| submitted | available | document details (if available) | source link |
|---|---|---|---|
| October 26 2019 | October 26 2019 |
| various | User Manual | Users Manual | 4.02 MiB | October 26 2019 |
SLM756P User Manual Released Date2019/3 File name SLM756P User Manual Version NumberV1.00 CompanyMeiG Smart Technology Co., Ltd MeiG Smart Technology Co., Ltd 2 IMPORTANT NOTICE COPYRIGHT NOTICE Copyright MeiG Smart Technology Co., Ltd. All rights reserved. All contents of this manual are exclusively owned by MeiG Smart Technology Co., Ltd(MeiG Smart for short), which is under the protection of Chineselawsandcopyrightlaws in international conventions. Anyone shall not copy, spread, distribute, modify or use in other ways with the written authorization of MeiG Smart. Those whoviolatedwillbe investigated by corresponding legal liability in accordance with the law. its contents without NO GUARANTEE MeiG Smart makes no representation or warranty, either express or implied, for any content in this document, and will not be liable for any specific merchantability and applicable or any indirect,particular and collateral damage. CONFIDENTIALITY All information contained here (including any attachments) is confidential. The recipient acknowledges the confidentiality of this document, and except for the specific purpose, this document shall not be disclosed to any third party. DISCLAIMER MeiG Smart will not take any responsibility for any property and health damage caused by the abnormal operation of customers. Please develop the product according to the technical specification and designing reference guide which defined in the product manual. MeiG Smart have the right to modify the document according to technical requirement with no announcement to the customer. 3 SLM756P_Hardware Design Guide_V1.00 4 Foreword Thank you for using the SLM756P module from Meg Smart. This product can provide data communication services. Please read the user manual carefully before use, you will appreciate its perfect function and simple operation method. The company does not assume responsibility for property damage or personal injury caused by improper operation of the user. Users are requested to develop the corresponding products according to the technical specifications and reference designs in the manual. Also pay attention to the general safety issues that mobile products should focus on. Before the announcement, the company has the right to modify the contents of this manual according to the needs of technological development. 5 1. Introduction ................................................................................................................................................................ 9 2. Module Overview ...................................................................................................................................................... 9 2.1 Summary of features ........................................................................................................................................ 9 2.2 Block diagram ................................................................................................................................................ 12 3. Module Encapsulation ............................................................................................................................................. 13 3.1 Pin distribution diagram ................................................................................................................................. 13 3.2 Pin definitions ................................................................................................................................................ 14 3.3 Mechanical Dimensions ................................................................................................................................... 1 4. Interface Application.................................................................................................................................................. 4 4.1 Power Supply ................................................................................................................................................... 4 4.1.1 Power Pin .............................................................................................................................................. 5 4.2 Power on and off ............................................................................................................................................. 6 4.2.1 Module Boot ......................................................................................................................................... 6 4.2.2 Module Shutdown ................................................................................................................................. 7 4.2.3 Module Reset ........................................................................................................................................ 7 4.3 VCOIN Power .................................................................................................................................................. 8 4.4 Power Output ................................................................................................................................................... 9 4.5 Serial Port ...................................................................................................................................................... 10 4.6 MIPI Interface ................................................................................................................................................ 12 4.6.1 LCD Interface ..................................................................................................................................... 12 4.6.2 MIFI camera Interface ........................................................................................................................ 14 4.7 Resistive Touch Interface ............................................................................................................................... 17 4.8 CapacitiveTouch Interface ............................................................................................................................. 17 4.9 Audio Interface .............................................................................................................................................. 18 4.9.1 Receiver Interface Circuit .................................................................................................................. 19 4.9.1 Microphone receiving Circuit ............................................................................................................. 19 4.9.2 Headphone Interface Circuit ............................................................................................................... 19 4.9.4 Speaker Interface Circuit ................................................................................................................... 20 4.9.5 I2S Interface ....................................................................................................................................... 21 4.10 USB Interface .............................................................................................................................................. 21 4.10.1 USB OTG ......................................................................................................................................... 22 4.11 Charging Interface ........................................................................................................................................ 23 4.11.1 Charging Detection ........................................................................................................................... 23 4.11.2 Charge Control ................................................................................................................................. 23 4.11.3 BAT _THERM ................................................................................................................................. 23 4.12 UIM Card Interface ...................................................................................................................................... 24 4.13 SD Card Interface ........................................................................................................................................ 24 4.14 I2C Bus Interface ........................................................................................................................................ 25 4.15 Analog to Digital Converter (ADC) ............................................................................................................ 25 4.16 PWM ............................................................................................................................................................ 25 4.17 Motor ........................................................................................................................................................... 26 4.18 Antenna Interface ........................................................................................................................................ 26 4.18.1 Main Antenna .................................................................................................................................. 26 4.18.2 DRX Antenna .................................................................................................................................. 27 4.18.3 GPS Antenna .................................................................................................................................... 28 4.18.4 WiFi/BT antenna .............................................................................................................................. 29 5. PCB Layout ............................................................................................................................................................. 30 5.1. Module PIN distribution ............................................................................................................................... 30 5.2. PCB layout principles ................................................................................................................................... 30 5.2.1. Antenna .............................................................................................................................................. 31 5.2.2 Power supply ....................................................................................................................................... 31 5.2.3. SIM card ............................................................................................................................................ 31 5.2.4. MIPI ................................................................................................................................................... 32 5.2.5. USB .................................................................................................................................................... 32 5.2.6.Audio .................................................................................................................................................. 32 5.2.7. Other .................................................................................................................................................. 33 6 6. Electrical & Reliability ............................................................................................................................................ 33 6.1 Absolute Maximum ........................................................................................................................................ 