RN-42 Specification CONTENTS Block Diagram Electrical Characteristic RN-42 Specification............................................................................................................................... 1 Type Release ......................................................................................................................... 1 Document RN-42-001................................................................................................................... 1 Version 1.0................................................................................................................................. 1 Release Date Jan 08, 2010................................................................................................................ 1 Release Record ...................................................................................................................................... 1 Device Features ..................................................................................................................................... 2 Description............................................................................................................................................. 2 Application............................................................................................................................................. 3 1 Ordering Information
................................................................................................................... 5 2 Key Features
.................................................................................................................................. 5 3
............................................................................................................................... 5 4
............................................................................................................... 6 4.1
...................................................................................................... 6 4.2
........................................................................................... 6 4.3
.......................................................................................................... 6 4.4
................................................................................................................. 7 4.5
......................................................................................................... 7 5 Mechanical Dimensions
................................................................................................................ 8 6
........................................................................................................... 9 7
.......................................................................................................................... 12 7.1
............................................................................................................................. 12 7.2
.................................................................................................................. 12 7.3
.................................................................................................................... 12 7.4
................................................................................................................................. 12 7.5
............................................................................................ 12 7.6 Minimizing radio interface
..................................................................................................... 13 7.7
.......................................................................................................... 13 8
.............................................................................................. 14 9
..................................................................................................................... 15 9.1
.................................................................................... 15 9.2
..................................................................................................... 15 Absolute Maximum ratings Recommend operation conditions Electrica Characteristics Radio characteristics Digital I/O characteristics Reset circuit Factory reset PIO4 Connection status HCI mode Using SPI bus for flash upgrade Reliability solder temperature chart:
Reflow temperature chart:
Reference Application Schematic SMT Reflow Profile Pin Definition Descriptions Design Concerns Soldering reflow profile Flaircomm Technologies Confidential 4 RN-42 Specification 4 Electrical Characteristic 4.1 Absolute Maximum ratings Rating Store temperature Operation temperature Power Supply Minimum
-40
-40 Maximum
+120
+85
-0.4 Volt DC 3.6Volt 4.2 Recommend operation conditions Rating Store temperature Operation temperature Power Supply Minimum
-40
-20 Type
+25
+25 Maximum
+85
+70
-
DC 3.3Volt DC 3.6Volt 4.3 Electrica Characteristics Parameter Supply Voltage (DC) RX Supply Current TX Supply Current Average power consumption Standby/Idle (default settings) Connected (normal mode) Connected (low power Sniff) Standby/Idle (Deep sleep enabled) Min 3.0 250uA Typ. 3.3 35 65 25 30 8 2.5 Max 3.6 60 100 Unit V mA mA mA mA mA mA Flaircomm Technologies Confidential 6 RN-42 Specification 4.4 Radio characteristics Parameter Sensitivity @ 0.1%BER RF Transmit Power Initial Carrier Frequency Tolerance 20dB bandwidth for modulated carrier Drift (Five slots packet) Drift Rate f1avg Max Modulation f2avg Min Modulation Freq.
(GHz) 2.402 2.442 2.480 2.402 2.442 2.480 2.402 2.442 2.480 Min Typ Max Bluetooth Specification Units
-
-
-
5.0 5.0 5.0
-
-
-
-80
-80
-80 6.0 6.0 6.0 5 5 5
-86
-86
-86 75 75 75
<=-70
<=6 75 dBm dBm dBm dBm dBm dBm kHz kHz kHz
-
900 1000
<=1000 kHz 2.402 2.442 2.480 2.402 2.442 2.480
-
-
140 140 140 140 140 140 15 13 165 165 165 190 190 190
-
-
175 175 175
-
-
-
40 20
>140 115 kHz kHz kHz kHz kHz kHz kHz kHz 4.5 Digital I/O characteristics 2.7V<=VDD<=3.0V Input logic level LOW Input logic level HIGH Output logic level LOW Output logic level HIGH All I/Os (except reset) default to weak pull down Min
-0.4 0.7VDD
-
VDD-0.2 Typ.
-
-
-
-
Max.
