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MRF24WG0MA/MB MRF24WG0MA/MB Data Sheet 2.4 GHz IEEE 802.11b/g Features:
IEEE 802.11-compliant RF transceiver Serialized unique MAC address Data rate: 1 to 11 Mbps for 802.11b / 6 to 54 Mbps for 802.11g Compatible with IEEE 802.11b/g/n networks Small size: 21 mm x 31 mm 36-pin Surface Mount module Integrated PCB antenna (MRF24WG0MA) External antenna option (MRF24WG0MB) with ultra-miniature coaxial (U.FL) connector Easy integration into final product accelerates product development, provides quicker time to market Radio regulation certification for United States
(FCC), Canada (IC), and Europe (ETSI) Designed for use with Microchip microcontroller families (PIC18, PIC24, dsPIC33, and PIC32) with downloadable Microchip TCP/IP Stack Operational:
Single operating voltage: 2.8V to 3.6V (3.3V typical) Temperature range: -40C to +85C Simple, four-wire SPI interface with interrupt Low-current consumption:
- RX mode 95 mA (typical)
- TX mode 240 mA (+18 dBm typical)
- PS mode 4 mA (typical)
- Hibernate mode 0.1 mA (typical) RF/Analog Features:
ISM Band 2.400 to 2.484 GHz operation 14 Channels selectable individually or domain-
restricted DSSS/OFDM modulation Application throughput: 4500 kbps
-95 dBm Typical sensitivity at 1 Mbps
+18 dBm Typical 802.11b TX power with control
+16 dBm Typical 802.11g TX power with control Integrated low phase noise VCO, RF frequency synthesizer, PLL loop filter and PA Integrated RSSI ADC and I/Q DACs, RSSI readings available to host MAC/Baseband Features:
Hardware CSMA/CA access control, automatic ACK, and FCS creation and checking Automatic MAC packet retransmit Hardware Security Engine for AES and RC4-based ciphers Supports 802.1x, 802.1i security: WEP, WPA-PSK, and WPA-2-PSK. Applications:
Utility and Smart Energy:
- Thermostats
- Smart Meters
- White Goods
- HVAC Consumer Electronics:
- Remote Control
Internet Radio
- Home Security
- Toys Industrial Controls:
- Chemical Sensors
- HVAC
- Security Systems
- M2M Communication Remote Device Management:
- Location and Asset Tracking
- Automotive
- Code Update Retail:
- POS Terminals
- Wireless Price Tags
- Digital Remote Medical, Fitness, and Health Care:
- Glucose Meters
- Fitness Equipment
- Patient Asset Tracking 2012 Microchip Technology Inc. Advance Information DS00000A-page 1 MRF24WG0MA/MB Pin Diagram Note:
Antenna connector on MRF24WG0MB only. DS00000A-page 2 Advance Information 2012 Microchip Technology Inc. MRF24WG0MA/MB Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 5 2.0 Circuit Description ...................................................................................................................................................................... 11 3.0 Regulatory Approval................................................................................................................................................................... 21 4.0 Electrical Characteristics............................................................................................................................................................ 27 Appendix A: Revision History............................................................................................................................................................... 31 The Microchip Web Site....................................................................................................................................................................... 33 Customer Change Notification Service ................................................................................................................................................ 33 Customer Support................................................................................................................................................................................ 33 Reader Response ................................................................................................................................................................................ 34 Product Identification System .............................................................................................................................................................. 35 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:
Microchips Worldwide Web site; http://www.microchip.com Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2012 Microchip Technology Inc. Advance Information DS00000A-page 3 MRF24WG0MA/MB NOTES:
DS00000A-page 4 Advance Information 2012 Microchip Technology Inc. MRF24WG0MA/MB in Figure 1-1 Interface Description 1.1 The block diagram represents a MRF24WG0MA/MB module. It interfaces to Microchip PIC18, PIC24, dsPIC33, or PIC32 microcontrollers through a four-wire serial slave SPI interface interrupt, hibernate, reset, power and ground signals. The module runs on a single supply voltage of nominally 3.3V. The serial trace port operates at 3.3V and requires a level shifter for operation with RS-232 devices. This port provides a serial output of module status messages and for debugging purposes. Figure 1-2 shows a simplified example connection between a Microchip PIC MCU and the module. Table 1-1 lists the pin descriptions. Data communications with the MRF24WG0MA/MB are through the SPI interface that is detailed in Section 2.0 Circuit Description. The Microchip PIC microcon-
troller communicates with the module through a com-