33 6.2 Working Temperature ..................................................................................................................................... 33 6.3 Working Voltage............................................................................................................................................. 34 6.4 Digital Interface Features ............................................................................................................................... 34 6.5 SIM_VDD Characteristics ............................................................................................................................. 34 6.6 PWRKEY Feature .......................................................................................................................................... 34 6.7 VCOIN Feature .............................................................................................................................................. 35 6.8 Current Consumption (VBAT = 3.8V) ........................................................................................................... 35 6.9 Electrostatic Protection .................................................................................................................................. 36 6.10 Module Operating Frequency Band ............................................................................................................. 36 6.11 RF Characteristics ........................................................................................................................................ 37 6.12 Module Conduction Receiving Sensitivity .................................................................................................. 37 6.13 WIFI Main RF Performance ........................................................................................................................ 39 6.14 BT Main RF Prformance ............................................................................................................................. 40 6.15 GNSS Main RF Performance ....................................................................................................................... 40 7. Production ................................................................................................................................................................ 41 7.1. Top And Bottom Views Of The Module ....................................................................................................... 41 7.2. Recommended Soldering Furnace Temperature Curve ................................................................................ 41 7.3. Humidity Sensitivity (MSL) ......................................................................................................................... 41 7.4. Baking Requirements .................................................................................................................................... 42 8. Support Peripheral Device List ................................................................................................................................ 42 9. Appendix .................................................................................................................................................................. 44 9.1. Related Documents ....................................................................................................................................... 44 9.2. Terms And Explanations ............................................................................................................................... 44 9.3. Multiplexing function ................................................................................................................................... 46 9.4. Safety Warning .............................................................................................................................................. 47 10. OEM/Integrators Installation Manual .................................................................................................................... 48 10.1. List of applicable FCC rules ....................................................................................................................... 48 10.2. Summarize the specific operational use conditions .................................................................................... 48 10.3. Limited module procedures ........................................................................................................................ 48 10.4. Trace antenna designs ................................................................................................................................. 48 10.5. RF exposure considerations ........................................................................................................................ 48 10.6. Antennas ..................................................................................................................................................... 48 10.7. Label and compliance information ............................................................................................................. 49 10.8. Information on test modes and additional testing requirements ................................................................. 49 10.9. Additional testing, Part 15 Subpart B disclaimer ........................................................................................ 49 7 Version History Date 2019-6 Version 1.00 Change description First edition Author Zheng Lei 8 1. Introduction This document describes the hardware application interface of the module, including the circuit connections and RF interfaces of the relevant applications. It can help users quickly understand the module's interface definition, electrical performance and structural size details. Combined with this and other application documents, users can quickly use modules to design mobile communication applications. 2. Module Overview The SLM756P module uses the Qualcomm MSM8909 platform solution, the MSM8909 processor is manufactured in a 28nm LP CMOS process, the quad core clocked at 1.1GHz, and the memory supports 8GB+1GB (compatible with 16GB+2GB) LPDDR3. The chip can support WCDMA, FDD-LTE and other standards, and is a highly integrated product. The working frequency bands that the SLM756P module can support are:
FDD-LTE: B2/4/5/7/12/13/17 WCDMA: B2/4/5 The physical interface of the module is a 210-pin pad that provides the following hardware interfaces:
Two serial ports, including one four-wire serial port and one two-wire serial port. LCM (MIPI interface). Two-way Camera interface (MIPI data). A high-speed USB interface. Three audio input interfaces. Three-channel audio output interface. Two-way UIM card interface. GPIO interface. Four sets of I2C interfaces. A set of SPI interfaces. A TF card interface. Support GNSS, WiFi, Bluetooth4.1, FM function. 2.1 Summary of features Table 2.1SLM756P features Product characteristics Description Plateform Qualcomm MSM8909 CPU Quad-core A7 (32bit) 1.1GHz 9 GPU A304 409.6MHz System memory 8GB eMMC + 1GB LPDDR3/16GB eMMC + 2GB LPDDR3 OS Size Android 5.1/ Android 7.1 44.0x39.0x3.0mm LCC+LGA130pin SLM756P Network band
-NA
(North America) FDD-LTE: B2/4/5/7/12/13/17 WCDMA: B2/4/5 Wi-Fi IEEE 802.11a/b/g/n 2.4G&5G Bluetooth BT4.1 Support GPS/Beidou/Glonass TDD-LTE FDD-LTE DC-HSPA+
TD-HSPA Cat4 TDD-LTE 117/30Mbps Cat4 FDD-LTE 150/50Mbps 42/11.2Mbps 2.8/2.3Mbps FM GNSS DAT A SIM Display Camera Front and rear Input Device Reset Application interface DSDS (Dual Sim-card Dual Stanby) 3.0/1.8V Support SIM hot plug L/W/G+G with CSFB to W/G L/TDS/G+G with CSFB Dont support dual CDMA sim-card Matrix:
HD(720p)1280*720@60fps LCM Size: User defined Interface: MIPI DSI 4-lane Interface: main: MIPI CSI0 2-lanes; front: MIPI CSI1 1-lanes Camera Pixel: Max: FRONT5M/REAR8M Video decode Video encode 1080p 30 fps: HEVC/H264/ MP4/DivX/VP8 WVGA 30 fps:H.263 720p 30 fps:H264 WVGA 30 fps:VP8/MP4 KeyPower on/off, Volume+, Volume-
Capacitive TP Support HW reset Interface Main function description VBAT Module power input, 3.3V ~ 4.2V, nominal value 3.8V SDIO *1 TF CardSupport32GB max USB SupportOTG FORCE_USB_BOOTPull-up forced USB boot for emergency download UART*2 A set of 4-wire uart, a set of 2-wire uart 10 I2C*4 SPI*1 ADC*2 Charging function Motor GPIO VCOIN RF PIN Audio For sensors/TP/others Master only Support Built-in 5V/1.44A, support external charging chip Support 17 Real-time clock backup battery Multimode LTE main antenna Multimode LTE diversity antenna The GPS antenna 2.4 G WiFi/BT antenna 2-way single-ended MIC ECM&MEMS ,1 way headphone MIC 1 way speakerphone (with amplifier) 1 way earpiece 1 channel stereo headset 11 2.2 Block diagram The following figure lists the main functional parts of the module. MSM8909 Baseband PM8909 Power management Antenna interface MIPI interface Storage EMCP AUDIO interface Serial port, SD card interface, SIM card interface, I2C interface, etc. 12 3. Module Encapsulation 3.1 Pin distribution diagram Figure 3.1module pin diagram (top view) 13 MeiG hardware design guide 3.2 Pin definitions Table 3.1Pin description Pin Name Pin number I/O Description Comment The power supply VBAT 4950 I The module provides four VBAT power pin pins. The SLM756P operates from a single supply with a voltage range from 3.3V to 4.2V for VBAT. VBUS 51 I Charging input power. Externally, the capacitor and Zener diode need to be increased for surge protection. Connect the 3V button battery or large capacitor to the VCOIN pin. 200mA 200mA 420mA The external backup battery provides power to the system real-time clock when the system power supply VBAT is not in place. The backup battery is charged when VBAT is in place. 1.2V power output for CAM DVDD power supply 1.8V power output for LCM, Camera and other low current supplies. 2.85V power output for Camera power supply. TF card power supply pin 600mA 2.9V power output for Camera power supply. UIM1 power supply pin UIM2 power supply pin 300mA 55mA 55mA Ground VCOIN 68 I/O VREG_L2_1P2 VREG_L6_1P8 VREG_L17_2P85 VREG_L11_SDC VREG_L8_2P9 VREG_L14_UIM1 VREG_L15_UIM2 GND 6 7 8 94 9 107 103 O O O O O O O 3152225 28474853 55566062 64668587 93102111 115118 MIPI_DSI0_CLK_N MIPI_DSI0_CLK_P MIPI_DSI0_LANE0_N MIPI_DSI0_LANE0_P Display interface (MIPI) 119 120 121 122 I/O I/O I/O I/O 14 MIPI_LCD clock MIPI_LCD data MeiG hardware design guide MIPI_DSI0_LANE1_N MIPI_DSI0_LANE1_P MIPI_DSI0_LANE2_N MIPI_DSI0_LANE2_P MIPI_DSI0_LANE3_N MIPI_DSI0_LANE3_P LCD_RST_N LCD_TE0 UART_TX UART_RX UART_CTS UART_RTS UART_MSM_TX UART_MSM_RX UIM1_DET UIM1_RESET UIM1_CLK UIM1_DATA UIM2_DET UIM2_RESET UIM2_CLK UIM2_DATA MIPI_CSI1_LANE0_N MIPI_CSI1_LANE0_P MIPI_CSI1_CLK_N MIPI_CSI1_CLK_P CAM1_MCLK CAM1_RST_N CAM1_PWDN MIPI_CSI0_LANE0_N MIPI_CSI0_LANE0_P MIPI_CSI0_LANE1_N MIPI_CSI0_LANE1_P MIPI_CSI0_CLK_N MIPI_CSI0_CLK_P CAM0_MCLK CAM0_RST_N CAM0_PWDN GND_MIC MIC_IN1_P MIC_IN2_P MIC_IN3_P CDC_HPH_R 123 124 125 126 1 2 117 5 80 79 78 77 82 81 I/O I/O I/O I/O I/O I/O O I UART O I I O O I UIM Card Interface LCD reset LCD frame sync signal UART1 Data sent UART1 Data reception UART1 Clear to send UART1 Request to send UART2 Data sent UART2 Data reception debug debug 88 108 110 109 84 104 106 105 26 27 29 30 31 32 33 16 17 18 19 20 21 14 12 13 34 35 36 37 38 I O O I/O I O O I/O Front Camera UIM1 detect UIM1 reset UIM1 clock UIM1 data UIM2 detect UIM2 reset UIM2 clock UIM2 data I/O I/O I/O I/O I/O I/O I/O Front Camera MIPI data Front Camera MIPI data Front Camera MIPI clock Front Camera main clock Front Camera reset Front Camera dormancy Rear Camera I/O I/O I/O I/O I/O I/O I/O I/O I/O Audio Interface I I I O 15 