ZIGBIT 2.4GHZ WIRELESS MODULES ATZB-X0-256-3-0-C DATASHEET Features Compact size (33.0 x 20.0mm) High RX sensitivity (- 96dBm) Outperforming link budget (up to 99.6dB) Up to +3.6dBm output power Very low power consumption:
6.3mA in RX mode(1) 20.5mA in TX mode(1) 0.3A in sleep mode(2) Ample memory resources:
256KBytes in-system self-programmable Flash memory, 4KBytes EEPROM, 16KBytes SRAM Wide range of interfaces (both analog and digital):
ISP, JTAG 4- wire SPI, TWI Two analog comparator input UART, USART Timer, PWM Four ADC lines External clock input, internal clock output Up to 32 lines configurable as GPIO Capability to use MAC address into the internal EEPROM IEEE 802.15.4 compliant transceiver 2.4GHz ISM band Serial bootloader High performance, low power AVR XMEGA 8/16-bit Microcontroller Rapid design-in with built-in chip antenna RF test point using MS-147 RF connector Small physical footprint and low profile for optimum fit in very small application boards Mesh networking capability Easy-to-use low cost development kit Single source of support for HW and SW Worldwide license-free operation 1. 2. Measured in TX/RX mode with digital input pins pulled high; RX ON and RPC mode of TRX, Power Down mode of MCU. Controller Sleep Mode: SLEEP_MODE_PWR_DOWN. 42172AWIRELESS10/2013 Table of Contents 1. Introduction ........................................................................................ 3 Summary ........................................................................................................... 3 1.1 Applications ....................................................................................................... 3 1.2 1.3 Abbreviations and Acronyms ............................................................................ 3 1.4 Related Documents ........................................................................................... 5 2. ZigBit Module Overview ..................................................................... 6 2.1 Overview ........................................................................................................... 6 3.1 3. Specification....................................................................................... 8 Electrical Characteristics ................................................................................... 8 Absolute Maximum Ratings ................................................................ 8 3.1.1 3.1.2 Power Supply ...................................................................................... 8 RF Characteristics .............................................................................. 9 3.1.3 3.1.4 ATXMEGA256A3U Microcontroller Characteristics .......................... 10 3.1.5 Module Interfaces Characteristics ..................................................... 10 Physical/Environmental Characteristics and Outline ....................................... 10 3.2 3.3 Pin Configuration ............................................................................................. 11 3.4 Mounting Information ...................................................................................... 12 Soldering Profile .............................................................................................. 14 3.5 3.6 Antenna Reference Designs ........................................................................... 15 4. Schematics ...................................................................................... 15 4.1 Handling Instructions ....................................................................................... 16 4.2 General Recommendations ............................................................................ 16 5. Persistence Memory ........................................................................ 16 6. Ordering Information ........................................................................ 17 7. Agency Certifications ....................................................................... 18 7.1 United States (FCC) ........................................................................................ 18 7.2 European Union (ETSI) ................................................................................... 19 7.3 Canada (IC) ...................................................... Error! Bookmark not defined. 8. Revision History ............................................................................... 21 ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 2 1. 1.1 Introduction Summary ATZB-X0-256-3-0-C ZigBit is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee OEM module from Atmel. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATxmega256A3U [1]