mand API from within the Microchip TCP/IP stack. The command API is detailed in the Microchip TCP/IP stack online Help that is included in the free Microchip Application Libraries download. is helpful DEVICE OVERVIEW 1.0 The MRF24WG0MA and MRF24WG0MB are low-
power, 2.4 GHz, IEEE 802.11-compliant, surface mount modules with all associated RF components crystal oscillator, bypass and bias passives with integrated MAC, baseband, RF and power amplifier, and built-in hardware support for AES, and TKIP (WEP, WPA, WPA2 security). The modules also provide acceleration for hosts running WPA-EAP application security. The integrated module design frees the designer from RF and antenna design tasks and regulatory compliance testing, ultimately providing quicker time to market. The MRF24WG0MA module is approved for use with the integrated PCB meander antenna. The MRF24WG0MB module comes with an ultra-
miniature coaxial connector (U.FL) and is approved for use with a list of antenna types that are certified the module. See Section 2.7 External with Antenna for specific recommendations. The MRF24WG0MA/MB modules are designed to be used with Microchips TCP/IP software stack. The soft-
ware stack has an integrated driver that implements the API that is used in the modules for command and con-
trol, and for management and data packet traffic. The Microchip TCP/IP software stack is available in the free Microchip Application Libraries download
(including example applications and source code) from the Microchip web site, http://www.microchip.com/
wireless. The combination of the module and a PIC running the TCP/IP stack results in support for IEEE Standard 802.11 and IP services. For example, this allows the immediate implementation of a wireless web server and e-mail clients. The MRF24WG0MA/MB modules have received regu-
latory approvals for modular devices in the United States (FCC), Canada (IC), and Europe (ETSI). The modular approval removes the need for expensive RF and antenna design, and allows the end user to place the modules inside a finished product and not require regulatory testing for an intentional radiator (RF trans-
mitter). See Section 3.0 Regulatory Approval, for the specific requirements that should be adhered to by the integrator. 2012 Microchip Technology Inc. Advance Information DS00000A-page 5 MRF24WG0MA/MB FIGURE 1-1:
MRF24WG0MA/MB BLOCK DIAGRAM MRF24WG0MA/MB 2.4 GHz IEEE 802.11b/g Module SPI Flash AES, TKIP Encryption WPA Engine Interface 2.4 GHz Transceiver/PA IEEE 802.11b/g MAC/LLC Internal Regulators IEEE 802.11b/g PHY 802.1x (EAP) Accelerator RAM ROM Matching Circuitry Slave SPI Interrupt Power Hibernate Trace Reset PCB Antenna MRF24WG0MA FIGURE 1-2:
MICROCONTROLLER TO MRF24WG0MA/MB INTERFACE MRF24WG0Mx PIC Microcontroller External Antenna
(MRF24WG0MB) CS SDI SDO SCK INT
+3.3V (Typ) GND VDD GND HIBERNATE WP RESET I/O SDO SDI SCK INTx I/O I/O I/O DS00000A-page 6 Advance Information 2012 Microchip Technology Inc. MRF24WG0MA/MB TABLE 1-1:
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Pin Description Symbol Type GND NC*
NC*
NC*
NC*
NC*
P NC*
NC*
NC*
NC*
NC*
Description Ground No connect(3) No connect(3) No connect(3) No connect(3) No connect(3) RESET I: Constant(1) Module Reset input NC NC*
GND NC NC NC NC NC WP(2) VDD GND GND HIBERNATE NC*
NC CS NC GND DEBUGRX DEBUGTX GND VDD GND NC SDO INT SCK SDI GND NC NC*
P NC NC NC NC NC I P P P I NC*
NC Do not connect No connect(3) Ground Do not connect Do not connect Do not connect Do not connect Do not connect Write protect (this pin is used to enable FLASH update) Power Ground Ground Hibernate mode enable (high input will disable the module) No connect(3) Do not connect I: Constant(1) SPI Chip Select input, constant drive or pull-up required NC P I O P P P NC O O I I P Do not connect Ground Serial debug port input (see Section 2.0 Circuit Description) Serial debug port output (see Section 2.0 Circuit Description) Ground Power Ground Do not connect SPI data out Interrupt output (open drain requires a pull-up) SPI clock input SPI data in Ground Legend: Pin type abbreviation: P = Power Input, I = Input, O = Output, NC = Do Not Connect, NC* = No Connect Note 1: Signals of Type I: Constant must either be constantly driven by the host or have a pull-up or pull-down (in case the host is likely to tri-state the signal during power down modes). The constant drive is used to ensure defined operation of the part and to minimize leakage current during low power modes. 2: WP is used as write-protect for the internal module SPI Flash. For production use, this pin should be pulled low. This pin can be controlled by the host microcontroller to enable in field Flash updates. 3: Signals of Type NC* were JTAG function pins on previous family devices. Signals on these pins will have no functional affect and will not impact the operation of this device. 2012 Microchip Technology Inc. Advance Information DS00000A-page 7 MRF24WG0MA/MB Mounting Details 1.2 The MRF24WG0MA/MB is a surface mountable mod-
ule. Module dimensions are shown in Figure 1-3. The module Printed Circuit Board (PCB) is 1 mm thick with castellated mounting points on two sides. FIGURE 1-3:
MRF24WG0MA/MB MODULE PHYSICAL DIMENSIONS Note:
Antenna connector on MRF24WG0MB only. DS00000A-page 8 Advance Information 2012 Microchip Technology Inc. MRF24WG0MA/MB Figure 1-4 shows the recommended host PCB footprint for the module. The MRF24WG0MA has an integrated PCB antenna. For best performance, follow the mounting details shown in Figure 1-4. For best performance, mount the module on the PCB without metal obstructions in the keep out area of Figure 1-4. The antenna is tuned to have FR4 PCB material underneath the module. Do not cut-out host PCB material under the antenna. FIGURE 1-4:
RECOMMENDED HOST PCB FOOTPRINT Note 1: The Note 1 demarcation specifies the host PCB copper plane keep-out area on underlying board layers. It is permissible to route surface escape traces in this area. 2012 Microchip Technology Inc. Advance Information DS00000A-page 9 MRF24WG0MA/MB Figure 1-5 illustrates the module reflow profile that is recommended for mounting the device onto the host PCB. FIGURE 1-5:
PRELIMINARY MODULE REFLOW PROFILE AND SETPOINTS 1 2 3 4 5 Zones 6 7 8
) C
e r u t a r e p m e T 300 250 200 150 100 50 0 0 50 100 150 200 250 300 Time (Seconds) TABLE 1-2:
Zone Temperature (C) MODULE REFLOW PROFILE(1) 3 1 2 180 180 200 4 200 5 200 6 220 7 265 8 270 Note 1: Conveyor Speed: 90 cm/min DS00000A-page 10 Advance Information 2012 Microchip Technology Inc. i 2 0 1 2 M c r o c h p T e c h n o o g y I i l n c
. A d v a n c e I n f o r m a t i o n D S 0 0 0 0 0 A
p a g e 1 1 CIRCUIT DESCRIPTION 2.0 The MRF24WG0MA/MB interfaces to Microchip PIC18, PIC24, dsPIC33, and PIC32 microprocessors with a minimal of external components through digital-
only connections. This section details use of the module, starting with an example host connection as shown in Figure 2-1. 2.1 Schematic FIGURE 2-1:
MRF24WG0MA/MB EXAMPLE APPLICATION SCHEMATIC U1 MRF24WG0MA NC NC*
NC*
NC*
NC*
NC NC*
NC NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 GND NC NC*
NC*
NC*
NC*
RESET NC NC*
GND NC NC NC NC NC WP VDD GND GND SDI SCK INT SDO NC GND VDD GND DEBUG_TX DEBUG_RX GND NC CS NC NC*
HIBERNATE GND 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 NC NC NC NC NC*
+3.3V 4x 4.7 K
+ 3.3V C1 1.0 F To Host Microcontroller To System Reset Controller R2 4.7 K To Host Microcontroller R4 4.7 K
+3.3V C2 1.0 F Note:
The example application schematic is for suggested design purposes. Please refer to Table 1-1 in Section 1.0 Device Overview for the module pin descriptions. M R F 2 4 W G 0 M A M B
MRF24WG0MA/MB Power-On Sequence 2.2 The internal regulators for the digital and analog core power supplies are disabled by driving the HIBERNATE pin high. Figure 2-2 shows the power up sequence for the MRF24WG0MA/MB. There is an internal Power-on-Reset (POR) circuit which keeps the module in reset until VDD is within specification. The Hibernate and Reset signals are also used to control startup. In Figure 2-2, section A is controlled by the internal POR and section B is an allowance for the SPI bus to stabilize when the module supplies are enabled. Once Hibernate is disabled, the host software provides 1mS of startup to allow the SPI to stabilize. This time is pre-programmed into the host driver, and may need to be increased if sufficient initial drive current is not provided to the MRF24WG0MA/MB module. Section C is the driver controlled release from Reset period. This takes approximately 300 mS and is monitored by the stack driver. No additional time needs to be provided by user software for startup. FIGURE 2-2:
MRF24WG0MA/MB POWER-ON SEQUENCE TIMING POR 1 ms SPI Stabilize Host driver auto-timed boot, approximately 50-300 ms after Reset Ready A B C VDD 2.7V Time DS00000A-page 12 Advance Information 2012 Microchip Technology Inc. Power States 2.3 The MRF24WG0MA/MB has several power states. These are Hibernate, Sleep and Active (two sub-
states), as shown in Figure 2-3. The selection of power state directly affects system behavior, and overall power consumption or battery life. There is also a Stand-by state that is not user-controlled. HIBERNATE STATE 2.3.1 An Off state is defined as no power applied to the device. The Hibernate mode is the closest to controlled off that the module can approach. It is controlled through the HIBERNATE pin (high input puts the module into Hibernate). When in Hibernate, the module only consumes leakage current, but does not maintain state. Hibernate has to be fully controlled by the PIC MCU and requires the TCP/IP stack to restart on an awake. The module contains about 70 F of internal bulk capacitance. Supplies should be provisioned to supply sufficient charge on release of hibernate for desired start time or sufficient delay must be provided in software after hibernate release and before releasing reset. This state provides the best battery life for embedded products. Entering Hibernate for intervals of less than 30 seconds is not likely to save power. Battery life expectation can be more than a year for devices operating on AA cells that would be in Hibernate except to wake up every hour for a small data transfer (<500 Bytes). MRF24WG0MA/MB POWER SAVE (PS) MODE 2.3.2 The PS mode is a low-power dynamic state that automatically implements the 802.11 Power Save feature. In this mode, if enabled, the module will enter PS mode when all activity is complete. The module will wake autonomously to any PIC intervention so it can check DTIM beacons from the Access Point. If any traffic is listed as queued for the module, then it will awaken and get the data from the Access Point on the next possible opportunity. When data is acquired, the module will interrupt the PIC microcontroller on a normal data available indication. If no data is available on a DTIM check, the module reenters the Power Save state until the next DTIM. The DTIM interval is programmed at the Access Point. This state can provide as if on behavior of the radio with a significant power savings versus always on. The battery life expectation of this mode is several days to several weeks. This mode is characterized by a very low latency (as low as 200 ms) to begin data transfer from the state. ACTIVE STATE 2.3.3 The Active state is identified as one of two states where the radio circuitry is fully on. The two active states are the Receive state (RX ON) and the Transmit state (TX ON). STAND-BY STATE 2.3.4 The Stand-by state is not user-controlled but is noted as it helps identify and track certain operations of the module during power tracing. TABLE 2-1:
MRF24WG0MA/MB POWER STATE DEFINITIONS State Off Hibernate Power Save RX ON TX ON Stand-by VDD 0V 3.3V 3.3V 3.3V 3.3V 3.3V CS 0V 3.3V 0V 0V 0V 0V Description Power is completely disconnected All internal power regulators are OFF enabled by HIBERNATE pin Enabled by TCP/IP driver Receive circuits are on and receiving Transmit circuits are on and transmitting State machine transition state only not user controlled 2012 Microchip Technology Inc. Advance Information DS00000A-page 13 MRF24WG0MA/MB FIGURE 2-3:
MRF24WG0MA/MB POWER-STATE DIAGRAM Off RX On TX On 10 s Note 1 Hibernate Stand-by Note 1 200 s 200 s Power Save Note 1: See Section 2.2 Power-On Sequence. DS00000A-page 14 Advance Information 2012 Microchip Technology Inc. MRF24WG0MA/MB PCB Antenna 2.6 For the MRF24WG0MA, the PCB antenna is fabricated on the top copper layer and covered in solder mask. The layers below the antenna have no copper trace. It is recommended that the module be mounted on the edge of the host PCB. It is permitted for PCB material to be below the antenna structure of the module as long as no copper traces or planes are on the host PCB in that area. For best performance, place the module on the host PCB according to the details shown in Figure 1-4 in Section 1.0 Device Overview. The antenna patterns shown in the following plots are simulated results of the PCB antenna. Figure 2-4 illus-
trates the simulation drawing and Figure 2-5 and Figure 2-6 illustrate the two-dimensional (2D) and three-dimensional (3D) radiation patterns. The calculated average of the radiated field is shown in Figure 2-5, highlighted in yellow. The radiation pattern for the XZ plane is shown in red, and the YZ plane is shown in black. As shown, the most powerful radiation occurs in the XY plane (the red pattern). Figure 2-6 shows the relative position of the 3D radia-
tion donut with reference to the module orientation. This is a very useful guide for placement of the module to obtain the maximum range. Figure 2-7 shows the 3D radiation pattern with the col-
ored distribution of the radiation magnitude. The values range from -9 dB to +0.3 dB. This is very useful in interpreting the 2D radiation pattern. Serial Trace Port Interface 2.4 The MRF24WG0MA/MB incorporates a Transmit Data pin (DEBUGTX) and a Receive Data pin (DEBUGRX) for serial debugging purposes. These pins can be connected to commercially available RS-232 line drivers/
receivers with appropriate external level shifters. The serial interface operates at 19200, 8, N, 1, N. SPI Interface 2.5 The slave Serial Peripheral Interface (SPI) is used to interface with the host PIC microcontroller. The slave SPI interface works with the Interrupt line (INT). When data is available for the PIC microcontroller during operation, the INT line is asserted (logic low) by the MRF24WG0MA/MB module. The INT line is de-
asserted (logic high) by the MRF24WG0MA/MB after the data is transferred to the host PIC microcontroller. The SPI SCK frequency can be up to 25 MHz. The slave SPI interface implements the [CPOL = 0;
CPHA = 0] and [CPOL = 1; CPHA = 1] modes (0 and 3) of operation. That is, data is clocked in on the first rising edge of the clock after Chip Select (CS) is asserted. Data is placed on the bus with most significant bit
(MSb) first. The CS pin must be toggled with transfer blocks and cannot be held low permanently. The falling edge of CS is used to indicate the start of a transfer. The rising edge of CS is used to indicate the completion of a transfer. Figure 4-1 in Section 4.0 Electrical Characteris-
tics shows the SPI timing diagram. Table 4-7 details the SPI timing AC characteristics. 2012 Microchip Technology Inc. Advance Information DS00000A-page 15 MRF24WG0MA/MB FIGURE 2-4:
PCB ANTENNA SIMULATION DRAWING DS00000A-page 16 Advance Information 2012 Microchip Technology Inc. MRF24WG0MA/MB FIGURE 2-5:
SIMULATED TWO-DIMENSIONAL RADIATION PATTERN Name m1 m2 m3 m4 m5 Theta Angle
-60.0000 -60.0000
-20.0000 -20.0000 30.0000 30.0000 100.0000 100.0000 170.0000 170.0000 Mag. 0.6323 0.3962
-0.1038
-0.9490
-0.1414 Curve Information db(GainTotal) Setup 1: LastAdaptive Freq. = 2.44 GHZ Phi = 0 deg dB(GainTotal) Setup 2: LastAdaptive Freq. = 2.44 GHz Phi = 0 deg Average 0.0097
-3.2020 Radiation Pattern 1 Two-dimensional (2D) pattern, including the average on main radiation planes (Phi = 0 and 90 degrees). 2012 Microchip Technology Inc. Advance Information DS00000A-page 17 MRF24WG0MA/MB FIGURE 2-6:
SIMULATED THREE-DIMENSIONAL RADIATION PATTERN Radiation pattern against the module dimensions DS00000A-page 18 Advance Information 2012 Microchip Technology Inc. FIGURE 2-7:
SIMULATED THREE-DIMENSIONAL RADIATION PATTERN i 2 0 1 2 M c r o c h p T e c h n o o g y I i l n c
. A d v a n c e I n f o r m a t i o n D S 0 0 0 0 0 A
p a g e 1 9 Three-dimensional (3D) pattern and magnitude distribution M R F 2 4 W G 0 M A M B
MRF24WG0MA/MB External Antenna 2.7 The MRF24WG0MB module has a 50 ultra-miniature coaxial (U.FL) connector to connect to an external 2.4 GHz antenna. Caution: The U.FL connector is fragile and can only limited number of tolerate a very insertions. The choice of antenna is limited to the antenna types the module has been tested with. Refer to the respec-
