LoRaWAN 915 MHz BAND TRX MODULE Product Code: 32001409 PRODUCT SUMMARY:
The 32001409 is a transceiver operating in the 902-928 MHz SRD Band optimized for very long range, low consumption applications, suitable for LPWA networks. Based on LoRaTM RF Technology and LoRaWAN protocol it provides ultra-long range spread spectrum communication and high interference immunity. Thanks to its small LCC form factor (15.5 x 26 mm only) and its low current consumption, this module allows the implementation of highly integrated low power (battery operated) solutions for Internet of Things (IoT) applications, security systems, sensor networks, metering, smart buildings, agriculture, supply chain. This pre-certified solution allows easy integration into final application reducing development time, costs and time-to-market. The embedded stack is compliant with LoRaWAN Class A and C specification by Lora Alliance. Module can be configured via UART interface. The module meets all the requirements in the industrial temperature range -40/+85C. The module has been designed to be compliant according to FCC Part 15.212 Modular Transmitter Statement about FCC. Compliant with ReACH and ROHS directives. 1. MECHANICAL CHARACTERISTICS 2. PIN DESCRIPTION Pin Name Pin type Description 1 2 3 5 6 GND RF I/O GND NU Supply A IN/OUT Supply NC Ground (0V) Tx: output RF Rx: input RF Ground (0V) Not Used Pin do not connect NDATA_INDICATE D OUT Data Indicate Pin Notes Note 3 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 NWAKE NU NU NU UART TX UART RX NU NU GND GND Vcc SWDAT SWCLK SWV NRST NU NU NU NU NU NU NU NU GND D IN NC NC NC Wake-up Pin Not Used Pin do not connect Not Used Pin do not connect Not Used Pin do not connect D OUT UART TX Pin D IN NC NC Supply Supply Supply NC NC NC D IN NC NC NC NC NC NC NC NC Supply UART RX Pin Not Used Pin do not connect Not Used Pin do not connect Ground (0V) Ground (0V) Power supply Reserved for programming do not connect Reserved for programming do not connect Reserved for programming do not connect Reset. Input Pull-Up Not Used Pin do not connect Not Used Pin do not connect Not Used Pin do not connect Not Used Pin do not connect Not Used Pin do not connect Not Used Pin do not connect Not Used Pin do not connect Not Used Pin do not connect Ground (0V) 3. ABS. MAX. RATINGS Transceiver Power Supply +Vcc (pin 15) 0 + 3.8V Max. Voltage allowed on input pins
+ Vcc+0.3V Storage Temperature (excl. package)
- 40 + 85 C Storage Temperature (incl. package)
- 10 + 65 C Operating Temperature
- 40 + 85 C Radio Frequency Input, pin 2:
+10 dBm 4. ELECTRICAL CHARACTERISTICS AT +25C TEMPERATURE Parameter Supply Voltage (Vcc) Current consumption Tx mode Rx mode Sleep Min. 2.4
-
-
-
Operating frequency range 902 Tx frequency accuracy Sensitivity Output Power (on 50 Ohm load) Modulation UART Interface Datarate
-
-
-
-
Typ. 3.3 118 14 1.3
-
25
-
+ 18 LoRa 115.2 Max. 3.7
-
-
-
928
-
-137
-
115.2 Unit Notes Volt mA mA A MHz kHz dBm dBm kbps Note 1 Note 2 5. TYPICAL CONNECTION DIAGRAM NOTES:
NRST pin connection is optional but recommended. NDATA_INDICATE pin connection is optional but its mandatory for low power designs where host microcontroller is in sleep state and module 32001409 activates NDATA_INDICATE pin to wake host microcontroller. 6. TYPICAL CHARACTERISTICS Note 1: Current consumption measured at power supply level of +3.3V. Note 2: Sensitivity measured with GFSK modulated signal, PRBS code, 38.4 kbaud, result at BER equal or less than 10-2 . Note 3: All RF parameters are measured with Input/output (pin 2) connected to 50 Ohm impedance signal source or load. 7. PROCESS INFORMATION Delivery 7.1. 32001409 modules are delivered in tape/reel packaging including 250 units. Dimensions are:
W = 44 mm P = 20 mm T = 0.35 mm Ao = 16 mm Bo = 26.5 mm Ko = 3.6 mm D0 = 1.5 mm D1 = 1.5 mm STORAGE AND HANDLING 7.2. 7.2.1. Moisture Sensitivity Level (MSL) The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions for devices that are sensitive to moisture-induced stress. The MSL standard is IPC/JEDEC J-
