FCC ID: FI5-WL18DBMOD Wifi Module

WL18x7MOD WiLink 8 Dual-Band Industrial Module Wi-Fi, Bluetooth, and Bluetooth Low Energy (LE) WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 1 Device Overview 1.1 1 Features General Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives, and Power Management Quick Hardware Design With TI Module Collateral and Reference Designs Operating Temperature: 40C to +85C Industrial Temperature Grade Small Form Factor: 13.3 13.4 2 mm 100-Pin MOC Package FCC, IC, ETSI/CE, and TELEC Certified With PCB, Dipole, Chip, and PIFA Antennas Wi-Fi WLAN Baseband Processor and RF Transceiver Support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n 20- and 40-MHz SISO and 20-MHz 2 2 MIMO at 2.4 GHz for High Throughput: 80 Mbps

(TCP), 100 Mbps (UDP) 2.4-GHz MRC Support for Extended Range and 5-GHz Diversity Capable Fully Calibrated: Production Calibration Not Required 4-Bit SDIO Host Interface Support Wi-Fi Direct Concurrent Operation

(Multichannel, Multirole) Bluetooth and Bluetooth low energy

(WL1837MOD Only) Bluetooth 4.2 Secure Connection Compliant and CSA2 Support (Declaration ID: D032800) Host Controller Interface (HCI) Transport for Bluetooth Over UART Dedicated Audio Processor Support of SBC Encoding + A2DP Dual-Mode Bluetooth and Bluetooth Low Energy TI's Bluetooth- and Bluetooth Low Energy-

Certified Stack Key Benefits Reduces Design Overhead Differentiated Use Cases by Configuring WiLink 8 Simultaneously in Two Roles (STA and AP) to Connect Directly With Other Wi-Fi Devices on Different RF Channel (Wi-Fi Networks) Best-in-Class Wi-Fi With High-Performance Audio and Video Streaming Reference Applications With Up to 1.4 the Range Versus One Antenna Different Provisioning Methods for In-Home Devices Connectivity to Wi-Fi in One Step Lowest Wi-Fi Power Consumption in Connected Idle (< 800 A) Configurable Wake on WLAN Filters to Only Wake Up the System Wi-Fi-Bluetooth Single Antenna Coexistence Internet of Things (IoT) 1.2 Applications Multimedia Home Electronics Home Appliances and White Goods Industrial and Home Automation Smart Gateway and Metering Video Conferencing Video Camera and Security 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ProductFolderOrderNowTechnicalDocumentsTools &SoftwareSupport &CommunityReferenceDesign WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 1.3 Description www.ti.com The certified WiLink 8 module from TI offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL1837MOD only) in a power-optimized design. The WL18x7MOD is a Wi-Fi, dual-band, 2.4- and 5-GHz module solution with two antennas supporting Industrial temperature grade. The device is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux and Android. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties. Device Information (1) PACKAGE QFM (100) QFM (100) BODY SIZE 13.3 mm 13.4 mm 2 mm 13.3 mm 13.4 mm 2 mm PART NUMBER WL1807MOD WL1837MOD

(1) For more information, see Section 9. _ Functional Block Diagram 1.4 Figure 1-1 shows a functional block diagram of the WL1837MOD variant. NOTE: Dashed lines indicate optional configurations and are not applied by default. Figure 1-1. WL1837MOD Functional Block Diagram 2 Device Overview Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD VIOZigBeeCOEXI/FMAC/PHY32.768kHzWLAN: SDIOBT: UARTWRF1WRF2BTRFBG2BTBG1MAC/PHYBTENWLANENWRFAAband5 GHzDPDTDFRF_ANT1RF_ANT226MTCXO2.4 GHzSPDTDPMVBATCopyright 2017,Texas Instruments Incorporated www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 Table of Contents 1.4 1.2 1.3 1.1 1 Device Overview ......................................... 1 Features .............................................. 1 Applications........................................... 1 Description............................................ 2 Functional Block Diagram ............................ 2 2 Revision History ......................................... 3 3 Device Comparison ..................................... 4 Related Products ..................................... 4 3.1 Terminal Configuration and Functions.............. 5 Pin Attributes ......................................... 6 4.1 Specifications .......................................... 10 Absolute Maximum Ratings......................... 10 5.1 ESD Ratings ........................................ 10 Recommended Operating Conditions............... 10 External Digital Slow Clock Requirements.......... 11 Thermal Resistance Characteristics for MOC 100-

Pin Package......................................... 11 5.4 5.5 5.2 5.3 4 5 5.6 WLAN Performance: 2.4-GHz Receiver Characteristics....................................... 12 5.7 WLAN Performance: 2.4-GHz Transmitter Power .. 13 5.8 WLAN Performance: 5-GHz Receiver Characteristics....................................... 14 5.9 WLAN Performance: 5-GHz Transmitter Power .... 14 5.10 WLAN Performance: Currents ...................... 15 5.11 Bluetooth Performance: BR, EDR Receiver CharacteristicsIn-Band Signals ................... 16 5.12 Bluetooth Performance: Transmitter, BR ........... 17 5.13 Bluetooth Performance: Transmitter, EDR.......... 17 5.14 Bluetooth Performance: Modulation, BR............ 17 5.15 Bluetooth Performance: Modulation, EDR .......... 18 5.16 Bluetooth low energy Performance: Receiver Characteristics In-Band Signals................... 18 5.17 Bluetooth low energy Performance: Transmitter Characteristics....................................... 18 5.18 Bluetooth low energy Performance: Modulation 6.3 Characteristics....................................... 19 5.19 Bluetooth BR and EDR Dynamic Currents.......... 19 5.20 Bluetooth low energy Currents...................... 19 5.21 Timing and Switching Characteristics............... 20 6 Detailed Description ................................... 28 6.1 WLAN Features ..................................... 29 Bluetooth Features.................................. 29 6.2 Bluetooth low energy Features ..................... 30 Device Certification.................................. 30 6.4 6.5 Module Markings .................................... 32 Test Grades ......................................... 32 6.6 End Product Labeling ............................... 33 6.7 6.8 Manual Information to the End User ................ 33 7 Applications, Implementation, and Layout........ 34 Application Information .............................. 34 8 Device and Documentation Support ............... 41 Device Support ...................................... 41 Related Links........................................ 44 Community Resources.............................. 44 Trademarks.......................................... 44 Electrostatic Discharge Caution..................... 44 Glossary ............................................. 44 7.1 8.2 8.5 8.3 8.1 8.4 8.6 9 Mechanical, Packaging, and Orderable Information .............................................. 45 TI Module Mechanical Outline ...................... 45 9.1 Tape and Reel Information.......................... 46 Packaging Information .............................. 48 9.3 9.2 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from November 18, 2016 to October 31, 2017 Page Changed Features.................................................................................................................... 1 Changed Bluetooth 4.1 to Bluetooth 4.2 .......................................................................................... 1 Added Bluetooth 4.2 secure connection compliance in Features .............................................................. 1 Changed package information in Device Information table ..................................................................... 2 Changed note in Absolute Maximum Ratings ................................................................................... 10 Bluetooth LE sensitivity typical value from 93.2 in LE Receiver Characteristics In-Band Signals .................... 18 added (Typ) to Specification column in WLAN Performance Parameters ................................................... 28 calibration performance from 5 seconds to 5 minutes WLAN Performance Parameters .................................. 28 Added Device Certification and Qualification section........................................................................... 30 Changed Module Markings section ............................................................................................... 32 Added End Product Labeling section............................................................................................. 33 Added Device Nomenclature image ............................................................................................. 43 Changed package type in Package Option Addendum ........................................................................ 49 Copyright 20142017, Texas Instruments Incorporated Revision History 3 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 3 Device Comparison www.ti.com The TI WiLink 8 module offers two footprint-compatible dual-band 2.4- and 5-GHz industrial temperature grade variants providing stand-alone Wi-Fi and Bluetooth combo connectivity. Table 3-1 compares the features of the module variants. Table 3-1. TI WiLink 8 Module Variants DEVICE WL1837MOD WL1807MOD WLAN 2.4-GHz SISO (1) WLAN 2.4-GHz MIMO (1) WLAN 2.4-GHz MRC (2) FEATURE BLUETOOTH WLAN 5-GHz SISO (1)

(1) SISO: single input, single output; MIMO: multiple input, multiple output.

(2) MRC: maximum ratio combining; supported at 11 g,n only. 3.1 Related Products For information about other devices in this family of products or related products, see the following links. Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low-power RF solutions suitable for a broad range of application. The offerings range from fully customized solutions to turnkey offerings with precertified hardware and software (protocol). Sub-1 GHz Long-range, low power wireless connectivity solutions are offered in a wide range of Sub-1 GHz ISM bands. Reference Designs for WL18xx The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor, and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at ti.com/tidesigns. 4 Device Comparison Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 4 Terminal Configuration and Functions Figure 4-1 shows the pin assignments for the 100-pin MOC package. Figure 4-1. 100-Pin MOC Package (Bottom View) Copyright 20142017, Texas Instruments Incorporated Terminal Configuration and Functions 5 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD PIN19-GNDPIN17-GNDPIN20-GNDPIN23-GNDPIN24-GNDPIN28-GNDPIN29-GNDPIN30-GNDPIN31-GNDPIN18-RF_ANT2PIN21-RESERVED1PIN22-RESERVED2PIN25-GPIO4PIN26-GPIO2PIN27-GPIO1PIN32-RF_ANT1PIN1-GNDPIN4-GPIO10PIN5-GPIO12PIN2-GPIO11PIN3-GPIO9PIN6-WL_SDIO_CMDPIN8-WL_SDIO_CLKPIN7-GNDPIN9-GNDPIN10-WL_SDIO_D0PIN11-WL_SDIO_D1PIN12-WL_SDIO_D2PIN13-WL_SDIO_D3PIN14-WLAN_IRQPIN15-GNDPIN16-GNDPIN33-GNDPIN40-WLAN_ENPIN38-VIOPIN39-GNDPIN37-GNDPIN41-BT_ENPIN43-BT_UART_DBGPIN46-VBAT_INPIN36-EXT_32KPIN34-GNDPIN35-GNDPIN42-WL_UART_DBGPIN44-GNDPIN45-GNDPIN47-VBAT_INPIN48-GNDPIN49-GNDPIN50-BT_HCI_RTSPIN51-BT_HCI_CTSPIN52-BT_HCI_TXPIN53-BT_HCI_RXPIN54-GNDPIN55-GNDPIN56-BT_AUD_INPIN57-BT_AUD_OUTPIN58-BT_AUD_FSYNCPIN60-BT_AUD_CLKPIN59-GNDPIN61-GNDPIN63-GNDPIN62-RESERVED3PIN64-GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDPin 2 Indicator WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 4.1 Pin Attributes Table 4-1 describes the module pins. www.ti.com Table 4-1. Pin Attributes PIN NAME PIN NO. TYPE/

DIR SHUTDOWN STATE (1) AFTER POWER UP (1) VOLTAGE LEVEL CONNECTIVITY (2) 1807 1837 DESCRIPTION (3) Clocks and Reset Signals WL_SDIO_CLK_1V8 Hi-Z Hi-Z 1.8 V Power-Management Signals POW PD PD 1.8 V EXT_32K WLAN_EN BT_EN VIO_IN VBAT_IN VBAT_IN TI Reserved GPIO11 GPIO9 GPIO10 GPIO12 RESERVED1 RESERVED2 GPIO4 RESERVED3 8 36 40 41 38 46 47 2 3 4 5 21 22 25 62 ANA I I I POW POW I/O I/O I/O I/O I I I/O O PD PD PD PD PU PU PD PD PD PD 1.8 V 1.8 V VBAT VBAT 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V PD PD PD PD PU PU PD PD PD PD v v v x v v v v v v v x x v x v v v v v v v v v v v x x v x WLAN SDIO clock. Must be driven by the host. Input sleep clock:

32.768 kHz Mode setting: high =

enable Mode setting: high =

enable. If Bluetooth is not used, connect to ground. Connect to 1.8-V external VIO Power supply input, 2.9 to 4.8 V Power supply input, 2.9 to 4.8 V Reserved for future use. NC if not used. Reserved for future use. NC if not used. Reserved for future use. NC if not used. Reserved for future use. NC if not used. Reserved for future use. NC if not used. Reserved for future use. NC if not used. Reserved for future use. NC if not used. Reserved for future use. NC if not used. Option: External TCXO.

(1) PU = pullup; PD = pulldown.

(2) v = connect; x = no connect.

(3) Host must provide PU using a 10-K resistor for all non-CLK SDIO signals. 6 Terminal Configuration and Functions Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 PIN NAME PIN NO. TYPE/

DIR SHUTDOWN STATE (1) AFTER POWER UP (1) VOLTAGE LEVEL CONNECTIVITY (2) 1807 1837 DESCRIPTION (3) Table 4-1. Pin Attributes (continued) WLAN Functional Block: Int Signals WL_SDIO_CMD_1V8 WL_SDIO_D0_1V8 WL_SDIO_D1_1V8 WL_SDIO_D2_1V8 6 10 11 12 I/O I/O I/O I/O Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z 1.8 V 1.8 V 1.8 V 1.8 V WL_SDIO_D3_1V8 13 I/O Hi-Z PU 1.8 V v v v v v v v v v v v v v v v v v v v v WLAN SDIO command WLAN SDIO data bit 0 WLAN SDIO data bit 1 WLAN SDIO data bit 2 WLAN SDIO data bit 3. Changes state to PU at WL_EN or BT_EN assertion for card detects. Later disabled by software during initialization. SDIO available, interrupt out. Active high. (For WL_RS232_TX/RX pullup is at power up.) Set to rising edge

(active high) on power up. The Wi-Fi interrupt line can be configured by the driver according to the IRQ configuration

(polarity/level/edge). 5G ANT diversity TX/RX , 2.4G Secondary antenna MRC/MIMO only WL_RS232_RX (when WLAN_IRQ = 1 at power up) WL_RS232_TX (when WLAN_IRQ = 1 at power up) 5G main ANT TX/RX, 2.4G WLAN main antenna SISO, Bluetooth Option: WLAN logger WL_IRQ_1V8 14 O PD 0 1.8 V v v RF_ANT2 18 ANA GPIO2 GPIO1 26 I/O PD 27 I/O PD PD PD RF_ANT1 ANA 32 42 WL_UART_DBG O PU PU 1.8 V 1.8 V 1.8 V Copyright 20142017, Texas Instruments Incorporated Terminal Configuration and Functions 7 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com Table 4-1. Pin Attributes (continued) PIN NAME PIN NO. TYPE/