Microcontroller and AT86RF233 [5] 2.4GHz ISM band transceiver. The radio transceiver provides high data rates from 250kb/s up to 2Mb/s, frame handling, outstanding receiver sensitivity and high transmit output power enabling a very robust wireless communication. The module is designed for wireless sensing, monitoring, control, data acquisition applications, to name a few. This ZigBit module eliminates the need for costly and time-consuming RF development, and shortens time-to-market for wireless applications. The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed and tuned for the ZigBit design to enable quick integration of the ZigBit into any application. 1.2 Applications The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing mesh network, while optimizing network traffic and minimizing power consumption. For detailed software support information, please visit http://www.atmel.com/products/wireless. The application areas include, but are not limited to:
Building automation and monitoring o Lighting controls o Wireless smoke- and CO-detectors o Structural integrity monitoring HVAC monitoring & control Inventory management Environmental monitoring Security Water metering Industrial monitoring o Machinery condition and performance monitoring o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc. Automated meter reading (AMR) 1.3 Abbreviations and Acronyms ADC API DC DTR Analog-to-Digital Converter Application Programming Interface Direct Current Data Terminal Ready EEPROM Electrically Erasable Programmable Read-Only Memory ESD GPIO HAF Electrostatic Discharge General Purpose Input/Output High Frequency ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 3 HVAC HW I2C IEEE IRQ ISM JTAG MAC MCU NRE OEM OTA PA PCB PER RAM RF RPC Heating, Ventilating, and Air Conditioning Hardware Inter-Integrated Circuit Institute of Electrical and Electronics Engineers Interrupt Request Industrial, Scientific and Medical radio band Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard interface Medium Access Control layer Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit module Network layer Original Equipment Manufacturer Over-The-Air upgrade Power Amplifier Printed Circuit Board Package Error Ratio Random Access Memory Radio Frequency Reduced Power Consumption RTS/CTS Request to Send/ Clear to Send RX SMA SoC SPI SW TTM TX UART USART USB Receiver Surface Mount Assembly System on Chip Serial Peripheral Interface Software Time-To-Market Transmitter Universal Asynchronous Receiver/Transmitter Universal Synchronous/Asynchronous Receiver/Transmitter Universal Serial Bus ZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications 802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 4 1.4 Related Documents
[1] ATXMEGA256A3U Datasheet in http://www.atmel.com/Images/Atmel-8386-8-and-16-bit-AVR-Microcontroller-
ATxmega64A3U-128A3U-192A3U-256A3U_datasheet.pdf
[2] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz http://www.hirose.co.jp/cataloge_hp/e35801505.pdf
[3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[4] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
[5] AT86RF233 Datasheet in http://www.atmel.com/Images/Atmel-8351-MCU_Wireless-AT86RF233_Datasheet.pdf ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 5 2. ZigBit Module Overview 2.1 Overview The ATZB-X0-256-3-0-C ZigBit is a compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module. Based on a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM band transceiver and Atmel Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low power consumption and exceptional ease of integration. Figure 2-1. ATZB-X0-256-3-0-C Block diagram