STD-020 and can be downloaded from www.jedec.org. Following table summarizes the dry pack requirements for different MSL levels in the IPC/JEDEC specification. Dry Pack Requirement MSL LEVEL Dry Pack Requirement 1 2 3 4 Optional Required Required Required According to IPC/JEDEC specification J-STD-020, if a device passes MSL level 1, it is classified as not moisture sensitive and does not require dry pack. If a device fails level 1 but passes a higher level, it is classified as moisture sensitive and must be dry packed in accordance with J-STD-033. The 32001409 is qualified for MSL level = 3. Dry Bag 7.2.2. Products with an MSL level of 2 or above are shipped dry packed in a Moisture Barrier Bag
(MBB). Carrier materials such as trays, tubes, reels, etc., that are placed in the MBB can affect the moisture level within the dry bag. The effect of these materials is compensated by adding additional desiccant in the MBB to ensure the shelf life of the SMT packages. IPC/JEDEC specifications require that MSD sensitive devices be packaged together with a Humidity Indicator Card (HIC) and desiccant to absorb humidity. If no moisture has been absorbed, the three fields in the HIC indicate blue color. 7.2.3. Storage and floor life The calculated shelf life for dry packed SMT packages is a minimum of 12 months from the bag seal date, when stored in a non-condensing atmospheric environment of <40C/90% RH. Following table lists floor life for different MSL levels in the IPC/JDEC specification. Floor life MSL level 1 2 2a 3 4 Floor life (out of bag) at factory ambient 30C/60% RH or as stated Unlimited at 30C/85% RH 1 year 4 weeks 168 hours 72 hours The parts must be processed and soldered within the time specified for the MSL level. If this time is exceeded, or the humidity indicator card in the sealed package indicates that they have been exposed to moisture, the devices need to be pre-baked before the reflow solder process. 7.2.4. Drying Both encapsulate and substrate materials absorb moisture. IPC/JEDEC specification J-STD-
020 must be observed to prevent cracking and delamination associated with the popcorn effect during reflow soldering. The popcorn effect can be described as miniature explosions of evaporating moisture. Baking before processing is required in the following cases:
Humidity indicator card: At least one circular indicator is no longer blue Floor life or environmental requirements after opening the seal have been exceeded, e.g. exposure to excessive seasonal humidity. Refer to Section 4 of IPC/JEDEC J-STD-033 for recommended baking procedures. Table 4-1 of the specification lists the required bake times and conditions for drying. Following table provides a summary of specified recommendations:
Bake Time Bake @ 125C Bake @ 90C 5% RH Bake @ 40C 5% RH Package Body MSL Level Exceeding Floor Life by > 72 h Exceeding Floor Life by 72 h Exceeding Floor Life by >72 h Exceeding Floor Life by 72 h Exceeding Floor Life by > 72 h Exceeding Floor Life by 72 h Thicknes s 1.4 mm Thicknes s
>1.4 mm 2.0 mm 2 2a 3 4 5 5a 2 2a 3 4 5 5 hours 3 hours 17 hours 11 hours 8 days 7 hours 5 hours 23 hours 13 hours 9 days 5 days 7 days 9 hours 7 hours 33 hours 23 hours 13 days 9 days 11 hours 7 hours 37 hours 23 hours 15 days 9 days 12 hours 7 hours 41 hours 24 hours 17 days 10 days 16 hours 10 hours 54 hours 24 hours 22 days 10 days 18 hours 15 hours 63 hours 2 days 25 days 20 days 21 hours 16 hours 3 days 27 hours 17 hours 4 days 34 hours 20 hours 5 days 40 hours 25 hours 6 days 2 days 2 days 3 days 4 days 29 days 22 days 37 days 23 days 47 days 28 days 57 days 35 days Thicknes s