DIR SHUTDOWN STATE (1) AFTER POWER UP (1) VOLTAGE LEVEL CONNECTIVITY (2) 1807 1837 DESCRIPTION (3) Bluetooth Functional Block: Int Signals PU PU PU PU PU PD PD PD PD PU PU PU PU PU PD PD PD PD BT_UART_DBG BT_HCI_RTS_1V8 BT_HCI_CTS_1V8 BT_HCI_TX_1V8 BT_HCI_RX_1V8 BT_AUD_IN BT_AUD_OUT BT_AUD_FSYNC BT_AUD_CLK Ground Pins GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 43 50 51 52 53 56 57 58 60 1 7 9 15 16 17 19 20 23 24 28 29 30 31 33 34 35 37 39 44 45 48 49 54 55 59 61 O O O I I I O I/O I/O GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V x x x x x x x x x v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v Option: Bluetooth logger UART RTS to host. NC if not used. UART CTS from host. NC if not used. UART TX to host. NC if not used. UART RX from host. NC if not used. Bluetooth PCM/I2S bus. Data in. NC if not used. Bluetooth PCM/I2S bus. Data out. NC if not used. Bluetooth PCM/I2S bus. Frame sync. NC if not used. Bluetooth PCM/I2S bus. NC if not used. v v v v v v v v v v v v v v v v v v v v v v v v v v v 8 Terminal Configuration and Functions Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com PIN NAME GND GND GND WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 Table 4-1. Pin Attributes (continued) PIN NO. TYPE/

DIR SHUTDOWN STATE (1) AFTER POWER UP (1) VOLTAGE LEVEL CONNECTIVITY (2) 1807 1837 DESCRIPTION (3) 63 G1 G36 64 GND GND GND v v v v v v v v v Copyright 20142017, Texas Instruments Incorporated Terminal Configuration and Functions 9 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 5 Specifications www.ti.com All specifications are measured at the module pins using the TI WL1837MODCOM8I evaluation board. All measurements are performed with VBAT = 3.7 V, VIO = 1.8 V, 25C for typical values with matched RF antennas, unless otherwise indicated. level-shifting I/Os with the TI WL18x7MOD, see the Level Shifting WL18xx I/Os For Application Report. NOTE 5.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VBAT VIO Input voltage to analog pins Input voltage limits (CLK_IN) Input voltage to all other pins Operating ambient temperature Storage temperature, Tstg MIN 0.5 0.5 0.5 0.5 40 40 MAX 4.8 (2) 2.1 2.1 VDD_IO

(VDD_IO + 0.5 V) 85 (3) 85 UNIT V V V V V C C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) 4.8 V cumulative to 2.33 years, including charging dips and peaks

(3) In the WL18xx system, a control mechanism exists to ensure Tj < 125C. When Tj approaches this threshold, the control mechanism manages the transmitter patterns. 5.2 ESD Ratings V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) Charged device model (CDM), per JEDEC specification JESD22-C101 (2)

(1)

(2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. VALUE 1000 250 UNIT V 5.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted)

(1) VBAT VIO VIH VIL VIH_EN VIL_EN VOH VOL Tr,Tf Tr Tf DC supply range for all modes 1.8-V I/O ring power supply voltage I/O high-level input voltage I/O low-level input voltage Enable inputs high-level input voltage Enable inputs low-level input voltage High-level output voltage Low-level output voltage

@ 4 mA

@ 4 mA VDD_IO 0.45 Input transitions time Tr,Tf from 10% to 90% (digital I/O) (2) Output rise time from 10% to 90%

(digital pins) (2) Output fall time from 10% to 90%

(digital pins) (2) CL < 25 pF CL < 25 pF TYP 3.7 1.8 0.65 VDD_IO 0.35 VDD_IO MIN 2.9 1.62 1.365 0 0 0 1 MAX UNIT 4.8 1.95 VDD_IO VDD_IO 0.4 VDD_IO 0.45 10 5.3 4.9 V V V V V V V V ns ns ns

(1) 4.8 V is applicable only for 2.33 years (30% of the time). Otherwise, maximum VBAT must not exceed 4.3 V.

(2) Applies to all digital lines except SDIO, UART, I2C, PCM and slow clock lines 10 Specifications Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 Recommended Operating Conditions (continued) over operating free-air temperature range (unless otherwise noted) Ambient operating temperature Maximum power dissipation WLAN operation Bluetooth operation MIN 40 TYP MAX UNIT 5.4 External Digital Slow Clock Requirements The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input. CONDITION MIN MAX UNIT TYP 32768 Input slow clock frequency Input slow clock accuracy (Initial + temp +

aging) WLAN, Bluetooth Tr, Tf Input transition time (10% to 90%) Frequency input duty cycle Square wave, DC-

coupled 15%

50%

0.65 x VDD_IO VDD_IO Vpeak 0 1 0.35 x VDD_IO M pF 5 Thermal Resistance Characteristics for MOC 100-Pin Package C W 85 2.8 0.2 250 ppm Hz ns 200 85%

(C/W) (2) 16.6 6.06 5.13 VIH, VIL Input voltage limits Input impedance Input capacitance 5.5 THERMAL METRICS (1) JA JB JC Junction to free air (3) Junction to board Junction to case (4) Report.

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application

(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70C is assumed.

(3) According to the JEDEC EIA/JESD 51 document

(4) Modeled using the JEDEC 2s2p thermal test board with 36 thermal vias Copyright 20142017, Texas Instruments Incorporated Specifications 11 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com 5.6 WLAN Performance: 2.4-GHz Receiver Characteristics over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. PARAMETER CONDITION MIN TYP MAX UNIT Operation frequency range 2412 2484 MHz RF_ANT1 pin 2.4-GHz SISO Sensitivity: 20-MHz bandwidth. At < 10% PER limit dBm 1 Mbps DSSS 2 Mbps DSSS 5.5 Mbps CCK 11 Mbps CCK 6 Mbps OFDM 9 Mbps OFDM 12 Mbps OFDM 18 Mbps OFDM 24 Mbps OFDM 36 Mbps OFDM 48 Mbps OFDM 54 Mbps OFDM MCS0 MM 4K MCS1 MM 4K MCS2 MM 4K MCS3 MM 4K MCS4 MM 4K MCS5 MM 4K MCS6 MM 4K MCS7 MM 4K MCS0 MM 4K 40 MHz MCS7 MM 4K 40 MHz MCS0 MM 4K MRC MCS7 MM 4K MRC MCS13 MM 4K MCS14 MM 4K MCS15 MM 4K OFDM CCK DSSS 2 Mbps DSSS 11 Mbps CCK 54 Mbps OFDM 95.0 92.0 89.2 86.3 91.0 89.0 88.0 85.5 82.5 79.0 74.0 72.5 89.3 86.5 84.5 81.5 78.0 73.5 71.5 70.0 86.0 66.3 91.0 73.0 70.0 69.0 68.3 10.0 6.0 1.0 70 1.0%

Adjacent channel rejection: Sensitivity level +3 dB for OFDM; Sensitivity level +6 dB for 11b Maximum input level RX leakage PER floor RSSI accuracy 20.0 10.0 4.0 42.0 38.0 2.0 dBm dB dBm 3 dB 12 Specifications Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 5.7 WLAN Performance: 2.4-GHz Transmitter Power over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. PARAMETER CONDITION (1) MIN TYP MAX UNIT RF_ANT1 Pin 2.4-GHz SISO Output Power: Maximum RMS output power measured at 1 dB from IEEE spectral mask or EVM (2) 1 Mbps DSSS 2 Mbps DSSS 5.5 Mbps CCK 11 Mbps CCK 6 Mbps OFDM 9 Mbps OFDM 12 Mbps OFDM 18 Mbps OFDM 24 Mbps OFDM 36 Mbps OFDM 48 Mbps OFDM 54 Mbps OFDM MCS0 MM MCS1 MM MCS2 MM MCS3 MM MCS4 MM MCS5 MM MCS6 MM MCS7 MM (3) MCS0 MM 40 MHz MCS7 MM 40 MHz MCS12 (WL18x5) MCS13 (WL18x5) MCS14 (WL18x5) MCS15 (WL18x5) 17.3 17.3 17.3 17.3 17.1 17.1 17.1 17.1 16.2 15.3 14.6 13.8 16.1 16.1 16.1 16.1 15.3 14.6 13.8 12.6 14.8 11.3 18.5 17.4 14.5 13.4 10.0 50.0 dBm dBm dB RF_ANT1 + RF_ANT2 MIMO RF_ANT1 + RF_ANT2 2412 2484 MHz Operation frequency range Return loss Reference input impedance

(1) Maximum transmitter power (TP) degradation of up to 30% is expected, starting from 80C ambient temperature on MIMO operation

(2) Regulatory constraints limit TI module output power to the following:

Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm. Channels 1, 11 @ OFDM legacy and HT 20-MHz rates: 12 dBm Channels 1, 11 @ HT 40-MHz rates: 10 dBm Channel 7 @ HT 40-MHz lower rates: 10 dBm Channel 5 @ HT 40-MHz upper rates: 10 dBm All 11B rates are limited to 16 dBm to comply with the ETSI PSD 10 dBm/MHz limit. All OFDM rates are limited to 16.5 dBm to comply with the ETSI EIRP 20 dBm limit. For clarification regarding power limitation, see the WL18xx .INI File Application Report.

(3) To ensure compliance with the EVM conditions specified in the PHY chapter of IEEE Std 802.11 2012:

MCS7 20 MHz channel 12 output power is 2 dB lower than the typical value. MCS7 20 MHz channel 8 output power is 1 dB lower than the typical value. Copyright 20142017, Texas Instruments Incorporated Specifications 13 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com 5.8 WLAN Performance: 5-GHz Receiver Characteristics over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. PARAMETER CONDITION MIN TYP MAX UNIT Operation frequency range 4910.0 5825.0 MHz RF_ANT1 or RF_ANT2 Sensitivity: 20-MHz bandwidth. At < 10%

PER limit 6 Mbps OFDM 1K 9 Mbps OFDM 1K 12 Mbps OFDM 1K 18 Mbps OFDM 1K 24 Mbps OFDM 1K 36 Mbps OFDM 1K 48 Mbps OFDM 1K 54 Mbps OFDM 1K MCS0 MM 4K MCS1 MM 4K MCS2 MM 4K MCS3 MM 4K MCS4 MM 4K MCS5 MM 4K MCS6 MM 4K MCS7 MM 4K MCS0 MM 4K 40 MHz MCS7 MM 4K 40 MHz OFDM OFDM54 92.5 90.5 90.0 87.5 84.5 81.0 76.5 74.6 91.4 88.0 86.0 83.0 79.8 75.5 74.0 72.4 88.5 69.3 15.0 52.0 1.0%

3 dBm dBm dBm dBm dB 2.0%

Maximum input level Adjacent channel rejection sensitivity +3 dB 30.0 2.0 RX LO leakage PER floor RSSI accuracy 5.9 WLAN Performance: 5-GHz Transmitter Power (1) over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITION (2) MIN TYP MAX UNIT RF_ANT1 or RF_ANT2

(1) All RF and performance numbers are aligned to the module pin.

(2) Maximum TP degradation of up to 30% is expected, starting from 80C ambient temperature on 5-GHz TX operation. 14 Specifications Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 WLAN Performance: 5-GHz Transmitter Power(1) (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITION (2) Operation frequency range MIN 4920 UNIT MAX 5825 RMS output power complies with IEEE mask and EVM requirements (3) 6 Mbps OFDM 9 Mbps OFDM 12 Mbps OFDM 18 Mbps OFDM 24 Mbps OFDM 36 Mbps OFDM 48 Mbps OFDM 54 Mbps OFDM MCS0 MM MCS1 MM 4K MCS2 MM 4K MCS3 MM 4K MCS4 MM 4K MCS5 MM 4K MCS6 MM 4K MCS7 MM 4K MCS0 MM 40 MHz MCS7 MM 40 MHz 2.4 GHz RX search SISO20 2.4-GHz RX search MIMO20 2.4-GHz RX search SISO40 2.4-GHz RX 20 M SISO 11 CCK 2.4-GHz RX 20 M SISO 6 OFDM 2.4-GHz RX 20 M SISO MCS7 2.4-GHz RX 20 M MRC 1 DSSS 2.4-GHz RX 20 M MRC 6 OFDM 2.4-GHz RX 20 M MRC 54 OFDM 2.4-GHz RX 40-MHz MCS7 5-GHz RX 20-MHz OFDM6 5-GHz RX 20-MHz MCS7 5-GHz RX 40-MHz MCS7 MHz dB dB TYP 18.0 18.0 18.0 18.0 17.4 16.5 15.8 14.5 18.0 18.0 18.0 18.0 16.5 15.8 14.5 13.0 16.5 12.0 0.125 10.0 50.0 49 58 74 63 60 61 69 74 81 85 81 68 77 85 Output power resolution Return loss Reference input impedance

(3) For further clarification regarding power limitation, see the WL18xx INI File Guide. 5.10 WLAN Performance: Currents (1) over operating free-air temperature range (unless otherwise noted) PARAMETER SPECIFICATION TYP (AVG) 25C UNIT Low-power mode (LPM) 2.4-GHz RX SISO20 single chain Receiver mA

(1) All RF and performance numbers are aligned to the module pin. Copyright 20142017, Texas Instruments Incorporated Specifications 15 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD 285 283 247 238 510 243 366 329 324 332 TYP 1 50 92.2 91.7 84.7 1e-6 1e-6 5.0 15.0 15.0 36.0 WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com WLAN Performance: Currents(1) (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER SPECIFICATION TYP (AVG) 25C UNIT Transmitter (2) mA 2.4-GHz TX 20 M SISO 6 OFDM 2.4-GHz TX 20 M SISO 11 CCK 2.4-GHz TX 20 M SISO 54 OFDM 2.4-GHz TX 20 M SISO MCS7 2.4-GHz TX 20 M MIMO MCS15 2.4-GHz TX 40 M SISO MCS7 5-GHz TX 20 M SISO 6 OFDM 5-GHz TX 20 M SISO 54 OFDM 5-GHz TX 20 M SISO MCS7 5-GHz TX 40 M SISO MCS7

(2) Numbers reflect the typical current consumption at maximum output power per rate. 5.11 Bluetooth Performance: BR, EDR Receiver CharacteristicsIn-Band Signals (1) over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITION MIN 2402 MAX 2480 Bluetooth BR intermodulation Level of interferers for n = 3, 4, and 5 30.0 Bluetooth BR, EDR operation frequency range Bluetooth BR, EDR channel spacing Bluetooth BR, EDR input impedance Bluetooth BR, EDR sensitivity (2) dirty TX on Bluetooth EDR BER floor at sensitivity + 10 dB Dirty TX off (for 1,600,000 bits) EDR2 EDR3 Bluetooth BR, EDR maximum usable input power Bluetooth BR, EDR C/I performance Numbers show wanted signal-

to-interfering-signal ratio. Smaller numbers indicate better C/I performances

(Image frequency = 1 MHz) BR, BER = 0.1%

EDR2, BER = 0.01%

EDR3, BER = 0.01%

BR, BER = 0.1%

EDR2, BER = 0.1%

EDR3, BER = 0.1%

BR, co-channel EDR, co-channel BR, adjacent 1 MHz EDR, adjacent 1 MHz,

(image) BR, adjacent +2 MHz EDR, adjacent +2 MHz BR, adjacent 2 MHz EDR, adjacent 2 MHz BR, adjacent 3 MHz EDR, adjacent 3 MHz EDR2 EDR3 EDR2 EDR3 EDR2 EDR3 EDR2 EDR3 EDR2 EDR3 UNIT MHz MHz dBm dBm dBm dB 10 12 20 3.0 3.0 2.0 33.0 33.0 28.0 20.0 20.0 13.0 42.0 42.0 36.0

(1) All RF and performance numbers are aligned to the module pin.