. This ZigBit module contains Atmels ATxmega256A3U Microcontroller and AT86RF233 2.4GHz ISM band Transceiver for ZigBee and IEEE 802.15.4 [1]. The module features 256KB in-system self-programmable Flash memory, 16KB SRAM and 4KB EEPROM. The compact all-in-one board design of MCU and radio transceiver with very minimal components on the RF path to Antenna dramatically improves the ZigBits compact size, range performance on signal transmission and increases its sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop applications on smaller footprint. The MS-147 connector [2] can be used as an RF Test port. ZigBit Module contains a complete RF/MCU design with all the necessary passive components included. The module can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module evaluation kit containing the ZigBit extension board for the Atmel Xplained PRO HW evaluation platform can be used to develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the HW/FW design, prototyping, and mass production phases of product development. All ZigBits are preloaded with a bootloader when they are sold as modules, either in single units or T&R. Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would function as a single MCU, or it can be paired with a host processor driving the module over a serial interface. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 6 The MAC stack running on the host processor can then control data transmission and manages module peripherals. Thus very minimal firmware customization is required for successful module design-in. Third-party sensors can then be connected directly to the module, thus expanding the existing set of peripheral interfaces. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 7 3. Specification 3.1 Electrical Characteristics 3.1.1 Absolute Maximum Ratings Table 3-1. Absolute Maximum Ratings (1)(2) Parameter Voltage on any pin, except RESET with respect to ground Input RF level Current into Vcc pins Minimum Maximum
-0.3V 3.6V (VDD max)
+10 dBm 200 mA Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Attention! ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to prevent permanent damage. 3.1.2 Power Supply Table 3-2. Test Conditions (unless otherwise stated), Vcc = 3V, Tamb = 25C. Parameter Range Unit Supply voltage, VDD Active Current consumption: RX mode BUSY_RX - Receive state Active Current consumption: RX mode - RX_ON with RPC, MCU Active Active Current consumption: RX mode - RX_ON, MCU Active Active Current consumption: RX mode - RX_ON with RPC, MCU Power_down Active Current consumption: RX mode - RX_ON, MCU Power_down Active Current consumption: TX mode (1) BUSY_TX Transmit state Active Current consumption: TX mode PLL_ON Current consumption: TRX_OFF, MCU Active Current consumption: TRX_OFF, MCU Power_down Sleep Current consumption: TRX Sleep, MCU Power_down (2) Sleep Current consumption: TRX Sleep, MCU Power_save (2) Sleep Current consumption: TRX Sleep, MCU Standby (2) Sleep Current consumption: TRX Sleep, MCU Extended_Standby (2) Sleep Current consumption: TRX Deep_Sleep, MCU Power_down (2) Sleep Current consumption: TRX Deep_Sleep, MCU Power_save (2) Sleep Current consumption: TRX Deep_Sleep, MCU Standby (2) Sleep Current consumption: TRX Deep_Sleep, MCU Extended_Standby (2) 1.8 to 3.6 16.5 11.8 17.0 6.1 11.3 20.5 5.6 5.5 443 0.3 0.3 380 380 8.5 8.5 388 388 V mA mA mA mA mA mA mA mA A A A A A A A A A ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 8 Note 1: Output TX power (when measuring consumption in TX mode) is +3 dBm. Note 2:
a) All interfaces are set to the default state (see Pin Assignment Table). b) JTAG is not connected. c) CPU Clock configured when doing this measurement 16MHz for all modes except Power save and Power down modes Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol settings, network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an application. 3.1.3 RF Characteristics Table 3-3. RF Characteristics (1). Parameter Frequency band Numbers of channels Channel spacing Condition Range 2.4000 to 2.4835 16 5 Transmitter output power Adjusted in 16 steps
-17 to +4 Receiver sensitivity On-air data rate PER = 1%
-96 250, upto 2000 TX output/ RX input nominal impedance For balanced 50 Range Open field, LoS, Elevated 178 Unit GHz MHz dBm dBm Kbps m Table 3-4. TX power settings PHY_TX_PWR 3:0 Register value Power register setting
[dBm]
Output power [dBm]
(typical values at RF connector) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14
+4
+3.7
+3.4
+3
+2.5
+2
+1 0
-1
-2
-3
-4
-6
-8
-12 15 Note 1: For detailed characteristics, refer to [2].
-17
+3
+2.9
+2.7
+2.6
+2.5
+0.4
-0.3
-1
-2
-3.0
-4.
-5.7
-7.5
-9.8
-13.0
-17.9 ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 9 3.1.4 ATXMEGA256A3U Microcontroller Characteristics Table 3-5. ATXMEGA256A3U Characteristics. Parameter On-chip flash memory size On-chip RAM size On-chip EEPROM size Operation frequency Range 256K 16K 4K 16 3.1.5 Module Interfaces Characteristics Table 3-6. Module Interfaces Characteristics (1). Parameters Condition UART maximum baud rate ADC conversion time (latency)
(RES+2)/2+(GAIN !=0) RES (Resolution) = 8 or 12 Unit Bytes Bytes Bytes MHz Range 115.2 5-8 ADC input resistance Static load resistor of input signal 4.0 ADC reference voltage (VREF) ADC input voltage TWI maximum clock GPIO High level input voltage GPIO Low level input voltage Vcc = 2.7-3.6V Vcc = 2.7-3.6V GPIO High level output voltage VOH Vcc = 3.0-3.6V GPIO Low level output voltage VOL Vcc = 3.0-3.6V Real-time oscillator frequency Note 1: For detailed characteristics, refer to [1]. 1.0 to AVcc 0.6 0 - AVDD 400 2 to Vcc+0.3
-0.3 to 0.3 VDD 2.4 to 0.94Vcc 0.05Vcc typ Max 0.4 32.768 Unit Kbps ClkADC cycles k V V kHz V V V V kHz 3.2 Physical/Environmental Characteristics and Outline Table 3-7. Physical characteristics. Parameters Size Operating temperature range Value 33.0 x 20.0 mm
-40C to +85C Comments
-40C to +85C operational ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 10 3.3 Pin Configuration Table 3-8. ATZB-X0-256-3-0-C Pinout description Pin Out Pin descriptions AVSS AVSS DEVDD DEVDD Function Analog Ground Analog Ground Digital Power input pin Digital Power input pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 RSET/PDI_CLOCK RESET PD4/SS PD5/MOSI/XCK1 PD6/MISO/RXD1/D-
PD7/SCK/TXD1/D+
PA5 PA4 DVSS PD2/SYNC/ASYNC/OC0C/
PD3/SYNC/TXD0/OC0D PD1/SCL/INT/OC0B PDI_DATA PA6 PA7 PB3 PB2 PF1/OC0B/INT/XCK0 PF2/OC0C/INT/RXD0 PF3/OC0D/INT/TXD0 PB0/IAREF/INT PA0/ADC0/INT PA1/ADC1/INT PA2/ADC2/INT PA3/ADC3/INT DVSS PB6/TCK/INT PB4/TMS/INT PB7/TDO/INT PB5/TDI/INT PE3/TXD PE2/RXD PE1/XCK PE0 PE5/OC1B/INT PE4/SYNC/OC1A SPI SPI SPI SPI GPIO / ADC / Analog COMP+
GPIO/ADC/Analog Comp-
Digital Ground UART UART USART PWM/TC GPIO/ADC GPIO/ADC GPIO/ADC/DAC1 GPIO/ADC/DAC/intwkup INT/PWM/GPIO INT/PWM/GPIO INT/PWM/GPIO Adc ref ADC/ GPIO ADC/ GPIO ADC/ GPIO ADC/ GPIO Digital Ground JTAG JTAG JTAG JTAG GPIO/output counter Wakeup INT TWI/INT/GPIO TWI/INT/GPIO GPIO/TC Master Clock out put ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 11 Pin Out Pin descriptions 40 41 42 PF0 DVSS DVSS Function GPIO/Timer Digital Ground Digital Ground NOTE: TXD, RXD of UART are crossed inside ZigBit Module. External UART devices connecting to ZigBit Module should follow straight connection for UART. UART_TXD_external_device <-> UART_TXD UART_RXD_external_device <-> UART_RXD 3.4 Mounting Information The Figures below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and losses. Figure 3-1. ATZB-X0-256-3-0-C Dimensions ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 12 Figure 3-2. ATZB-X0-256-3-0-C Pinout Figure 3-3. ATZB-X0-256-3-0-C Foot Print Dimensions ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 13 Figure 3-4. ATZB-X0-256-3-0-C Mounting Information The ZigBits location and orientation on the carrier board is illustrated in the above PCB Land pattern and Mounting information drawing. The Recommended placement of ZigBit on Carrier Board needs to be accurately followed to ensure performance on the end application 3.5 Soldering Profile The J-STD-020C-compliant soldering profile is recommended according to Table 3-9. Table 3-9. Soldering profile(1) Profile feature Green package Average ramp-up rate (217C to peak) Preheat temperature 175C 25C Temperature maintained above 217C Time within 5C of actual peak temperature Peak temperature range Ramp-down rate Time within 25C to peak temperature 3C/s max 180s max 60s to 150s 20s to 40s 260C 6C/s max 8 minutes Note:
1. The package is backward compatible with PB/Sn soldering profile. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 14 3.6 Antenna Reference Designs Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board material and thickness, shields, the material used for enclosure, the board neighborhood, and other components adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit. General Recommendations:
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning. Placing high profile components next to antenna should be avoided. Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern. ZigBit module should not be placed next to consumer electronics which might interfere with ZigBits RF band frequency. The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges. 4. Schematics The following schematic drawings for the ATZB-X0-256-3-0-C are in the following order:
Top level schematics Connector schematics ATxmega256A3BU schematics AT86RF233 schematics ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 15 4.1 Handling Instructions The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure suitable Ingress Protection standards are complied with. The MS-147 connector should never be exposed to varnish / similar conformal coating material which will affect electrical connection on the surfaces of connector. The in-built chip antenna has been tuned for the particular design 4.2 General Recommendations Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning Placing high profile components next to antenna should be avoided Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit RF frequency band 5. Persistence Memory A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The organization of the persistence memory is as follows:
Table 5-1. Persistence Memory Data Structure Revision MAC address(1) Board information overall Board information PCBA Name Board information PCBA Serial number Size 2 bytes 8 bytes 49 bytes 30 bytes 10 bytes Board information PCBA Atmel Part Number 8 bytes Board information PCBA Revision XTAL Calibration Value Reserved Reserved CRC Note:
1 byte 1 byte 7 bytes 4 bytes 1 byte 1. The MAC address stored inside the MCU is a uniquely assigned ID for each ZigBit and owned by Atmel. User of the ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The MAC ID can be read from the ZigBit using the Performance Analyzer Application that is supplied through Atmel Studio Gallery Extension. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 16 6. Ordering Information Part number Description ATZB-X0-256-3-0-C 2.4GHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and AT86RF233 Transceiver with MS-147 test connector and chip antenna, Single unit ATZB-X0-256-3-0-CR(1) 2.4GHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and AT86RF233 Transceiver with MS-147 test connector and chip antenna, Tape & Reel Note:
1. Tape and reel quantity: 200. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 17 7. Agency Certifications 7.1 United States (FCC) This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an OEM manufacturer must comply with the following regulations:
1. The ATZB-X0-256-3-0-C modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
Contains FCC ID: VW4A091731 The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause undesired operation. Any similar wording that expresses the same meaning may be used. IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation (FCC 15.19). The internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be colocated or operating in conjunction with any other antenna or transmitter. Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment authorization. IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21). IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense
(FCC section 15.105). ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 18 7.2 European Union (ETSI) The ATZB-X0-256-3-0-C Module has been certified for use in European Union countries. If these modules are incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards. IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall consist of the initials "CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus. The CE marking must be affixed visibly, legibly, and indelibly. More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12. Industry Canada (IC) Compliance statements 7.3 This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the device and the user or bystanders. Cet quipement est conforme aux limites d'exposition aux radiofrquences dfinies par Industrie Canada pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre le dispositif et l'utilisateur ou des tiers CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another device, then the device should display the label on it referring the enclosed module. In that case, the final end product must be labelled in a visible area with the following:
Contains Transmitter Module IC:11019A-091731 OR Contains IC: 11019A-091731 ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 19 Ce module est tiquet avec son propre ID IC. Si le numro de certification IC ID n'est pas visible lorsqu'il est install l'intrieur d'un autre appareil, l'appareil doit afficher l'tiquette sur le module de rfrence ci-joint. Dans ce cas, le produit final doit tre tiquet dans un endroit visible par le texte suivant:
Contains Transmitter Module IC: 11019A-091731 OR Contains IC: 11019A-091731 ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172AWIRELESS10/2013 20 8. Revision History Doc. Rev. Date Comments 42172A 10/2013 Initial revision. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
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