3GPPTS 36.521 Compliant
(LTE FDD) R8. Software upgradable to R9 FDD Dual Band Band 13 Band 4 Standard mPCIe minicard Form Factor 23dBm Transmission Power Wireless Broadband LTE Solutions MitraStar M4G-641 LTE FDD Module Band 13 & Band 4 supported Field Proved LTE Technology M4G-641 is based on Altair Semiconductors high performance LTE chipsets of FourGee3100 baseband and FourGee6202 RFIC chip. It supports 3GPP R8 and R9 upgradable without hardware change. It supports LTE connection using single software and implements a high performance MIMO receiver. Altair FourGee 3100/6202 LTE chipset is Verizon Wireless pre-certified to run over Verizons 4G LTE network. Fast Hook Up Standard Minicard Interface M4G-641 adapts the standard mini-PCIe minicard with 52 pin connector. The dimension is 51(L) x 30(W) x 5(H)mm. Both sides have components. Two antenna connectors are provided. The operation temperature ranged from -30C to 60C. Easy Enable with Hostless Driver Support M4G-641 supports hostless driver architecture on Linux and Windows. The advantage of this kind of driver requires a lower-end process to establish LTE connection and run traffic through LTE network. This will let most lower-end machine-to-machine applications to use 4G wireless broadband LTE high speed network in the first moment. 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2
LTE Air Interface
3GPPTS 36.521 Compliant R8 compliance Software upgradeable to R9. Duplex mode: FDD Band 13 Uplink 777-787MHz Downlink 746-756MHz Band 4 Uplink 1710-1755 MHz Downlink 2110-2155 MHz Channel Bandwidth:
1.4MHz, 3MHz, 5MHz, 10MHz, 15MHz and 20MHz.
Modulation:
Uplink QPSK, 16QAM Downlink QPSK, 16QAM, 64QAM Transmsit Power : 231 dBm Receive Sensitivity:
-97dBm @ QPSK 1/2. 10MHz channel bandwidth Antenna:
Two antenna connectors Main RF for transmit & receive Auxiliary RF for receive diversity Specifications Hardware Specifications
mini-PCIe minicard 52 connector
(work in USB mode) LED : Power/ LTE connection status through minicard interface SIM card though mini-card interface Power Specification
Input Voltage: 3.3V 9%
Power consumption :
Average power consumption 3 W Physical Specifications
Dimension:
51(L) x 30(W) x 5(H)mm
Weight: 12g Environmental Specifications
Operation Temperature: -30 oC ~
60oC Operation Humidity : 10% ~ 90%
Storage Temperature: -30oC ~
70oC Storage Humidity: 10% ~ 95%
OS Support
Linux
Microsoft Windows Certification
FCC RoHS 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 Pin Assignment Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Minicard Standard Pin Define WAKE_N 3V3_Vaux COEX1/NC GND COEX2/NC 1.5V CLKREQ_N UIM_PWR GND I/O O I I/O I I/O I O O I UIM_DATA I/O REF_CLK-
UIM_CLK REF_CLK+
UIM_RST GND UIM_VPP UIM_C8 GND UIM_C4 W_DISABLE_N GND PERST_N PERn0 3V3_Vaux PERp0 GND I O I O I O NA I NA I I I I/O I I/O I MitraStar LTE module Pin Definition NC 3V3_Vaux BUZZER_CTL GND RSSI_LED_0 NC LAN_RESET UIM_PWR GND UIM_DATA NC UIM_CLK NC UIM_RST GND NC NC GND NC W_DISABLE_N GND PERST_N RMII_RXCTL 3V3_Vaux RMII_TXCTL GND I/O Description
I O I O
O O I No Connect Main Board for Module +3V3 System USB Mode: no used OP Mode: RSSI Signal Monitor by Voice Ground USB Mode: no used OP Mode: RSSI Signal Monitor by LED No Connect OP Mode: Rest PHY IC USB Mode: no used For SIM Slot (Card) Power +1.8V/+3.0V Ground I/O SIM Data Signal
O
O I
I
I I I I I O I No Connect SIM Clock Signal No Connect SIM Reset Signal Ground No Connect No Connect Ground No Connect USB Mode: Active Low Signal. System Can Be Use This Signal to Disable Radio Operation. Pull-up Resistor on The Card.
(Feature Support) Low: Idle/Sleep Mode High: Operation Mode OP Mode: no used Ground USB Mode: Reset Module OP Mode: no used OP Mode: RMII Interface USB Mode: no used Main Board for Module +3V3 System OP Mode: RMII Interface USB Mode: no used Ground 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 Pin Number 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 Minicard Standard Pin Define GND 1.5V GND SMB_CLK PETn0 SMB_DATA PETp0 GND GND USB_D-
GND USB_D+
3V3_Vaux GND 3V3_Vaux LED_WWAN_N GND LED_WLAN_N NC LED_WPAN_N NC 1.5V NC GND NC 3V3_Vaux I/O I I I I I/O I/O I/O I I I/O I I/O I I I O I O X O X I X I X I MitraStar LTE module Pin Definition GND NC GND I/O Description I
I Ground No Connect Ground RMII_MDIO I/O RMII_RXD0 RMII_MDC RMII_RXD1 GND GND USB_D-
GND USB_D+
3V3_Vaux-PA GND 3V3_Vaux-PA RSSI_LED_1 GND RSSI_LED_2 RMII_CLK NC RMII_TXD0 NC RMII_TXD1 GND NC 3V3_Vaux-PA I O I I I I/O I I/O I I I X I O O
O
O I
I OP Mode: RMII Interface USB Mode: no used OP Mode: RMII Interface USB Mode: no used OP Mode: RMII Interface USB Mode: no used OP Mode: RMII Interface USB Mode: no used Ground Ground OP Mode: no used USB Mode: Data Interface Ground OP Mode: no used USB Mode: Data Interface Main Board for PA Power +3V3 (+23dBm) or +4V2 (+26dBm) Ground Main Board for PA Power +3V3 (+23dBm) or +4V2 (+26dBm) USB Mode: no used OP Mode: RSSI Signal Monitor by LED Ground USB Mode: no used OP Mode: RSSI Signal Monitor by LED OP Mode: RMII Interface USB Mode: no used No Connect OP Mode: RMII Interface USB Mode: no used No Connect OP Mode: RMII Interface USB Mode: no used Ground No Connect Main Board for PA Power +3V3 (+23dBm) or +4V2 (+26dBm) 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 Connector Figure 1 Module Connectors Physical Dimension Figure 2 Mechanical Drawing (unit: mm) 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. End Product Labeling When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: ZMYM4G-641 The grantee's FCC ID can be used only when all FCC compliance requirements are met. 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 This device is intended only for OEM integrators under the following conditions:
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile exposure condition must not exceed:
5.5dBi in LTE Band 4 10dBi in LTE Band 13
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2