(2) Sensitivity degradation up to 3 dB may occur due to fast clock harmonics with dirty TX on. 16 Specifications Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 Bluetooth Performance: BR, EDR Receiver CharacteristicsIn-Band Signals(1) (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITION MIN Bluetooth BR, EDR RF return loss TYP 10.0 MAX UNIT dB 5.12 Bluetooth Performance: Transmitter, BR (1) over operating free-air temperature range (unless otherwise noted) PARAMETER MIN MAX UNIT

(1) All RF and performance numbers are aligned to the module pin.

(2) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%. 5.13 Bluetooth Performance: Transmitter, EDR (1) over operating free-air temperature range (unless otherwise noted) PARAMETER MIN MAX UNIT VBAT 3 V (3) VBAT < 3 V (3) BR RF output power (2) BR gain control range BR power control step BR adjacent channel power |M-N| = 2 BR adjacent channel power |M-N| > 2 VBAT 3 V (3) VBAT < 3 V (3) EDR output power (2) EDR gain control range EDR power control step EDR adjacent channel power |M-N| = 1 EDR adjacent channel power |M-N| = 2 EDR adjacent channel power |M-N| > 2 TYP 11.7 7.2 30.0 5.0 43.0 48.0 TYP 7.2 5.2 30 5 36 30 42 dBm dB dB dBm dBm dBm dB dB dBc dBm dBm BR modulation characteristics 120 130

(1) All RF and performance numbers are aligned to the module pin.

(2) Values reflect default maximum power. Maximum power can be changed using a VS command.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%. 5.14 Bluetooth Performance: Modulation, BR (1) over operating free-air temperature range (unless otherwise noted) CHARACTERISTICS CONDITION (2) BR 20-dB bandwidth Mod data = 4 1s, 4 0s:

111100001111... Mod data =

1010101... f1avg f2max limit for at least 99.9% of all f2max f2avg, f1avg One-slot packet Three- and five-slot packet lfk+5 fkl , k =

0 . max BR carrier frequency drift BR drift rate BR initial carrier frequency tolerance (3) f0fTX

(1) All RF and performance numbers are aligned to the module pin.

(2) Performance values reflect maximum power.

(3) Numbers include XTAL frequency drift over temperature and aging. MIN 145 85%

25 35 75 TYP 925 160 88%

MAX UNIT 995 170 kHz kHz kHz 25 35 kHz kHz 15 kHz/50 s 75 kHz Copyright 20142017, Texas Instruments Incorporated Specifications 17 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com 5.15 Bluetooth Performance: Modulation, EDR (1) over operating free-air temperature range (unless otherwise noted) PARAMETER (2) CONDITION TYP MAX UNIT 5.16 Bluetooth low energy Performance: Receiver Characteristics In-Band Signals (1) over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITION (2) EDR carrier frequency stability EDR initial carrier frequency tolerance (3) EDR RMS DEVM EDR 99% DEVM EDR peak DEVM EDR2 EDR3 EDR2 EDR3 EDR2 EDR3

(1) All RF and performance numbers are aligned to the module pin.

(2) Performance values reflect maximum power.

(3) Numbers include XTAL frequency drift over temperature and aging. Bluetooth low energy operation frequency range Bluetooth low energy channel spacing Bluetooth low energy input impedance Bluetooth low energy sensitivity (3) Dirty TX on Bluetooth low energy maximum usable input power Bluetooth low energy intermodulation characteristics Level of interferers. For n = 3, 4, 5 Bluetooth low energy C/I performance. Note: Numbers show wanted signal-to-

interfering-signal ratio. Smaller numbers indicate better C/I performance. Image = 1 MHz low energy, co-channel low energy, adjacent 1 MHz low energy, adjacent +2 MHz low energy, adjacent 2 MHz low energy, adjacent

|3|MHz MIN 5 75 MIN 2402 5 36 4%

4%

9%

9%

TYP 2 50 92.2 30 TYP 7.0 7.0 51.0 54.0 5 75 15%

10%

30%

20%

25%

18%

MAX 2480 12 0 38 15 40 kHz kHz UNIT MHz MHz dBm dBm dBm dB dBm dBm dBm

(1) All RF and performance numbers are aligned to the module pin.

(2) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to the Bluetooth low energy test specification.

(3) Sensitivity degradation of up to 3 dB can occur due to fast clock harmonics. 5.17 Bluetooth low energy Performance: Transmitter Characteristics (1) over operating free-air temperature range (unless otherwise noted) PARAMETER MIN MAX UNIT Bluetooth low energy RF output power (2) Bluetooth low energy adjacent channel power |M-N| = 2 Bluetooth low energy adjacent channel power |M-N| > 2 VBAT 3 V (3) VBAT < 3 V (3)

(1) All RF and performance numbers are aligned to the module pin.

(2) Bluetooth low energy power is restricted to comply with the ETSI 10-dBm EIRP limit requirement.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%. 18 Specifications Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 5.18 Bluetooth low energy Performance: Modulation Characteristics (1) over operating free-air temperature range (unless otherwise noted) CHARACTERISTICS CONDITION (2) Bluetooth low energy modulation characteristics Mod data = four 1s and four 0s:

111100001111... Mod data = 1010101... f1avg f2max limit for at least 99.9% of all f2max f2avg, f1avg Bluetooth low energy carrier frequency drift lf0 fnl , n = 2,3 . K Bluetooth low energy drift rate lf1 f0l and lfn fn-5l , n = 6,7. K Bluetooth low energy initial carrier frequency tolerance (3) fn fTX

(1) All RF and performance numbers are aligned to the module pin.

(2) Performance values reflect maximum power.

(3) Numbers include XTAL frequency drift over temperature and aging. 5.19 Bluetooth BR and EDR Dynamic Currents Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm. MIN 240 195 85%

25 75 TYP 250 215 90%

MAX UNIT 260 kHz 25 kHz 15 kHz/50 s 75 kHz USE CASE (1) (2) BR voice HV3 + sniff EDR voice 2-EV3 no retransmission + sniff Sniff 1 attempt 1.28 s EDR A2DP EDR2 (master). SBC high quality 345 kbps EDR A2DP EDR2 (master). MP3 high quality 192 kbps Full throughput ACL RX: RX-2DH5 (3) (4) Full throughput BR ACL TX: TX-DH5 (4) Full throughput EDR ACL TX: TX-2DH5 (4) Page scan or inquiry scan (scan interval is 1.28 s or 11.25 ms, respectively) Page scan and inquiry scan (scan interval is 1.28 s and 2.56 s, respectively)

(1) The role of Bluetooth in all scenarios except A2DP is slave.

(2) CL1P5 PA is connected to VBAT, 3.7 V.

(3) ACL RX has the same current in all modulations.

(4) Full throughput assumes data transfer in one direction. 5.20 Bluetooth low energy Currents All current measured at output power of 6.5 dBm USE CASE (1) Advertising, not connectable (2) Advertising, discoverable (2) Scanning (3) Connected, master role, 1.28-s connect interval (4) Connected, slave role, 1.28-s connect interval (4)

(1) CL1p% PA is connected to VBAT, 3.7 V.

(2) Advertising in all three channels, 1.28-s advertising interval, 15 bytes advertise data

(3) Listening to a single frequency per window, 1.28-s scan interval, 11.25-ms scan window

(4) Zero slave connection latency, empty TX and RX LL packets TYP 11.6 5.9 178.0 10.4 7.5 18.0 50.0 33.0 253.0 332.0 TYP 131 143 266 124 132 UNIT mA mA A mA mA mA mA mA A A UNIT A A A A A Copyright 20142017, Texas Instruments Incorporated Specifications 19 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 5.21 Timing and Switching Characteristics 5.21.1 Power Management 5.21.1.1 Block Diagram Internal DC-DCs www.ti.com The device incorporates three internal DC-DCs (switched-mode power supplies) to provide efficient internal supplies, derived from VBAT. 5.21.2 Power-Up and Shut-Down States Figure 5-1. Internal DC-DCs The correct power-up and shut-down sequences must be followed to avoid damage to the device. While VBAT or VIO or both are deasserted, no signals should be driven to the device. The only exception is the slow clock that is a fail-safe I/O. While VBAT, VIO, and slow clock are fed to the device, but WL_EN is deasserted (low), the device is in SHUTDOWN state. In SHUTDOWN state all functional blocks, internal DC-DCs, clocks, and LDOs are disabled. To perform the correct power-up sequence, assert (high) WL_EN. The internal DC-DCs, LDOs, and clock start to ramp and stabilize. Stable slow clock, VIO, and VBAT are prerequisites to the assertion of one of the enable signals. To perform the correct shut-down sequence, deassert (low) WL_EN while all the supplies to the device

(VBAT, VIO, and slow clock) are still stable and available. The supplies to the chip (VBAT and VIO) can be deasserted only after both enable signals are deasserted (low). Figure 5-2 shows the general power scheme for the module, including the power-down sequence. 20 Specifications Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL18xx Top LevelMain DC2DCVBATVIOFBSWPADC2DCFBSWDigital DC2DCFBSW1.8 V2.22.7 VVBATVIO_INVBAT_IN_MAIN_DC2DCVBAT_IN_PA_DC2DCVBATMAIN_DC2DC_OUTDIG_DC2DC_OUTVDD_DIGLDO_IN_DIGPA_DC2DC_OUTFB_IN_PA_DC2DC1 V www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 NOTE: 1. Either VBAT or VIO can come up first. NOTE: 2. VBAT and VIO supplies and slow clock (SCLK), must be stable prior to EN being asserted and at all times NOTE: when the EN is active. NOTE: 3. At least 60 s is required between two successive device enables. The device is assumed to be in NOTE: shutdown state during that period, meaning all enables to the device are LOW for that minimum duration. NOTE: 4. EN must be deasserted at least 10 s before VBAT or VIO supply can be lowered (order of supply turn off NOTE: after EN shutdown is immaterial). NOTE: 5. EXT_32K - Fail safe I/O Figure 5-2. Power-Up System 5.21.3 Chip Top-level Power-Up Sequence Figure 5-3 shows the top-level power-up sequence for the chip. Figure 5-3. Chip Top-Level Power-Up Sequence Copyright 20142017, Texas Instruments Incorporated Specifications 21 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD VBAT/ VIOinputEXT_32KinputWL_ENinputMain 1V8 DC2DCTCXO_CLK_REQoutputDIG DC2DCSRAM LDOInternal power stable = 5 msTop RESETZ4.5 ms delay>10 s123>10 s455>60 sVBATVIOEXT_32KWLEN WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 5.21.4 WLAN Power-Up Sequence Figure 5-4 shows the WLAN power-up sequence. www.ti.com Figure 5-4. WLAN Power-Up Sequence 5.21.5 Bluetooth-Bluetooth low energy Power-Up Sequence Figure 5-5 shows the Bluetooth-Bluetooth low energy power-up sequence. Figure 5-5. Bluetooth-Bluetooth low energy Power-Up Sequence 22 Specifications Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD Completion of Bluetooth firmware initialztion.Initialization timeIndicates completion of firmware downloadand internal initializationWake-up timeSLOWCLKinputWL_ENinputSDIO_CLKinputWLAN_IRQoutputTCXOinputTCXO_CLK_REQoutputTXCO_LDOoutputVBAT / VIOinputNLCPWLAN_IRQoutputMCPHost configures device toreverse WLAN_IRQ polarityWake-up timeIndicates completion of firmware downloadand internal initializationNLCP: trigger at rising edgeMCP: trigger at low level www.ti.com 5.21.6 WLAN SDIO Transport Layer WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 The SDIO is the host interface for WLAN. The interface between the host and the WL18xx module uses an SDIO interface and supports a maximum clock rate of 50 MHz. 4-bit data bus The device SDIO also supports the following features of the SDIO V3 specification:

Synchronous and asynchronous in-band interrupt Default and high-speed (HS, 50 MHz) timing Sleep and wake commands 5.21.6.1 SDIO Timing Specifications Figure 5-6 and Figure 5-7 show the SDIO switching characteristics over recommended operating conditions and with the default rate for input and output. Figure 5-6. SDIO Default Input Timing Table 5-1 lists the SDIO default timing characteristics. Figure 5-7. SDIO Default Output Timing Table 5-1. SDIO Default Timing Characteristics (1) fclock DC tTLH tTHL tISU tIH tODLY Cl Clock frequency, CLK (2) Low, high duty cycle (2) Rise time, CLK (2) Fall time, CLK (2) Setup time, input valid before CLK (2) Hold time, input valid after CLK (2) Delay time, CLK to output valid (2) Capacitive load on outputs (2) MIN 0.0 40.0%

3.0 2.0 7.0 MAX 26.0 60.0%

10.0 10.0 10.0 15.0 UNIT MHz ns ns ns ns ns pF

(1) To change the data out clock edge from the falling edge (default) to the rising edge, set the configuration bit.