tive country in Section 3.0 Regulatory Approval for a list of tested and approved antenna types that may be used with the MRF24WG0MB module. A list of antennas approved for use with the module is provided in Table 2-2. TABLE 2-2:
APPROVED EXTERNAL ANTENNA TYPES Type Manufacturer Dipole Aristotle PCB Aristotle Aristotle PCB PIFA Aristotle Part Number Gain RFA-02-C2M2-D034 2 dBi RFA-02-P33-D034 1 dBi 2 dBi RFA-02-P05-D034 RFA-02-G03-D034 0 dBi DS00000A-page 20 Advance Information 2012 Microchip Technology Inc. REGULATORY APPROVAL 3.0 The MRF24WG0MA/MB module has received regulatory approvals for modular devices in the United States and Canada. Modular approval allows the end user to place the MRF24WG0MA/MB module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter), provided no changes or modifications are made to the module circuitry. Changes or modifications could void the users authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The MRF24WG0MA/MB module has been tested and conforms to EN 300 328 V1.7.1 (2006-10), European Standards. The module tests can be applied toward final product certification and Declaration of Conformity
(DoC). Additional testing may be required depending on the end application. The integrator may still be responsible for testing the end product compliance requirements that become necessary with this module installed (for example, digital device emission, PC peripheral requirements, etc.) in the specific country that the end device will be marketed. For more information on regulatory compliance, refer to the specific country radio regulations in the following sections. for any additional United States 3.1 received Federal The MRF24WG0MA/MB has Communications CFR47 Commission Telecommunications, Part 15 Subpart C Intentional Radiators 15.247 and modular approval in accordance with Part 15.212 Modular Transmitter approval. The MRF24WG0MA/MB module can be integrated into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation.
(FCC) MRF24WG0MA/MB The MRF24WG0MA/MB module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows:
Contains Transmitter Module FCC ID:
W7OMRF24WG0MAMB or Contains FCC ID:
W7OMRF24WG0MAMB This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. A users manual for the product should include the following statement:
interference in accordance with This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used the instructions, may cause harmful interference to radio communications. However, is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment interference radio or there to and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 2012 Microchip Technology Inc. Advance Information DS00000A-page 21 MRF24WG0MA/MB RF EXPOSURE 3.1.1 All transmitters regulated by FCC must comply with RF exposure requirements. OET Bulletin 65, Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields, provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency
(RF) fields adopted by the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance. If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF exposure compliance:
To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the MRF24WG0MA/MB module is used in a portable application (i.e., the antenna is less than 20 cm from persons during operation), the integrator is responsible for performing Specific Absorption Rate (SAR) testing in accordance with FCC rules 2.1091. 3.1.2 APPROVED EXTERNAL ANTENNA TYPES To maintain modular approval in the United States, only the antenna types that have been tested shall be used. It is permissible to use different antenna manu-
facturer provided the same antenna type and antenna gain (equal to or less than) is used. Testing of the MRF24WG0MB module was performed with listed in Section 2.0 Circuit Description. the antenna in Table 2-2 types Canada 3.2 The MRF24WG0MA/MB module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-
Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010):
The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words Contains transmitter module, or the word Contains, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 7693A-24WG0MAMB for License-Exempt Radio User Manual Notice Apparatus (from Section 7.1.3 RSS-Gen, Issue 3, December 2010):
User manuals for license-exempt radio apparatus shall the contain in a conspicuous the user manual or alternatively on the device or both:
following or equivalent notice location in This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. accepter tout doit HELPFUL WEB SITES 3.1.3 Federal Communications Commission (FCC):
http://www.fcc.gov. DS00000A-page 22 Advance Information 2012 Microchip Technology Inc. MRF24WG0MA/MB User manuals for transmitters equipped with detach-
able antennas shall also contain the following notice in a conspicuous location:
This radio transmitter (identify the device by certifi-
cation number, or model number if Category II) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Conformment la rglementation d'Industrie Canada, radio peut fonctionner avec une antenne d'un type et d'un gain maximal infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) l'intensit ncessaire ne dpasse pas l'tablissement d'une communication satisfaisante. le prsent metteur
(ou following the above notice, Immediately the manufacturer shall provide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each. the Approved MRF24WG0MA/MB module are listed in Table 2-2 in Section 2.0 Circuit Description. antenna external types for 3.2.2 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/
