FCC ID: A8TBM57SPPSYC2A Bluetooth Module

by: Microchip Technology Inc. latest update: 2012-04-16 model: BM57SPPSYC2A

One grant has been issued under this FCC ID on 04/16/2012 (this is the only release in 2012 for this grantee). Public details available include frequency information, internal & external photos, and manuals. some products also feature user submitted or linked drivers, troubleshooting guides, password defaults, instructions, & warrantee terms.

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all	frequencies		exhibits	applications
		manual

all exhibits 12
1 ~ 2012-04-16 12

app s				submitted / available
1	Manual	Users Manual	pdf	1.20 MiB
1		Operational Description	pdf
1		Block Diagram	pdf
1		External Photos	pdf
1		Internal Photos	pdf
1		ID Label/Location Info	pdf
1		Cover Letter(s)	pdf
1		Operational Description	pdf
1		Parts List/Tune Up Info	pdf
1		Schematics	pdf
1		Test Report	pdf
1		Test Setup Photos	pdf

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Manual

Users Manual

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1.20 MiB

Datasheet of Bluetooth BM57SPPSyC2 Module iSSC Technologies Corp. Revision History Date Revision Content 2012/03/08 Preliminary Draft Version Version 0.2 Content 1. Introduction ...................................................................................................................... 3 1.1. Major Components ....................................................................................................................................... 3 1.2. Features ........................................................................................................................................................ 3 1.3. Application .................................................................................................................................................... 4 1.4. Certifications ................................................................................................................................................. 4 Product Specification ...................................................................................................... 5 2. 2.1. Chipset .......................................................................................................................................................... 5 2.2. Interfaces ...................................................................................................................................................... 5 2.3. Hardware Design Considerations ................................................................................................................. 5 Hardware Architecture ................................................................................................... 10 Compatibility Requirements .......................................................................................... 10 Environmental Requirements ....................................................................................... 11 3. 4. 5. 5.1. Temperature ............................................................................................................................................... 11 5.2. Humidity ...................................................................................................................................................... 11 Appendix A: Dimension and Foot Print ................................................................................. 12 Appendix B: Product Image .................................................................................................... 13 Appendix C: PIN Assignment ................................................................................................. 14 Appendix D: Reflow Profile ..................................................................................................... 16 Appendix E: Schematic ........................................................................................................... 17 Appendix F: Reference Schematic ......................................................................................... 18 Appendix G: Test Board Layout Information ......................................................................... 19 Appendix H: Test Board Layout Information ......................................................................... 19 Appendix H: Label Information ............................................................................................... 19 Appendix I: Packaging Information ........................................................................................ 20 Appendix I: Reversion History ................................................................................................ 21 CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 2 1. Introduction Part Name: iSSC BM57SPPSyC2 Bluetooth module Part Number: BM57SPPSyC2-xxxxxx The iSSC BM57SPPSyC2 Bluetooth module is design for MFi (The Made for iPod, Made for iPhone and Made for iPad logos) electronic accessory via Bluetooth connectivity. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.0 + EDR. iSSC IS1657NM single chip solution combines transceiver and baseband function to decrease the external components. It narrows down the module size and minimizes its cost. The optimized power designs minimize power consumption to keep low battery. The module is integrated with shielding case and 2.4GHz RF Chip antenna. It has passed the Bluetooth SIG and FCC Part 15 certification.

*Notice:

1. Changes or modifications made to this equipment not expressly approved by the Grantee of the FCC ID may void the FCC authorization to operate this equipment. 2. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following

" Contains FCC ID: A8TBM57SPPSYC2A. 1.1. Major Components

- iSSC IS1657NM (48 pin QFN, single-chip Bluetooth transceiver and baseband processor)

- Serial EEPROM 8K (1024*8) TSSOP 8P 1.2. Features

- Bluetooth 3.0 EDR compliant

- Low power 1.8V RF operation

- RF transmitter output power Class 2

- RF receiver GFSK typical -90dBm, /4 PSK typical -90dBm, 8DPSK typical -83dBm

- Internal ROM and 4Mibts of flash

- HCI over UART

- I2C for external EEPROM and authentication chip (to enable functionality between your electronic accessory and the iPod, iPhone and iPad)

- 1 LED driver

- 2.4GHz ceramic chip antenna CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 3 1.3. Application