Rear Camera MIP Idata Rear Camera MIPI data Rear Camera MIPI data Rear Camera MIPI data Rear Camera MIPI clock Rear Camera MIPI clock Rear Camera main clock Rear Camera reset Rear Camera dormancy MIC reference ground Main MIC Headphone MIC Noise MIC Headphone right channel MeiG hardware design guide CDC_HPH_L CDC_HS_DET CDC_HPH_REF CDC_EAR_P CDC_EAR_M SPKR_DRV_P SPKR_DRV_M SDC2_SDCARD_DET SDC2_SDCARD_CMD SDC2_SDCARD_CLK SDC2_SDCARD_D0 SDC2_SDCARD_D1 SDC2_SDCARD_D2 SDC2_SDCARD_D3 CAM_I2C_SDA CAM_I2C_SCL SENSOR_I2C_SDA SENSOR_I2C_SCL TP_I2C_SDA TP_I2C_SCL TP_INT_N TP_RST_N USB_DM USB_DP USB_ID RF_MAIN RF_WIFI/BT RF_DIV RF_GPS GPIO0 GPIO1 GPIO2 GPIO3 40 45 39 41 42 43 44 95 96 97 98 99 100 101 23 24 59 58 72 71 73 74 112 113 114 O I I O O O O SD Card Interface Class_D Class_D Headphone left channel Headphone plug detection Headphone reference ground Earpiece output positive Earpiece output negative Amplifier (0.85W) output positive Amplifier (0.85W) output negative SD card insertion detection SD CMD signal SD clock signal SD data signal I2C signal, dedicated to CAM I2C signal, dedicated to CAM I2C signal, default SENSOR I2C signal, default SENSOR Up to the L6 I2C signal, default TP I2C signal, default TP TP interrupt signal TP reset signal USB DM USB DP USB ID I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I O I2C TP USB I/O I/O I Antenna interface 86 54 65 61 I/O I/O I I The main antenna WIFI/BT antenna Diversity antenna GPS antenna GPIO and default function 92 91 90 89 I/O I/O I/O Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration I/O Generic GPIO, without default 16 MeiG hardware design guide GPIO8_SPI1_MOSI GPIO9_SPI1_MISO GPIO10_SPI1_CS GPIO11_SPI1_CLK GPIO14 GPIO15 GPIO16 GPIO17 GPIO36 GPIO90 GPIO95 GPIO98 KYPD_PWR_N PM_RESIN_N BAT_THERM PM8909_MPP4 PM8909_MPP2 RF_FM 116 10 11 83 76 75 70 69 127 128 130 129 O I O O I/O I/O I/O I/O I/O I/O I/O I/O configuration SPI interface SPI interface SPI interface SPI interface Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Other functional pin 52 57 46 67 4 63 I I I I O I Powerkey Pull down to achieve reset Battery temperature detection
(default battery terminal NTC resistance is 10K) Analog voltage input for use as an ADC input Analog voltage output for use as a PWM output FM antenna signal Table 3.2Pin Characteristics Pin# Pin name GPIO Interrupt Pad characteristics Functional description 1 2 3 4 5 6 7 8 9 MIPI_DSI0_LANE3_N MIPI_DSI0_LANE3_P AI, AO AI, AO MIPI display serial interface 0 lane 3 negative MIPI display serial interface 0 lane 3 positive GND GND GND PM8909_MPP2 MPP2**
AO-Z; DO Configurable MPP; used for PWM LCD_TE0 GPIO24 B-PD:nppukp Configurable I/O,CCI_TIMER0, GP_CLK0 VREG_L2_1P2 VREG_L6_1P8 VREG_L17_2P85 VREG_L8_2P9 OUPUT PMU Supply 1.2V OUPUT PMU Supply 1.8V OUPUT PMU Supply 2.85V OUPUT PMU Supply 2.9V 10 GPIO9_SPI_MISO GPIO9 B-PD:nppukp Configurable I/O SPI 17 MeiG hardware design guide GPIO10_SPI_CS GPIO10 B-PD:nppukp Configurable I/O SPI or I2C CAM0_RST_N GPIO35*
DO;B-PD:nppukp Rear camera reset; Configurable I/O CAM0_PWDN GPIO34*
DO;B-PD:nppukp Rear camera pwdn;Configurable I/O CAM0_MCLK GPIO26 DO;B-PD:nppukp Rear camera clock; Configurable I/O GND GND GND MIPI_CSI0_LANE0_N AI, AO MIPI camera serial interface 0 lane 0 - negative MIPI_CSI0_LANE0_P MIPI_CSI0_LANE1_N MIPI_CSI0_LANE1_P MIPI_CSI0_CLK_N MIPI_CSI0_CLK_P GND AI, AO MIPI camera serial interface 0 lane 0 positive AI, AO AI, AO AI AI MIPI camera serial interface 0 lane 1 negative MIPI camera serial interface 0 lane 1 positive MIPI camera serial interface 0 CLK negative MIPI camera serial interface 0 CLK positive GND GND CAM_I2C_SDA GPIO29 B-PD:nppukp Camera I2C_SDA,cant be used for other CAM_I2C_SCL GPIO30 B-PD:nppukp Camera I2C_SCL,cant be used for other GND GND GND MIPI_CSI1_LANE0_N MIPI_CSI1_LANE0_P GND MIPI_CSI1_CLK_N MIPI_CSI1_CLK_P AI, AO AI, AO MIPI camera serial interface 1 lane 0negative MIPI camera serial interface 1 lane 0 positive GND GND AI AI MIPI camera serial interface 1 clock negative MIPI camera serial interface 1 clock positive CAM1_MCLK GPIO27 DO;B-PD:nppukp Camera master clock 1 Configurable I/O CAM1_RST_N GPIO28*
DO;B-PD:nppukp Front camera reset Configurable I/O CAM1_PWDN GPIO33 DI;B-PD:nppukp Front camera pwdn Configurable I/O GND_MIC MIC_IN1_P MIC_IN2_P MIC_IN3_P CDC_HPH_R CDC_HPH_REF CDC_HPH_L CDC_EAR_P CDC_EAR_M SPKR_OUT_P SPKR_OUT_M CDC_HS_DET BAT_THERM GND GND MIC GND AI AI AI AO AI AO AO AO AO AO DI DI Microphone 1 input, single-ended Earphone Microphone input, single-ended Microphone 3 input, single-ended Earphone right output Earphone driver amplifier ground reference Earphone left output Earpiece amplifier output, differential plus Earpiece amplifier output, differential minus Speaker0.85w / 4.2V driver output, plus Speaker0.85w / 4.2V driver output, minus Headset detection Battery therm monitor GND GND 18 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 MeiG hardware design guide GND VBAT VBAT VBUS KYPD_PWR_N GND RF_WIFI/BT GND GND PM_RESIN_N GND GND PI,PO Battery PI,PO Battery PI DI USB VBUS Voltage Power on key GND GND AI,AO RF signal GND GND DI GND GND PMIC reset GPIO7_I2C_SCL GPIO7 DO;B-PD:nppukp Configurable I/O I2C or GPIO GPIO6_I2C_SDA GPIO6 DO;B-PD:nppukp Configurable I/O I2C or GPIO GND RF_GPS GND RF_FM GND RF_DIV GND GND GND AI RF signal-GPS ANT GND GND AI RF signal-FM ANT GND GND AI RF signal-DIV ANT GND GND PM8909_MPP4 MPP4**
AO-Z;DI Configurable MPP; used for ADC IN VCOIN GPIO17 GPIO16 GPIO17 GPIO16 PI VCOIN B-PD:nppukp Configurable I/O, B-PD:nppukp Configurable I/O, TP_I2C_SCL GPIO19 B;B-PD:nppukp Configurable I/O CTP I2C TP_I2C_SDA GPIO18 B;B-PD:nppukp Configurable I/O CTP I2C TP_INT_N GPIO13*
DI;B-PD:nppukp Configurable I/O Touchscreen interrupt TP_RST_N GPIO12*
DI;B-PD:nppukp Configurable I/O Touchscreen reset SMB_I2C_SCL GPIO15 B;B-PD:nppukp Configurable I/O SMB I2C SMB_I2C_SDA GPIO14 B;B-PD:nppukp Configurable I/O SMB I2C UART1_RTS GPIO112*
B;B-PD:nppukp Configurable I/O UARTor I2C SCL UART1_CTS GPIO111*
B-PD:nppukp Configurable I/O UARTor I2C SDA UART1_RX GPIO21*
B-PD:nppukp Configurable I/O UART UART1_TX GPIO20*
B-PD:nppukp Configurable I/O UART UART2_MSM_RX GPIO5*
B;B-PD:nppukp Configurable I/O UART for debug UART2_MSM_TX GPIO4 BD;B-PD:nppukp Configurable I/O UART for debug GPIO11_SPI_CLK GPIO11*
B-PD:nppukp Configurable I/O SPI or I2C UIM2_DET_N GPIO52 DI,B-PD:nppukp Configurable I/O UIM2 removal detection GND GND GND 19 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 MeiG hardware design guide 86 87 88 89 90 91 92 93 94 95 96 97 98 99 RF_MAIN GND AI,AO RF signal-Main ANT GND GND UIM1_DET_N GPIO56 DI,B-PD:nppukp Configurable I/O UIM1 removal detection GPIO3 GPIO2 GPIO1 GPIO0 GND GPIO3 GPIO2 GPIO1 GPIO0 B-PD:nppukp Configurable I/O, MI2S_2_D1 B-PD:nppukp Configurable I/O,MI2S_2_D0 B-PD:nppukp Configurable I/O,MI2S_2_SCK B-PD:nppukp Configurable I/O,MI2S_2_WS GND GND VREG_L11_SDC PO PMIC output 2.95V SDC2_SDCARD_DET GPIO38*
B-PD:nppukp Configurable I/O ,SD_DET_N SDC2_SDCARD_CMD BH-PD:nppukp Secure digital controller 2 command SDC2_SDCARD_CLK BH-NP:pdpukp Secure digital controller 2 clock SDC2_SDCARD_D0 BH-PD:nppukp Secure digital controller 2 data bit 0 SDC2_SDCARD_D1 BH-PD:nppukp Secure digital controller 2 data bit 1 100 SDC2_SDCARD_D2 BH-PD:nppukp Secure digital controller 2 data bit 2 101 SDC2_SDCARD_D3 BH-PD:nppukp Secure digital controller 2 data bit 3 102 GND 103 VREG_L15_UIM2 GND PO GND PMIC supply for UIM2 104 UIM2_RESET DO,B-PD:nppukp Configurable I/O UIM2 reset 105 UIM2_DATA 106 UIM2_CLK B,B-PD:nppukp Configurable I/O UIM2 data DO,B-PD:nppukp Configurable I/O UIM2 clock 107 VREG_L14_UIM1 PO PMIC supply for UIM1 108 UIM1_RESET DO,B-PD:nppukp Configurable I/O UIM1 reset 109 UIM1_DATA 110 UIM1_CLK 111 GND 112 USB_DM 113 USB_DP 114 USB _ID 115 GND B,B-PD:nppukp Configurable I/O UIM1 data DO,B-PD:nppukp Configurable I/O UIM1 clock GND GND AI, AO USB data minus AI, AO USB data plus AI USB ID GND GND 116 GPIO8_SPI_MOSI GPIO8 B-PD:nppukp Configurable I/O SPI 117 LCD_RST_N GPIO25*
B-PD:nppukp Configurable I/O,
#DSI_RST# ,MDP_VSYNC_S 118 GND GND GND 119 MIPI_DSI0_CLK_N 120 MIPI_DSI0_CLK_P AO AO MIPI display serial interface 0 clock negative MIPI display serial interface 0 clock positive 121 MIPI_DSI0_LANE0_N AI, AO MIPI display serial interface 0 lane 0 negative 122 MIPI_DSI0_LANE0_P AI, AO MIPI display serial interface 0 lane 0 positive 20 MeiG hardware design guide 123 MIPI_DSI0_LANE1_N AI, AO MIPI display serial interface 0 lane 1 negative 124 MIPI_DSI0_LANE1_P AI, AO MIPI display serial interface 0 lane 1 positive 125 MIPI_DSI0_LANE2_N AI, AO MIPI display serial interface 0 lane 2 negative 126 MIPI_DSI0_LANE2_P AI, AO MIPI display serial interface 0 lane 2 positive 127 GPIO36 GPIO36*
B-PD:nppukp Configurable I/O 128 GPIO90_KEY_VOL_U P GPIO90*
DI;B-PD:nppukp Configurable I/O Keypad sense bit 0 129 GPIO98 GPIO98*
B-PD:nppukp Configurable I/O 130 GPIO95 GPIO95*
B-PD:nppukp Configurable I/O
*Wake-up system interrupt pin
**Power chipPM8909pin BBidirectionaldigital with CMOS input HHigh-voltage tolerant NPpdpukp=defaultno-pull with programmable options following the colon (:) PDnppukp=defaultpulldownwith programmable options following the colon (:) PUnppdkp=defaultpullupwith programmable options following the colon (:) KPnppdpu=defaultkeeperwith programmable options following the colon (:) Table 3.3Multiplexing function GPIO Module pin BLSP Multiplexing functiondefault is blue GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 92 91 90 89 82 81 59 58 116 10 11 83 74 73 SPI MOSI MISO CS_N CLK MOSI MISO CS_N CLK MOSI MISO CS_N CLK MOSI MISO UART I2C TX RX CTS RTS 21 SDA SCL SDA SCL Outside BLSP Other functions I2S/GPIO I2S/GPIO I2S/GPIO I2S/GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO MeiG hardware design guide GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO111 GPIO112 76 75 70 69 72 71 80 79 78 77 CS_N CLK MOSI MISO CS_N CLK MOSI MISO CS_N CLK SDA SCL SDA SCL SDA SCL GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO TX RX CTS RTS 22 MeiG hardware design guide 3.3 Mechanical Dimensions TOP:
1 MeiG hardware design guide BOTTOM:
2 MeiG hardware design guide Side Figure 3.3Recommended PCB package size (unit: mm) 3 MeiG hardware design guide 4. Interface Application 4.1 Power Supply In the case of a battery device, the voltage input range of the module VBAT is 3.4V to 4.2V, and the recommended voltage is 3.8V. In the LTE band, when the module is transmitting at maximum power, the peak current can reach up to 3A, resulting in a large voltage drop on VBAT. It is recommended to use a large capacitor regulator close to VBAT. It is recommended to use two 47uF ceramic capacitors. Parallel 33PF and 10PF capacitors can effectively remove high frequency interference. To prevent damage to the chip due to ESD and surge, it is recommended to use a suitable TVS tube and a 5.6V/500mW Zener diode at the VBAT pin of the module. For PCB layout, the capacitors and diodes should be as close as possible to the VBAT pin of the module. The user can directly power the module with a 3.7V lithium-ion battery. When using the battery, the impedance between the VBAT pin and the battery should be less than 150m. Figure 4.1VBAT input reference circuit If it is a DC power supply device, the DC input voltage is 5V-12V, and the recommended circuit that can be powered by DC-DC is shown below. 4 MeiG hardware design guide Figure 4.2DC-DC power supply circuit Note If the user does not use battery power, please note that a 10K resistor is connected to the 134 pin
(BAT_THERM) of the module and pulled down to GND to prevent the software from judging the abnormal battery temperature after the module is turned on, resulting in shutdown. The connection diagram is as follows:
Figure 4.3Connection diagram when not powered by battery 4.1.1 Power Pin The VBAT pin (49, 50) is used for power supply input. In the user's design, please pay special attention to the design of the power supply part to ensure that the VBAT drop should not be lower than 3.4V even when the module consumes 2A. If the voltage drops below 3.4V, the module may shut down. The PCB layout from the VBAT pin to the power supply should be wide enough to reduce the voltage drop in the transmit burst mode. 5 MeiG hardware design guide Figure 4.4VBAT lowest voltage drop 4.2 Power on and off Do not turn on the module when the module's temperature and voltage limits are exceeded. In extreme cases, such operations can cause permanent damage to the module. 4.2.1 Module Boot The user can power up the module by pulling the PWRKEY pin (52) low. Pull down for at least 5 seconds. This pin has been pulled up to 1.8V in the module. The recommended circuit is as follows:
Figure 4.5Using an external signal to drive the module to boot 6 MeiG hardware design guide The following figure is the boot timing description Figure 4.6Use the PWRKEY button circuit to boot Figure 4.7 Using PWRKEY boot timing diagram 4.2.2 Module Shutdown Users can use the PWRKEY pin to shut down. 4.2.2.1 PWRKEY Shutdown The user can turn off the PWRKEY signal by pulling it down for at least 3 seconds. The shutdown circuit can refer to the design of the boot circuit. After the module detects the shutdown action, a prompt window pops up on the screen to confirm whether to perform the shutdown action. The user can achieve a forced shutdown by pulling PWRKEY down for a long time, pulling down for at least 15 seconds 4.2.3 Module Reset The SLM756P module supports a reset function that allows the user to quickly restart the module by pulling the module's PM_RESIN_N1 (PIN57) pin low. The RESET signal is used as the volume-key by default in Android. If you need to use the RESET signal, you need to modify the software. The recommended circuit is as follows:
7 MeiG hardware design guide Figure 4.8 Reset using the key circuit Figure 4.9Reset Module Using External Signa When the pin is high, the voltage is typically 1.8V. Therefore, for users with a level of 3V or 3.3V, it is not possible to directly use the GPIO of the MCU to drive the pin. An isolation circuit is required. The hardware parameters of the RESET can refer to the following table:
Table 4.1: RESET Hardware Parameters Pin Description Minimum Typical Maximum RESET Input high level Input low level Pull down effective time 1
-
500
-
-
-
0.65
-
Unit V V ms Figure 4.7: Using PWRKEY boot timing diagram 4.3 VCOIN Power When VBAT is disconnected, the user needs to save the real-time clock. The VCOIN pin cannot be suspended. It should be connected to a large capacitor or battery. When external capacitor is connected, the recommended value is 100uF, and the real-time clock can be kept for 1 minute. The reference design circuit is used when the RTC power supply uses an external large capacitor or battery to power the RTC inside the module:
8 MeiG hardware design guide Figure 4.10: External Capacitor Powering the RTC Non-rechargeable battery powered:
Figure 4.11: Non-rechargeable battery to power the RTC Rechargeable battery powered:
Figure 4.12: Rechargeable Battery Powers RTC This VCOIN power supply is typically 3.0V and consumes approximately 8uA when VBAT is disconnected. 4.4 Power Output The SLM756P has multiple power outputs. For LCD, Camera, touch panel, etc. In application, it is recommended to add parallel 33PF and 10PF capacitors to each power supply to effectively remove high frequency interference. Table 4.2: Power Description Signal Programmable RangeV Default Voltage(V) Drive Current(mA) 9 MeiG hardware design guide VREG_L2_1P2 VREG_L6_1P8 VREG_L17_2P85 VREG_L11_SDC VREG_L8_2P9 VREG_L14_UIM1 VREG_L15_UIM2
-
-
1.75~3.337
-
1.75~3.337 1.75~3.337 1.8 1.8 2.85 2.95 2.9 1.8/3.3 1.8/3.3 200 200 420 600 300 55 55 4.5 Serial Port The SLM756P provides two serial ports for communication. UART1 with hardware flow control, UART2 default for debugging. Table 4.3: UART Pin Description Name UART_TX UART_RX UART_CTS UART_RTS UART_MSM_TX UART_MSM_RX Pin 80 79 78 77 82 81 Direction Function O I I O O I UART1 Data Transmission UART1 Data Reception UART1Clear To Send UART1Request To Send UART2 Data Transmission UART2 DataReception Please refer to the following connection method:
Figure 4.13: Serial Port Connection Diagram When the serial level used by the user does not match the module, in addition to adding the level shifting IC, the following figure can also be used to achieve level matching. Only the matching circuits on TX and RX are listed here. Other low speed signals can refer to this two circuits. 10 MeiG hardware design guide Figure 4.14: TX Connection Diagram Figure 4.15: RX Connection Diagram Note: When using Levels 14 and 15 for level isolation, you need to pay attention to the output timing of VREG_L6_1P8. Only after VREG_L6_1P8 is output normally, the serial port can communicate normally. VREG_L6_1P8 will enter low power mode when sleeping. If the serial port needs to be in sleep mode. When communicating, please use the commonly used 1.8V as the pull-up power supply. Table 4.4: Serial Port Hardware Parameters Minimum Description Maximum Unit Input low level Input high level Input low level Input high level
-
1.17
-
1.35 0.63
-
0.45
-
V V V V Note: 1. The serial port of the module is a CMOS interface, and the RS232 signal cannot be directly connected. If necessary, please use the RS232 conversion chip. 2. If the 1.8V output of the module cannot meet the high level range of the user terminal, please add a level shifting circuit. 11 MeiG hardware design guide 4.6 MIPI Interface The SLM756P supports the Moble Industry Processor Interface (MIPI) interface for Camera andLCM. The module supports up to HD (720P) display, of which MIPI interface Main Camera supports up to 8MP and Front Camera supports 5MP. MIPI is a high-speed signal line. In the Layout stage, please strictly follow the impedance and length requirements to control the length of the differential pair within the group and the group length. The total length should be as short as possible. 4.6.1 LCD Interface The SLM756P module supports the LCD display of the MIPI interface with an identification signal for the compatible screen. The resolution of the screen can be up to 1280*720. The signal interface is shown in the following table. In the Layout, the MIPI signal line should strictly control the differential 100 ohm impedance and the equal length between the signal line group and the group. The module's MIPI interface is a 1.2V power domain. When the user needs a compatible screen design, the module's GPIO or ADC pin can be used. At the same time, the module can provide 2.8V power to the LCD. The LCD interface is as follows:
Table 4.5: Interface Definitions Name LCD_RST MIPI_DSI0_CLK_N MIPI_DSI0_CLK_P MIPI_DSI0_LANE0_N MIPI_DSI0_LANE0_P MIPI_DSI0_LANE1_N MIPI_DSI0_LANE1_P MIPI_DSI0_LANE2_N Description LCM Reset Pin MIPI Clock Line MIPI Data Line Input/Output O O O I/O I/O I/O I/O I/O Pin 117 119 120 121 122 123 124 125 12 Information/designguidanceComments750 MHz1.5 Gbit/s per laneMain route100 3%Break-out100 10%Connector100 20%Main route50 20%Break-out50 30%Connector50 30%0.7 mm (5 ps)It is important to maintain differential lines; single linemeandering should not be used other than at Tx breakout.1.4 mm (10 ps)This target is for compliance mode. For mission mode whiledata rate is 1 Gbps or less, inter-pair skew may be relaxedto 100 ps; consider 100 ps for extra-cable inter-pair timeskew. At 1.0-1.5 Gbps, this value is 50 ps. (Refer to theMIPI Alliance Specfication for D-PHY 9.2.1 for mission-modetarget).30 cmThis max length guidance is practical level of definition.(Refer to the MIPI Alliance Specfication for D-PHY 7.6.1).Spacing toall other signal4x line widthIf not practical, may be relaxed to x3 line width byaccepting potential risk.(Refer to the MIPI Alliance Specfication for D-PHY 7.6.5).Spacing datalane to lane3x line widthIf not practical, may be relaxed to x2 line width byaccepting potential risk.(Refer to the MIPI Alliance Specfication for D-PHY 7.6.5).Inspected by TDR simulation @ 150 ps (2080%).No manufacturing variation considered.Intra-lane length matchData to clock slewMax trace lengthLength matchSpacingMain routeMetricsGeneralinformationCLK frequencyData rateDifferentialSingle-endedImpedance MeiG hardware design guide MIPI_DSI0_LANE2_P MIPI_DSI0_LANE3_N MIPI_DSI0_LANE3_P PM8909_MPP2 LCD_TE LDO6_1P8 LDO17_2P85 126 1 2 4 5 7 8 I/O I/O I/O O I/O O O Backlight PWM ontrol signal Frame synchronization signal 1.8V power supply 2.85V power supply The LCD_ID of the module can use GPIO (only recognize high and low level) or ADC
(PM8909_MPP4). Please confirm the internal circuit of LCM. If the internal divider of LCM uses resistor divider, please note that the voltage domain is 1.8V. MIPI is a high-speed signal line. To avoid EMI interference, it is recommended to place a common-
mode inductor on the side close to the LCM. LCD needs a backlight circuit. The backlight driver circuit can refer to Figure 4.17. Adjusting the backlight brightness can be realized by the module's PM8909_MPP2 (112PIN). The modulation mode is PWM mode. Figure 4.16: Main LCD Interface Circuit 13 MeiG hardware design guide Figure 4.17: Backlight Drive Circuit Note: 1. The backlight circuit should select the chip according to the backlight circuit of LCD. Users should carefully read the LCD document and select the correct driver chip. The reference circuit provided in this document is a series-type PWM dimming backlight driver circuit; if a series-type one-
line dimming backlight driver circuit (such as KTD2801) is used due to design requirements, GPIO is required for control. 4.6.2 MIFI camera Interface The SLM756P module supports the MIPI interface Camera and provides a dedicated camera power supply. The main camera is a CSI0 interface that supports two sets of data lines and can support 8M pixels. The front camera is a CSI1 interface that supports a set of data lines and can support 5M pixels. The module provides the power required by the Camera, including AVDD-2.85V, IOVDD-1.8V, DVDD-1.2V and AFVDD-2.8V (powering the focus motor). Table 4.6: MIPI Camera Interface Definition Main camera interface Name Pin Input/Output Description MIPI_CSI0_LANE0_N MIPI_CSI0_LANE0_P MIPI_CSI0_LANE1_N MIPI_CSI0_LANE1_P MIPI_CSI0_CLK_N MIPI_CSI0_CLK_P CAM0_MCLK CAM0_RST_N CAM0_PWDN CAM_I2C_SDA CAM_I2C_SCL VREG_L6_1P8 VREG_L17_2P85 VREG_L8_2P9 VREG_L2_1P2 Name MIPI_CSI1_LANE0_N MIPI_CSI1_LANE0_P MIPI_CSI1_CLK_N MIPI_CSI1_CLK_P CAM1_MCLK CAM1_RST_N CAM1_PWDN 16 17 18 19 20 21 14 12 13 23 24 7 8 9 6 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O O O O O Front camera interface Pin Input/Output 26 27 29 30 31 32 33 I/O I/O I/O I/O I/O I/O I/O 14 Rear Camera MIPI data signal Rear Camera MIPIclock signal Rear Camera MIPIclock signal Rear Camera main clock Rear Camera reset signal Rear Camera sleep signal I2Csignal,CAMdedicated I2Csignal,CAMdedicated 1.8V IOVDD 2.8V AVDD 2.9V AFVDDpowering the focus motor 1.2V DVDD Description Front Camera MIPIdata signal Front Camera MIPIclock signal Front Camera MIPIclock signal Front Camera main clock Front Camera reset signal Front Camera sleep signal MeiG hardware design guide CAM_I2C_SDA CAM_I2C_SCL VREG_L6_1P8 VREG_L17_2P85 VREG_L8_2P9 VREG_L2_1P2 23 24 7 8 9 6 I/O I/O O O O O I2Csignal,CAMdedicated I2Csignal,CAMdedicated 1.8V IOVDD 2.8V AVDD 2.9V AFVDDpowering the focus motor 1.2V DVDD If the user designs to use the CAMERA module with autofocus function, please note that the I2C of the module cannot be directly connected to the AF device. The I2C of the AF device should be connected to the driver chip of CAMERA, and the correct connection is as follows:
Figure 4.18: Correct CAMERA connection diagram The MIPI interface has a high rate. The user should control the impedance by 100 ohms during the routing. Please pay attention to the length of the trace. It is not recommended to add a small capacitor on the MIPI signal line. This may affect the rising edge of the MIPI data. This in turn causes the MIPI data to be invalid. 15 MeiG hardware design guide Figure 4.19: MIPI Camera Reference Circuit When designing the camera function, you need to pay attention to the position of the connector. There will be a small person in the specification of the camera to indicate the imaging direction. You need to ensure that the villain stands on the long side of the LCD. As shown in the two figures below. 16 MeiG hardware design guide Figure 4.20: Camera imaging diagram 4.7 Resistive Touch Interface The module does not provide a resistive touch screen interface. If the user needs to use a resistive touch, an external dedicated chip is required. The module can provide an I2C interface.The reference circuit is as follows:
4.8 CapacitiveTouch Interface Figure 4.21: RTP Reference Circuit The module provides a set of I2C interfaces that can be used to connect capacitive touches while providing the required power and interrupt pins. The default interface pins for capacitive touch software are defined as follows:
Table 4.7: Capacitive Touch Interface Definitions Name Pin Input/Output Description 17 MeiG hardware design guide GPIO10_TP_I2C3_SDA GPIO11_TP_I2C3_SCL GPIO65_TP_INT_N GPIO64_TP_RST_N 82 81 79 80 VREG_L17_2P85 112 I/O I/O I O O The capacitive touch I2C interface needs to be pulled up toVREG_L5_1P8 Interrupt Reset 2.8V Power Note: The interface definition of the capacitive touch can be adjusted by software, and the user can change the GPIO and I2C according to the design needs. 4.9 Audio Interface The module provides three analog audio inputs, MIC_IN1_P/M for the main microphone, MIC_IN2_P for the microphone, and MIC_IN3_P for the noise reduction microphone. The module also provides three analog audio outputs (HPH_L/R, REC_P/N, SPK_P/N). The audio pin is defined as follows:
Table 4.8: Audio Pin Foot Definitions Name Pin Input/Output MIC_IN1_P MIC_IN2_P GND_MIC MIC_IN3_P CDC_HPH_R CDC_HPH_L CDC_HS_DET CDC_HPH_REF CDC_EAR_M CDC_EAR_P SPKR_DRV_M SPKR_DRV_P 35 36 34 37 38 40 45 39 42 41 44 43 I I I I O O I I O O O O Description Main MIC positive Headphone MIC positive Headphone MIC, noise reduction MIC negative Noise reduction MIC positive Headphone right channel Headphone left channel Headphone plug detection Headphone reference ground Earpiece output negative Earpiece output positive Amplifier (0.85W) output negative Amplifier (0.85W) output positive Users are advised to use the following circuit according to the actual application to get better sound effects. 18 MeiG hardware design guide 4.9.1 Receiver Interface Circuit Figure 4.21: Receiver Interface Circuit 4.9.1 Microphone receiving Circuit Below is the MEMS microphone interface circuit, which has more BIAS power supply than the electret MIC. Figure 4.22: Microphone Differential Interface Circuit 4.9.2 Headphone Interface Circuit The module integrates a stereo headphone jack. Users are advised to reserve ESD devices during the design phase to prevent ESD damage. The HS_DET pin of the module can be set as an interrupt. In software, this pin is the earphone interrupt by default. The user can use this pin to detect the plugging and unplugging of the earphone. 19 MeiG hardware design guide Figure 4.23: Headphone Interface Circuit note:
1. The earphone holder in Figure 4.23 is normally closed. If the user is using the normally open mode earphone holder, please modify the detection circuit according to the actual pin and modify the software accordingly. 2. We recommend that the headphone detection pin HS_DET and HPH_L form a detection circuit (the connection method in the above figure), because the HPH_L has a pull-down resistor inside the chip, which can ensure that HS_DET is low when connected with HPH_L, if the user will HS_DET and HPH_R Connect, please reserve the position of 1K pull-down resistor on HPH_R. 3 The standard of the headphone interface is the European standard OMPT. If you need to design the American standard CTIA interface, you need to swap the GND and MIC signals for the network. If you want to be compatible with both headset standards, you need an external dedicated chip, such as the TI-TS3A226AE. 4.9.4 Speaker Interface Circuit The module integrates a Class-D audio amplifier with an output power of 0.85W and an output signal of SPKR_OUT_P / SPKR_OUT_M Figure 4.24: Recommended Circuit with Internal Audio Power Amplifier It is also possible to add an audio amplifier externally, using CDC_HPH_R as a single-ended input signal, and the reference circuit is shown below. 20 MeiG hardware design guide Figure 4.25: Recommended Circuit with External Audio Power Amplifier 4.9.5 I2S Interface There is a set of GPIO-compatible I2S interfaces inside the module. The pins used by this function are as follows:
Name GPIO3 GPIO2 GPIO1 GPIO0 Pin 89 90 91 92 Input/Output Description I O O O I2S1 input DATA I2S1 output DATA I2S1_ SCK I2S1_ WS 4.10 USB Interface The SLM756P supports a USB 2.0 High speed interface. It must control the 90 ohm differential impedance during Layout and control the external trace length according to the internal trace length of the module.The module supports OTG function at the same time (requires external circuit to provide external 5V power supply).The voltage input range during charging is as follows:
Table 4.9: Voltage input range during charging Name VBUS Description Minimum Typical Maximum Input range 4
-
6.3 Unit V The USB plug-in detection of the module is realized by the VBUS and DP/DM data lines. When the USB cable is inserted, the VBUS voltage is detected first, and then the DM/DP pull-up state is detected to determine whether the USB data line or the charger is inserted. Therefore, if you need to use the USB function, please be sure to connect VBUS to the 5V power supply on the data line. USB is a high-speed mode. It is recommended to connect a common-mode inductor to the side of the USB connector to effectively suppress EMI interference. At the same time, the USB interface is an external interface. It is recommended to add a TVS tube to prevent static damage caused by plugging and unplugging the data cable. When selecting TVS, please pay attention to the load capacitance should be less than 1pf. VBUS also needs to increase the TVS tube. If there is anti-surge demand, it is also necessary to increase the anti-surge tube. The connection diagram is as follows:
21 MeiG hardware design guide Figure 4.26: USB Connection Diagram 4.10.1 USB OTG The SLM756P module provides USB OTG functionality and requires an external charging chip or power chip to output 5V power to external devices. The work The pins that can be used are as follows:
Table 4.10: USB OTG Pin Description Name USB_DM USB_DP USB_ID Pin 112 113 114 Decription USB data-
USB data+
USB ID The recommended circuit diagram of USBOTG is as follows:
Figure 4.27: USB-OTG Connection Diagram 22 MeiG hardware design guide 4.11 Charging Interface 4.11.1 Charging Detection The USB_VBUS power supply is a USB power supply or an adapter power supply. It can be used as a USB plug-in detection and charge the battery through the internal PMU of the module. The power input voltage range is 4.35~6.3V, and the recommended value is 5V. The module supports single-cell lithium battery charge management, and different capacity models need to set different charging parameters. The module's built-in linear charging circuit supports up to 1.44A of charging current. Adapter or USB Figure 4.28: Battery connection diagram 4.11.2 Charge Control The SLM756P module can charge the over-discharged battery. The charging process includes trickle charge, constant current, and constant voltage charging. Trickle charge: it is divided into 2 parts, trickle charge-A: charge current 90mA when the battery voltage is lower than 2.8V; trickle charge-B: charge current 450mA when the battery voltage is between 2.8V~3.2V;
Constant current charging: When the battery voltage is between 3.2V and 4.2V, the constant current is charged, the charging current is 1.44A when the adapter is charging, and the charging current is 450mA when charging the USB;
Constant voltage charging: When the battery voltage reaches 4.2V, the constant voltage is charged, the charging current is gradually decreased, the charging current is reduced to about 100mA, and the charging is cut off. 4.11.3 BAT _THERM The SLM756P module has battery temperature detection and can be implemented by BAT_THERM
(46PIN). This requires the internal integration of a 10K thermistor (negative temperature coefficient) inside the battery to connect the thermistor to the BAT_THERM pin. During the charging process, the software reads the voltage of the BAT_THERM pin to determine if the battery temperature is too high. If the temperature is too high or too low, the battery will stop charging immediately to prevent battery damage. 23 MeiG hardware design guide 4.12 UIM Card Interface The SLM756P can support two SIM cards at the same time to achieve dual card dual standby. Support SIM card hot swap, can automatically recognize 1.8V and 3.0V cards. The figure below shows the recommended interface circuit for the SIM card. In order to protect the SIM card, it is recommended to use TVS devices for electrostatic protection. The DATA signal requires a 15K resistor to pull up to the SIM power supply. The device of the peripheral circuit of the SIM card should be close to the SIM card holder. The reference circuit is as follows:
Figure 4.29: UIM card interface circuit 4.13 SD Card Interface SLM756P supports SD card interface and supports up to 64GB The reference circuit is as follows:
Figure 4.30: SD card interface circuit 24 MeiG hardware design guide 4.14 I2C Bus Interface The SLM756P module supports multiple hardware I2C bus interfaces. The default I2C pin definition functions are as follows:
Table 4.11: Default I2C Interface Pin Description Name CAM_I2C_SDA CAM_I2C_SCL SENSOR_I2C_SDA SENSOR_I2C_SCL TP_I2C_SDA TP_I2C_SCL Pin 23 24 59 58 72 71 Default function Camera dedicated I2C General purpose I2C, default for sensor General purpose I2C, default for TP Note: 1 These 3 groups of I2C have been internally pulled up to VERG_L6_1P8 by default 2.2K, so they cannot be used as normal GPIOs. 2 For other I2C signals, please refer to the table (3.3 Multiplexing Function). If necessary, add an external pull-up resistor. 4.15 Analog to Digital Converter (ADC) The SLM756P module provides two MPP function signals from the power management chip. MPP4 is the ADC input signal and MPP2 is the PWM signal. The ADC signal is 16-bit resolution, and its performance parameters are as follows:
Table 4.12: ADC Performance Parameters Description Minimum Typical Maximum Unit Measurement range can be selected by software programming Offset error Gain error 0.1 0.3
-
-
-
-
-
-
-
-
-
16 100 2.4M
-
-
-
-
1.7 4.5
-
-
-
8 4 1 1 V Bits kHz MHz LSB LSB
%
%
Input Voltage Range ADC Resolution Analog Input Bandwidth Sampling Frequency INL DNL Error 4.16 PWM The PWM pin can be used as a backlight adjustment for the LCD to adjust the backlight brightness by adjusting the duty cycle. 25 MeiG hardware design guide 4.17 Motor The SLM756P supports motor functions that can be implemented by the user with GPIO control power. The reference schematic is as follows:
Figure 4.32: Motor interface circuit 4.18 Antenna Interface The module provides four antenna interfaces: MAIN antenna, DRX antenna, GPS antenna and WiFi/BT antenna. In order to ensure that the user's products have good wireless performance, the antenna selected by the user should meet the requirement that the input impedance is 50 ohms in the working frequency band and the VSWR is less than 2. 4.18.1 Main Antenna The module provides the MAIN antenna interface pin Pin1 RF_MAIN. The antenna on the user's main board should be connected to the antenna pin of the module using a 50-ohm characteristic microstrip line or strip line. In order to facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:
Figure 4.33: MAIN Antenna Interface Connection Circuit 26 MeiG hardware design guide In the figure, R101, C101, and C102 are antenna matching devices, and the specific component values can be determined after the antenna factory debugs the antenna. Among them, R101 defaults to 0R, C101 and C102 do not paste by default. If there are fewer components between the antenna and the module output, or if the RF test head is not needed in the design, the antenna matching circuit can be simplified as shown below:
Figure 4.34: MAIN Antenna Interface Simplified Connection Circuit In the above figure, R101 defaults to 0R, and C101 and C102 do not paste by default. 4.18.2 DRX Antenna The module provides the DRX antenna interface pin RF_DIV, and the antenna on the user's motherboard should be connected to the module's antenna pins using a 50-ohm characteristic microstrip or stripline. In order to facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:
Figure 4.35: DRX Antenna Interface Connection Circuit In the figure, R102, C103, and C104 are antenna matching devices, and the specific component values can be determined after the antenna factory debugs the antenna. Among them, R102 defaults to 0R, C103 and C104 are not posted by default. 27 MeiG hardware design guide If there are fewer components between the antenna and the module output, or if the RF test head is not needed in the design, the antenna matching circuit can be simplified as shown below:
Figure 4.36: DRX Antenna Interface Simplified Connection Circuit In the above figure, R102 defaults to 0R, C103 and C104 are not attached by default. 4.18.3 GPS Antenna The module provides the GNSS antenna pin RF_GPS. The antenna on the user's main board should be connected to the antenna pin of the module using a 50-ohm characteristic microstrip line or strip line. The LNA is integrated inside the module. To improve GNSS reception performance, customers can use external active antennas. The recommended circuit connections are as follows:
Figure 4.37: Connecting Active Antennas To improve GNSS reception performance, customers can use external active antennas. The recommended circuit connections are as follows:
28 MeiG hardware design guide Figure 4.38: Connecting Active Antennas 4.18.4 WiFi/BT antenna The module provides the WiFi/BT antenna pin RF_WIFI/BT. The antenna on the user's motherboard should be connected to the antenna pin of the module using a 50 ohm microstrip line or strip line. In order to facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:
Figure 4.39: WiFI_BT antenna interface connection circuit In the figure, R301, C301, and C302 are antenna matching devices, and the specific component values can be determined after the antenna factory debugs the antenna. Among them, R301 defaults to 0R, C301 and C302 do not paste by default. If there are fewer components between the antenna and the module output, or if the RF test head is not needed in the design, the antenna matching circuit can be simplified as shown below:
29 MeiG hardware design guide Figure 4.40: WIFI_BT antenna interface simplified connection circuit In the above figure, R301 defaults to 0R, and C301 and C302 do not paste by default. 5. PCB Layout The performance of a product depends largely on the PCB trace. As mentioned above, if the PCB layout is unreasonable, it may cause interference problems such as card loss. The way to solve these interferences is often to redesign the PCB. If you can plan a good PCB layout in the early stage, the PCB traces smoothly, saving a lot of time. Of course, it can also save a lot of costs. This chapter mainly introduces some things that users should pay attention to during the PCB layout stage, minimizing interference problems and shortening the user's development cycle. The SLM756P module is an intelligent module with its own Android operating system. It includes sensitive data lines such as high-speed USB and MIPI. It also has strict requirements on the length and impedance of the signal line. If the high-speed signal processing is not good, it will cause serious EMI. The problem, more serious will also affect the USB identification, LCM display, so the PCB design requirements when using the SLM756P module is much higher than the previous 2G module, please read this chapter carefully, reduce the subsequent hardware debugging cycle. When using the SLM756P module, the user is required to use at least 4 layers of via design for the impedance control and signal line shielding. 5.1. Module PIN distribution Before the PCB layout, first understand the pin distribution of the module, and rationally layout the relevant devices and interfaces according to the distribution defined by the pin. Please refer to Figure 2 to determine the distribution of the function feet of the module. 5.2. PCB layout principles Several aspects of the main attention during the PCB layout phase:
30 MeiG hardware design guide 5.2.1. Antenna Antenna part design, SLM756P module has a total of 5 antenna interfaces, they are: RF_MAIN, RF_DRX, RF_GPS, RF_WIFI, RF_FM. Pay attention to component placement and RF routing:
The RF test head is used to test the conducted RF performance and should be placed as close as possible to the antenna pins of the module;
The antenna matching circuit needs to be placed close to the antenna end;
The connection between the antenna pin of the module and the antenna matching circuit must be controlled by 50 ohm impedance;
The devices and connections between the antenna pins of the module and the antenna connector must be away from high-speed signal lines and strong interference sources to avoid crossing or parallel with any signal lines in adjacent layers. The length of the RF cable between the antenna pin of the module and the antenna connector should be as short as possible. The situation across the entire PCB should be absolutely avoided. If the antenna is connected by a coaxial RF line, care should be taken to avoid coaxial RF lines across the SIM card, power circuit, and high-speed digital circuits to minimize the effects of each other. 5.2.2 Power supply Power traces must consider not only VBAT, but also the return GND of the power supply. The trace of the positive electrode of VBAT must be short. To be thick, the trace must first pass through the large capacitor, Zener diode and then the power PIN of the module. There are multiple PAD exposed copper at the bottom of the module. It is necessary to ensure that the GND path of these exposed copper areas to the power supply is the shortest and most smooth. This ensures that the current path of the entire power supply is the shortest and the interference is minimal. 5.2.3. SIM card The size of the SIM card is large, and there is no anti-EMI interference device itself, which is relatively susceptible to interference. Therefore, in the layout, first ensure that the SIM card is away from the antenna and the antenna extension cable inside the product, as close as possible to the module. When the PCB is routed, pay attention to The SIM_CLK signal is protected, and the SIM_DATA, SIM_RST, and SIM_VDD signals of the SIM card are away from the power source and away from the high-speed signal line. If the processing is not easy, it may cause problems such as not knowing the card or dropping the card. Therefore, please follow the following principles when designing:
Keep the SIM card holder away from the LTE antenna during the PCB layout phase;
Keep the SIM card away from the RF line, VBAT, and high-speed signal lines, and do not leave the SIM card too long. The GND of the SIM card holder should be in good communication with the GND of the module to make the GND equipotential between the two. To prevent SIM_CLK from interfering with other signals, it is recommended to protect SIM_CLK. It is recommended to place a 100nF capacitor on the SIM_VDD signal line near the SIM card holder. Place TVS near the SIM card holder. The parasitic capacitance of the TVS should not exceed 50pF. The 51 resistor in series with the module can enhance ESD protection. The SIM card signal line increases the capacitance of 22pf to ground to prevent radio frequency interference. The VBAT's return path has a large current, so the SIM card trace should avoid the VBAT return path. 31 MeiG hardware design guide 5.2.4. MIPI MIPI is a high-speed signal line. Users must pay attention to protection during the layout phase, so that they are away from the signal lines that are easily interfered. The GND processing must be performed on the upper and lower sides, and the traces are differential pairs. 100 ohm differential impedance matching is performed. Ensure impedance consistency and do not bridge different GND planes as much as possible. The MIPI interface selects a small-capacity TVS when selecting an ESD device. It is recommended that the parasitic capacitance be less than 1pF. The MIPI routing requirements are as follows:
The total length of the cable does not exceed 305mm It is required to control 100 ohm differential impedance with an error of 10%. The error of the differential line length within the group is controlled within 0.7mm. The length error between groups is controlled within 1.4mm. 5.2.5. USB The module supports high-speed USB interface at a rate of 480Mbps. The user recommends adding a common-mode inductor during the schematic design phase to effectively suppress EMI interference. If you need to increase the static protection, please select a TVS tube with a parasitic capacitance of less than 1pF. Please refer to the following notes when planning:
The common mode inductor should be close to the USB connector side. It is required to control the 90 ohm differential impedance with an error of 10%. The differential line length error is controlled within 6mm. If the USB has a charging function, please note that the VBUS cable is as wide as possible. If there is a test point, try to avoid the split line and put the test point on the path of the trace. Table 5.1:
Pin 14 13 5.2.6.Audio Signal Length(mm) Length ErrorP-N USB_DP USB_DM 26.2 26.5 0.2mm The module supports 3 analog audio signals. Analog signals are susceptible to interference from high speed digital signals. So stay away from high-speed digital signal lines. The module supports the LTE system, and the LTE signal can interfere with the audio by coupling and conduction. Users can add 33pF and 10pF capacitors to the audio path to filter out coupling interference. The 33pF capacitor mainly filters out the interference of the LTE band, and the 10pF capacitor mainly filters out the interference of the WCDMA band. The coupling interference of TDD has a great relationship with the PCB design of the user. In some cases, the LTE frequency band is more serious, and in some cases, the interference of the WCDMA frequency band is more serious. Therefore, the user can select the required filter capacitor according to the actual test result, and sometimes even do not need to paste the filter capacitor. 32 MeiG hardware design guide The LTE antenna is the main source of coupling interference for FDD, so users should pay attention to keeping the audio trace away from the LTE antenna and VBAT during PCB layout and routing. The filter capacitor of the audio is preferably placed close to the module end and placed next to the interface end. The audio output should be routed according to the differential signal rules. The conducted interference is mainly caused by the voltage drop of VBAT. If the Audio PA is directly powered by VBAT, it is easier to hear the zizi sound at the SPK output. Therefore, it is better to connect in parallel with the input of the Audio PA in the schematic design. Some large capacitance capacitors and series magnetic beads. TDD and GND also have a great relationship. If GND is not handled well, many high-frequency interference signals will interfere with MIC and Speaker through devices such as bypass capacitors, so users should ensure good performance of GND during PCB design. 5.2.7. Other The serial port interface of the module should also be kept as short as possible. It is best to walk in a group when routing, and do not distract the wires. 6. Electrical & Reliability 6.1 Absolute Maximum The table below shows the absolute maximum values that the module can withstand. Exceeding these limits can cause permanent damage to the module. Table 6.1: Absolute Maximum Minimum Typical Maximum Unit Paramete r VBAT VBUS Peak current
