FCC ID: OA3MRF24J40MB Spread Spectrum Transmitter

MRF24J40MB Data Sheet 2.4 GHz IEEE Std. 802.15.4 20 dBm RF Transceiver Module 2009 Microchip Technology Inc. Preliminary DS70599B Note the following details of the code protection feature on Microchip devices:

Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as unbreakable. Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, Omniscient Code Generation, PICC, PICC-18, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Companys quality system processes and procedures are for its PIC MCUs and dsPIC DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchips quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS70599B-page ii Preliminary 2009 Microchip Technology Inc. MRF24J40MB 2.4 GHz IEEE Std. 802.15.4 20 dBm RF Transceiver Module Features:

IEEE Std. 802.15.4 Compliant RF Transceiver Supports ZigBee, MiWi, MiWi P2P and Proprietary Wireless Networking Protocols Small Size: 0.9" x 1.3" (22.9 mm x 33.0 mm), Surface Mountable Integrated Crystal, Internal Voltage Regulator, Matching Circuitry, Power Amplifier, Low Noise Amplifier and PCB Antenna Easy Integration into Final Product Minimize Product Development, Quicker Time to Market Radio Regulation Certified for United States

(FCC), Canada (IC) and Europe (ETSI) Compatible with Microchip Microcontroller Families (PIC16F, PIC18F, PIC24F/H, dsPIC33 and PIC32) Up to 4000 ft. Range Operational:

Operating Voltage: 2.4-3.6V (3.3V typical) Temperature Range: -40C to +85C Industrial Simple, Four-Wire SPI Interface Low-Current Consumption:

- RX mode: 25 mA (typical)

- TX mode: 130 mA (typical)

- Sleep: 5 A (typical) FIGURE 1:

PIN DIAGRAM RF/Analog Features:

ISM Band 2.405-2.48 GHz Operation Data Rate: 250 kbps

-102 dBm Typical Sensitivity with -23 dBm Maximum Input Level

+20 dBm Typical Output Power with 56 dB TX Power Control Range Integrated Low Phase Noise VCO, Frequency Synthesizer and PLL Loop Filter Digital VCO and Filter Calibration Integrated RSSI ADC and I/Q DACs Integrated LDO High Receiver and RSSI Dynamic Range MAC/Baseband Features:

Hardware CSMA-CA Mechanism, Automatic ACK Response and FCS Check Independent Beacon, Transmit and GTS FIFO Supports all CCA modes and RSS/LQI Automatic Packet Retransmit Capable Hardware Security Engine (AES-128) with CTR, CCM and CBC-MAC modes Supports Encryption and Decryption for MAC Sublayer and Upper Layer GND RESET WAKE INT SDI SCK 1 2 3 4 5 6 12 GND 11 GND 10 9 8 7 VIN NC CS SDO 2009 Microchip Technology Inc. Preliminary DS70599B-page 1 MRF24J40MB Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 3 2.0 Circuit Description ........................................................................................................................................................................ 7 3.0 Regulatory Approval................................................................................................................................................................... 17 4.0 Electrical Characteristics ........................................................................................................................................................... 21 Appendix A: Revision History............................................................................................................................................................... 23 Index ................................................................................................................................................................................................... 25 The Microchip Web Site ....................................................................................................................................................................... 27 Customer Change Notification Service ................................................................................................................................................ 27 Customer Support................................................................................................................................................................................ 27 Reader Response ................................................................................................................................................................................ 28 Product Identification System............................................................................................................................................................... 29 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:

Microchips Worldwide Web site; http://www.microchip.com Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS70599B-page 2 Preliminary 2009 Microchip Technology Inc. MRF24J40MB Interface Description 1.1 Figure 1-1 shows a simplified block diagram of the MRF24J40MB module. The module is based on the Microchip Technology MRF24J40 IEEE 802.15.4 2.4 GHz RF Transceiver IC. The module interfaces to many popular Microchip PIC microcontrollers via a 4-wire serial SPI interface, interrupt, wake, Reset, power and ground, as shown in Figure 1-2. Table 1-1 provides the pin descriptions. Data communications with the MRF24J40MB module are documented in the MRF24J40 IEEE 802.15.4 2.4 GHz RF Transceiver Data Sheet (DS39776). Refer to the MRF24J40 Data Sheet for specific serial interface protocol and register definitions. DEVICE OVERVIEW 1.0 The MRF24J40MB is a 2.4 GHz IEEE Std. 802.15.4 compliant, surface mount module with integrated crystal, internal voltage regulator, matching circuitry, Power Amplifier, Low Noise Amplifier and PCB antenna. The MRF24J40MB module operates in the non-licensed 2.4 GHz frequency band. The integrated module design frees the integrator from extensive RF and antenna design, and regulatory compliance testing, allowing quicker time to market. The MRF24J40MB module is compatible with Microchips ZigBee, MiWi and MiWi P2P software stacks. Each software stack is available as a free download, including source code, from the Microchip web site: http://www.microchip.com/wireless. The MRF24J40MB module has received regulatory approvals for modular devices in the United States

(FCC), Canada (IC) and Europe (ETSI). Modular approval removes the need for expensive RF and antenna design, and allows the end user to place the MRF24J40MB module inside a finished product and not require regulatory testing for an intentional radiator

(RF transmitter). Note:

See Section 3.0 Regulatory Approval for specific requirements to be followed by the integrator. FIGURE 1-1:

MRF24J40MB BLOCK DIAGRAM MRF24J40MB IEEE Std. 802.15.4 Module MRF24J40 PCB Antenna PA LNA Physical MAC Interface SPI Power Management Digital I/O Power 20 MHz Crystal 2009 Microchip Technology Inc. Preliminary DS70599B-page 3 MRF24J40MB TABLE 1-1:

PIN DESCRIPTION Pin 1 2 3 4 5 6 7 8 9 10 11 12 Symbol GND RESET WAKE INT SDI SCK SDO CS NC VIN GND GND Type Power Ground Description DI DI DO DI DI DO DI Global hardware Reset pin External wake-up trigger Interrupt pin to microcontroller Serial interface data input Serial interface clock Serial interface data output from MRF24J40 Serial interface enable No connection Power supply Power Ground Ground Ground Ground Legend: Pin type abbreviation: D = Digital, I = Input, O = Output FIGURE 1-2:

MICROCONTROLLER TO MRF24J40MB INTERFACE PIC MCU MRF24J40MB I/O SDO SDI SCK INTx I/O I/O CS SDI SDO SCK INT WAKE RESET VIN GND DS70599B-page 4 Preliminary 2009 Microchip Technology Inc. MRF24J40MB FIGURE 1-4:

RECOMMENDED PCB FOOTPRINT footprint Mounting Details recommended host PCB 1.2 The MRF24J40MB is a surface mountable module. Module dimensions are shown in Figure 1-3. The module Printed Circuit Board (PCB) is 0.032" thick with castellated mounting points on the edge. Figure 1-4 is a the MRF24J40MB. The MRF24J40MB has an integrated PCB antenna. For the best performance, follow the mounting details shown in Figure 1-5. It is recommended that the module be mounted on the edge of the host PCB, and an area around the antenna, approximately 1.2", be kept clear of metal objects. A host PCB ground plane around the MRF24J40MB acts as a counterpoise to the PCB antenna. It is recommended to extend the ground plane at least 0.4" around the module. for FIGURE 1-3:

MODULE DETAILS 2009 Microchip Technology Inc. Preliminary DS70599B-page 5 MRF24J40MB FIGURE 1-5:

MOUNTING DETAILS 1.2 Keep area around antenna

(approximately 1.2 inches) clear of metallic structures for best performance Edge of PCB 0.315 1.2 0.4 0.4 0.4 PCB Ground Plane (Counterpoise) Underneath and extend as far as possible to the sides and below the module

(at least 0.4 inches on each side) for best performance DS70599B-page 6 Preliminary 2009 Microchip Technology Inc. CIRCUIT DESCRIPTION 2.0 The MRF24J40MB is a complete 2.4 GHz IEEE Std. 802.15.4 compliant surface mount module with integrated crystal, internal voltage regulator, matching circuitry, Power Amplifier, Low Noise Amplifier and PCB antenna. The MRF24J40MB module interfaces to many popular Microchip PIC microcontrollers via a 4-wire serial SPI interface, interrupt, wake, Reset, power and ground. Data communications with the MRF24J40MB module are documented in the MRF24J40 IEEE 802.15.4 2.4 GHz RF Transceiver Data Sheet