- GPS

- Printers

- Electric Scale

- Blood Pressure Monitors

- Bar code Scanner

- Industrial Applications (CNC, PLC, RFID)

- Embedded systems 1.4. Certifications

- Bluetooth SIG: QDID B017511 http://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=17511

- FCC ID: A8TBM57SPPSYC2A CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 4 2. Product Specification 2.1. Chipset 7x7 mm2 48 pin QFN IS1657NM 2.2. Interfaces

- Multi function GPIO interface

- Bluetooth RF interface

- HCI over URAT up to 921600 bps

- I2C for external EEPROM and authentication chip

- 2/4 wires SPI interface (master/slave) for external peripherals control. (Optional) 2.3. Hardware Design Considerations

- Power The module requires either a 3.3V or 5V supply voltage. (3.3V was suggested)

- Power ramp-up timing restriction 1) BAT_IN : ramp-up (0 to 1.6V) < 200ms 2) PMULDO_O : PMU-logic ramp-up (0 to 1.6V) <60ms 3) VCC_RF (1.8V power domain) : RF BPOR ramp-up (0 to 1.6V) < 20ms

- Power on sequence 1) BAT_IN/ BAT_IN_5V: must be first!

2) 3.3V power domain: VDD_IO/ VDD_FIO must power-up early than 1.8V power. 3) 1.8V power domain: 1V8/ VCC_RF/ VDD_XO/ 1V8_U_P 4) RST_N: digital reset released from 0 to 1.6V must be the last one.

- Recommended operating conditions Rating VDD_IO_x, SW_BTN BAT_IN Min 3.2V 3.2V 3.2V Typ Max 3.63V 4.3V 4.3V

- Clock Sources A high accuracy crystal with 10ppm tolerance is connected to the BM57SPPSyC2 clock input pins.

- Serial Flash and Firmware Version Firmware code is stored on chip internal flash.

- Radio Characteristics Bluetooth V3.0 + EDR Frequency Band: 2402-2480 GHz Number of Channels: 79 1MHz channels CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 5

- Current Consumption Operation Mode Peak current at TX mode Peak current at RX mode Standby mode (Discoverable &

connectable mode Deep power down mode Connected + Sniff, Master (No data) Connected + Sniff, Master (No data) Connected + Sniff, Slave (No data) Data, Master Data, Slave

- Terminal characteristics Condition :

VDD_IO=3.3V I/O voltage levels VIL input logic levels low VIH input logic levels high VOL output logic levels low VOH output logic levels high Reset terminal VTH,res threshold voltage Input and tri-state current with Pull-up Resistor Leakage current Vdd supply current TX mode RX mode Min

-0.3 2.0 2.4

-10 Peak current 50.357 49.413 AVG current Unit mA mA Note No data was transmitted Sniff (40 20 4 0) No data was transmitted Sniff (500 20 4 0) No data was transmitted Sniff (500 20 3 3) iPhone parameters 2.382 mA 0.276 mA 2.723 mA 0.673 mA 0.745 mA 17.641 mA Data transmitted at 115200bps 18.025 mA Data transmitted at 115200bps Typ Max Unit 1.6 65 0.8 3.6 0.4

+10 70 70 V V V V V Kohm A mA mA CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 6

- Baud Rate Desired baud rate Clock 921600 460800 230400 115200 57600 38400 28800 19200 14400 9600 4800 2400 48000000 48000000 48000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000

- Testing Criterion P 13 13 13 13 13 13 13 13 13 13 13 13 Testing Item Name Device Initialization System Verify PMU LDO trim Calibration LDO18 Calibration LDO33 RF frequency calibration RF TX power verify 8852 output power Initial carrier test Single slot sensitivity Multi slot sensitivity Modulation index test NO. 1 2 3 4 5 6 7 8 9 10 11 12 Div Actual Baud rate Error Rate %

0.16 0.16 0.16

-2.87 1.75 0.16

-0.62 0.16 0.55 0.16 0.16

-0.03 3.50641026 7.51282051 15.525641 10.1837607 20.8675214 31.5512821 42.2350427 63.6025641 84.9700855 127.705128 255.910256 512.320513 923077 461538 230769 111888 58608 38462 28623 19231 14480 9615 4808 2399 Spec. System Power>1.6V 1.8~2.1 1.81~1.93V 3.1~3.4V

< 10k Hz

> -5 dBm

-2dbm~+4dbm

+/- 30KHz

> -70dbm

> -70dbm 140KHz f1avg 175KHz f2max f2/f1avg 115KHz 0.8 CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 7

- Timing Sequence Timing Sequence for Mode selection Pin (P20, P24) under APP mode Pin No. Name Description I/O I P I BAT_IN VDD_IO P20 4 7 17 18 I P24 P20 P24 VDDIO Power 3.3V power input Main power supply System configuration, refer to P2_4, MCU do NOT drive under APP Mode Boot mode selection (MCU NOT drive under APP Mode) P2_0/ P2_4: HH Application LL Boot mode LH HCI UART mode for testing and system configuration. 7.28ms 41.1ms P20, P24 Mode Selection Timing Diagram CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 8 Timing Sequence for Rest Pin (RST_N) under different mode 22 I RST_N External reset input (Low Active), clock period 62.5n at least. 60 ms 400 ms External Rest 1 ms Write Flash Mode 1 Ready for MCU Test Mode APP Mode 5 ms Ready for MCU Ready for MCU 2 3 RST_N Timing Diagram CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 9 3. Hardware Architecture Block Diagram RTX

(Class 2) t A n e n n a m m 2 3 IS1657NM I2C EEPROM UART/ HCI Interface GPIO Control Power Tree 16M XTAL 12.6 mm BM57 Module IS1657NM LDO33_O VDD_FIO USB_VDD LDO18_I BAT_IN_5V 5V BAT_IN_5V VDD_IO BAT_IN 3V~4V2 BAT_IN Either One BAT_IN is recommended LDO18_O 1V8 VDD_XO VCC_RF AVDD_SAR 1V8_U_P 2V8 ~ 3V3 2V8 ~ 3V3 VDD_IO 1V8 EEPROM 4. Compatibility Requirements The BM57SPPSyC2 Bluetooth module shall pass the standard test plan, which includes hardware compatibility and reliability, and software compatibility test. CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 10 5. Environmental Requirements 5.1. Temperature Conditions Minimum Maximum 5.2. Humidity Conditions Minimum Maximum Operating Temperature Non-Operating Temperature

-10

+70

-40

+80 Operating Humidity Non-Operating Humidity 10%

90%

95%

CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 11 Appendix A: Dimension and Foot Print 1. Dimension 32mm* 12.6mm* 1.86mm (Length* Width* Height) board thickness: 0.8mm (4 layers PCB) 2. Module Foot Print 3. The mandatory layout under the module. 4. The solder stop mask CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 12 Appendix B: Product Image CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 13 Appendix C: PIN Assignment 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Chip Antenna GND BT_RF GND LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 P21 P24 P20 SAR_BAT BAT_IN_5V BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O WAKEUP PMULDO_O P04 P12 / SCL P13 / SDA P16 USB_DP USB_DM BM57_V2 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 Description Ground Reserved 5V power input 3.3V power input Reserved 3V3 LDO output Main power supply LDO18 output Wakeup BM57 from Shutdown State. (Low Active) It is only valid while BM57 into Shutdown State. Output of PMULDO UART_TX_IND:

H: BM57 indicate UART data will be transmitted out after a certain timing

(setting by EEPROM, default 5 ms) L: Otherwise. STATUS_IND_2: BM57 State indication , refer to P22 I2C_SCL, for Authentication Coprocessor 2.0B I2C_SDA, for Authentication Coprocessor 2.0B EEPROM WP Pin #

1 2 3 4 5 6 7 8 Name I/O P GND I SAR_BAT I I I P P P BAT_IN_5V BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O 9 I WAKEUP 10 P PMULDO_O 11 O P04 12 13 14 I/O P12/ SCL I/O P13/ SDA I/O P16 CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 14 15 16 17 I/O USB_DP I/O USB_DM I P20 18 I P24 19 O P21 20 O P22 21 22 23 24 25 I I I O I EAN RST_N HCI_RXD HCI_TXD P26 26 O P27 27 28 29 30 31 32 I I I P23 P25 P07 O P LED1 GND RI/O BT_RF Reserved Reserved System configuration, refer to P2_4, No drive under APP Mode Boot mode selection (No drive under APP Mode) P2_0/ P2_4: HH Application LL Boot mode LH HCI UART mode for testing and system configuration. CP_RST:

Reset Authentication Coprocessor 2.0B STATUS_IND:

Bluetooth link status indication, P22/P04: HH Power default value and Shutdown State. P22/P04: HL Access State. P22/P04: LL Link State w/o UART_TXD. P22/P04: LH Link State with UART_TXD. ROM/ Flash selection. (No drive under APP Mode) H: ROM code; L: Flash code External reset input (Low Active), clock period 62.5n at least. UART_RXD UART_TXD UART_CTS:

UART Flow Control- set HIGH to disable TX transmitter. UART_RTS:

UART Flow Control- go HIGH to disable host transmitter. Open data session indication- go LOW when APP session is ready. LINK_DROP:

Host_MCU ask to drop SPP link under Link State;

One low pulse with 10 ms duration low signal to trigger SPP disconnection. Otherwise it will be set as high always. Pairing Key:

Device will enter Standby Mode after pull low over 240ms. UART_RX_IND:

L: Inform BM57 that UART data will be transmitted out after 1 ms H: Otherwise. LED1 driver Ground RF Port CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 15 Appendix D: Reflow Profile 1.) Follow: IPC/JEDEC J-STD-020 C 2.) Condition:

Average ramp-up rate (217 to peak): 1~2/sec max. Preheat150~200C60~180 seconds Temperature maintained above 217 : 60~150 seconds Time within 5 of actual peak temperature: 20 ~ 40 sec. Peak temperature250+0/-5 or 260+0/-5 Ramp-down rate : 3/sec. max. Time 25 to peak temperature : 8 minutes max. Cycle interval5 minus 217 25 Slope: 1~2/ sec max.

(217 to peak) Peak: 250+0/-5 Or 260+0/-5 Ramp down rate:

Max. 3/sec. Preheat: 150~200 20~40 sec. 60~180 sec. 60~150 sec. Time (sec) CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 16 Appendix E: Schematic 5V_IN VBAT_IN LDO33_O C3 10u/6.3V C5 10u/6.3V C8 10u/6.3V LDO18_O C14 1u/10V C12 10u/6.3V LDO18_O WAKEUP PMULDO_O P04 P16 P12 P13 1 2 3 4 5 6 7 8 9 10 11 12 LDO18_O 1 L2 4.7nH C6 1.2p/50V 2 BT_RF 1 2 ANT1 C7 NP-0402 CAN4311851042453K 1 2 1 L1 2.7nH 2 T A B _ R A S O _ 8 1 O D L O _ 8 1 O D L C9 1u/16V LED1 N T B _ W S C4 1.8p/50V C11 9p/50V 9 4 P E 8 4 7 4 6 4 5 4 4 4 3 4 2 4 1 4 0 4 9 3 8 3 7 3 D N G _ 8 V 1 N I _ 8 1 O D L O _ 3 3 O D L N T B _ W S N I _ T A B T A B _ R A S V 5 _ N I _ T A B R A S _ D D V A X R X T R 1 D E L F R _ C C V LDO18_O WAKEUP PMULDO_O NC P0_4 P1_4/TX_CLS1 P1_5/RX_CLS1 P1_6/WP P1_2/SCL P1_3/SDA GND 1V8 IS1657NM QFN48-SPP Bridge P D _ B S U M D _ B S U O I _ D D V D D V _ B S U P _ U _ 8 V 1 D X R _ I C H N _ T S R 0 _ 2 P 4 _ 2 P 1 _ 2 P 2 _ 2 P N A E XO_N XO_P VDD_XO VDD_FIO P0_7 P2_5/SCLK P2_3/MOSI P2_7/MISO P2_6/NCS VDD_IO 1V8 HCI_TXD LDO33_O USB_DP USB_DM LDO33_O LDO18_O 3 1 4 1 5 1 6 1 7 1 8 1 9 1 0 2 1 2 2 2 3 2 4 2 0 2 P 1 2 P N A E 4 2 P 2 2 P HCI_RXD RST_N 1 2 R3 4K7 1u/10V C19 32 X1 41 X4P-16MHZ-HLT C13 9p/50V LDO33_O 1u/10V C16 LDO18_O 1u/10V C15 P07 P25 P23 P27 P26 LDO33_O LDO18_O 36 35 34 33 32 31 30 29 28 27 26 25 H C I _ T X D 1u/10V C17 5V_IN 1 GND SAR_BAT SW_BTN 2 3 4 5 6 7 8 WAKEUP 9 PMULDO_O 10 P04 11 P12 12 P13 13 P16 14 USB_DP 15 USB_DM 16 SAR_BAT BAT_IN_5V BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O WAKEUP PMULDO_O P04 P12 / SCL P13 / SDA P16 USB_DP USB_DM VBAT_IN LDO33_O LDO18_O CONFIDENTIAL 2000~2011 iSSC Technologies Corp. BT_RF GND LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 P21 P24 P20 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 P21 P24 P20 BM57_V2 17 8 7 6 5 1 2 3 4 A0 VCC WP A1 SCL A2 GND SDA U4 IS24C08A VDD_IO P16 P12/SCL P13/SDA R6 10K 1 2 VDD_IO Appendix F: Reference Schematic 4V2~3V2 WAKEUP (option) UART_TX_IND (option) CP_SCL (option) CP_SDA (option) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 GND BT_RF SAR_BAT BAT_IN_5V BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O WAKEUP PMULDO_O P04 P12 / SCL P13 / SDA P16 USB_DP USB_DM GND LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 P21 P24 P20 BM57_V2 3V3 LED1 2 1 LED-B LED1 UART_RX_IND (option) Pairing Key (option) LINK_DROP (option) UART_RTS (option) UART_CTS (option) HCI_TXD HCI_RXD RST_N (option) ROM/ Flash selection (reserv e test point) STATUS_IND (recommend) CP_RST (option) Boot mode selection (reserv e test point) Sy stem conf iguration (reserv e test point) TP1 TP2 TP3 Test Point: TP1, TP2, TP3 are recommended for future firmware, EEPROM table update if the module are welded on load board. CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 18 Appendix G: Test Board Layout Information 1. The CN1 is reserved for SMA Connector, Its will be used only if user would like to check module RF performance. 2. The C4 components must be removed under general condition. The RF trace will output from the chip antenna on the module. Appendix H: Test Board Layout Information Top Bottom Appendix H: Label Information TBA CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 19 Appendix I: Packaging Information TBA CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 20 Appendix I: Reversion History Version Date 0.1 2011/12/11 History Preliminary Draft Version CONFIDENTIAL 2000~2011 iSSC Technologies Corp. 21

		frequency	equipment class	purpose
1	2012-04-16	2402 ~ 2480	DSS - Part 15 Spread Spectrum Transmitter	Original Equipment

Application Forms

app s	Applicant Information
1	Effective	2012-04-16
1	Applicant's complete, legal business name	Microchip Technology Inc.
1	FCC Registration Number (FRN)	0001596279
1	Physical Address	2355 West Chandler Blvd.
1		CHANDLER, Arizona 85224-6199
1		United States

app s	TCB Information
1	TCB Application Email Address	r******@twn.tuv.com
1	TCB Scope	A4: UNII devices & low power transmitters using spread spectrum techniques

app s	FCC ID
1	Grantee Code	A8T
1	Equipment Product Code	BM57SPPSYC2A

app s	Person at the applicant's address to receive grant or for contact
1	Name	S****** M******
1	Title	Staff Engineer
1	Telephone Number	480-7******** Extension:
1	Fax Number	480-7********
1	E-mail	s******@microchip.com

app s	Technical Contact
		n/a

app s	Non Technical Contact
		n/a

app s	Confidentiality (long or short term)
1	Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?:	No
1	Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?:	No
	if no date is supplied, the release date will be set to 45 calendar days past the date of grant.

app s	Cognitive Radio & Software Defined Radio, Class, etc
1	Is this application for software defined/cognitive radio authorization?	No
1	Equipment Class	DSS - Part 15 Spread Spectrum Transmitter
1	Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant)	Bluetooth Module
1	Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application?	No
1	Modular Equipment Type	Single Modular Approval
1	Purpose / Application is for	Original Equipment
1	Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization?	No
1	Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization?	No
1	Grant Comments	Output power listed is conducted.
1	Is there an equipment authorization waiver associated with this application?	No
1	If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded?	No

app s	Test Firm Name and Contact Information
1	Firm Name	TUV Rheinland Taiwan Ltd.
1	Name	S** W******
1	Telephone Number	886-2******** Extension:
1	Fax Number	886-2********
1	E-mail	s******@tuv.com

Equipment Specifications
	Line	Rule Parts	Grant Notes	Lower Frequency	Upper Frequency	Power Output	Tolerance	Emission Designator	Microprocessor Number
1	1	15C		2402.00000000	2480.00000000	0.0007000

some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details

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