-
-
-
-
-
-
6 10.5 3 6.2 Working Temperature The table below shows the operating temperature range of the module:
Table 6.2: Module Operating Temperature Parame ter Workin g temper ature Minimum Typical Maximum
-25
-
75 33 V V A Unit MeiG hardware design guide Storage temper ature
-40
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90 6.3 Working Voltage Table 6.3: Module Operating Voltage Parameter Minimum Typical Maximum Unit VBAT VBUS Hardware shutdown voltage 3.4 4 2.5
-
5 2.8 4.2 6
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V V V 6.4 Digital Interface Features Table 6.4: Digital Interface Features (1.8V) Parameter Description Minimum Typical Maximum Unit VIH VIL VOH VOL Input high level voltage 1.17 Input low level voltage
-
Output high level voltage Output low level voltage 1.35
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-
-
-
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0.63
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0.45 V V V V 6.5 SIM_VDD Characteristics Table 6.5: SIM_VDD Characteristics Parameter Description Minimum Typical Maximum Unit VO IO Output voltage Output current
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3 1.8
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55 V mA 6.6 PWRKEY Feature Table 6.6: PWRKEY Characteristics Parameter Description Minimum Typical Maximum Unit PWRKEY High level 1.4
-
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V 34 MeiG hardware design guide low level
-
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0.6 Effective time 2000 V ms 6.7 VCOIN Feature Table 6.6: VCOIN Characteristics Paramet er Description Minimum Typical Maximum Unit VCOIN-IN VCOIN input voltage IRTC-IN VCOIN-
OUT VCOINCurrent consumption VCOIN Output voltage IRTC-OUT VCOIN Output current 2
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-
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3
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3
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3.25 8
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2 V uA V mA 6.8 Current Consumption (VBAT = 3.8V) Table 6.8: Current consumption Param eter Descrip tion VBAT voltage Condition Minimum Typical Voltage must be between the maximum and minimum values 3.4 3.8 Shutdown mode Standby power consumption WCDMAStandby power consumption TD-SStandby power consumption Standby power consumption Average current Ivbat FDDStandby power consumption TDDStandby power consumption Call Current consum ption Digital transmi ssion 32dBm
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Imax Peak Power control at maximum output current power
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Maximu m 4.2 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 3 Uni t V uA mA mA mA mA mA mA mA mA mA mA A 35 MeiG hardware design guide 6.9 Electrostatic Protection The module is not specifically protected against electrostatic discharge. Therefore, users must pay attention to electrostatic protection when producing, assembling, and operating modules. 6.10 Module Operating Frequency Band The table below lists the operating frequency bands of the module and complies with the 3GPP TS 05.05 technical specification. Table 6.9: Module Operating Band Frequency WCDMA B2 Receive Transmission 1932~1988MHZ 1852~1908MHZ WCDMA B4 2112~2153MHz 1712~1753MHz WCDMA B5 869894MHz 824849MHz LTE B2 LTE B4 LTE B5 LTE B7 LTE B12 LTE B13 LTE B17 19301990 MHz 18501910 MHz 21102155 MHz 17101755 MHz 869~894MHz 824~849MHz 2620~2690MHz 25002570MHz 729~746MHz 699716MHz 746~756PMHz 777787MHz 734~746MHz 704~716MHz Physical channel TX:9262~9538 RX:9662~9938 TX: 8562~8763 RX: 10562~10763 TX: 4132~4233 RX: 4357~4458 TX: 1860019150 RX:600~1199 TX: 19950~20399 RX: 1950~2399 TX:20400~20649 RX:2400~2649 TX:20750~21449 TX:23010~23179 RX:5010~5179 TX:23180~23279 RX:5180~5279 TX:23730~23849 RX:5730~5849 36 MeiG hardware design guide 6.11 RF Characteristics The following table lists the conducted RF output power of the module, in accordance with 3GPP TS 05.05 technical specification, 3GPP TS 134121-1 standard. Table 6.10: Conducted Output Power 6.12 Module Conduction Receiving Sensitivity The table below lists the conducted receive sensitivity of the module and is tested under static conditions. 37 MeiG hardware design guide Table 6.11: Conducted Receive Sensitivity Frequency band WCDMAB5 TDSCDMA1.9G TDSCDMA2G LTEFDD/TDD Receive sensitivity
(typical)
<-109 dBm
<-110 dBm
<-110 dBm See table 6.12 Receive sensitivity (maximum) 3GPP Claim 3GPP Claim 3GPP Claim 3GPP Claim Table 6.12: LTE Reference Sensitivity 3GPP Dual Antenna Requirements (QPSK) E-UTRA Frequency band 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz Duplex mode number 1 2 3 4 5 6 7 8 9 10 11 12 13 14
... 17 18 19 20 21 22 23 24 25 26
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-102.7
-101.7
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-99.7
-98.7
-100
-98
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-104.7
-101.7
-100
-103.2
-100.2
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-102.2
-99.2
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-101.7
-98.7
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-104.7
-101.7
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-98
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-97
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-1007
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-95
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-977
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-93.2
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-95.2
-94
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-93
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-95.27
-95.2
-91.2
-95.2
-92.2
-95.2
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-90
-91
-94
-101.2
-102.7
-98.2
-99.7
-96.5
-97.56
-93.5
-94.56
-91.7
-92.76
-90.5 FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD 38 MeiG hardware design guide 27 28 31
... 33 34 35 36 37 38 39 40 41
-103.2
-100.2
-98
-95
-100.2
-98.5
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-93.7
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-95.7
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-106.2
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-92 FDD FDD FDD TDD TDD TDD TDD TDD TDD TDD TDD TDD 6.13 WIFI Main RF Performance The table below lists the main RF performance under WIFI conduction. Table 6.13: Main RF performance parameters under WIFI conduction Transmission performance 802.11B 802.11G 802.11N Target power (minimum rate) Transmit power (maximum rate) 19
-
EVM (maximum rate) 20%
20
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-27 18.5
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-30 Receiving performance Receiving sensitivity 802.11B 802.11G 802.11N Minimum rate Maximum rate
-92
-89
-91
-74.5
-90
-72.5 Transmission performance 802.11A 802.11N Target power (minimum rate) Transmit power (maximum rate) 12.5
-
EVM (maximum rate)
-27 12.5
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-30 39 dBm dBm dB dBm dBm dBm dBm dB MeiG hardware design guide Receiving sensitivity 802.11B 802.11N Receiving performance Minimum rate Maximum rate
-88
-73
-89
-71 dBm dBm 6.14 BT Main RF Prformance The table below lists the main RF performance under BT conduction. Table 6.14: Main RF performance parameters under BT conduction Target power Receiving sensitivity Transmission performance DH5 11 2DH5 11 Receiving performance DH5
-94.5 2DH5
-94.5 3DH5 11.5 3DH5
-86 dBm dBm 6.15 GNSS Main RF Performance The table below lists the main RF performance under GNSS conduction. Table 6.15: Main RF performance parameters under GNSS conduction GNSS working frequency band: 1575.42MHZ GNSS carrier-to-noise ratio CN0: 39dB/Hz GNSS sensitivity:
GNSS startup time Capture (cold Capture (hot start)
-148 start)
-156 Track
-160 dBm Hot start Warm start Cold start TBD TBD TBD 40 MeiG hardware design guide 7. Production 7.1. Top And Bottom Views Of The Module Figure 48: Module top and bottom views 7.2. Recommended Soldering Furnace Temperature Curve Figure 49: Module recommended soldering furnace temperature curve 7.3. Humidity Sensitivity (MSL) The SLM756P module meets moisture sensitivity level 3. The dry package is subjected to the J-STD-
020C specification in accordance with the IPC/JEDEC standard under ambient conditions of <30 degrees of temperature and <60% of relative humidity. Under ambient conditions of temperature <40 41 MeiG hardware design guide degrees and relative humidity <90%, the shelf life is at least 6 months without unpacking. After unpacking, Table 22 lists the shelf life of the modules for different moisture sensitivity levels. Table 7.1: Humidity sensitivity level distinction Grade Factory environment+30/60%RH 1 2 2a 3 4 5 5a 6 Indefinite quality in the environment+30/85% RH Under conditions 1 Year 4 Weeks 168 hours 72 hours 48 hours 24 hours Use it after forced baking. After baking, the module must be patched within the time limit specified on the label. After unpacking, the SMT patch should be performed within 168 hours under ambient conditions of
<30 degrees and relative humidity <60%. If the above conditions are not met, baking is required. Note:
Oxidation risk: Baking SMD packages can cause metal oxidation and, if excessive, can cause solderability problems during board assembly. The temperature and time of the SMD package are baked, thus limiting solderability considerations. The accumulation of baking time should be no more than 96 hours at temperatures above 90 C and as high as 125 C. 7.4. Baking Requirements The MEIG Smart Module has a moisture rating of three. The SLM756P should be fully baked before reflow soldering, otherwise the module may cause permanent damage during reflow. The SLM756P can use the following three baking conditions. Users should note that the tray is not resistant to high temperatures. The user should take the module out of the tray for baking, otherwise the tray may be damaged by high temperature. Table 7.2: Baking requirements:
Baking condition 40/5%RH Baking time 30 Days 60/5%RH 72 Hours 90/5%RH 48Hours Description Original tray can be used Original tray can be used Original tray cannot be used 8. Support Peripheral Device List Table 8.1: List of supported display models Vendor Drive IC 42 MeiG hardware design guide DJN HOLITECH Table 8.2: List of supported camera models Vendor GXKJ GXKJ Table 8.3: List of supported touch screen models Vendor DJN HOLITECH DIXIAN Table8.4List of supported G sensor models Vendor Bosch Table8.5List of supported Ecompass models Vendor AKM Model BMA223 Model AK09911 Table8.6List of supported PS/ALS Sensor models ILI9881C ILI9881C Drive IC SP5506 SP2509 Drive IC GT5688 GT5688 GT970 Specification 3-Axis,8-bit Specification 3-Axis,14-bit Vendor Elan Model EPL2182KQWJ0 Specification ALS+PS Table8.7List of supported Gyro Sensor models Vendor Bosch Model BMI120 Specification 9-axis,16bit/16bit Table8.8 List of supported Flash LED Driver models Vendor SGMICRO Model Specification SGM3785YTDP14G/TR FLASH LED Driver,1.5A Table 8.8: Peripheral Support List Peripheral Fingerprint recognition Vendor ZHIANG Fingerprint recognition FingerCrystal Model 43 MeiG hardware design guide Identification Sweeping the pier CHINA-VISION Zeba 9. Appendix 9.1. Related Documents Table 9.1: Related documents Serial number File name Comment
[1]
[2]
[3]
[4]
[5]
[6]
GSM 07.07 GSM 07.10 GSM 07.05 GSM 11.14 GSM 11.11 GSM 03.38 Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) Support GSM 07.10 multiplexing protocol Digital cellular telecommunications(Phase 2+); Use of Data Terminal Equipment Data Circuit terminating Equipment(DTEDCE) interface for Short Message service(SMS)and Cell Broadcast Service(CBS) Digital cellular telecommunications system (Phase 2+);Specification of the SIM Application Toolkit for the Subscriber Identity ModuleMobile Equipment (SIM ME) interface Digital cellular telecommunications system (Phase 2+);Specification of the Subscriber Identity Module Mobile Equipment (SIMME) interface Digital cellular telecommunications system (Phase 2+); Alphabets and language-
specific information
[7]
GSM 11.10 Digital cellular telecommunications system (Phase 2)Mobile Station (MS) conformance specificationPart 1Conformance specification
[8]
AN_Serial Port AN_Serial Port 9.2. Terms And Explanations Table 9.2: Terms and explanations Explanations Terms ADC AMR CS Analog-to-Digital Converter Adaptive Multi-Rate Coding Scheme 44 MeiG hardware design guide Circuit Switched Data Clear to Send Data Terminal Equipment (typically computer, terminal, printer) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge European Telecommunication Standard Full Rate Half Rate International Mobile Equipment Identity Lithium-Ion Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated Password Authentication Protocol CSD CTS DTE DTR DTX EFR ESD ETS FR HR IMEI Li-ion MO MS MT PAP PBCCH Packet Broadcast Control Channel PCB PCL PCS PDU PPP RF RMS RX SIM SMS TDD TE TX UART URC USSD Printed Circuit Board Power Control Level Personal Communication System, also referred to as GSM 1900 Protocol Data Unit Point-to-point protocol Radio Frequency Root Mean Square (value) Receive Direction Subscriber Identification Module Short Message Service Time Division Distortion Terminal Equipment, also referred to as DTE Transmit Direction Universal Asynchronous Receiver & Transmitter Unsolicited Result Code Unstructured Supplementary Service Data 45 MeiG hardware design guide Phone book abbreviation Explanations FD LD MC ON RC SM NC SIM fix dialing phonebook SIM last dialing phonebook (list of numbers most recently dialed) Mobile Equipment list of unanswered MT calls (missed calls) SIM (or ME) own numbers (MSISDNs) list Mobile Equipment list of received calls SIM phonebook Not connect 9.3. Multiplexing function Table 9.3: Multiplexing Functions GPIO Module pin BLSP multiplexing function (default is blue) Other functions besides BLSP UART I2C SPI GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 92 91 90 89 82 81 59 58 116 10 11 83 74 73 76 75 70 69 72 71 80 79 MOSI MISO CS_N CLK MOSI MISO CS_N CLK MOSI MISO CS_N CLK MOSI MISO CS_N CLK MOSI MISO CS_N CLK MOSI MISO TX RX CTS RTS TX RX 46 I2S/GPIO I2S/GPIO I2S/GPIO I2S/GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO SDA SCL SDA SCL SDA SCL SDA SCL MeiG hardware design guide GPIO111 GPIO112 78 77 CS_N CLK CTS RTS SDA SCL GPIO GPIO 9.4. Safety Warning Pay attention to the following safety precautions when using or repairing any terminal or mobile phone that contains modules. The user should be informed of the following safety information on the terminal device. Otherwise, MeiG will not be responsible for any consequences caused by the user not following these warning actions. Table 9.4: Security Warnings Identificat ion Claim When you are at a hospital or medical facility, observe the restrictions on using your phone. If necessary, please turn off the terminal or mobile phone, otherwise the medical device may malfunction due to radio frequency interference. Turn off the wireless terminal or mobile phone before boarding. To prevent interference with the communication system, wireless communication equipment is prohibited on the aircraft. Ignoring the above will violate local laws and may result in a flight accident. Do not use mobile terminals or mobile phones in front of flammable gases. Turn off the mobile terminal when you are near an explosion, chemical factory, fuel depot, or gas station. It is dangerous to operate a mobile terminal next to any potentially explosive electrical equipment. The mobile terminal receives or transmits radio frequency energy when it is turned on. It can interfere with TV, radio, computer or other electrical equipment. Road safety first! Do not use a handheld terminal or mobile phone while driving, please use a hands-free device. Stop before using your handheld terminal or mobile phone. mobile terminals operate under RF signals and cellular networks, but are not guaranteed to be connected in all situations. For example, there is no credit or invalid SIM card. When in this situation and need emergency services, remember to use an emergency call. In order to be able to call and receive calls, the mobile terminal must be powered on and in a service area where the mobile signal is strong enough. Emergency calls are not allowed when certain network services or telephony features are in use, such as feature locks, keyboard locks. These functions should be removed before using an emergency call. Some networks require effective SIM card support. 47 MeiG hardware design guide 10. OEM/Integrators Installation Manual 10.1. List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27 part 15.247,part 15.407 requirements for Modular Approval. 10.2. Summarize the specific operational use conditions This module can be used in POS and other equipment. The input voltage to the module should be nominally 3.5~4.2 VDC ,typical value 3.8VDC and the ambient temperature of the module should not exceed 60. SLM756P has four External fixed rubber antenna with max antenna gain 5dBi . If the antenna needs to be changed, the certification should be re-applied. 10.3. Limited module procedures NA 10.4. Trace antenna designs NA 10.5. RF exposure considerations This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. If the device built into a host as a portable usage, the additional RF exposure evaluation may be required as specified by 2.1093. 10.6. Antennas Antenna type:
External fixed rubber antenna Antenna type:
External fixed rubber antenna Antenna type:
External fixed rubber antenna Antenna type:
2.4GHz band Peak Gain 0(dBi) BT Peak Gain 0(dBi) LTE band 4 Peak Gain 7(dBi) LTE band 17 5.2GHz band Peak Gain 0(dBi) WCDMA band 2 Peak Gain 10(dBi) LTE band 5 Peak Gain 12.92(dBi) 5.3GHz band Peak Gain 0(dBi) WCDMA band 4 Peak Gain 7(dBi) LTE band 7 Peak Gain 10(dBi) 5.5GHz band Peak Gain 0(dBi) WCDMA band 5 Peak Gain 12.92(dBi) LTE band 12 Peak Gain 13.92(dBi) 5.8GHz band Peak Gain 0(dBi) LTE band 2 Peak Gain 10(dBi) LTE band 13 Peak Gain 13.92(dBi) 48 MeiG hardware design guide External fixed rubber antenna Peak Gain -
13.92(dBi) 10.7. Label and compliance information When the module is installed in the host device, the FCC ID/IC label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: 2APJ4-SLM756P Contains IC: 23860- SLM756P The FCC ID/IC can be used only when all FCC ID/IC compliance requirements are met. 10.8. Information on test modes and additional testing requirements a) The modular transmitter has been fully tested by the module grantee on the required number of channels, modulation types, and modes, it should not be necessary for the host installer to re-test all the available transmitter modes or settings. It is recommended that the host product manufacturer, installing the modular transmitter,perform some investigative measurements to confirm that the resulting composite system does not exceed the spurious emissions limits or band edge limits (e.g., where a different antenna may be causing additional emissions). b) The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters, digital circuitry, or due to physical properties of the host product (enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a stand-alone configuration. It is important to note that host product manufacturers should not assume that because the modular transmitter is certified that they do not have any responsibility for final product compliance. c) If the investigation indicates a compliance concern the host product manufacturer is obligated to mitigate the issue. Host products using a modular transmitter are subject to all the applicable individual technical rules as well as to the general conditions of operation in Sections 15.5, 15.15, and 15.29 to not cause interference. The operator of the host product will be obligated to stop operating the device until the interference have been corrected , WIFI and Bluetooth testing using QRCT in FTM mode. 10.9. Additional testing, Part 15 Subpart B disclaimer The final host / module combination need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369. For host products with certified modular transmitter, the frequency range of investigation of the composite system is specified by rule in Sections 15.33(a)(1) through (a)(3), or the range applicable to the digital device, as shown in Section 15.33(b)(1), whichever is the higher frequency range of investigation When testing the host product, all the transmitters must be operating.The transmitters can be enabled by using publicly-available drivers and turned on, so the transmitters are active. In certain conditions it might be appropriate to use a technology-specific call box (test set) where accessory 49 MeiG hardware design guide devices or drivers are not available. When testing for emissions from the unintentional radiator, the transmitter shall be placed in the receive mode or idle mode, if possible. If receive mode only is not possible then, the radio shall be passive (preferred) and/or active scanning. In these cases, this would need to enable activity on the communication BUS (i.e., PCIe, SDIO, USB) to ensure the unintentional radiator circuitry is enabled. Testing laboratories may need to add attenuation or filters depending on the signal strength of any active beacons (if applicable) from the enabled radio(s). See ANSI C63.4, ANSI C63.10 and ANSI C63.26 for further general testing details. The product under test is set into a link/association with a partnering WLAN device, as per the normal intended use of the product. To ease testing, the product under test is set to transmit at a high duty cycle, such as by sending a file or streaming some media content. FCC Statment:
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation. ISED RSS Warning:
This device complies with Innovation, Science and Economic Development Canada licence-
exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'ISED applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre For IC , To meet RF exposure & ERP/ERIP, the maximum net gains of antennas allowed are 10dBi@WCDMA Band II/LTE Band 2 , 7dBi@ WCDMABand IV/ LTE Band 4 , 6.95dBi@
WCDMABand V/LTE Band 5 ,10.00dBi @LTE Band 7, 7.46dBi @ LTE Band 12/LTE Band 17,7.78dBi @ LTE Band 13. 50
This product uses the FCC Data API but is not endorsed or certified by the FCC