(DS39776). Refer to the MRF24J40 Data Sheet for specific serial interface protocol and register definitions. MRF24J40MB Schematic 2.1 A schematic diagram of the module is shown in Figure 2-1 and the Bill of Materials (BOM) is shown in Table 2-1. The MRF24J40MB module is based on the Microchip Technology MRF24J40 IEEE 802.15.4 2.4 GHz RF Transceiver IC (U1). The serial I/O (SCK, SDI, SDO and CS), RESET, WAKE and INT pins are brought out to the module pins. The SDO signal is tri-state buffered by IC7 to solve a silicon errata, where the SDO signal does not release to a high-impedance state, after the CS pin returns to its inactive state. Crystal, X1, is a 20 MHz crystal with a frequency tolerance of 10 ppm @ 25C to meet the IEEE Std. 802.15.4 symbol rate tolerance of 40 ppm. A balun is formed by components: L1, L3, C2 and C3. L2 is an RF choke and pull-up for the RFP and RFN pins on the MRF24J40. C4 is a DC block capacitor. RF switches, IC2 and IC4, switch between the power amplifier, low noise amplifier, IC5, when receiving. A low-pass filter is formed by components: L10, L11, C31, C32 and C36. The remaining passive components provide bias and decoupling. transmitting and IC3, when 2009 Microchip Technology Inc. Preliminary DS70599B-page 7 MRF24J40MB FIGURE 2-1:

MRF24J40MB SCHEMATIC F

2

. 2 F

0 1 z H M 0 2 F

1 DS70599B-page 8 Preliminary 2009 Microchip Technology Inc. TABLE 2-1:

Designator MRF24J40MB MRF24J40MB BILL OF MATERIALS Description Chip Capacitor 0402 COG 0.5P Chip Capacitor 0402 COG 0.5P Chip Capacitor 0402 COG 1.0P Chip Capacitor 0402 COG 1.5P Not Used Chip Capacitor 0402 COG 4.7P Chip Capacitor 0402 COG 4.7P Chip Capacitor 0402 COG 10P Chip Capacitor 0402 COG 10P Chip Capacitor 0402 X5R 100N Chip Capacitor 0402 X5R 100N Chip Capacitor 0402 COG 15P Chip Capacitor 0402 COG 15P Chip Capacitor 0402 COG 22P Chip Capacitor 0402 X5R 100N Chip Capacitor 0402 COG 5.6P Chip Capacitor 0402 COG 1.8P Chip Capacitor 0402 X7R 1N Chip Capacitor 0402 COG 47P Chip Capacitor 0402 X7R 1N Chip Capacitor 0402 COG 47P Not Used Chip Capacitor 0402 X7R 1N Chip Capacitor 0402 X5R 100N Chip Capacitor 0402 COG 10P Chip Capacitor 0402 COG 100P Chip Capacitor 0402 X5R 100N Chip Capacitor 0402 COG 47P Chip Capacitor 0402 COG 1.5P Chip Capacitor 0402 COG 0.4P Chip Capacitor 0402 COG 18P Chip Capacitor 0402 COG 18P Chip Capacitor 0402 COG 47P Not Used Chip Capacitor 0805 X5R 10U Chip Capacitor 0402 COG 47P Chip Capacitor 0402 COG 47P Chip Capacitor 0402 X5R 1U Chip Capacitor 0402 X7R 10N Chip Capacitor 0402 X7R 10N Chip Capacitor 0402 COG 100P Chip Capacitor 0402 X5R 100N Chip Capacitor 0402 COG 47P Manufacturer Johanson Technology Johanson Technology Johanson Technology Murata Part Number 500R07S0R5AV4T 500R07S0R5AV4T 500R07S1R0BV4T GRM1555C1H1R5CZ01D Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Johanson Technology Johanson Technology Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata Murata GRM1555C1H4R7CZ01D GRM1555C1H4R7CZ01D GRM1555C1H100JZ01D GRM1555C1H100JZ01D GRM155R61A104KA01D GRM155R61A104KA01D GRM1555C1H150JZ01D GRM1555C1H150JZ01D GRM1555C1H220JZ01D GRM155R61A104KA01D GRM1555C1H5R6CZ01D GRM1555C1H1R8CZ01D GRM155R71H102KA01D GRM1555C1H470JZ01D GRM155R71H102KA01D GRM1555C1H470JZ01D GRM155R71H102KA01D GRM155R61A104KA01D GRM1555C1H100JZ01D GRM1555C1H101JZ01D GRM155R61A104KA01D GRM1555C1H470JZ01D 500R07S1R5BV4T 500R07S0R4AV4T GRM1555C1H180JZ01D GRM1555C1H180JZ01D GRM1555C1H470JZ01D GRM21BR60J106ME19L GRM1555C1H470JZ01D GRM1555C1H470JZ01D GRM155R60J105ME19D GRM155R71E103KA01D GRM155R71E103KA01D GRM1555C1H101JZ01D GRM155R61A104KA01D GRM1555C1H470JZ01D Capacitors and inductors cannot be substituted. C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C29 C30 C31 C32 C33 C34 C35 C36 C37 C38 C39 C40 C41 C42 C43 C44 C45 Note:

2009 Microchip Technology Inc. Preliminary DS70599B-page 9 MRF24J40MB TABLE 2-1:

Designator MRF24J40MB BILL OF MATERIALS (CONTINUED) Description Manufacturer C46 C47 C48 IC1 IC2 IC3 IC4 IC5 IC6 IC7 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 R1 R2 R3 R4 R7 R8 S X1 Note:

Chip Capacitor 0402 X5R 100N Chip Capacitor 0402 COG 47P Chip Capacitor 0603 X5R 2.2U 802.15.4 Radio Switch SPDT Power Amplifier Switch SPDT Low Noise Amplifier Voltage Regulator Buffer-SC70 Package Chip Inductor 0402 8.2N Chip Inductor 0402 2.7N Chip Inductor 0402 4.7N Chip Resistor 0402 0Ohms Chip Inductor 0402 3.3N Chip Inductor 0402 3.9N Chip Inductor 0402 1.5N Chip Inductor 0402 18N Chip Inductor 0402 1.5N Chip Inductor 0402 2.2N Chip Inductor 0402 2.7N Chip Resistor 0402 10Ohms 5%

Not Used Chip Resistor 0402 2.2Ohms 5%

Chip Resistor 0402 10K 5%

Not Used Not Used Shield-Custom 20 MHz Crystal Murata Murata Murata Microchip Skyworks SiGe Skyworks NEC Microchip Fairchild Panasonic Panasonic Panasonic Dale Panasonic Panasonic Panasonic Panasonic Panasonic Panasonic Panasonic Dale Dale Dale TBD Abracon Capacitors and inductors cannot be substituted. Part Number GRM155R61A104KA01D GRM1555C1H470JZ01D GRM188R60J225ME01D MRF24J40-I/ML AS179-92 PA2423L-R AS179-92 UPC8233TK-E2-A MCP1700T-3302E/TT NC7SZ125P5X ELJ-RF8N2JFB ELJ-RF2N7DFB ELJ-RF4N7DFB CRCW04020000Z0ED ELJ-RF3N3DFB ELJ-RF3N9DFB ELJ-RF1N5DFB ELJ-RF18NJFB ELJ-RF1N5DFB ELJ-RF2N2DFB ELJ-RF2N7DFB CRCW040210R0JNED CRCW04022R20JNED CRCW040210K0JNED ABM8-156-20.0000MHZ-T DS70599B-page 10 Preliminary 2009 Microchip Technology Inc. MRF24J40MB Printed Circuit Board 2.2 The MRF24J40MB module printed circuit board is con-

structed with FR4 material, layers and 0.032 inches thick. The layers are shown in Figure 2-2 through Figure 2-6. The stack up of the PCB is shown in Figure 2-7. four FIGURE 2-2:

TOP SILK SCREEN FIGURE 2-3:

TOP COPPER FIGURE 2-4:

LAYER 2 GROUND PLANE Note:

Top view positive Gerber. 2009 Microchip Technology Inc. Preliminary DS70599B-page 11 MRF24J40MB FIGURE 2-5:

LAYER 3 POWER PLANE FIGURE 2-6:

BOTTOM COPPER Note:

Top view positive Gerber. Note:

Top view. FIGURE 2-7:

PCB LAYER STACK UP 0.032

+/- 0.005 1/2 oz. Copper 8 mil FR4 1/2 oz. Copper 12 mil FR4 1/2 oz. Copper 8 mil FR4 1/2 oz. Copper Top Copper Ground Plane Power Plane Bottom Copper DS70599B-page 12 Preliminary 2009 Microchip Technology Inc. PCB Antenna 2.3 The PCB antenna is fabricated on the top copper trace. Figure 2-8 shows the trace dimensions. The layers below the antenna have no copper traces. The ground and power planes under the components serve as a counterpoise to the PCB antenna. Additional ground plane on the host PCB will substantially enhance the performance of the module. For best performance, place the module on the host PCB following the recommendations in Section 1.2 Mounting Details. The Printed Circuit Board (PCB) antenna was designed and simulated using Ansoft Designer and HFSS 3D full-wave solver software by Ansoft Corporation FIGURE 2-8:

PCB ANTENNA DIMENSIONS 1.0 8.6 5.3 0.85 2.0 7 3

. 3 5

. 0 MRF24J40MB

(www.ansoft.com). The design goal was to create a compact, low-cost antenna with the best radiation pattern. Figure 2-9 shows the simulation drawing and Figure 2-10 and Figure 2-11 show the 2D and 3D radiation patterns, respectively. As shown by the radiation patterns, the performance of the antenna is dependant upon the module. Figure 2-12 shows the impedance simulation and Figure 2-13 shows the SWR simulation. The discrete matching circuitry matches the impedance of the antenna with the MRF24J40 transceiver IC. the orientation of 22.0 1.3 6.0 3.8 1.54 4.2 3.82 4.3 6.6 0.5 9.6 1.0 1.2 6.6 1.2 1.0 2.0 1.0 1.0 0.72 Note 1: Dimensions are in mm and tolerance is +/ 0.05 mm. 2009 Microchip Technology Inc. Preliminary DS70599B-page 13 MRF24J40MB FIGURE 2-9:

PCB ANTENNA SIMULATION DRAWING FIGURE 2-10:

SIMULATED 2D RADIATION PATTERN DS70599B-page 14 Preliminary 2009 Microchip Technology Inc. FIGURE 2-11:

SIMULATED 3D RADIATION PATTERN MRF24J40MB FIGURE 2-12:

SIMULATED PCB ANTENNA IMPEDANCE 2009 Microchip Technology Inc. Preliminary DS70599B-page 15 MRF24J40MB FIGURE 2-13:

SIMULATED PCB ANTENNA SWR DS70599B-page 16 Preliminary 2009 Microchip Technology Inc. MRF24J40MB The users manual should include the following statement:

in a residential This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to reasonable protection against harmful provide interference installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. MRF24J40MB SETTINGS 3.1.1 To meet the FCC requirements, the following settings must be observed by the integrator:

The MRF24J40MB transmit power setting

(RFCON3 0x203) cannot exceed -1.9 dB. Only channels 11 through 25 may be selected

(RFCON0 0x200). RF EXPOSURE 3.1.2 All transmitters regulated by FCC must comply with RF exposure requirements. OET Bulletin 65 Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency

(RF) fields adopted by the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance. If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. REGULATORY APPROVAL 3.0 The MRF24J40MB module has received regulatory approvals for modular devices in the United States, Canada and European countries. Modular approval allows the end user to place the MRF24J40MB module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter), pro-

vided no changes or modifications are made to the module circuitry. Changes or modifications could void the users authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The integrator may still be responsible for testing the end product for any additional compliance requirements required with this module, installed (for example: digital device emission, PC peripheral requirements, etc.) in the specific country that the end device will be marketed. Annex F of the IEEE Std. 802.15.4 document has a good summary of regulatory requirements in various countries concerning IEEE Std. 802.15.4 devices. The standard can be downloaded from the IEEE Standards web page:

http://standards.ieee.org/getieee802/802.15.html. Refer to the specific country radio regulations for details on regulatory compliance. has Commission received