(2) Parameter values reflect maximum clock frequency. Copyright 20142017, Texas Instruments Incorporated Specifications 23 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD tTHLtTLHVIHVILVILVIHVIHVOHValidVOLVDDVDDVSSVSSNot ValidNot ValidClock InputData OutputtWLVOHVOLtWHtODLY(max)tODLY(min)tTHLtTLHVIHVILVILVIHVIHtIHtISUVIHVIHValidVILVILVDDVDDVSSVSSNot ValidNot ValidClock InputData InputtWLtWH WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com 5.21.6.2 SDIO Switching Characteristics High Rate Figure 5-8 and Figure 5-9 show the parameters for maximum clock frequency. Figure 5-8. SDIO HS Input Timing Table 5-2 lists the SDIO high-rate timing characteristics. Figure 5-9. SDIO HS Output Timing Table 5-2. SDIO HS Timing Characteristics fclock DC tTLH tTHL tISU tIH tODLY Cl Clock frequency, CLK Low, high duty cycle Rise time, CLK Fall time, CLK Setup time, input valid before CLK Hold time, input valid after CLK Delay time, CLK to output valid Capacitive load on outputs MIN 0.0 40.0%

3.0 2.0 7.0 MAX 52.0 60.0%

3.0 3.0 10.0 10.0 UNIT MHz ns ns ns ns ns pF 24 Specifications Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD tTHLtTLHVIHVILVIHVIHVOHValidVOLVDDVDDVSSVSSNot ValidNot ValidClock InputData OutputtWLVOHVOLtWHtODLY(max)tOH(min)VIL50% VDD50% VDDtTHLtTLHVIHVILVILVIHVIHVIHVIHValidVILVILVDDVDDVSSVSSNot ValidNot ValidClock InputData InputtWLtWHtISUtIH50% VDD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com _ 5.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN) The device includes a UART module dedicated to the Bluetooth shared-transport, host controller interface

(HCI) transport layer. The HCI transports commands, events, and ACL between the Bluetooth device and its host using HCI data packets ack as a shared transport for all functional blocks except WLAN. Table 5-3 lists the transport mechanism for WLAN and bluetooth audio. Table 5-3. Transport Mechanism WLAN SHARED HCI FOR ALL FUNCTIONAL BLOCKS EXCEPT WLAN BLUETOOTH VOICE-AUDIO WLAN HS SDIO Over UART Bluetooth PCM The HCI UART supports most baud rates (including all PC rates) for all fast-clock frequencies up to a maximum of 4 Mbps. After power up, the baud rate is set for 115.2 Kbps, regardless of the fast-clock frequency. The baud rate can then be changed using a VS command. The device responds with a Command Complete Event (still at 115.2 Kbps), after which the baud rate change occurs. HCI hardware includes the following features:

Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions Receiver-transmitter underflow detection CTS, RTS hardware flow control 4 wire (H4) Table 5-4 lists the UART default settings. Table 5-4. UART Default Setting PARAMETER VALUE 115.2 Kbps 8 bits 1 None Bit rate Data length Stop-bit Parity 5.21.7.1 UART 4-Wire Interface H4 The interface includes four signals:

TXD RXD CTS RTS Flow control between the host and the device is byte-wise by hardware. When the UART RX buffer of the device passes the flow-control threshold, the buffer sets the UART_RTS signal high to stop transmission from the host. When the UART_CTS signal is set high, the device stops transmitting on the interface. If HCI_CTS is set high in the middle of transmitting a byte, the device finishes transmitting the byte and stops the transmission. Copyright 20142017, Texas Instruments Incorporated Specifications 25 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 Figure 5-10 shows the UART timing. www.ti.com Table 5-5 lists the UART timing characteristics. Figure 5-10. UART Timing Diagram Table 5-5. UART Timing Characteristics PARAMETER CONDITION TYP Baud rate Baud rate accuracy per byte Baud rate accuracy per bit CTS low to TX_DATA on CTS high to TX_DATA off CTS high pulse width RTS low to RX_DATA on RTS high to RX_DATA off t3 t4 t6 t1 t2 Figure 5-11 shows the UART data frame. Receive-transmit Receive-transmit MIN 37.5 2.5%

12.5%

0.0 1.0 0.0 MAX 4364 1.5%

12.5%

UNIT Kbps s Bit s 2.0 2.0 Hardware flow control 1.0 Byte Interrupt set to 1/4 FIFO 16.0 Bytes Figure 5-11. UART Data Frame 26 Specifications Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD STR-Start-bit;D0..Dn-Databits (LSBfirst);PAR - Paritybit(if used);STP- Stop-bitTXSTRD0D1D2DnPARSTPtb__ www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 5.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications Figure 5-12 shows the Bluetooth codec-PCM (audio) timing diagram. Figure 5-12. Bluetooth Codec-PCM (Audio) Master Timing Diagram Table 5-6 lists the Bluetooth codec-PCM master timing characteristics. Table 5-6. Bluetooth Codec-PCM Master Timing Characteristics PARAMETER MIN MAX 162.76 (6.144 MHz) 15625 (64 kHz) UNIT ns 35% of Tclk min 10.6 Table 5-7 lists the Bluetooth codec-PCM slave timing characteristics. Table 5-7. Bluetooth Codec-PCM Slave Timing Characteristics PARAMETER MIN MAX Tclk Tw tis tih top top Cl Tclk Tw tis tih tis tih top Cl Cycle time High or low pulse width AUD_IN setup time AUD_IN hold time AUD_OUT propagation time FSYNC_OUT propagation time Capacitive loading on outputs Cycle time High or low pulse width AUD_IN setup time AUD_IN hold time AUD_FSYNC setup time AUD_FSYNC hold time AUD_OUT propagation time Capacitive loading on outputs 0 0 0 0 5 0 0 81.38 (12.288 MHz) 35% of Tclk min 5 15 15 40 pF UNIT ns 19 40 pF Copyright 20142017, Texas Instruments Incorporated Specifications 27 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD tWtWtCLKtistihtop WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 6 Detailed Description www.ti.com The WiLink 8 module is a self-contained connectivity solution based on WiLink 8 connectivity. As the eighth-generation connectivity combo chip from TI, the WiLink 8 module is based on proven technology. Figure 6-1 shows a high-level view of the WL1837MOD variant. Figure 6-1. WL1837MOD High-Level System Diagram Table 6-1, Table 6-2, and Table 6-3 list performance parameters along with shutdown and sleep currents. Table 6-1. WLAN Performance Parameters WLAN (1) CONDITIONS SPECIFICATION (TYP) Maximum TX power, 5 GHz (OFDM6) 6-Mbps OFDM Maximum TX power, 2.4 GHz (1DSSS) 1-Mbps DSSS Minimum sensitivity, 5 GHz (OFDM6) 6-Mbps OFDM Minimum sensitivity, 2.4GHz (1DSSS) 1-Mbps DSSS Sleep current Connected IDLE RX search RX current (SISO20) RX current (SISO20) TX current (SISO20) TX current (SISO20) Leakage, firmware retained No traffic IDLE connect 2.4-GHz SISO 20 MCS7, 2.4 GHz MCS7, 5 GHz MCS7, 2.4 GHz MCS7, 5 GHz 18 16.5 92.5 95 160 750 58 69 77 238 324 850 UNIT dBm dBm dBm dBm A A mA mA mA mA mA mA Maximum peak current consumption during calibration (2)

(1) System design power scheme must comply with both peak and average TX bursts.

(2) Peak current VBAT can hit 850 mA during device calibration. At wakeup, the WiLink 8 module performs the entire calibration sequence at the center of the 2.4-GHz band. Once a link is established, calibration is performed periodically (every 5 minutes) on the specific channel tuned. The maximum VBAT value is based on peak calibration consumption with a 30% margin. 28 Detailed Description Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL18XXMOD32KHzXTAL32KHzWi-FiSDIOEnableVBATBTUARTAntenna 2Wi-Fi(Optional)Antenna 1Wi-Fi/BTVIOWPASupplicantandWi-FiDriverTISitaraProcessorrunningLinuxorAndroidUARTDriverSDIODriverBluetoothStackandProfilesWL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 Table 6-2. Bluetooth Performance Parameters BLUETOOTH CONDITIONS SPECIFICATION (TYP) Maximum TX power Minimum sensitivity GFSK GFSK Page or inquiry Sniff A2DP 1 attempt, 1.28 s (+4 dBm) 1.28-s interrupt, 11.25-ms scan window

(+4 dBm) MP3 high quality 192 kbps (+4 dBm) 11.7 92.2 178 253 7.5 Table 6-3. Shutdown and Sleep Currents PARAMETER POWER SUPPLY CURRENT VBAT VIO VBAT VIO VBAT VIO TYP 10 2 160 60 110 60 Shutdown mode All functions shut down WLAN sleep mode Bluetooth sleep mode 6.1 WLAN Features UNIT dBm dBm A A mA UNIT A A A The device supports the following WLAN features:

Baseband processor: IEEE Std 802.11a, 802.11b/g, and IEEE Std 802.11n data rates with 20- or Integrated 2.4-GHz power amplifiers (PAs) for a complete WLAN solution 40-MHz SISO and 20-MHz MIMO Fully calibrated system (production calibration not required) Medium access controller (MAC) Embedded ARM central processing unit (CPU) Hardware-based encryption-decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys Requirements for Wi-Fi-protected access (WPA and WPA2.0) and IEEE Std 802.11i (includes hardware-accelerated Advanced Encryption Standard [AES]) New advanced coexistence scheme with Bluetooth and Bluetooth low energy wireless technology 2.4- and 5-GHz radio Internal LNA and PA IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n 4-bit SDIO host interface, including high speed (HS) and V3 modes 6.2 Bluetooth Features The device supports the following Bluetooth features:

Bluetooth 4.2 secure connection as well as CSA2 Concurrent operation and built-in coexisting and prioritization handling of Bluetooth and Bluetooth low energy wireless technology, audio processing, and WLAN Dedicated audio processor supporting on-chip SBC encoding + A2DP Assisted A2DP (A3DP): SBC encoding implemented internally Assisted WB-speech (AWBS): modified SBC codec implemented internally Copyright 20142017, Texas Instruments Incorporated Detailed Description 29 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 6.3 Bluetooth low energy Features The device supports the following Bluetooth low energy features:

Bluetooth 4.2 low energy dual-mode standard All roles and role combinations, mandatory as well as optional Up to 10 low energy connections Independent performance 6.4 Device Certification low energy buffering allowing many multiple connections with no affect on BR-EDR The WL18MODGI modules from TI (test grades 07 and 37) are certified for FCC, IC, ETSI/CE, and Japan MIC. Moreover, the module is also Wi-Fi certified and has the ability to request a certificate transfer for Wi-

Fi alliance members. TI customers that build products based on the WL18MODGI device from TI can save on testing costs and time per product family. Table 6-4 shows the certification list for the WL18MODGI module. Regulatory Body FCC (USA) ISED (Canada) ETSI/CE (Europe) Table 6-4. Device Certification Specification ID (If Applicable) Part 15C + MPE FCC RF exposure Z64-WL18DBMOD RSS-102 (MPE) and RSS-247 (Wi-Fi, Bluetooth) 451I-WL18DBMOD EN300328 v2.1.1 (2.4-GHz Wi-Fi, Bluetooth) EN301893 v2.1.1 (5-GHz Wi-Fi) EN62311:2008 (MPE) EN301489-1 v2.1.1 (general EMC) EN301489-17 v3.1.1 (EMC) EN60950-

1:2006/A11:2009/A1:2010/A12:2011/A2:2013 MIC (Japan) Article 49-20 of ORRE 201-140447 6.4.1 FCC Certification and Statement The WL18MODGI modules from TI are certified for the FCC as a single-modular transmitter. The modules are FCC-certified radio modules that carries a modular grant. Users are cautioned that changes or modifications not expressively approved by the party responsible for compliance could void the authority of the user to operate the equipment. This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:

This device may not cause harmful interference. This device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement:

CAUTION This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be colocated or operating with any other antenna or transmitter. 30 Detailed Description Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 6.4.2 Innovation, Science, and Economic Development Canada (ISED) The WL18MODGI modules from TI are certified for IC as a single-modular transmitter. The WL18MODGI modules from TI meet IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment. This device complies with Industry Canada licence-exempt RSS standards. Operation is subject to the following two conditions:

This device may not cause interference. This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

L'appareil ne doit pas produire de brouillage. L'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. IC RF Radiation Exposure Statement:

CAUTION To comply with IC RF exposure requirements, this device and its antenna must not be colocated or operating in conjunction with any other antenna or transmitter. Pour se conformer aux exigences de conformit RF canadienne l'exposition, cet appareil et son antenne ne doivent pas tre co-localiss ou fonctionnant en conjonction avec une autre antenne or transmitter. 6.4.3 ETSI/CE 6.4.4 MIC Certification The WL18MODGB modules conform to the EU Radio Equipment Directive. For further detains, see the full text of the EU Declaration of Conformity for the WL18MODGI (test grade 07) and WL18MODGI (test grade 37) devices. The WL18MODGI modules from TI are MIC certified against article 49-20 and the relevant articles of the Ordinance Regulating Radio Equipment. Operation is subject to the following condition:

The host system does not contain a wireless wide area network (WWAN) device. Copyright 20142017, Texas Instruments Incorporated Detailed Description 31 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 7 Applications, Implementation, and Layout www.ti.com NOTE Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TIs customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 7.1 Application Information 7.1.1 Typical Application WL1837MOD Reference Design Figure 7-1 shows the TI WL1837MODGI reference design. 34 Applications, Implementation, and Layout Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 Copyright 20142017, Texas Instruments Incorporated Applications, Implementation, and Layout 35 Figure 7-1. TI Module Reference Schematics Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WLAN/BT Enable Control.Connect to Host GPIO.For Debug onlyConnect to Host HCI Interface.Connect to Host BT PCM Bus.Connect to Host SDIO Interface.For Debug onlyExternal TCXO option.ANT1 - WL_2.4_IO2/BT/WL_5GHzANT2 - WL_2.4_IO1/WL_5GHzFor Debug onlyFor Debug onlyFor Debug onlyWL_IRQ_1V8WL_SDIO_D3_1V8WL_SDIO_CLK_1V8WL_SDIO_D2_1V8WL_SDIO_D1_1V8WL_SDIO_D0_1V8WL_SDIO_CMD_1V8EXT_32KBT_HCI_RTS_1V8BT_HCI_CTS_1V8BT_AUD_CLKBT_AUD_INBT_AUD_OUTBT_AUD_FSYNCWL_RS232_TX_1V8WL_RS232_RX_1V8BT_HCI_TX_1V8BT_HCI_RX_1V8BT_ENWLAN_ENVIO_INVIO_INVBAT_INTP6L2NU0402C210uF0603J5U.FL-R-SMT(10)U.FL123C142.4pF0402C131pF0402TP10R10R0402TP7TP2TP13TP5R2NU_0R0402R13NURES1005ANT1W3006ANT-10.0X3.2MM_BFEED1NC2L11.3nH0402C11uF0402TP4TP3L42.2nH0402TP11J6U.FL-R-SMT(10)U.FL123U1WL1837MODGIE-13.4X13.3-N100_0.75-TOPGND17VIO38VBAT47EXT_32K36BT_AUD_FSYNC58BT_AUD_IN56BT_AUD_OUT57BT_AUD_CLK60WL_SDIO_D212WL_SDIO_CLK8WL_SDIO_D313WL_SDIO_D010WL_SDIO_D111WL_SDIO_CMD6BT_HCI_RTS50BT_HCI_RX53BT_HCI_TX52BT_HCI_CTS51GND16GPIO_425GPIO_226GPIO_127BT_EN_SOC41WLAN_IRQ14WLAN_EN_SOC40BT_UART_DBG43WL_UART_DBG42GNDG13GNDG14GNDG15GNDG16GNDG9GNDG10GND48GNDG11GNDG12VBAT46GND28GNDG1GNDG2GNDG3GNDG4GNDG5GNDG6GNDG7GNDG8RF_ANT132RESERVED64GND1GND20RESERVED121RESERVED222GND37GND19RESERVED362GNDG17GNDG18GNDG19GNDG20GNDG21GNDG22GNDG23GNDG24GNDG25GNDG26GNDG27GNDG28GNDG29GNDG30GNDG31GNDG32GNDG33GNDG34GNDG35GND23GND59GND34GND29GND7RF_ANT218GND49GND9GND31GND35GND15GND55GND45GND44GND30GND24GND63GND61GND39GND33GND54GNDG36GPIO112GPIO93GPIO104GPIO125R140R0402ANT2W3006ANT-10.0X3.2MM_AFEED1NC2L31.8nH0402C30.1uF0402TP12R30R0402TP1R4NU_0R0402TP8 www.ti.com 1 1 2 2 1 1 1 1 1 1 1 1 2 TI TXC Pulse Hirose Murata Murata Murata Murata Murata Walsin Murata TDK Walsin WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 Table 7-1 lists the bill materials (BOM). ITEM DESCRIPTION PART NO. PACKAGE REFERENCE QTY MFR Table 7-1. Bill of Materials 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 13 WL1837 Wi-Fi / Bluetooth module WL1837MODGI XOSC 3225 / 32.768 kHz / 1.8 V / 50 ppm ANT / Chip / 2.4 GHz and 5 GHz (1) 7XZ3200005 W3006 Mini-RF header receptacle U.FL-R-SMT-1 (10) Inductor 0402 / 1.3 nH / 0.1 nH / SMD LQP15MN1N3B02 Inductor 0402 / 1.8 nH / 0.1 nH / SMD LQP15MN1N8B02 Inductor 0402 / 2.2 nH / 0.1 nH / SMD LQP15MN2N2B02 Capacitor 0402 / 1 pF/ 50 V / C0G / 0.1 pF GJM1555C1H1R0BB01 Capacitor 0402 / 2.4 pF / 50 V / C0G /

