ; I2C bus, SPI o I2C Interface Operation mode : I2C Master Clock frequency : Standard mode (100kHz or less) Fast mode (400Hz or less) Output mode: Open drain output, CMOS output. Pull up resistors Device address format: 7 bit address. Figure 3.2.4a: Connection of Exernal Flash/EEPROM and other I2C Device There are 2 I2C EEPROM already available on Module 64. One EEPROM is mandatory for storing of unique Bluetooth device address for each module. The 2nd EEPROM is optional. Figure 3.2.4b: Connection of External Serial Flash/EEPROM and order Serial devices CONFIDENTIAL 2nd-July-2012 12/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 3.2.5 Wi-FI Co-Existance Interface This interface is used for collocation with other Wi-Fi devices in a same system. It supports the following Operation Voltage : 1.8V or 3.3V Mode ; 2-wire, 3-wire and 4-wire Figure 3.2.5: Connection of Example of Wi-Fi Co-ex for 2,3 and 4 Wire modes CONFIDENTIAL 2nd-July-2012 13/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 3.2.6 JTAG Interface The Module 64 supports JTAG interface for debugging and testing. Operation Voltage : 1.8V or 3.3V Chip boundary test function ICE interface CONFIDENTIAL Figure 3.2.6: Connection of JTAG with ICE 2nd-July-2012 14/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 4. ELECTRICAL SPECIFICATIONS 4.1 ABSOLUTE MAXIMUM RATINGS Item Symbol Power Supply Input Voltage Output Voltage Input Current Storage Temperature D3V3 A3V3 VIN VOUT IIN
Min
-0.3
-0.3
-0.3
-0.3
-10
-40 Max Ratings
+3.9
+3.9 D3V3+0.3 D3V3+0.3
+10
+125 Table 4.1: Absolute Maximum Ratings (DGnd, AGnd = 0V) Unit V V V V mA oC 4.2 RF CHARACTERISTIC Measuring conditions:
Ambient Temperation Ta = 25 oC. Power input : 3.3V F = 2441Mhz (RF channel = Channel 39) Clock frequency = 26 MHz (+/-2ppm) Item Symbol Conditions Value Typical Max
-85 Unit dBm Min
-20
-10
dBm Rx Sensitivity Sense1 Maximum Input range MaxRange1 Bit error rate 0.1%
F=2402, 2441, 2480 MHz Item Symbol Conditions Table 4.2.1: RF Rx Characteristic (Basic Rate) Tx Output Level Frequency Range CONFIDENTIAL PAOUT1 Frange f=2402, 2441, 2480 MHz Value Typical
+2.0
Min
2400 Max
2483.5 Unit dBm MHz Table 4.2.2: RF Tx Characteristic (Basic Rate) 2nd-July-2012 15/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 5. PCB LAYOUT RECOMMENDATION Figure 5.1 show the recommended solder pad layout to mount the Module 64. The height of the module is around 3mm. There should be no ground plane or signal under the antenna area highlighted. Figure 5.1: Solder Pad for Module 64 CONFIDENTIAL 2nd-July-2012 16/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 6. SOLDERING RECOMMENDATIONS 6.1 Baking Recommendation Baking condition Follow MSL Level 4 to do baking process. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be Mounted within 72 hours of factory conditions <30C/60% RH, or Stored at
<10% RH. Devices require bake, before mounting, if Humidity Indicator Card reads >10%
If baking is required, Devices may be baked for 4 hrs at 100 C. 6.2 SMT Recommendation No. 1 2 3 Item Pre-heat Soldering Peak=temperature Temperature (oC) Time (sec) D1: 140~D2:200 D2 : = 220 T1 : 80~120 T2 : 60 +/- 10 D3 : 250 oC max Figure 6.2.1: Reflow Soldering Profile 1. 2. Add Nitrogen while reflow process: SMT solder ability will be better. It is recommended to do reflow soldering for maximum two times. 7. ORDERING INFORMATION Part Number : MBTM64-x : Module 64, where x refers to 0: HCI ; 1: SPP ; 2 : HID ; 3 : BLE ; 4 : HDP CONFIDENTIAL 2nd-July-2012 17/18 MEDS Technologies Bluetooth Module64 Datasheet V0.8 8. FCC STATEMENT This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Caution: Any changes or modifications not expressly approved by the party responsible for compliance to this equipment would void the users authority to operate this device. Note :
1. This module is intended for end-user installation. The end-user or installer is still responsible for the FCC compliance requirement of the end product, which integrates this module. The host end product must also pass the FCC Part 15 unintentional emission testing requirement and be properly authorized per FCC Part 15. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. 2. The built-in antenna is integrated to the module and no other antenna should be used. 20cm minimum distance has to be able to be maintained between the antenna and all persons. 3. This module must not be co-located or jointly operated with any other antenna or transmitter 4. A label should be attached to the host end product in a visible area with the following statement: Contains Transmitter Module FCC ID: OIKMBTM64 or Contains FCC ID:
OIKMBTM64. within host. End of document. CONFIDENTIAL 2nd-July-2012 18/18