+0.8 VDD+0.4 0.2
-
Unit V V V V
+0.2
+1.0
+5.0 uA Flaircomm Technologies Confidential 7 RN-42 Specification 5 Mechanical Dimensions Flaircomm Technologies Confidential 8 RN-42 Specification 6 Pin Definition Descriptions Flaircomm Technologies Confidential 9 RN-42 Specification Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Name GND Description Default SPI MOSI Programming only PIO6 PIO7 Set BT master (HIGH=auto-master mode) Set Baud rate (HIGH = force 9600, LOW = 115K or firmware setting) RESET Active LOW reset SPI_CLK Programming only PCM_CLK PCM interface PCM_SYNC PCM interface PCM_IN PCM interface PCM_OUT PCM interface VDD GND 3.3V regulated power input UART_RX UART receive Input UART_TX UART transmit output UART_RTS UART RTS, goes HIGH transmitter to disable host No Connect Input to RN42with weak pull down Input to RN42 with weak pull down Input to RN42 with 1K pull up No Connect No Connect No Connect No Connect No Connect Input to RN42 High RN42 level output from Low level output from RN42 UART_CTS UART CTS, if set HIGH, disables transmitter Low level input to RN42 USB_D+ USB port USB_D- USB port PIO2 Status, HIGH when connected, LOW otherwise PIO3 Auto discovery = HIGH PIO5 Status, toggles based on state, LOW on connect PIO4 Set factory defaults SPI_CSB Programming only SPI_MISO Programming only GND NC GND GND GND AIO0 PIO8 RF pad keep all traces and planes clear. Optional analog input Status (RF data rx/tx) Pull up 1.5K when active Output from RN42 Input to RN42 with weak pull down Output from RN42 Input to RN42 with weak pull down No Connect No Connect Not Used Output from RN42 Flaircomm Technologies Confidential 10 RN-42 Specification PIO9 IO PIO10 IO (remote DTR signal) PIO11 AIO1 IO (remote RTS signal ) Optional analog input 32 33 34 35 Input to RN42 with weak pull down Input to RN42 with weak pull down Input to RN42 with weak pull down Not Used Flaircomm Technologies Confidential 11 RN-42 Specification 7 Design Concerns 7.1 Reset circuit RN-42 contains a 1k pull up to VCC, the polarity of reset on the RN42 is ACTIVE LOW. A power on reset circuit with delay is OPTIONAL on the reset pin of the module. It should only be required if the input power supply has a very slow ramp, or tends to bounce or have instability on power up. Often a microcontroller or embedded CPU IO is available to generate reset once power is stable. If not, there are many low cost power supervisor chips available, such as MCP809, MCP102/121, and Torex XC61F. 7.2 Factory reset PIO4 It is a good idea to connect this pin to a switch, or jumper, or resistor, so it can be accessed. This pin can be used to reset the module to FACTORY DEFAULTS and is often critical in situations where the module has been mis-configured. To set Factory defaults start HIGH, then toggle times. 7.3 Connection status PIO5 is available to drive an LED, and blinks at various speeds to indicate status. PIO2 is an output which directly reflects the connection state, it goes HIGH when connected, and LOW otherwise. 7.4 HCI mode The RN42 module must be loaded with special firmware to run in HCI mode. When in HCI mode the standard SPP/DUN applications are disabled. 7.5 Using SPI bus for flash upgrade While not required, this bus is very useful for configuring advanced parameters of the Bluetooth modules, and is required for upgrading the firmware on modules. The suggested ref-design shows a 6pin header which can be implemented to gain access to this bus. A minimum-mode version could just use the SPI signals (4pins) and pickup ground and VCC from elsewhere on the design. Flaircomm Technologies Confidential 12 RN-42 Specification 7.6 Minimizing radio interface When laying out the carrier board for the RN42 module the areas under the antenna and shielding connections should not have surface traces, GND planes, or exposed vias. (See diagram to right) For optimal radio performance the antenna end of RN42 module should protrude 5mm past any metal enclosure. 7.7 Soldering reflow profile
Lead-Free Solder Reflow
Temp: 230 degree C, 30-40 seconds, Peak 250 degree C maximum.
Preheat temp: 165 +- 15 degree C, 90 to 120 seconds.
Time: Single Pass, One Time Flaircomm Technologies Confidential 13 RN-42 Specification 9 SMT Reflow Profile 9.1 Reliability solder temperature chart:
9.2 Reflow temperature chart:
Flaircomm Technologies Confidential 15 Compliance Information FCC Compliance Statement:
This device complies with Part 15 of the FCC Rules . Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. This device must accept any interference received, including interference that may cause undesired operation. Product that is a radio transmitter is labeled with FCC ID. FCC Caution:
(1) Exposure to Radio Frequency Radiation. This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance.
(2) Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment.
(3) This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
(4) Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user authority to operate the equipment.
(5) Outdoor Operations in the 5.15~5.25GHz band is prohibited. NOTE:
(1) This device is approved for OEM installation with specified antennas as listed in this Manual. It is the responsibility of the Installer to comply with the separation distance for satisfying RF exposure compliance.
(2) This device only could work when being installed into client devices which could not transmit automatically, such as Notebook P.C. , with the software driver limit. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization. IC Radiation Exposure Statement for Canada This equipment complies with IC radiation exposure limits set forth for an uncontrolled enviroment. To maintain compliance with IC RF exposure compliance requirements, Please avoid direct contact to the transmitting. End users must follow the specific operating instructions for satisfying RF Exposure compliance. Caution: The device is incapable of transmitting in the band 5600-5650 MHz band in Canada.