(FCC) United States 3.1 Federal The MRF24J40MB Communications CFR47 Telecommunications, Part 15 Subpart C Intentional Radiators 15.247 and modular approval in accordance with FCC Public Notice DA 00-1407 Released: June 26, 2000, Part 15 Unlicensed Modular Transmitter Approval. The MRF24J40MB module can be integrated into a finished product without obtaining subsequent and separate FCC approvals. The MRF24J40MB module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:

Contains Transmitter Module FCC ID:

OA3MRF24J40MB

-or-

Contains FCC ID: OA3MRF24J40MB This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 2009 Microchip Technology Inc. Preliminary DS70599B-page 17 thereof, inseparable combination From Section 5.2, RSS-Gen, Issue 2, June 2007, Equipment Labels:

All Category I radio equipment intended for use in Canada shall permanently display on each transmitter, receiver or the applicants name (i.e., manufacturers name, trade name or brand name), model number and certification number. This information shall be affixed in such a manner as to not be removable except by destruction or defacement. The size of the lettering shall be legible without the aid of magnification, but is not required to be larger than an 8-point font size. If the device is too small to meet this condition, the information can be included in the user manual upon agreement with Industry Canada. Label:

Contains IC: 7693A-24J40MB From Section 7.1.6, RSS-Gen, Issue 2, June 2007, Digital Circuits:

If the device contains digital circuitry that is not directly associated with the radio transmitter, the device shall also have to comply with ICES-003, Class A or B as appropriate, labeling requirements. The test data obtained (for the ICES-003 tests) shall be kept by the manufacturer or importer whose name appears on the equipment label, and made available to Industry Canada on request, for as long as the model is being marketed in Canada. ICES-003 except for MRF24J40MB SETTINGS 3.2.1 To meet Industry Canada (IC) requirements, the following settings must be observed by the integrator:

The MRF24J40MB transmit power setting

(RFCON3 0x203) cannot exceed -1.9 dB. Only channels 11 through 25 may be selected

(RFCON0 0x200). 3.2.2 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/

MRF24J40MB The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF exposure compliance:

To satisfy FCC RF exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the MRF24J40MB module is used in a portable application (antenna is less than 20 cm from persons during operation), the integrator is responsible for performing Specific Absorption Rate (SAR) testing in accordance with FCC rules 2.1091. HELPFUL WEB SITES 3.1.3 Federal Communications Commission http://www.fcc.gov

(FCC):

Canada 3.2 The MRF24J40MB module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. From Section 7.1.1, RSS-Gen, Issue 2, June 2007, Modular Transmitter Approval:

Host devices which contain separately certified modules do not need to be recertified, provided that they meet the following conditions:

a) The host device, as a stand-alone unit without any separately certified modules, complies with all applicable Radio Standards Specifications. b) The host device and all the separately certified modules it contains jointly meet the RF exposure compliance requirements of RSS-102, if applicable. c) The host device complies with the certification labeling requirements of each of the modules it contains. Note:

Compliance of a module in its final configuration is the responsibility of the applicant. A host device will not be considered certified if the instructions regarding antenna configuration provided in the original description, of one or more separately certified modules it contains, were not followed DS70599B-page 18 Preliminary 2009 Microchip Technology Inc. Europe 3.3 The MRF24J40MB module has been certified for use in European countries. The following testing has been completed:

Test standard ETSI EN 300 328 V1.7.1 (2006-10):

Maximum Transmit Power Maximum EIRP Spectral Density Frequency Range Radiated Emissions Test standards ETSI EN 301 489-1:2008 and ETSI EN 301 489-17:2008:

Radiated Emissions Electrostatic Discharge Radiated RF Susceptibility A helpful document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications

(ERC) Recommendation 70-03 E, Committee downloadable Radio Communications Office (ERO): http://www.ero.dk. The end user is responsible for ensuring compliance with labeling requirements for each country the end device is marketed and sold. harmonized frequencies European from and the MRF24J40MB MRF24J40MB SETTINGS 3.3.1 To meet ETSI requirements, the following settings must be observed by the integrator:

The MRF24J40MB transmit power setting

(RFCON3 0x203) cannot exceed -14.9 dB. This is to meet the requirements of ETSI EN 300 328 v1.7.1 (2006-05), Maximum e.i.r.p. spectral density limit, Section 4.3.2.2, For wideband modulations other then FHSS (e.g., DSSS, OFDM, etc.), the maximum e.i.r.p. spectral density is limited to 10 mW per MHz. The output power of the MRF24J40MB module, at this setting with the PA enabled, is 9 dBm. Only channels 11 through 25 may be selected

(RFCON0 0x200). HELPFUL WEB SITES:

3.3.2 Radio and Telecommunications Terminal Equipment

(R&TTE):

http://ec.europa.eu/enterprise/rtte/index_en.htm European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org/

European Telecommunications Standards

(ETSI): http://www.etsi.org/

European Radio Communications Office http://www.ero.dk/

Institute

(ERO):

2009 Microchip Technology Inc. Preliminary DS70599B-page 19 MRF24J40MB NOTES:

DS70599B-page 20 Preliminary 2009 Microchip Technology Inc. MRF24J40MB 4.0 TABLE 4-1:

ELECTRICAL CHARACTERISTICS RECOMMENDED OPERATING CONDITIONS Parameters Ambient Operating Temperature Supply Voltage for RF, Analog and Digital Circuits Supply Voltage for Digital I/O Input High Voltage (VIH) Input Low Voltage (VIL) Min

-40 2.4 2.4 0.5 x VDD

-0.3 Typ 3.3 Max

+85 3.6 3.6 VDD + 0.3 0.2 x VDD Units C V V V V TABLE 4-2:

(TA = 25C, VDD = 3.3V) CURRENT CONSUMPTION Chip Mode Condition Sleep TX RX Sleep Clock Disabled At Maximum Output Power Min Typ 5 A 130 mA 25 mA TABLE 4-3:

Typical values are at TA = 25C, VDD = 3.3V, LO Frequency = 2.445 GHz RECEIVER AC CHARACTERISTICS Parameters Condition RF Input Frequency Compatible to IEEE Std. 802.15.4, 2003 RF Sensitivity Maximum RF Input LO Leakage Input Return Loss Noise Figure

(including matching) Adjacent Channel Rejection Alternate Channel Rejection RSSI Range RSSI Error Measured at Balun Matching Network Input at Frequency, 2.405-2.48 GHz

@ +/-5 MHz

@ +/-10 MHz Min 2.405

-23

-8 30 40

-5 Typ

-102

-60

-12 1.9 50 Max Max 2.480 5 Units A mA mA Units GHz dBm dBm dBm dB dB dB dB dB dB 2009 Microchip Technology Inc. Preliminary DS70599B-page 21 MRF24J40MB TABLE 4-4:

Typical values are at TA = 25C, VDD = 3.3V, LO Frequency = 2.445 GHz TRANSMITTER AC CHARACTERISTICS Parameters Condition RF Carrier Frequency Maximum RF Output Power RF Output Power Control Range TX Gain Control Resolution Carrier Suppression TX Spectrum Mask for O-QPSK Signal TX EVM Programmed by Register Offset Frequency > 3.5 MHz, at 0 dBm Output Power Min 2.405

-33 Typ 20 56 1.25

-30 15 Max 2.480 Units GHz dBm dB dB dBc dBm

DS70599B-page 22 Preliminary 2009 Microchip Technology Inc. MRF24J40MB APPENDIX A: REVISION HISTORY Revision A (June 2009) Original release of this document. Revision B (July 2009) Added Section 3.0 Regulatory Approval. 2009 Microchip Technology Inc. Preliminary DS70599B-page 23 MRF24J40MB NOTES:

DS70599B-page 24 Preliminary 2009 Microchip Technology Inc. MRF24J40MB P PCB Antenna ...................................................................... 13 Dimensions ................................................................. 13 Simulation Drawing..................................................... 14 SWR ........................................................................... 16 Bottom Copper............................................................ 12 Layer 2 Ground Plane.............................................. 11 Layer 3 Power Plane ............................................... 12 Stack Up ..................................................................... 12 Top Copper................................................................. 11 Top Silk Screen .......................................................... 11 Pin Description...................................................................... 4 Pin Diagram .......................................................................... 1 Printed Circuit Board (PCB) ................................................ 11 R Radiation Pattern 2D ............................................................................... 14 3D ............................................................................... 15 Reader Response............................................................... 27 Regulatory Approval ........................................................... 17 Canada ....................................................................... 18 Settings............................................................... 18 Europe ........................................................................ 19 Settings............................................................... 19 United States .............................................................. 17 Settings............................................................... 17 Revision History .................................................................. 23 RF Exposure ....................................................................... 17 RF/Analog Features.............................................................. 1 S Schematic MRF24J40MB............................................................... 8 Serial I/O SCK, SDI, SDO, CS...................................................... 7 Short Range Devices (SRD) ............................................... 19 Specific Absorption Rate (SAR).......................................... 18 SPI ........................................................................................ 7 W WWW Address.................................................................... 26 WWW, On-Line Support ....................................................... 2 Z ZigBee Protocol .................................................................... 3 INDEX A AC Characteristics Antenna Impedance Receiver ......................................................................21 Transmitter ..................................................................22 Simulated PCB............................................................15 PCB Layers B Bill of Materials (BOM) ..........................................................9 Block Diagrams Microcontroller to MRF24J40MB Interface....................4 MRF24J40MB ...............................................................3 C Circuit Description .................................................................7 Customer Change Notification Service ...............................26 Customer Notification Service .............................................26 Customer Support ...............................................................26 D Details Module ..........................................................................5 Mounting .......................................................................6 Recommended PCB Footprint ......................................5 E Electrical Characteristics .....................................................21 Current Consumption ..................................................21 Recommended Operating Conditions .........................21 Errata.....................................................................................2 European Radio Communications (ERC)............................19 F FCC ID Number...................................................................17 FCC RF Exposure Compliance ...........................................18 H Helpful Web Sites..........................................................18, 19 I Interface Description .............................................................3 Internet Address ..................................................................26 M MAC/Baseband Features ......................................................1 Microchip Internet Web Site ................................................26 MiWi P2P...............................................................................3 MiWi Protocol ........................................................................3 More Information ...................................................................2 Customer Notification System.......................................2 Errata ............................................................................2 Mounting Details....................................................................5 MRF24J40 Data Sheet......................................................3, 7 O Overview ...............................................................................3 DS70599B-page 25 Preliminary 2009 Microchip Technology Inc. MRF24J40MB NOTES:

DS70599B-page 26 Preliminary 2009 Microchip Technology Inc. MRF24J40MB CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:

Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers distributor, their representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com contact should THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, following information:

Product Support Data sheets and errata, the web site contains the application notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software General Technical Support Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing Business of Microchip Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchips customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. 2009 Microchip Technology Inc. Preliminary DS70599B-page 27 MRF24J40MB READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-

4150. Please list the following information, and use this outline to provide us with your comments about this document. Technical Publications Manager Reader Response To:

RE:

From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional):

Would you like a reply? Y N Total Pages Sent ________ FAX: (______) _________ - _________ Device:

MRF24J40MB Literature Number:

DS70599B Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS70599B-page 28 Preliminary 2009 Microchip Technology Inc. MRF24J40MB PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. M X T

-X Device Module Module Type Tape and Reel Temperature Range Examples:

a) b) MRF24J40MB-I = Industrial temp. tray MRF24J40MBT-I = Industrial temp., tape and reel. Device MRF24J40MB;

VDD range 2.4V to 3.6V Temperature Range I

= -40C to

+85C (Industrial) 2009 Microchip Technology Inc. Preliminary DS70599B-page 29 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support:

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