BM20SPKXYNBZ Bluetooth Module Modular Approval Request Letter Cover Letter(s)

Company: Microchip Technology Inc.

FCC ID: A8TBM20SPKXYNBZ

submitted available document details (if available) source link
May 18 2022 May 23 2022 Public Notice DA 00-1407 Vs Section 15 MKuo 適用於 Microsoft 365 的 Microsoft® Word
various Modular Approval Request Letter Cover Letter(s) pdf 159.99 KiB May 18 2022 / May 23 2022

Comments
 

Related Exhibits
External Photos Internal Photos Users Manual

 

  This product uses the FCC Data API but is not endorsed or certified by the FCC