0.1 pF Capacitor 0402 / 0.1 F / 10 V / X7R /

10%

Capacitor 0402 / 1 F / 6.3 V / X5R /

10%/HF Capacitor 0603 / 10 F / 6.3 V / X5R /

20%

GJM1555C1H2R4BB01 0402B104K100CT GRM155R60J105KE19D C1608X5R0J106M 13.4 13.3 2.0 mm 3.2 2.5 1.0 mm 10.0 3.2 1.5 mm 3.0 2.6 1.25 mm ANT1, ANT2 U1 OSC1 J5, J6 L1 L3 L4 C13 C14 C3 C1 C2 0402 0402 0402 0402 0402 0402 0402 0603 0402 13 Resistor 0402 / 0R / 5%

WR04X000 PTL R1, R3

(1) For more information, see the Pulse Electronics W3006 product page. 7.1.2 Design Recommendations This section describes the layout recommendations for the WL1837 module, RF trace, and antenna. Table 7-2 summarizes the layout recommendations. ITEM Thermal Table 7-2. Layout Recommendations Summary DESCRIPTION The proximity of ground vias must be close to the pad. Signal traces must not be run underneath the module on the layer where the module is mounted. Have a complete ground pour in layer 2 for thermal dissipation. Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible. Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer. RF Trace and Antenna Routing The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate. The RF trace bends must be gradual with an approximate maximum bend of 45 with trace mitered. RF traces must not have sharp corners. RF traces must have via stitching on the ground plane beside the RF trace on both sides. RF traces must have constant impedance (microstrip transmission line). For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid. There must be no traces or ground under the antenna section. RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered. 36 Applications, Implementation, and Layout Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com ITEM Supply and Interface 14 15 16 17 18 19 Table 7-2. Layout Recommendations Summary (continued) DESCRIPTION The power trace for VBAT must be at least 40-mil wide. The 1.8-V trace must be at least 18-mil wide. Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. If possible, shield VBAT traces with ground above, below, and beside the traces. SDIO signals traces (CLK, CMD, D0, D1, D2, and D3) must be routed in parallel to each other and as short as possible (less than 12 cm). In addition, every trace length must be the same as the others. There should be enough space between traces greater than 1.5 times the trace width or ground to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses. SDIO and digital clock signals are a source of noise. Keep the traces of these signals as short as possible. If possible, maintain a clearance around them. 7.1.3 RF Trace and Antenna Layout Recommendations Figure 7-2 shows the location of the antenna on the WL1837MODCOM8I board as well as the RF trace routing from the WL1837 module (TI reference design). The Pulse multilayer antennas are mounted on the board with a specific layout and matching circuit for the radiation test conducted in FCC, CE, and IC certifications. Figure 7-2. Location of Antenna and RF Trace Routing on the WL1837MODCOM8I Board Follow these RF trace routing recommendations:

RF traces must have 50- impedance. RF traces must not have sharp corners. RF traces must have via stitching on the ground plane beside the RF trace on both sides. RF traces must be as short as possible. The antenna, RF traces, and module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. Copyright 20142017, Texas Instruments Incorporated Applications, Implementation, and Layout 37 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD Antennas are orthogonalto each other.Antennas distance is Higher thanhalf wavelength.No sharp corners.Constant 50controlimpedance RFTrace.Antenna placement onthe edge of the board.76.00 mm WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com 7.1.4 Module Layout Recommendations Figure 7-3 and Figure 7-4 show layer 1 and layer 2 of the TI module layout. Figure 7-3. TI Module Layout: Layer 1 38 Applications, Implementation, and Layout Copyright 20142017, Texas Instruments Incorporated Figure 7-4. TI Module Layout: Layer 2 (Solid GND) Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 Follow these module layout recommendations:

Ensure a solid ground plane and ground vias under the module for stable system and thermal Do not run signal traces underneath the module on a layer where the module is mounted. Signal traces can be run on a third layer under the solid ground layer and beneath the module dissipation. mounting. Run the host interfaces with ground on the adjacent layer to improve the return path. TI recommends routing the signals as short as possible to the host. 7.1.5 Thermal Board Recommendations The TI module uses vias for layers 1 through 6 with full copper filling, providing heat flow all the way to the module ground pads. TI recommends using one big ground pad under the module with vias all the way to connect the pad to all ground layers (see Figure 7-5). Figure 7-5. Block of Ground Pads on Bottom Side of Package Figure 7-6 shows via array patterns, which are applied wherever possible to connect all of the layers to the TI module central or main ground pads. Copyright 20142017, Texas Instruments Incorporated Applications, Implementation, and Layout 39 Figure 7-6. Via Array Patterns Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD ModuleCOM8 Board WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 7.1.6 Baking and SMT Recommendations 7.1.6.1 Baking Recommendations www.ti.com Follow these baking guidelines for the WiLink 8 module:

Follow MSL level 3 to perform the baking process. After the bag is open, devices subjected to reflow solder or other high temperature processes must be mounted within 168 hours of factory conditions (< 30C/60% RH) or stored at <10% RH. If the Humidity Indicator Card reads >10%, devices require baking before they are mounted. If baking is required, bake devices for 8 hours at 125C. 7.1.6.2 SMT Recommendations Figure 7-7 shows the recommended reflow profile for the WiLink 8 module. Figure 7-7. Reflow Profile for the WiLink 8 Module Table 7-3 lists the temperature values for the profile shown in Figure 7-7. Table 7-3. Temperature Values for Reflow Profile ITEM TEMPERATURE (C) TIME (s) Preheat Soldering Peak temperature D1 to approximately D2: 140 to 200 T1: 80 to approximately 120 D2: 220 D3: 250 maximum T2: 60 10 T3: 10 NOTE TI does not recommend the use of conformal coating or similar material on the WiLink 8 module. This coating can lead to localized stress on the WCSP solder connections inside the module and impact the device reliability. Care should be taken during module assembly process to the final PCB to avoid the presence of foreign material inside the module. 40 Applications, Implementation, and Layout Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD Temp(degC)Time(SeC)D1D2D3MeatingPreheatSolderingCoolingT1T2T3 www.ti.com 8 Device and Documentation Support 8.1 Device Support 8.1.1 Third-Party Products Disclaimer WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 8.1.2 Development Support 8.1.2.1 Tools and Software TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. For a complete listing of development-support information on pricing and availability, contact the nearest TI field sales office or authorized distributor. the Texas Instruments WL18xx Wiki. For tools, visit Design Kits and Evaluation Modules AM335x EVM (TMDXEVM3358) The AM335x EVM enables developers to immediately evaluate the AM335x processor family (AM3351, AM3352, AM3354, AM3356, and AM3358) and begin building applications, such as portable navigation, portable gaming, and home and building automation. AM437x Evaluation Module (TMDSEVM437X) The AM437x EVM enables developers to immediately evaluate the AM437x processor family (AM4376, AM4377, AM4378, and AM4379 ) and begin building applications, such as portable navigation, patient monitoring, home and building automation, barcode scanners, and portable data terminals. BeagleBone Black Development Board (BEAGLEBK) BeagleBone Black is a low-cost, open source, community-supported development platform for ARM Cortex-A8 processor developers and hobbyists. Boot Linux in under 10 seconds and get started on Sitara AM335x ARM Cortex-

A8 processor development in less than 5 minutes using just a single USB cable. WiLink 8 Module 2.4 GHz Wi-Fi + Bluetooth COM8 EVM (WL1835MODCOM8B) The for Sitara EVMs easily enables customers to add Wi-Fi and WL1835MODCOM8 Kit Bluetooth technology (WL183x module only) to embedded applications based on TI's Sitara microprocessors. TIs WiLink 8 Wi-Fi + Bluetooth modules are precertified and offer high throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL183x modules only) in a power-optimized design. Drivers for the Linux and Android high-level operating systems (HLOSs) are available free of charge from TI for the Sitara AM335x microprocessor (Linux and Android version restrictions apply). Note: The WL1835MODCOM8 EVM is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5-GHz band and extended temperature range, see the WL1837MODCOM8I EVM. WL18XXCOM82SDMMC Adapter Board The WiLink SDIO board is an SDMMC adapter board and an easy-to-use connector between the WiLink COM8 EVM (WL1837MODCOM8i and WL1835MODCOM8B) and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO and provides a UART connection for Bluetooth technology over an FPC connector or wire cables. In addition, the adapter is a standalone evaluation platform using TI wireless PC debug tools for any WiLink module or chip solution with a PCB 100-pin edge connector. This board is designed for use with various platforms such as the TI Sitara AM335 and AM437. TI Designs and Reference Designs The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI Designs include schematics or block diagrams, BOMs, and design files to speed your time to market. Copyright 20142017, Texas Instruments Incorporated Device and Documentation Support 41 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com TI WiLink 8 Wi-Fi/Bluetooth/Bluetooth Smart Audio Multi-Room Cape Reference Design (TIDC-

WL1837MOD-AUDIO-MULTIROOM-CAPE) The TI WiLink 8 WL1837MOD audio cape is wireless a multi-room audio reference design used with BeagleBone Black featuring the TI Sitara (AM335x). The WLAN capability of the WiLink 8 device to capture and register precise arrival time of the connected AP beacon is used to achieve ultra-precise synchronization between multiple connected audio devices. The WiLink 8 module (WL1837MOD) offers integrated Wi-Fi/Bluetooth/Bluetooth Smart solution featuring 2.4-GHz MIMO and antenna diversity on the 5-GHz band. The WiLink 8 module offers a best-in-class audio solution featuring multi-room, Airplay receiver, full audio stack streaming, support for online music services, and much more. This TI Design enables customers to design their own audio boards with Wi-Fi/Bluetooth/Bluetooth Smart connectivity from our WiLink 8 module

(WL1837MOD) and evaluate audio multi-room software. 2.4-GHz Wi-Fi + Bluetooth Certified Antenna Design on WiLink 1835 Module (TIDC-

WL1835MODCOM8B) The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way the module is certified. Customers can thus evaluate the performance of the module through embedded applications, such as home automation and the Internet of Things that make use of both Wi-Fi and Bluetooth/Bluetooth low energy functionalities found on the WiLink 1835 module. This antenna design is the same layout used during module certification, allowing customers to avoid repeated certification when creating their specific applications. Smart Home and Energy Gateway Reference Design (TIEP-SMART-ENERGY-GATEWAY) The Smart Home and Energy Gateway Reference Design provides example implementation for measurement, management and communication of energy systems for smart homes and buildings. This example design is a bridge between different communication interfaces, such as Wi-Fi, Ethernet, ZigBee or Bluetooth, that are commonly found in residential and commercial buildings. Because objects in homes and buildings are becoming more and more connected and no single RF standard dominates the market, the gateway design must be flexible to accommodate different RF standards. This example gateway addresses the problem by supporting existing legacy RF standards (Wi-Fi, Bluetooth) and newer RF standards ( ZigBee and BLE). Streaming Audio Reference Design (TIDEP0009) The TIDEP0009 Streaming Audio Reference Design form factor hardware and major minimizes design time for customers by offering small software components, including streaming protocols and Internet radio services. With this reference design, TI offers a quick and easy transition path to the AM335x and WiLink 8 platform solution. This proven combination solution provides key advantages in this market category that helps bring your products to the next level. Software WiLink 8 Wi-Fi Driver for Linux OS (WILINK8-WIFI-NLCP) The NLCP package contains the install package, pre-compiled object and source of the TI Linux Open-Source Wi-Fi image to easily upgrade the default LINUX EZSDK release with the TI WiLink family NLCP Wi-Fi driver. The software is built with Linaro GCC 4.7 and can be added to Linux Software Development Kits

(SDKs) that use similar toolchain on other platforms. Android Development Kit for Sitara Microprocessors (ANDROIDSDK-SITARA) Although originally designed for mobile handsets, the Android Operating System offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and production today. Linux EZ Software Development Kit (EZSDK) for Sitara Processors (LINUXEZSDK-SITARA) Linux SDKs provide Sitara developers with an easy setup and quick out-of-box experience that is specific to and highlights the features of TI's ARM processors. Launching demos, benchmarks, and applications is a snap with the included graphical user interface. The Sitara Linux SDK also allows developers to quickly start development of their own applications and easily add them to the application launcher, which can be customized by the developer. TI Dual-Mode Bluetooth Stack (TIBLUETOOTHSTACK-SDK) TIs dual-mode Bluetooth stack enables Bluetooth + Bluetooth low energy and is comprised of single-mode and dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, provides simple command line sample applications to speed development and has MFI capability on request. 42 Device and Documentation Support Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 Bluetooth Service Pack for WL18xx (WL18XX-BT-SP) The Bluetooth Service Pack is composed of the file (TIInit_11.8.32.ili), XML following four

(TIInit_11.8.32.xml), Release Notes Document, and License Agreement Note. files: BTS file (TIInit_11.8.32.bts), ILI TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone with WL18xx and CC256x (TI-BT-STACK-LINUX-ADDON) The Bluetooth Linux Add-On package contains the install package, pre-compiled object, and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM, or BeagleBone. The software is built with Linaro GCC 4.7 and can be added to Linux SDKs that use a similar toolchain on other platforms. The Bluetooth stack is fully qualified

(QDID 69886 and QDID 69887), provides simple command line sample applications to speed development, and has MFI capability on request. WiLink Wireless Tools for WL18XX Modules (WILINK-BT_WIFI-WIRELESS_TOOLS) The WiLink Wireless Tools package includes the following applications: WLAN Real-Time Tuning Tool

(RTTT), Bluetooth Logger, WLAN gLogger, Link Quality Monitor (LQM), HCITester Tool the capabilities

(BTSout, BTSTransform, and ScriptPad). The applications provide all of required to debug and monitor WiLink WLAN/Bluetooth/Bluetooth low energy firmware with a host, perform RF validation tests, run pretest for regulatory certification testing, and debug hardware and software platform integration issues. Development Tools WiLink 8 Proprietary Wi-Fi Driver QNX, WinCE, Nucleus RTOS Baseline (WILINK8-WIFI-WAPI-