3.2.1 APPROVED EXTERNAL ANTENNA TYPES Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010):
The MRF24WG0MB module can only be sold or operated with antennas with which it was approved. Transmitter may be approved with multiple antenna types. An antenna type comprises antennas having similar in-band and out-of-band radiation patterns. Testing shall be performed using the highest gain antenna of each combination of transmitter and antenna type for which approval is being sought, with the transmitter output power set at the maximum level. Any antenna of the same type having equal or lesser gain as an antenna that had been successfully tested with the transmitter, will also be considered approved with the transmitter, and may be used and marketed with the transmitter. When a measurement at the antenna connector is used to determine RF output power, the effective gain of the device's antenna shall be stated, based on measurement or on data the antenna manufacturer. For transmitters of output power greater than 10 milliwatts, the total antenna gain shall be added to the measured RF output power to demonstrate compliance to the specified radiated power limits. User manuals for transmitters shall display the following notice in a conspicuous location:
from Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformment la rglementation d'Industrie Canada, radio peut fonctionner avec une antenne d'un type et d'un gain maximal infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) l'intensit ncessaire ne dpasse pas l'tablissement d'une communication satisfaisante. le prsent metteur
(ou The above notice may be affixed to the device instead of displayed in the user manual. 2012 Microchip Technology Inc. Advance Information DS00000A-page 23 MRF24WG0MA/MB Europe 3.3 The MRF24WG0MA/MB module conforms to the emission standards summarized in Table 3-1. The module toward product certification and Declaration of Conformity (DoC). tests can be applied Note:
To maintain conformance tested ETSI standards, the module shall not be modified. The European Standards do not provide a modular approval similar to the USA (FCC) and Canada (IC). However, the completed compliance testing can be used as part of the customers application for product compliance approvals. The module test report data can be used as part of the customers product test plan and can significantly lower customers compliance burden. Depending on the end application, additional testing may be required. The integrator is responsible for test-
ing the end product for any additional compliance requirements that become necessary with this module installed (for example, digital device emission, PC peripheral requirements and so on) in the specific country where end device is marketed). 3.3.1 EXTERNAL ANTENNA REQUIREMENTS European conformance testing was performed using the antenna types listed in Table 2-2 in Section 2.0 Circuit Description. HELPFUL WEB SITES 3.3.2 A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded the European Radio Communications Office (ERO) at: http://www.ero.dk/. Additional helpful web sites are:
Radio and Telecommunications Terminal from Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org European Telecommunications Standards Institute
(ETSI):
http://www.etsi.org European Radio Communications Office (ERO):
http://www.ero.dk TABLE 3-1:
EMISSIONS STANDARDS TESTED Specification Emission Standards EN 300 328 V1.7.1 (2006-10) EN 300 328 V1.7.1 (2006-10) EN 300 328 V1.7.1 (2006-10) EN 300 328 V1.7.1 (2006-10) EN 300 328 V1.7.1 (2006-10) 4.3.1 4.3.2 4.3.3 4.3.6 4.3.7 Maximum Transmit Power Maximum EIRP Spectral Density Frequency Range Transmitter Spurious Emissions Receiver Spurious Emissions Test Method 5.7.2 5.7.3 5.7.4 5.7.5 5.7.6 DS00000A-page 24 Advance Information 2012 Microchip Technology Inc. Other Regulatory Jurisdictions 3.4 Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, a certification utility is available. The utility runs on a Window's PC and utilizes a USB to SPI converter to interface to the MRF24WG0MA/MB module. In order to use the utility, the MRF24WG0MA/MB module must be out of reset and not accessed by the system host. That is, the SPI signals to the MRF24WG0MA/MB module must be tri-
state, with Reset and Hibernate deasserted. The fol-
lowing signals will need to be brought from the MRF24WG0MA/MB module for connection to the PC
(through the USB adapter):
SDO SDI CS SCK INT GND For documentation, salesperson. regulatory Certification Utility and local Microchip contact further your MRF24WG0MA/MB 3.5 Wi-Fi Alliance Wi-Fi Alliance Certification focuses on interoperability testing of devices based on 802.11 standards. Historically, when the certification process and programs were developed by Wi-Fi Alliance members, the vast majority of the 802.11 clients were PC-centric, and certification testing adequately addressed those types of devices. In subsequent years, the number of Wi-Fi devices that are not PC-centric has grown significantly. These non-standard devices, as a class of products, have been dubbed Application Specific Devices
