SPECIFICATION FOR APPROVAL CUSTOMER CUSTOMERS P/N PART NUMBER WAN3216F245W36 DESCRIPTION Chip Antenna 3216 M-Ant 2.45G Type 36 VERSION V2.0 ISSUE DATE 2016/08/04 CUSTOMER APPROVED R&D CENTER CHECKED APPROVAL Ray Thor DRAWN Rocky RIMON TECHNOLOGY CO., LTD. 114 2 352 4 6 4F-6, No.352, Sec. 2, Neihu Rd., Neihu District,Taipei 114, Taiwan
: +886-2-2796-2568
: +886-2-2796-6433 Hong Kong RIMON TECHNOLOGY CO., LTD. 582-592 804 RM804, Sino Centre., 582-592 Nathan Rd., Kln, Hong Kong E-mail : service@rimon.com.tw 3216 Chip antenna For Bluetooth / WLAN Applications P/N: WAN3216F245W36 L W T Dimension(mm) 3.230.20 1.660.20 1.230.20 RIMON TECHNOLOGY CO., LTD. 2/11 Part Number Information WAN 3216 A B F C 245 W E D 36 F ProductSeries DimensionLxW A B C D WorkingFrequency E F Feedingmode Antennatype Material Antenna 3.2X1.6mm(+0.2mm) HighKmaterial 2.4~2.5GHz FunctionAntenna Type=36 1. ElectricalSpecification Specification WAN3216F245W36 PartNumber CentralFrequency Bandwidth ReturnLoss PeakGain Impedance MaximumPower 2450 100(Min.) 6.5(Max) 2.71 50 4 MHz MHz dB dBi Ohm W sec. OperatingTemperature 40+85 ResistancetoSolderingHeats 10(@260) Polarization AzimuthBeamwidth Termination Linear Omnidirectional Cu/Sn(Leadless) Remark:Bandwidth&PeakGainwasmeasuredunderevaluationboardofnextpage RIMON TECHNOLOGY CO., LTD. 3/11 2. RecommendedPCBPattern EvaluationBoardDimension SuggestedMatchingCircuit RIMON TECHNOLOGY CO., LTD. 4/11 LayoutDimensionsinClearancearea(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit FootPrint (Unit :mm) RIMON TECHNOLOGY CO., LTD. 5/11 3. MeasurementResults ReturnLoss RIMON TECHNOLOGY CO., LTD. 6/11 RadiationPattern Y Z X Efficiency PeakGain Directivity 2400MHz 55.21%
1.45dBi 5.32dBi 2450MHz 66.45%
2.71dBi 5.21dBi 2500MHz 57.53%
1.98dBi 5.29dBi ChamberCoordinateSystem RIMON TECHNOLOGY CO., LTD. 7/11 4. Reliability and Test Condictions ITEM Solderability REQUIREMENTS 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within 6%
TEMP () 230 150 TEMP () 260 150 41 sec. 60sec 100.5 sec. 60sec Component Adhesion
(Push test) 1. No visible mechanical damage 1. No visible mechanical damage Component Adhesion
(Pull test) Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within 6%
Phase 1 2 3 4 Temperature() Time(min)
+855 Room Temperature 303 Within 3sec
-402 Room Temperature 303 Within 3sec Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within 6%
3. No disconnection or short circuit. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within 6%
3. No disconnection or short circuit. Humidity 1. No visible mechanical damage 2. Central Freq. change :within 6%
3. No disconnection or short circuit. TEST CONDITION Preheatingtemperature:150/60sec. Soldertemperature:2305 Duration:41sec. Solder:SnAg3.0Cu0.5 Fluxforleadfree:rosin Preheatingtemperature:150/60sec. Soldertemperature:2605 Duration:100.5sec. Solder:SnAg3.0Cu0.5 Fluxforleadfree:rosin The device should be reflow soldered(2305 for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged.
+85=>303min
-40=>303min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature: 855 Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature:-405 Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature: 402 Humidity: 90% to 95% RH Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. RIMON TECHNOLOGY CO., LTD. 8/11 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Preheat circuit and products to 150 Never contact the ceramic with the iron tip Use a 20 watt soldering iron with tip diameter of 1.0mm 280 tip temperature (max) 1.0mm tip diameter (max) Limit soldering time to 3 sec. RIMON TECHNOLOGY CO., LTD. 9/11 6.Packaging Information Tape Specification:
P0 P2 0 D T 0 W B P A0 K0 W 8.0 0.30 Ao 1.80 0.05 Bo 3.51 0.10 Ko 1.59 0.10 P 4.00 0.05 E 1.75 0.10 D 1.50 0.10 D1 0.00 0.10 Po 4.00 0.10 P2 2.00 0.05 t 0.25 0.05 F 3.50 0.05 Reel Specification: (7, 180 mm) TapeWidth(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.00.5 602 13.50.5 1782 3000 RIMON TECHNOLOGY CO., LTD. 10/11 E F 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes:
1. Temperature and humidity conditions: -10~ 40 and 30~70% RH. 2. Recommended products should be used within 6 months from the time of 3. The packaging material should be kept where no chlorine or sulfur exists delivery. in the air. Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. RIMON TECHNOLOGY CO., LTD. 11/11