>2.0 mm 4.5 mm 5a 2 2a 3 4 5 48 hours 40 hours 8 days 6 days 79 days 56 days 48 hours 48 hours 10 days 7 days 79 days 67 days 48 hours 48 hours 10 days 7 days 79 days 67 days 48 hours 48 hours 10 days 8 days 79 days 67 days 48 hours 48 hours 10 days 10 days 79 days 67 days 48 hours 48 hours 10 days 10 days 79 days 67 days 5a 48 hours 48 hours 10 days 10 days 79 days 67 days Packages of sensitive components in 32001409 have a thickness 1.4 mm. Do not attempt to bake modules at temperatures higher than 60C while contained in tape and rolled up in reels. If baking at higher temperature is required, remove modules from packaging and place them individually onto oven tray. Oxidation Risk: Baking SMT packages may cause oxidation and/or intermetallic growth of the terminations, which if excessive can result in solderability problems during board assembly. The temperature and time for baking SMT packages are therefore limited by solderability considerations. The cumulative bake time at a temperature greater than 90C and up to 125C shall not exceed 96 hours. If the bake temperature is not greater than 90C, there is no limit on bake time. Bake temperatures higher than 125C are not allowed. SOLDERING INFORMATION 7.3. 7.3.1. Soldering pad pattern The finished surface on the printed circuit board pads should be made of Nickel/Gold. The recommended soldering pad layout on the host board for the 32001409 is shown in the diagram below (purple lines):
All dimensions in mm Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module. 7.3.2. Solder Paste 32001409 module is designed for surface mounting using half-moon solder joints (see diagram below). For proper module assembly, solder paste must be printed on the target surface of the host board. The suggested solder paste height should be within 150 m and 180 m . The following diagram shows mounting characteristics for Module integration on host PCB:
7.3.3. Placement The 32001409 module can be automatically placed on host boards by pick&place machines like any integrated circuit. 7.3.4. Soldering Profile (RoHS Process) It must be noted that 32001409 module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last. The recommendation for lead-free solder reflow in IPC/JEDEC J-STD-020D Standard should be followed. Profile Feature Average Ramp-UP Rate
(Ts max to Tp) Preheat
-Temperature Min (Ts min)
-Temperature Max (Ts max)
-Time (ts min to ts max) Time maintained above:
-Temperature (TL)
-Time (tL) Peak/Classification Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-Down Rate 25C Time Temperature Peak to Sn-Pb Assembly Pb-Free Assembly 3C/second max 3C/second max 100C 179C 80-135 seconds 183C 30-90 seconds 130C 217C 80-135 seconds 220C 30-90 seconds max. Peak Temp. 220C max. Peak Temp. 250C 10-15 seconds 10-15 seconds 4C/second max 4C/second max 6 minutes max 8 minutes max Note: All temperatures refer to topside of the package, measured on the package body surface CAUTION Please note that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the 32001409 modules metal shield from being in contact with the solder wave. 8. REGULATORY APPROVAL The Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Class B device notice 8.1. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. RF exposure safety 8.2. This product is a radio transmitter and receiver. It is designed not to exceed the emission limits for exposure to radio frequency (RF) energy set by the Federal Communications Commission. The antenna must be installed and operated with minimum distance of 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Permitted Antenna 8.3. This radio transmitter has been approved by FCC to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Type Quarter-wave monopole, GSM 900/1800 Max Gain 2.14 dBi Labelling Requirements for the Host Device 8.4. The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the IC of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows:
Contains FCC ID: 2AQJP-32001409 9. GLOSSARY ABP = Activation by personalization OTAA = Over The Air Activation SN = Serial Number FW = Firmware EUI = Extended Unique Identifier LSB = Least significant byte MSB = Most significant byte Cks = Checksum 10. REFERENCES
[1] LoRaWAN Specification V1.0.2
[2] Sx1272 Datasheet 11. REVISION HISTORY Revision 0.1 0.2 Date 30-04-2018 31-07-2018 Description Preliminary Added Regulatory section