(ASDs) by the Wi-Fi Alliance. ASDs are 802.11 devices, for example clients or access points (APs), which cannot be tested under a standard Alliance test plan because they do not comply with the standard test configuration and/or because they are designed to perform a specific application. Examples include, but are not limited to: bar code scanners, pagers, recording devices, monitoring equipment, and cable modems. The APs or clients that are used to validate ASD compliance (from the standard test bed) will meet all of the requirements specified in the applicable System Interoperability Test Plans (referred to as the standard test plan), unless specifically exempted. The MRF24WG0MA/MB modules are in the ASD category. The modules are certified under Wi-Fi 802.11 with WPA2, WPA, and WEP System Interoperability ASD Model Test Plan with Test Engine For IEEE 802.11a, b, and g Devices (Version 1.0). 2012 Microchip Technology Inc. Advance Information DS00000A-page 25 MRF24WG0MA/MB NOTES:
DS00000A-page 26 Advance Information 2012 Microchip Technology Inc. 4.0 ELECTRICAL CHARACTERISTICS MRF24WG0MA/MB DIGITAL ELECTRICAL CHARACTERISTICS (NOMINAL CONDITIONS: 25C, VDD = 3.3V) TABLE 4-1:
Parameters VIL (Input low voltage) VIH (Input high voltage) VOL (Output low voltage) VOH (Output high voltage) IOL (Output low level current at VOL Max) IOH (Output high level current at VOH Min) Min
-0.3 2 2.4 Typ 8.5 15.4 Max 0.8 5.5 0.4 Units V V V V mA mA ABSOLUTE MAXIMUM RATINGS(1) TABLE 4-2:
Parameters Storage Temperature VDD VIN on SDI, CS, SCK Note 1: The listed Absolute Maximum Ratings are not meant for functional operation. Operation exceeding these Max
+125C 3.60V 3.60V Min
-40C 0V
-0.3V Notes levels is not guaranteed, and may reduce the operating life of the component. RECOMMENDED OPERATING CONDITIONS TABLE 4-3:
Parameters Ambient Temperature VDD for FCC and IC Min
-40 2.80 Typ 3.3 Max
+85 3.60 Units Degrees Celsius Volts Min CURRENT CONSUMPTION(1) (NOMINAL CONDITIONS: 25C, VDD = 3.3V) TABLE 4-4:
Parameters IDD, Hibernate = 3.3V IDD, Power Save (software enabled) IDD, RX on, Receive @ -91 dBm with 1 Mbps modulated signal at antenna port Measured at 11 Mbps IDD, TX on, 802.11b, +18 dBm IDD, TX on, 802.11g, +16 dBm Measured at 6 Mbps Note 1: Current Consumption values represent Typical Peak currents, and the measured current conditions were done with 85% duty cycle modulated signal. Wi-Fi applications typically operate at less than 85% TX duty cycle. TX current is dependent on such criteria as transmit power setting, and transmit data rate and bandwidth being used. RX current is affected by connection distance. Units A mA Max Typ 0.1 4(2) Conditions 237 226 mA mA mA 85 2: Power Save current is current consumed during periods of stand-by between DTIM beacons. The module will awake 2 ms before a DTIM and turn on its receiver, and possibly its transmitter (if data is available). 2012 Microchip Technology Inc. Advance Information DS00000A-page 27 MRF24WG0MA/MB RECEIVER AC CHARACTERISTICS(1) TABLE 4-5:
Max Parameters 2484 Flo RX Min Input Level Sensitivity, 1 Mbps, 8% PER RX Min Input Level Sensitivity, 2 Mbps, 8% PER RX Max Input Level (Power), 1 Mbps, 8% PER RX Max Input Level (Power), 2 Mbps, 8% PER Note 1: Nominal conditions: 25C, VDD = 3.3V, Flo = 2437 MHz, measurements at antenna port. Min 2412 Typ
-95
-88
-4
-4 Units MHz dBm dBm dBm dBm TABLE 4-6:
Parameters Flo Average POUT (transmit spectrum mask compliant) Average POUT gain step resolution from +5 to +10 dBm(2) Average POUT gain step resolution from -5 to Max.(2) Note 1: Nominal conditions: 25C, VDD = 3.3V, Flo = 2437 MHz, 2 Mbps. modulated signal measured at antenna TRANSMITTER AC CHARACTERISTICS(1) Min 2412 Units MHz dBm dB dB Max 2484 Typ
+18 0.5 1.0 port. 2: Gain step control is not calibrated. Steps are shown for planning purposes only. DS00000A-page 28 Advance Information 2012 Microchip Technology Inc. MRF24WG0MA/MB FIGURE 4-1:
SPI INPUT TIMING TSCK TCSS TSU THD MSb In CS(1) SCK SI SO LSb In High-Impedance TCSD TCSH Note 1: CS must be toggled for each SPI block transfer. FIGURE 4-2:
SPI OUTPUT TIMING CS SCK SO TSCK TV TV MSb Out SI LSb In TDIS LSb Out Dont Care TABLE 4-7:
Symbol TSCK TCSD TCSS TCSH TSU THD TV SPI INTERFACE AC CHARACTERISTICS Parameters SCK Period CS High time CS Setup time CS Hold time SDI Setup time SDI Hold time SDO Valid time Min 40 50 50 50 10 10 Max 15 Units ns ns ns ns ns ns ns 2012 Microchip Technology Inc. Advance Information DS00000A-page 29 MRF24WG0MA/MB NOTES:
DS00000A-page 30 Advance Information 2012 Microchip Technology Inc. MRF24WG0MA/MB APPENDIX A: REVISION HISTORY Revision A (July 2012) This is the initial released version of this document. 2012 Microchip Technology Inc. Advance Information DS00000A-page 31 MRF24WG0MA/MB NOTES:
DS00000A-page 32 Advance Information 2012 Microchip Technology Inc. MRF24WG0MA/MB CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers distributor, their representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support contact should THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, following information:
Product Support Data sheets and errata, the web site contains the application notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software General Technical Support Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing Business of Microchip Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchips customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at Support, click on www.microchip.com. Under Customer Change Notification and the registration instructions. follow 2012 Microchip Technology Inc. Advance Information DS00000A-page 33 MRF24WG0MA/MB READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. Technical Publications Manager Reader Response TO:
RE:
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional):
Would you like a reply? Y N Device:
MRF24WG0MA/MB Questions:
1. What are the best features of this document?
Total Pages Sent ________ FAX: (______) _________ - _________ Literature Number:
DS00000A 2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS00000A-page 34 2012 Microchip Technology Inc. MRF24WG0MA/MB PRODUCT IDENTIFICATION SYSTEM To order parts, including industrial, or obtain information, for e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. M X T
-X Device Module Module Type Tape and Reel Temperature Range Examples:
a) MRF24WG0MA-I/RM = Industrial Temp Device MRF24WG0MA/MB;
VDD range 2.7V to 3.6V Temperature Range I = -40C to +85C (Industrial Temperature) 2012 Microchip Technology Inc. Advance Information DS00000A-page 35 Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as unbreakable. Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. QUALITYMANAGEMENTSYSTEM CERTIFIEDBYDNV
== ISO/TS16949==
Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. 2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN:
Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Companys quality system processes and procedures are for its PIC MCUs and dsPIC DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchips quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2012 Microchip Technology Inc. Advance Information DS00000A-page 36 Worldwide Sales and Service AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support:
http://www.microchip.com/
support Web Address:
www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Osaka Tel: 81-66-152-7160 Fax: 81-66-152-9310 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-330-9305 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 11/29/11 DS00000A-page 37 Advance Information 2012 Microchip Technology Inc.
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2014-09-14 | 2412 ~ 2472 | DTS - Digital Transmission System | Class II permissive change or modification of presently authorized equipment |
2 | 2012-08-31 | 2412 ~ 2462 | DTS - Digital Transmission System | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 | Effective |
2014-09-14
|
||||
1 2 |
2012-08-31
|
|||||
1 2 | Applicant's complete, legal business name |
Microchip Technology Incorporated
|
||||
1 2 | FCC Registration Number (FRN) |
0018576819
|
||||
1 2 | Physical Address |
2355 W. Chandler Blvd.
|
||||
1 2 |
Chandler, Arizona 85224
|
|||||
1 2 |
United States
|
|||||
app s | TCB Information | |||||
1 2 | TCB Application Email Address |
L******@ul.com
|
||||
1 2 |
c******@ccsemc.com
|
|||||
1 2 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 2 | Grantee Code |
W7O
|
||||
1 2 | Equipment Product Code |
MRF24WG0MAMB
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 | Name |
S******** C******
|
||||
1 2 | Title |
Director, Wireless Product Division
|
||||
1 2 | Telephone Number |
480-7********
|
||||
1 2 | Fax Number |
480-7********
|
||||
1 2 |
s******@microchip.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 2 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
1 2 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 | Equipment Class | DTS - Digital Transmission System | ||||
1 2 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | 802.11b/g Radio Card | ||||
1 2 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 | Modular Equipment Type | Single Modular Approval | ||||
1 2 | Purpose / Application is for | Class II permissive change or modification of presently authorized equipment | ||||
1 2 | Original Equipment | |||||
1 2 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 2 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 | Grant Comments | Class II permissive change to add channels 12 and 13 for this 802.11b/g module as documented in this filing. Modular approval. Output power listed is conducted. This module may only be installed by the OEM or an OEM integrator. Only antenna(s) documented in this filings may be used with this transmitter. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. OEM integrators and End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. | ||||
1 2 | Modular approval. Output power listed is conducted. This module may only be installed by the OEM or an OEM integrator. Only antenna(s) documented in this filings may be used with this transmitter. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. OEM integrators and End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. | |||||
1 2 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 | Firm Name |
Compliance Certification Services
|
||||
1 2 | Name |
T******** C******
|
||||
1 2 | Telephone Number |
510-7********
|
||||
1 2 | Fax Number |
510-6********
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1 2 |
t******@ccsemc.com
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Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
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Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 2412.00000000 | 2472.00000000 | 0.3926400 | ||||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 15C | 2412.00000000 | 2462.00000000 | 0.3926400 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC