Meshreen MS516x ZigBee Module MS516x-Mxx series Data Sheet Meshreen DS-MS5168 / info@meshreen.com 1 Content 1. Introduction .................................................................................................................................................. 3 1.1 Variants ........................................................................................................................................... 3 2. Specification .................................................................................................................................................. 4 2.1 2.2 2.3 2.4 Pin configurations ............................................................................................................................ 5 Pin Assignment ................................................................................................................................ 6
.Pin Description ............................................................................................................................... 7 Power Supplies ................................................................................................................................ 7 3. Electrical Characteristics ................................................................................................................................ 8 3.1 3.2 Maximum Ratings ............................................................................................................................ 8 Operation Conditions ....................................................................................................................... 8 4 Module PCB Footprint....................................................................................................................................9 7. 6. 5. Optimal PCB placement of the MS5168-M00/M05 Module .......................................................................... 10 Reflow Profile .............................................................................................................................................. 11 Soldering Paste and Cleaning ......................................................................................................... 11 6.1 Ordering Information ................................................................................................................................... 12 Label example: ............................................................................................................................... 12 7.1 Federal Communication Commission Interference Statement .......................................................................13 Packing ........................................................................................................................................................ 15 RoHS Compliance ............................................................................................................................... 15 Disclaimers ......................................................................................................................................... 16 11. 12. Version Control ............................................................................................................................................ 17 8. 9. 10. Figure 7 PCB footprint ........................................................................................................................... 9 Figure 8 Optimal PCB placement............................................................................................................ 10 Figure 9 Module Reflow profile reference .............................................................................................. 11 Table 1 Meshreen module variants .......................................................................................................... 3 Table 2 Module specification ................................................................................................................... 4 Table 3 Pin Assignment ......................................................................................................................... 6 Table 4 Maximum Ratings ........................................................................................................................ 8 Table 5 Operation Conditions ................................................................................................................... 8 Meshreen DS-MS5168 / info@meshreen.com 2 1. Introduction The MS5168-001-Myy family is a range of ultra-low power, high performance surface mount modules targeted at IEEE 802.15.4, JenNet-IP, ZigBee Light Link, ZigBee Smart Energy and RF4CE networking applications, enabling users to realize products with minimum time to market and at the lowest cost. They remove the need for expensive and lengthy development of custom RF board designs and test suites. The modules use NXPs MS5168 wireless microcontroller to provide a comprehensive solution with large memory, high CPU and radio performance and all RF components included. All that is required to develop and manufacture wireless control or sensing products is to connect a power supply and peripherals such as switches, actuators and sensors, considerably simplifying product development. 1.1 Variants Module MS5168-M00 MS5168-M03 MS5168-M04 MS5168-M05 MS5169-M03 Power Standard Standard Chip JN5168-001 JN5168-001 JN5168-001 High JN5168-001 High JN5169-001 Middle Antenna PCB Antenna u-FL connector u-FL connector PCB Antenna u-FL Connector Dimension(mm) Compatible 30x16x2.8 21x16x2.8 30x16x2.8 30x16x2.8 21x16x2.8 JN5168-001-M00 JN5168-001-M03 JN5168-001-M06 N/A N/A FCC ID n/a 2AC2E-68M03 2AC2E-68M04 2AC2E-68M04 2AC2E-69M03 Table 1 Meshreen module variants Meshreen DS-MS5168 / info@meshreen.com 3 2. Specification There are differences between modules, the parameters are defined here. VDD=3.3V @ +25C Typical DC Characteristics Deep sleep current Sleep Current Radio Transmit current Radio receive current M00/03 100nA 0.70uA 15.3mA 17mA M04/05 100nA MS5169-M03 100nA Notes 0.70A 150mA 22mA 0.73A 23.3mA 15mA With active sleep timer CPU + Protocol +
radio transmitting CPU in doze + radio receiving Additional +/-15ppm allowance Centre frequency accuracy
+/-10ppm
+/-10ppm
+/-10ppm for Typical RF Characteristics temperature and ageing Notes Nominal for 1% PER, as per Receive sensitivity
-95dBm
-100dBm
-95dBm 802.15.4 section 6.5.3.3 (Note Maximum Transmit power
+2.5dBm
+18dBm
+9dBm Maximum input signal 10dBm
+5dBm
+10dBm 1) For 1% PER, measured as sensitivity RSSI range (dBm) RF Port impedance SMA/uFl connector
-95 ~ -10dBm
-105 ~ -20
-95~-10dBm 50 ohm 50 ohm 50 ohm 2.4 - 2.5GHz Rx Spurious Emissions
-61dBm
-69dBm
-70dBm Tx Spurious Emissions
-40dBm
-49dBm
--65dBm VSWR (max) Peripherals Master SPI port Slave SPI port Two UARTs Two-wire serial I/F (compatible with SMbus & I2C) 5 x PWM (4 x timer, 1x timer/counter) Two programmable Sleep Timers Digital IO lines (multiplexed with UARTs, timers and SPI selects) Four channel Analogue-to-Digital converter Programmable analogue comparators Internal temperature sensor and battery monitor Table 2 Module specification 2:1 2:1 2:1 3 selects 3 selects 20 18 Measured conducted into 50 ohms Measured conducted into 50 ohms 2.4 - 2.5GHz Notes 250kHz - 16MHz 250kHz - 8MHz 16550 compatible Up to 400kHz 16MHz clock 32kHz clock 10-bit, up to 100ks/s Ultra low power mode for sleep Meshreen DS-MS5168 / info@meshreen.com 4 2.1 Pin configurations Figure 1 Pin Configuration (top view) Note that the same basic pin configuration applies for all module designs. However, DIO3(pin9) and DIO2(pin8) are not available on the high power modules. Meshreen DS-MS5168 / info@meshreen.com 5 Pin No 1 2 3 4 5 6 7 8 9 2.2 Pin Assignment Primary Alternate Functions Pin Functions ADC1 DO0 DO1 SPICLK SPIMISO DIO18 SPIMOSI DIO19 SPISEL0 DIO0 SPISEL1 ADC3 DIO1 SPISEL2 ADC4 PC0 DIO2*
DIO3*
RFRX TIM0CK_GT RFTX TIM0CAP PWM2 PWM3 Signal Type 3.3V Description Analogue to Digital Input CMOS SPI Master Clock Output or PWM2 Output CMOS SPI Master In Slave Out Input or PWM3 Output CMOS SPI Master Out Slave In Output CMOS SPI Select From Module SS0 Output CMOS DIO0, SPI Slave Select Output 1 or ADC input 3 Output CMOS DIO1, SPI Slave Select Output 2, ADC input 4 or Pulse Counter 0 input CMOS DIO2, Radio Receive Control Output or Timer0 Clock/Gate Input CMOS DIO3, Radio Transmit Control Output or Timer0 Capture 10 DIO4 CTS0 JTAG_TCK TIM0OUT PC0 CMOS DIO4, UART 0 Clear To Send Input, JTAG CLK Input, Input Timer0 PWM output, or Pulse Counter 0 Input 11 DIO5 RTS0 JTAG_TMS PWM1 PC1 CMOS DIO5, UART 0 Request To Send Output, JTAG Mode 12 DIO6 TXD0 JTAG_TDO PWM2 13 DIO7 RXD0 JTAG_TDI PWM3 14 DIO8 TIM0CK_GT PC1 PWM4 Select Input, PWM1 Output or Pulse Counter 1 Input CMOS DIO6, UART 0 Transmit Data Output, JTAG Data Output or PWM2 Output CMOS DIO7, UART 0 Receive Data Input, JTAG Data Input or PWM 3 Output CMOS DIO8, Timer0 Clock/Gate Input, Pulse Counter1 Input or PWM 4 Output 15 DIO9 TIM0CAP 32KXTALIN RXD1 32KIN CMOS DIO9, Timer0 Capture Input, 32K External Crystal Input, 16 DIO10 TIM0OUT 32KXTALOUT 17 VDD GND DIO11 PWM1 