MCP8, WILINK8-WIFI-MCP8, WILINK8-WIFI-SIGMA-MCP8) The MCP package contains the install package, precompiled object, and source of the proprietary Wi-Fi driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, C, MQX ,RTX and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through third party vendors. The WAPI package provides the WPA Supplicant patch to support WAPI security protocol. The Sigma package provides the required APIs for WL8 code to support automated Sigma certification testing. 8.1.3 Device Support Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These prefixes represent evolutionary stages of product development from engineering prototypes through fully qualified production devices. Figure 8-1. Device Nomenclature X Experimental, preproduction, sample or prototype device. Device may not meet all product qualification conditions and may not fully comply with TI specifications. Experimental/Prototype devices are shipped against the following disclaimer:

This product is still in development and is intended for internal evaluation purposes. Notwithstanding any provision to the contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of fitness for a specific purpose, of this device. null Device is qualified and released to production. TIs standard warranty applies to production devices. Copyright 20142017, Texas Instruments Incorporated Device and Documentation Support 43 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD XWL18XYXXMOCPrefixX= PreproductionNo Prefix = Production DeviceWL18XY FamilyX = 0/3PackagingPackage DesignatorModelR = Large ReelT = Small ReelMOC = LGA PackageGB = 2.4 GHz Wi-FiGI = 5 GHz Wi-FiY = 1/5/7XMODModuleMOD = module0 = WLAN only3 = Bluetooth, WLAN1 = 2.4 GHz SISO5 = 2.4 GHz MIMO7 = 2.4 GHz MIMO + 5 GHz WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 8.2 Related Links www.ti.com Table 8-1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 8-1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY WL1807MOD WL1837MOD Click here Click here Click here Click here TECHNICAL DOCUMENTS Click here Click here TOOLS &

SOFTWARE Click here Click here SUPPORT &

COMMUNITY Click here Click here 8.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;

see TI's Terms of Use. TI E2E Online Community The TI engineer-to-engineer

(E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 8.4 Trademarks WiLink, Sitara, E2E are trademarks of Texas Instruments. ARM is a registered trademark of ARM Physical IP, Inc. Airplay is a registered trademark of Apple Inc. Bluetooth is a registered trademark of Bluetooth SIG. Android is a trademark of Google, Inc. IEEE Std 802.11 is a trademark of IEEE. Linux is a registered trademark of Linus Torvalds. Wi-Fi is a registered trademark of Wi-Fi Alliance. ZigBee is a registered trademark of ZigBee Alliance. All other trademarks are the property of their respective owners. 8.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. integrated circuits be handled with ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 8.6 Glossary SLYZ022 TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 44 Device and Documentation Support Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD www.ti.com WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 9 Mechanical, Packaging, and Orderable Information 9.1 TI Module Mechanical Outline Figure 9-1 shows the mechanical outline for the device. Figure 9-1. TI Module Mechanical Outline Table 9-1 lists the dimensions for the mechanical outline of the device. The TI module weighs 0.684 g typical. NOTE Table 9-1. Dimensions for TI Module Mechanical Outline MARKING MIN (mm) NOM (mm) MAX (mm) MARKING MIN (mm) NOM (mm) MAX (mm) L (body size) W (body size) T (thickness) a1 a2 a3 b1 b2 b3 c1 13.20 13.30 1.80 0.30 0.60 0.65 0.20 0.65 1.20 0.20 13.30 13.40 1.90 0.40 0.70 0.75 0.30 0.75 1.30 0.30 13.40 13.50 2.00 0.50 0.80 0.85 0.40 0.85 1.40 0.40 c2 c3 d1 d2 e1 e2 e3 e4 e5 e6 0.65 1.15 0.90 0.90 1.30 1.30 1.15 1.20 1.00 1.00 0.75 1.25 1.00 1.00 1.40 1.40 1.25 1.30 1.10 1.10 0.85 1.35 1.10 1.10 1.50 1.50 1.35 1.40 1.20 1.20 Copyright 20142017, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information 45 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD e3e6e4e5d2d1e1c3c2c1a1a2b1b2b3a34321Pin 2 IndicatorBottom ViewTSide ViewTop Viewe2WLLW WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 9.2 Tape and Reel Information Emboss taping specification for MOC 100 pin. 9.2.1 Tape and Reel Specification www.ti.com Figure 9-2. Tape Specification Table 9-2. Dimensions for Tape Specification ITEM W E F P Po P2 Do T Ao Bo Ko DIMENSION

(mm) 24.00

(0.30) 1.75

(0.10) 11.50

(0.10) 20.00

(0.10) 4.00

(0.10) 2.00

(0.10) 2.00

(0.10) 0.35

(0.05) 13.80

(0.10) 13.80

(0.10) 2.50

(0.10) Figure 9-3. Reel Specification Table 9-3. Dimensions for Reel Specification ITEM DIMENSION (mm) W1 24.4 (+1.5, 0.5) W2 30.4 (maximum) 46 Mechanical, Packaging, and Orderable Information Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD 2.200.7W1W2100.001.5330.002.0Po5.00DoP2EWKoFC0.5Ao = BoPTPin 1 www.ti.com 9.2.2 Packing Specification 9.2.2.1 Reel Box WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 The reel packed into a reel box, as shown in Figure 9-4. is packed in a moisture barrier bag fastened by heat-sealing. Each moisture-barrier bag is The reel box is made of corrugated fiberboard. 9.2.2.2 Shipping Box Figure 9-4. Reel Box Figure 9-5 shows a typical shipping box. If the shipping box has excess space, filler (such as cushion) is added. The size of the shipping box may vary depending on the number of reel boxes packed. NOTE The shipping box is made of corrugated fiberboard. Figure 9-5. Shipping Box Copyright 20142017, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information 47 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD 6161,24325035436257236037085645 WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 9.3 Packaging Information www.ti.com The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 48 Mechanical, Packaging, and Orderable Information Copyright 20142017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD WL1807MOD, WL1837MOD SWRS170I AUGUST 2014 REVISED OCTOBER 2017 www.ti.com PACKAGE OPTION ADDENDUM WL1807MODGIMOCR WL1807MODGIMOCT WL1837MODGIMOCR WL1837MODGIMOCT ACTIVE ACTIVE ACTIVE ACTIVE QFM QFM QFM QFM

(1) The marketing status values are defined as follows:

Package Drawing MOC MOC MOC MOC Orderable Device Status(1) Package Type Pins Package Qty Eco Plan(2) Lead/Ball Finish MSL Peak Temp (C) (3) Op Temp (C) 100 100 100 100 1200 250 1200 250 Green Green Green Green NiPdAu NiPdAu NiPdAu NiPdAu 250 250 250 250 40 to 85 40 to 85 40 to 85 40 to 85 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2) RoHS Compliance: This product has an RoHS exemption for one or more subcomponent(s). The product is otherwise considered Pb-Free (RoHS compatible) as defined above.

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. space Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Copyright 20142017, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information 49 Submit Documentation Feedback Product Folder Links: WL1807MOD WL1837MOD MOC0100A PACKAGE OUTLINE QFM - 2.0 mm max height QUAD FLAT MODULE B 1 13.4 13.2 A 13.5 13.3 C 0.08 C

(1.4) TYP SYMM 60X 0.8 0.7 60X 0.45 0.35 0.1 0.05 C A B C 2X 11.95 2X 9.8 7.7 TYP 33 56X 0.7 G36 PIN 1 INDEX AREA 2 MAX 7.7 TYP 2X 9.8 2X 12.05 17 1 G6 G3 G1 64 G7 G19 G31 PIN 2 ID 4X 0.8 0.7 SYMM 36X 1.05 0.95 49

(1.4) TYP NOTES:

4221006/B 10/2016 1. 2. 3. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. This drawing is subject to change without notice. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com MOC0100A EXAMPLE BOARD LAYOUT QFM - 2.0 mm max height QUAD FLAT MODULE 64 1 2X (11.95) G1 G7 G13 G19 G25 G31 49 33 SYMM 56X (0.7) 60X (0.75) 60X (0.4) 2X

(12.05)

(1.05) TYP

(1.4) TYP 17 4X (0.75) G6 G12 G18 G24 G30 G36

(1.05) TYP

(1.4) TYP 36X (1) SYMM LAND PATTERN EXAMPLE SCALE: 8X 0.05 MIN ALL AROUND SOLDER MASK DETAILS SOLDER MASK DEFINED

(R0.05) TYP SOLDER MASK OPENING METAL UNDER SOLDER MASK NOTES: (continued) 4. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, it is recommended that vias under paste be filled, plugged or tented. 4221006/B 10/2016 www.ti.com MOC0100A EXAMPLE STENCIL DESIGN QFM - 2.0 mm max height QUAD FLAT MODULE 64 1 2X (11.95) G1 G7 G13 G19 G25 G31 60X (0.4) 60X (0.75) SYMM 56X (0.7) SEE DETAIL B 49 33 2X

(12.05)

(1.05) TYP

(1.4) TYP 17 SEE DETAIL A G6 G12 G18

(1.05) TYP G24 G30 G36

(1.4) TYP SYMM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PADS 1, 17, 33, 49, G1-G36 90% PRINTED COVERAGE BY AREA SCALE: 8X SOLDER PASTE 4X (0.713) METAL UNDER SOLDER MASK SOLDER MASK EDGE DETAIL A SCALE 20X METAL UNDER SOLDER MASK SOLDER MASK EDGE SOLDER PASTE 36X (0.95) DETAIL B SCALE 20X 4221006/B 10/2016 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform User's Guide SWRU382 November 2014 The WL1837MODCOM8I is a Wi-Fi dual-band, Bluetooth, and BLE module evaluation board (EVB) with the TI WL1837 module (WL1837MOD). The WL1837MOD is a certified WiLink 8 module from TI that offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a power-

optimized design. The WL1837MOD offers A 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP

(with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux, Android, WinCE, and RTOS.TI. Contents Overview ...................................................................................................................... 3 General Features ................................................................................................... 3 1.1 Key Benefits ......................................................................................................... 3 1.2 Applications.......................................................................................................... 4 1.3 Board Pin Assignment ...................................................................................................... 4 Pin Description ...................................................................................................... 5 2.1 Jumper Connections ............................................................................................... 7 2.2 Electrical Characteristics.................................................................................................... 7 Antenna Characteristics..................................................................................................... 8 VSWR ................................................................................................................ 8 4.1 Efficiency............................................................................................................. 8 4.2 Radio Pattern........................................................................................................ 9 4.3 Circuit Design ................................................................................................................ 9 EVB Reference Schematics....................................................................................... 9 5.1 Bill of Materials (BOM)............................................................................................ 10 5.2 Layout Guidelines .......................................................................................................... 11 Board Layout....................................................................................................... 11 6.1 Ordering Information ....................................................................................................... 16 List of Figures WL1837MODCOM8I EVB (Top View) .................................................................................... 3 EVB Top View................................................................................................................ 4 EVB (Bottom View) .......................................................................................................... 5 Antenna VSWR Characteristics............................................................................................ 8 Antenna Efficiency........................................................................................................... 8 EVB Reference Schematics................................................................................................ 9 WL1837MODCOM8I Layer 1 Layout .................................................................................... 11 WL1837MODCOM8I Layer 2 Layout .................................................................................... 11 WL1837MODCOM8I Layer 3 Layout .................................................................................... 12 WL1837MODCOM8I Layer 4 Layout .................................................................................... 12 Module Layout Guidelines (Top Layer).................................................................................. 13 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 9 10 11 Sitara, WiLink are trademarks of Texas Instruments. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Android is a trademark of Google, Inc. Linux is a registered trademark of Linus Torvalds. Wi-Fi is a registered trademark of Wi-Fi Alliance. SWRU382 November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform 1 Copyright 2014, Texas Instruments Incorporated www.ti.com 12 13 14 15 16 17 1 2 3 4 Module Layout Guidelines (Bottom Layer).............................................................................. 13 Trace Design for the PCB Layout ........................................................................................ 14 Layer 1 Combined With Layer 2.......................................................................................... 14 Top Layer Antenna and RF Trace Routing Layout Guidelines .................................................... 15 Bottom Layer Antenna and RF Trace Routing Layout Guidelines................................................. 15 MIMO Antenna Spacing ................................................................................................... 16 List of Tables Pin Description ............................................................................................................... 5 BOM.......................................................................................................................... 10 Module Layout Guidelines ................................................................................................ 13 Antenna and RF Trace Routing Layout Guidelines.................................................................... 15 2 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform SWRU382 November 2014 Submit Documentation Feedback Copyright 2014, Texas Instruments Incorporated www.ti.com 1 Overview Figure 1 shows the WL1837MODCOM8I EVB. Overview Figure 1. WL1837MODCOM8I EVB (Top View) 1.1 General Features 100-pin board card The WL1837MODCOM8I EVB includes the following features:

WLAN, Bluetooth, and BLE on a single module board Dimensions: 76.0 mm (L) x 31.0 mm (W) WLAN 2.4- and 5-GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels) Support for BLE dual mode Seamless integration with TI Sitara and other application processors Design for the TI AM335X general-purpose evaluation module (EVM) WLAN and Bluetooth, BLE, and ANT cores that are software- and hardware-compatible with prior WL127x, WL128x, and BL6450 offerings for smooth migration to device Shared host-controller-interface (HCI) transport for Bluetooth, BLE, and ANT using UART and SDIO for WLAN Wi-Fi and Bluetooth single-antenna coexistence Built-in chip antenna Optional U.FL RF connector for external antenna Direct connection to the battery using an external switched-mode power supply (SMPS) supporting 2.9- to 4.8-V operation VIO in the 1.8-V domain 1.2 Key Benefits The WL1837MOD offers the following benefits:

Reduces design overhead: Single WiLink 8 module scales across Wi-Fi and Bluetooth WLAN high throughput: 80 Mbps (TCP), 100 Mbps (UDP) Bluetooth 4.1 + BLE (Smart Ready) Wi-Fi and Bluetooth single-antenna coexistence Low power at 30% to 50% less than the previous generation SWRU382 November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform 3 Copyright 2014, Texas Instruments Incorporated Overview www.ti.com Available as an easy-to-use FCC-, ETSI-, and Telec-certified module AM335x Linux and Android reference platform accelerates customer development and time to market. Lower manufacturing costs saves board space and minimizes RF expertise. 1.3 Applications The WL1837MODCOM8I device is designed for the following applications:

Portable consumer devices Home electronics Home appliances and white goods Industrial and home automation Smart gateway and metering Video conferencing Video camera and security 2 Board Pin Assignment Figure 2 shows the top view of the EVB. Figure 2. EVB Top View 4 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform SWRU382 November 2014 Submit Documentation Feedback Copyright 2014, Texas Instruments Incorporated www.ti.com Board Pin Assignment Figure 3 shows the bottom view of the EVB. Figure 3. EVB (Bottom View) 2.1 Pin Description Table 1 describes the board pins. No. Name Type Description SLOW_CLK Slow clock input option (default: NU) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 WL_EN GND GND VBAT GND VBAT VIO GND N.C. N.C. N.C. N.C. N.C. GND GND SDIO_CLK WL_RS232_TX WL_RS232_RX Table 1. Pin Description I G G I P G P P G O I G G I Ground Ground WLAN enable 3.6-V typical voltage input Ground 3.6-V typical voltage input VIO 1.8-V (I/O voltage) input Ground No connection WLAN tool RS232 output No connection WLAN tool RS232 input No connection No connection No connection Ground Ground WLAN SDIO clock WL_UART_DBG O WLAN Logger output SWRU382 November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform 5 Copyright 2014, Texas Instruments Incorporated Board Pin Assignment www.ti.com No. Name Type Description Table 1. Pin Description (continued) SDIO_CMD I/O WLAN SDIO command WLAN_IRQ O WLAN SDIO interrupt out 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 SDIO_D0 SDIO_D1 SDIO_D2 SDIO_D3 N.C. GND N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. GND N.C. N.C. N.C. N.C. GND N.C. N.C. N.C. N.C. GND N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. GND N.C. N.C. GND GND N.C. N.C. PCM_IF_DIN PCM_IF_DOUT I/O WLAN SDIO data bit 0 I/O WLAN SDIO data bit 1 I/O WLAN SDIO data bit 2 I/O WLAN SDIO data bit 3 No connection G Ground No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection No connection G Ground G Ground G Ground No connection Bluetooth PCM data input No connection Bluetooth PCM data output I O G G G O No connection Ground No connection No connection Ground Ground No connection No connection PCM_IF_CLK I/O Bluetooth PCM clock input or output PCM_IF_FSYNC I/O Bluetooth PCM frame sync input or output BT_UART_IF_TX Bluetooth HCI UART transmit output 6 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform SWRU382 November 2014 Submit Documentation Feedback Copyright 2014, Texas Instruments Incorporated www.ti.com Board Pin Assignment No. Name Type Description BT_UART_IF_RX Bluetooth HCI UART receive input Table 1. Pin Description (continued) BT_UART_IF_CTS Bluetooth HCI UART Clear-to-Send input BT_UART_IF_RTS Bluetooth HCI UART Request-to-Send output RESERVED1 BT_UART_DEBUG Bluetooth Logger UART output 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 GND GPIO9 N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. GND N.C. N.C. N.C. GND N.C. N.C. N.C. GND N.C. GND BT_EN GPIO11 GND GPIO12 RESERVED2 No connection No connection No connection Reserved No connection I I O O O G Ground I/O General-purpose I/O No connection No connection No connection No connection No connection No connection No connection G Ground G Ground No connection I Bluetooth enable No connection No connection Ground Reserved No connection Ground General-purpose I/O Ground General-purpose I/O G I G I/O G I/O TCXO_CLK_COM Option to supply 26 MHz externally 100 GPIO10 I/O General-purpose I/O 2.2 Jumper Connections The WL1837MODCOM8I EVB includes the following jumper connections:

J1: Jumper connector for VIO power input J3: Jumper connector for VBAT power input J5: RF connector for 2.4- and 5-GHz WLAN and Bluetooth J6: Second RF connector for 2.4-GHz WLAN 3 Electrical Characteristics For electrical characteristics, see the WL18xxMOD WiLink Single-Band Combo Module Wi-Fi, Bluetooth, and Bluetooth Low Energy (BLE) Data Sheet (SWRS170). SWRU382 November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform 7 Copyright 2014, Texas Instruments Incorporated Antenna Characteristics 4 Antenna Characteristics 4.1 VSWR Figure 4 shows the antenna VSWR characteristics. www.ti.com Figure 4. Antenna VSWR Characteristics 4.2 Efficiency Figure 5 shows the antenna efficiency. Figure 5. Antenna Efficiency 8 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform SWRU382 November 2014 Submit Documentation Feedback Copyright 2014, Texas Instruments Incorporated www.ti.com 4.3 Radio Pattern 5 Circuit Design For information on the antenna radio pattern and other related information, see productfinder.pulseeng.com/product/W3006. 5.1 EVB Reference Schematics Figure 6 shows the reference schematics for the EVB. Antenna Characteristics Figure 6. EVB Reference Schematics SWRU382 November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform 9 Copyright 2014, Texas Instruments Incorporated EDGECONNECTOR-MALEANT2-WL_2.4_IO1/WL_5GHzANT1-WL_2.4_IO2/BT/WL_5GHzR20fortestmode.ThesetwoTPsfortestmodewhenWL_IRQpullhigh.WL_UART_DBGBT_AUD_CLKBT_AUD_FSYNCBT_AUD_INWL_RS232_TXWL_RS232_RXBT_HCI_TXBT_HCI_RXBT_HCI_CTSBT_HCI_RTSBT_EN_SOCBT_UART_DBGSDIO_CLK_WLSDIO_CMD_WLSDIO_D0_WLSDIO_D2_WLSDIO_D3_WLSDIO_D1_WLWLAN_EN_SOCBT_AUD_OUTBT_FUNC1GPIO9GPIO11GPIO12GPIO10SLOW_CLKBT_FUNC2WLAN_IRQRF_ANT1RF_ANT2SDIO_D3_WLGPIO12SDIO_D2_WLGPIO11SDIO_D0_WLSDIO_D1_WLGPIO9WLAN_IRQGPIO10RF_ANT2WL_RS232_TXWL_RS232_RXRF_ANT1BT_FUNC1BT_FUNC2BT_HCI_RXBT_HCI_TXBT_HCI_CTSBT_HCI_RTSBT_AUD_INBT_AUD_OUTBT_AUD_CLKBT_AUD_FSYNCSDIO_CMD_WLSDIO_CLK_WLSLOW_CLKWL_UART_DBGBT_UART_DBGBT_EN_SOCWLAN_EN_SOCEXT_CLK_REQ_OUTEXT_CLK_REQ_OUTTCXO_CLK_COMTCXO_CLK_COMVBAT_INVIO_INVIO_INVBAT_INVIO_INVIO_INVBAT_INVIO_CLKVIO_CLKR2010k0402L32.2nH0402R250R0402C50R0402J6U.FL-R-SMT(10)U.FL123TCXO1NU_TCXO 26MHz2.0x1.6x0.73mmNC1VCC4OUT3GND2R170R0402C60R0402R310R0603J2NU_100pin Micro Edge MEC6SD-100P123456789101112131415161718192021222324252627282930313233343536373839404142434445464748495051525354555657585960616263646566676869707172737475767778798081828384858687888990919293949596979899100ANT1W3006ANT-10.0X3.2MM_BFEED1NC2R330R0402TP41C7NU_0R0402U4NU_TLV70518XBGA-N4_0.8X0.8_0.4VINB2VOUTB1ENA2GNDA1R120R0402R110R0402R34NU0402C11uF0402R300R0402R90R0402J5U.FL-R-SMT(10)U.FL123L2NU0402R100R0402TP11TP51R20R0402L11.3nH04020RR2104020RR190402OSC11V8 / 32.768kHzOSC-3.2X2.5EN1VCC4OUT3GND2R60R0402C32NU_0.1uF0402R30R0402R160R0402U1WL1837MODGJE-13.4X13.3-N100_0.75-TOPGND17VIO38VBAT47EXT_32K36BT_AUD_FSYNC58BT_AUD_IN56BT_AUD_OUT57BT_AUD_CLK60WL_SDIO_D212WL_SDIO_CLK8WL_SDIO_D313WL_SDIO_D010WL_SDIO_D111WL_SDIO_CMD6BT_HCI_RTS50BT_HCI_RX53BT_HCI_TX52BT_HCI_CTS51GND16GPIO_425GPIO_226GPIO_127BT_EN_SOC41WLAN_IRQ14WLAN_EN_SOC40BT_UART_DBG43WL_UART_DBG42GNDG13GNDG14GNDG15GNDG16GNDG9GNDG10GND48GNDG11GNDG12VBAT46GND28GNDG1GNDG2GNDG3GNDG4GNDG5GNDG6GNDG7GNDG8RF_ANT132RESERVED64GND1GND20RESERVED121RESERVED222GND37GND19RESERVED362GNDG17GNDG18GNDG19GNDG20GNDG21GNDG22GNDG23GNDG24GNDG25GNDG26GNDG27GNDG28GNDG29GNDG30GNDG31GNDG32GNDG33GNDG34GNDG35GND23GND59GND34GND29GND7RF_ANT218GND49GND9GND31GND35GND15GND55GND45GND44GND30GND24GND63GND61GND39GND33GND54GNDG36GPIO112GPIO93GPIO104GPIO125R35NU0402C210uF0603R320R0603J1NU_HEADER 1x2H-1X2_2MM12R10R0402R290R0402R80R0402TP71C130.9pF0402TP61TP31R280R04020RR240402R70R0402R140R0402C8NU_0R0402C40.1uF0402R270R0402R130R0402R150R0402C30.1uF04020RR220402R180R0402R40R0402R230R0402C15NU_1uF0402ANT2W3006ANT-10.0X3.2MM_AFEED1NC2C141.5pF0402R5NU0402J3NU_HEADER 1x2H-1X2_2MM12L43.9nH0402R36NU0402TP810RR260402TP21 Circuit Design 5.2 Bill of Materials (BOM) Table 2 lists the BOM for the EVB. Item Description Part Number Package Reference Qty Table 2. BOM 1 2 3 4 5 6 7 8 9 10 11 12 14 15 16 TI WL1837 Wi-Fi / Bluetooth module WL1837MODGI XOSC 3225 / 32.768KHZ / 1.8 V /

50 ppm 7XZ3200005 Antenna / Chip / 2.4 and 5 GHz W3006 Mini RF header receptacle U.FL-R-SMT-1(10) Inductor 0402 / 1.3 nH / 0.1 nH /

SMD Inductor 0402 / 1.8 nH / 0.1 nH /

SMD Inductor 0402 / 2.2 nH / 0.1 nH /

SMD LQP15MN1N3B02 LQP15MN1N8B02 LQP15MN2N2B02 Capacitor 0402 / 1 pF / 50 V / C0G GJM1555C1H1R0BB01

/ 0.1 pF GJM1555C1H2R4BB01 Capacitor 0402 / 2.4 pF / 50 V /

C0G / 0.1 pF Capacitor 0402 / 0.1 F / 10 V /

X7R / 10%

Capacitor 0402 / 1 F / 6.3 V /

X5R / 10% / HF Capacitor 0603 / 10 F / 6.3 V /

X5R / 20%

GRM155R60J105KE19D C1608X5R0J106M 13.4 mm x 13.3 mm x 2.0 mm 3.2 mm 2.5 mm 1.0 mm 10.0 mm 3.2 mm 1.5 mm 3.0 mm 2.6 mm 1.25 mm U1 OSC1 J5, J6 ANT1, ANT2 0402 0402 0402 0402 0402 0402 0402 0603 0402 0402 0603 L1 L3 L4 C13 C14 C1 C2 R1 to R4, R6 to R19, R21 to R30, R33, C5, C6 (1) R20 R31, R32 0402B104K100CT C3, C4 Resistor 0402 / 10K / 5%

WR04X103 JTL Resistor 0603 / 0R / 5%

WR06X000 PTL PCB WG7837TEC8B D02 / Layer 4 / FR4 (4 pcs / PNL) 76.0 mm 31.0 mm 1.6 mm

(1) C5 and C6 are mounted with a 0- resistor by default. 13 Resistor 0402 / 0R / 5%

WR04X000 PTL 31 Walsin www.ti.com Mfr Jorjin TXC Pulse Hirose Murata Murata Murata Murata Murata Walsin Murata TDK Walsin Walsin 1 1 2 2 1 1 1 1 1 2 1 1 1 2 1 10 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform SWRU382 November 2014 Submit Documentation Feedback Copyright 2014, Texas Instruments Incorporated www.ti.com 6 Layout Guidelines 6.1 Board Layout Figure 7 through Figure 10 show the four layers of the WL1837MODCOM8I EVB. Layout Guidelines Figure 7. WL1837MODCOM8I Layer 1 Layout Figure 8. WL1837MODCOM8I Layer 2 Layout SWRU382 November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform 11 Copyright 2014, Texas Instruments Incorporated Layout Guidelines www.ti.com Figure 9. WL1837MODCOM8I Layer 3 Layout Figure 10. WL1837MODCOM8I Layer 4 Layout Figure 11 and Figure 12 show instances of good layout practices. 12 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform SWRU382 November 2014 Submit Documentation Feedback Copyright 2014, Texas Instruments Incorporated www.ti.com Layout Guidelines Figure 11. Module Layout Guidelines (Top Layer) Figure 12. Module Layout Guidelines (Bottom Layer) Table 3 describes the guidelines corresponding to the reference numbers in Figure 11 and Figure 12. Table 3. Module Layout Guidelines Reference Guideline Description Keep the proximity of ground vias close to the pad. 1 2 3 4 5 6 Do not run signal traces underneath the module on the layer where the module is mounted. Have a complete ground pour in layer 2 for thermal dissipation. Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation. Increase ground pour in the first layer and have all traces from the first layer on the inner layers, if possible. Signal traces can be run on a third layer under the solid ground layer and the module mounting layer. SWRU382 November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform 13 Copyright 2014, Texas Instruments Incorporated Layout Guidelines www.ti.com Figure 13 shows the trace design for the PCB. TI recommends using a 50- impedance match on the trace to the antenna and 50- traces for the PCB layout. Figure 13. Trace Design for the PCB Layout Figure 14 shows layer 1 with the trace to the antenna over ground layer 2. Figure 14. Layer 1 Combined With Layer 2 Figure 15 and Figure 16 show instances of good layout practices for the antenna and RF trace routing. NOTE: RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered. 14 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform SWRU382 November 2014 Submit Documentation Feedback Copyright 2014, Texas Instruments Incorporated www.ti.com Layout Guidelines Figure 15. Top Layer Antenna and RF Trace Routing Layout Guidelines Figure 16. Bottom Layer Antenna and RF Trace Routing Layout Guidelines Table 4 describes the guidelines corresponding to the reference numbers in Figure 15 and Figure 16. Table 4. Antenna and RF Trace Routing Layout Guidelines Reference Guideline Description 1 2 3 4 5 6 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate. RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF traces must not have sharp corners. RF traces must have via stitching on the ground plane beside the RF trace on both sides. RF traces must have constant impedance (microstrip transmission line). For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid. There must be no traces or ground under the antenna section. SWRU382 November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform 15 Copyright 2014, Texas Instruments Incorporated Ordering Information www.ti.com Figure 17 shows the MIMO antenna spacing. The distance between ANT1 and ANT2 must be greater than half the wavelength (62.5 mm at 2.4 GHz). Figure 17. MIMO Antenna Spacing Follow these supply routing guidelines:

For power supply routing, the power trace for VBAT must be at least 40-mil wide. The 1.8-V trace must be at least 18-mil wide. Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. If possible, shield VBAT traces with ground above, below, and beside the traces. Follow these digital-signal routing guidelines:

Route SDIO signal traces (CLK, CMD, D0, D1, D2, and D3) in parallel to each other and as short as possible (less than 12 cm). In addition, each trace must be the same length. Ensure enough space between traces (greater than 1.5 times the trace width or ground) to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses. Digital clock signals (SDIO clock, PCM clock, and so on) are a source of noise. Keep the traces of these signals as short as possible. Whenever possible, maintain a clearance around these signals. 7 Ordering Information Part number:

WL1837MODCOM8I DATE November 2014 Revision History REVISION

NOTES Initial draft 16 Revision History Copyright 2014, Texas Instruments Incorporated SWRU382 November 2014 Submit Documentation Feedback IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. 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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID Applications www.ti.com/audio Automotive and Transportation www.ti.com/automotive amplifier.ti.com Communications and Telecom www.ti.com/communications dataconverter.ti.com Computers and Peripherals www.ti.com/computers www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com www.ti-rfid.com Consumer Electronics www.ti.com/consumer-apps Energy and Lighting www.ti.com/energy Industrial Medical Security www.ti.com/industrial www.ti.com/medical www.ti.com/security Space, Avionics and Defense www.ti.com/space-avionics-defense microcontroller.ti.com Video and Imaging www.ti.com/video OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2014, Texas Instruments Incorporated Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Industry Canada Statement This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:

(1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement."

CAN ICES-3(B)/ NMB-3(B) The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology.

the device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

the maximum antenna gain permitted for devices in the bands 52505350 MHz and 54705725 MHz shall comply with the e.i.r.p. limit; and the maximum antenna gain permitted for devices in the band 57255825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate. In addition, high-power radars are allocated as primary users (i.e. priority users) of the bands 52505350 MHz and 56505850 MHz and that these radars could cause interference and/or damage to LE-LAN devices. Radiation Exposure Statement This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions:

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) This radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved by Texas Instrument. Antenna types not included in the list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this transmitter. Antenna Gain (dBi) @ 2.4GHz Antenna Gain (dBi) @ 5GHz 3.2 4.5 In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

Required End Product Labeling Any device incorporating this module must include an external, visible, permanent marking or label which states: Contains FCC ID: FI5-WL18DBMOD and Contains IC :

5056A-WL18DBMOD Obligation d'tiquetage du produit final:

Tout dispositif intgrant ce module doit comporter un externe, visible, marquage permanent ou une tiquette qui dit: "Contient IC : 5056A-WL18DBMOD Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. FCC This module has been tested and found to comply with the following requirements for Modular Approval. Test Modes This device uses various test mode programs for test set up which operate separate from production firmware. Host integrators should contact the grantee for assistance with test modes needed for module/host compliance test requirements. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in User manual. In the end product, the antenna(s) used with this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operation in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. User and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying the RF exposure compliance. Part 15.247 - Operation within the bands 902-928 MHz, 2400-2483.5 MHz, and 5725-5850 MHz. Part 15.407 General technical requirements.

Physical Characteristics Approximate dimensions: L= 200mm. W= 95mm. D=190mm Approximate weight: approximately 3.1kg Available connections: Ethernet, USB , serial Environment RoHS compliant DISPOSAL The MEMS EVOLUTION 4 TRANSCEIVER must not be disposed of in landfill. At the end of its life, the MEMS EVOLUTION 4 TRANSCEIVER must be removed from the vehicle and deposited in a container dedicated to the recycling of electronic equipment that contains batteries. If users do not have access to the appropriate recycling facility, your local Michelin MEMS representative is able to provide a container dedicated to the purpose of collecting MEMS equipment. CONTACT DETAILS For more information or assistance, please contact the Michelin MEMS representative for your country. Brasil, Chile & Per USA, Canada & Mxico Australia South Africa Russia China Europe

: +55 (21) 36 21 4646

: +1 864 458 5000

: +61 3 86 71 1003

: +27 115 790 300

: +7 495 258 09 26

: +86 21 22855000

: +33 4 73 32 20 00 Features, specifications are subject to change without notification. Document version 10.1 MFP MICHELIN 2022 All rights reserved. Exclusive property of Manufacture Franaise des Pneumatiques Michelin. Any reproduction or utilization prohibited without the consent of Michelin. PRODUCT NAME MEMS TRANSCEIVER A ALLUMINIUM Part Number CAI 068685 PRODUCT DESCRIPTION The MEMS EVOLUTION 4 TRANSCEIVER receives, via externally mounted antennas, pressure and temperature data transmitted by the MEMS SENSORS. This information is to be forwarded to the MEMS EVOLUTION 4 SERVER, together with any messages that may require corrective action to be taken in order to maximise the service life of the tire. PRODUCT COMPLIANCE Model FCC ID

: RV5-01

: FI5-RV501 Contains FCC ID: FI5-WL18DBMOD Contains IC: 5056A-WL18DBMOD This device complies with part 15 of the FCC Rules and with RSS-210 of Industry Canada. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body Le Prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est authorise aux deux conditions suivantes: (1) lappareil ne doit pas produire de brouillage, et (2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. Caution: Exposure to Radio Frequency Radiation 1. 2. To comply with the Canadian RF exposure compliance requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter. To comply with RSS 102 RF exposure compliance requirements, a separation distance of at least 20 cm must be maintained between the antenna of this device and all persons. Attention: exposition au rayonnement radiofrquence 1. 2. Pour se conformer aux exigences de conformit RF canadienne l'exposition, cet appareil et son antenne ne doivent pas tre co-localiss ou fonctionnant en conjonction avec une autre antenne ou transmetteur. Pour portable utilisation, cet appareil a t test et respecte les directives sur l'exposition aux RF lorsqu'il est utilis avec un accessoire sans mtal. L'utilisation d'autres accessoires peut ne pas garantir la conformit aux directives d'exposition aux RF. Product complies with EU requirements Product complies with ACMA requirements Changes or modifications not expressly approved by Michelin may void the user's authority to operate the equipment. PRODUCT INFORMATION For correct operation, the coupling torque of all SMA connectors is 0.34 - 0.57Nm. Failure to tighten to this range can result in loss of performance and/or damage to the connector during use. PRODUCT SPECIFICATION Performance Characteristics Transmission rate to MEMS server: Normally once each minute but can be configured to suit certain needs. Barometer measurement precision: 4kPa Wi-Fi 802.11 a/b/g/n Electrical Performance Supply voltage: From 20 to 30VDC Over voltage: Up to 80VDC continuous Supply current: 100mA battery charged, 500mA battery in charge Batteries:

o o 1 x Li-metal coin cell (BR2032) Ni-metal hydride rechargeable 7.2V, 4200mAh Typical battery charging time: 6 hours Typical rechargeable battery performance: 6 hours in normal operation Operating Conditions Operating temperature: -20C to +60C, -4F to +140F Sealing: IP65 Humidity: 95% non condensing Drop specifications: 0.5m drop to concrete surface Storage Conditions Long term storage temperature: 5 to +20C, +41F to +68F Recharge internal battery to at least 80% of capacity every 12 months

1 STATEMENT The label is affixed on an immovable part of the front side of the device. There is no space to bear Part 15.19 statement due to too small, the statement is specified in user manual. 2 LABEL LOCATION Model No.: MI5-TI01 FCC ID: FI5-WL18DBMOD IC: 5056A-WL18DBMOD Top Side Label location Bottom Side

SGS North America Inc. j i 620 Old Peachtree Road Applicant Declaration SUITE 100 Suwanee, Georgia 30024 United States Applicant Legal Business Name MICHELIN NORTH AMERICA (US) INC. Address One Parkway South Greenville South Carolina United States 29615 Grantee Code FI5 FCC ID -WL18DBMOD pier Contact Name Dave Adamson Contact Email dave.adamson@michelin.com Contact Phone 864-905-9848 1, the undersigned, certify that | am an authorized signatory for the Applicant and therefore declare;

a) in accordance with 47CFR2.911(d), all of the statements herein and the exhibits attached hereto are true and correct to the best of my knowledge and belief. b) in accepting a Grant of Equipment Authorization issued by a TCB, under the authority of the FCC, as a result of the representations made in this application, the Applicant is responsible for:

(1) labeling the equipment with the exact FCC ID as specified in this application,

(2) compliance statement labeling pursuant to the applicable rules,

(3) compliance of the equipment with the applicable technical rules, c) if the Applicant is not the actual manufacturer of the equipment, appropriate arrangements have been made with the manufacturer to ensure that production units of this equipment will continue to comply with the FCCs technical requirements. d) in accordance with 47 CFR 2.909 and KDB394321, the Applicant has read, understood and agrees to accept that they are the responsible party and agree to abide by their responsibilities as specified under 47 CFR 2.909 and KDB394321. e) in accordance with ISO017065, FCC KDB641163, FCC KDB610077, KDB394321 and RSP-100, the Applicant has read, understood, accepts and agrees to abide by the post market surveillance requirements.

(1) the Applicant understands, accepts and agrees that a sample may be requested for surveillance testing.

(2) the Applicant sali make provisions to always have a production sample available upon request by SGS, FCC and/or ISED.

(3) the Applicant shall, upon request by SGS, at the Applicant's expense, provide a production sample of the requested product to SGS, FCC and/or ISED as instructed. The sample shall include all support devices, cables, software, accessories or other hardware or software required for evaluation, review, certification and audit surveillance of products certified by SGS. f) neither the Applicant nor any party to the application is subject to a denial of Federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862 because of a conviction for possession or distribution of a controlled substance. See 47CFR 1.2002(b) for the definition of a party for these purposes. g) the Applicant has read, understood, accepts and agrees to abide by the SGS North America, Inc.(TCB) terms and conditions. Link to CFRs: hitps://Awww.fcc.gov/wireless/bureau-divisions/technologies-systems-and-innovation-division/rules-requlations-title-47 Link to KDBs: httos://apps.fcc.gov/oetcf/kdb/index.cim Link to RSP-100: https:/Awww.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf01130.htm!

Applicant Y, MICHELIN NORTH AMERICA (US) INC. Dave Adamson Title: Strategic Partnerships, Connected Mobility

*NOTE: This declaration cannot be signed by an Agent, it shall be signed by an authorized person listed in the FCC database Date: 2021/12/15

| Print Name: #

Applicant Declaration Rev:0.0

Texas Instruments Incorporated 12500 TI Boulevard, Dallas Texas 75243 United States of America Change in ID (FCC) / Multiple Listing (ISED) February 4th, 2022 Re: Change in ID / Multiple Listing To Whom It May Concern:

Model Name /

PMN (ISED) FCC WL18MODGI: 37 Grade: WiLink 8 Dual Band Combo 2x2 MIMO Wi-Fi, Bluetooth and Bluetooth low energy Module. 07 Grade:

WiLink 8 Dual Band Combo 2x2 MIMO Wi-

Fi Module ISED WL18MODGI: 37 Grade: WiLink 8 Dual Band Combo 2x2 MIMO Wi-Fi, Bluetooth and Bluetooth low energy Module. 07 Grade:

WiLink 8 Dual Band Combo 2x2 MIMO Wi-

Fi Module MICHELIN NORTH AMERICA (US) INC. (Company) has contacted Texas Instruments Incorporated (TI) regarding Companys intention to file applications for a change in identification in the United States pursuant to Section 2.933 of the Federal Communication Commissions (FCC) rules, and/or a multiple listing in Canada pursuant to Section 8.4 of Innovation, Science and Economic Development Canada (ISED) Certification of Radio Apparatus (RSP-100 Issue 12), with respect to the following:

TI Model Number /

HVIN (ISED) WL18MODGI Certification Number Z64-WL18DBMOD Original Grant Date 3/27/2018 WL18MODGI 451I-WL18DBMOD 4/4/2018 Company has requested TIs permission to reference, in Companys applications, certain documentation relating to the equipment identified in the table above. This letter is provided to permit Dave Adamson, MICHELIN NORTH AMERICA (US) INC., One Parkway South, Greenville, South Carolina, United States, 29615; email: dave.adamson@michelin.com, phone: 864-905-9848, to use the publicly available test data and application exhibits submitted to the FCC and to ISED on behalf of TI with respect to the equipment identified above pertaining to the grants of equipment certification covered by this letter. DocuSign Envelope ID: 4894BC17-760D-41F4-8162-DD0A27B9596E Change in ID (FCC) / Multiple Listing (ISED) Company has represented to TI that its equipment submitted to ISED is identical in design and construction to the equipment approved by ISED as identified in the table above. Based on Companys representation to TI, TI understands that Company will market the above equipment under the following certification number:

Model / PMN FCC WL1837MODGIMOC ISED WL1837MODGIMOC HVIN MI5-TI01 Certification Number FI5-WL18DBMOD 5056A-WL18DBMOD Based on Companys representations to TI, Company may list the existing certified product under Companys new certification number, subject to FCC and ISED rules. This permission to act using data and applications previously filed with the FCC and ISED on behalf of TI is limited to the matters set forth herein. This letter does not, and shall not be construed to, grant rights or permissions beyond those expressly granted to the party named herein. This permission expires automatically one year from the date of this letter. If you have any questions concerning this letter, please contact me by email at m-

kost@ti.com or by phone at +1 214 479 5532. Respectfully, Texas Instruments Incorporated By:

Name:

Title:

_______________________________ DocuSign Envelope ID: 4894BC17-760D-41F4-8162-DD0A27B9596ENaomi HellerBusiness Line Manager

SA yh MICHELIN Federal Communications Commission 7435 Oakland Mills Road Columbia, Maryland 21046 USA Re: Change of Identification Authorization, FCC ID: FIS-WL18DBMOD To Whom It May Concern:

The purpose of this letter is to apply for a change in identification as specified under 47CFR2.933 of the FCC rules, based on the original FCC ID: Z64-WL18DBMOD, grant date: 12/24/2014 with reference to a C2PC dated 03/27/2018. The equipment bearing the modified FCC ID: FIS-WL18DBMOD is no different from the original equipment. The original test results continue to be representative of and applicable to the equipment bearing the changed identification. The original software security exhibit showing this device meets the requirements of KDB 594280 continue to be representative of and applicable to the equipment bearing the changed identification. As new grantee, we, MICHELIN NORTH AMERICA (US) INC. responsible for changes to the device and will not alter or offer any capabilities that will modify DFS settings. Sincerely, City: Greenville Name: Dave Adamson Function: Strategic Partnerships Connected Mobility Signature: Ui. Lee

September 20, 2021 To: Naomi Heller From: Marian Kost Subj: Delegation of Authority Under our corporate policy, all delegations are to be made to positions rather than individuals. Therefore, this delegation applies to you while you hold the position listed and will immediately terminate as to you if you change jobs or leave TI. The delegation will continue to be effective as to any employee assuming the position listed above. Commitment Authorizations Authorization is hereby granted to the employee holding the following position to approve and sign on behalf of Texas Instruments Incorporated all contracts, agreements, bids, quotations, purchase orders and other instruments evidencing commitments of Texas Instruments Incorporated within the usual conduct of his/her organization, limited to the amount shown. You are personally responsible to ensure that you exercise the authority consistent with this document and TIs corporate procedures. Wi-Fi Business Manager

$1,000,000 Delegation of Commitment Authorizations You may not re-delegate your authority. You may re-delegate your authority on an acting for basis or through issuance of one shots, as described in SP&P 11-03-01. Marian Kost Business Unit Manager, Connectivity Texas Instruments Incorporated DocuSign Envelope ID: FD4A24EF-51D5-4269-B549-7865596A09AA