MRF89XAM9A Data Sheet 915 MHz Ultra Low-Power Sub-GHz Transceiver Module 2011 Microchip Technology Inc. Preliminary DS00000A Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as unbreakable. Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN:
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Companys quality system processes and procedures are for its PIC MCUs and dsPIC DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchips quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS00000A-page ii Preliminary 2011 Microchip Technology Inc. MRF89XAM9A 915 MHz Ultra Low-Power Sub-GHz Transceiver Module RF/Analog Features ISM Band 902928 MHz Operation Modulation: FSK and OOK Data Rate (to conform to FCC and IC regulations):
- FSK: 50200 kbps
- OOK: 16 kbps Reception sensitivity
- FSK: -107 dBm (typical) at 50 kbps
- OOK: -113 dBm (typical) at 2 kbps
+10 dBm Typical Output Power with 21 dB Tx Power Control Range Media Access Controller (MAC)/
Baseband Features Packet handling feature with data whitening and automatic CRC generation Incoming sync word (pattern) recognition Built-in bit synchronizer for incoming data, and clock synchronization and recovery 64-byte transmit/receive FIFO with preload in Stand-by mode Supports Manchester encoding/decoding techniques Features Module designed from the MRF89XA Integrated Ultra Low-Power, Sub-GHz Transceiver IC. Supports MiWi Development Environment Proprietary Wireless Networking Protocols 4-Wire Serial Peripheral Interface (SPI) with Interrupts Small Size: 0.7" x 1.1" (17.8 mm x 27.9 mm), Surface Mountable Pin compatible with MRF89XAM9A Integrated Crystal, Internal Voltage Regulator, Matching Circuitry and Printed Circuit Board
(PCB) Antenna Easy Integration into Final Product Minimize Product Development, Quicker Time to Market Compatible with Microchips Microcontroller Families (PIC16, PIC18, PIC24, dsPIC33 and PIC32) Radio Regulation Certified for United States
(FCC), Canada (IC) and Australia/New Zealand
(C-TICK) Operational Operating Voltage: 2.13.6V (3.3V typical) Temperature Range: -40C to +85C Industrial Low-Current Consumption:
- Rx mode: 3 mA (typical)
- Tx mode: 25 mA at +10 dBm (typical)
- Sleep: 0.1 A (typical) Pin diagram GND RESET CSCON IRQ0 SDI SCK 1 2 3 4 5 6 12 GND 11 GND 10 9 8 7 VIN IRQ1 CSDATA SDO 2011 Microchip Technology Inc. Preliminary DS00000A-page 1 MRF89XAM9A Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 3 2.0 Circuit Description ........................................................................................................................................................................ 9 3.0 Regulatory Approval................................................................................................................................................................... 17 4.0 Electrical Characteristics ............................................................................................................................................................ 21 Appendix A: Revision History............................................................................................................................................................... 27 The Microchip Web Site ....................................................................................................................................................................... 29 Customer Change Notification Service ................................................................................................................................................ 29 Customer Support ................................................................................................................................................................................ 29 Reader Response ................................................................................................................................................................................ 30 Product Identification System............................................................................................................................................................... 31 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:
Microchips Worldwide Web site; http://www.microchip.com Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS00000A-page 2 Preliminary 2011 Microchip Technology Inc. MRF89XAM9A Interface description 1.1 The simplified block diagram of the MRF89XAM9A module is shown in Figure 1-1. The module is based on the Microchip Technology MRF89XA Ultra Low-Power Sub-GHz Transceiver Integrated Circuit (IC). The module interfaces to many popular Microchip PIC microcontrollers through a 3-wire serial SPI interface, two chip selects (Configuration and Data), two interrupts Interrupt Request 0 (IRQ0) and Interrupt Request 1 (IRQ1), Reset, Power and Ground as shown in Figure 1-2. Table 1-1 provides the pin descriptions. Data communication and module configuration are documented in the MRF89XA Ultra Low-Power, Integrated Sub-GHz Transceiver (DS70622) Data Sheet. For more information on specific serial interface protocol and general register definitions, refer to the MRF89XA Data Sheet and see Section 1.3, Operation for specific register settings unique to the MRF89XAM9A module operation to maintain regulatory compliance. DEVICE OVERVIEW 1.0 The MRF89XAM9A is an Ultra Low-Power Sub-GHz surface mount transceiver module with integrated crystal, internal voltage regulator, matching circuitry and PCB antenna. The MRF89XAM9A module operates in the United States/Canada 902928 MHz ISM frequency band. The integrated module design frees the integrator from extensive RF and antenna design, and regulatory compliance testing, allowing quicker time to market. The MRF89XAM9A module is compatible with Microchips MiWi Development Environment software stacks. The software stacks are available as a free download, including source code, from the Microchips web site http://www.microchip.com/wireless. The MRF89XAM9A module has received regulatory approvals for modular devices in the United States
(FCC) and Canada (IC). Modular approval removes the need for expensive RF and antenna design, and allows the end user to place the MRF89XAM9A module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter). To maintain conformance, refer to module settings in Section 3.1.1, MRF89XAM9A SETTINGS for the United States and Section 3.2.1, MRF89XAM9A SETTINGS for Canada. FIGURE 1-1:
MRF89XAM9A BLOCK DIAGRAM PCB Antenna Matching Circuitry and SAW Filter MRF89XAM9A Module MRF89XA RF Baseband Control Interface Power Management CSCON CSDATA SPI Digital I/O IRQ0 IRQ1 RESET Power VCO Tank Loop Filter 12.8 MHz Crystal 2011 Microchip Technology Inc. Preliminary DS00000A-page 3 MRF89XAM9A TABLE 1-1:
PIN DESCRIPTION Pin 1 2 3 4 5 6 7 8 9 10 11 12 Symbol GND RESET CSCON IRQ0 SDI SCK SDO CSDATA IRQ1 Vin GND GND Type Power DI DI DO DI DI DO DI DO Power Power Power Description Ground Reset Pin Serial Interface Configure Chip Select Interrupt Request Output Serial Interface Data Input Serial Interface Clock Serial Interface Data Output Serial Interface Data Chip Select Interrupt Request Output Power Supply Ground Ground FIGURE 1-2:
MICROCONTROLLER TO MRF89XAM9A INTERFACE MRF89XAM9A PIC Microcontroller VIN GND CSCON CSDATA SDI SDO SCK IRQ0 IRQ1 RESET I/O I/O SDO SDI SCK INTx INTx I/O DS00000A-page 4 Preliminary 2011 Microchip Technology Inc. Mounting Details 1.2 The MRF89XAM9A is a surface mountable module. Module dimensions are shown in Figure 1-3. The module PCB is 0.032" thick with castellated mounting holes on the edge. Figure 1-4 is the recommended host PCB footprint for the MRF89XAM9A. FIGURE 1-3:
MODULE DETAILS MRF89XAM9A The MRF89XAM9A has an integrated PCB antenna. For the best performance, follow the mounting details shown in Figure 1-5. It is recommended that the module be mounted on the edge of the host PCB and an area around the antenna, approximately 3.4" (8.6 cm), be kept clear of metal objects for best performance. A host PCB ground plane around the MRF89XAM9A acts as a counterpoise to the PCB antenna. It is recommended to extend the ground plane at least 0.4" (1 cm) around the module. FIGURE 1-4:
RECOMMENDED PCB FOOTPRINT 2011 Microchip Technology Inc. Preliminary DS00000A-page 5 MRF89XAM9A FIGURE 1-5:
MOUNTING DETAILS Keep area around antenna
(approximately 3.4
(6.8 cm) inches) clear of metallic structures for best performance 3.4 Edge of PCB 0.470 0.4 3.4 0.4 Host PCB Top Copper Ground Plane
(Antenna Counterpoise):
Extend the host PCB top copper ground plane under and to the left and right side of the module at least 0.4 inches (1 cm) for best antenna performance. DS00000A-page 6 Preliminary 2011 Microchip Technology Inc. Operation 1.3 The MRF89XAM9A module is based on the Microchip Technology MRF89XA Ultra Low-Power, Integrated ISM Band Sub-GHz Transceiver IC. Data configuration are communication and module documented in the MRF89XA Ultra Low-Power, Integrated ISM Band Sub-GHz Transceiver Data Sheet (DS70622). This section emphasizes operational settings that are unique to the MRF89XAM9A module design that must be followed for proper operation. RESET 1.3.1 Pin 2 of the module, RESET, allows for an external reset of the MRF89XA IC. RESET is connected to the TEST8 pin of the MRF89XA IC. During normal operations of the MRF89XAM9A, the RESET pin should be held in a high impedance state. For more information on Assertion of the RESET pin, refer to the Section 3.1.2 Manual Reset of MRF89XA Data Sheet (DS70622). MRF89XAM9A CRYSTAL FREQUENCY 1.3.2 When calculating frequency deviation, bit rate, receiver bandwidth, and PLL R, P and S values, use crystal frequency fxtal = 12.8 MHz. 1.3.3 The CLKOUT pin 19 of the MRF89XA IC is not used on the module. Ensure that the CLKOUT signal is disabled to minimize the current consumption. CLOCK OUTPUT (CLKOUT) FREQUENCY BAND SELECT 1.3.4 The Frequency Band Select (FBS<1:0>) bits in the GCONREG<4:3> should be set for target channel range 902915 MHz FBS<1:0> = '00' or 915928 MHz FBS<1:0> = '01'. VCO TANK TRIM VALUE 1.3.5 The VCO Trim the GCONREG<2:1> should be set for VCOT<1:0> = '11'
for the inductor values of the module.
(VCOT<1:0>) bits in 2011 Microchip Technology Inc. Preliminary DS00000A-page 7 MRF89XAM9A NOTES:
DS00000A-page 8 Preliminary 2011 Microchip Technology Inc. CIRCUIT DESCRIPTION 2.0 The MRF89XAM9A module interfaces to Microchips PIC16, PIC 18, PIC24, dsPIC33 and PIC32 microcontrollers with a minimum of external components through digital only connections. An example application schematic is shown in Figure 2-2. MRF89XAM9A Module Schematic 2.1 The MRF89XAM9A module is based on the Microchip Technology MRF89XA Ultra Low-Power, Integrated ISM Band sub-GHz Transceiver IC. The serial I/O
(CSCON, CSDATA, SCK, SDO and SDI), RESET, IRQ0 and IRQ1 pins are brought out to the module pins. Crystal X1 is a 12.8 MHz crystal with a frequency tolerance of 10 ppm at 25C. The RFIO output is matched to the SAW filter FL1 and further matched to the PCB trace antenna. Figure 2-2 illustrates the MRF89XAM9A schematics. Table 2-1 details the Bill of Materials (BOM). FIGURE 2-1:
MRF89XAM9A APPLICATION SCHEMATIC U1 MRF89XAM9A-I/RM 1 2 3 4 5 6 GND RESET CSCON IRQ0 SDI SCK 12 11 10 9 8 7 GND GND VIN IRQ1 CSDATA SDO To Host Microcontroller
+ 3.3V Note 1 C1 0.1 F
+ C2 1 0 F To Host Microcontroller Note:
For battery powered applications, place a 10 F capacitor in parallel with the 0.1 F bypass capacitor to provide a low impedance during startup sequences. 2011 Microchip Technology Inc. Preliminary DS00000A-page 9 FIGURE 2-2:
MRF89XAM9A SCHEMATIC D S 0 0 0 0 0 A
p a g e 1 0 M R F 8 9 X A M 9 A P r e l i i m n a r y Note:
Designators not used: C6, L5 i 2 0 1 1 M c r o c h p T e c h n o o g y I i l n c
. 0.047 F Capacitor, Ceramic, 10V, 10%, X7R, SMT 0402 MRF89XAM9A MRF89XAM9A BILL OF MATERIALS Description Manufacturer Part Number Capacitor, Ceramic, 16V, 10%, X7R, SMT 0402 Capacitor, Ceramic, 6.3V, 10%, X5R, SMT 0603 Capacitor, Ceramic, 50V, 5%, UHI-Q NP0, SMT 0402 Capacitor, Ceramic, 50V, 0.1 pF, UHI-Q NP0, SMT 0402 Designator not used Capacitor, Ceramic, 50V, 5%, C0G, SMT 0402 Capacitor, Ceramic, 16V, 10%, X7R, SMT 0402 Capacitor, Ceramic, 50V, 5%, C0G, SMT 0402 Capacitor, Ceramic, 16V, 10%, X7R, SMT 0402 Capacitor, Ceramic, 50V, 0.1 pF, UHI-Q NP0, SMT 0402 Capacitor, Ceramic, 50V, 0.1 pF, UHI-Q NP0, SMT 0402 Filter, SAW, 902928 MHz Inductor, Ceramic, 5%, SMT 0402 Inductor, Ceramic, 5%, SMT 0402 Inductor, Wirewound, 5%, SMT 0402 Inductor, Wirewound, 5%, SMT 0402 Designator not used Murata Murata Murata GRM155R71A473KA01D GRM155R71C224KA12D GRM188R60J105KA01D Johanson Technology 250R07S300JV4T Johanson Technology 500R07S1R8BV4 Murata Murata Murata Murata GRM1555C1H330JZ01D GRM155R71C104KA88D GRM1555C1H681JA01D GRM155R71C103KA01D Johanson Technology 500R07S1R0BV4 Johanson Technology 500R07S0R9BV4 Tai-saw Technology Johanson Technology Johanson Technology Johanson Technology Johanson Technology TA0281A L-07C10NJV6T L-07CR10JV6T L-07W5N6JV4T L-07W5N6JV4T Inductor, Ceramic, 5%, SMT 0402 Johanson Technology L-07C10NJV6T Resistor, 1%, 100 ppm/0C, SMT 0402 Resistor, 5%, 100 ppm/0C, SMT 0402 Resistor, 1%, 100 ppm/0C, SMT 0402 Transceiver, Ultra Low-Power, Integrated Sub-GHz Vishay/Dale Yageo Yageo CRCW04021R00FKED RC0402JR-07100KL RC0402FR-076K8L Microchip Technology MRF89XA-I/MQ TABLE 2-1:
Desi gnat or C1 Value C2 C3 C4 C5 C6 C7 C8 C9 0.22 F 1 F 30 pF 1.8 pF 33 pF 0.1 F 680 pF C10 0.01 F C11 1.0 pF C12 0.9 pF TA0281A 10 nH 100 nH 5.6 nH 5.6 nH FL1 L1 L2 L3 L4 L5 L6 R1 R2 R3 U1 MRF89XA 100K 6.8K 10 nH 1 X1 12.8 MHz Crystal, 10 ppm, 15 pF, ESR 100 ohms, SMT 5 x 3.2mm Abracon ABM3B-155-12.800MHz-T 2011 Microchip Technology Inc. Preliminary DS00000A-page 11 MRF89XAM9A FIGURE 2-5:
LAYER 2 GROUND PLANE Printed Circuit Board 2.2 The MRF89XAM9A module PCB is constructed with high temperature FR4 material, four layers and 0.032 inches thick. The layers are shown in Figure 2-3 through Figure 2-8. The stack up of the PCB is shown in Figure 2-9 FIGURE 2-3:
TOP SILK SCREEN FIGURE 2-6:
LAYER 3 POWER PLANE FIGURE 2-4:
TOP COPPER 2011 Microchip Technology Inc. Preliminary DS00000A-page 12 FIGURE 2-7:
BOTTOM COPPER FIGURE 2-8:
BOTTOM SILK SCREEN MRF89XAM9A FIGURE 2-9:
PCB LAYER STACK UP 0.032 0.005 1/2 oz. Copper 8 mil FR4 1/2 oz. Copper 12 mil FR4 1/2 oz. Copper 8 mil FR4 1/2 oz. Copper Top Copper Ground Plane Power Plane Bottom Copper 2011 Microchip Technology Inc. Preliminary DS00000A-page 13 MRF89XAM9A FIGURE 2-10:
PCB ANTENNA DIMENSIONS 16.8mm 1.0mm 2.5mm 8.4mm 1.1mm 0.5mm PCB Antenna 2.3 The PCB antenna is fabricated on the top copper trace. Figure 2-11 shows the trace dimensions. The layers below the antenna have no copper traces. The ground and power planes under the components serve as a counterpoise to the PCB antenna. Additional ground plane on the host PCB will substantially enhance the performance of the module. For best performance, place the module on the host PCB by following the recommendations in Section 1.2, Mounting Details. The PCB antenna was designed and simulated using Ansoft Designer and HFSS 3D full-wave solver software by ANSYS, Inc. (www.ansoft.com). The design goal was to create a compact, low-cost antenna with the best radiation pattern. Figure 2-11 shows the simulation drawing and Figure 2-12 and Figure 2-13 show the 2D and 3D radiation patterns, respectively. As shown by the radiation patterns, the performance of the antenna is dependant upon the orientation of the module. Figure 2-14 shows the impedance simulation and Figure 2-15 shows impedance measurement. The discrete matching circuitry matches the impedance of the antenna with the SAW filter and MRF89XA transceiver IC. the actual FIGURE 2-11:
PCB ANTENNA SIMULATION DRAWING 2011 Microchip Technology Inc. Preliminary DS00000A-page 14 FIGURE 2-12:
SIMULATED 2D RADIATION PATTERN MRF89XAM9A FIGURE 2-13:
SIMULATED 3D RADIATION PATTERN 2011 Microchip Technology Inc. Preliminary DS00000A-page 15 FIGURE 2-14:
SIMULATED PCB ANTENNA IMPEDANCE MRF89XAM9A FIGURE 2-15:
SIMULATED PCB ANTENNA VSWR 2011 Microchip Technology Inc. Preliminary DS00000A-page 16 to REGULATORY APPROVAL 3.0 The MRF89XAM9A module has received regulatory approvals for modular devices in the United States and Canada. Modular approval allows the end user to place the MRF89XAM9A module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter), provided no changes or modifications are made the module circuitry. Changes or modifications could void the users authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The integrator is still responsible for testing the end product for any additional compliance requirements required with this module installed (digital device emission, PC peripheral requirements, etc.) in the specific country that the end device will be marketed. For more compliance, refer regulations in the following sections. regulatory the specific country radio information on details on to has Commission received
(FCC) United States 3.1 Federal The MRF89XAM9A Communications CFR47 Telecommunications, Part 15 Subpart C Intentional Radiators 15.247 and 15.249 and modular approval in accordance with FCC Public Notice DA 00-1407 Released: June 26, 2000, Part 15 Unlicensed Modular Transmitter Approval. The MRF89XAM9A module can be integrated into a finished product without obtaining subsequent and separate FCC certification. The MRF89XAM9A module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as following:
Contains Transmitter Module FCC ID:
OA3MRF89XAM9A
-or-
Contains FCC ID: OA3MRF89XAM9A This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. MRF89XAM9A Requirements for product labeling are given in Part 15.19 Labelling Requirements. in a residential The users manual should include the following statement:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment OFF and ON, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. MRF89XAM9A SETTINGS 3.1.1 To meet the FCC requirements, the following settings must be observed by the integrator:
FSK Modulation 3.1.1.1 The following settings configure the MRF89XAM9A for wideband digital modulation techniques that conform to the requirements of Part 15.247. These settings allow for higher radio frequency (RF) output power and greater link budget:
Bit Rate Setting: 50 - 200 kbps
- Transmit Power Maximum Setting:13 dBm Bit Rate Setting: 2 - 40 kbps
- Transmit Power Maximum Setting:7 dBm Frequency Deviation Setting: 200 kHz Data Whitening: On Transmit Bandwidth Setting: 400 kHz Lower Frequency Setting: 902.800 MHz Upper Frequency Setting: 926.500 MHz 2011 Microchip Technology Inc. Preliminary DS00000A-page 17 MRF89XAM9A OOK Modulation 3.1.1.2 The following settings configure the MRF89XAM9A for narrowband operation that conform to the requirements of Part 15.249. Part 15.249 requires a much lower power setting than is allowed in Part 15.247. These set-
tings are good for applications that require lower trans-
mit power current consumption and shorter transmit distances:
Transmit Power Maximum Setting:1 dBm Bit Rate Maximum Setting: 16 kbps Frequency Deviation Setting: 200 kHz Transmit Bandwidth Setting: 400 kHz Lower Frequency Setting: 902.330 MHz Upper Frequency Setting: 927.500 MHz RF EXPOSURE 3.1.2 All transmitters regulated by FCC must comply with RF exposure requirements. OET Bulletin 65 Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to RF fields adopted by the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance. If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF Exposure compliance:
To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the MRF89XAM9A module is used in a portable application (antenna is less than 20 cm from persons during operation), the integrator is responsible for performing Specific Absorption Rate (SAR) testing in accordance with FCC rules 2.1091. HELPFUL WEB SITES 3.1.3 Federal Communications Commission (FCC) http://
www.fcc.gov DS00000A-page 18 Preliminary 2011 Microchip Technology Inc. Canada 3.2 The MRF89XAM9A module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010):
The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words Contains transmitter module, or the word Contains, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 7693A-89XAM9A in following or equivalent notice location User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3, December 2010):
User manuals for license-exempt radio apparatus shall contain the in a conspicuous the user manual or alternatively on the device or both. This device complies with Industry Canada license-
exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. MRF89XAM9A MRF89XAM9A SETTINGS 3.2.1 To meet Industry Canada (IC) requirements, the following settings must be observed by the integrator:
FSK Modulation 3.2.1.1 The following settings configure the MRF89XAM9A for wideband digital modulation techniques that conform to the requirements of RSS-210 Issue 8 Annex 8. These settings allow for higher radio frequency (RF) output power and greater link budget. Bit Rate Setting: 50 - 200 kbps
- Transmit Power Maximum Setting:13 dBm Bit Rate Setting: 2 - 40 kbps
- Transmit Power Maximum Setting:7 dBm Frequency Deviation Setting: 200 kHz Data Whitening: On Transmit Bandwidth Setting: 400 kHz Lower Frequency Setting: 902.800 MHz Upper Frequency Setting: 926.500 MHz OOK Modulation 3.2.1.2 The following settings configure the MRF89XAM9A for narrowband operation that conform to the requirements of RSS-Gen Issue 3. RSS-Gen Issue 3 requires a much lower power setting than is allowed in Part RSS-
210 Issue 8 Annex 8. These settings are good for applications that require lower transmit power current consumption and shorter transmit distances. Transmit Power Maximum Setting:1 dBm Bit Rate Maximum Setting: 16 kbps Frequency Deviation Setting: 200 kHz Transmit Bandwidth Setting: 400 kHz Lower Frequency Setting: 902.330 MHz Upper Frequency Setting: 927.500 MHz 3.2.2 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/
2011 Microchip Technology Inc. Preliminary DS00000A-page 19 MRF89XAM9A NOTES:
DS00000A-page 20 Preliminary 2011 Microchip Technology Inc. MRF89XAM9A 4.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Ambient temperature under bias.............................................................................................................. -40C to +85C Storage temperature .............................................................................................................................. -55C to +125C Voltage on VIN with respect to VSS ................................................................................................................ -0.3V to 6V Voltage on any combined digital and analog pin with respect to VSS (except VIN) ...........................-0.3V to (VIN + 0.3V) Input current into pin (except VIN and VSS)........................................................................................... -25 mA to 25 mA Electrostatic discharge with human body model.................................................................................................... 1000V NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2011 Microchip Technology Inc. Preliminary DS00000A-page 21 MRF89XAM9A TABLE 4-1:
RECOMMENDED OPERATING CONDITIONS Typ Parameter Ambient Operating Temperature Supply Voltage for RF, Analog and Digital Circuits Supply Voltage for Digital I/O Input High Voltage (VIH) Input Low Voltage (VIL) AC Peak Voltage on Open Collector Outputs (IO)(1) VIN 1.5 Note 1: At minimum, VIN 1.5V should not be lower than 1.8V. Min
-40 2.1 2.1 0.5 * VIN
-0.3V Max
+85 3.6 3.6 VIN + 0.3 0.2 * VIN VIN + 1.5 Unit C V V V V V Condition CURRENT CONSUMPTION Chip Mode TABLE 4-2:
Symbol IDDSL IDDST IDDFS IDDTX Sleep Idle Frequency Synthesizer Tx Min Typ 0.1 65 1.3 25 16 3.0 Max 2 80 1.7 30 21 3.5 Unit A A mA mA mA mA Condition Sleep clock disabled, all blocks disabled Oscillator and baseband enabled Frequency synthesizer running Output power = +10 dBm Output power = +1 dBm(1) IDDRX Note 1: Guaranteed by design and characterization. Rx TABLE 4-3:
DIGITAL I/O PIN INPUT SPECIFICATIONS(1) Max Min Characteristic Input Low Voltage Input High Voltage Symbol VIL VIH IIL IIH VOL IOL = 1 mA VOH IOH = -1 mA Note 1: Measurement Conditions: TA = 25C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise Input Low Leakage Current(2) Input High Leakage Current Digital Low Output Voltage Unit V V A A V Typ Digital Low Output
-0.5
-0.5 Condition 0.5 0.5 0.9 * VIN 0.8 * VIN 0.1 * VIN 0.2 * VIN VIL = 0V VIH = VIN, VIN = 3.7 specified. 2: Negative current is defined as the current sourced by the pin. DS00000A-page 22 Preliminary 2011 Microchip Technology Inc. TABLE 4-4:
Symbol FRO BRFSK BROOK FDFSK FXTAL FSSTP TSOSC TSFS TSHOP Parameter Frequency Ranges PLL PARAMETERS AC CHARACTERISTICS(1) Max 928 40 16 200 Frequency Deviation (FSK) Crystal Oscillator Frequency Frequency Synthesizer Step Min 902 1.56 1.56 33 9 Bit Rate (FSK) Bit Rate (OOK) Typ 50 12.8 2 Oscillator Wake-up Time Frequency Synthesizer Wake-
up Time; at most, 10 kHz away from the target Frequency Synthesizer Hop Time; at most, 10 kHz away from the target 1.5 500 180 200 250 260 290 320 340 5 800 MRF89XAM9A Unit MHz kbps kbps kHz MHz kHz ms s s s s s s s s Condition NRZ NRZ Variable, depending on the frequency From Sleep mode(1) From Stand-by mode 200 kHz step 1 MHz step 5 MHz step 7 MHz step 12 MHz step 20 MHz step 27 MHz step Note 1: Guaranteed by design and characterization. 2011 Microchip Technology Inc. Preliminary DS00000A-page 23 MRF89XAM9A TABLE 4-5:
RECEIVER AC CHARACTERISTICS(1) Symbol RSF Parameter Sensitivity (FSK) Min RSO Sensitivity (OOK) CCR ACR Co-Channel Rejection Adjacent Channel Rejection BI Blocking Immunity RXBWF RXBWU ITP3 TSRWF TSRWS TSRHOP Receiver Bandwidth in FSK Mode(2) Receiver Bandwidth in OOK Mode(2) Input Third Order Intercept Point Receiver Wake-up Time Receiver Wake-up Time Receiver Hop Time from Rx Ready to Rx Ready with a Frequency Hop Typ
-107
-103
-113
-106
-12 27 52 57
-48
-37
-33
-28 280 600 400 400 460 480 520 550 600 70 Max 250 400 500 900 1/fdev Condition Unit dBm 915 MHz, BR = 25 kbps, fdev = 50 kHz, fc = 100 kHz dBm 915 MHz, BR = 66.7 kbps, fdev = 100 kHz, fc = 200 kHz dBm 915 MHz, 2 kbps NRZ fc fo = 50 kHz, fo = 50 kHz dBm 915 MHz, 16.7 kbps NRZ fc fo = 100 kHz, fo = 100 kHz Modulation as wanted signal Offset = 300 kHz, unwanted tone is not modulated Offset = 600 kHz, unwanted tone is not modulated Offset = 1.2 MHz, unwanted tone is not modulated Offset = 1 MHz, unmodulated Offset = 2 MHz, unmodulated, no SAW Offset = 10 MHz, unmodulated, no SAW Single side BW, Polyphase Off Single side BW, Polyphase On dBc dB dB dB dBm dBm dBm kHz kHz dBm Interferers at 1 MHz and 1.950 MHz offset s s s s s s s s s s dB From FS to Rx ready From Stand-by to Rx ready 200 kHz step 1 MHz step 5 MHz step 7 MHz step 12 MHz step 20 MHz step 27 MHz step From Rx ready Ranging from sensitivity 50 50 RSSIST RSSTDR Note 1: Guaranteed by design and characterization. RSSI Sampling Time RSSI Dynamic Range 2: This reflects the whole receiver bandwidth, as described by conditions for active and passive filters. DS00000A-page 24 Preliminary 2011 Microchip Technology Inc. MRF89XAM9A TRANSMITTER AC CHARACTERISTICS(1) Min Typ
+12.5
-8.5
-112 Max
-47 Unit dBm dBm dBc/Hz dBc
-40 dBm Condition Maximum power setting Minimum power setting Measured with a 600 kHz offset at the transmitter output At any offset between 200 kHz and 600 kHz, unmodulated carrier, fdev = 50 kHz No modulation, see Note(2) TABLE 4-6:
Symbol RFOP Description RF Output Power, Programmable with 8 Steps of typ. 3 dB Phase Noise Transmitted Spurious Second Harmonic Third Harmonic Fourth Harmonic PN TXSP Tx2 Tx3 Tx4 Txn FSKDEV TSTWF Harmonics above Tx4 FSK Deviation Transmitter Wake-up Time 33 TSTWS Note 1: Guaranteed by design and characterization. Transmitter Wake-up Time 55 120 600 200 500 900 kHz s s Programmable From FS to Tx ready From Stand-by to Tx ready 2: Transmitter in-circuit performance with SAW filter and crystal. 4.1 Timing Specification and Diagram TABLE 4-7:
Condition Parameter Min 2 250 312 500 SPI TIMING SPECIFICATION(1,2) Typ SPI Configure Clock Frequency SPI Data Clock Frequency Data Hold and Setup Time SDI Setup Time for SPI Configure SDI Setup Time for SPI Data CSCON Low to SCK Rising Edge;
SCK Falling Edge to CSCON High CSDATA Low to SCK Rising Edge;
SCK Falling Edge to CSDATA High CSCON Rising to Falling Edge CSDATA Rising to Falling Edge Note 1: Typical Values: TA = 25C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise specified. Unit MHz MHz s ns ns ns Max 6 1 500 625 ns ns 625 ns 2: Negative current is defined as the current sourced by the pin. 2011 Microchip Technology Inc. Preliminary DS00000A-page 25 MRF89XAM9A NOTES:
DS00000A-page 26 Preliminary 2011 Microchip Technology Inc. MRF89XAM9A APPENDIX A: REVISION HISTORY Revision A (May 2011) This is the Initial release of the document. 2011 Microchip Technology Inc. Preliminary DS00000A-page 27 MRF89XAM9A NOTES:
DS00000A-page 28 Preliminary 2011 Microchip Technology Inc. MRF89XAM9A CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
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DS00000A-page 30 Preliminary 2011 Microchip Technology Inc. MRF89XAM9A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office. PART NO M X T
-X Device Module Module Type Tape and Reel Temperature Range Device MRF89XAM9A-I/RM: Ultra Low-Power, Integrated ISM Band Sub-GHz Transceiver module Temperature Range I
= -40C to +85C (Industrial) Example:
a) MRF89XAM9A-I/RM: Industrial temperature tray. b) MRF89XAM9AT-I/RM: Industrial temperature tape and reel, 2011 Microchip Technology Inc. Preliminary DS00000A-page 31 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 Worldwide Sales and Service AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support:
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