18 19 20 TXD1 UART 1 Receive Data Input or 32K External Clock Input CMOS DIO10, Timer0 PWM Output or 32K External Crystal 3.3V Output Supply Voltage 0V Digital Ground CMOS DIO11, PWM1 Output or Timer1 Data Output DIO12 PWM2 CTS0 JTAG_TCK ADO or CMOS DIO12, PWM2 Output, UART0 Clear To Send Input, JTAG SPISMOSI CLK Input, Antenna Diversity Odd Output or SPI Slave Master Out Slave In Input 21 DIO13 PWM3 RTS0 JTAG_TMS ADE or CMOS DIO13, PWM3 Output, UART0 Request To Send Output, SPIMISO JTAG Mode Select Input, Antenna Diversity Even output or SPI Slave Master In Slave Out Output 22 23 RESETN CMOS Reset input DIO14 SIF_CLK TXD0 TXD1 JTAG_TDO SPISEL1 or CMOS DIO14, Serial Interface Clock, UART 0 Transmit Data SPISSEL Output, UART1 Transmit Data Output, JTAG Data Output, SPI Master Select Output 1 or SPI Slave Select Input 24 DIO15 SIF_D RXD0 RXD1 JTAG_TDI SPISEL2 CMOS DIO15, Serial Interface Data or Intelligent Peripheral Data Out 25 DIO16 COMP1P SIF_CLK SPISMOSI CMOS DIO16, Comparator Positive Input, Serial Interface clock or SPI Slave Master Output Slave In Input 26 DIO17 COMP1M PWM4 I2C DATA SPISIMO CMOS DIO17, Comparator Negative Input, Serial Interface Data 27 ADC2 Table 3 Pin Assignment or SPI Slave Master In Slave Out Output 3.3V Analogue to Digital Input
*These two pins are not connected for JN5168-001-M04 & JN5168 -001-M05 modules. Meshreen DS-MS5168 / info@meshreen.com 6 2.3
.Pin Description All pins behave as described in the DS- MS5168 Wireless Microcontroller Datasheet, with the exception of the following:
2.4 Power Supplies A single power supply pin, 3.3V VDD is provided. Meshreen DS-MS5168 / info@meshreen.com 7 3. Electrical Characteristics In most cases, the Electrical Characteristics are the same for both module and chip. They are described in detail in the chip datasheet. Where there are differences, they are detailed below 3.1 Maximum Ratings Exceeding these conditions will result in damage to the device. Parameter Device supply voltage VDD All Pins Storage temperature Table 4 Maximum Ratings Min
-0.3V
-0.3V
-40C Max 3.6V VDD + 0.3V 150C 3.2 Operation Conditions Supply VDD Min 2.0V Ambient temperature range
-40C Table 5 Operation Conditions Max 3.6V 85C Meshreen DS-MS5168 / info@meshreen.com 8 4. Module PCB Footprint Note 1: All modules have the same footprint Note 2: All Dimensions are mm Figure 7 PCB footprint Meshreen DS-MS5168 / info@meshreen.com 9 5. Optimal PCB placement of the MS5168-M00/M05 Module The JN5168-M00/M05 module features an optimized, low cost, integrated, inverted F, printed PCB antenna. The antenna has a vertically polarized near omnidirectional radiation pattern and up to 1.6 dBi of peak gain. The PCB design has been elongated in order to increase the ground plane area which increases the antenna efficiency. This allows standalone operation without any additional ground plane however care must be taken when mounting this module onto another PCB. The area around the antenna must be kept clear of conductors or other metal objects for an absolute minimum of 20 mm. This is true for all layers of the PCB and not just the top layer. Any conductive objects close to the antenna could severely disrupt the antenna pattern resulting in deep nulls and high directivity in some directions. The diagrams below show various possible scenarios. The top 3 scenarios are correct; ground plane may be placed beneath MS5168-M00/M05 module as long as it does not protrude beyond the edge of the top layer ground plane on the module PCB. The bottom 3 scenarios are incorrect; the left hand side example because there is ground plane underneath the antenna, the middle example because there is insufficient clearance around the antenna (it is best to have no conductors anywhere near the antenna), finally the right hand example has a batterys metal casing in the recommended keep out area. Figure 8 Optimal PCB placement Note: The antenna radiation pattern is same as JN5168-001-M00 Meshreen DS-MS5168 / info@meshreen.com 10 6. Reflow Profile For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste manufacturers guidelines on peak flow temperature, soak times, time above liquid and ramp rates. Figure 9 Module Reflow profile reference 6.1 Soldering Paste and Cleaning Meshreen does not recommend use of a solder paste that requires the module and PCB assembly to be cleaned
(rinsed in water) for the following reasons:
Solder flux residues and water can be trapped by the PCB, can or components and result in short circuits. The module label could be damaged or removed. MESHREEN recommends use of a 'no clean' solder paste for all its module products. Meshreen DS-MS5168 / info@meshreen.com 11 7. Ordering Information MS5168-Mxx Module Type:
00: Standard Power, Ceramic Antenna 03: Standard Power, Fl connector 04: High Power, Fl connector 05: High Power, PCB Antenna 06: Middle Power, uFl connector Main Chip Variant:
5168: MS5168-001 5169: MS5169-001 7.1 Label example:
Part Number FCC ID Date Code 1D Bar-Code: Serial Number Serial Number Meshreen DS-MS5168 / info@meshreen.com 12 8. Federal Communication Commission Interference Statement Any changes or modifications not expressly approved by the party responsible compliance could void your authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Notice:
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference and
(2) This device must accept any interference received, including interference that may cause undesired operation. RF Radiation Exposure Statement 1. This Transmitter must not be collocated or operating in conjunction with any other antenna or transmitter. 2. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). This applies to the MS5168-M00 and MS5168-M03 devices; the MS5168-M04 and MS5168-M05 are mobile devices (see below) High Power Module usage limitation The high power module variants are classified as mobile device pursuant with FCC 2.1091 and must not be used at a distance of < 20 cm (8) from any people. This applies to the MS5168-M04 and MS5168-M05 module type
(2AC2E-68M04). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product Meshreen DS-MS5168 / info@meshreen.com 13
(including the transmitter) and obtaining a separate FCC authorization. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual for the end product must include the following information in a prominent location; To comply with FCCs RF radiation exposure requirements, the antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. FCC End Product Labeling The final end product should be labeled in a visible area with the following: Contains TX FCC ID:
2AC2E-68M03 or 2AC2E-68M04 or 2AC2E-69M03 " to reflect the version of the module being used inside the product. Meshreen DS-MS5168 / info@meshreen.com 14 9. Packing For All models are packing in one size Tray, the Tray dimension is below. The standard packing is base on 500 pcs, use 11 trays which include cover. All modules will packing in vacuum packing bag which include trays, humidity indicator card, desiccant. 10. RoHS Compliance MS5168-Mxx modules meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS). Meshreen DS-MS5168 / info@meshreen.com 15 11. Disclaimers The contents of this document are subject to change without notice. Meshreen reserves the right to make changes, without notice, in the products, including circuits and/or software, described or contained therein. Information contained in this document regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Meshreen warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with Meshreen standard warranty. Testing and other quality control techniques are used to the extent MESHREEN deems necessary to support this warranty. Except where mandatory by government requirements, testing of all parameters of each product is not necessarily performed. MESHREEN assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or masks work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work infringement, unless otherwise specified. MESHREEN products are not intended for use in life support systems, appliances or systems where malfunction of these products can reasonably be expected to result in personal injury, death or severe property or environmental damage. MESHREEN customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify MESHREEN for any damages resulting from such use. All products are sold subject to MESHREEN's terms and conditions of sale supplied at the time of order acknowledgment. All trademarks are the property of their respective owners. 12. Version Control Version Date 2013.11.05 Notes 1st Issue 1.0 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 3.0 2014.03.21 Update PIN I/O names 2014.05.12 Add Picture, update thickness 2014.07.02 Modify module outline, Delete Label definition 2014.10.08 Add FCC warring chapter 2015.03.24 Add packing information, remove labeling information 2015.03.30 Add M06 specification 2015.05.12 Add Temperature conditions 2016.01.27 Modify FCC statement, Labeling example, Disclaimers, RoHS statement 2016.05.26 Add model MS5169-M03 Meshreen Ltd., Tel: +886-3-3594766 Fax: +886-3-3594733 Email: info@meshreen.com http://meshreen.com Meshreen DS-MS5168 / info@meshreen.com 16